JP4438569B2 - Reactor - Google Patents

Description

  The present invention relates to a reactor, and more particularly to a fuel reforming reactor.

  In recent years, research and development have been actively conducted on fuel cells that can achieve high energy use efficiency. BACKGROUND ART A fuel cell is a promising battery that is promising and promising because it directly extracts electric energy from chemical energy by electrochemically reacting fuel and oxygen in the atmosphere. There are two types of fuel cells: direct type and reforming type. The direct type directly supplies liquid fuel such as alcohols and gasoline to the fuel electrode of the fuel cell for power generation. The reforming type converts the fuel to hydrogen. It supplies the reformed and reformed hydrogen to the fuel electrode. Compared with the reforming type, the direct type has a problem that a part of the fuel crosses over the proton permeable membrane. In contrast, the reforming type is capable of relatively high output, but requires a reforming device for reforming liquid fuel in addition to the fuel cell. When used as a power source for equipment, it is necessary to downsize not only the fuel cell but also the reformer.

On the other hand, Patent Document 1 describes that a small amount of chemical reaction is performed by using a small chemical microreactor formed by bonding a plurality of substrates, and the chemical microreactor described in Patent Document 1 is used for a reformer. Research and development are also underway. The microreactor described in Patent Document 1 will be briefly described. First, a first substrate made of polystyrene having a twisted groove formed on one surface as a flow path is prepared, and the groove is covered. In addition, the second substrate is bonded to the first substrate with an ultraviolet curable resin, whereby a twisted flow path is formed at the joint between the two substrates. When a reactant is caused to flow through the flow path of the chemical microreactor, the reactant reacts to produce a target product or an intermediate product.
JP 2002-102681 A

By the way, by heating the chemical microreactor, the heat of the chemical microreactor is conducted to the reactant flowing through the flow path while being in contact with the wall surface, so that the chemical reaction of the reactant can be made efficient. In a twisted flow path, the flow path bends at multiple locations, so the flow direction of the fluid changes one by one, increasing the pressure loss and increasing the flow path length. Can not be discharged quickly.
An object of the present invention is to provide a reactor that can pass through a fluid quickly and can be heated efficiently.

In order to solve the above problems, the reactor according to claim 1 comprises:
A substrate having a plurality of through holes penetrating from one surface to the other surface facing the surface;
A flat plate portion provided at a first interval between the through holes adjacent to each other on the one surface;
An insulating film on the one surface;
A heating element provided at a position of the flat plate portion on the insulating film;
A protective insulating film covering the heating element;
With
Said 1st space | interval is longer than the 2nd space | interval between the said other through-holes mutually adjacent in said one surface.

The invention described in claim 2
The reactor according to claim 1,
A plurality of the flat plate portions are arranged on the substrate,
Each of the plurality of flat plate portions is provided with the heating element,
Each of the heating elements is arranged independently of each other.

The invention according to claim 3
The reactor according to claim 1,
A plurality of the flat plate portions are arranged on the substrate,
Each of the plurality of flat plate portions is provided with the heating element,
Each of the heating elements has a different resistance value.

The invention according to claim 4
Reactor according to any one of claims 1 to 3,
It is characterized by being a vaporizer.

The invention described in claim 5
Reactor according to any one of claims 1 to 3,
It is a reformer.

The invention described in claim 6
Reactor according to any one of claims 1 to 3,
It is a carbon monoxide remover.

According to the first aspect of the present invention, a position where the heating element is arranged on the surface of the substrate having the through hole is sufficiently secured, and the fluid can pass through the through hole quickly.

  According to the second aspect of the present invention, each heating element can generate heat independently, and the temperature distribution of the atmosphere around the substrate can be controlled.

  In the third aspect of the present invention, since the amount of heat generation differs for each heating element by applying a voltage to each heating element, each heating element is caused to generate heat in an amount corresponding to the resistance value, and the temperature of the atmosphere around the substrate The distribution can be controlled.

  The best mode for carrying out the present invention will be described below with reference to the drawings. However, the embodiments described below are given various technically preferable limitations for carrying out the present invention, but the scope of the invention is not limited to the following embodiments and illustrated examples.

FIG. 1 is a block diagram showing a schematic configuration of the power generator 1.
The power generation device 1 includes a desktop personal computer, a notebook personal computer, a mobile phone, a PDA (Personal Digital Assistant), an electronic notebook, a wristwatch, a digital still camera, a digital video camera, a game device, a game machine, a household electric device, and the like. The electronic device is provided and used as a power source for operating the electronic device main body.

