JP4413234B2 - Laminated structure for high-frequency signal transmission and high-frequency semiconductor package using the same - Google Patents

Description

  The present invention relates to a laminated structure used at high frequencies such as a microwave band and a millimeter wave band, and a high-frequency semiconductor package containing a semiconductor element, and particularly to a high-frequency signal transmission laminated structure having good high-frequency transmission characteristics and a high-frequency semiconductor package using the same. About.

  Conventionally, there is a structure as shown in FIG.

In FIG. 17, reference numeral 1 denotes a dielectric layer, which is laminated to form a laminated plate. Reference numerals 11 and 21 denote signal wiring conductors, which are connected to the surface signal through conductors 14 and 24 through the signal wiring connecting conductors 13 and 23, respectively. In the inner layer, 34 inner layer signal through conductors and 33 signal through conductor connecting conductors connecting them are formed and connected between the surface layer signal through conductors 14, 24, and 32 inner layer ground conductors are connected. A circular inner layer ground conductor non-formation region indicated by 36 is formed inside, and an inner layer grounding through conductor indicated by 35 is formed in the vicinity of the outer periphery of the inner layer ground conductor non-formation region. The surface layer signal through conductors 14, 24, the inner layer signal through conductors 34, and the surface ground conductor non-formation regions 16, 26 and the inner layer ground conductor non-formation region 36 overlap each other in a so-called coaxial line structure. None, a laminated structure for high-frequency signal transmission.
JP 2002-100901 A

  However, in the above-described conventional laminated structure for high-frequency signal transmission, the length of the signal wiring connecting conductors 13 and 23 is long, and the distance from the high-frequency signal propagating here is far from the ground. There was a problem that the high-frequency transmission characteristics deteriorated.

  For example, as a conventional laminated structure for high-frequency signal transmission having the structure shown in FIG. 17, the present inventors laminated nine dielectric layers 1 having a relative dielectric constant of 9.2 and a thickness of 0.2 mm to form a laminated board, The conductor 11 is formed with a width of 0.21 mm, the signal wiring connecting conductor 13 is formed with a width of 0.21 mm, and the surface layer signal through conductors 14 and 24 and the inner layer signal through conductor 34 are formed in a circular shape with a diameter of 0.1 mm. The signal through conductor connecting conductor has a circular shape with a diameter of 0.16 mm, and the surface ground conductor non-forming regions 16 and 26 and the inner layer grounding inner layer grounding conductor non-forming region 36 have a circular shape with a diameter of 1.24 mm. Is a circular shape with a diameter of 0.1 mm, and is arranged around the apex of a regular octagon on the circumference with a diameter of 1.40 mm. Then, when the distance between the ends of the surface signal wiring conductors 11 and 21 opposite to the signal wiring connecting conductors 13 and 23 is 2.0 mm when viewed from above, and the high frequency characteristics therebetween are extracted by electromagnetic field simulation, the line in FIG. A characteristic curve of frequency characteristics as shown in the figure was obtained. In FIG. 19, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown.

  The characteristic curve in FIG. 19 shows that the reflection increases as the frequency increases. In particular, the influence of the inductance of the signal wiring connecting conductors 13 and 23 appears strongly at high frequencies, and the reflection increases, and the high frequency signal It has been found that the transmission is degraded.

  In addition, as a configuration similar to the example of FIG. 17, except that the inner-layer grounding through conductor 35 is removed, the structure shown in FIG. When high frequency characteristics were extracted by electromagnetic field simulation, a characteristic curve as shown in FIG. 20 was obtained. FIG. 20 (a) shows the frequency characteristic of the reflection coefficient (unit: dB) indicating the proportion of the reflected signal returned from the incident high-frequency signal, and FIG. 20 (b) shows that the incident high-frequency signal is transmitted. The frequency characteristics of the transmission coefficient (unit: dB) indicating the ratio of the transmitted signal are shown. From FIG. 20, by removing the inner-layer grounding through conductor 35, reflection at high frequencies is somewhat reduced, but there are very few signals transmitted through and transmitted through the inner-layer grounding conductor 32. You can see that As described above, if the inner-layer grounding through conductor 35 is not properly disposed, an electromagnetic shielding space cannot be provided in the inner layer portion. Therefore, leakage of a high-frequency signal occurs, resulting in an increase in radiation loss. It will deteriorate the characteristics.

  Accordingly, the present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a laminated structure for high-frequency signal transmission with good high-frequency transmission characteristics and a high-frequency semiconductor package using the same. .

In the laminated structure for high-frequency signal transmission according to claim 1 of the present invention, the signal wiring conductors formed on the uppermost layer and the lowermost layer of the laminated substrate formed by laminating four or more dielectric layers are reversed from one end. The signal wiring conductor is connected to one end of each of the signal wiring conductors, and the surface layer signal through conductors vertically passing through the uppermost layer and the lowermost dielectric layer via the signal wiring connection conductors, An inner layer ground conductor non-forming region having a circular shape, a rectangular shape, an elliptical shape, or an even polygonal shape and an inner layer ground conductor are formed on each of the inner layer excluding the uppermost layer and the lowermost layer. In the formation region, a signal through conductor connecting conductor is formed to connect to an inner layer signal through conductor that vertically penetrates each inner layer, and each inner layer is vertically moved outside the outer periphery of the inner layer ground conductor non-forming region. For inner layer grounding A high-frequency signal transmission layered structure formed of Tsushirube body, so that the surface layer signal through conductors, the signal lines connecting conductor which does not overlap with the inner layer ground conductor immediately below or immediately above to extend the signal wiring conductors The inner layer signal through conductor is formed inside the outer periphery of the inner layer ground conductor non-formation region immediately above or immediately below the signal wiring conductor, and the inner layer signal through conductor is the surface layer signal through conductor. They are arranged so as to be smoothly connected so as to be connected smoothly in the vertical direction, and the shift is small as they approach the center in the vertical direction.

