JP2005347045A - Plasma display panel, its manufacturing method, plasma display device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reconcile improvement of exhaust conductance and suppression of discharge interference, and also to obtain a stable barrier plate shape. <P>SOLUTION: This PDP 10 has a front substrate and a back substrate disposed face to face so that a discharge space is formed between both substrates, and a barrier plate to partition display cells on either one of the facing sides of the front substrate and the back substrate. The barrier plate 5 in parallel crosses is composed of a lateral barrier plate 5A formed in the row direction H on the facing side and a longitudinal barrier plate 5B formed in the column direction perpendicular to the row direction H. The lateral barrier plate 5A and the longitudinal barrier plate 5B are formed so that they have different patterns and the height of the lateral barrier plate 5A is lower than that of the longitudinal barrier plate 5B. In addition, the lateral barrier plate and the longitudinal barrier plate are not specifically fixed, and this invention can be applied to a general use to control the unevenness of the barrier plate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plasma display panel (hereinafter also referred to as PDP) and a manufacturing method thereof, and a plasma display device and a manufacturing method thereof, and more particularly, a PDP having partition walls for partitioning display cells and the plasma display device The present invention relates to a manufacturing method, a plasma display device, and a manufacturing method thereof.

  In general, a plasma display device mainly composed of a PDP is compared with a display device such as a CRT (Cathode Ray Tube) or LCD (Liquid Crystal Device) that has been widely used. Since it has many advantages such as small flickering, large display contrast ratio, thin and large screen, and high response speed, it has recently become a display for information processing equipment such as computers. It is used as a device.

  This plasma display device has an AC type in which an electrode is covered with a dielectric layer and is operated indirectly in an AC discharge state, and an electrode is exposed to a discharge space and is operated in a DC discharge state depending on an operation method. Although it is roughly classified into a DC type, especially an AC type plasma display device (also simply referred to as a plasma display device) is widely used because it can easily realize a large screen as described above.

A PDP constituting the main part of the plasma display device as described above is disclosed in, for example, Patent Document 1 (first prior art). As shown in a perspective view in FIG. 13, the PDP 100 is arranged such that a front substrate 101 and a rear substrate 102 face each other, and a discharge gas space 103 is formed between the substrates 101 and 102. It has a configuration.
The front substrate 101 is arranged in parallel to each other along a row direction (lateral direction or first direction) H on the inner surface of the first insulating substrate 104 made of a transparent material such as glass and the first insulating substrate 104. Scan electrode 105 and sustain electrode (common electrode) 106 constituting row electrode group, first dielectric layer 107 made of low melting point lead glass (PbO) or the like covering both electrodes 105, 106, and first dielectric And a protective layer 108 made of magnesium oxide (MgO) or the like for protecting the body layer 107 from electric discharge. Here, the scan electrode 105 and the sustain electrode 106 are respectively formed on the transparent electrodes 105A and 106A made of ITO (Indium Tin Oxide), tin oxide (SnO ₂ ), and the like, and on the transparent electrodes 105A and 106 in order to reduce resistance. The bus electrodes (trace electrodes) 105B and 106B made of Al (aluminum), Ag (silver), etc. are formed in part.

  On the other hand, the back substrate 102 has a second insulating substrate 109 made of a transparent material such as glass and a column direction (vertical direction or second direction) V perpendicular to the row direction H on the inner surface of the second insulating substrate 109. A data electrode (address electrode) 111 made of Al, Ag or the like that is arranged in parallel with each other to form a column electrode group, and a second dielectric layer 112 made of lead-containing frit glass or the like covering the data electrode 111, , He (helium), Ne (neon), Xe (xenon) or the like is filled with a discharge gas alone or mixed to secure the discharge gas space 103 and partition display cells as display units. Therefore, a striped barrier 113 made of lead-containing frit glass or the like formed in the column direction V, and an inner wall surface and a bottom surface of the barrier 113 are formed to cover the discharge gas discharge. And a phosphor layer 114 blue phosphor layer is painted to convert the red phosphor layer, a green phosphor layer is converted into green light, and blue that converts ultraviolet light to more generated red light. Here, filling of the discharge gas into the discharge gas space 103 is usually performed by once exhausting the gas in the panel from the vent formed at the end of the panel and then introducing the discharge gas from the vent. Is called.

  In the PDP 100 having the above-described configuration, a write discharge for selecting a cell to be displayed (light emission) is performed between the data electrode 111 of the rear substrate 102 and the scan electrode 105 of the front substrate 101, and then the front substrate 101. By performing a sustain discharge (display discharge) by the surface discharge 110 of the selected cell between the scan electrode 105 and the sustain electrode 106, the cell is provided for display.

  Here, in the PDP 100 of Patent Document 1 in which the stripe-shaped partition wall 113 is formed on the back substrate 102 as described above, as shown in a plan view in FIG. 14, the scan electrode 105 of each display cell 115 constituting the PDP. And the sustain electrode 106 are arranged opposite to each other in the horizontal direction H via a main gap (discharge gap) MG, while a subgap (in order to avoid discharge interference between cells) between the display cells 115 adjacent in the column direction V. A non-discharge gap (SG) is provided. Usually, the dimension of the subgap SG is set to 3 to 5 times that of the main gap MG. Since the pixel size of the PDP is normally defined by the screen size and the number of pixels, the width of the electrode is shortened in the column direction V by increasing the dimension of the non-discharge gap. For this reason, the discharge current decreases as the electrode area decreases, resulting in a problem that the light emission luminance decreases. This tendency becomes more prominent as the number of display cells 115 is increased to increase the screen size of the PDP 100.

  From such a viewpoint, a PDP configured to avoid discharge interference between display cells 115 adjacent to each other in the column direction V while avoiding a reduction in electrode area is disclosed in, for example, Patent Document 2 (second prior art). ing. As shown in a plan view in FIG. 15, the PDP 120 includes a cross-shaped partition wall 116 for partitioning the display cell 115. That is, the PDP 120 includes the partition 116 formed not only in the row direction H but also in the column direction V as in the PDP 100 described above. Further, the arrangement of the scan electrodes 105 and the sustain electrodes 106 is different from that of the PDP 100, and the arrangement order is changed for each display line in the column direction V. This is to reduce the capacitance component formed by the scan electrode 105 and the sustain electrode 106 between the display cells 115 adjacent in the column direction V.

  Since the configuration other than this is substantially the same as that of the PDP 100, the same reference numerals are given to the components corresponding to the components in FIG. 14 in FIG. According to the PDP 120 having such a configuration, since the display cell 115 is surrounded by the grid-like partition walls 116, not only can the discharge interference between the display cells 115 adjacent in the column direction V be prevented, Since the subgap between 115 can be shortened, it is possible to prevent the electrode width from being shortened in the column direction V. Further, as the subgap can be shortened, the electrode areas of the scan electrode 105 and the sustain electrode 106 can be increased, so that display with high luminance can be achieved by increasing the discharge current.

  However, in the PDP 120 of FIG. 15, each display cell 115 has a sealed structure due to the provision of the grid-like partition walls 116, so that in the process of filling the discharge gas, the panel is efficiently exhausted. Disadvantageous. That is, since it is necessary to exhaust air through a minute gap between the front substrate and the cross-shaped partition wall 116 on the rear substrate, the exhaust conductance is significantly reduced. As a result, when an exhaust process similar to that of the above-described PDP 100 is performed, the gas in the panel cannot be exhausted sufficiently, so that a large amount of impurity gas remains. The light emission characteristics as a PDP are deteriorated. Further, in order to obtain an exhaust state equivalent to that of the PDP 100, a longer exhaust time is required, so that the productivity of the PDP is lowered.

