JP4407680B2 - Copper foil with resin, printed wiring board using the same, and manufacturing method thereof - Google Patents

Description

  The present invention relates to a metal foil with resin, a metal-clad laminate, a printed wiring board using the same, and a method for producing the same, and in particular, the metal of a metal-clad laminate in which a metal foil is fixed on an insulating resin composition. The present invention relates to a technique suitable for a printed wiring board on which a conductor circuit is formed by performing pattern electroplating using a foil as a power feeding layer.

  In recent years, there has been an increasing demand for downsizing, weight reduction, and speeding up of electronic devices, and the density of printed wiring boards has been increasing. A method for manufacturing printed wiring boards using a semi-additive method using electroplating has attracted attention. . In this semi-additive method, as disclosed in Patent Document 1, after forming a hole to be an interstitial via hole (hereinafter referred to as IVH) with a laser or the like on a resin surface on which a circuit is to be formed, chemical roughening or plasma treatment is performed. Etc. by forming irregularities of several μm on the resin, applying a Pd catalyst, performing electroless plating of about 1 μm, forming a pattern electroplating resist, forming a circuit by pattern electroplating, and then other than resist and circuit This is a method for removing the power feeding layer existing in the portion, and enables finer wiring formation as compared with the subtractive method with large side etching.

  Further, there is a method of forming a circuit on a metal foil with resin by a semi-additive method. In recent years, in order to reduce the thickness of the metal foil, a peelable type metal foil in which a metal foil having a thickness of 5 μm or less is formed on a supporting metal foil as described in Patent Document 2 and Patent Document 3 is used. It is done. In this method, it is not necessary to perform electroless plating on the surface of the insulating resin composition layer, and a printed wiring board with higher reliability can be produced.

  As described above, when a circuit is formed on a metal foil with a resin by a semi-additive method, the thinner the metal foil is, the more advantageous for fine wiring formation. However, as disclosed in Patent Document 4, the metal foil and the resin cured product are actually used. A roughening layer of several μm is provided on the metal foil to obtain the peel strength, which hinders the thinning of the metal foil. Further, in the semi-additive method, it is necessary to etch away the power feeding layer existing in a portion other than the circuit after electroplating, but due to the unevenness present in the roughened layer, an etching residue that causes a short circuit failure is likely to occur. Furthermore, the unevenness of the roughened layer increases the electrical resistance of the conductor circuit, and thus increases transmission loss. It is known that this increase in electrical resistance becomes more pronounced as the signal becomes higher in frequency. Further, if the metal foil has a roughened layer, excessive etching is required at the time of forming the conductor circuit, and the conductor top width becomes narrower than the bottom width, so that a good circuit formation cannot be obtained.

In order to solve the above problems, Patent Document 5 discloses that a copper foil that has not been subjected to a roughening treatment and a peroxide curable resin composition that serves as an insulating layer are a silane coupling agent or a thiol-based coupling. A copper-clad laminate laminated via an adhesive base made of an agent is disclosed. According to this, the above-described various problems caused by roughening the metal foil can be solved without reducing the peel strength between the copper foil and the insulating layer.
JP-A-11-186716 Japanese Patent Laid-Open No. 13-140090 Japanese Patent Laid-Open No. 13-89892 Japanese Patent No. 2927968 JP-A-8-309918

  However, in the above method, it is essential to use a peroxide curable resin as an insulating layer, and in that case, the reliability of a printed wiring board manufactured using a copper clad laminate including the same is reduced. There is a fear. In addition, since the peroxide curable resin itself is a highly dangerous substance, it is very difficult to handle and store, and moreover, it is more expensive than a generally used insulating resin. It's not the right one.

  The present invention is a metal-clad laminate that achieves both the adhesion and flatness of the interface between the insulating resin composition layer and the metal foil, and also satisfies practical elements relating to the production of printed wiring boards such as economy and handling properties. An object of the present invention is to provide a metal foil with a plate or a resin, and furthermore, using the metal-clad laminate or the metal foil with a resin, the printed wiring board having excellent reliability and circuit forming property and extremely low conductor loss, and its manufacture It aims to provide a method.

  That is, the present invention relates to the following descriptions (1) to (40).

  (1) In a metal foil with a resin having an insulating resin composition layer and a metal foil fixed to one or both surfaces of the insulating resin composition layer, at least the insulating resin composition layer side of the metal foil is surface-treated. A metal foil with resin, characterized in that both surfaces of the metal foil are substantially roughened and not treated.

  (2) The metal foil with resin as described in (1) above, wherein the surface roughness (Rz) of the metal foil is 2.0 μm or less on both sides.

  (3) The metal foil with a resin as described in (1) or (2) above, wherein the thickness of the metal foil is 3 μm or less.

  (4) The resin-coated metal foil according to any one of (1) to (3) above, wherein the interface roughness (Rz) between the insulating resin composition layer and the metal foil is 2.0 μm or less.

  (5) The resin-coated metal foil according to any one of (1) to (4) above, wherein the surface treatment is any one of rust prevention treatment, chromate treatment, silane coupling treatment, or a combination thereof. .

  (6) The resin-coated metal foil according to (5), wherein the antirust treatment is performed using any one of nickel, tin, zinc, chromium, molybdenum, cobalt, or an alloy thereof.

  (7) The metal foil with a resin according to the above (5) or (6), wherein the insulating resin composition contains a cyanate resin, and the rust prevention treatment is performed with a metal mainly composed of nickel. .

  (8) The resin-coated metal foil according to any one of claims (5) to (7), wherein a chromate treatment is performed on the rust-proofing treatment.

  (9) The resin-coated metal foil according to any one of the above (5) to (8), wherein the silane coupling treatment is applied to the outermost layer of the metal foil.

  (10) The resin-coated metal foil according to any one of (5) to (9) above, wherein the silane coupling agent used for the silane coupling treatment chemically reacts with the insulating resin composition by heating. .

  (11) The insulating resin composition contains an epoxy resin, and the silane coupling agent used for the silane coupling treatment contains an amino-functional silane. (5)-(10) Metal foil with resin.

  (12) The resin-coated metal foil according to any one of (1) to (11), wherein the insulating resin composition contains a thermosetting resin.

  (13) The resin-coated metal foil according to any one of (1) to (12) above, wherein the insulating resin composition contains an epoxy resin that is liquid at normal temperature.

  (14) The resin-coated metal foil according to any one of (1) to (13), wherein the insulating resin composition contains a latent curing agent.

  (15) The insulating resin composition after curing has a relative dielectric constant at 1 GHz of 3.0 or less or a dielectric loss tangent of 0.01 or less, according to any one of (1) to (14) above Metal foil with resin.

  (16) In a metal-clad laminate having an insulating resin composition layer and a metal foil fixed to one or both surfaces of the insulating resin composition layer, at least the insulating resin composition layer side of the metal foil is surface-treated. The metal-clad laminate is characterized in that both surfaces of the metal foil are substantially roughened and not treated.

  (17) The metal-clad laminate as described in (16) above, wherein the surface roughness (Rz) of the metal foil is 2.0 μm or less on both sides.

  (18) The metal-clad laminate as described in (16) or (17) above, wherein the thickness of the metal foil is 3 μm or less.

  (19) The metal-clad laminate according to any one of (16) to (18) above, wherein the interface roughness (Rz) between the insulating resin composition layer and the metal foil is 2.0 μm or less.

  (20) The metal-clad laminate according to any one of (16) to (19) above, wherein the surface treatment is any one of rust prevention treatment, chromate treatment, silane coupling treatment, or a combination thereof. .

  (21) The metal-clad laminate as described in (20) above, wherein the rust-proofing treatment is performed using any of nickel, tin, zinc, chromium, molybdenum, cobalt, or an alloy thereof.

  (22) The metal-clad laminate as described in (20) or (21) above, wherein the insulating resin composition contains a cyanate resin, and the rust prevention treatment is performed with a metal containing nickel as a main component. .

