JP4413636B2 - 熱処理装置 - Google Patents
熱処理装置 Download PDFInfo
- Publication number
- JP4413636B2 JP4413636B2 JP2004026053A JP2004026053A JP4413636B2 JP 4413636 B2 JP4413636 B2 JP 4413636B2 JP 2004026053 A JP2004026053 A JP 2004026053A JP 2004026053 A JP2004026053 A JP 2004026053A JP 4413636 B2 JP4413636 B2 JP 4413636B2
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- heat shield
- heat
- shield plate
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 49
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 22
- 230000004888 barrier function Effects 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- 239000010453 quartz Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004026053A JP4413636B2 (ja) | 2004-02-02 | 2004-02-02 | 熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004026053A JP4413636B2 (ja) | 2004-02-02 | 2004-02-02 | 熱処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005217383A JP2005217383A (ja) | 2005-08-11 |
| JP2005217383A5 JP2005217383A5 (enExample) | 2007-03-08 |
| JP4413636B2 true JP4413636B2 (ja) | 2010-02-10 |
Family
ID=34908240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004026053A Expired - Fee Related JP4413636B2 (ja) | 2004-02-02 | 2004-02-02 | 熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4413636B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101094643B1 (ko) * | 2009-12-22 | 2011-12-20 | 주식회사 티씨케이 | 종형열처리장치의 단열판 및 그 제조방법 |
| JP2021197448A (ja) * | 2020-06-15 | 2021-12-27 | 光洋サーモシステム株式会社 | 熱処理装置 |
-
2004
- 2004-02-02 JP JP2004026053A patent/JP4413636B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005217383A (ja) | 2005-08-11 |
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