  In order to solve the problems of the PDP 120 as described above, PDPs having a configuration in which the height of the partition wall is partially changed to secure an exhaust path are disclosed in, for example, Patent Document 3 (third prior art) and Patent Document 4 (Fourth prior art). As shown in the perspective view of FIG. 16, the PDP 130 disclosed in Patent Document 3 includes a stripe-shaped second partition wall formed on the partition wall 117 only in the column direction V after the first partition wall-shaped partition wall 117 is formed. 118 is formed. According to the PDP 130 having such a configuration, the height of the partition wall 117 in the row direction H is lower than that of the partition wall 118 in the column direction V. Therefore, when the rear substrate and the front substrate are combined, Since a gap is formed between the partition wall 117 in the row direction H and the front substrate, good exhaust characteristics can be obtained and a decrease in exhaust conductance can be prevented.

Further, as shown in a perspective view of FIG. 17, the PDP 140 disclosed in Patent Document 4 forms the first partition 121 in the column direction V and the second partition 122 and the third partition in the row direction H. By forming the partition wall 123, a cross-shaped partition wall is formed. According to the PDP 140 having such a configuration, the widths of the partition walls 122 and 123 in the row direction H constituting the grid-like partition walls are made larger than those of the partition walls 121 in the column direction V, so that the direction of shrinkage due to firing is different. When the rear substrate and the front substrate are combined with a height distribution in the partition wall shape after firing, there is a gap between the front wall 101 and the partition walls 122 and 123 in the row direction H on the rear substrate. To form.
JP 2002-258794 A JP 2002-42661 A JP 2000-285808 A JP 2002-83545 A

Incidentally, the conventional PDPs described in Patent Documents 3 and 4 have problems as described below.
First, in the PDP 130 according to the third prior art described in Patent Document 3, as shown in FIG. 16, after forming the first partition walls 117 in a cross pattern using two independent pattern forming steps, Since the stripe-shaped second partition 118 is formed so as to overlap the partition 117 only in the direction V to form a desired partition shape, the second partition 118 is easily displaced. That is, since the foundation of the second partition wall 118 becomes uneasy, there is a possibility that the second partition wall 118 may collapse when a panel is formed by combining the rear substrate and the front substrate, and a stable partition shape is obtained. It becomes difficult.

  Next, in the PDP 140 according to the fourth prior art described in Patent Document 4, as shown in FIG. 17, the first partition 121 is formed in the column direction V, and the second partition 122 and the row direction H are formed. By forming the third partition wall 123, the partition wall shape has a height distribution to form a grid-like partition wall, so that the design range of the partition wall width is limited, and optical characteristics and the like are reduced. It may end up. In addition, if the partition wall width must be determined due to constraints other than exhaust conductance, the gap necessary for exhaust cannot be obtained and exhaust conductance is deteriorated, or the gap becomes too large and exhaust conductance is improved. However, the discharge interference cannot be prevented.

  The present invention has been made in view of the above-described circumstances, and is a plasma display panel and a method for manufacturing the same, which can improve both exhaust conductance and suppress discharge interference, and can obtain a more stable barrier rib shape. An object of the present invention is to provide a plasma display device and a manufacturing method thereof.

  In order to solve the above-mentioned problem, according to a first aspect of the present invention, the first substrate and the second substrate are arranged to face each other so as to form a discharge space between the two substrates, and the first and second substrates are arranged. A plasma display panel having a partition for partitioning display cells on any one of the opposite surfaces, wherein the partition is formed of a plurality of partition materials having different properties, and the plurality of materials are formed in different patterns. It is characterized by that.

  According to a second aspect of the present invention, there is provided the plasma display panel according to the first aspect, wherein the first electrode and the second electrode are formed on the opposing surface of the first substrate via a main discharge gap in a first direction. A row electrode group consisting of a plurality of electrodes is arranged, while a column electrode group consisting of a third electrode is arranged on the facing surface of the second substrate in a direction perpendicular to the row electrode group. Yes.

  The invention according to claim 3 relates to the plasma display panel according to claim 1 or 2, wherein the partition includes a first partition material and a second partition material having a composition different from that of the first partition material. A first partition wall portion, and the first partition wall portion is a second partition wall having a different composition ratio of the first partition wall material and the second partition wall material. The first partition wall and the second partition wall are different in height.

  The invention according to claim 4 relates to the plasma display panel according to claim 1 or 2, wherein the partition includes a first partition material and a second partition material having a composition different from that of the first partition material. A first partition wall portion, and the first partition wall portion is a second partition wall having a different composition ratio of the first partition wall material and the second partition wall material. And the first partition wall and the second partition wall have substantially the same height.

  The invention according to claim 5 relates to the plasma display panel according to any one of claims 1 to 4, wherein the plurality of partition wall materials include partition wall materials having different shrinkage rates due to firing. .

  The invention according to claim 6 relates to the plasma display panel according to any one of claims 1 to 4, wherein the plurality of partition wall materials include partition wall materials having different softening points of glass materials contained therein. It is a feature.

  According to a seventh aspect of the present invention, the first substrate and the second substrate are arranged to face each other so as to form a discharge space between the two substrates, and one of the first and second substrates faces each other. According to a method of manufacturing a plasma display panel having a partition for partitioning display cells on a surface, the step of forming the partition includes the step of forming a first partition material on any one of the facing surfaces, and A step of forming a second partition material on any one of the opposing surfaces, a step of patterning the first and second partition materials into a shape constituting the partition over time, and the first and second And the step of simultaneously firing the partition wall material.

  According to the eighth aspect of the present invention, the first substrate and the second substrate are arranged to face each other so as to form a discharge space between the two substrates, and the first surface is opposite to the first surface. A row electrode group consisting of a first electrode and a second electrode is arranged in the direction via a main discharge gap, while the opposing surface of the second substrate consists of a third electrode in the second direction. A step of forming the partition wall according to a plasma display panel having a partition electrode group and a partition wall for partitioning a display cell on either one of the first and second substrates. A step of forming a first partition wall material on one facing surface, a step of forming a second partition wall material on any one of the facing surfaces, and the first and second partition wall materials over time. Patterning the shape of the partition, and the first and second It is characterized by a step of firing the barrier rib material at the same time.

  The invention according to claim 9 relates to the method of manufacturing a plasma display panel according to claim 7 or 8, wherein the formation pattern of the first partition wall material is different from the formation pattern of the second partition wall material. It is characterized by.

  A tenth aspect of the present invention relates to a method of manufacturing a plasma display panel according to the seventh, eighth, or ninth aspect, wherein the partition includes a first partition and the first partition is the first partition. The partition wall material and the second partition wall material have a second partition wall portion having a different composition ratio, and the first partition wall portion and the second partition wall portion have different heights. Yes.

  The invention described in claim 11 relates to a method of manufacturing a plasma display panel according to claim 7, 8 or 9, wherein the partition includes a first partition and the first partition is the first partition. The partition wall material and the second partition wall material have a different partition ratio, and the first partition wall portion and the second partition wall portion have substantially the same height. It is said.