  (23) The metal-clad laminate as described in any one of (20) to (22) above, wherein a chromate treatment is performed on the rust prevention treatment.

  (24) The metal-clad laminate according to any one of (20) to (23), wherein the silane coupling treatment is applied to the outermost layer of the metal foil.

  (25) The metal-clad laminate according to any one of (20) to (24), wherein the silane coupling agent used for the silane coupling treatment is a chemical reaction with the insulating resin composition by heating.

  (26) The insulating resin composition contains an epoxy resin, and the silane coupling agent used for the silane coupling treatment contains an amino-functional silane. Metal-clad laminate.

  (27) The metal-clad laminate as described in any one of (16) to (26) above, wherein the insulating resin composition contains a thermosetting resin.

  (28) The metal-clad laminate as described in any one of (16) to (27) above, wherein the insulating resin composition contains an epoxy resin that is liquid at normal temperature.

  (29) The metal-clad laminate according to any one of (16) to (28), wherein the insulating resin composition contains a latent curing agent.

  (30) The metal according to any one of (16) to (29), wherein the cured dielectric resin composition has a relative dielectric constant at 1 GHz of 3.0 or less or a dielectric loss tangent of 0.01 or less. Tension laminate.

  (31) It is manufactured using the metal foil with a resin according to any one of the above (1) to (15) and / or the metal-clad laminate according to any one of the above (16) to (30). Characteristic printed wiring board.

  (32) The printed wiring board according to the above (31), wherein the surface roughness (Rz) of the conductor circuit is 2.0 μm or less.

  (33) The printed wiring board as described in (31) or (32) above, wherein the peel strength between the insulating resin composition layer and the 1 mm-width conductor circuit is 0.6 kN / m or more.

  (34) The peeling strength between the insulating resin composition layer after heating at 150 ° C. for 240 hours and the 1 mm width conductor circuit is 0.4 kN / m or more, (31) to (33) The printed wiring board in any one.

  (35) The metal foil with resin according to any one of (1) to (15) and / or the metal foil of the metal-clad laminate according to any one of (16) to (30) above is used as a power feeding layer. A method for producing a printed wiring board, comprising a step of producing a conductor circuit by pattern electroplating.

  (36) The method for producing a printed wiring board according to (35), wherein an electroless plating layer is formed on the metal foil.

  (37) The printed wiring board according to the above (35) or (36), wherein an etching solution that is controlled by a chemical reaction is used when the metal foil as the power feeding layer is removed by etching after the conductor circuit is formed. Method.

  (38) The method for producing a printed wiring board according to (37), wherein the etching solution contains an acid not containing a halogen element and hydrogen peroxide as main components.

  (39) The method for producing a printed wiring board according to the above (38), wherein the acid containing no halogen element is sulfuric acid.

  (40) The method for producing a printed wiring board according to (39), wherein the concentration of sulfuric acid is 5 to 300 g / L, and the concentration of hydrogen peroxide is 5 to 200 g / L.

  As described above, according to the present invention, practical factors related to the production of a printed wiring board such as economy and handleability, which are compatible with the adhesion and flatness of the interface between the insulating resin composition layer and the metal foil, are achieved. In addition, it is possible to provide a metal-clad laminate or a resin-coated metal foil that satisfies the above requirements. It is possible to provide a small number of printed wiring boards and a manufacturing method thereof.

  Hereinafter, the metal-clad laminate of the present invention will be described in detail.

  As shown in FIG. 1A, for example, the metal-clad laminate of the present invention is a metal-clad laminate in which metal foils 2 that are substantially roughened and not treated on both sides of a prepreg 1 are laminated and integrated. It is a laminated board.

  The prepreg is obtained by impregnating or coating a base material with a varnish of an insulating resin composition. As the base material, well-known materials used for various laminates for electrical insulating materials can be used. Examples of the material of the substrate include inorganic fibers such as E glass, D glass, S glass, and Q glass, organic fibers such as polyimide, polyester, and tetrafluoroethylene, and mixtures thereof. These base materials have shapes such as woven fabric, non-woven fabric, low-ink, chopped strand mat, surfacing mat, etc., and the material and shape are selected depending on the intended use and performance of the molded product, and may be single or 2 as required. It can be used from more than a variety of materials and shapes. There is no particular limitation on the thickness of the base material, but usually about 0.03 to 0.5 mm is used, and the surface treated with a silane coupling agent or the like or mechanically opened is heat resistant. From the viewpoint of properties, moisture resistance, and workability. Moreover, the prepreg is usually impregnated or coated with a resin so that the resin content thereof is 20 to 90% by weight after drying, and is heated and dried at a temperature of 100 to 200 ° C. for 1 to 30 minutes. A semi-cured state (B stage state) can be obtained. Furthermore, a metal-clad laminate as in the present application can be obtained by laminating 1 to 20 sheets of this prepreg and laminating them by heating and pressing in a configuration in which metal foils are arranged on both sides thereof. The thickness of the plurality of prepreg layers varies depending on the application, but a thickness of 0.1 to 5 mm is usually preferable. As a laminating method, a normal laminating method can be applied, for example, using a multistage press, a multistage vacuum press, continuous molding, an autoclave molding machine, etc., usually at a temperature of 100 to 250 ° C., a pressure of 0.2 to 10 MPa, and a heating time. Lamination can be performed for 0.1 to 5 hours, or lamination can be performed using a vacuum laminator or the like under conditions of lamination conditions of 50 to 150 ° C., 0.1 to 5 MPa, and vacuum pressure of 1.0 to 760 mmHg.

  As the insulating resin used in the insulating resin composition of the present invention, a well-known and commonly used insulating resin used as an insulating material for a printed wiring board can be used. Usually, thermosetting with good heat resistance and chemical resistance. Resin is used as a base. Examples of the thermosetting resin include, but are not limited to, a phenol resin, an epoxy resin, a cyanate resin, a maleimide resin, an isocyanate resin, a benzocyclobutene resin, and a vinyl resin. One type of thermosetting resin may be used alone, or two or more types may be mixed and used.

Among the above thermosetting resins, epoxy resins are particularly important because they are widely used as insulating resins because they are excellent in heat resistance, chemical resistance and electrical properties and are relatively inexpensive. Epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, and other bisphenol type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, and bisphenol A novolak type epoxy resins. Type epoxy resin, cycloaliphatic epoxy resin, aliphatic chain epoxy resin, diglycidyl etherified product of biphenol, diglycidyl etherified product of naphthalenediol, diglycidyl etherified product of phenol, diglycidyl etherified product of alcohol, and the like And alkyl-substituted products, halides, hydrogenated products, and the like. One type of epoxy resin may be used alone, or two or more types may be mixed and used. The curing agent used together with the epoxy resin can be used without limitation as long as it cures the epoxy resin. For example, polyfunctional phenols, polyfunctional alcohols, amines, imidazole compounds, acid anhydrides, organic There are phosphorus compounds and their halides. These epoxy resin curing agents may be used alone or in combination of two or more.

The cyanate resin is a resin that generates a cured product having a triazine ring as a repeating unit by heating, and the cured product is excellent in dielectric characteristics, and is often used particularly when high-frequency characteristics are required. Examples of the cyanate resin include 2,2-bis (4-cyanatophenyl) propane, bis (4-cyanatophenyl) ethane, and 2,2-bis (3,5-dimethyl-4-cyanatophenyl) methane. 2,2-bis (4-cyanatophenyl) -1,1,1,3,3,3-hexafluoropropane, α, α′-bis (4-cyanatophenyl) -m-diisopropylbenzene, phenol And cyanate esterified products of novolak and alkylphenol novolak. Among them, 2,2-bis (4-cyanatophenyl) propane is preferable because it has a particularly good balance between the dielectric properties and curability of the cured product and is inexpensive. As the cyanate resin used here, one kind may be used alone, two or more kinds may be mixed and used, or a part may be oligomerized in advance to a trimer or a pentamer. I do not care.

