JP4415952B2 - Manufacturing method of chip-type electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a chip-type electronic component, and more specifically, an operation for removing a resin burr of an exterior resin is easy without damaging the component, and a high-quality chip-type electronic component is manufactured. The present invention relates to a method for manufacturing a chip-type electronic component that can be manufactured with a high manufacturing yield.

  As an example of a chip-type electronic component, for example, a coil chip component shown in Patent Document 1 below is known.

  In this coil chip component, the outer peripheral surface of the exterior resin portion formed on the outer periphery of the core portion of the ferrite core is polished so as not to protrude from the outer periphery of the end electrode. In paragraph No. 0011 of Patent Document 1, it is described that the outer peripheral surface of the exterior resin portion can be polished to satisfactorily adsorb electronic components and improve the stability on the substrate.

  However, in the coil chip component shown in Patent Document 1, the exterior resin portion covers only the outer periphery of the coil portion, and does not cover the outer periphery of the flange-shaped flanges formed at both ends of the core portion. For this reason, it has the subject that foreign substances, such as a water | moisture content, enter easily from the clearance gap between an exterior resin part and the flange of a core part.

  Therefore, as shown in FIG. 13B of Patent Document 2 below, not only the outer periphery of the coil part but also the outer periphery of the part including the outer periphery of the flanges formed at both ends of the core part is packaged. A structure covering with a resin portion has also been proposed.

  However, in the structure of the coil chip component shown in Patent Document 2, in order to cover the entire periphery of the component, including the outer periphery of the flange formed at both ends of the core portion, with the exterior resin portion, the connection between the end electrode and the coil is performed. The connection with the wire part tends to be insufficient. In addition, the bonding strength between the end electrode and the exterior resin part is likely to be lowered.

  In chip-type electronic components including the coil chip components shown in Patent Documents 1 and 2 described above, a process of integrating an exterior resin with the component main body is required in the process of manufacture. For example, when the exterior resin is a thermosetting resin, the exterior resin is integrated with the component main body by injection molding or the like, and then heat treatment (curing treatment) is performed on the exterior resin-equipped component taken out from the mold. The exterior resin is completely cured. Thereafter, the resin burrs formed on the part with the exterior resin are removed by, for example, blasting to produce a product.

A process of removing resin burrs after heat-treating (curing) the part with exterior resin taken out from the mold and completely curing the exterior resin is described, for example, in Patent Document 3 below. The method described in Patent Document 3 is a method for manufacturing a solid electrolytic capacitor. However, if resin burrs are removed from a coil chip component in the process sequence described in this document, the removal of resin burrs becomes incomplete. There was a fear. Further, in order to completely remove the resin burr, for example, if the strength of the blast treatment is increased, the resin burr can be completely removed, but the electrode surface exposed to the outside together with the exterior resin remains damaged. have.
JP 10-163033 A Japanese Patent Laid-Open No. 10-172853 JP-A-9-246114

  The present invention has been made in view of such a situation, and an object thereof is to easily remove the resin burrs of the exterior resin without damaging the components, and to improve the quality of the chip-type electronic component. It is an object to provide a method for manufacturing a chip-type electronic component that can be manufactured at a manufacturing yield.

In order to achieve the above object, a chip type electronic component manufacturing method (resin burr removing method) according to the present invention includes:
Placing the component body within the cavity of the mold;
Injecting resin into the cavity;
In a state before the resin is completely cured, the step of integrating the resin into the component body as a semi-cured exterior resin;
Removing resin burrs formed on the component body in which the semi-cured exterior resin is integrated;
Fully curing the semi-cured exterior resin integrated with the component body from which the resin burrs have been removed.

  According to the method for manufacturing a chip-type electronic component according to the present invention, the resin burrs formed on the component main body integrated with the semi-cured exterior resin before completely curing the resin are removed. Therefore, the resin burr can be removed easily and in a short time, and the resin burr removal efficiency is improved.

  In addition, since the load on the component main body required for removing resin burrs is reduced, it is possible to effectively reduce the damage to the component main body that is not covered with the exterior resin, and to suppress the occurrence of defective products. Can do. Therefore, it is possible to manufacture high-quality chip-type electronic components with a high manufacturing yield.