  A twelfth aspect of the present invention relates to a method for manufacturing a plasma display panel according to any one of the seventh to eleventh aspects, wherein the first partition wall material and the second partition wall material have a shrinkage ratio due to firing. It is characterized by being different.

  A thirteenth aspect of the present invention relates to a method of manufacturing a plasma display panel according to any one of the seventh to eleventh aspects, wherein the first barrier rib material and the second barrier rib material are made of a glass material contained therein. It is characterized by different softening points.

  According to a fourteenth aspect of the present invention, in the method of manufacturing a plasma display panel according to any one of the seventh to thirteenth aspects, the step of forming the first barrier rib material includes the step of forming the first barrier rib material. On the other hand, the step of forming the second partition wall material is characterized in that the second partition wall material is formed on the entire surface.

  The invention according to claim 15 relates to the method of manufacturing a plasma display panel according to any one of claims 8 to 14, wherein the step of patterning into a shape constituting the partition uses a common resist pattern. The third electrode and the first partition wall material are patterned at the same time.

  According to a sixteenth aspect of the present invention, there is provided the plasma display panel manufacturing method according to any one of the eighth to fourteenth aspects, wherein the step of patterning into the shape constituting the partition includes a light shielding material on the surface of the transparent substrate. The first partition wall material made of a photosensitive material is formed so as to cover the third electrode made of, and then exposed from the back surface of the transparent substrate using the third electrode as a mask, then developed and developed. The first partition wall material is patterned.

  According to a seventeenth aspect of the present invention, there is provided a plasma display device comprising the plasma display panel according to any one of the first to sixth aspects.

  An invention according to claim 18 relates to a method for manufacturing a plasma display device, and includes a first step of manufacturing a plasma display panel by the method for manufacturing a plasma display panel according to any one of claims 7 to 16, A second step of manufacturing the plasma display panel as a module together with a circuit for driving the plasma display panel; and a step of performing an image signal format conversion and electrically connecting an interface for transmitting the module to the module. And 3 processes.

  According to the plasma display panel and the manufacturing method thereof, and the plasma display device and the manufacturing method thereof according to the present invention, for example, a grid-like partition formed on the rear substrate for partitioning the display cells of the plasma display panel The height of the horizontal and vertical bulkheads that make up the front panel is different, or the height of one of the horizontal and vertical bulkheads is partially different. A gap as an exhaust path can be easily secured between the partition wall and the front substrate. Therefore, both improvement in exhaust conductance and suppression of discharge interference can be achieved, and a more stable partition wall shape can be obtained.

  The plasma display panel according to the present invention has a structure in which a front substrate and a rear substrate are arranged to face each other so as to form a discharge space between both substrates, and has a grid-like partition wall for partitioning display cells on the opposite surface of the rear substrate. The partition walls are formed of a plurality of partition wall materials having different properties, and the plurality of materials are formed in different patterns.

1 is a perspective view showing a schematic configuration of a PDP according to Embodiment 1 of the present invention, FIG. 2 is a plan view showing a manufacturing method of the PDP in order of steps, and FIG. 3 is taken along the line AA ′ of FIG. It is sectional drawing. In this example, only the rear substrate will be described. The front substrate is substantially the same as that of the conventional PDP shown in FIG.
As shown in FIG. 1, the rear substrate 1 of the PDP 10 in this example is parallel to each other along an insulating substrate 2 made of a transparent material such as glass and a column direction V perpendicular to the row direction H on the inner surface of the insulating substrate 2. A front electrode (not shown) is filled with a data electrode (address electrode) 3 made of Al, Ag, etc., which is arranged to form a column electrode group, and a discharge gas such as He, Ne, Xe or the like alone or mixed. ) And a grid-like partition wall 5 made of lead-containing frit glass or the like formed in the row direction H to partition the display cell 4, and the data electrode 3 and the partition wall 5 is formed so as to cover the inner wall surface and the bottom surface, and a red phosphor layer that converts ultraviolet light generated by the discharge of the discharge gas into red light, a green phosphor layer that converts green light, and blue fluorescence that converts blue light. The body layer is painted separately And a phosphor layer 6. Here, the cross-shaped partition 5 is composed of a horizontal partition 5A formed in the row direction H and a vertical partition 5B formed in the column direction V. The cross-shaped barrier ribs 5 are formed so that the horizontal barrier ribs 5A parallel to the scan electrodes and sustain electrodes (both not shown) arranged in the row direction H on the front substrate overlap the non-discharge gap. Vertical partition walls 5B parallel to the data electrodes 3 arranged in the column direction V are arranged between the data electrodes 3. In the example shown, the dielectric layer covering the data electrode 3 is unnecessary. Due to the principle of operation of the PDP, the dielectric layer may be unnecessary.

  Further, as apparent from FIG. 1, the horizontal barrier ribs 5A and the vertical barrier ribs 5B constituting the cross-girder-shaped barrier ribs 5 are formed in different patterns by a plurality of materials having different properties, and the height of the horizontal barrier ribs 5A is It is formed lower than that of the vertical partition wall 5B. With such a setting, when the rear substrate and the front substrate are combined, a gap can be formed between the horizontal partition wall 5A in the row direction H on the rear substrate 1 and the front substrate. . In addition, the discharge gas is filled into the discharge gas space in the same manner as in the conventional PDP, after the gas in the panel is once exhausted from the vent formed at the end of the panel, and then the discharge gas is introduced from the vent. Is done.

  As described above, according to the PDP 10 of this example, the cross-shaped partition walls 5 for partitioning the display cells 4 include the horizontal partition walls 5A formed in the row direction H and the column direction V orthogonal to the row direction H. The vertical barrier ribs 5B are formed, the horizontal barrier ribs 5A and the vertical barrier ribs 5B are formed in different patterns, and the height of the horizontal barrier ribs 5A is lower than that of the vertical barrier ribs 5B. A gap as an exhaust path can be easily ensured between the horizontal partition 5A on the top 1 and the front substrate. Therefore, since the inside of the panel can be efficiently exhausted by exhausting through the gap in the process of filling the discharge gas, the exhaust process similar to that of the conventional PDP 100 is performed to sufficiently exhaust the gas in the panel. Therefore, a large amount of impurity gas does not remain, and the discharge characteristics and further the light emission characteristics as the PDP can be improved. Further, since an exhaust state equivalent to that of the conventional PDP 100 can be obtained with substantially the same exhaust time, the productivity of the PDP is not lowered.

Next, with reference to FIG.2 and FIG.3, the manufacturing method of PDP10 of this example is demonstrated in order of a process. 3A to 3E show cross sections taken along the line AA 'in FIGS. 2A to 2E, respectively.
First, as shown in FIGS. 2 (a) and 3 (a), an insulating substrate 2 made of a transparent material such as glass is prepared, and data electrodes made of Al, Ag, etc. are parallel to each other along the column direction V. 3 is formed, a first partition wall material 5a made of an insulating paste containing lead-containing frit glass or the like is applied (formed) along the row direction H by, for example, a screen printing method. In this case, the height of the first partition wall material 5a is selected to be approximately ½ of the finally required thickness for the horizontal partition wall 5A.