  Furthermore, a curing catalyst or a curing accelerator may be added to the cyanate resin. As the curing catalyst, metals such as manganese, iron, cobalt, nickel, copper, and zinc are used. Specifically, organic metal salts such as 2-ethylhexanoate, naphthenate, octylate, and acetylacetone are used. Used as organometallic complexes such as complexes. These may be used alone or in combination of two or more. Phenols are preferably used as the curing accelerator, and monofunctional phenols such as nonylphenol and paracumylphenol, bifunctional phenols such as bisphenol A, bisphenol F, and bisphenol S, or polyfunctional phenols such as phenol novolac and cresol novolac. Etc. can be used. These may be used alone or in combination of two or more.

  The insulating resin composition used in the present invention may be blended with a thermoplastic resin in consideration of dielectric properties, impact resistance, film processability, and the like. Examples of the thermoplastic resin include, but are not limited to, fluororesin, polyphenylene ether, modified polyphenylene ether, polyphenylene sulfide, polycarbonate, polyether imide, polyether ether ketone, polyarylate, polyamide, polyamide imide, and polybutadiene. I don't mean. One type of thermoplastic resin may be used alone, or two or more types may be mixed and used.

  Of the above thermoplastic resins, blending polyphenylene ether and modified polyphenylene ether is useful because it improves the dielectric properties of the cured product. Examples of polyphenylene ether and modified polyphenylene ether include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2,6-dimethyl-1,4-phenylene) ether and polystyrene alloyed polymer, poly Alloyed polymer of (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene copolymer, Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-maleic anhydride copolymer Alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and polyamide, alloyed polymer of poly (2,6-dimethyl-1,4-phenylene) ether and styrene-butadiene-acrylonitrile copolymer, etc. Is mentioned. In addition, in order to impart reactivity and polymerizability to polyphenylene ether, functional groups such as amino groups, epoxy groups, carboxyl groups, styryl groups, and methacryl groups are introduced at the ends of polymer chains, or amino groups are introduced into the side chains of polymer chains. In addition, a functional group such as an epoxy group, a carboxyl group, a styryl group, or a methacryl group may be introduced.

  Among the above thermoplastic resins, the polyamideimide resin is useful because it has excellent heat resistance and moisture resistance and has good adhesion to metals. Among the raw materials of polyamideimide, trimellitic anhydride and trimellitic anhydride monochloride are used as acid components, and metaphenylenediamine, paraphenylenediamine, 4,4′-diaminodiphenyl ether, 4,4′- as amine components. Examples include, but are not limited to, diaminodiphenylmethane, bis [4- (aminophenoxy) phenyl] sulfone, 2,2′-bis [4- (4-aminophenoxy) phenyl] propane, and the like. In order to improve drying property, it may be modified with siloxane. In this case, siloxane diamine is used as the amino component. In consideration of film processability, it is preferable to use a molecular weight of 50,000 or more.

  The insulating resin composition used in the present invention may be mixed with an inorganic filler. Examples of the inorganic filler include alumina, aluminum hydroxide, magnesium hydroxide, clay, talc, antimony trioxide, antimony pentoxide, zinc oxide, fused silica, glass powder, quartz powder, and shirasu balloon. These inorganic fillers may be used alone or in combination of two or more.

The insulating resin composition used in the present invention may contain an organic solvent. Examples of the organic solvent include aromatic hydrocarbon solvents such as benzene, toluene, xylene, and trimethylbenzene; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; ether solvents such as tetrahydrofuran; isopropanol, butanol Alcohol solvents such as 2-etherethanol solvents such as 2-methoxyethanol and 2-butoxyethanol; amide solvents such as N-methylpyrrolidone, N, N-dimethylformamide, and N, N-dimethylacetamide. These may be used alone or in combination of two or more. It is preferable that the amount of the solvent in the varnish of the insulating resin composition used for producing a prepreg is in the range of 40 to 80% by weight. Moreover, it is preferable that the viscosity at 25 degreeC of an insulating resin composition varnish shall be the range of 20-100 cP.

  A flame retardant may be mixed in the insulating resin composition used in the present invention. Examples of the flame retardant include bromine compounds such as decabromodiphenyl ether, tetrabromobisphenol A, tetrabromophthalic anhydride, tribromophenol, triphenyl phosphate, tricresyl phosphate, trixyl phosphate, cresyl diphenyl phosphate Phosphorus compounds such as metal hydroxides such as magnesium hydroxide and aluminum hydroxide, red phosphorus and its modified products, antimony compounds such as antimony trioxide and antimony pentoxide, triazine compounds such as melamine, cyanuric acid and melamine cyanurate A known and customary flame retardant can be used.

  The insulating resin composition used in the present invention may further contain various additives and fillers such as a curing agent, a curing accelerator, thermoplastic particles, a colorant, an ultraviolet opaquer, an antioxidant, and a reducing agent as necessary. Can be added.

  In addition, when the insulating resin composition of the present invention has a dielectric constant at 1 GHz after curing of 3.0 or less or a dielectric loss tangent of 0.01 or less, it is possible to reduce dielectric loss in the wiring. A circuit with even smaller transmission loss can be formed. Examples of such resins having excellent dielectric properties include polyphenylene ether resins and cyanate resins. When polyphenylene ether is used as a wiring board material, it is necessary to impart thermosetting properties in order to improve heat resistance and chemical resistance. For example, polyphenylene ether may be epoxy resin, cyanate resin, triazine-bismaleimide. There are a method of blending a thermosetting resin such as a resin and a method of introducing a polymerizable functional group such as a double bond or an epoxy group into the molecular chain of polyphenylene ether.

  The metal foil used in the present invention is roughened by the formation, oxidation treatment, reduction treatment, etching, or the like of a hump-shaped electrodeposit layer (referred to as commonly used glazing: Japanese Patent Publication No. 8-21618) on the surface thereof. The treatment is not substantially applied. Here, the term “substantially” means that a conventional metal foil roughened to such an extent that a sufficient peel strength cannot be obtained can be used. Use metal foil that has not been applied. Therefore, as for the surface roughness of the metal foil used in the present invention, the 10-point average roughness (Rz) shown in JIS B0601 is preferably 2.0 μm or less on both sides, more preferably 1.5 μm or less. It is particularly preferable that the thickness is 0.0 μm or less.

Moreover, as metal foil used for this invention, although copper foil, nickel foil, aluminum foil, etc. can be used, normally copper foil is used, for example. The method for producing the copper foil used in the present invention is not particularly limited. For example, when producing a peelable type copper foil having a carrier, a metal oxide or a release layer on a carrier foil having a thickness of 10 to 50 μm or If an organic layer is formed and a copper sulfate bath is formed thereon, sulfuric acid 50-100 g / L, copper 30-100 g / L, liquid temperature 20 ° C.-80 ° C., current density 0.5-100 A / dm ² In the case of a copper pyrophosphate bath, it is produced under the conditions of potassium pyrophosphate 100-700 g / L, copper 10-50 g / L, liquid temperature 30 ° C.-60 ° C., pH 8-12, current density 1-10 A / dm ^2. Various additives may be added in consideration of the physical properties and smoothness of the copper foil. Note that the peelable type metal foil is a metal foil having a carrier and is a metal foil that can be peeled off by the carrier.

  The thickness of the metal foil used in the present invention is not particularly limited, but is preferably 3 μm or less. When using a peelable type metal foil having a carrier, the metal foil is preferably 3 μm or less after peeling off the carrier. When such a metal foil is used for the power feeding layer, it is possible to obtain a wire having good wiring formability as will be described later.

  In addition, at least the insulating resin composition layer side of the metal foil used in the present invention is subjected to a surface treatment in order to bring the adhesion between the metal foil and the insulating resin composition layer to a practical level or higher. Examples of the surface treatment on the metal foil include rust prevention treatment, chromate treatment, silane coupling treatment, or a combination thereof. What kind of surface treatment is performed depends on the insulating resin composition layer. It is preferable to examine appropriately according to the resin system used in the above.