  According to the high-frequency semiconductor package of claim 5, a structure is provided in which a high-frequency semiconductor element is accommodated by providing a frame body and a lid on the upper surface of the multi-layer substrate provided with the multi-layer structure for high-frequency signal transmission. Features.

  Here, in the laminated structure for high-frequency signal transmission of the present invention, in particular, the thickness of the inner dielectric layer and the interval between the inner-layer grounding through conductors are set to be smaller than half of the maximum guide wavelength used. desirable. The reason for this is to prevent electromagnetic waves from leaking and causing radiation loss in the inner layer when the electromagnetic shielding space is not formed in the inner layer as shown in the conventional example. In other words, if the rectangle formed by the upper and lower ground conductors on the inner layer and the grounding through conductor is regarded as a rectangular waveguide, the lowest transmission mode (basic mode) of the rectangular waveguide is the TE10 mode. Is equal to the effective length of twice the long side of the rectangle. Therefore, in order to form an electromagnetic shielding space in the inner layer portion within the frequency band to be used, the thickness of the inner dielectric layer and the interval between the inner layer grounding through conductors should be smaller than half of the highest frequency of the guide wavelength used. It is necessary to set it to 1/4 wavelength or less. Therefore, it is also important to satisfy the above range within a range where manufacturing difficulties do not occur.

As described above, according to the laminated structure for high-frequency signal transmission according to claim 1, the signal wiring conductors formed on the uppermost layer and the lowermost layer of the laminated substrate formed by laminating four or more dielectric layers are mutually connected. Connects one end of each signal wiring conductor to the uppermost layer and the lowermost dielectric layer through the signal wiring connecting conductor, extending in the opposite direction from one end. An inner layer ground conductor non-formation region in which the planar shape is circular, rectangular, elliptical or even polygonal , and an inner layer ground conductor are formed on each of the inner layers excluding the uppermost layer and the lowermost layer, and the inner layer In the ground conductor non-forming region, a signal through conductor connecting conductor connected to an inner layer signal through conductor penetrating each layer of the inner layer is formed, and outside the outer periphery of the inner layer ground conductor non-forming region, Inside each layer up and down A high-frequency signal transmission layered structure forming the ground through conductors, the surface layer signal through conductors, the signal lines connecting conductor which does not overlap with the inner layer ground conductor immediately below or immediately above to extend the signal wiring conductors The inner layer signal through conductor is disposed on the outer periphery of the inner layer ground conductor non-formation region immediately above or immediately below the signal wiring conductor, and the inner layer signal through conductor is used for the surface layer signal. Since it is sequentially shifted so as to connect smoothly between the through conductors, and the deviation is small as it approaches the center in the vertical direction, the length of the signal wiring connecting conductor can be shortened. Since the high-frequency transmission characteristics can be improved by reducing the inductance, the problem is that reflection increases at high frequencies. It can be solved.

  According to the laminated structure for high-frequency signal transmission according to claim 1, the surface layer signal through conductors are sequentially shifted so as to be smoothly connected by the inner layer signal through conductor and the signal through conductor connecting conductor. Since the impedance change can be made smaller than the case where the region (dimension) forming the signal transmission laminated structure is arranged by changing the shape of the inner-layer ground conductor non-formation region, impedance matching is improved.

  Further, according to the laminated structure for high-frequency signal transmission according to claim 1, since the deviation of the inner layer signal through conductor becomes smaller toward the center of the inner layer ground conductor non-formation region, the gap between the surface layer and the inner layer is reduced. Impedance discontinuity in high-frequency signal propagation can be reduced, and better high-frequency transmission characteristics can be obtained.

  Further, according to the multilayer structure for high frequency signal transmission according to claim 2 of the present invention, in the multilayer structure for high frequency signal transmission according to claim 1, the width of the signal wiring connecting conductor is wider than the width of the signal wiring conductor. As a result, the width of the signal wiring connecting conductor is increased, whereby the inductance of this portion is further reduced, and the impedance matching is improved.

According to the multilayer structure for high-frequency signal radio waves according to claim 3, the surface ground conductor is formed on either one of the upper and lower surfaces of the multilayer substrate, and the surface ground conductor having a predetermined distance from the signal wiring conductor is formed. The signal wiring conductor is disposed outside the outer periphery of the surface ground conductor non-formation region so that the length of the signal wiring connection conductor is shortened, and the surface ground conductor region surrounds the signal wiring conductor. Compared to the conventional case where the length of the signal wiring connecting conductor is long and the distance from the high-frequency signal propagating here is far from the ground, so that this part acts as an inductance and the high-frequency transmission characteristics deteriorate. In addition, the inductance of the signal wiring connecting conductor can be reduced, and further, the external wiring can be connected to the coplanar by configuring it as a coplanar line as an input / output line. If the road to become a structure that can reduce impedance discontinuities in connection with the external wiring can be a good high-frequency transmission characteristics. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained.