  Next, as shown in FIGS. 2 (b) and 3 (b), the second partition material 5b made of an insulating paste containing lead-containing frit glass or the like is replaced with the first partition material 5a by, for example, a table coater. It coat | covers on the substantially whole surface of the insulated substrate 2 so that it may cover. Next, the height of the non-formation part of the 2nd partition material 5b is adjusted by leveling so that it may become the same as that of the formation part of the 1st partition material 5a. Here, the first partition wall material 5a and the second partition wall material 5b are made of a composition as described later.

  Next, as shown in FIGS. 2C and 3C, a resist pattern 7 having the same shape as the cross-shaped partition walls 5 to be formed is formed on the second partition material 5b by photolithography. .

  Next, as shown in FIG. 2D and FIG. 3D, the second partition wall material 5b is patterned by, for example, sandblasting using the resist pattern 7 as a mask to remove the unnecessary second partition wall material 5b. Remove. As described above, the patterning of the second partition material 5b is performed at a time later than the patterning of the first partition material 5a, that is, with time.

  Next, as shown in FIGS. 2 (e) and 3 (e), after removing the resist pattern 7, baking is performed to form the horizontal barrier rib 5A with the first barrier rib material 5a and at the same time the second barrier rib. The vertical barrier ribs 5B are formed of the material 5b, and the cross-shaped barrier ribs 5 are formed, thereby completing the back substrate 1 as shown in FIG.

  Next, the surface of the rear substrate 2 on which the cross-shaped barrier ribs 5 are formed and the surface of the front substrate (not shown) on which the row electrode group consisting of the scan electrodes and the sustain electrodes is formed are overlapped with each other, The periphery is sealed with low melting glass (not shown) to form a panel. Next, after exhausting the gas in the panel from the vent formed at the end of the panel, a discharge gas such as He, Ne, and Xe is filled into the discharge gas space from the vent. Finally, the PDP 10 is completed by sealing the vent. Thereafter, peripheral circuit boards such as a drive circuit and a signal processing circuit are attached to the PDP 10 to complete the plasma display device.

  In the manufacturing method of the PDP 10 as described above, the partition wall material for forming the grid-like partition wall 5 is generally formed by bonding a filler made of a metal oxide or the like for maintaining the shape after firing and the filler after firing. For forming a low melting point glass and a binder for bonding the respective materials before firing. Here, since the binder component is decomposed and removed by firing, only the filler and the low melting point glass remain after firing.

  In this case, the volume difference of the partition wall material before and after firing, that is, the shrinkage of the partition wall material due to firing is determined by the composition ratio of the filler, the low-melting glass, and the binder. For example, when the composition ratio is such that the binder content is increased in the composition composed of these three raw materials, the volume change before and after firing is increased, resulting in increased shrinkage.

  From such a viewpoint, in the manufacturing method of the PDP 10 of this example, the composition ratios of the first partition material 5a and the second partition material 5b are made different. Specifically, the binder content of the first partition wall material 5a is used more than that of the second partition wall material 5b. As a result, a difference occurs in the shrinkage amount due to firing, and the shrinkage amount of the first partition material 5a having a large binder content is larger than that of the second partition material 5b. The shrinkage amount of the formed horizontal barrier rib 5A is larger than that of the vertical barrier rib 5B formed by the second barrier rib material 5b, and the height of the horizontal barrier rib 5A is formed lower than that of the vertical barrier rib 5B. Therefore, as shown in FIG. 1, the height of the horizontal partition 5A can be formed lower than that of the vertical partition 5B.

  As described above, according to the PDP manufacturing method of this example, the first partition wall material 5a is fired by using a binder having a composition ratio that increases the binder content more than that of the second partition wall material 5b. Therefore, the shrinkage amount of the horizontal partition wall 5A formed by the first partition wall material 5a having a high binder content is made larger than that of the vertical partition wall 5B formed by the second partition wall material 5b, thereby increasing the height of the horizontal partition wall 5A. Since the height is lower than that of the vertical partition 5B, a gap as an exhaust path can be easily secured between the horizontal partition 5A on the back substrate 1 and the front substrate. In addition, since the horizontal barrier rib 5A and the vertical barrier rib 5B are formed by a single photolithography process after the first barrier rib material 5a and the second barrier rib material 5b are applied, the formation accuracy of the first barrier rib material 5a is very high. Even if it does not, the shift of the partition shape does not occur.

As described above, according to the PDP 10 of this example, the front substrate and the rear substrate are arranged to face each other so that a discharge space is formed between the two substrates, and the display cell is provided on either one of the front substrate and the rear substrate. In the configuration having partition walls for partitioning, the cross-shaped partition walls 5 include a horizontal partition wall 5A formed in the row direction H on the opposing surface, and a vertical partition wall 5B formed in the column direction V orthogonal to the row direction H. The horizontal barrier ribs 5A and the vertical barrier ribs 5B are formed in different patterns, and the height of the horizontal barrier ribs 5A is lower than that of the vertical barrier ribs 5B. In addition, a gap as an exhaust path can be easily secured.
Further, according to the manufacturing method of the PDP of this example, the shrinkage amount of the horizontal barrier rib 5A formed by the first barrier rib material 5a having a large binder component by firing is reduced by the vertical barrier rib 5B formed by the second barrier rib material 5b. Since the width of the horizontal partition wall 5A is made lower than that of the vertical partition wall 5B, the gap as the exhaust path is easily secured between the horizontal partition wall 5A on the back substrate 1 and the front substrate. can do.
Therefore, both improvement in exhaust conductance and suppression of discharge interference can be achieved, and a more stable partition wall shape can be obtained.

4 is a perspective view showing a schematic configuration of a PDP according to Embodiment 2 of the present invention, FIG. 5 is a plan view showing a manufacturing method (first manufacturing method) of the PDP in order of steps, and FIG. FIG. 7 is a cross-sectional view illustrating a shape of a partition formed by the first manufacturing method of the PDP. The schematic configuration of the PDP in this example is greatly different from that of the first embodiment described above in that a part of the horizontal partition walls formed in the row direction H is formed to have a low height.
That is, as shown in FIG. 4, the back substrate 11 of the PDP 12 in this example has a grid-like partition wall 13 composed of a horizontal partition wall 13 </ b> A formed in the row direction H and a vertical partition wall 13 </ b> B formed in the column direction V. Thus, a part of the horizontal partition wall 13A is formed to be low in height. With such a setting, when the rear substrate and the front substrate are combined, a gap can be formed between a part of the horizontal partition wall 13A in the row direction H on the rear substrate 11 and the front substrate. Has been. The discharge gas is filled into the discharge gas space in the same manner as the PDP 10 of the first embodiment after the gas in the panel is once exhausted from the vent formed at the end of the panel and then discharged from the vent. It is done by introducing.
Since the configuration other than this is substantially the same as that of the PDP 10 of the first embodiment shown in FIG. 1, in FIG. 4, each part corresponding to the constituent part of FIG.

  As described above, according to the PDP 12 of this example, the cross-shaped barrier ribs 13 for partitioning the display cells 14 include the horizontal barrier ribs 13A formed in the row direction H and the column direction V orthogonal to the row direction H. Since the vertical barrier ribs 13B are formed, the horizontal barrier ribs 13A and the vertical barrier ribs 13B are formed in different patterns, and the height of a part of the horizontal barrier ribs 13A is lower than that of the vertical barrier ribs 5B. A gap as an exhaust path can be easily secured between the horizontal partition wall 13A on the back substrate 11 and the front substrate. Therefore, in the process of filling the discharge gas, the inside of the panel can be efficiently exhausted by exhausting through the gap. Therefore, the exhaust process similar to that of the PDP 10 of Example 1 in FIG. Since the gas can be exhausted sufficiently, a large amount of impurity gas does not remain, and the discharge characteristics and further the light emission characteristics as the PDP can be improved. In addition, since an exhaust state equivalent to that of the PDP 10 can be obtained in substantially the same exhaust time, the productivity of the PDP is not reduced.