The rust prevention treatment is performed by forming a thin film on a metal foil by sputtering, electroplating, or electroless plating, for example, any one of metals such as nickel, tin, zinc, chromium, molybdenum, and cobalt, or an alloy thereof. Can be applied. From the viewpoint of cost, electroplating is preferable. In order to facilitate the precipitation of metal ions, a complexing agent such as citrate, tartrate or sulfamic acid can be added in the required amount. The plating solution is usually used in an acidic region and is performed at a temperature of room temperature to 80 ° C. The plating is appropriately selected from a range of usually a current density of 0.1 to 10 A / dm ² and a current application time of 1 to 60 seconds, preferably 1 to 30 seconds. The amount of the rust-proofing metal varies depending on the type of metal, but is preferably 10 to 2000 μg / dm ^{2 in} total. If the rust preventive treatment is too thick, it may cause etching inhibition and deterioration of electrical characteristics, and if it is too thin, it may cause a reduction in peel strength with the resin.

  Moreover, when cyanate resin is included in an insulating resin composition, it is preferable that the antirust process is performed with the metal containing nickel. This combination is useful in that there is little reduction in peel strength in the heat resistance deterioration test and moisture resistance deterioration test.

As the chromate treatment, an aqueous solution containing hexavalent chromium ions is preferably used. The chromate treatment can be performed by a simple immersion treatment, but is preferably performed by a cathode treatment. Sodium dichromate 0.1-50 g / L, pH 1-13, bath temperature 0-60 ° C., current density 0.1-5 A / dm ² , electrolysis time 0.1-100 seconds are preferable. . It can also carry out using chromic acid or potassium dichromate instead of sodium dichromate. Moreover, it is preferable to perform the said chromate process on the said antirust process, and this can improve the adhesiveness of an insulating resin composition layer and metal foil more.

Examples of the silane coupling agent used for the silane coupling treatment include epoxy-functional silanes such as 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and 3-amino. Amino-functional silanes such as propyltrimethoxysilane, N-2- (aminoethyl) 3-aminopropyltrimethoxysilane, N-2- (aminoethyl) 3-aminopropylmethyldimethoxysilane, vinyltrimethoxysilane, vinylphenyl Olefin functional silanes such as trimethoxysilane and vinyltris (2-methoxyethoxy) silane, acrylic functional silanes such as 3-acryloxypropyltrimethoxysilane, and methacrylic functional silanes such as 3-methacryloxypropyltrimethoxysilane, 3 −Me And mercapto-functional silanes such as mercaptopropyltrimethoxysilane is used. These may be used alone or in combination. These coupling agents are dissolved in a solvent such as water at a concentration of 0.1 to 15 g / L and applied to a metal foil at a temperature of room temperature to 50 ° C. or electrodeposited to be adsorbed. These silane coupling agents form a film by condensation bonding with the hydroxyl group of the rust-proofing metal on the surface of the metal foil. After the silane coupling treatment, a stable bond is formed by heating, ultraviolet irradiation or the like. If it is heating, it is dried at a temperature of 100 to 200 ° C. for 2 to 60 seconds. In the case of ultraviolet irradiation, it is performed in the range of 200 to 400 nm and 200 to 2500 mJ / cm ² . The silane coupling treatment is preferably performed on the outermost layer of the metal foil.

  Moreover, as a silane coupling agent used for a silane coupling process, it is preferable that it reacts with the said insulating resin composition preferably by heating at 60-200 degreeC, More preferably, 80-150 degreeC. According to this, the functional group in the insulating resin composition and the functional group of the silane coupling agent chemically react, and it becomes possible to obtain better adhesion. For example, it is preferable to use a silane coupling agent containing an amino-functional silane for an insulating resin composition containing an epoxy group. This is because the epoxy group and amino group easily form a strong chemical bond by heat, and this bond is extremely stable against heat and moisture. As a combination for forming a chemical bond in this manner, epoxy group-amino group, epoxy group-epoxy group, epoxy group-mercapto group, epoxy group-hydroxyl group, epoxy group-carboxyl group, epoxy group-cyanato group, amino group-hydroxyl group , Amino group-carboxyl group, amino group-cyanato group and the like.

  Further, as the insulating resin of the insulating resin composition used in the present invention, it is preferable to use an epoxy resin that is liquid at room temperature.In this case, since the viscosity at the time of melting is greatly reduced, the wettability at the adhesion interface is improved, A chemical reaction between the epoxy resin and the silane coupling agent easily occurs, and as a result, a strong peel strength is obtained. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and phenol novolac type epoxy resin having an epoxy equivalent of about 200 are preferable.

  Moreover, when the insulating resin composition contains a curing agent, it is particularly preferable to use a thermosetting latent curing agent as the curing agent. That is, when the functional group in the insulating resin composition and the functional group of the silane coupling agent chemically react, the reaction temperature of the functional group in the insulating resin composition and the functional group of the silane coupling agent is the same as that of the insulating resin composition. It is preferable to select the curing agent so that it is lower than the temperature at which the curing reaction is initiated. Thereby, the reaction of the functional group in the insulating resin composition and the functional group of the silane coupling agent is preferentially and selectively performed, and the adhesion between the metal foil and the insulating resin composition becomes higher. Thermosetting latent curing agents for insulating resin compositions containing epoxy resins include solid dispersion-heat-dissolving curing agents such as dicyandiamide, dihydrazide compounds, imidazole compounds, amine-epoxy adducts, urea compounds, onium salts, boron tri Examples thereof include reactive group block type curing agents such as chloride / amine salts and block carboxylic acid compounds.

  By laminating and integrating the prepreg containing the insulating resin composition as described above and the metal foil whose surface is not substantially roughened and subjected to the surface treatment by the above-described method. The metal-clad laminate of the present invention as shown in FIG. 1 (a) can be obtained.

  Moreover, the metal foil with resin of this invention can be obtained by apply | coating the varnish of the above insulating resin compositions on the above metal foil, heating, and drying. As a coating method, for example, a kiss coater, a roll coater, a comma coater, or the like can be used. The heating and drying conditions are preferably 100 to 200 ° C. for 1 to 30 minutes, and after heating and drying The amount of residual solvent in the insulating resin composition is preferably about 0.2 to 10%. In addition, the amount of solvent in the insulating resin composition varnish when forming a metal foil with resin is preferably in the range of 30 to 70% by weight, and the viscosity of the varnish at 25 ° C. is in the range of 100 to 500 cP. preferable. Moreover, a film-like insulating resin composition can be laminated on a metal foil to obtain a metal foil with a resin of the present invention. In that case, the resin film is formed under conditions of 50 to 150 ° C. and 0.1 to 5 MPa. It is appropriate to laminate on a metal foil.

  Further, the interface roughness (Rz) between the metal-clad laminate of the present invention or the insulating resin composition layer of the metal foil with resin and the metal foil is preferably 2.0 or less, and preferably 1.5 μm or less. More preferred. In the present invention, the interface roughness between the insulating resin composition layer and the metal foil refers to the roughness of the resin surface that appears after etching the conductor metal of the metal-clad laminate, the resin-attached metal foil, or the printed wiring board. It is a numerical value measured based on B-0601.

  Next, an example of a method for producing a printed wiring board using the metal-clad laminate of the present invention obtained as described above will be described.

First, through-holes 3 for interlayer connection are formed in the metal-clad laminate of FIG. 1A, and catalyst nuclei are provided on the metal foil 2 and inside the through-holes 3. (FIG. 1 (b)). If the through hole diameter is 100 μm or more, processing by a drill is suitable, and if the through hole diameter is 100 μm or less, a gas laser such as CO ₂ , CO, or excimer, or a solid laser such as YAG is suitable. In addition, noble metal ions or palladium colloids are used for imparting catalyst nuclei.