  The power generation apparatus 1 includes a fuel container 2 that stores fuel as a power generation source, a vaporizer 3 that includes a microreactor that vaporizes the fuel supplied from the fuel container 2, and sucks and sucks fuel from the fuel container 2. The fuel pump 4 for supplying the vaporized fuel to the vaporizer 3, the reformer 5 composed of a microreactor for reforming the vaporized fuel supplied from the vaporizer 3 into hydrogen, and the reformer 5 A carbon monoxide remover 6 composed of a microreactor that removes carbon monoxide from a mixture containing hydrogen, and an electrochemical reaction between hydrogen and oxygen in the outside air out of the mixture supplied from the carbon monoxide remover 6 A fuel cell 7 that generates electric energy, and an air pump 8 that sucks air from outside and supplies the sucked air to the carbon monoxide remover 6 and the fuel cell 7 are provided. Here, the reactor according to the present invention is applied to the vaporizer 3, the reformer 5, and the carbon monoxide remover 6.

  The vaporizer 3, the fuel pump 4, the reformer 5, the carbon monoxide remover 6, the fuel cell 7 and the air pump 8 are mounted on the electronic device main body. On the other hand, the fuel container 2 is detachably attached to the electronic device main body. When the fuel container 2 is attached to the electronic device main body, the fuel in the fuel container 2 is vaporized by the fuel pump 4 by the vaporizer 3. To be sent to.

  The fuel stored in the fuel container 2 is a mixture of liquid chemical fuel and water, and as the chemical fuel, compounds containing hydrogen elements such as alcohols such as methanol and ethanol, and gasoline are applicable. In this embodiment, a mixed liquid of methanol and water is used as the fuel.

  The fuel cell 7 includes a fuel electrode as a gas diffusion layer composed of catalyst fine particles and carrier fine particles, an air electrode as a gas diffusion layer composed of catalyst fine particles and carrier fine particles, and hydrogen sandwiched between the fuel electrode and the air electrode. An ion conductive solid polymer electrolyte membrane. The air electrode communicates with the air pump 8 through a pipe or the like, and air containing oxygen used for the electrochemical reaction is supplied to the air electrode.

  FIG. 2 is a perspective view of the vaporizer 3, the reformer 5, and the carbon monoxide remover 6, and FIG. 3 shows the substrate 305 applied to the vaporizer 3, the reformer 5, and the carbon monoxide remover 6, respectively. , 505, and 605. FIG. 4 is a cross-sectional view of the substrates 305, 505, and 605 cut in the thickness direction along the line IV-IV in FIG.

  As shown in FIGS. 2 and 4, the vaporizer 3 includes a reactor main body 301 that is a container that forms an internal space, and a flow path structure 302 that is accommodated in the reactor main body 301.

  The reactor main body 301 has a rectangular parallelepiped or cubic box shape having an internal space, and is formed of a heat insulating material having a relatively low thermal conductivity such as glass, ceramic, or metal. The reactor main body 301 is provided with an inflow pipe 303 and an outflow pipe 304 that lead from the internal space to the outside of the reactor main body 301. The inflow pipe 303 is provided at a position facing the outflow pipe 304 in the reactor main body 301. In this embodiment, the inflow pipe 303 is provided on the upper wall of the reactor main body 301, and the outflow pipe 304 is provided in the reactor. It is provided on the lower wall of the main body 301. The inflow pipe 303 communicates with the fuel pump 4, and the outflow pipe 304 communicates with an inflow pipe 503 of the reformer 5 described later.

  The channel structure 302 has a substrate 305 as a basic configuration. The substrate 305 is preferably made of an insulator such as glass or ceramic, or a metal such as aluminum, cerium, titanium, or silicon that can be made porous by anodization. The thickness of the substrate 305 is shorter than the length and width in the surface direction of the substrate 305. In the substrate 305, a large number of through holes 306, 306,... That are flow paths that penetrate from one surface of the substrate 305 to the other surface facing the surface are parallel to each other along the thickness direction of the substrate 305. And it is formed in the shape which went straight so that it may not be bent in the middle. Therefore, when a fluid enters the through-hole 306, the fluid can quickly pass through each through-hole 306 with little loss of flow velocity due to friction with the side wall 315 exposed by the through-hole 306. .