  Preferably, after the resin burr is removed and before the semi-cured exterior resin is completely cured, the component main body in which the semi-cured exterior resin is integrated is washed. By cleaning the component main body in which the semi-cured exterior resin is integrated before completely curing the resin, dust such as resin burrs can be easily cleaned, and the cleaning efficiency is improved.

  Further, by performing a complete curing process (curing process) after the cleaning, the curing process can also serve as a drying process of the cleaning liquid at the time of cleaning, which contributes to the reduction of the process. In addition, by performing a curing process after cleaning, it is possible to completely volatilize the cleaning solution that has penetrated into the exterior resin part, and therefore, the strength of the exterior resin part is improved, and cracks and the like are prevented by soldering heat. be able to.

  Preferably, after the resin burrs are removed and before the semi-cured exterior resin is completely cured, an appearance inspection of the component body in which the semi-cured exterior resin is integrated is performed. By the appearance inspection, it is possible to inspect burrs remaining on the surface of the component main body (for example, the electrode surface) that is not covered with the exterior resin, and damage to the component main body. By performing an appearance inspection in the process before the exterior resin is completely cured, the deburring process for the remaining burrs can be easily performed.

  In the present invention, the “state before completely curing the resin” is not particularly limited, and the entire resin may be in a semi-cured state, or only the outer surface of the resin is considerably cured. The inside may not be completely cured. In any case, “the state before completely curing the resin (semi-cured state)” means that in the subsequent process, a process for completely curing the resin is required to obtain a product. is there.

  However, in the present invention, preferably, before the resin burr is removed, the outer surface of the semi-cured exterior resin has a Vickers hardness of 18 to 22. When the surface hardness is too low, it is difficult to take out the product from the mold, and the surface of the exterior resin may be damaged by the deburring and removing operation. Further, when the surface hardness is too high, the deburring operation tends to be complicated.

  Preferably, the resin injected into the cavity of the mold is a thermosetting resin. This is because it is easy to produce the semi-cured state of the present invention when it is a thermosetting resin.

  Preferably, the resin burr is removed by blasting. The blasting process is performed, for example, by spraying a large number of plastic spheres of about 100 μm or less toward the object, and by adjusting the spraying pressure, the semi-cured resin burrs can be easily removed. There is little damage to the parts body.

Preferably, the component body is
A core portion having a pair of flanges at both axial ends of the core portion;
A coil chip component body having a wire wound around the winding core portion.

For example, the chip-type electronic component according to the present invention is
A core portion having a pair of square flanges at both axial ends of the core portion;
A wire wound around the core portion;
A resin flange covering portion covering the connecting portion of the wire located on the outer periphery of each flange halfway;
An exterior resin portion formed integrally with the flange covering portion, covering the periphery of the wire wound around the core portion, and having a flat surface on at least one surface;
A pair of end electrodes formed so as to directly cover the outer peripheral surface of the flange from the end surface of the flange and to cover the flange covering portion of the exterior resin portion so as to be connected to the connecting portion of the wire Have
The flat surface of the exterior resin part is an adsorption surface.

  In such a chip-type electronic component, the resin flange covering portion that is a part of the exterior resin portion covers the wire connecting portion located on the outer periphery of the flange partway. The end electrode directly covers the outer peripheral surface of the flange from the end surface of the flange so as to be connected to the wire connecting portion, and also covers the flange covering portion of the exterior resin portion. For this reason, the gap between the outer resin portion and the flange of the core portion is well sealed, and the connection between the end electrode and the wire connecting portion is sufficiently secured, so that the end electrode and the outer resin portion High bonding strength.

  In addition, in this type of chip-type electronic component, the flat surface of the exterior resin part that is not covered by the end electrodes serves as an adsorption surface, and even a small and lightweight chip-type electronic component is adsorbed by suction force. Adsorption and holding can be satisfactorily performed by the nozzle.

  Preferably, the axial length of the flat portion of the exterior resin portion not covered with the end electrode is 30 to 70% of the total length of the electronic component. The flat part of the exterior resin having such an axial length can be satisfactorily held by suction by the suction nozzle.