  Next, as shown in FIG. 1C, a thin electroless plating layer 4 is formed on the metal foil 2 provided with catalyst nuclei and in the through hole 3. For this electroless plating, commercially available electroless copper plating such as CUST2000 (manufactured by Hitachi Chemical Co., Ltd., trade name) or CUST201 (product name of Hitachi Chemical Co., Ltd.) can be used. These electroless copper platings are mainly composed of copper sulfate, formalin, complexing agent and sodium hydroxide. The thickness of the plating is not limited as long as the next electroplating can be performed, and about 0.1 to 1 μm is sufficient.

  Next, as shown in FIG. 1D, electroless plating is performed and a plating resist 5 is formed. The thickness of the plating resist is preferably set to a thickness that is about the same as or thicker than the conductor to be subsequently plated. Resins that can be used for plating resist include liquid resists such as PMER P-LA900PM (trade name, manufactured by Tokyo Ohka Co., Ltd.), HW-425 (trade name, Hitachi Chemical Co., Ltd.), RY-3025 (Hitachi Chemical). There are dry films such as Kogyo Co., Ltd. (trade name). A plating resist is not formed on the via hole and the portion to be a conductor circuit.

  Next, as shown in FIG. 1E, a circuit pattern 6 is formed by electroplating. For the electroplating, copper sulfate electroplating usually used for printed wiring boards can be used. The plating thickness may be used as a circuit conductor, and is preferably in the range of 1 to 100 μm, and more preferably in the range of 5 to 50 μm.

  Next, the resist is stripped using an alkaline stripping solution, sulfuric acid or a commercially available resist stripping solution, and copper other than the pattern portion is removed by etching (FIG. 1 (f)). The etching solution used in the present invention is not particularly limited. However, when a conventional diffusion-controlled etching solution is used, the circuit forming properties tend to deteriorate because the exchange of the solution is inevitably worsened for fine portions of the wiring. There is. Therefore, it is desirable to use an etching solution of a type in which the reaction between copper and the etching solution proceeds not at a diffusion rate but at a reaction rate. If the reaction between copper and the etchant is reaction-controlled, the etching rate does not change even if diffusion is further increased. That is, there is no difference in etching rate between a place where the liquid exchange is good and a place where the liquid exchange is bad. As such a reaction-limited etching solution, for example, one containing hydrogen peroxide and an acid not containing a halogen element as main components can be mentioned. Since hydrogen peroxide is used as the oxidizing agent, strict etching rate control becomes possible by managing the concentration. If a halogen element is mixed in the etching solution, the dissolution reaction tends to be diffusion-limited. As the acid not containing halogen, nitric acid, sulfuric acid, organic acid, and the like can be used, but sulfuric acid is preferable because it is inexpensive. Furthermore, when sulfuric acid and hydrogen peroxide are the main components, the respective concentrations are preferably 5 to 300 g / L and 5 to 200 g / L from the viewpoints of etching rate and liquid stability.

  Next, using FIG. 1 (f) as an inner circuit board, a single-sided metal-clad laminate or a metal foil with resin is laminated on both sides thereof (FIG. 1 (g)). The single-sided metal-clad laminate or resin-attached metal foil used here is preferably the same as the metal-clad laminate or resin-attached metal foil of the present invention described above. In addition, here, the thickness of the insulating layer 7 is preferably 10 to 100 μm, and more preferably 20 to 60 μm. Furthermore, the thickness of the metal foil 8 is preferably 0.3 to 3 μm.

Next, as shown in FIG. 1 (h), IVH9 is formed on the insulating layer 7 from above the metal foil 8, and then the resin residue inside is removed. As a method of forming IVH, it is preferable to use a laser. Examples of the laser that can be used here include gas lasers such as CO ₂ , CO, and excimer, and solid lasers such as YAG. Since a CO ₂ laser can easily obtain a large output, it is suitable for processing IVH of φ50 μm or more. When processing a fine IVH of φ50 μm or less, a YAG laser with a shorter wavelength and good condensing property is suitable. Moreover, as an oxidizing agent used for removal of a resin residue, oxidizing agents, such as a permanganate, chromate, chromic acid, are mentioned, for example.

  Next, catalyst nuclei are provided on the metal foil 8 and inside the IVH 9, and a thin electroless plating layer 10 is formed on the metal foil 8 and inside the IVH 9. Noble metal ions or palladium colloids can be used for imparting catalyst nuclei. For electroless plating, commercially available electroless copper plating such as CUST2000 (manufactured by Hitachi Chemical Co., Ltd., trade name) or CUST201 (product name of Hitachi Chemical Co., Ltd.) can be used. These electroless copper platings are mainly composed of copper sulfate, formalin, complexing agent and sodium hydroxide. The thickness of the plating is not limited as long as the next electroplating can be performed, and about 0.1 to 1 μm is sufficient.

  Next, a plating resist 11 is formed on the electroless plating layer 10 as shown in FIG. The thickness of the plating resist is preferably set to a thickness that is about the same as or thicker than the conductor to be subsequently plated. Resins that can be used for plating resist include liquid resists such as PMER P-LA900PM (trade name, manufactured by Tokyo Ohka Co., Ltd.), HW-425 (trade name, Hitachi Chemical Co., Ltd.), RY-3025 (Hitachi Chemical). There are dry films such as Kogyo Co., Ltd. (trade name). A plating resist is not formed on the via hole and the portion to be a conductor circuit.

  Next, as shown in FIG. 1 (k), a conductor circuit pattern 12 is formed by electroplating. For the electroplating, copper sulfate electroplating usually used for printed wiring boards can be used. The plating thickness may be used as a circuit conductor, and is preferably in the range of 1 to 100 μm, and more preferably in the range of 5 to 50 μm.

  Next, the resist is stripped using an alkaline stripping solution, sulfuric acid, or a commercially available resist stripping solution, and copper is formed by removing the copper other than the conductor circuit pattern portion with the above-described etching solution, which is preferably reaction-controlled. Perform (FIG. 1 (l)).

  Further, gold plating can be performed on the conductor circuit of the substrate shown in FIG. The gold plating method may be a conventionally known method, and is not particularly limited. For example, the conductor interface activation treatment is performed with an activation treatment solution such as SA-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.). And electroless nickel plating such as NIPS-100 (manufactured by Hitachi Chemical Co., Ltd., trade name) to about 1 to 10 μm, and substitution gold plating such as HGS-100 (trade name, manufactured by Hitachi Chemical Co., Ltd.) There is a method of performing electroless gold plating such as HGS-2000 (manufactured by Hitachi Chemical Co., Ltd., trade name) for about 0.1 to 1 μm after performing about 0.01 to 0.1 μm.

  As described above, by using the metal-clad laminate of the present invention, and optionally using a metal foil with a resin, a printed wiring board having excellent reliability and circuit forming property and having very little conductor loss and a method for producing the same Can be provided. Of course, it is also possible to manufacture the printed wiring board of this invention using only metal foil with resin. Moreover, since the adhesiveness between the insulating resin composition layer and the metal foil serving as the conductor circuit also satisfies a practically sufficient value, there are few defects due to line peeling in the printed wiring board manufacturing process. In the printed wiring board of the present invention, the peel strength between the insulating resin composition layer and the 1 mm-width conductor circuit is preferably 0.6 kN / m or more, and more preferably 0.8 kN / m or more. Furthermore, the peel strength between the insulating resin composition layer after heating at 150 ° C. for 240 hours and the 1 mm-width conductor circuit is preferably 0.4 kN / m or more, and preferably 0.6 kN / m or more. More preferred.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to this.