According to the multilayer structure for high-frequency signal transmission according to claim 4, the surface layer ground conductor non-formation region and the surface layer ground conductor having a predetermined interval with respect to the signal wiring conductor are formed on either the upper or lower surface of the multilayer substrate. In addition, the signal wiring conductor is disposed outside the outer periphery of the surface layer ground conductor non-formation region so that the length of the signal wiring connection conductor is shortened, and the entire surface layer ground conductor is disposed in the signal wiring connection conductor. Since the surface wiring conductor is provided only on both sides of the signal wiring conductor from the end opposite to the signal wiring conductor, the surface layer ground conductor is provided only on both sides of the signal wiring conductor (or from the inner layer to the surface layer). ) Because the propagation direction can be changed stably while keeping the propagation mode stable with respect to the straightness of the electromagnetic wave going to the surface, reflection is less likely to occur and impedance matching can be performed well. A signal wave transmitting laminated structure.

  Furthermore, according to the high-frequency semiconductor package of claim 5, the frame body and the lid are arranged so as to accommodate the high-frequency semiconductor element on the upper surface of the laminated substrate having the laminated structure for high-frequency signal transmission according to any one of claims 1 to 4, for example. A high-frequency semiconductor with good high-frequency transmission characteristics by forming an input / output signal wiring connection conductor for signal input / output with the outside on the opposite side of the signal wiring connection conductor of the signal wiring conductor on the bottom surface of the multilayer substrate Can be provided as a package.

  Hereinafter, the present invention will be described in detail with reference to the drawings schematically shown. In addition, this invention is not limited to the following examples, It does not interfere at all in the range which does not deviate from the main point of this invention.

  1A and 1B are diagrams showing an example of a first laminated structure for high-frequency signal transmission according to a reference example. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1, reference numeral 1 denotes a dielectric layer, which is laminated to form a laminated plate. The signal wiring conductors 11 and 21 are connected to the surface signal through conductors 14 and 24 through the signal wiring connecting conductors 13 and 23, respectively. In the present invention, the signal wiring connecting conductor refers to a signal conductor that does not overlap with the inner-layer ground conductor 32 directly below or directly above. In the inner layer, 34 inner layer signal through conductors and 33 signal through conductor connecting conductors connecting them are formed and connected between the surface layer signal through conductors 14, 24, and 32 inner layer ground conductors are connected. On the inside, 36 elliptical inner-layer ground conductor non-forming regions are formed, and 35 inner-layer grounding through conductors are formed in the vicinity of the outer periphery of the inner-layer ground conductor non-forming region 36. The inner-layer ground conductor non-forming regions 36 are arranged so as to overlap each other, and the surface layer signal through conductors 14 and 24 are smoothly connected by the inner layer signal through conductor 34 and the signal through conductor connecting conductor 33. As shown in FIG.

  Further, the surface layer signal through conductors 14 and 24 are arranged at the outer periphery of the inner layer ground conductor non-forming region 36 immediately above or directly below, so that the length of the signal wiring connecting conductor 33 is shortened.

  As a result, the length of the signal wiring connection conductor is long, and the distance from the signal wiring connection conductor to the ground is long when viewed from the high frequency signal propagating here. Since the inductance of the signal wiring connecting conductor can be reduced as compared with the case where this occurs, it is possible to achieve good high-frequency transmission characteristics. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained. In particular, in the case where the surface layer signal through conductors 14 and 24 are sequentially shifted so as to be smoothly connected by the inner layer signal through conductors 34 and the signal through conductor connecting conductors 33, the regions forming the laminated structure for high frequency signal transmission ( Dimension) can be made smaller than the case where the inner-layer ground conductor non-formation region is sequentially shifted and arranged, and furthermore, the impedance change can be made smaller than when the inner-layer ground conductor non-formation region is arranged in sequence. Therefore, there is an operation and effect that impedance matching is improved.

  Next, FIG. 2 is a figure which shows the example of the 2nd laminated structure for high frequency signal transmission based on Claim 1 of this invention, (a) is a top view, (b) is AA of (a). It is line sectional drawing.

  2, the same reference numerals are given to the same parts as in FIG. 1, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The inner layer signal penetrating conductor 34 has a smaller deviation as it approaches the center in the vertical direction (the middle layer among the stacked inner layers).

  As a result, the propagation direction can be changed while maintaining the propagation mode stably with respect to the straightness of the electromagnetic wave traveling from the surface layer to the inner layer (or from the inner layer to the surface layer), so that the high-frequency signal between the surface layer and the inner layer can be changed. Since discontinuity of impedance in propagation can be reduced, even better high-frequency transmission characteristics can be obtained. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained.

  Next, FIG. 3 is a figure which shows the example of the 3rd laminated structure for high frequency signal transmission based on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). FIG.

  That is, in FIG. 3, the same reference numerals are assigned to the same parts as in FIG. 1, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are Signal wiring connection conductors, 14 and 24 are surface layer signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor, 34 is an inner layer signal through conductor, 35 is an inner layer ground through conductor, and 36 is an inner layer ground. It is a conductor non-formation region. The inner-layer ground conductor non-formation regions 36 are sequentially shifted so as to be smoothly connected up and down.

  As a result, the impedance change can be made smaller than in the case where the shape of the inner-layer ground conductor non-formation region is sequentially changed and disposed, so that the impedance matching is improved.