  Preferably, the end electrode has a thickness of 8 μm or less. The end electrode having such a thickness is formed by a plating method or the like. Because the end electrode is thin in this way, even if the end of the suction nozzle is positioned on the end electrode, the suction action is not reduced so much by the suction nozzle, and the part can be held with sufficient suction force. Can do.

  Preferably, a stepped recess that is continuous in the circumferential direction is formed on the outer peripheral surface of each end electrode. By forming the stepped recesses, the stepped recesses formed on the bottom surfaces of the end electrodes formed at both ends of the electronic component during solder reflow, especially when mounting a small and lightweight chip-type electronic component Solder enters the. Since the step-like recesses are formed continuously in the circumferential direction of the end electrodes, a sufficient amount of solder can be secured. As a result, the so-called tombstone phenomenon can be effectively prevented and mounting defects can be prevented.

In addition, a preferable method for manufacturing a chip-type electronic component of the present invention is as follows.
Preparing a core portion having a pair of square flanges at both axial ends of the core portion;
Forming a coil part by winding a wire around the core part; and
Forming a connecting portion of the wire on the outer periphery of the flange;
The core portion around which the wire is wound is arranged in the mold in at least one line in the axial direction, and the end surfaces of the flanges in the adjacent core portions are in contact with each other, and on the flange outer periphery of the end surface where these flanges contact. Forming a cavity on the outer periphery of the coil part and the outer periphery of the flange part by contacting the holding convex part of the mold; and
Resin is injected into the cavity, and a resin flange covering portion covering the connecting portion of the wire located on the outer periphery of each flange to the middle, and the flange covering portion are formed integrally, covering the periphery of the coil portion And forming an exterior resin portion having a flat surface on at least one surface,
When forming the exterior resin part, the above-described resin deburring method according to the present invention is applied.

  In this method, it is only necessary to devise the shape of the mold, and it is not necessary to process the core part itself. Therefore, the volume of the core portion does not decrease and the performance as an electronic component is not affected at all. In addition, the resin flange covering part, which is a part of the exterior resin part, is formed with a single resin molding, and many resin molded products have a structure that covers the wire connecting part located on the outer periphery of the flange partway. Can be manufactured.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is a longitudinal sectional view of a coil chip component as a chip-type electronic component according to an embodiment of the present invention.
2A is a process diagram illustrating a method for manufacturing a coil chip component according to an embodiment of the present invention, and FIG. 2B is a process diagram illustrating a method for manufacturing a coil chip component according to a conventional example.
FIG. 3 is a longitudinal sectional view of a mold and a part showing a manufacturing process of the coil chip part shown in FIG.
FIG. 4 is a cross-sectional view of the mold and parts along line IV-IV shown in FIG.
FIG. 5 is a cross-sectional view of the main part of the coil chip component shown in FIG.
FIG. 6 is a schematic perspective view showing a state in which the coil chip component shown in FIG. 1 is sucked by a suction nozzle.

  As shown in FIG. 1, a coil chip component 2 as a chip-type electronic component according to an embodiment of the present invention has a drum core 4 as a core portion (core material). The drum core 4 is made of a ferrite material. The drum core 4 has a core part 4 a in which a wire 10 a constituting the coil part 10 is wound along the axial direction of the core 4.

  A first flange 4b and a second flange 4c are integrally formed at the first end and the second end, which are both ends in the axial direction of the core 4a. The outer dimensions of the first flange 4b and the second flange 4c are larger than the outer diameter of the core 4a.

  The cross section of the core part 4a is not particularly limited, and may be a rectangular cross section, a circular cross section, or other cross sectional shapes. The cross-sectional shape of the first flange 4b and the second flange 4c is a square shape such as a rectangular cross section. The 1st flange 4b and the 2nd flange 4c are the same size, for example, length is about 0.82 mm and width is about 0.30 mm. Moreover, the outer diameter of the core part 4a is about 0.42 mm. The total axial length L0 of the drum core 4 (substantially the same as the total length of the component 2) L0 is about 1.637 mm.