(Preparation of metal foil 1)
A chromium plating layer (peeling layer) having a thickness of 1.0 mg / dm ² is formed by continuously performing chromium plating on the light selective surface of an electrolytic copper foil (carrier copper foil) having a width of 510 mm and a thickness of 35 μm under the following conditions. did. The surface roughness after chromium plating formation was Rz = 0.5 μm. The surface roughness was measured based on JIS-B-0601.
Chromium plating conditions / solution composition: chromium trioxide 250 g / L, sulfuric acid 2.5 g / L
・ Bath temperature: 25 ° C
・ Anode: Lead ・ Current density 20A / dm ²

Next, electrolytic copper plating with a thickness of 1.0 μm was performed under the photoselective plating conditions shown below. The surface roughness of the metal foil after completion of the electrolytic copper plating was Rz = 0.6 μm.
Copper sulfate plating conditions / solution composition: copper sulfate pentahydrate 100 g / L, sulfuric acid 150 g / L, chloride ion 30 ppm
・ Bath temperature: 25 ° C
・ Anode: Lead ・ Current density: 10 A / dm ²

Next, as shown below, zinc rust prevention treatment was performed by electroplating.
・ Liquid composition: Zinc 20 g / L, sulfuric acid 70 g / L
・ Bath temperature: 40 ℃
・ Anode: Lead ・ Current density: 15 A / dm ²
・ Electrolysis time: 10 seconds

Next, the following chromate treatment was performed.
Liquid composition: chromic acid 5.0 g / L
・ PH: 11.5
・ Bath temperature: 55 ℃
・ Anode: Lead ・ Immersion time: 5 seconds

Next, the following silane coupling treatment was performed.
Liquid composition: 3-aminopropyltrimethoxysilane 5.0 g / L
・ Liquid temperature: 25 ° C
・ Immersion time: 10 seconds

  After the silane coupling treatment, the metal foil was dried at 120 ° C. to adsorb the coupling agent on the surface of the metal foil. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 2)
A metal foil was prepared in the same manner as the metal foil 1 except that the metal foil 1 was subjected to a rust prevention treatment by electro nickel plating shown below instead of the zinc rust prevention treatment. The metal foil surface roughness at that time was Rz = 0.6 μm.
Electro nickel plating ・ Liquid composition: Zinc 20g / L, sulfuric acid 70g / L
・ Bath temperature: 40 ℃
・ Anode: Lead ・ Current density: 15 A / dm ²
・ Electrolysis time: 10 seconds

(Preparation of metal foil 3)
A metal foil was prepared in the same manner as the metal foil 1 except that γ-glycidoxypropyltrimethoxysilane was used as the silane coupling agent of the metal foil 1. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 4)
A metal foil was prepared in the same manner as the metal foil 2 except that γ-glycidoxypropyltrimethoxysilane was used as the silane coupling agent for the metal foil 2. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 5)
A metal foil was prepared in the same manner as the metal foil 1 except that the chromate treatment of the metal foil 1 was not performed. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 6)
A metal foil was prepared in the same manner as the metal foil 1 except that the metal foil 1 was not treated with the coupling agent. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 7)
A metal foil was prepared in the same manner as the metal foil 1 except that the metal foil 1 was not subjected to the zinc rust prevention treatment. The metal foil surface roughness at that time was Rz = 0.6 μm.

(Preparation of metal foil 8)
A metal foil was prepared in the same manner as the metal foil 1 except that after the bright copper plating, electrolytic copper plating with a thickness of 2.0 μm was performed under the burnt plating conditions shown below. At that time, the surface roughness of the metal foil was Rz = 2.7 μm.
Burn plating conditions / solution composition: copper sulfate pentahydrate 50 g / L, sulfuric acid 100 g / L, chloride ion 30 ppm
・ Bath temperature: 25 ° C
・ Anode: Lead ・ Current density: 10 A / dm ²

(Preparation of insulating resin composition 1)
Bisphenol A type epoxy resin (Epicoat 828EL, product name manufactured by Yuka Shell Co., Ltd.) 30% by weight, cresol novolac type epoxy resin (Epicron N-673, product name manufactured by Dainippon Ink Co., Ltd.) 30% by weight Then, brominated bisphenol A type epoxy resin (YDB-500, trade name, manufactured by Tohto Kasei Co., Ltd.) 30% by weight is stirred and dissolved in methyl ethyl ketone at 80 ° C., and there is a latent epoxy curing agent 2,4- Diamino-6- (2-methyl-1-imidazolylethyl) -1,3,5-triazine / isocyanuric acid adduct 4% by weight, finely pulverized silica 2% by weight, antimony trioxide 4% by weight, and epoxy An insulating resin composition varnish was prepared.

(Preparation of insulating resin composition 2)
20% by weight of polyphenylene ether resin (PKN4752, trade name manufactured by Nippon GE Plastics Co., Ltd.), 40% by weight of 2,2-bis (4-cyanatophenyl) propane (ArocyB-10, trade name of Asahi Ciba Co., Ltd.), Phosphorus-containing phenol compound (HCA-HQ, trade name, manufactured by Sanko Chemical Co., Ltd.) 8% by weight, manganese naphthenate (Mn content = 6% by weight, manufactured by Nippon Chemical Industry Co., Ltd.) 0.1% by weight, 2,2- Bis (4-glycidylphenyl) propane (DER331L, trade name, manufactured by Dow Chemical Japan Co., Ltd.) 32% by weight was dissolved in toluene at 80 ° C. to prepare a polyphenylene ether-cyanate insulating resin composition varnish.

(Preparation of insulating resin composition 3)
80% by weight of siloxane-modified polyamideimide resin (KS-6600, trade name, manufactured by Hitachi Chemical Co., Ltd.), 20% by weight of cresol novolac type epoxy resin (YDCN-703, trade name of Toto Kasei Co., Ltd.) is added to NMP (N-methylpyrrolidone) ) Was dissolved at 80 ° C. to prepare a siloxane-modified polyamideimide insulating resin composition varnish.

Example 1
The varnish of the insulating resin composition 1 was impregnated into a 0.2 mm thick glass cloth (basis weight 210 g / m ² ) and dried at 120 ° C. for 5 minutes to obtain a prepreg. The metal foil 1 is laminated on the top and bottom of the four prepregs, press-formed at 170 ° C. and 2.45 MPa for 1 hour, the carrier copper foil is peeled off, and the insulating layer 13 and the copper as shown in FIG. A copper clad laminate made of the foil 14 was produced.

  As shown in FIG. 2 (b), a through-hole 15 having a diameter of 80 μm was drilled from a metal foil with a carbon dioxide impact laser drilling machine L-500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.), and permanganate. Smear was removed by immersing in a mixed aqueous solution of potassium 65 g / liter and sodium hydroxide 40 g / liter at a liquid temperature of 70 ° C. for 20 minutes.

  Then, after immersing in HS-202B (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a palladium solution, at 25 ° C. for 15 minutes to give a catalyst, CUST-201 (trade name, manufactured by Hitachi Chemical Co., Ltd.) Was used, and electroless copper plating was carried out at a liquid temperature of 25 ° C. for 30 minutes to form an electroless copper plating layer 16 having a thickness of 0.3 μm as shown in FIG.

  As shown in FIG.2 (d), the location which laminates the dry film photoresist RY-3025 (made by Hitachi Chemical Co., Ltd., brand name) on the surface of the electroless plating layer 16, and performs electrolytic copper plating. The plating resist 17 was formed by exposing and developing ultraviolet rays through the masked photomask.

As shown in FIG. 2 (e), using a copper sulfate bath, electrolytic copper plating is performed for about 20 μm under conditions of a liquid temperature of 25 ° C. and a current density of 1.0 A / dm ² , and the minimum circuit conductor width / circuit conductor interval. Patterned electrolytic copper plating 18 was formed so that (L / S) = 25/15 μm.

Next, as shown in FIG. 2F, after removing the dry film with HTO (trade name, manufactured by Nichigo Morton Co., Ltd.) which is a resist stripping solution, H ₂ SO ₄ 20 g / L, H ₂ O _2. Copper other than the pattern portion was removed by etching using an etching solution having a composition of 10 g / L. At the time of etching, the substrate was cut into small pieces of 1 dm ² on one side, placed in a 1 L beaker, and etched at 40 ° C. for 5 minutes using a magnetic stirrer.