  Next, FIG. 4 is a figure which shows the example of the 4th laminated structure for high frequency signal transmission based on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). FIG.

  4, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The deviation of the inner-layer ground conductor non-forming region 36 becomes smaller as it approaches the center in the vertical direction.

  As a result, the impedance discontinuity in the propagation of the high-frequency signal between the surface layer and the inner layer can be reduced, so that even better high-frequency transmission characteristics can be obtained. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained.

  Next, FIG. 5 is a diagram showing an example of a fifth laminated structure for high-frequency signal transmission according to another reference example, (a) is a plan view, and (b) is a cross-sectional view taken along line AA in (a). FIG.

  In FIG. 5, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The inner-layer ground conductor non-formation region 36 is arranged with its shape changed so as to be smoothly connected vertically.

  Thereby, there exists an effect | action and effect that the area | region (dimension) which comprises the laminated structure for high frequency signal transmission can be made smaller than the case where the inner layer ground conductor non-formation area | region is shifted and arrange | positioned one by one.

  Next, FIG. 6 is a figure which shows the example of the 6th laminated structure for high frequency signal transmission based on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). FIG.

  In FIG. 6, the same parts as in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The shape change of the inner-layer ground conductor non-formation region 36 becomes smaller as it approaches the center in the vertical direction.

  As a result, the impedance discontinuity in the propagation of the high-frequency signal between the surface layer and the inner layer can be reduced, so that even better high-frequency transmission characteristics can be obtained. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained.

  Next, FIG. 7 is a figure which shows the example of the 7th laminated structure for high frequency signal transmission based on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). FIG. 7, the same reference numerals are assigned to the same parts as in FIG. 1, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The surface signal through conductors 14 and 24, the inner layer signal through conductor 34, and the surface ground conductor non-forming regions 16, 26 and the inner layer ground conductor non-forming region 36 have a so-called coaxial line structure in which the centers are overlapped. The surface layer ground conductor non-forming region 16 is made smaller than the inner layer ground conductor non-forming region.

  Thereby, there exists an effect | action and effect that the area | region (dimension) which comprises the laminated structure for high frequency signal transmission can be made smaller than the case where the inner layer ground conductor non-formation area | region is shifted and arrange | positioned one by one.

  Next, FIG. 8 is a view showing an example of an eighth laminated structure for high frequency signal transmission according to claim 2 of the present invention, wherein (a) is a plan view and (b) is an AA line of (a). It is sectional drawing.

  In FIG. 8, the same parts as in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connecting conductors, 14 and 24 are surface layer signal through conductors, 32 are inner layer ground conductors, 33 are signal through conductor connection conductors, 34 are inner layer signal through conductors, 35 are inner layer ground through conductors, and 36 are not inner layer ground conductors. It is a formation area. The signal wiring connection conductors 13 and 23 are wider than the signal wiring conductors 11 and 21.

  As a result, the width of the signal wiring connection conductors 13 and 23 is wider than the width of the signal wiring conductors 11 and 21, thereby further reducing the inductance of the signal wiring connection conductors 13 and 23 and matching impedance. There is an action and an effect that the property becomes good.

  By the way, in the laminated structure for high-frequency signal transmission according to the present invention, the length from the surface signal wiring conductor to the surface signal through conductor in the signal wiring connecting conductor is the inner layer directly above or immediately below the uppermost layer or the lowermost layer. It is preferable that the thickness be equal to or smaller than the thickness of the ground conductor non-formation region (ninth laminated structure for high frequency signal transmission). This is based on the fact that the shorter the length of the signal wiring connecting conductor, the smaller the inductance can be. However, when the length is equal to or less than the thickness of the uppermost dielectric layer or the lowermost dielectric layer, the inductance is negligible. By being maintained.

  Next, FIG. 9 is a diagram showing an example of a tenth laminated structure for high frequency signal transmission according to claim 3 of the present invention, wherein (a) is a plan view and (b) is an AA line of (a). It is sectional drawing.

  9, the same reference numerals are given to the same parts as in FIG. 1, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 13 and 23 are signal wiring connection conductors, and 14 and 24 are surface layers. The signal through conductor, 32 is an inner layer ground conductor, 33 is a signal through conductor connecting conductor, and 34 is an inner layer signal through conductor. Then, on the upper surface or the lower surface of the multilayer substrate 1, 12 surface ground conductors are formed at a predetermined interval with respect to the signal wiring conductor 11 in a state of surrounding the surface signal through conductors 14 and the signal wiring connecting conductors 13, By connecting the surface ground conductor 12 and the inner-layer ground conductor 32 with 15 surface ground through conductors extending vertically, the length of the signal wiring connection conductor is conventionally long, as viewed from the high-frequency signal propagating therethrough. Compared with the case where the high-frequency transmission characteristics deteriorate due to this part acting as an inductance because the distance to the ground is far, the inductance of the signal wiring connection conductor can be reduced, and the coplanar as an input / output line By configuring as a line, when the external wiring is a coplanar line, it is possible to reduce the impedance discontinuity in connection with the external wiring and In order, it can be a good high-frequency transmission characteristics. As a result, a laminated structure for high frequency signal transmission with good high frequency transmission characteristics is obtained.

  FIG. 21 is a view showing an example of an eleventh laminated structure for high-frequency signal transmission according to claim 4 of the present invention, where (a) is a plan view and (b) is a cross-sectional view taken along line AA of (a). It is.