  As shown in FIG. 1, the connecting portions 10b and 10c formed at both ends of the wire 10a constituting the coil portion 10 are connected to the base electrode layer 20 at the outer peripheral positions of the flanges 4b and 4c. The connecting portions 10b and 10c of the wire 10a are fixed to the outer circumferences of the flanges 4b and 4c by means such as thermocompression bonding after the base electrode layer 20 is formed, and these connecting connections are ensured.

  The base electrode layer 20 is an electroless Ni plating having a first layer of 1.0 to 2.0 μm and a second layer of electrolytic Ni plating having a thickness of 1.0 to 2.0 μm.

  After the base electrode layer 20 and the connecting portions 10b and 10c are connected, in step S1 shown in FIG. 2 (A), resin is molded into the outer peripheral recess of the core portion 4a where the coil portion 10 is formed. Thus, the exterior resin part 30 is formed. The resin constituting the exterior resin portion 30 is not particularly limited, and examples thereof include thermosetting resins such as epoxy resins, phenol resins, diallyl phthalate resins, and polyester resins. Preferably, diallyl phthalate resins and epoxy resins are used. A thermosetting resin such as a diallyl-based mixed resin is preferable.

  The exterior resin portion 30 is molded using, for example, molds 80 and 82 shown in FIGS. As shown in FIGS. 3 and 4, the connected drum core 4 in which the coil portion 10 is formed in a plurality of cavities 84 formed by closing the molds 80 and 82 is connected to the adjacent drum core 4. The first flange 4b is arranged side by side in the axial direction so that the end face of the second flange 4b contacts the end face of the second flange of the adjacent drum core 4.

  The molds 80 and 82 are formed with holding convex portions 86 for holding the outer periphery of the contact portion between the first flange 4b and the second flange 4c of the drum core 4 disposed adjacent to each other. A circumferential gap 88 for forming the resin flange covering portion 30a shown in FIG. The circumferential gap 88 communicates with the cavity 84, and is molded by injecting resin into the cavity 84 from the resin injection port 85, and has the flange covering portion 30a shown in FIG. A plurality of element bodies 5 in which the exterior resin part 30 is integrated are obtained. The four side surfaces of the exterior resin part 30 are flat surfaces.

  The outer diameter of the exterior resin portion 30 of each element body 5 is larger than the outer dimensions (the maximum outer dimensions of the core portion) of the first flange 4b and the second flange 4c, and the first flange 4b and the second flange 4c. A flange covering portion 30a having a predetermined thickness is formed on the outer periphery. The flange covering portion 30a is formed integrally with the exterior resin portion 30, and is formed so as to cover the outer periphery of the flange portions 4b and 4c from the inner side to the outer side to the middle position in the axial direction.

  The thickness of the flange covering portion 30a corresponds to the depth H1 of the step-shaped recess 50 described later. Further, the axial length of the flange covering portion 30a is determined so as to appropriately adjust the axial width (W1) of the step-shaped recess 50 described later.

  After the exterior resin part 30 is formed, the element body 5 (the drum core 4 with the exterior resin part) is taken out from the molds 80 and 82. The molding conditions for the molds 80 and 82 differ depending on the type of resin, but the molds 80 and 82 are opened before the resin is completely cured, and the product is taken out. Specifically, when the exterior resin part 30 is a diallyl phthalate resin, the mold temperature is 160 ° C., and the time from the completion of resin filling into the mold until the mold opening is 1 minute. Under such conditions, the exterior resin part 30 is in a semi-cured state.

  After the exterior resin part 30 is formed, in a general method, as shown in FIG. 2 (B), the exterior resin part 30 is cured (step S5), and then a blast process is performed to form a base electrode. The resin burr formed on the surface of the layer 20 is removed. However, in the embodiment of the present invention, as shown in FIG. 2A, after the exterior resin part 30 is formed, the blasting process (step S5) is performed without performing the curing process (step S5) of the exterior resin part 30. S2) is performed, and the resin burrs formed on the surface of the base electrode layer 20 are removed.