  Further, according to the PDP 12 of this example, like the PDP 10 of the first embodiment, the cross-shaped partition wall 13 is constituted by the horizontal partition wall 13A and the vertical partition wall 13B respectively formed on the opposing surface of the insulating substrate 2, Since the striped barrier ribs are not superimposed on the barrier rib portions 13A and 13B, the first and vertical barrier ribs 13A and 13B can be stably formed. In addition, the first and vertical barrier ribs 13A and 13B are both constituted by a single barrier rib, and only one of the barrier rib portions is not formed with a large width, so that the design range of the barrier rib width is limited. Will disappear.

Next, the first manufacturing method of the PDP 12 of this example will be described in the order of steps with reference to FIGS. 6A to 6E show cross sections taken along the line BB 'in FIGS. 5A to 5E, respectively.
First, as shown in FIGS. 5A and 6A, an insulating substrate 2 made of a transparent material such as glass is prepared, and electrode layers made of Al, Ag, etc. are parallel to each other along the column direction V. After 3a is formed on substantially the entire surface, a first partition wall material 13a made of an insulating paste containing lead-containing frit glass or the like is applied on the substantially entire surface by, for example, screen printing. In this case, the height of the first partition wall material 13a is selected to be approximately ½ of the finally required thickness for the horizontal partition wall 13A. Next, a resist pattern 8 having the same shape as the data electrode 3 to be formed is formed on the first partition wall material 13a by photolithography.

  Next, as shown in FIGS. 5B and 6B, the first partition wall material 13a is patterned by, for example, sandblasting using the resist pattern 8 as a mask, so that the unnecessary second partition wall material 13a is formed. Remove. Further, the data electrode 3 is formed by patterning by etching using the resist pattern 8 as a mask.

Next, as shown in FIGS. 5 (c) and 6 (c), the second partition material 13b made of an insulating paste containing lead-containing frit glass or the like is replaced with the first partition material 13a by, for example, a table coater. It coat | covers on the substantially whole surface of the insulated substrate 2 so that it may cover. Next, the height of the non-formation part of the 2nd partition material 13b is adjusted by leveling so that it may become the same as that of the formation part of the 1st partition material 13a. Here, the first partition wall material 13a and the second partition wall material 13b are made of compositions as described later.
Next, a resist pattern 7 having the same shape as the cross-shaped barrier ribs 13 to be formed is formed on the second barrier rib material 13b by photolithography.

  Next, as shown in FIGS. 5D and 6D, the second partition wall material 13b is patterned by, for example, sandblasting using the resist pattern 7 as a mask, so that the unnecessary second partition wall material 13b is formed. Remove.

Next, as shown in FIGS. 5 (e) and 6 (e), after removing the resist pattern 7, baking is performed to form the horizontal barrier rib 13A with the first barrier rib material 13a and at the same time the second barrier rib. The vertical barrier ribs 13B are formed from the material 13b, the cross-shaped barrier ribs 13 are formed, and the back substrate 2 is completed.
Thereafter, the plasma display device is completed by completing the PDP 12 through the same steps as the manufacturing method of the PDP 10 of Example 1, and then attaching peripheral circuit boards such as a drive circuit and a signal processing circuit to the PDP 12. Let

  In the first manufacturing method of the PDP 12 as described above, the softening points of the first partition material 13a and the second partition material 13b to be used are different. Specifically, the first partition wall material 13a and the second partition wall material 13b are composed of a filler made of a metal oxide or the like for maintaining the shape after firing and a low melting point for bonding the filler after firing. The composition composed of glass and the binder for bonding each material before firing is the same, and the softening point of the low melting point glass contained in the first partition material 13a is that contained in the second partition material 13b. It is used lower than the softening point. As a result, a difference occurs in the holding force of the partition wall structure during firing, and the holding force of the first partition wall material 13a having a low softening point of the low melting point glass is smaller than that of the second partition wall material 13b. The holding force of the horizontal barrier rib 13A formed by the first barrier rib material 13a is smaller than that of the vertical barrier rib 13B formed by the second barrier rib material 13b. Therefore, as shown in FIG. 4, the height of a part of the horizontal partition wall 13A can be formed low.

  FIGS. 7A and 7B show cross sections taken along lines XX ′ and YY ′ in FIG. 5E, respectively, and are formed by the first manufacturing method of the PDP 12 of this example. The shape of the partition is explained. As shown in FIG. 7 (a), the first partition wall material 13a applied first has a lower softening point of the low melting point glass than the second partition wall material 13b applied next, and is fired. Since the force to hold the partition wall structure is sometimes weakened, sagging occurs at the bottom and the height is lowered. On the other hand, as shown in FIG. 7B, when the softening points of the low melting point glass of the first and second partition wall materials 13a and 13b are applied to be substantially the same, the force for holding the partition wall structure during firing is Since it becomes substantially the same, there is almost no sagging at the bottom, so the height is not so low.

  Thus, the height of the partition wall can be changed not only by the example of increasing the shrinkage amount by increasing the binder content of the partition wall material composition as in the manufacturing method of the PDP 10 of Example 1, but also by different phenomena. it can.

  Further, according to the first manufacturing method of the PDP 12 described above, the patterning of the first partition wall material 13a and the patterning of the data electrode 3 are performed using the resist pattern 8 as a common mask, thereby increasing the number of photolithography processes. Thus, a pattern of the first partition wall material 13a can be obtained.

  Thus, also in this example, substantially the same effects as described in the first embodiment can be obtained.

  FIG. 8 is a plan view showing a method of manufacturing a PDP according to Embodiment 3 of the present invention in the order of steps, and FIG. 9 is a cross-sectional view taken along the line CC 'in FIG. The structure of the manufacturing method of the PDP of this example (the second manufacturing method of the PDP of Example 2) is significantly different from the first manufacturing method of the PDP of Example 1 described above. This is the point to use. Hereinafter, the second manufacturing method of the PDP 12 will be described in the order of steps with reference to FIGS. 9A to 9E show cross sections taken along the line CC 'in FIGS. 8A to 8E, respectively.

  First, as shown in FIGS. 8A and 9A, an insulating substrate 2 made of a transparent material such as glass is prepared, and data electrodes made of Al, Ag, etc. are parallel to each other along the column direction V. 3 is formed, the first barrier rib material 15a having negative photosensitivity is applied to substantially the entire surface of the insulating substrate 2 by, for example, a screen printing method. In this case, the height of the first partition wall material 15a is selected to be approximately ½ of the finally required thickness for the horizontal partition wall 15A. Next, exposure is performed from the back surface of the insulating substrate 2 using the data electrode 3 as a mask.

  Next, as shown in FIGS. 8B and 9B, the lateral barrier ribs 15a are patterned so as to remove only the portions directly above the data electrodes 3 by performing development. By configuring the data electrode 3 from a light-shielding material such as Al or Ag, the first partition material 15a only in the portion immediately above the data electrode 3 that is not exposed is removed.