  The laminated structure for high-frequency signal transmission shown in FIG. 21 is such that the entire surface layer ground conductor 12 is connected to the signal wiring from the opposite end of the signal wiring connection conductor 13 to the signal wiring conductor 11 on either the upper or lower surface. It is arranged on the conductor 11 side. According to the configuration shown in FIG. 21, since the surface ground conductor is formed only on both sides of the signal wiring conductor, the propagation mode is stably maintained against the straightness of the electromagnetic wave traveling from the surface layer to the inner layer (or from the inner layer to the surface layer). Since the propagation direction can be stably changed as it is, a laminated structure for high frequency signal wave transmission is obtained in which reflection hardly occurs and impedance matching can be performed satisfactorily.

  Further, the laminated structure for high frequency signal transmission can be applied to a high frequency semiconductor package. That is, a frame body and a lid are formed on the upper surface of the laminated structure so as to accommodate the high-frequency semiconductor element, and signal input / output with the outside is performed on the opposite side of the signal wiring conductor of the signal wiring conductor on the lower surface of the laminated structure. By forming the input / output signal wiring connection conductor, a high-frequency semiconductor package with good high-frequency transmission characteristics is obtained.

  FIG. 22 shows such a high-frequency semiconductor package, which is configured as a high-frequency semiconductor package by providing 41 frames and 42 lids for the first example of the laminated structure for high-frequency signal transmission.

In such a laminated structure for high-frequency signal transmission according to the present invention or a high-frequency semiconductor package using the same, as a dielectric material, for example, ceramic materials such as alumina, mullite, aluminum nitride, so-called glassera (glass + ceramic) materials are widely used. Conductor patterns such as signal wiring conductors and grounding conductors are metal materials for high-frequency wiring conductors, such as Cu, MoMn + Ni + Au, W + Ni + Au, Cr + Cu, Cr + Cu + Ni + Au, Ta ₂ N + NiCr + Au, Ti + Pd + Au, NiCr + Pd + Au, etc. are used for the thick film printing method or various thin film forming methods and plating methods. The thickness and width of the dielectric are set together with the dielectric constant and thickness of the dielectric according to the frequency of the transmitted high-frequency signal and the characteristic impedance used. When using metal for the frame and lid, Fe-Ni alloys such as Fe-Ni-Co and Fe-Ni42 alloys, oxygen-free copper, aluminum, stainless steel, Cu-W alloys, Cu-Mo alloys, etc. It is made of a material that is hermetically sealed for bonding between metal structures by soldering with high melting point metal solder such as solder, AuSn solder or AuGe solder, seam weld (welding), etc. The substrate and the metal structure are joined by a high melting point metal brazing such as AgCu brazing, AuSn brazing, or AuGe brazing to accommodate a semiconductor element, thereby providing a high frequency semiconductor package having good transmission characteristics.

  Next, a specific example of the laminated structure for high frequency signal transmission according to the present invention will be described.

  [Example 1] First, nine dielectric layers 1 having a relative dielectric constant of 9.2 and a thickness of 0.2 mm were laminated in the same configuration as in FIG. 1 showing the first laminated structure for high-frequency signal transmission according to the reference example. The width of the signal wiring conductor 11 is 0.21 mm, the width of the signal wiring connecting conductors 13 and 23 is 0.21 mm, and the distance between the signal wiring conductors 11 and 21 and the surface signal through conductors 14 and 24 is The surface signal through conductors 14 and 24 and the inner layer signal through conductor 34 are formed in a circular shape with a diameter of 0.1 mm, the signal through conductor connecting conductor is rectangular with a width of 0.16 mm, and the inner layer is grounded. The inner-layer ground conductor non-forming region 36 has a circular shape with a diameter of 1.24 mm, and the inner-layer grounding through conductor 35 has a circular shape with a diameter of 0.1 mm, and the center is separated from the outer periphery of the inner-layer ground conductor non-forming region 36 by 0.08 mm. The displacement between the nine layers of the surface signal through conductors 14 and 24 and the inner layer signal through conductor 34 is 0.11 mm each. By shifting the distance between the ends of the surface signal wiring conductors 11 and 21 opposite to the signal wiring connecting conductors 13 and 23 to 2.0 mm when viewed from above, the sample A of the laminated structure for high frequency signal transmission of the reference example is obtained. It was.

  Further, in the same configuration as in FIG. 2 showing the second laminated structure for high-frequency signal transmission according to claim 1 of the present invention, the same as the sample A, except that the surface signal through conductors 14 and 24 and the inner layer By making the deviation between the 9 layers of the signal through conductor 34 from the front side 0.195mm, 0.115mm, 0.075mm, 0.055mm, 0.055mm, 0.075mm, 0.115mm, 0.195mm A structural sample B was obtained.

  When the electrical characteristics between the ends of the signal wiring conductor 21 on the lower surface and the ends of the signal wiring conductor 11 on the upper surface of these samples A and B are extracted by electromagnetic field simulation, a diagram as shown in FIG. A characteristic curve of frequency characteristics was obtained. In FIG. 10, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, A and B added to the characteristic curve indicate that they are characteristic curves of the samples A and B, respectively.

  From this result, it can be seen that Samples A and B have a laminated structure for high-frequency signal transmission that has low reflection at high frequencies and good electrical characteristics. In particular, in the sample B, since the deviation becomes smaller as the inner layer signal through conductor approaches the center of the inner layer ground conductor non-formation region, the impedance discontinuity becomes smaller, and thus the matching is further improved. As a result, it can be seen that it functions as a laminated structure for high-frequency signal transmission having good electrical characteristics with low reflection.

