JP4382788B2 - Light emitting module - Google Patents
Light emitting module Download PDFInfo
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- JP4382788B2 JP4382788B2 JP2006245809A JP2006245809A JP4382788B2 JP 4382788 B2 JP4382788 B2 JP 4382788B2 JP 2006245809 A JP2006245809 A JP 2006245809A JP 2006245809 A JP2006245809 A JP 2006245809A JP 4382788 B2 JP4382788 B2 JP 4382788B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10697—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer being cross-linked
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10036—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising two outer glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
Description
本発明は、発光モジュールに関するものであり、さらに詳しくは、太陽電池やその他の電池と組み合わせて例えば照明装置や案内標識などに使用することのできる発光モジュール、特に複数の発光ダイオード（ＬＥＤ）が含まれている発光モジュールの改良に関するものである。 The present invention relates to a light-emitting module, and more specifically, includes a light-emitting module that can be used for, for example, a lighting device or a guide sign in combination with a solar battery or other batteries, particularly a plurality of light-emitting diodes (LED). The present invention relates to an improvement of a light emitting module.
近年において、ＬＥＤが含まれている発光モジュールは、低消費電力、長寿命などの観点からその市場が急速に拡大している。このような発光モジュールの１つの例としては、特許文献１に記載されたものが知られている。 In recent years, the market of light emitting modules including LEDs has been rapidly expanding from the viewpoint of low power consumption, long life, and the like. As an example of such a light emitting module, one described in Patent Document 1 is known.
また、ＬＥＤが含まれている発光モジュールの別の例としては、第１基板と、第１封止層と、絶縁基板に配線パターンが形成され、この配線パターンに対応して複数個のＬＥＤが実装されているＬＥＤ基板と、ＬＥＤの光出射面を露出させてＬＥＤを封止するＬＥＤ封止層と、第２封止層と、第２基板とが順次積層されてなるものが知られている。 Further, as another example of the light emitting module including the LED, a wiring pattern is formed on the first substrate, the first sealing layer, and the insulating substrate, and a plurality of LEDs corresponding to the wiring pattern are formed. It is known that the mounted LED substrate, the LED sealing layer that seals the LED by exposing the light emitting surface of the LED, the second sealing layer, and the second substrate are sequentially laminated. Yes.
このような発光モジュールでは、第１封止層および第２封止層を構成する材料として例えばＥＶＡ（エチレンビニルアセテート）シートが使用されている。このため、ＥＶＡの主剤である酢酸ビニルまたは添加剤である架橋剤および紫外線吸収剤が、ＬＥＤの発光により生じる紫外線および発熱作用によって一部分解されることがある。分解により生じた物質は、低分子のガス状態にあってＬＥＤの発光効率を低下させる原因物質になる。 In such a light emitting module, for example, an EVA (ethylene vinyl acetate) sheet is used as a material constituting the first sealing layer and the second sealing layer. For this reason, vinyl acetate, which is the main component of EVA, or a crosslinking agent and an ultraviolet absorber, which are additives, may be partially decomposed by ultraviolet rays and heat generation caused by the light emission of the LED. The substance produced by the decomposition is in a low molecular gas state and becomes a causative substance that lowers the luminous efficiency of the LED.
例えば白色光を発するＬＥＤの場合には、長期寿命(長期信頼性)を確保するためにＬＥＤ封止層の封止剤として透明なシリコーン樹脂を用いるのが一般的である。しかしながら、シリコーン樹脂は、多孔性樹脂であり、ガス透過率が高く、ＬＥＤの発光効率を低下させるガス状の前記原因物質を透過させてしまう性質を有している。 For example, in the case of an LED that emits white light, a transparent silicone resin is generally used as a sealant for the LED sealing layer in order to ensure a long life (long-term reliability). However, the silicone resin is a porous resin, has a high gas permeability, and has a property of transmitting the gaseous causative substance that reduces the light emission efficiency of the LED.