  Next, as shown in FIGS. 8 (c) and 9 (c), the second partition material 15b made of an insulating paste containing lead-containing frit glass or the like is replaced with the first partition material 15a using, for example, a table coater. It coat | covers on the substantially whole surface of the insulated substrate 2 so that it may cover. Next, the height of the non-formation part of the 2nd partition material 15b is adjusted by leveling so that it may become the same as that of the formation part of the 1st partition material 15a. Here, the first partition wall material 15a and the second partition wall material 15b are made of compositions as described later. Next, a resist pattern 7 having the same shape as the cross-shaped partition 15 to be formed is formed on the second partition material 15b by photolithography.

  Next, as shown in FIGS. 8D and 9D, the first and second partition wall materials 15a and 15b are patterned by, for example, sand blasting using the resist pattern 7 as a mask, and unnecessary first And the second partition wall materials 15a and 15b are simultaneously removed.

  Next, as shown in FIGS. 8E and 9E, the resist pattern 7 is removed and then baked to form the horizontal barrier ribs 15A from the first barrier rib material 15a and at the same time the second barrier ribs. The vertical barrier ribs 15B are formed from the material 15b, the cross-shaped barrier ribs 15 are formed, and the back substrate 2 is completed.

  Thereafter, the PDP 12 is completed through the same steps as the first manufacturing method of the PDP 12 of the second embodiment, and then a peripheral circuit substrate such as a drive circuit and a signal processing circuit is attached to the PDP 12 to thereby display a plasma display. Complete the device.

  In the second manufacturing method of the PDP 12 as described above, the shrinkage amount due to firing of the first partition wall material 15a and the second partition wall material 15b to be used is different. Specifically, the composition of the first partition material 15a is adjusted so that the shrinkage amount is smaller than that of the second partition material 15b. As a result, a difference occurs in the shrinkage amount due to firing, and the shrinkage amount of the first partition wall material 15a is smaller than that of the second partition wall material 15b, so that the horizontal partition wall 15A formed by the first partition wall material 15a. Is smaller than that of the vertical barrier rib 15B formed by the second barrier rib material 15b. Therefore, as shown in FIG. 4, the height of a part of the horizontal partition wall 13A (which is 15A in this example) can be formed low like the PDP 12 of the second embodiment.

  Further, according to the above-described second manufacturing method of the PDP 12, the horizontal barrier ribs 15A are formed by the horizontal barrier ribs 15a by performing development after exposure from the back surface of the insulating substrate 2 using the data electrodes 3 as a mask. Since the exposure mask is not required and alignment with the data electrode 3 is not required, the horizontal barrier rib 15A can be formed with high accuracy by a simple process.

  Thus, also in this example, substantially the same effect as described in the first manufacturing method of the PDP in Example 2 can be obtained.

FIG. 10 is a perspective view showing a schematic configuration of a PDP manufactured by a PDP manufacturing method according to Embodiment 4 of the present invention, and FIG. 11 is a block diagram showing the PDP manufacturing method in the order of steps. The PDP in this example is characterized in that it is manufactured according to the method for manufacturing a PDP in Examples 1 to 3.
As shown in FIG. 10, the PDP 70 in this example is arranged so that a front substrate 71 and a rear substrate 72 face each other, and a basic configuration in which a discharge gas space 73 is formed between the substrates 71 and 72. have.

Here, as shown in FIG. 10, the front substrate 71 is arranged in parallel with each other along the row direction H on the first insulating substrate 74 made of a transparent material such as glass and the inner surface of the first insulating substrate 74. The scan electrode 75 and the sustain electrode (common electrode) 76 constituting the row electrode, the first dielectric layer 77 made of PbO or the like covering the electrodes 75 and 76, and the first dielectric layer 77 from the discharge. And a protective layer 78 made of MgO or the like for protection. Here, the scan electrode 75 and the sustain electrode 76 are transparent electrodes 75A and 76A made of ITO, SnO ₂ or the like, respectively, and Al and Ag formed on a part of the transparent electrodes 75A and 76 in order to reduce resistance. Etc., and bus electrodes (trace electrodes) 75B and 76B.

  On the other hand, as shown in FIG. 10, the back substrate 72 includes a second insulating substrate 81 made of a transparent material such as glass, and a column direction V perpendicular to the row direction H on the inner surface of the second insulating substrate 81. A data electrode (address electrode) 83 made of Al, Ag or the like that is arranged in parallel with each other to form a column electrode, a second dielectric layer 84 made of lead-containing frit glass or the like covering the data electrode 83, He, A discharge gas such as Ne or Xe is filled alone or mixed to secure the discharge gas space 73, and in addition, a grid-shaped partition wall 85 made of lead-containing frit glass or the like formed to partition the display cell. And a red phosphor layer that converts the ultraviolet light generated by the discharge of the discharge gas into red light, a green phosphor layer that converts green light, and blue. Blue phosphor layer and a phosphor layer 86 which is painted that.

The PDP 70 in this example is manufactured by a manufacturing method as shown in FIG. The process will be described below in the order of steps with reference to FIG.
First, in step a, a front glass substrate is prepared as the first insulating substrate 74. Next, in step b, ITO or the like is formed on the inner surface of the substrate 74 by sputtering or the like, and then patterned into a desired shape by photolithography. Then, the transparent electrodes 75A and 76A are formed. Then, in step c, Al or the like is formed on the transparent electrodes 75A and 76A by sputtering or the like, and then patterned into a desired shape by photolithography. The electrodes 75B and 76B are formed to complete the scan electrode 75 and the sustain electrode 76. Next, a first dielectric layer 77 such as PbO is formed by a screen printing method or the like so as to cover the scan electrode 75 and the sustain electrode 76 in step d, and then in step e, a black mask (not shown in FIG. 10). Next, in step f, a protective film 78 made of MgO or the like is formed to complete the front substrate 71.

  On the other hand, in step g, a rear glass substrate is prepared as the second insulating substrate 81. Next, in step h, Al or the like is formed on the inner surface of the substrate 81 by sputtering or the like, and then patterned into a desired shape by photolithography. Thus, the data electrode 83 is formed. Next, in step i, a cross-shaped barrier rib 85 is formed on the data electrode 84 in accordance with the method for manufacturing the PDP in the first to third embodiments. Next, in step j, the phosphor layer 86 is covered so as to cover the barrier rib 85. Next, in step k, a seal frit (not shown in FIG. 10) is formed by a screen printing method or the like to complete the back substrate 72.

  Next, in step l, the front substrate 71 and the rear substrate 72 are used to be fixed and assembled in a state of facing each other with a gap of about 100 μm. Next, in step m, the periphery of both substrates 71 and 72 is sealed with a seal frit (sealing material). Next, in step n, the gas in the panel is once exhausted from the vent formed at the end of the panel by both substrates 71 and 72, and then the discharge gas is filled from the vent, so that the discharge gas space 73 is filled. Fill the discharge gas. For example, the second insulating substrate 81 constituting the back substrate 72 is formed with vent holes at appropriate locations, and the outer surface of the insulating substrate 81 is omitted in FIG. The vent tube is attached under sealed condition in alignment with the. The end of the vent pipe opposite to the end attached to the back substrate 71 is open in the initial state, and the vent pipe is connected to the exhaust / gas filling device through this end. .