  The blasting process is a process for removing resin burrs by spraying plastic balls of about 100 μm or less onto the element body 5 as an object. As the plastic sphere used at the time of blasting, for example, a resin such as nylon or polycarbonate is used. The pressure of the plastic sphere is determined so as not to damage the outer surface of the base electrode layer 20 and the exterior resin part 30 although the resin burrs are removed.

  As shown in FIG. 2A, after the blasting process, an appearance inspection is performed in step S3. In the appearance inspection, whether or not there is a resin burr residue on the surface of the base electrode layer 20 is checked, and whether or not there is damage such as peeling of the base electrode layer 20 is also checked. If there is a defective product, the defective product is sent to the reprocessing step and blasted again. Alternatively, other reprocessing is performed. If it does not become a good product even after reprocessing, it will be disposed of.

  Only those that are judged to be non-defective products in the appearance inspection in step S3 are sent to the cleaning process in step S4. In the cleaning process, the element main body 5 is cleaned using, for example, acetone as a cleaning liquid, and the media residue and dust used during the blasting process are removed. Cleaning is performed by putting the element body 5 in a mesh or the like and cleaning it in a cleaning solution in a time of about 30 to 150 seconds.

  Thereafter, in the present embodiment, a curing process for completely curing the semi-cured exterior resin is performed in step S5. The ambient temperature during the curing treatment is preferably about the same as the mold temperature during resin molding, for example, 160 ° C. The treatment time for the curing treatment is preferably about 1 to 10 hours.

  The Vickers hardness on the surface of the semi-cured exterior resin part 30 after taking out from the molds 80 and 82 is about 22 or less, and the Vickers hardness on the surface of the exterior resin part 30 after the curing treatment is 28 or more. After the curing process, the hardness is improved by about 25% or more.

  Then, the coil chip component 2 is obtained by forming a pair of end electrodes 40 at both ends in the axial direction of the element body 5. The end electrode 40 is formed after the exterior resin part 30 is formed.

  In this embodiment, each end electrode 40 has electroless Ni plating of 1.0 to 2.0 μm for the first layer, electrolytic Ni plating of 1.0 to 2.0 μm for the second layer, and 3 for the third layer. Electrolytic Sn plating of 0.0 to 4.0 μm. The thickness t1 of the end electrode 40 is 8 μm or less.

  Each end electrode 40 is formed in a stepped shape so as to directly cover the outer peripheral surface of the flange 4b, 4c from the end face of each flange 4b, 4c and to cover the flange covering portion 30a of the exterior resin portion 30. . Each end electrode 40 is directly connected to the base electrode layer 20 and the connecting portions 10b and 10c at the end surfaces of the flanges 4b and 4c and a part of the outer peripheral surface of the flanges 4b and 4c. Moreover, since each end electrode 40 is formed so as to cover the flange covering portion 30a of the exterior resin portion 30, a step-like recess 50 that is continuous in the circumferential direction is formed on the outer peripheral surface of each end portion 40. Is done.

  As shown in FIG. 1, the step-shaped recess 50 is formed with a predetermined width (W1) from the axial end surface of the element body 5, and the ratio (W1 / W0) to the total width (W0) of each end electrode. ) Is preferably 0.1 to 0.8, more preferably 0.3 to 0.6. By setting the ratio (W1 / W0) within the above range, the connection between the end electrode 40 and the coil connecting portions 10b and 10c is sufficiently secured, and the bonding strength between the end electrode 40 and the exterior resin portion 30 is also high. high. Moreover, the effect which suppresses a tombstone phenomenon is large by setting it as this range.

  The tombstone phenomenon means that when a chip-type electronic component is mounted on a substrate, the electronic component rises due to an unbalance of moments generated on the solder paste surfaces of the end electrodes formed at both ends of the electronic component. This is a phenomenon that results in poor bonding.

  Further, the stepped recess 50 is formed such that the depth (H1) from the maximum outer peripheral surface dimension of each end electrode 40 is 10 to 40 μm. By setting the depth H1 within this range, the connection between the end electrode 40 and the coil connection portions 10b and 10c is sufficiently secured, and the bonding strength between the end electrode 40 and the exterior resin portion 30 is also high. Moreover, the effect which suppresses a tombstone phenomenon is large by setting it as this range. On the other hand, if the depth H1 is too deep, the maximum outer dimensions of the flange portions 4b and 4c in the drum core 4 are relatively small with a limited chip size, and the electrical performance tends to deteriorate. .