また、封止剤であるＥＶＡは、厚さが厚いほど吸湿し易くなる性質を有している。そして、吸湿した場合には、白濁することで発光モジュールの発光特性を低下させるとともに、ＬＥＤおよびＬＥＤを実装しているＬＥＤ基板の配線部の腐食を招くおそれがある。さらに、発光モジュールの中に発電用として太陽電池を封入した場合には、吸湿したＥＶＡによって、太陽電池における電極部の変色や発電性能の低下が起きることがある。 Moreover, EVA which is a sealing agent has a property that moisture absorption becomes easier as the thickness increases. And when it absorbs moisture, while becoming cloudy, while reducing the light emission characteristic of a light emitting module, there exists a possibility of causing the corrosion of the wiring part of LED board which mounts LED and LED. Further, when a solar cell is encapsulated in the light emitting module for power generation, the hygroscopic EVA may cause discoloration of the electrode part of the solar cell and a decrease in power generation performance.
本発明は、このような実情に鑑みてなされたものであり、その課題は、発光ダイオードの発光効率を低下させる原因物質が発光ダイオードに取り込まれるおそれがなく、また、吸湿性が従来よりも低減された発光モジュールを提供することにある。 The present invention has been made in view of such circumstances, and the problem is that a causative substance that lowers the light emission efficiency of the light emitting diode is not likely to be taken into the light emitting diode, and the hygroscopicity is lower than in the past. And providing a light emitting module.
本発明によれば、第１基板と、第１封止層と、複数個の発光ダイオードが実装された発光ダイオード基板と、発光ダイオードの光出射面を露出させて発光ダイオードを封止する発光ダイオード封止層と、第２封止層と、第２基板とが順次積層された構造を備えてなり、発光ダイオード基板と第１封止層または第２封止層との間に、実装された発光ダイオードの光出射面を覆うとともに該光出射面からの出射光の透過を確保する一方でガス状物質の透過を阻止する中間膜層が設けられていることと、発光ダイオード封止層は、発光ダイオード露出用の穴が開けられたＥＶＡシートからなり、第１封止層および第２封止層は、このような穴が開けられていないＥＶＡシートからなり、発光ダイオード露出用の穴が開けられたＥＶＡシートは、その厚さが実装された発光ダイオードの高さよりも０．２ｍｍ〜０．５ｍｍだけ薄いことを特徴とする発光モジュールが提供される。 According to the present invention, a first substrate, a first sealing layer, a light emitting diode substrate on which a plurality of light emitting diodes are mounted, and a light emitting diode that seals the light emitting diode by exposing a light emitting surface of the light emitting diode. The sealing layer, the second sealing layer, and the second substrate are sequentially stacked, and are mounted between the light emitting diode substrate and the first sealing layer or the second sealing layer. An intermediate film layer that covers the light emitting surface of the light emitting diode and ensures the transmission of the emitted light from the light emitting surface while preventing the transmission of the gaseous substance, and the light emitting diode sealing layer, The first sealing layer and the second sealing layer are made of an EVA sheet having no holes, and the holes for exposing the light emitting diodes are formed. The EVA sheet is Of the 0.2mm~0.5mm light emitting module, wherein only the thin is provided than the height of the mounted light emitting diodes.
中間膜層は、発光ダイオード（ＬＥＤ）の封止剤（例えばシリコーン樹脂）の表面に発光モジュールの封止剤（例えばＥＶＡ）が直接接しないようにするものである。また、中間膜層は発光モジュールにおける封止層の積層を分断する構造を兼ねるものとなる。 The intermediate film layer prevents the sealing agent (for example, EVA) of the light emitting module from directly contacting the surface of the sealing agent (for example, silicone resin) of the light emitting diode (LED). Further, the intermediate film layer also serves as a structure that divides the lamination of the sealing layers in the light emitting module.
ここで、中間膜層としては例えば、ＰＶＡ（ポリ酢酸ビニル）フィルムからなる層、ＰＶＡフィルムにＳｉＯｘがコーティングされてなる層、またはＰＥＴ（ポリエチレンテレフタレート）フィルムにＳｉＯｘがコーティングされてなる層などが好ましく使用される。 Here, as the intermediate film layer, for example, a layer made of a PVA (polyvinyl acetate) film, a layer made of PVA film coated with SiOx, or a layer made of PET (polyethylene terephthalate) film coated with SiOx is preferable. used.
中間膜層は例えば、実装された発光ダイオードの光出射面を覆う１枚の方形フィルムまたは複数枚の短冊状フィルムなどが好ましく使用される。 As the intermediate film layer, for example, one rectangular film or a plurality of strip-shaped films covering the light emitting surface of the mounted light emitting diode is preferably used.