  First, after the discharge gas space 73 is evacuated to vacuum by the exhaust / gas filling device, the discharge gas space 73 is filled with the discharge gas. After the discharge gas filling is completed, the vent tube is chipped on due to overheating, and the open end is closed. In this way, the discharge gas space is filled with the discharge gas, and the PDP 70 is completed.

  Thus, according to the PDP 70 of this example, the PDP 70 can be stably operated because the PDP 70 is manufactured according to the manufacturing method of the PDP in the first to third embodiments.

FIG. 12 is a block diagram showing the configuration of the plasma display apparatus which is Embodiment 5 of the present invention. The plasma display device of this example is characterized in that it is configured using the PDP according to the first to fourth embodiments.
The plasma display device 60 of this example is designed to have a module structure as shown in FIG. 12, and specifically includes an analog interface (hereinafter referred to as IF) 20 and a color PDP module 30. Yes.

  As shown in FIG. 12, the analog IF 20 includes a Y / C separation circuit 21 including a chroma decoder, an A / D conversion circuit 22, a synchronization signal control circuit 23 including a PLL circuit, an image format conversion circuit 24, The circuit includes an inverse γ (gamma) conversion circuit 25, a system control circuit 26, and a PLE control circuit 27.

  Schematically, the analog IF 20 converts the received analog video signal into a digital video signal, and then supplies the digital video signal to the color PDP module 30. For example, an analog video signal transmitted from a TV tuner is decomposed into RGB luminance signals in a Y / C separation circuit 21 and then converted into a digital signal in an A / D conversion circuit 22. Thereafter, when the pixel configuration of the color PDP module 30 is different from the pixel configuration of the video signal, the image format conversion circuit 24 performs necessary image format conversion. The display luminance characteristic with respect to the input signal of the PDP is linearly proportional, but a normal video signal is corrected (γ conversion) in advance in accordance with the characteristic of the CRT. For this reason, after the A / D conversion of the video signal is performed in the A / D conversion circuit 22, the inverse γ conversion circuit 25 performs the inverse γ conversion on the video signal, and the digital video signal restored to the linear characteristic is converted into the digital video signal. Generate. This digital video signal is output to the color PDP module 30 as an RGB video signal.

  Since the analog video signal does not include the sampling clock and data clock signal for A / D conversion, the PLL circuit built in the synchronization signal control circuit 23 is supplied with the horizontal synchronization signal simultaneously with the analog video signal. Is used as a reference to generate a sampling clock and a data clock signal and output them to the color PDP module 30. The PLE control circuit 27 of the analog IF 20 performs brightness control. Specifically, the display luminance is increased when the average luminance level is equal to or lower than a predetermined value, and the display luminance is decreased when the average luminance level exceeds a predetermined value.

  The system control circuit 26 outputs various control signals to the color PDP module 30. The color PDP module 30 further includes a digital signal processing / control circuit 31, a panel unit 32, and an in-module power supply circuit 33 incorporating a DC / DC converter. The digital signal processing / control circuit 31 includes an input IF signal processing circuit 34, a frame memory 35, a memory control circuit 36, and a driver control circuit 37.

  For example, the average luminance level of the video signal input to the input IF signal processing circuit 34 is calculated by an input signal average luminance level calculation circuit (not shown) in the input IF signal processing circuit 34 and output as, for example, 5-bit data. Is done. Further, the PLE control circuit 27 sets PLE control data according to the average luminance level and inputs it to a luminance level control circuit (not shown) in the input IF signal processing circuit 34.

  The digital signal processing / control circuit 31 transmits these control signals to the panel unit 32 after processing these various signals in the input IF signal processing circuit 34. At the same time, the memory control circuit 36 and the driver control circuit 37 transmit the memory control circuit and driver control signal to the panel unit 32.

  The panel unit 32 includes, for example, a PDP 70 according to the fourth embodiment, a scan driver 38 that drives the scan electrodes, a data driver 39 that drives the data electrodes, a high-voltage pulse circuit 40 that supplies a pulse voltage to the PDP 70 and the scan driver 38, The power recovery circuit 41 recovers surplus power from the high voltage pulse circuit 40.

The PDP 70 is configured to have pixels arranged, for example, 1365 × 768. In the PDP 70, the scanning driver 38 controls the scanning electrodes, and the data driver 39 controls the data electrodes, so that lighting or non-lighting of predetermined pixels among these pixels is controlled and desired display is performed. .
The logic power supply supplies logic power to the digital signal processing / control circuit 31 and the panel unit 32. Further, the in-module power supply circuit 33 is supplied with DC power from the display power supply, converts the voltage of the DC power into a predetermined voltage, and then supplies the voltage to the panel unit 32.

Hereinafter, a method for manufacturing the plasma display device 60 of this example will be schematically described.
First, for example, the PDP 70 according to the fourth embodiment, the scan driver 38, the data driver 39, the high voltage pulse circuit 40, and the power recovery circuit 41 are arranged on one substrate to form the panel unit 32. Further, a digital signal processing / control circuit 31 is formed separately from the panel unit 32.

The panel unit 32, the digital signal processing / control circuit 31, and the in-module power supply circuit 33 thus formed are assembled as one module to form the color PDP module 30. Further, the analog IF 20 is formed separately from the color PDP module 30.
In this manner, after the color PDP module 30 and the analog IF 20 are formed separately, the two are electrically connected to complete the plasma display device 60 shown in FIG.

  As described above, by modularizing the plasma display device 60, it becomes possible to manufacture the plasma display device 60 independently of other components constituting the plasma display device. In the case of failure, the repair can be simplified and shortened by replacing the color PDP module 30 with each other.

  As described above, according to the plasma display device of this example, the color PDP module 30 can be replaced in the event of a failure by modularizing the plasma display device 60, simplifying repair and shortening the time. Can be achieved.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the present invention can be changed even if there is a design change or the like without departing from the gist of the present invention. include. For example, in the embodiment, the example in which the partition wall is formed on the rear substrate is shown, but the partition wall is not limited to the rear substrate, but may be formed on the front substrate. In addition, in each of the embodiments, an example of forming a grid-like partition wall has been described, but it is not limited to a partition wall having a specific shape as long as the purpose is to partially control the height of the partition wall. . Further, in the manufacturing method of the PDP of Example 1, the example has been described in which the shrinkage amount of each partition wall material is changed by adjusting the binder content in the composition of the first and second partition wall materials. Instead, the shrinkage amount of each partition wall material may be changed by adjusting the content of the filler or the low melting point glass in the composition. In the method for manufacturing the PDP in Example 2, the height of a part of the partition walls is changed by adjusting the softening point of the low melting glass in the composition of the first and second partition wall materials. However, the present invention is not limited to this, and it may be performed by adjusting the binder content in the composition of the first and second partition wall materials as in the first embodiment. In addition, the height relationship of the partition walls is such that a groove, an uneven surface, an inclined surface, or the like is formed on the upper surface of at least one partition wall as long as a gap as an exhaust path can be secured between the two substrates. Good.