FIG. 5 is a plan view of the substrate 305 as viewed from one side.
As shown in FIG. 5, each through hole 306 has a hexagonal cross section, and these through holes 306, 306,... Are arranged in a honeycomb shape. Therefore, the substrate 305 increases the number of through holes 306 while maintaining sufficient strength against the force applied in the thickness direction and the force applied in the direction perpendicular to the thickness direction, that is, the area of the side wall 315 is reduced. It becomes possible to take large. Each through-hole 306 need not be formed in a hexagonal shape if the strength and the area of the side wall 315 can be ensured, but formed in a geometrical shape such as a triangle, a quadrangle, a polygon more than that, a circular shape, an elliptical shape, or the like. May be. When the substrate 305 is viewed in plan, the through holes 306, 306,... Do not have to be arranged in a honeycomb shape, and may be arranged in a two-dimensional array (for example, a matrix). The substrate 305 is preferably less reactive to a substance contained in the fluid flowing through the through-hole 306, has a high thermal conductivity, and a low thermal expansion coefficient.

  A flat plate portion 320 having no through holes 306, 306,... Is formed in the central portion on one surface of the substrate 305, and a heating wire 308 as a heating element is disposed on the flat plate portion 320. . That is, the flat plate portion 320 is a position (part) where the heating wire 308 is disposed. The heating wire 308 snakes in a zigzag shape so as to follow the outer shape of each through-hole 306 along the center of the substrate 305. An interval L1 (first interval) between the through holes 306 adjacent to each other via the flat plate portion 320 or the heating wire 308 is an interval L2 (second interval) between other through holes 306 not via the flat plate portion 320 or the heating wire 308. ) It is longer. The terminal portions 314 and 314 of the heating wire 308 are electrical contacts integrally formed with the heating wire 308, and are arranged outside the reactor main body 301 as shown in FIG.

As shown in FIG. 4, in this flow path structure 302, an insulating film 307 such as a silicon oxide film (SiO ₂ ) or a silicon nitride film (SiN) is formed between the through holes 306, 306,. Is formed. A heating wire 308 is formed on the insulating film 307 at the center of the substrate 305. The heating wire 308 is an electric resistance heating element or a semiconductor heating element made of a composite metal oxide such as Ta—Si—O or Ta—Si—O—N, or a single metal or alloy such as Au. In other words, heat is generated by electric energy when a current flows or a voltage is applied. By interposing the insulating film 307 between the heating wire 308 and the substrate 305, it is possible to prevent the current from flowing through the substrate 305 and the heating wire 308 from being sufficiently heated. The heating wire 308 is less likely to peel from the substrate 305 than when the film is directly formed on the substrate 305.
Note that the insulating film 307 is not necessarily coated if the substrate 305 itself is an insulator such as glass.

  A protective insulating film 309 such as a silicon oxide film or a silicon nitride film is formed on the heating wire 308. The protective insulating film 309 protects the heating wire 308 by covering the heating wire 308 excluding the terminal portions 314 and 314. The protective insulating film 309 is inert to the fluid passing through each through-hole 306, and does not itself alter the fluid, and does not deteriorate even in a high-temperature atmosphere.

  This substrate 305 is accommodated in the reactor main body 301. The substrate 305 is supported in a state separated from the upper wall of the reactor main body 301 by an upper support portion 312 made of a heat insulating member, and separated from the lower wall of the reactor main body 301 by a lower support portion 313 made of a heat insulating member. Supported by the state. The internal space of the reactor main body 301 is partitioned by the substrate 305 into a region 310 on the inflow pipe 303 side and a region 311 on the outflow pipe 304 side. One surface of the substrate 305 is opposed to the upper wall of the reactor main body 301, the other surface of the substrate 305 is opposed to the lower wall of the reactor main body 301, and the region 310 on the inflow pipe 303 side has through holes 306, 306,... Leads to a region 311 on the outflow pipe 304 side. Therefore, the through holes 306, 306,... Serve as a flow path from the region 310 on the inflow tube 303 side to the region 311 on the outflow tube 304 side.

  As shown in FIG. 2, a part of the substrate 305 extends to the outside of the reactor main body 301, and terminal portions 314 and 314 as electrical contacts integrally formed with the heating wire 308 are included in the reactor main body 301. The portion exposed from the substrate 305 is formed on the substrate 305. In the vaporizer 3, the voltage and current are applied to the heating wire 308 through the terminal portions 314 and 314 of the heating wire 308, so that the heating wire 308 generates heat to a predetermined temperature. In the portion where the substrate 305 passes through the reactor main body 301, the interface between the substrate 305 and the reactor main body 301 is completely sealed.