中間膜層は、その厚さが０．０１ｍｍ〜０．０５ｍｍであるのが好ましい。厚さが０．０１ｍｍに満たないときにはフィルムの取り扱いが容易ではなく、一方、０．０５ｍｍを超えるときには発光ダイオードからの出射光の透過が不充分になるおそれがあるからである。 The interlayer film layer preferably has a thickness of 0.01 mm to 0.05 mm. This is because when the thickness is less than 0.01 mm, handling of the film is not easy, while when it exceeds 0.05 mm, there is a possibility that the transmission of the emitted light from the light emitting diode may be insufficient.
中間膜層は、ガス状物質の透過をいっそう確実に阻止するために、実装された発光ダイオードの光出射面と接しているのが好ましい。 The interlayer film layer is preferably in contact with the light emitting surface of the mounted light emitting diode in order to more reliably prevent the gaseous substance from passing therethrough.
本発明にあっては、発光ダイオード基板と第１封止層または第２封止層との間に、ガス状物質の透過を阻止する中間膜層、すなわちガスブロック性能を有する中間膜層が配置されている。これにより、ＬＥＤの封止剤（例えばシリコーン樹脂）が発光モジュールの封止剤（例えばＥＶＡ）に接することがなくなり、ＬＥＤの発光効率の低下を招く封止剤の分解成分がＬＥＤに取り込まれるおそれがなくなる。さらに、配置された中間膜層は発光モジュールに用いる封止層の積層を分断する構造を兼ねるものとなる。そして、分断されていない封止層の厚さを薄くすることが可能になることから、吸湿性を低減する効果も得られる。 In the present invention, an intermediate film layer that prevents the permeation of gaseous substances, that is, an intermediate film layer having gas blocking performance, is disposed between the light emitting diode substrate and the first sealing layer or the second sealing layer. Has been. Thereby, the sealing agent (for example, silicone resin) of the LED does not come into contact with the sealing agent (for example, EVA) of the light emitting module, and the decomposition component of the sealing agent that causes a decrease in the light emission efficiency of the LED may be taken into the LED. Disappears. Furthermore, the disposed intermediate film layer also serves as a structure for dividing the stack of sealing layers used in the light emitting module. And since it becomes possible to make thin the thickness of the sealing layer which is not parted, the effect of reducing hygroscopicity is also acquired.
以下、本発明を実施するための３つの実施形態について説明する。なお、本発明はこれらの実施形態によって限定されるものではない。 Hereinafter, three embodiments for carrying out the present invention will be described. Note that the present invention is not limited to these embodiments.
実施形態１
実施形態１を図１〜図６に基づいて説明する。図１に示されたように、厚さ５．０ｍｍの第１基板としての透明ガラス板８に、封止材である厚さ０．６ｍｍのＥＶＡ（エチレンビニルアセテート）シートを２枚積層した第１封止層７を設けた。次いで、第１封止層７に多数の発光ダイオード（ＬＥＤ）４を実装したＬＥＤ基板６を積層し、ＬＥＤ４へ電力を供給するための配線を施した。
Embodiment 1
Embodiment 1 is demonstrated based on FIGS. As shown in FIG. 1, a transparent glass plate 8 as a first substrate having a thickness of 5.0 mm is laminated with two 0.6 mm thick EVA (ethylene vinyl acetate) sheets as a sealing material. One sealing layer 7 was provided. Next, an LED substrate 6 on which a large number of light emitting diodes (LEDs) 4 were mounted was laminated on the first sealing layer 7, and wiring for supplying power to the LEDs 4 was applied.
その後、ＬＥＤ基板６の上に、厚さ０．６ｍｍであってφ１０．０ｍｍのＬＥＤ露出用の穴１０が穴開け加工より複数個施された封止材であるＥＶＡシートを３枚積層して、ＬＥＤ封止層５を設けた。ＬＥＤ封止層５の積層厚さは、例えば実装後のＬＥＤ４の高さが２．０ｍｍである場合には、０．６ｍｍ×３＝１．８ｍｍとなり、実装後のＬＥＤ高さよりも２．０ｍｍ−１．８ｍｍ＝０．２ｍｍだけ低いものとなる。 Thereafter, three EVA sheets, which are sealing materials in which a plurality of LED exposure holes 10 having a thickness of 0.6 mm and a diameter of φ10.0 mm are provided by drilling, are stacked on the LED substrate 6. The LED sealing layer 5 was provided. The stacking thickness of the LED sealing layer 5 is, for example, 0.6 mm × 3 = 1.8 mm when the height of the LED 4 after mounting is 2.0 mm, which is 2.0 mm than the LED height after mounting. −1.8 mm = 0.2 mm lower.
次いで、ＬＥＤ封止層５の上に、厚さ０．０１２ｍｍのＰＥＴ（ポリエチレンテレフタレート）フィルム基材に蒸着によってＳｉＯｘ（シリカ）蒸着膜がコーティングされてなる中間膜層３を積層した。この実施形態では、中間膜層３としては、三菱樹脂株式会社製の商品名「テックバリアＴＣＢ-ＨＩ３」のものを使用し、ＳｉＯｘ非蒸着面がＬＥＤ４の上面である光出射面に接するように配置した。この状態を示す概略断面図が図４である。 Next, on the LED sealing layer 5, an interlayer film layer 3 formed by coating a PET (polyethylene terephthalate) film substrate having a thickness of 0.012 mm with a SiOx (silica) deposited film by deposition was laminated. In this embodiment, as the intermediate film layer 3, the product name “Tech Barrier TCB-HI3” manufactured by Mitsubishi Plastics, Inc. is used, and the SiOx non-deposition surface is in contact with the light emitting surface which is the upper surface of the LED 4. Arranged. FIG. 4 is a schematic sectional view showing this state.
その後、中間膜層３の上に、封止材である厚さ０．６ｍｍのＥＶＡシートを３枚積層した第２封止層２を設けた。そして、第２封止層２の上に厚さ５．０ｍｍの第２基板としての透明ガラス板１１を積層した。 Then, the 2nd sealing layer 2 which laminated | stacked three 0.6 mm thick EVA sheets which are sealing materials on the intermediate film layer 3 was provided. Then, a transparent glass plate 11 as a second substrate having a thickness of 5.0 mm was laminated on the second sealing layer 2.
以上の各積層が完了した積層体を熱圧着装置に投入して、約１５０度で１時間の熱圧着処理を行い、封止剤であるＥＶＡを架橋させることで発光モジュール１を完成した。 The laminated body in which each of the above laminations was completed was put into a thermocompression bonding apparatus, a thermocompression treatment was performed at about 150 degrees for 1 hour, and EVA as a sealant was crosslinked to complete the light emitting module 1.
この熱圧着による封止・接着作用により、それぞれのＬＥＤ４の周囲に設けられた空間が周囲からのＥＶＡの流入により塞がれて封止・接着され、ＬＥＤ４の光出射面が中間膜層３で被覆され、中間膜層３の上面からはさらに封止剤であるＥＶＡで封止される。 By the sealing / adhesion action by thermocompression bonding, the space provided around each LED 4 is blocked and sealed and adhered by the inflow of EVA from the surroundings, and the light emitting surface of the LED 4 is the intermediate film layer 3. Covered and further sealed with EVA as a sealant from the upper surface of the intermediate film layer 3.
実装後のＬＥＤ４の高さとＬＥＤ封止層５の厚さとの間における上記のような関係は、次のような理由によるものである。 The above relationship between the height of the LED 4 after mounting and the thickness of the LED sealing layer 5 is due to the following reason.
すなわち、ＬＥＤ４の高さとＬＥＤ封止層５の厚さとの差が０．２ｍｍより小さいときには、製造時のバラツキ（例えばＬＥＤ４の実装高さバラツキ）により中間膜層３がＬＥＤ４の光出射面に接しない構造となってしまい、充分なガスバリア機能を果さないことがある。一方、この差が０．５ｍｍより大きいときには、積層された中間膜層３が大きく変形して、第２封止層２の中に気泡やシワが発生するため、接着不良・外観不良が発生してしまうおそれがある。さらに、この実施形態で使用したＰＥＴ基材にＳｉＯｘ蒸着を施した中間膜層３の場合には、中間膜層３の変形する角度が大きくなると、表面の蒸着膜にクラックが発生して、充分なガスバリア機能を果さなくなってしまうことがある。 That is, when the difference between the height of the LED 4 and the thickness of the LED sealing layer 5 is smaller than 0.2 mm, the interlayer film layer 3 is in contact with the light emitting surface of the LED 4 due to manufacturing variations (for example, mounting height variations of the LED 4). The gas barrier function may not be achieved. On the other hand, when this difference is larger than 0.5 mm, the laminated intermediate film layer 3 is greatly deformed, and bubbles and wrinkles are generated in the second sealing layer 2. There is a risk that. Further, in the case of the intermediate film layer 3 obtained by performing SiOx vapor deposition on the PET base material used in this embodiment, if the deformation angle of the intermediate film layer 3 increases, cracks are generated in the vapor deposition film on the surface, which is sufficient. The gas barrier function may not be achieved.
従って、ＬＥＤ４の実装高さと、ＬＥＤ露出用の穴１０を穴開け加工により施したＬＥＤ封止材５の厚さとの差は、０．２ｍｍ〜０．５ｍｍであることが好ましく、０．２ｍｍ〜０．３ｍｍであればいっそう好ましい。 Therefore, the difference between the mounting height of the LED 4 and the thickness of the LED sealing material 5 in which the LED exposure hole 10 is drilled is preferably 0.2 mm to 0.5 mm, preferably 0.2 mm to 0.3 mm is more preferable.
この実施形態では、中間膜層３としてＰＥＴ基材にＳｉＯｘ蒸着を施したものを用いたが、中間膜層は、ガスバリア性を有するフィルムであれば他のものであってもよい。例えば、ＰＶＡフィルム、ＰＶＡフィルム＋ＳｉＯｘコートフィルムなどを用いても同様の効果が得られるものである。 In this embodiment, a film obtained by subjecting a PET base material to SiOx vapor deposition is used as the intermediate film layer 3, but the intermediate film layer may be another film as long as it has a gas barrier property. For example, the same effect can be obtained by using a PVA film, PVA film + SiOx coat film, or the like.
また、中間膜層３の平面サイズは、この実施形態においては発光モジュールの外形平面寸法と同サイズで作製したが、ＬＥＤ４の光出射面を確実にカバーすることができれば、いかなるサイズでもよい。例えば、複数枚の短冊状カバーフィルムをＬＥＤ４の配列に従って配置してもよい。 In addition, in this embodiment, the planar size of the intermediate film layer 3 is the same as the outer planar size of the light emitting module. However, any size may be used as long as the light emitting surface of the LED 4 can be reliably covered. For example, a plurality of strip-shaped cover films may be arranged according to the arrangement of the LEDs 4.
さらに、この実施形態で用いた封止剤はＥＶＡであるが、ＥＶＡ以外の封止剤、例えばポリオレフィン系の熱圧着性樹脂、ＥＥＡやＥＡＡなどの熱圧着性樹脂などを用いても同様の効果を得ることができる。 Furthermore, although the sealant used in this embodiment is EVA, the same effect can be obtained by using a sealant other than EVA, for example, a polyolefin-based thermocompression bonding resin, a thermocompression bonding resin such as EEA or EAA, and the like. Can be obtained.
なお、この実施形態において、封止材であるＥＶＡシートは０．６ｍｍの厚さのものを使用したが、その他の厚さのＥＶＡシートや例えばポリオレフィン系封止材を用いても同様の効果を得ることができる。 In this embodiment, the EVA sheet that is the sealing material is 0.6 mm thick, but the same effect can be obtained by using other thickness EVA sheets or, for example, polyolefin-based sealing materials. Obtainable.
また、この実施形態では、第１基板および第２基板として透明ガラス板８・１１を使用したが、例えばポリカーボーネート板やアクリル板のようなプラスチック製透明基板を用いてもよい。さらに、透明ガラス板８・１１に代えて、不透明あるいは半透明のガラス板、プラスチック板、フィルムまたはシートを用いてもよい。 In this embodiment, the transparent glass plates 8 and 11 are used as the first substrate and the second substrate. However, for example, a plastic transparent substrate such as a polycarbonate plate or an acrylic plate may be used. Further, an opaque or translucent glass plate, plastic plate, film or sheet may be used in place of the transparent glass plates 8 and 11.
実施形態２
次に、実施形態１の積層体を基本として、封止層の中に半導体光電変換層を配置した発光モジュールの実施形態２を説明する。
Embodiment 2
Next, Embodiment 2 of the light emitting module in which the semiconductor photoelectric conversion layer is arranged in the sealing layer on the basis of the laminate of Embodiment 1 will be described.