  In addition, the partition wall formation method described in the PDP manufacturing method of each embodiment is a technique for partially controlling the height of the partition wall, and in each embodiment, the description has been focused on an example of forming irregularities on the partition wall. However, the present invention is not limited to this, and can also be used for applications such as controlling the unevenness of the partition walls caused by other factors. For example, when forming a partition using the first partition material and the second partition material, by changing the formation state of the first and second partition materials, without specifying the horizontal partition and the vertical partition, That is, by forming the first partition wall portion and the second partition wall portion having different formation states regardless of the position of the horizontal partition wall and the vertical partition wall, the unevenness of the partition wall can be controlled. Further, the PDP or plasma display device of the present invention is not limited to the color display method, and can be applied to a monochrome display method.

It is a perspective view which shows schematic structure of PDP which is Example 1 of this invention. It is a top view which shows the manufacturing method of the PDP in order of a process. It is sectional drawing along the AA 'line of FIG. It is a perspective view which shows schematic structure of PDP which is Example 2 of this invention. It is a top view which shows the manufacturing method of the PDP in order of a process. It is sectional drawing along the BB 'line of FIG. It is sectional drawing explaining the shape of the partition formed by the manufacturing method of the PDP. It is a top view which shows the manufacturing method of PDP which is Example 3 of this invention in order of a process. It is sectional drawing along CC line of FIG. It is a perspective view which shows schematic structure of PDP manufactured by the manufacturing method of PDP which is Example 4 of this invention. It is a block diagram which shows the manufacturing method of the same PDP in process order. It is a block diagram which shows the structure of the plasma display apparatus which is Example 5 of this invention. It is a perspective view which shows the structure of PDP which concerns on a 1st prior art. It is a top view which shows the structure of PDP based on the said 1st prior art. It is a top view which shows the structure of PDP which concerns on a 2nd prior art. It is a perspective view which shows the structure of PDP which concerns on a 3rd prior art. It is a perspective view which shows the structure of PDP which concerns on a 4th prior art.

Explanation of symbols

1, 11 Rear substrate (second substrate)
2 Insulating substrate 3 Data electrode (address electrode)
4, 14 Display cells 5, 13, 15 Grid-like partition walls 5a, 13a, 15a First partition material 5b, 13b, 15b Second partition material 5A, 13A, 15A Horizontal partition walls 5B, 13B, 15B Vertical partition walls 6 Fluorescence Body layer 7, 8 Resist pattern 10, 12, 70 Plasma display panel (PDP)
20 Analog interface (IF)
30 Color PDP Module 31 Digital Signal Processing / Control Circuit 32 Panel Unit 60 Plasma Display Device

Claims (18)

A partition for opposingly arranging a first substrate and a second substrate so as to form a discharge space between the two substrates, and partitioning display cells on one of the opposing surfaces of the first and second substrates A plasma display panel comprising:
The plasma display panel, wherein the barrier ribs are formed of a plurality of barrier rib materials having different properties, and the plurality of materials are formed in different patterns.   A row electrode group composed of a first electrode and a second electrode is disposed on the facing surface of the first substrate through a main discharge gap in a first direction, while the facing surface of the second substrate is opposed to the second substrate. 2. The plasma display panel according to claim 1, wherein a column electrode group composed of a third electrode is arranged on the surface in a direction orthogonal to the row electrode group. The partition is composed of a plurality of partition materials including a first partition material and a second partition material having a composition different from that of the first partition material, the first partition portion, and the first partition The partition wall portion has a second partition wall portion having a different composition ratio between the first partition wall material and the second partition wall material,
3. The plasma display panel according to claim 1, wherein the first partition wall and the second partition wall have different heights. The partition is composed of a plurality of partition materials including a first partition material and a second partition material having a composition different from that of the first partition material, the first partition portion, and the first partition The partition wall portion has a second partition wall portion having a different composition ratio between the first partition wall material and the second partition wall material,
3. The plasma display panel according to claim 1, wherein the first partition wall and the second partition wall have substantially the same height.   The plasma display panel according to any one of claims 1 to 4, wherein the plurality of partition wall materials include partition wall materials having different shrinkage ratios by firing.   The plasma display panel according to any one of claims 1 to 4, wherein the plurality of partition wall materials include partition wall materials having different softening points of glass materials contained therein. A partition for opposingly arranging a first substrate and a second substrate so as to form a discharge space between the two substrates, and partitioning display cells on one of the opposing surfaces of the first and second substrates A method of manufacturing a plasma display panel having
The step of forming the partition includes
Forming a first partition wall material on any one of the facing surfaces;
Forming a second partition material on any one of the opposing surfaces;
Patterning the first and second partition wall materials into a shape constituting the partition wall over time;
Simultaneously firing the first and second partition wall materials;
A method for manufacturing a plasma display panel, comprising: A first substrate and a second substrate are arranged to face each other so as to form a discharge space between the two substrates, and the first surface of the first substrate faces the first direction via a main discharge gap in the first direction. A row electrode group composed of the second electrode and the second electrode is disposed, while a column electrode group composed of the third electrode is disposed in the second direction on the facing surface of the second substrate, and the first electrode And a method of manufacturing a plasma display panel having partition walls for partitioning display cells on either one of the opposing surfaces of the second substrate,
The step of forming the partition includes
Forming a first partition wall material on any one of the facing surfaces;
Forming a second partition material on any one of the opposing surfaces;
Patterning the first and second partition wall materials into a shape constituting the partition wall over time;
Simultaneously firing the first and second partition wall materials;
A method for manufacturing a plasma display panel, comprising:   9. The method of manufacturing a plasma display panel according to claim 7, wherein a formation pattern of the first barrier rib material is different from a formation pattern of the second barrier rib material. The partition wall includes a first partition wall portion, and the first partition wall portion has a second partition wall portion having a different composition ratio of the first partition wall material and the second partition wall material,
10. The method of manufacturing a plasma display panel according to claim 7, wherein the first partition wall portion and the second partition wall portion have different heights. 11. The partition wall includes a first partition wall portion, and the first partition wall portion has a second partition wall portion having a different composition ratio of the first partition wall material and the second partition wall material,
10. The method of manufacturing a plasma display panel according to claim 7, wherein the first partition wall portion and the second partition wall portion have substantially the same height.   12. The method of manufacturing a plasma display panel according to claim 7, wherein the first partition wall material and the second partition wall material have different shrinkage rates due to firing.   The method for manufacturing a plasma display panel according to any one of claims 7 to 11, wherein the first partition wall material and the second partition wall material have different softening points of the glass material contained therein.   The step of forming the first barrier rib material partially forms the first barrier rib material, while the step of forming the second barrier rib material forms the second barrier rib material on the entire surface. The method for manufacturing a plasma display panel according to claim 7, wherein:   15. The step of patterning into a shape constituting the partition wall simultaneously patterns the third electrode and the first partition wall material using a common resist pattern. A method for producing a plasma display panel as described in 1. above.   The step of patterning into a shape constituting the partition wall includes forming the first partition wall material made of a photosensitive material so as to cover the third electrode made of a light-shielding material on the surface of the transparent substrate. 15. The method of manufacturing a plasma display panel according to claim 8, wherein the first barrier rib material is patterned by exposing from the back surface of the transparent substrate using an electrode as a mask, and then developing the pattern. .   A plasma display device comprising the plasma display panel according to claim 1. A first step of manufacturing a plasma display panel by the method of manufacturing a plasma display panel according to any one of claims 7 to 16,
A second step of manufacturing the plasma display panel as a module together with a circuit for driving the plasma display panel;
A third step of performing an image signal format conversion and electrically connecting an interface for transmission to the module to the module;
A method for manufacturing a plasma display device, comprising:

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