  As shown in FIGS. 2, 3, and 4, as with the vaporizer 3, the reformer 5 also includes a reactor main body 501 that forms an internal space, and a flow channel structure 502 that is accommodated in the reactor main body 501. And has. 2, 3, and 4, in the reformer 5, for example, the “insulating film 507” is substantially the same as the “insulating film 307”, so that any part of the vaporizer 3 is disposed. The corresponding parts are given the same reference numerals in the 500th order, and in the following description, explanation of each part of the reformer 5 corresponding to any part of the vaporizer 3 is omitted. Different parts of the vaporizer 5 and the vaporizer 3 will be described.

  In the reformer 5, the inflow pipe 503 communicates with the outflow pipe 304 of the vaporizer 3, and the outflow pipe 504 communicates with the inflow pipe 603 of the carbon monoxide remover 6.

In the reformer 5, a catalyst layer 516 as a reforming catalyst is formed on the entire surface layer of the substrate 505 except for a portion covered with the insulating film 507. In particular, a catalyst layer 516 is formed on a side wall 515 that partitions the periphery of the through holes 506, 506,. The catalyst layer 516 is formed by oxidizing the surface layer of the substrate 505 including the side wall 515 so that the surface layer is a porous metal oxide (when the substrate 505 is aluminum, the porous metal oxide is alumina (Al ₂ O ₃ )). When the substrate 505 is titanium, the porous metal oxide is titanium oxide. When the substrate 505 is cerium, the porous metal oxide is cerium oxide.) A catalyst component is supported on the surface layer of an oxide as a carrier. In the reformer 5, a Cu / ZnO-based catalyst is supported on the surface layer of the substrate 505 as a catalyst component. It is preferable that the substrate 505 is excellent in corrosion resistance with respect to a substance contained in the fluid flowing through the through-hole 506, easily supports a catalyst, has high thermal conductivity, and has a low coefficient of thermal expansion. The thickness of the substrate 505 is shorter than the length and width in the surface direction of the substrate 505. A plurality of through holes 506, 506,... Are formed in a straight shape so as to be parallel to each other along the thickness direction of the substrate 505 and not bent in the middle. Therefore, when a fluid enters the through-holes 506, the fluid can pass through each through-hole 506 promptly with almost no loss of flow velocity due to friction.

  As shown in FIGS. 2 and 4, the carbon monoxide remover 6 also has a reactor body 601 that forms an internal space, and a flow path structure 602 that is housed in the reactor body 601, as in the vaporizer 3. Is provided. 2 and 4, in the carbon monoxide remover 6, for example, “insulating film 607” corresponds to any part of the vaporizer 3 such that “insulating film 307” is substantially the same as “insulating film 307”. In the following, description of each part of the carbon monoxide remover 6 corresponding to any part of the vaporizer 3 is omitted. Differences between the carbon oxide remover 6 and the vaporizer 3 will be described.

  In the carbon monoxide remover 6, the reactor main body 601 is provided with an air pipe 617 in addition to the inflow pipe 603 and the outflow pipe 604. The air pipe 617 faces a region 610 on the inflow pipe 603 side in the internal space of the reactor main body 601. Further, the air pipe 617 communicates with the air pump 8. In addition, the inflow pipe 603 communicates with the outflow pipe 504 of the reformer 5, and the outflow pipe 604 communicates with the fuel electrode of the fuel cell 7.

  In the carbon monoxide remover 6, the oxidation of carbon monoxide is performed on the entire surface layer of the substrate 605 (including the surface layer in the through holes 606, 606,...) Except for the portion covered with the insulating film 607. A catalyst layer 616 is formed as a reaction catalyst. The catalyst layer 616 is obtained by oxidizing the surface layer of the substrate 605 to change the surface layer into a porous metal oxide, and supporting the catalyst component on the surface layer using the porous metal oxide of the surface layer as a carrier. In the carbon monoxide remover 6, a Pt-based catalyst is supported on the surface layer of the substrate 605 as a catalyst component. It is preferable that the substrate 605 has excellent corrosion resistance with respect to a substance contained in the fluid flowing through the through-hole 606, easily supports the catalyst layer 616, has high thermal conductivity, and has a low coefficient of thermal expansion. The thickness of the substrate 605 is shorter than the length and width in the surface direction of the substrate 605. A large number of through-holes 606, 606,... Are formed along the thickness direction of the substrate 605 so as to be parallel to each other and not to be bent halfway. Therefore, when a fluid enters the through-hole 606, the fluid can pass through each through-hole 606 promptly with almost no loss of flow velocity due to friction.

Then, the manufacturing method of the vaporizer 3, the reformer 5, and the carbon monoxide remover 6 is demonstrated.
First, flat substrates 305, 505, and 605 are prepared, and a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, and a sputtering method are provided on one surface of the substrates 305, 505, and 605 as needed. Insulating films 307, 507, and 607 are formed by vapor phase epitaxy. Then, the electrothermal films 308, 508, and 608 (including the terminal parts 314, 514, and 614 as electrical contacts) are formed by patterning at positions where the flat plate sections 320, 520, and 620 on one surface are formed, respectively, Protective insulating films 309, 509, and 609 are formed so as to cover 508 and 608, respectively.

  Next, a resist mask is formed by photolithography on the substrates 305, 505, and 605, and the substrates 305, 505, and 605 in a state where the resist mask is applied are etched. Thus, a large number of through holes 306, 506, 606 are formed in the substrates 305, 505, 605, respectively. In this case, the central portion of each of the substrates 305, 505, and 605 is equivalent to the interval L1 in FIG. 5, which is wider than the interval between adjacent through holes 305, 505, and 605 (interval L2 in FIG. 5). Etching is performed so as to form the flat plate portions 320, 520, and 620 with the width to be formed. In the case of isotropic etching, the etching holes gradually expand when eroding in the thickness direction of the substrates 305, 505, and 605, so that the shape of the through holes 305, 505, and 605 in the thickness direction is maintained. For this purpose, each of the substrates 305, 505, and 605 may have a very thin laminated structure, and the thin plates may be stacked after etching holes are formed in the thin plates.

After that, the substrates 505 and 605 are immersed in an electrolytic solution (for example, phosphoric acid (desirably 4% is preferable) and oxalic acid (preferably 5% is preferable)). Then, the surface layers of the substrates 505 and 605 are oxidized (anodic oxidation method). By anodizing the surface layer of the substrates 505 and 605, the surface layer of the substrates 505 and 605 is transformed into a porous metal oxide (support). Thus, the substrates 505 and 605 can have a function as a carrier.
When the substrates 505 and 605 are made of glass, they are immersed in a suspension containing an oxidizable metal and applied to the surface, and then the metal is oxidized to form a porous support film on the surface. May be.

  Next, the catalyst layers 516 and 616 are supported by immersing the substrates 505 and 605 in a solution or suspension containing the catalyst material and supporting the catalyst component on the porous metal oxide in the surface layer including the through holes 506 and 606. Form. Since the surface layers of the substrates 505 and 605 are transformed into a porous metal oxide, the adhesion strength of the catalyst component can be improved.

  Next, the substrates 305, 505, 605 are accommodated in the reactor main bodies 301, 501, 601, and the inner spaces of the reactor main bodies 301, 501, 601 are placed on the inflow pipes 303, 503, 603 side by the substrates 305, 505, 605. The areas 310, 510, and 610 are divided into areas 311, 511, and 611 on the outflow pipes 304, 504, and 604 side. Here, the through holes 306, 506, 606 allow the regions 310, 510, 610 on the inflow pipes 303, 503, 603 side to communicate with the regions 311, 511, 611 on the outflow pipes 304, 504, 604 side, and the substrates 305, A part of 505 and 605 and terminal portions 314, 514 and 614 of heating wires 308, 508 and 608 are extended from the reactor main bodies 301, 501 and 601 to the outside.

Then, the effect | action of the electric power generating apparatus 1 is demonstrated.
A voltage / current is appropriately applied between the terminal portions 314, 514, and 614, and heat generated by the heating wires 308, 508, and 608 is transmitted to the substrates 305, 505, and 605, and the side walls 315 and the catalyst layers 516 and 616 are transmitted. Is maintained at a predetermined temperature.

  When the fuel pump 4 is activated, fuel containing water is supplied from the fuel container 2 into the reactor main body 301 of the vaporizer 3, and when the air pump 8 is activated, air is externally supplied from the air pipe 617 of the carbon monoxide remover 6. To the region 610 in the reactor main body 601.

  In the vaporizer 3, the substrate 305 is heated to 120 ° C. to 130 ° C. by the heating wire 308, and the fuel passes through the through holes 306, 306,... From the region 310 in the reactor main body 301 toward the region 311. In the meantime, the fuel is heated and vaporized. Here, since a large number of through holes 306, 306,... Are formed in the substrate 305, the surface area of the substrate 305 is large, and the contact area between the fuel and the substrate 305 is large.

The vaporized fuel (mixture of methanol and water) is supplied into the reactor main body 501 of the reformer 5 through the outflow pipe 304 and the inflow pipe 503 connected to each other. In the reformer 5, the fuel flows through the through holes 506, 506,... From the region 510 in the reactor main body 501 toward the region 511. In the reactor main body 501, the substrate 505 is heated to 250 ° C. to 300 ° C. by the heating wire 508, and in this state, the vaporized fuel contacts the catalyst layer 516 to generate hydrogen and carbon dioxide from the fuel. The Specifically, as shown in the chemical reaction formula (1), methanol and water vapor react to generate carbon dioxide and hydrogen.
CH ₃ OH + H ₂ O → 3H ₂ + CO ₂ (1)

In the reactor main body 501, methanol and water vapor may not be completely reformed to carbon dioxide and hydrogen. In this case, as shown in chemical reaction formula (2), methanol and water vapor react with each other to produce carbon dioxide and water vapor. Carbon monoxide is produced.
2CH ₃ OH + H ₂ O → 5H ₂ + CO + CO ₂ (2)

An air-fuel mixture such as carbon monoxide, carbon dioxide and hydrogen generated in the reformer 5 is supplied into the reactor main body 601 of the carbon monoxide remover 6 through an outflow pipe 504 and an inflow pipe 603 connected to each other. The In addition, external air is supplied into the reactor main body 601 through the air pipe 617. Then, the air-fuel mixture supplied to the region 610 in the reactor main body 601 flows from the region 610 in the reactor main body 601 toward the region 611 through the through holes 606, 606,. In the reactor main body 601, the substrate 605 is heated to 170 ° C. to 190 ° C. by the heating wire 608, and in this state, carbon monoxide contained in the air-fuel mixture supplied from the reformer 5 is selectively oxidized, Carbon monoxide is removed from the gas mixture. Specifically, as shown in the chemical reaction formula (3), carbon monoxide specifically selected from the gas mixture supplied from the reformer 5 reacts with oxygen in the air to generate carbon dioxide. Is generated.
2CO + O ₂ → 2CO ₂ (3)

Then, the air-fuel mixture from which carbon monoxide is removed and containing high-concentration hydrogen is supplied from the reactor body 601 through the outflow pipe 604 to the fuel electrode of the fuel cell 7. In the fuel electrode of the fuel cell 7, as shown in the electrochemical reaction formula (4), hydrogen gas in the supplied air-fuel mixture is separated into hydrogen ions and electrons under the action of catalyst fine particles of the fuel electrode. Hydrogen ions are conducted to the air electrode through the solid polymer electrolyte membrane, and electrons are taken out by the fuel electrode.
H ₂ → 2H ⁺ + 2e ⁻ (4)
Of the air-fuel mixture supplied to the fuel electrode of the fuel cell 7, products (such as carbon dioxide) that do not contribute to the electrochemical reaction are discharged to the outside.

Air was supplied to the air electrode of the fuel cell 7, and as shown in the electrochemical reaction formula (5), oxygen in the air, hydrogen ions that passed through the solid polymer electrolyte membrane, and the fuel electrode were taken out. Reaction with electrons produces water as a product.
2H ⁺ + 1 / 2O ₂ + 2e ⁻ → H ₂ O (5)
Of the air supplied to the air electrode of the fuel cell 7, the gas (such as nitrogen) that does not contribute to the electrochemical reaction and the generated water are discharged to the outside.

  As described above, in the power generation device 1, electric energy is generated by the electrochemical reactions shown in the above (4) and (5) in the fuel cell 7. The generated electrical energy is used for the operation of the electronic device main body, the fuel pump 4, the heating wires 308, 508, 608 and the like.

  In the above power generator 1, since the heating wires 308, 508, and 608 are arranged on the substrates 305, 505, and 605 of the vaporizer 3, the reformer 5, and the carbon monoxide remover 6, respectively, Heat can be efficiently supplied into the reactors of the reformer 5 and the carbon monoxide remover 6. And on each board | substrate 305,505,605 of the vaporizer | carburetor 3, the reformer 5, and the carbon monoxide remover 6, the width | variety (space | interval L1 in FIG. 5, ie, flat plate part) of each flat plate part 320,520,620. 320, 520, 620 is the shortest distance between adjacent through-holes in the same row direction, and the interval between adjacent through-holes 306, 506, 606 (interval L2 in FIG. 5, that is, flat plate portion 320). , 520, 620, which is longer than the shortest distance between adjacent through-holes in the same row direction, so that the heating wires 308, 508, 608 are disposed on the substrates 305, 505, 605. Is sufficiently secured. Therefore, the heating wires 308, 508, and 608 can be easily formed on the substrates 305, 505, and 605 without being limited by the film forming position and the film forming width with respect to the film formation of the heating wires 308, 508, and 608. As a result, the heating wires 308, 508, and 608 that are resistant to disconnection and have an optimal electrical resistance can be formed.