  The ratio (H1 / H0) of the depth (H1) of the stepped recess 50 to the total height (H0) of the maximum outer peripheral surface of each end electrode 40 is in the range of 0.011 to 0.045. By setting the ratio within this range, the connection between the end electrode 40 and the coil connecting portions 10b and 10c is sufficiently secured, and the bonding strength between the end electrode 40 and the exterior resin portion 30 is also high. Moreover, the effect which suppresses a tombstone phenomenon is large by setting it as this range.

  In this embodiment, in particular, even when the chip maximum height H0 is 0.9 mm or less and the coil tip part 2 is 5 mg or less in light weight, during solder reflow during mounting, as shown in FIG. In addition, the solder 70 enters the gap between the stepped recess 50 formed on the bottom surface of the end electrode 40 and the substrate 60. Since the step-shaped recess 50 is formed continuously in the circumferential direction of the end electrode 40, the amount of wraparound of the solder 70 can be sufficiently secured. As a result, the so-called tombstone phenomenon can be effectively prevented and mounting defects can be prevented. For example, in the conventional coil chip component (there is no stepped recess 50), the tombstone phenomenon occurred at a ratio of about 10 per 100,000, whereas the embodiment of the present invention (the stepped recess 50) In some cases, no tombstone phenomenon occurred.

  Further, in this embodiment, the solder 70 wraps around the stepped recess 50, so that sufficient bonding strength can be obtained even if the size of the fillet formed by the solder 70 is reduced, and high-density mounting is possible. .

  In the present embodiment, the stepped recess 50 is formed by forming the end electrode 40 so as to cover the outer periphery of both ends of the exterior resin part 30 having an outer dimension larger than the maximum outer dimension of the flanges 4b and 4c. It is formed. For this reason, it is not necessary to process the flange itself, the volume of the flange does not decrease, and the performance as a coil chip is not affected at all. Moreover, since the stepped recess 50 can be formed by resin molding, the manufacturing process is not complicated.

  Furthermore, in this embodiment, the axial width W0 of each end electrode 40 shown in FIG. 1 is preferably 0.41 mm, so that the flat surface of the exterior resin portion 30 located between the edges of the end electrode 40 is provided. The axial width L1 of 30b can be about 0.817 mm. The axial width L1 of the flat surface 30b is 30 to 70% of the total length L0 of the component 2.

  The upper flat portion 30b of the exterior resin portion 30 having such an axial length L1 can be favorably held by the suction nozzle 90 as shown in FIG. In addition, since the thickness t1 of the end electrode 40 is as thin as 8 μm or less, even if the end of the suction nozzle 90 is positioned on the end electrode 40, the suction action is not significantly reduced by the suction nozzle 90, and sufficient suction power is obtained. The parts can be held with.

  In particular, in the manufacturing method of the coil chip component 2 of the present embodiment, as shown in FIG. 2A, the resin formed in the element body 5 in which the semi-cured exterior resin before the resin is completely cured is integrated. Burrs are removed by blasting. Therefore, the resin burr can be removed easily and in a short time, and the resin burr removal efficiency is improved.

  In addition, since the load on the element body 5 required for removing the resin burrs is also reduced, it is possible to effectively reduce the occurrence of damage to the base electrode layer 20 that is not covered with the exterior resin, and to generate defective products. Can be suppressed. Therefore, the high quality coil chip component 2 can be manufactured at a high manufacturing yield.

  Furthermore, in the embodiment of the present invention, after removing the resin burr, the element body 5 in which the semi-cured exterior resin is integrated is washed before the semi-cured exterior resin is completely cured. By cleaning the element body 5 in which the semi-cured exterior resin is integrated before completely curing the resin, dust such as resin burrs can be easily cleaned, and the cleaning efficiency is improved.