  Finally, a nickel plating layer 19 and a gold plating layer 20 were formed on the conductor circuit under the conditions shown in Table 1 (FIG. 2 (g)). The minimum circuit conductor width / circuit conductor interval (L / S) after circuit formation was 20/20 μm (bottom width).

(Example 2)
The varnish of the insulating resin composition 1 was impregnated into a 0.2 mm thick glass cloth (basis weight 210 g / m ² ) and dried at 120 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 2 were laminated on the top and bottom and press molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 3)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 2 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 2 were laminated on the top and bottom and press molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

Example 4
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 2 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 4 were laminated on top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 5)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and a metal foil 1 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 6)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 2 were laminated on the top and bottom and press molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 7)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 3 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 8)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 4 were laminated on top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

Example 9
The varnish of the insulating resin composition 1 was impregnated into a 0.2 mm thick glass cloth (basis weight 210 g / m ² ) and dried at 120 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 3 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 10)
The varnish of the insulating resin composition 1 was impregnated into a 0.2 mm thick glass cloth (basis weight 210 g / m ² ) and dried at 120 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 4 were laminated on top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 11)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 2 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and a metal foil 1 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

Example 12
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 2 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 3 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 13)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and a metal foil 5 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 14)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 6 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Example 15)
A glass cloth having a thickness of 0.2 mm (basis weight 210 g / m ² ) was impregnated with the varnish of the insulating resin composition 3 and dried at 160 ° C. for 5 minutes to obtain a prepreg. Example 4 Except that four prepregs and metal foil 7 were laminated on the top and bottom and press-molded at 170 ° C. and 2.45 MPa for 1 hour to produce a copper-clad laminate as shown in FIG. A substrate was prepared in the same manner as in 1.

(Comparative Example 1)
A substrate was produced in the same manner as in Example 1 except that the metal foil 8 was used.

(Example 16)
The resin composition 1 was applied to the surface of the metal foil 1 with a roll coater so that the thickness after drying was 50 μm, to obtain a metal foil with a resin with a carrier as shown in FIG.

  On the other hand, as shown in FIG. 3 (b), MCL-, which is a glass cloth base epoxy copper clad laminate having a thickness of 0.2 mm, in which a metal foil having a thickness of 18 μm is bonded to both sides of an insulating base. Using E-679 (manufactured by Hitachi Chemical Co., Ltd., trade name), the unnecessary portion of the metal foil is removed by etching, the through hole 26 is formed, the inner layer conductor circuit 24 is formed, and the inner layer circuit board 25 is formed. Produced.

  The inner layer conductor circuit 24 of the inner layer circuit board 25 is subjected to a spray spraying process using a MEC etch BOND CZ-8100 (trade name, manufactured by MEC Co., Ltd.) at a liquid temperature of 35 ° C. and a spray pressure of 0.15 MP. The copper surface is roughened to create irregularities with a roughness of about 3 μm, and immersed using MEC etch BOND CL-8300 (trade name, manufactured by MEC Co., Ltd.) at a liquid temperature of 25 ° C. and an immersion time of 20 seconds. Then, a rust prevention treatment was performed on the copper surface.

As shown in FIG. 3 (c), the resin-coated metal foil with a carrier prepared in FIG. 3 (a) was laminated by heating and pressing at 170 ° C. and 30 kgf / cm ² for 60 minutes, and then the carrier copper foil. I peeled off.

  As shown in FIG. 3 (d), a non-through hole 27 having a diameter of 80 μm was formed on the copper foil by a carbon dioxide impact laser drilling machine L-500 (trade name, manufactured by Sumitomo Heavy Industries, Ltd.), and permanganate. Smear was removed by immersing in a mixed aqueous solution of potassium 65 g / liter and sodium hydroxide 40 g / liter at a liquid temperature of 70 ° C. for 20 minutes.

  Then, after immersing in HS-202B (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a palladium solution, at 25 ° C. for 15 minutes to give a catalyst, CUST-201 (trade name, manufactured by Hitachi Chemical Co., Ltd.) Was used and electroless copper plating was performed at a liquid temperature of 25 ° C. for 30 minutes to form an electroless copper plating layer 28 having a thickness of 0.3 μm as shown in FIG.

  As shown in FIG.3 (f), the place which laminates the dry film photoresist RY-3025 (made by Hitachi Chemical Co., Ltd., brand name) on the surface of the electroless-plating layer 28, and performs electrolytic copper plating. The plating resist 29 was formed by exposing and developing ultraviolet rays through the masked photomask.

As shown in FIG. 3 (g), electrolytic copper plating is carried out using a copper sulfate bath at a liquid temperature of 25 ° C. and a current density of 1.0 A / dm ² for about 20 μm, and the minimum circuit conductor width / circuit conductor interval. Pattern electroplating 30 was formed so that (L / S) = 25/15 μm.

Next, as shown in FIG. 3 (h), after removing the dry film with HTO (trade name, manufactured by Nichigo-Morton Co., Ltd.), which is a resist stripping solution, H ₂ SO ₄ 20 g / L, H ₂ O ₂ Copper other than the pattern portion was removed by etching using an etching solution having a composition of 10 g / L. At the time of etching, the substrate was cut into small pieces of 1 dm ² on one side, placed in a 1 L beaker, and etched at 40 ° C. for 5 minutes using a magnetic stirrer.

  Finally, gold plating 31 was performed on the conductor circuit under the conditions shown in Table 1 (FIG. 3 (i)). Minimum circuit conductor width / circuit conductor interval (L / S) = 20/20 μm.

(Example 17)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 1 was applied to the surface of the metal foil 2 and a metal foil with a resin with a carrier was prepared.

(Example 18)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 2 was applied to the surface of the metal foil 2 to produce a metal foil with a resin with a carrier.

(Example 19)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 2 was applied to the surface of the metal foil 4 to produce a resin-attached metal foil with a carrier.

(Example 20)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 1 to produce a metal foil with a resin with a carrier.

(Example 21)
A substrate was produced in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 2 to produce a metal foil with a resin with a carrier.

(Example 22)
A substrate was produced in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 3 to produce a metal foil with a resin with a carrier.

(Example 23)
A substrate was produced in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 4 to produce a metal foil with a resin with a carrier.

(Example 24)
A substrate was produced in the same manner as in Example 16 except that the resin composition 1 was applied to the surface of the metal foil 3 to produce a resin-attached metal foil with a carrier.

(Example 25)
A substrate was produced in the same manner as in Example 16 except that the resin composition 1 was applied to the surface of the metal foil 4 to produce a metal foil with a resin with a carrier.

(Example 26)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 2 was applied to the surface of the metal foil 1 to produce a metal foil with a resin with a carrier.

(Example 27)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 2 was applied to the surface of the metal foil 3 to prepare a metal foil with a resin with a carrier.

(Example 28)
A substrate was produced in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 5 to produce a metal foil with a resin with a carrier.

(Example 29)
A substrate was produced in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 6 to produce a resin-attached metal foil with a carrier.

(Example 30)
A substrate was prepared in the same manner as in Example 16 except that the resin composition 3 was applied to the surface of the metal foil 7 and a metal foil with a resin with a carrier was prepared.

Measurement conditions (1) Conductor surface roughness The conductor surface roughness of the board | substrate obtained by the Example and the comparative example was measured based on JIS-B-0601.

(2) Peel strength (peel strength)
The peel strength of the conductor circuits of the substrates obtained in the examples and comparative examples was measured under the conditions based on JIS-C-6481, except that the peel width was 1 mm. The measurement was performed three times after the substrate preparation, after the 150 ° C. heating test and after the PCT test. When the peeling width is narrowed, moisture absorption deterioration is likely to occur, and the peeling strength tends to be weaker than that measured at a width of 10 mm.
Sample for heating test at 150 ° C. The substrates obtained in the examples and comparative examples were left in the gas phase at 150 ° C. for 240 hours.
・ Pressure cooker test (PCT test)
The substrates obtained in Examples and Comparative Examples were left for 72 hours under the conditions of 121 ° C., 2 atm, and humidity of 100%.