  The present invention is not limited to the above embodiment as long as the widths of the flat plate portions 320, 520, and 620 are longer than the intervals between the adjacent through holes 306, 506, and 606, respectively. Various improvements and design changes may be made without departing from the spirit of the invention.

  For example, as shown in FIGS. 6 and 7, the second flat plate portions 321, 521, 621 similar to the flat plate portions 320, 520, 620 are provided on the respective substrates 305, 505, 605, and the flat plate portions 320, 520, 620. 6, second heating wires 330, 530, and 630 similar to the heating wires 308, 508, and 608 may be provided on the left and right sides in FIG. 6. Further, as shown in FIG. 8, second flat plate portions 321, 521, 621 similar to the flat plate portions 320, 520, 620 are provided on the left and right sides of the flat plate portions 320, 520, 620 on the respective substrates 305, 505, 605. The heating wires 325, 525, and 625 of the flat plate portions 320, 520, and 620 may be connected in series with the heating wires 326, 526, and 626 of the flat plate portions 321, 521, and 621, respectively.

  In this case, as shown in FIG. 6, the terminal portions 314, 514, 614 of the heating wires 308, 508, 608 and the terminal portions 322, 522, 622 of the second heating wires 330, 530, 630 are electrically independent. As shown in FIG. 7, the heating wires 308, 508, and 608 and the second heating wires 330, 530, and 630 are electrically connected to each other, and the heating wires 308, 508, and 608 are connected to the first heating wires 308, 508, and 608, respectively. The terminal portions 323, 523, and 623 common to the two heating wires 330, 530, and 630 are provided, and the heating wires 308, 508, and 608 and the second heating wires 330, 530, and 630 are electrically connected in parallel. As shown in FIG. 8, terminal portions 324, 524, and 624 are provided at both ends of the heating wires 325, 525, and 625, and a series structure in which the flat plate portion 320 continues to the flat plate portion 321, and the flat plate portion 520 to the flat plate. Continuous series structure 521 may be continuous series structure 621 parts flat from the flat plate portion 620.

  In the case shown in FIG. 6, by changing the amount of voltage applied to each heating wire 308, 508, 608, 330, 530, 630, each heating wire 308, 508, 608, 330, 530, and 630 can generate heat specifically, for example, the second is less likely to store heat than the center (flat plate portions 320, 520, and 620) side because heat is diffused to a lower temperature outside. A voltage higher than that of the heating wires 308, 508, and 608 is applied to the second heating wires 330, 530, and 630 of the flat plate portions 321, 521, and 621 to compensate for heat loss due to heat transfer, so that the substrates 305, 505, and 605 are used. Therefore, the temperature distribution in each vaporizer 3, the reformer 5, and the carbon monoxide remover 6 can be made more uniform, and the reaction can be made uniform.

On the other hand, in the case shown in FIG. 7, the current values (resistance values) flowing in the heating wires 308, 508, and 608 and the second heating wires 330, 530, and 630 may be different from each other. Each heating wire 308, 508, 608, 330, 530, 630 can be specifically heated in an amount corresponding to the value. For example, in order to diffuse the heat to the outside at a lower temperature, the center (flat plate portion 320, 520, 620) on the second heating wire 330, 530, 630 by increasing the wiring width of the second heating wire 330, 530, 630 of the second flat plate portion 321, 521, 621, which is less likely to store heat than the side of the second heating wire 330, 530, 630. Increase the current value. The calorific value Q in the heating wire per unit time is as shown in the following formula (6).
Q = RI ² (6)
Here, R is a resistance value, and I is a current value. Therefore, in the second heating wires 330, 530, and 630, the wiring width is increased and the resistance value is lowered, but the relationship between the resistance value and the current value is as shown in Expression (7).
V = IR (7)
In the parallel case, since the voltages V are both equal, the current value increases in inverse proportion to the decrease in the resistance value. Therefore, the calorific value Q increases as the current value increases. The heat generation amount of the heat wires 330, 530, and 630 is larger than the heat generation amount of the heating wires 308, 508, and 608. The increased heat generation amount compensates for the heat loss of the second heating wires 330, 530, and 630 to reduce the temperature difference in each surface direction of the substrates 305, 505, and 605, thereby reducing the vaporizer 3, the reformer 5, and the monoxide. The temperature distribution in the carbon remover 6 can be made more uniform, and the reaction can be made uniform.