  [Example 2] First, in the same configuration as in FIG. 3 showing the third laminated structure for high frequency signal transmission according to another reference example, similar to the sample A in [Example 1], except that the surface layer signal penetration Samples of the laminated structure for high-frequency signal transmission of another reference example by superimposing the conductors 14 and 24 and the inner layer signal through conductors 34 on top of each other and shifting the shift between the eight layers of the inner layer ground conductor non-forming region 36 by 0.11 mm. C was obtained.

  Further, in the same configuration as in FIG. 4 showing the fourth high-frequency signal transmission laminated structure according to another reference example, the same as the sample C, except that the inner layer ground conductor non-forming region 36 is shifted between the eight layers. Was set to 0.18 mm, 0.14 mm, 0.10 mm, 0.04 mm, 0.10 mm, 0.14 mm, 0.18 mm from the surface side to obtain a sample D of a laminated structure for high-frequency signal transmission of another reference example.

  When the electrical characteristics between the end of the signal wiring conductor 21 on the lower surface and the end of the signal wiring conductor 11 on the upper surface are extracted by electromagnetic field simulation for these samples C and D, as shown in FIG. A characteristic curve of frequency characteristics was obtained. In FIG. 11, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, CD and D added to the characteristic curve indicate that they are characteristic curves of the samples C and D, respectively.

  From this result, it can be seen that Samples C and D have a laminated structure for high-frequency signal transmission that has low reflection at high frequencies and good electrical characteristics. In particular, in the sample D, the discontinuity of the impedance is further reduced in the region where the inner layer ground conductor is not formed because the shift becomes smaller as the center of the inner layer ground conductor non-formed region approaches the inner layer signal through conductor. In addition, as a result of further good matching, it can be seen that it functions as a laminated structure for high frequency signal transmission having good electrical characteristics with low reflection.

  [Example 3] First, in the same configuration as FIG. 5 showing the fifth high-frequency signal transmission laminated structure according to another reference example, the same as sample A in [Example 1], except that the surface layer signal penetration The conductors 14 and 24 and the inner layer signal through conductors 34 are stacked on top of each other, the inner layer ground conductor non-forming region 36 is formed in a rectangular shape, the long side of the rectangle is 1.16 mm, and the short side is extended from the upper surface side. A sample E of a laminated structure for high-frequency signal transmission of another reference example was obtained by sequentially changing the eight layers to 0.76 mm, 0.86 mm, 0.96 mm, 1.06 mm, 1.06 mm, 0.96 mm, 0.86 mm, and 0.76 mm.

  Further, in the same configuration as FIG. 6 showing the sixth high-frequency signal transmission laminated structure according to another reference example, the same as the sample E, except that the rectangular short side of the inner-layer ground conductor non-forming region 36 8 layers from the top side in order of 0.76mm, 0.89mm, 1.00mm, 1.09mm, 1.09mm, 1.00mm, 0.89mm, 0.76mm, so that the laminated structure for high frequency signal transmission of other reference examples Sample F was obtained.

  Then, when the electrical characteristics between the ends of the signal wiring conductor 21 on the lower surface and the ends of the signal wiring conductor 11 on the upper surface are extracted by electromagnetic field simulation for these samples E and F, as shown in FIG. A characteristic curve of frequency characteristics was obtained. In FIG. 12, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, E and F added to the characteristic curve indicate that they are characteristic curves of the samples E and F, respectively.

  From this result, it can be seen that Samples E and F have a laminated structure for high-frequency signal transmission that has low reflection even at high frequencies and has good electrical characteristics. In particular, in the sample F, the change in shape of the inner-layer ground conductor non-forming region becomes smaller as the center of the inner-layer ground conductor non-forming region approaches the inner-layer signal through conductor, thereby reducing impedance discontinuity. Therefore, as a result of further good matching, it can be seen that it functions as a laminated structure for high-frequency signal transmission having good electrical characteristics with low reflection.

  [Example 4] The same structure as that of FIG. 7 showing the seventh laminated structure for high-frequency signal transmission showing another reference example, similar to Sample A of [Example 1], except that the surface signal through conductor 14 , 24 and the inner layer signal through conductor 34 and the circular inner layer ground conductor non-forming region 36 are configured to have the same center, and the inner layer ground conductor non-forming region 36 has a diameter of 0.46 mm at the uppermost layer and the lowermost layer, The other six layers were configured to have a diameter of 1.24 mm, thereby obtaining a sample G having a laminated structure for high-frequency signal transmission according to the present invention.

  When the electrical characteristics between the end of the signal wiring conductor 21 on the lower surface and the end of the signal wiring conductor 11 on the upper surface of this sample G are extracted by electromagnetic field simulation, the frequency characteristics as shown in the diagram of FIG. A characteristic curve was obtained. In FIG. 13, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, G added to the characteristic curve indicates that it is a characteristic curve of the sample G.

  From this result, it can be seen that the sample G has a laminated structure for high-frequency signal transmission that has low reflection even at high frequencies and has good electrical characteristics.

  [Example 5] The same structure as that of FIG. 8 showing the eighth laminated structure for high-frequency signal transmission according to claim 2 of the present invention, as in Sample B of [Example 1], except that the signal wiring connecting conductor By setting the width of 13,23 to 0.30 mm, a sample H having a laminated structure for high frequency signal transmission according to the present invention was obtained.