(3) Dielectric constant, dielectric loss tangent Cured products of the insulating resin compositions 1 to 3 were produced, and dielectric properties were evaluated. The sample used was a metal foil with resin obtained in Examples 16, 18 and 20, which was laminated with the resin side and press cured, and then the metal foil was etched. The pressing conditions were a heating rate of 5 ° C./min, a curing temperature of 180 ° C., a curing time of 90 min, and a pressure of 2.0 MPa. The relative permittivity and dielectric loss tangent at 1 GHz of the obtained resin cured product were measured with an impedance-material analyzer HP4291B manufactured by Hewlett-Packard Co., Ltd.

(4) Conductor top width, space width The circuit conductor width / circuit conductor interval (L / S) after circuit formation of the substrates obtained in the examples and comparative examples was photographed from above with an optical microscope, and image processing was performed. Based on the data, 20 points were arbitrarily measured and the average was calculated.

(result)
Table 2 shows the results of the conductor surface roughness, relative dielectric constant, dielectric loss tangent, peel strength, conductor top width and space width of the substrates obtained in Examples 1 to 15 and Comparative Example 1. Similarly, Table 3 shows the results of the conductor surface roughness, relative dielectric constant, dielectric loss tangent, peel strength, conductor top width and space width of the substrates obtained in Examples 16 to 30.

  From Tables 2 and 3, it can be seen that the substrates obtained in Examples 1 to 30 have substantially the same conductor top width and space width, and form a good circuit. 4, 5 and 6 are SEM photographs of the circuit of the substrate produced in the same manner as in Example 1 using the resin compositions 1, 2 and 3 of the example, respectively. L / S = 20/20 μm , 25/25 μm and 30/30 μm indicate that the circuit formation is good. In particular, the substrates produced in Examples 1 to 14 and 16 to 29 are excellent in both initial peel strength and flatness, and Examples 1 to 8, 11, 12, 16 to 23, 26, and 27 are Moreover, it is excellent also in the peel strength after a heating, and Examples 1-8 and 16-23 are excellent also in the peel strength after moisture absorption. Further, Examples 3, 4, 11, 12, 18, 19, 26 and 27 are suitable for applications requiring a low dielectric constant and dielectric loss tangent and requiring low loss of electrical signals. , 18 and 19 are extremely excellent in dielectric constant, dielectric loss tangent and peel strength.

  On the other hand, in Comparative Example 1, since the metal foil has a roughened layer, excessive etching is required, and the conductor top width becomes narrow, and the conductor surface is rough, which is not preferable in terms of electrical characteristics.

It is sectional drawing which shows an example of the method of manufacturing a printed wiring board using the metal-clad laminated board of this invention. It is sectional drawing which shows the manufacturing method of the board | substrate used for Examples 1-15 and evaluation of the comparative example 1. FIG. It is sectional drawing which shows the manufacturing method of the board | substrate used for evaluation of Examples 16-30. The photograph of the substrate circuit produced using the resin composition 1 of an Example. The photograph of the substrate circuit produced using the resin composition 2 of an Example. The photograph of the substrate circuit produced using the resin composition 3 of an Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Prepreg 2 Metal foil 3 Through-through hole 4 Electroless plating layer 5 Plating resist 6 Circuit pattern 7 Insulating layer 8 Metal foil 9 IVH
DESCRIPTION OF SYMBOLS 10 Electroless plating layer 11 Plating resist 12 Circuit pattern 13 Insulating layer 14 Copper foil 15 Through-through hole 16 Electroless copper plating layer 17 Plating resist 18 Pattern electrolytic copper plating 19 Nickel plating layer 20 Gold plating layer 21 Carrier metal foil 22 Metal foil 23 Resin 24 Inner layer conductor circuit 25 Insulating layer 26 Through hole 27 IVH
28 Electroless copper plating 29 Resist 30 Pattern electroplating 31 Ni / Au plating

Claims (22)

An insulating resin composition layer, in one surface or a resin-coated copper foil having a copper foil such by fixing the both sides of the insulating resin composition layer, the insulating resin composition layer contains a cyanate resin, the copper foil The surface in contact with the insulating resin composition layer or both surfaces of the copper foil are subjected to rust prevention treatment with nickel, chromate treatment and silane coupling treatment, and the surface roughness (Rz) of the copper foil is 2.0 μm or less on both surfaces. The copper foil with resin characterized by being. The copper foil with resin according to claim 1, wherein the copper foil has a thickness of 3 μm or less. The copper foil with resin according to claim 1 or 2 insulating resin composition layer and the interface roughness of the copper foil (Rz) is equal to or is 2.0μm or less. The copper foil with resin according to any one of claims 1 to 3, wherein the chromate treatment is performed on the rust prevention treatment. Copper foil with resin according to any one of claims 1 to 4, characterized in that said silane coupling treatment is performed on the outermost layer of the copper foil. The resin-coated copper foil according to claim 1, wherein the silane coupling agent used for the silane coupling treatment chemically reacts with the insulating resin composition by heating. The resin-coated copper according to claim 1, wherein the insulating resin composition contains an epoxy resin, and the silane coupling agent used for the silane coupling treatment contains an amino-functional silane. Foil . The said insulating resin composition contains a thermosetting resin, The copper foil with resin in any one of Claims 1-7 characterized by the above-mentioned. The said insulating resin composition contains a liquid epoxy resin at normal temperature, The resin-coated copper foil in any one of Claims 1-8 characterized by the above-mentioned. The said insulating resin composition contains a latent hardening | curing agent, Copper foil with resin in any one of Claims 1-9 characterized by the above-mentioned. The resin-coated copper foil according to claim 1, wherein the insulating resin composition after curing has a relative dielectric constant at 1 GHz of 3.0 or less or a dielectric loss tangent of 0.01 or less.
It manufactures using the copper foil with resin in any one of Claims 1-11, The printed wiring board characterized by the above-mentioned.   The printed wiring board according to claim 12, wherein the surface roughness (Rz) of the conductor circuit is 2.0 μm or less.   14. The printed wiring board according to claim 12, wherein a peel strength between the insulating resin composition layer and a 1 mm-width conductor circuit is 0.6 kN / m or more.   The peel strength between the insulating resin composition layer after heating at 150 ° C for 240 hours and a 1 mm-wide conductor circuit is 0.4 kN / m or more, and the peel strength is 0.4 kN / m or more. Printed wiring board. The manufacturing method of a printed wiring board which has the process of producing a conductor circuit by the pattern electroplating which used the said copper foil of the copper foil with resin in any one of Claims 1-11 as the electric power feeding layer. The method of manufacturing a printed wiring board according to claim 16, wherein an electroless plating layer is formed on the copper foil . 18. The method of manufacturing a printed wiring board according to claim 16, wherein an etching solution that is controlled by a chemical reaction is used when the copper foil that is a power feeding layer is removed by etching after the conductor circuit is formed.   The method for manufacturing a printed wiring board according to claim 18, wherein the etching solution contains an acid not containing a halogen element and hydrogen peroxide as main components.   The method for manufacturing a printed wiring board according to claim 19, wherein the acid containing no halogen element is sulfuric acid.   21. The method of manufacturing a printed wiring board according to claim 20, wherein the concentration of the sulfuric acid is 5 to 300 g / L, and the concentration of the hydrogen peroxide is 5 to 200 g / L. The step of forming a conductor circuit by pattern electroplating on the copper foil , using the copper foil of the copper foil with resin according to any one of claims 1 to 11 as a power feeding layer,
After the conductor circuit is formed, the step of removing the copper foil other than the conductor circuit portion by etching with an etchant that is rate-controlled by chemical reaction, and the step of performing electroless gold plating on the conductor circuit,
A method for producing a printed wiring board, comprising: