JP4416105B2 - Pattern forming device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for forming a pattern on a substrate.
[0002]
[Prior art]
Conventionally, a sandblast method (also called a photolithography method), a screen printing method, a lift-off method, or the like is known as a method for forming a partition pattern on a panel used in a plasma display device, an organic EL display device, or the like. However, these methods are complicated and increase the production cost. Therefore, in recent years, as disclosed in Patent Document 1, a method for forming a pattern on a substrate by discharging a paste-form pattern forming material from a nozzle having a fine discharge port has been proposed.
[0003]
[Patent Document 1]
JP 2002-184303 A
[0004]
[Problems to be solved by the invention]
By the way, when the pattern forming material is discharged to form a pattern having a cross-sectional shape close to the shape of the discharge port, the discharged pattern forming material may adhere to the vicinity of the discharge port of the nozzle. In this case, when the adhesion proceeds to a certain extent (for example, when the adhesion is performed with a width of several hundreds μm to several mm centering on the ejection port), the ejected pattern formation material is affected by the pattern formation material adhered to the ejection port. Thereafter, the ejection becomes unstable, and there is a possibility that a pattern having an uneven cross-sectional shape is formed. In particular, when the discharge of the pattern forming material cannot be stopped quickly when the discharge is stopped, there is a high possibility that the pattern forming material adheres to the vicinity of the discharge port of the nozzle.
[0005]
On the other hand, depending on the characteristics of the material, the relative movement speed between the nozzle and the substrate at the start of discharge is large, so the pattern forming material does not sufficiently adhere to the substrate at the start and stop of discharge, and the pattern shape is disturbed. There is. When the pattern forming material after ejection is cured by irradiating light, when the nozzle is heated, the characteristics (particularly viscosity) of the pattern forming material to be ejected greatly fluctuate, and a predetermined pattern cannot be formed.
[0006]
The present invention has been made in view of the various problems described above, and an object thereof is to more reliably form a pattern having a predetermined cross-sectional shape on a substrate.
[0007]
[Means for Solving the Problems]
  The invention according to claim 1 is a pattern forming apparatus for forming a pattern on a substrate, the discharge unit having an array of a plurality of discharge ports for discharging a pattern forming material toward the substrate, and a main surface of the substrate. And a moving mechanism that relatively moves the discharge unit in a direction substantially perpendicular to the array of the plurality of discharge ports along the direction from the plurality of discharge ports toward the substrate and after the relative movement of the discharge unit. An inclined surface in which the pattern forming material is discharged in a discharge direction toward the side, and the discharge portion extends from the upper side of the plurality of discharge ports in a direction away from the substrate rather than a surface perpendicular to the discharge direction.And a groove provided between the plurality of discharge ports;Have
[0009]
  Claim2The invention described in claim1The width | variety between each of these discharge ports and a groove | channel is 100 micrometers or less.
[0010]
  Claim3The invention described in claim 1Or 2The distance between the upper ends of the plurality of discharge ports and the edges of the inclined surfaces on the plurality of discharge ports is 100 μm or less.
[0011]
  Claim4The invention described in claim 1 to claim 13In the pattern forming apparatus according to any one of the above, the inclined surface is inclined from the upper side of the plurality of ejection ports toward the front side of the relative movement of the ejection unit from the direction perpendicular to the substrate.
[0012]
  Invention of Claim 5 is a pattern formation apparatus in any one of Claim 1 thru | or 4, It is further provided with the light irradiation part which hardens the pattern formation material immediately after discharge by irradiating light, A part of the light from the light irradiator is irradiated onto the inclined surface.
Invention of Claim 6 is a pattern formation apparatus in any one of Claim 1 thru | or 4, It is further provided with the light irradiation part which hardens the pattern formation material immediately after discharge by irradiating light, The periphery of the plurality of discharge ports is formed of metal.
  Claim7The invention described in claim 1 to claim 16The pattern forming apparatus according to any one of the above, wherein the periphery of the plurality of discharge ports is mirror-finished.
  Claim8The invention described in claim7An average roughness around the plurality of ejection openings is 0.2 μm or less.
[0013]
  Claim9The invention described inThe method according to any one of claims 1 to 8.A pattern forming device,in frontThe periphery of the plurality of discharge ports is coated with a material that is relatively less adherent to the pattern forming material than the member forming the plurality of discharge ports.
[0017]
  Claim10The invention described in claim 1 to claim 19The pattern forming apparatus according to any one of the above, wherein the discharge unit is formed of metal.
[0022]
  Claim11The invention described in claim 1 to claim 110A partition for a flat display device is formed by the pattern forming material.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing a schematic configuration of a pattern forming apparatus 1 according to an embodiment of the present invention. The pattern forming apparatus 1 is an apparatus for forming a plurality of partition wall patterns on a glass substrate (hereinafter referred to as “substrate”) 9 for a plasma display device, and the substrate 9 on which the partition walls are formed is subjected to other processes. Thus, a panel (usually a rear panel) is an assembly part of the plasma display device.
[0024]
In the pattern forming apparatus 1, the stage moving mechanism 2 is provided on the base 11, and the stage 3 that holds the substrate 9 by the stage moving mechanism 2 is the X direction shown in FIG. 1 (that is, the direction along the main surface of the substrate 9). ) Can be moved. A frame 12 is fixed to the base 11 so as to straddle the stage 3, and the head unit 5 is attached to the frame 12.
[0025]
The stage moving mechanism 2 has a structure in which a ball screw 22 is connected to a motor 21 and a nut 23 fixed to the stage 3 is attached to the ball screw 22. A guide rail 24 is fixed above the ball screw 22, and when the motor 21 rotates, the stage 3 together with the nut 23 moves smoothly in the X direction along the guide rail 24.
[0026]
The head unit 5 includes a discharge unit 52 that discharges a paste-form pattern forming material toward the substrate 9, and a light irradiation unit 53 that irradiates ultraviolet rays toward the substrate 9, and the discharge unit 52 and the light irradiation unit 53. Is attached to the lower part of the base 51 fixed to the frame 12. The discharge part 52 has a nozzle 54 in which a plurality of discharge ports arranged in the Y direction are formed. The light irradiation unit 53 emits ultraviolet rays toward the substrate 9 on the (−X) side of the discharge unit 52, and forms ultraviolet spots corresponding to the respective discharge ports on the substrate 9. The pattern forming material includes a low softening point glass frit, an ultraviolet curable resin, and other solvents and additives.
[0027]
A supply pipe 521 for supplying a pattern forming material is attached to the discharge section 52, and the supply pipe 521 is connected to the material supply section 55. The light irradiation unit 53 is connected to a light source unit 532 that generates ultraviolet rays via an optical fiber 531. The motor 21, the material supply unit 55, and the light source unit 532 of the stage moving mechanism 2 are connected to the control unit 6.
[0028]
When a pattern is formed on the substrate 9 by the pattern forming apparatus 1, the stage moving mechanism 2 controls the stage 3 in the direction indicated by the arrow 31 in FIG. The pattern forming material is discharged from the plurality of discharge ports of the nozzle 54 while moving in the direction perpendicular to the direction. At this time, the pattern forming material immediately after ejection is irradiated from the light irradiation unit 53 with ultraviolet rays, and the pattern forming material is sequentially cured. As a result, a plurality of linear barrier rib patterns are sequentially formed on the substrate 9 from the (−X) side end toward the (+ X) side end. The relative movement direction of the discharge unit 52 may be slightly inclined with respect to the arrangement direction of the plurality of discharge ports.
[0029]
FIG. 2 is a side view of the nozzle 54, and shows that the head portion 5 moves relative to the substrate 9 in the (+ X) direction, and the pattern 91 of the pattern forming material is sequentially formed on the substrate 9. ing. As shown in FIG. 2, a discharge port 541 is provided at the tip of the nozzle 54, and as indicated by a reference numeral 542, the discharge port 52 extends toward the substrate 9 side (that is, the (−Z) side). The pattern forming material is discharged from the discharge port 541 in the direction (hereinafter referred to as “discharge direction 542”) toward the rear side of the relative movement (that is, the (−X) side).
[0030]
FIG. 3 is a view showing a state in which the tip of the nozzle 54 is viewed from the substrate 9 side in the direction opposite to the discharge direction 542, and FIG. 4 discharges the nozzle 54 at the position AA shown in FIG. 5 is a cross-sectional view taken along a plane parallel to a direction 542. FIG. As shown in FIGS. 3 and 4, a plurality of discharge ports 541 are arranged in the Y direction, and the shape and area of the discharge ports 541 are determined in accordance with the shape of the partition wall formed on the substrate 9.
[0031]
2 to 4, an example of the nozzle 54 when the discharge port 541 is rectangular, the width W1 of the discharge port 541 is 100 μm, the height H1 is 400 μm, and the distance D1 between the discharge ports 541 is 300 μm. Is shown.
[0032]
As shown in FIGS. 2 and 3, a surface perpendicular to the ejection direction 542 (hereinafter referred to as “ejection surface”) 543 and a surface 544 parallel to the main surface of the substrate 9 are formed at the tip of the nozzle 54. In other words, the surface 544 and the main surface of the substrate 9 are close to or in contact with each other. The discharge port 541 is formed across the boundary between the discharge surface 543 and the surface 544, and the pattern forming material is discharged in a state where the discharge port 541 is close to or in contact with the main surface of the substrate 9. The nozzle 54 has an inclined surface 545 that extends from the upper end of the ejection surface 543 (that is, the (+ Z) side edge) in a direction away from the substrate 9.
[0033]
The nozzle 54 is provided with an inclined surface 545 that extends in a direction away from the substrate 9 rather than a surface perpendicular to the discharge direction 542 (illustrated by reference numeral 543a in FIG. 2), and thus the discharged pattern forming material is provided on the inclined surface 545. Adhering (for example, spreading from the discharge surface 543 to the inclined surface 545) is prevented. Further, a distance D2 (see FIG. 2) between the upper end of the discharge port 541 (the (+ Z) side edge of the discharge port 541) and the edge of the inclined surface 545 on the discharge port 541 side is 100 μm or less (preferably 10 μm or less). ), The adhesion of the pattern forming material to the ejection surface 543 is further suppressed. This prevents the pattern forming material to be ejected from being pulled by the pattern forming material adhering to the tip of the nozzle 54, so that the cross-sectional shape of the pattern 91 is not broken or the pattern 91 is not uniform. Note that the edge on the discharge port 541 side of the inclined surface 545 may be chamfered and rounded.
[0034]
FIG. 5 shows the nozzle in the case where the inclined surface 545 is inclined to the front side of the relative movement of the nozzle 54 from the direction perpendicular to the main surface of the substrate 9 (that is, the nozzle 54 is directed to the front side in the relative movement direction as the distance from the substrate 9 increases). It is a side view which shows the example of 54. In the nozzle 54 shown in FIG. 5, when attention is paid to the X direction, the inclined surface 545 is positioned on the (+ X) side as the upper part is reached, and the discharged pattern forming material moves to the (−X) side. The pattern forming material discharged from the discharge port 541 is further prevented from adhering to the inclined surface 545.
[0035]
6 and 7 are views showing other examples of the tip of the nozzle 54, and correspond to FIG. 3 and FIG. 4, respectively. In the nozzle 54 shown in FIGS. 6 and 7, a groove 546 is provided on the discharge surface 543 between the discharge ports 541, and is formed approximately parallel to the discharge port 541 at a certain width D3 away from the discharge port 541. . In the nozzle 54 shown in FIGS. 6 and 7, the area of the discharge surface 543 around the discharge port 541 is reduced compared to the case where the groove 546 is not provided, and the periphery of the discharge port 541 is in the direction opposite to the discharge direction. Since it is deep, adhesion of the pattern forming material to the ejection surface 543 can be suppressed. Further, the width D3 between each of the plurality of ejection ports 541 and the groove 546 is set to 100 μm or less (preferably 10 μm or less), and thereby the adhesion of the pattern forming material to the ejection surface 543 is further suppressed. In this example, the cross-sectional shape of the groove 546 is triangular as shown in FIG. 7, but the cross-sectional shape of the groove 546 may be semicircular, quadrangular, or other shapes.
[0036]
As described above, in the pattern forming apparatus 1, by devising the shape of the nozzle 54, the discharged pattern forming material is suppressed from adhering to the vicinity of the discharge port 541, and the pattern is more reliably formed in a predetermined cross-sectional shape. The forming material can be discharged onto the substrate 9.
[0037]
FIG. 8 is a diagram showing the nozzle 54 and the light irradiation unit 53. As shown in FIG. 8, in the pattern forming apparatus 1, the light irradiation unit 53 is attached so that a part of ultraviolet rays from the light irradiation unit 53 is irradiated onto the inclined surface 545. Therefore, the discharged pattern forming material is quickly irradiated with ultraviolet rays and cured. This prevents the pattern 91 formed on the substrate 9 from collapsing (sagging) and spreading.
[0038]
Further, as described above, in the pattern forming apparatus 1, the pattern forming material is prevented from adhering to the inclined surface 545 of the nozzle 54. Therefore, even if the inclined surface 545 is irradiated with ultraviolet rays, pattern formation is performed on the inclined surface 545. The material does not adhere and harden.
[0039]
The pattern forming apparatus 1 is further devised in order to make the pattern 91 formed by the pattern forming material discharged from the nozzle 54 more appropriate. Specifically, the nozzle 54 is made of metal, and at least the periphery of the discharge port 541 (that is, the discharge surface 543 (and the surface of the nozzle 54 around the discharge surface 543)) is mirror-finished. Specifically, the nozzle 54 is made of stainless steel, and the average roughness (Ra) around the discharge port 541 is 0.2 μm or less (preferably 0.1 μm or less). Further, chrome plating is applied to the periphery of the discharge port 541 of the nozzle 54 (the portion indicated by the parallel oblique lines indicated by reference numeral 547 in FIG. 8).
[0040]
By reducing the surface roughness of the nozzle 54, the adhesion with the pattern forming material can be suppressed lower than when the surface roughness is large, and the adhesion of the pattern forming material to the periphery of the discharge port 541 is further suppressed. can do. In addition, by finishing the tip of the nozzle 54 with a mirror finish, as shown in FIG. 8, a part of ultraviolet rays irradiated to the tip of the nozzle 54 or heat rays (visible light or infrared rays) emitted from the light irradiation unit 53. Is efficiently reflected, and the temperature rise at the tip of the nozzle 54 is suppressed. In particular, since chrome efficiently reflects ultraviolet rays and heat rays, the temperature rise at the tip of the nozzle 54 can be further suppressed by chrome plating. Furthermore, since the nozzle 54 is made of metal, the heat at the tip of the nozzle 54 can be quickly diffused to other parts. With the above-described operation, a change in the characteristics (particularly viscosity) of the pattern forming material due to a temperature change at the tip of the nozzle 54 is suppressed, and a uniform pattern can be formed.
[0041]
Even when the nozzle 54 is formed of ceramics, the tip of the nozzle 54 is mirror-finished or coated with metal (may be deposited by sputtering of metal such as gold). It is possible to obtain the effect of suppressing adhesion and temperature rise. Alternatively, the main body of the nozzle 54 may be formed of resin or ceramics, and only the periphery of the discharge port 541 (that is, the tip of the nozzle 54) may be formed of metal. Further, the nozzle 54 may be formed of a plurality of members and partially made of metal. For example, even if the upper part is divided into two parts on the discharge port 541 and only the upper part is made of metal, the effect is obtained because this is a part having a large temperature rise suppressing effect.
[0042]
The periphery of the discharge port 541 of the nozzle 54 may be coated with a fluororesin such as Teflon (registered trademark) having a thickness of several μm instead of (or in addition to) a metal coating such as chromium. Thereby, on the surface of the part 547 in FIG. 8, the adhesion with the pattern forming material is relatively lower than the uncoated surface (that is, the surface where the member forming the nozzle 54 itself is exposed). (That is, the pattern forming material is easily peeled off).
[0043]
By coating the periphery of the discharge port 541 with a material that is relatively less adherent to the pattern forming material than the member that forms the discharge port 541, adhesion of the pattern forming material is suppressed. Even when the ultraviolet rays from the nozzle 54 are irradiated to the tip of the nozzle 54, the pattern forming material is suppressed from adhering to the periphery of the discharge port 541.
[0044]
Note that the material to be coated is not limited to the fluororesin, but may be any material that has relatively lower adhesion (so-called wettability or surface activity) to the pattern forming material than the member that forms the discharge port 541. For example, a hydrophobic material may be used if the pattern forming material is hydrophilic, and a hydrophilic material may be used if the pattern forming material is hydrophobic. These coatings may also be partial.
[0045]
FIG. 9 is a diagram illustrating various configurations of the material supply unit 55 of the pattern forming apparatus 1. The material supply unit 55 controls the main tank 581 that stores the pattern forming material, the sub tank 551 that stores a part of the pattern forming material from the main tank 581 for discharging, and the discharge of the pattern forming material from the nozzle 54. And a negative pressure tank (vacuum accumulator) 572. In addition, the compressor 562 and the vacuum pump 575 shown in FIG. 9 may be provided in the material supply part 55, and may be provided in the factory where the pattern formation apparatus 1 is installed.
[0046]
A supply pipe 521 for supplying a pattern forming material to the discharge unit 52 is connected to a sub tank 551. The sub tank 551 is connected to a main tank 581 by a pipe 553 having a valve 557, and further includes an air flow path for controlling discharge. A pipe 552 is connected. A pipe having a valve 556 for opening to the atmosphere is connected to the pipe 552, branching into two on the way, one connected to the valve 554, and the other connected to the valve 555. The valve 554 is connected to a compressed air pipe 56 that leads to a compressor 562 via a regulator 561, and the valve 555 is used for a vacuum that leads to a vacuum pump 575 via a regulator 571, a negative pressure tank 572, a valve 573 and a regulator 574. Connected to the pipe 57. The main tank 581 is connected to the compressor 562 by a pipe 58 via a valve 582 and a regulator 583.
[0047]
The compressor 562, the vacuum pump 575, the valve 554 and the valve 555 are connected to the control unit 6, and these are controlled by the control unit 6 to start and stop discharging the pattern forming material from the discharge unit 52. The valve 554 and the valve 555 have a mechanism for switching between the connection of the compressed air pipe 56 and the connection of the vacuum pipe 57 to the sub tank 551. The valves 556, 573, 557, and 582 may be manually operated or controlled by the control unit 6.
[0048]
The air release valve 556 is opened during maintenance and inspection of the pattern forming apparatus 1 and when the pattern forming material is replenished from the main tank 581 to the sub tank 551. At the time of material replenishment, first, the valve 556 is opened to open the sub tank 551, then the valve 582 is opened, compressed air is sent from the compressor 562 to the main tank 581, and the valve 557 between the main tank 581 and the sub tank 551 is further opened. The pattern forming material is sent from the main tank 581 to the sub tank 551.
[0049]
FIG. 10 is a diagram showing the flow of operation of the pattern forming apparatus 1 at the start of the discharge of the pattern forming material, and FIG. 11 shows the change in the relative movement speed of the discharge unit 52 relative to the substrate 9 at the start of the discharge of the pattern forming material. FIG. All valves are closed before the start of discharge.
[0050]
First, the control unit 6 controls the motor 21 so that the substrate 9 held on the stage 3 starts to move (accelerate) with respect to the nozzle 54 (step S11, time t11 in FIG. 11). When the moving speed of the substrate 9 reaches a predetermined speed V1, the acceleration of the substrate 9 is stopped (step S12, time t12), and the process moves to a constant speed movement. However, the speed V1 is lower than the speed V2, which is a steady speed at the time of pattern formation.
[0051]
Subsequently, when the control unit 6 opens the valve 554 for compressed air, the sub tank 551 and the compressor 562 are connected via the pipe 552 and the pipe 56, and the compressed air is sent into the sub tank 551. The internal pressure is increased in the sub tank 551, and the pattern forming material stored in the sub tank 551 is sent out to the discharge unit 52 through the supply pipe 521. Thereby, the discharge of the pattern forming material from the discharge port 541 onto the substrate 9 is started (step S13, time t13). At this time, the discharge speed is adjusted by the pressure of the compressed air from the compressor 562 and the regulator 561.