  Further, by performing a curing process after the cleaning, the curing process can also serve as a drying process of the cleaning liquid at the time of cleaning, which contributes to the reduction of the process. In addition, by performing a curing process after cleaning, it is possible to completely volatilize the cleaning liquid that has penetrated into the exterior resin part 30, which improves the strength of the exterior resin part 30, and causes cracks due to soldering heat. Can be prevented.

  In addition, in this embodiment, after the resin burr is removed and before the semi-cured exterior resin is completely cured, an appearance inspection of the element body 5 in which the semi-cured exterior resin is integrated is performed. By appearance inspection, it is possible to inspect burrs remaining on the surface of the base electrode layer 20 that are not covered with the exterior resin portion 30 and damages on the surfaces of the exterior resin portion 30 and the base electrode layer 20. By performing an appearance inspection in the process before the exterior resin part 30 is completely cured, the deburring process for the remaining burrs is easy.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
For example, the method of the present invention is not limited to the manufacturing method of the coil chip component shown in FIGS. 1 to 6, and is also applied to the manufacturing method of other chip type electronic components such as common mode filters, three-terminal filters, and ferrite beads. can do.

  In the method of the present invention, as a method for removing the resin burrs, it is possible to adopt a method such as barrel polishing in addition to the blast treatment.

FIG. 1 is a longitudinal sectional view of a coil chip component as a chip-type electronic component according to an embodiment of the present invention. 2A is a process diagram showing a method for manufacturing a coil chip component according to an embodiment of the present invention, and FIG. 2B is a process diagram showing a method for manufacturing a coil chip component according to a conventional example. FIG. 3 is a longitudinal sectional view of a mold and a part showing a manufacturing process of the coil chip part shown in FIG. FIG. 4 is a cross-sectional view of the mold and parts along the line IV-IV shown in FIG. FIG. 5 is a cross-sectional view of a main part of the coil chip component shown in FIG. FIG. 6 is a schematic perspective view showing a state in which the coil chip component shown in FIG. 1 is sucked by a suction nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Coil chip component 4 ... Drum core 4a ... Core part 4b ... 1st flange 4c ... 2nd flange 5 ... Element main body 10 ... Coil part 10a ... Wire 10b, 10c ... Connection part 20 ... Underlayer electrode layer 30 ... Exterior resin Part 30a ... Flange coating part 30b ... Flat surface 40 ... End electrode 50 ... Stepped concave part 60 ... Substrate 70 ... Solder 80, 82 ... Mold 84 ... Cavity 85 ... Resin injection port 86 ... Holding convex part 88 ... Circumferential direction Clearance 90 ... Suction nozzle

Claims (3)

Placing the component body within the cavity of the mold;
Injecting resin into the cavity;
In a state before the resin is completely cured, the step of integrating the resin into the component body as a semi-cured exterior resin;
Removing resin burrs formed on the component body in which the semi-cured exterior resin is integrated;
A step of completely curing the semi-cured exterior resin integrated with the component main body from which the resin burr has been removed,
The component body is
A core portion having a pair of flanges at both axial ends of the core portion;
A coil chip component body having a wire wound around the winding core part,
The mold is formed with holding convex portions that hold the outer periphery of the contact portion between the flanges of the component main body arranged adjacent to each other in the axial direction in contact with the two flanges. circumferential gap for forming the covering portion is formed tare is,
After removing the resin burrs and before completely curing the semi-cured exterior resin, the component body integrated with the semi-cured exterior resin is washed,
At the time before removing the resin burr, the outer surface of the semi-cured exterior resin is Vickers hardness, 18-22,
The outer surface of the exterior resin after completely curing the semi-cured exterior resin has a Vickers hardness of 28 or more,
The method of manufacturing a chip-type electronic component, wherein the resin burr is removed by blasting . 2. The chip-type electronic component according to claim 1 , wherein after the resin burr is removed and before the semi-cured exterior resin is completely cured, an appearance inspection of the component body in which the semi-cured exterior resin is integrated is performed. Manufacturing method. The method for manufacturing a chip-type electronic component according to claim 1, wherein the resin injected into the cavity of the mold is a thermosetting resin.

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