  In the case shown in FIG. 8, the width of the heating wires 326, 526, 626 of the second flat plate portions 321, 521, 621 is made narrower than the width of the heating wires 325, 525, 625 of the flat plate portions 320, 520, 620. The resistance value may be increased. In such a series structure, the current values of the heating wires 325, 525, 625 of the flat plate portions 320, 520, 620 are equal to the current values of the heating wires 326, 526, 626 of the second flat plate portions 321, 521, 621. Therefore, the heating value of the heating wires 326, 526, 626 of the second flat plate portions 321, 521, 621 is larger than the heating value of the heating wires 325, 525, 625 of the flat plate portions 320, 520, 620 from the equation (6). Thus, the heat loss in the second flat plate portions 321, 521, 621 is compensated to reduce the temperature difference in each surface direction of the substrates 305, 505, 605, and the vaporizer 3, the reformer 5 and the carbon monoxide are removed. The temperature distribution in the vessel 6 can be made more uniform, and the reaction can be made uniform.

  6 and 7, the flat plate portions 320, 520, 620 and the second flat plate portions 321, 521, 621, the heating wires 308, 508, 608 and the second heating wires 330, 530, 630, Although the example which has been arranged in three places in a state of being substantially parallel to each other has been shown, the number of flat plate portions and the number of heating wires installed may be arbitrarily changed as long as it is plural, and the arrangement position thereof may also be arbitrarily changed. It's okay. In FIG. 8, the flat plate portions 320, 520, 620 and the second flat plate portions 321, 521, 621, the heating wires 325, 525, 625, and the second heating wires 326, 526, 626 are substantially parallel to each other. However, the number of flat plate portions and the number of heating wires may be arbitrarily changed as long as they are plural, and the arrangement positions thereof may be arbitrarily changed.

  In each of the above embodiments, the heating wire is provided only on one surface of the substrates 305, 505, and 605. However, the flat plate portions 320, 520, and 620 and the second surface are also provided on the opposite surface that faces the one surface. The flat plate portions 321, 521, 621 may be formed, and heating wires may be provided on these portions in the same manner as one surface to heat from both surfaces of the substrates 305, 505, 605.

1 is a block diagram showing a schematic configuration of a power generation device 1. FIG. 2 is a perspective view of a vaporizer 3, a reformer 5, and a carbon monoxide remover 6. FIG. It is a perspective view of the board | substrate used as the vaporizer | carburetor 3, the reformer 5, and the carbon monoxide remover 6. FIG. It is sectional drawing which follows the IV-IV line of FIG. 3 is a plan view of a substrate 305. FIG. It is a top view which shows the modification of the board | substrate 305 of FIG. It is a top view which shows the modification of the board | substrate 305 of FIG. It is a top view which shows the modification of the board | substrate 305 of FIG.

Explanation of symbols

3 Vaporizer (reactor)
5 Reformer (Reactor)
6 Carbon monoxide remover (reactor)
305, 505, 605 Substrate 306, 506, 606 Through hole 308, 508, 608 Heating element 330, 530, 630 Second heating element (heating element)

Claims (6)

A substrate having a plurality of through holes penetrating from one surface to the other surface facing the surface;
A flat plate portion provided at a first interval between the through holes adjacent to each other on the one surface;
An insulating film on the one surface;
A heating element provided at a position of the flat plate portion on the insulating film;
A protective insulating film covering the heating element;
With
The reactor, wherein the first interval is longer than a second interval between the other adjacent through holes on the one surface. The reactor according to claim 1,
A plurality of the flat plate portions are arranged on the substrate,
Each of the plurality of flat plate portions is provided with the heating element,
A reactor characterized in that the heating elements are arranged independently of each other. The reactor according to claim 1,
A plurality of the flat plate portions are arranged on the substrate,
Each of the plurality of flat plate portions is provided with the heating element,
Each of the heating elements has a different resistance value. Reactor according to any one of claims 1 to 3,
A reactor characterized by being a vaporizer. Reactor according to any one of claims 1 to 3,
A reactor characterized by being a reformer. Reactor according to any one of claims 1 to 3,
A reactor characterized by being a carbon monoxide remover.

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