[0052]
Thereafter, the movement of the substrate 9 is further accelerated (step S14, time t14), and the acceleration of the substrate 9 is stopped when the moving speed reaches the speed V2 (step S15, time t15).
[0053]
As described above, in the pattern forming apparatus 1, the discharge of the pattern forming material is started at the speed V1 which is equal to or lower than the steady speed V2 at the time of pattern formation. As a result, the pattern forming material is discharged excessively relative to the moving speed at the start of discharging, and the pattern forming material is pressed against the substrate 9. As a result, the pattern forming material is surely seated (that is, in close contact) with the substrate 9, and the pattern formed at the speed V2 after acceleration can be easily and sequentially contacted. Appropriately achieved.
[0054]
Note that the velocity V1 at the start of discharging the pattern forming material may be zero. In this case, the discharge is started immediately before the discharge unit 52 starts to move relative to the substrate 9, and it is not necessary to perform acceleration in two stages as shown in FIG. Further, the acceleration toward the speed V2 may be performed without stopping in the middle, and the discharge of the pattern forming material may be started during the acceleration. That is, under the control of the control unit 6, the discharge is started before the relative movement speed of the discharge unit 52 with respect to the substrate 9 reaches the speed V2 at the time of pattern formation, so that the pattern can be formed while the shape is stabilized. Realized.
[0055]
FIG. 12 is a diagram showing a flow of operation of the pattern forming apparatus 1 when the discharge of the pattern forming material is stopped, and FIG. 13 shows a change in the relative movement speed of the discharge unit 52 with respect to the substrate 9 when the discharge of the pattern forming material is stopped. FIG. G1 shown in FIG. 12 indicates that it is a continuation of the operation flow of FIG. Note that only the compressed air valve 554 is open before the discharge is stopped.
[0056]
First, the control unit 6 controls the motor 21 to start decelerating the substrate 9 moving at the speed V2 (step S21, time t21 in FIG. 13), and the moving speed of the substrate 9 is determined in advance. When the speed V3 is reached, the deceleration of the substrate 9 is stopped (step S22, time t22).
[0057]
Subsequently, the control unit 6 controls the material supply unit 55 to stop the discharge of the pattern forming material (step S23, time t23). FIG. 14 is a diagram showing a flow of operation of the material supply unit 55 in step S23. First, the control unit 6 closes the compressed air valve 554 to cut off the connection between the sub tank 551 and the pipe 56 (or the compressor 562) (step S231).
[0058]
Immediately after this, the controller 6 temporarily opens the vacuum valve 555 and connects the sub tank 551 and the negative pressure tank 572 via the pipe 552 and the pipe 57 for a short time (step S232). As a result, the compressed air remaining in the sub tank 551 quickly moves to the negative pressure tank 572, the internal pressure of the sub tank 551 becomes lower than the atmospheric pressure, and the pattern forming material in the nozzle 54 is slightly pulled back ( So-called suckback operation).
[0059]
Usually, the viscosity of the pattern forming material is about tens of thousands to hundreds of thousands of mPa · s, the resistance in the pipe is large, and the compressed air remains in the sub tank 551. Therefore, it is possible to discharge simply by closing the compression valve 554. In addition, if only the sub tank 551 is evacuated, a large amount of air is discharged at one time, the vacuum pressure is canceled out, and it becomes difficult to obtain a large suction force. Therefore, in the pattern forming apparatus 1, by providing the negative pressure tank 572 as a vacuum accumulator on the vacuum pipe 57, it is possible to quickly bring the sub tank 551 to a negative pressure and stop the discharge of the pattern forming material. . Until the ejection is completely stopped, the pattern forming material that is slightly ejected is wiped in close contact with the substrate 9 at a speed V3 lower than the speed V2.
[0060]
In order to prevent the compressor 562 and the negative pressure tank 572 from being directly connected, an interval of several milliseconds is provided between step S231 and step S232. Further, instead of the valve 554 and the valve 555, other mechanisms may be employed as long as the mechanism can switch between the connection of the compressed air pipe 56 and the vacuum pipe 57 to the sub tank 551. For example, a slide valve, a three-way valve, or the like may be used.