  When the electrical characteristics between the end of the signal wiring conductor 21 on the lower surface and the end of the signal wiring conductor 11 on the upper surface of this sample H are extracted by electromagnetic field simulation, the frequency characteristics as shown in the diagram of FIG. A characteristic curve was obtained. In FIG. 14, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, B and H added to the characteristic curve indicate the characteristic curves of the sample B and the sample H obtained in [Example 1], respectively.

  From this result, it can be seen that Samples B and H, which are the laminated structure for high-frequency signal transmission according to the present invention, are a laminated structure for high-frequency signal transmission that has low reflection at high frequencies and good electrical characteristics. In particular, the sample H functions as a laminated structure for high-frequency signal transmission having good electrical characteristics with low reflection as a result of being able to perform better matching because impedance discontinuity becomes smaller. I understand.

  [Example 6] First, in the same configuration as in FIG. 1 showing the ninth high-frequency signal transmission laminated structure according to another reference example, the same as Sample A in [Example 1], except that the signal wiring connecting conductor Samples of the laminated structure for high-frequency signal transmission according to the present invention are obtained by shifting the deviation between the nine layers of the surface signal through conductors 14 and 24 and the inner layer signal through conductor 34 by 0.0925 mm each having a length of 13 and 23 of 0.20 mm. I was obtained.

  For comparison, the configuration is the same as that of Sample I, except that the length of the signal wiring connecting conductors 13 and 23 is 0.29 mm, and the deviation between the nine layers of the surface signal through conductors 14 and 24 and the inner layer signal through conductor 34 is as follows. A sample J for comparison was obtained by shifting 0.07 mm.

  Then, when the electrical characteristics between the end of the signal wiring conductor 21 on the lower surface and the end of the signal wiring conductor 11 on the upper surface are extracted by electromagnetic field simulation for these samples I and J, as shown by a diagram in FIG. A characteristic curve of frequency characteristics was obtained. In FIG. 15, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, A, I, and J added to the characteristic curve indicate that they are characteristic curves of Sample A and Sample I and J of [Example 1], respectively.

  From this result, it can be seen that Samples A and I have a laminated structure for high-frequency signal transmission that has low reflection even at high frequencies and has good electrical characteristics. On the other hand, as for the sample J obtained as a comparative example, since the length of the signal wiring connecting conductor becomes too long and the function as an inductance appears strongly, the reflection of high frequency becomes large, resulting in deterioration in electrical characteristics. You can see that it happens. Therefore, the length of the signal wiring connection conductor from the surface signal wiring conductor to the surface signal through conductor is made equal to or less than the thickness of the uppermost layer or the lowermost dielectric layer, thereby reliably reducing the inductance of the signal wiring connection conductor. Therefore, good high frequency transmission characteristics can be obtained with certainty.

  [Example 7] First, similar to FIG. 9 showing the tenth laminated structure for high-frequency signal transmission according to claim 3 of the present invention, like the sample B in [Example 1], except that the laminated substrate On the top surface of 1, the surface grounding conductor 14 and the signal wiring connecting conductor 13 are surrounded, and the shape is matched with the inner layer grounding conductor non-forming region, and the surface grounding is performed with a spacing of 0.10 mm from the signal wiring conductor 11 The conductor 12 is formed, and further, the surface ground conductor 12 and the inner layer ground conductor 32 are connected by the surface layer ground through conductor 15 having a diameter of 0.1 mm penetrating up and down. Sample K was obtained.

  When the electrical characteristics between the end of the signal wiring conductor 21 on the lower surface and the end of the signal wiring conductor 11 on the upper surface are extracted by electromagnetic field simulation for this sample K, the frequency characteristics as shown in the diagram of FIG. A characteristic curve was obtained. In FIG. 16, the horizontal axis indicates the frequency (unit: GHz), the vertical axis indicates the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve indicates the reflection coefficient. The frequency characteristics are shown. Further, K added to the characteristic curve indicates that it is a characteristic curve of the sample K.

  From this result, the sample K, which is the laminated structure for high-frequency signal transmission of the present invention, has low reflection even at high frequencies, has good electrical characteristics, and is configured as a coplanar line as an input / output line. It can be seen that when the wiring is a coplanar line, the impedance discontinuity in connection with the external wiring can be reduced, so that the laminated structure for high-frequency signal transmission has good high-frequency transmission characteristics.

  In addition, the above is an illustration of embodiment of this invention to the last, This invention is not limited to these, A various change and improvement can be added in the range which does not deviate from the summary of this invention.

  For example, in the embodiment of the present invention, the shape of the surface ground conductor non-forming region and the inner layer ground conductor non-forming region is shown as a circular shape or a rectangle, but other two-axis symmetry such as an elliptical shape or an even polygonal shape is used. It is also possible to use a shape.

  In addition, when the surface ground conductor is provided on the upper surface or the lower surface of the multilayer substrate, the main purpose is to form the surface ground conductor as a high-frequency transmission line by forming a predetermined width on both sides of the signal wiring conductor. The high frequency characteristics are excellent even if the signal wiring connection conductor is not surrounded, but the structure having more preferable high frequency transmission characteristics can be obtained by being close to the structure surrounding the signal wiring connection conductor.

It is a figure which shows typically an example of the 1st laminated structure for high frequency signal transmission which concerns on a reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 2nd laminated structure for high frequency signal transmission which concerns on this invention, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 3rd laminated structure for high frequency signal transmission which concerns on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 4th laminated structure for high frequency signal transmission which concerns on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 5th laminated structure for high frequency signal transmission which concerns on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 6th laminated structure for high frequency signal transmission which concerns on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 7th laminated structure for high frequency signal transmission which concerns on another reference example, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 8th laminated structure for high frequency signal transmission which concerns on this invention, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a figure which shows typically an example of the 10th laminated structure for high frequency signal transmission of this invention, (a) is a top view, (b) is the sectional view on the AA line of (a). It is a diagram which shows the high frequency characteristic of the laminated structure for 1st and 2nd high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the laminated structure for 3rd and 4th high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the laminated structure for 5th and 6th high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the 7th laminated structure for high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the laminated structure for 8th high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the 9th laminated structure for high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the laminated structure for 10th high frequency signal transmission. (A) and (b) are the top views and sectional drawings which show the example of the conventional laminated structure for high frequency signal transmission. (A) and (b) are the top views and sectional drawings which show other examples of the conventional laminated structure for high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the example of the conventional laminated structure for high frequency signal transmission. It is a diagram which shows the high frequency characteristic of the other example of the conventional laminated structure for high frequency signal transmission. It is a figure which shows typically an example of the 10th laminated structure for high frequency signal transmission which concerns on this invention, (a) is a top view, (b) is the sectional view on the AA line of (a). It is sectional drawing which shows typically an example of the high frequency semiconductor package using the laminated structure for high frequency signal transmission which concerns on this invention.

Explanation of symbols

1 ... Dielectric layer
11,21 ・ ・ ・ ・ ・ Signal wiring conductor
12,22 ・ ・ ・ ・ ・ Surface ground conductor
13,23 ・ ・ ・ ・ ・ Signal connection conductor
14,24 ... Surface signal through conductor
15,25 ・ ・ ・ ・ ・ Through-surface grounding conductor
16,26 ・ ・ ・ ・ ・ surface ground conductor non-formation area
32 ・ ・ ・ ・ ・ Inner layer ground conductor
33 ・ ・ ・ ・ ・ Signal through conductor connection conductor
34 ・ ・ ・ ・ ・ Inner signal through-conductor
35 ・ ・ ・ ・ ・ Penetration conductor for inner layer grounding
36 ・ ・ ・ ・ ・ Inner layer ground conductor non-formation area
41 ・ ・ ・ ・ ・ Frame
42 ... Lid

Claims (5)

The signal wiring conductors formed on the uppermost layer and the lowermost layer of the multilayer substrate formed by laminating four or more dielectric layers are in a relationship extending in the opposite direction from one end, and one end of each of these signal wiring conductors, The top layer and the lower layer dielectric layer are vertically connected to each other through a signal wiring connecting conductor, and each of the inner layers excluding the uppermost layer and the lowermost layer has a planar shape. An inner-layer ground conductor non-formation area having a circular shape, a rectangular shape, an ellipse shape, or an even polygonal shape and an inner-layer ground conductor are formed, and in the inner-layer ground conductor non-formation area, an inner layer signal that penetrates each layer of the inner layer vertically forming a signal through conductor connection conductor connected to the through conductors, the outer periphery of the inner layer ground conductor non-formation region, the high-frequency signal transmission laminate forming the inner layer ground through conductors passing through each layer of the inner layer in the vertical Structure Said surface layer signal through conductor, together with the signal lines connecting conductor which does not overlap with the inner layer ground conductor immediately below or immediately above is formed so as to extend the signal wiring conductor, so as to approach the end of the signal wiring conductors The inner layer signal through conductors are arranged inside the outer periphery of the inner layer ground conductor non-formation region immediately above or directly below, and the inner layer signal through conductors are sequentially shifted so as to be connected smoothly between the surface layer signal through conductors. In addition, the laminated structure for high-frequency signal transmission, characterized in that the deviation is small as it approaches the center in the vertical direction.   The multilayer structure for high-frequency signal transmission according to claim 1, wherein the width of the signal wiring connection conductor is wider than the width of the signal wiring conductor. The surface layer ground conductor is not formed on either of the upper and lower surfaces of the multilayer substrate and a surface layer ground conductor having a predetermined distance from the signal wiring conductor is formed, and the length of the signal wiring connecting conductor is shortened. 3. The laminated structure for high-frequency signal transmission according to claim 1, wherein a wiring conductor is arranged outside an outer periphery of the surface layer ground conductor non-forming region, and the surface layer ground conductor region surrounds the signal wiring conductor. . A surface layer ground conductor non-formation region and a surface layer ground conductor having a predetermined interval with respect to the signal wiring conductor are formed on either of the upper and lower surfaces of the multilayer substrate, and the length of the signal wiring connection conductor is shortened. A signal wiring conductor is disposed outside the outer periphery of the surface layer ground conductor non-forming region, and the entire surface layer ground conductor is disposed on the signal wiring connection conductor from the end opposite to the signal wiring conductor. The laminated structure for high-frequency signal transmission according to claim 1 or 2 , wherein the laminated structure is disposed on the side of the substrate.   5. A structure in which a high-frequency semiconductor element is accommodated by providing a frame body and a lid on the upper surface of the multilayer substrate provided with the multilayer structure for high-frequency signal transmission according to any one of claims 1 to 4. High frequency semiconductor package.

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