[0061]
When the discharge of the pattern forming material is stopped, the movement of the substrate 9 is further decelerated (step S24, time t24), and the movement is stopped (step S25, time t25).
[0062]
15 to 17 are side views showing the state of the nozzle 54 and the pattern 91 on the substrate 9 when the discharge of the pattern forming material is stopped. The state immediately before step S21, the state immediately after step S23, and the state of step S25, respectively. Corresponds to the state immediately after.
[0063]
As shown in FIG. 15, when the relative movement of the nozzle 54 is decelerated from the state where the pattern forming material is discharged at the steady speed V2, the pattern forming material is slightly accumulated at the tip of the nozzle 54, and the pattern forming material And the substrate 9 are in close contact with each other. Thereafter, by performing the above-described suck back, the tip of the nozzle 54 and most of the ejected pattern 91 are separated at a stretch as shown in FIG. In the pattern forming apparatus 1, the nozzle 54 (discharge unit 52) is moved at a lower speed, and the end of the pattern on the substrate 9 and the tip of the nozzle 54 (or the discharge port 541) are completely as shown in FIG. 17. The nozzle 54 continues to move until it is separated.
[0064]
As described above, in the pattern forming apparatus 1, it is possible to completely stop the discharge of the pattern forming material in a short time, so that the pattern forming material that leaks after stopping the discharge is excessive on the substrate 9. Thus, it is possible to reduce a region where unnecessary pattern forming material adheres due to dragging. As a result, it is possible to reduce a useless area that cannot be used for a product generated on the substrate 9 and to reduce the production cost of the substrate 9.
[0065]
Further, the discharge is stopped in a short time, and the movement of the discharge unit 52 continues so that the pattern forming material at the tip of the nozzle 54 is wiped by the substrate 9 until the tip of the nozzle 54 and the pattern 91 are completely separated. Therefore, it is possible to prevent the pattern forming material from adhering to the discharge port 541 and to prevent the discharge from becoming unstable at the next discharge, and it is possible to more reliably form a pattern having a desired cross-sectional shape.
[0066]
If the pattern forming material and the nozzle 54 can be appropriately separated, the discharge may be stopped before the deceleration, and the deceleration is not performed in two stages as shown in FIG. Also good. That is, the ejection may be stopped only before the ejection unit 52 stops with respect to the substrate 9.
[0067]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.
[0068]
In the above embodiment, the head unit 5 is fixed and the stage 3 moves. However, the head unit 5 and the stage 3 only need to move relatively in the direction along the main surface of the substrate 9. The head unit 5 may be provided with a moving mechanism.
[0069]
The pattern forming apparatus 1 may be used for forming patterns of partitions, wirings, electrodes, phosphors, and the like in other types of flat display devices (flat panel displays) such as organic EL display devices and liquid crystal display devices. The substrate 9 is not limited to a glass substrate, and may be a resin substrate, a semiconductor substrate, or the like.
[0070]
The pattern forming material is not limited to one containing glass frit, and when an electrode is formed, for example, one containing metal particles such as silver and (ultraviolet curable) resin is used. Further, the curable resin contained in the pattern forming material does not necessarily need to be a resin curable by ultraviolet rays, and can be easily used as long as it is a resin curable by light.
[0071]
【The invention's effect】
According to the present invention, a pattern having a predetermined cross-sectional shape can be reliably formed on a substrate.
[0072]
  According to the first to tenth aspects of the present invention, it is possible to suppress the pattern forming material from adhering to the vicinity of the discharge port and form a pattern having a predetermined cross-sectional shape on the substrate. Claims6In the inventions 10 and 10, the discharge of the pattern forming material can be stabilized by suppressing the temperature rise at the tip of the nozzle.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a pattern forming apparatus according to a first embodiment.
FIG. 2 is a side view showing a nozzle.
FIG. 3 is a view showing a nozzle from the tip side.
FIG. 4 is a cross-sectional view of a nozzle.
FIG. 5 is a side view showing another example of a nozzle.
FIG. 6 is a view showing a nozzle from the tip side.
FIG. 7 is a cross-sectional view of a nozzle.
FIG. 8 is a diagram illustrating a nozzle and a light irradiation unit.
FIG. 9 is a diagram showing a configuration of a material supply unit.
FIG. 10 is a diagram showing an operation flow of the pattern forming apparatus at the start of discharging of the pattern forming material.
FIG. 11 is a diagram illustrating a change in relative movement speed of the discharge unit at the start of discharge of the pattern forming material.
FIG. 12 is a diagram showing an operation flow of the pattern forming apparatus when the discharge of the pattern forming material is stopped.
FIG. 13 is a diagram showing a change in relative movement speed of the discharge section when the discharge of the pattern forming material is stopped.
FIG. 14 is a diagram illustrating an operation flow of the material supply unit when the discharge of the pattern forming material is stopped.
FIG. 15 is a side view showing a pattern forming material on a nozzle and a substrate.
FIG. 16 is a side view showing a pattern forming material on a nozzle and a substrate.
FIG. 17 is a side view showing a pattern forming material on a nozzle and a substrate.
[Explanation of symbols]
1 Pattern forming device
2 Stage moving mechanism
6 Control unit
9 Board
52 Discharge part
53 Light irradiation part
54 nozzles
55 Material Supply Department
56,57 piping
521 Supply pipe
541 Discharge port
542 Discharge direction
543 Discharge surface
545 inclined surface
546 groove
551 Sub tank
554, 555 valve
572 Negative pressure tank
S13, S23, S232 step

Claims (11)

A pattern forming apparatus for forming a pattern on a substrate,
A discharge portion having an array of a plurality of discharge ports for discharging the pattern forming material toward the substrate;
A moving mechanism for relatively moving the discharge unit in a direction substantially perpendicular to the array of the plurality of discharge ports along the main surface of the substrate;
With
The pattern forming material is discharged from the plurality of discharge ports in the discharge direction toward the substrate side and toward the rear side of the relative movement of the discharge portion,
The discharge part is
An inclined surface extending from the upper side of the plurality of discharge ports in a direction away from the substrate rather than a surface perpendicular to the discharge direction;
A groove provided between the plurality of discharge ports;
A pattern forming apparatus comprising: The pattern forming apparatus according to claim 1,
The pattern forming apparatus, wherein a width between each of the plurality of ejection openings and the groove is 100 μm or less. The pattern forming apparatus according to claim 1 or 2,
The distance between the upper ends of the plurality of discharge ports and the plurality of discharge port side edges of the inclined surface is 100 μm or less. The pattern forming apparatus according to any one of claims 1 to 3,
The pattern forming apparatus, wherein the inclined surface is inclined from the upper side of the plurality of ejection ports to the front side of the relative movement of the ejection unit from a direction perpendicular to the substrate. The pattern forming apparatus according to any one of claims 1 to 4,
It further includes a light irradiation unit that sequentially cures the pattern forming material immediately after ejection by irradiating light,
A part of the light from the light irradiation unit is irradiated on the inclined surface. The pattern forming apparatus according to any one of claims 1 to 4,
It further includes a light irradiation unit that sequentially cures the pattern forming material immediately after ejection by irradiating light,
The pattern forming apparatus, wherein the periphery of the plurality of ejection openings is formed of metal. The pattern forming apparatus according to any one of claims 1 to 6,
The pattern forming apparatus characterized in that the periphery of the plurality of discharge ports is mirror-finished. It is a pattern formation apparatus of Claim 7, Comprising:
An average roughness around the plurality of ejection openings is 0.2 μm or less. The pattern forming apparatus according to any one of claims 1 to 8,
The pattern forming apparatus, wherein the periphery of the plurality of discharge ports is coated with a material that is relatively less adherent to the pattern forming material than a member that forms the plurality of discharge ports. The pattern forming apparatus according to any one of claims 1 to 9,
The pattern forming apparatus, wherein the discharge part is formed of metal. The pattern forming apparatus according to any one of claims 1 to 10 ,
A partition for a flat display device is formed of the pattern forming material.

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