図２に、実施形態２に係る発光モジュールの概略断面図を示す。実施形態１の積層体と同じように、透明ガラス板８、第１封止層７、複数個のＬＥＤ４が実装されたＬＥＤ基板６、ＬＥＤ封止層５および中間膜層３を積層した。 In FIG. 2, the schematic sectional drawing of the light emitting module which concerns on Embodiment 2 is shown. Similar to the laminated body of the first embodiment, the transparent glass plate 8, the first sealing layer 7, the LED substrate 6 on which the plurality of LEDs 4 are mounted, the LED sealing layer 5, and the intermediate film layer 3 were stacked.
次に、中間膜層３の上に、封止材である厚さ０．６ｍｍのＥＶＡシートを３枚積層した別の封止層１３を設けた。そして、この封止層１３の上に、半導体光電変換層としての光透過型太陽電池９をその発電面が上になるように配置した。さらに、太陽電池９の上に、封止材である厚さ０．６ｍｍのＥＶＡシートを２枚積層した第２封止層１２を設けた。そして、第２封止層１２の上に厚さ５．０ｍｍの第２基板としての透明ガラス板１１を積層した。 Next, another sealing layer 13 in which three EVA sheets having a thickness of 0.6 mm, which is a sealing material, were laminated on the intermediate film layer 3 was provided. And on this sealing layer 13, the light transmission type solar cell 9 as a semiconductor photoelectric converting layer was arrange | positioned so that the electric power generation surface might turn up. Furthermore, on the solar cell 9, the 2nd sealing layer 12 which laminated | stacked two 0.6 mm-thick EVA sheets which are sealing materials was provided. Then, a transparent glass plate 11 as a second substrate having a thickness of 5.0 mm was laminated on the second sealing layer 12.
以上の各積層が完了した積層体を熱圧着装置に投入して、約１５０度で１時間の熱圧着処理を行い、封止剤であるＥＶＡを架橋させることで、発電機能を持ち合わせた発光モジュール２１を作製した。 A light emitting module having a power generation function by putting the laminated body in which each of the above laminations is completed into a thermocompression bonding apparatus, performing thermocompression bonding processing at about 150 degrees for 1 hour, and crosslinking EVA as a sealant. 21 was produced.
この実施形態で作製した発電機能を持ち合わせた発光モジュール２１は、太陽電池９の発電面を所定方向へ向けて、主に建物の壁面などに設置して利用される。すなわち、昼間には太陽光によって太陽電池９で発電が行われ、その発電された電気が蓄電池システムで蓄電されるかまたは系統と連携して電力会社などへ売電される。夜間は、前記蓄電池システムに蓄えられた電気により、あるいは系統からの商用電力を受けて、ＬＥＤ４が発光する。ＬＥＤ４からの光は、光透過型太陽電池９の光透過部から透明ガラス板１１を経て外部へ出るので、照明（イルミネーション）として使用される。 The light emitting module 21 having the power generation function produced in this embodiment is used by being installed mainly on a wall surface of a building or the like with the power generation surface of the solar cell 9 facing a predetermined direction. That is, in the daytime, power is generated by the solar cell 9 by sunlight, and the generated electricity is stored in the storage battery system or sold to an electric power company or the like in cooperation with the system. At night, the LED 4 emits light by electricity stored in the storage battery system or by receiving commercial power from the system. Since the light from the LED 4 exits from the light transmitting portion of the light transmitting solar cell 9 through the transparent glass plate 11, it is used as illumination (illumination).
実施形態３
次に、実施形態２と同様の構造であって、ＬＥＤの出射方向が実施形態２とは反対になるように半導体光電変換層を封止層の中に配置した発光モジュールの実施形態３を説明する。
Embodiment 3
Next, a third embodiment of the light emitting module having the same structure as that of the second embodiment, in which the semiconductor photoelectric conversion layer is arranged in the sealing layer so that the emission direction of the LED is opposite to that of the second embodiment will be described. To do.
図７に、実施形態３に係る発光モジュールの概略断面図を示す。厚さ５．０ｍｍの第２基板としての透明ガラス板１１の上に、封止材である厚さ０．６ｍｍのＥＶＡシートを２枚積層した第２封止層１２を設けた。次に、第２封止層１２の上に、半導体光電変換層としての光透過型太陽電池９をその発電面が下になるように配置した。 In FIG. 7, the schematic sectional drawing of the light emitting module which concerns on Embodiment 3 is shown. On the transparent glass plate 11 as a second substrate having a thickness of 5.0 mm, a second sealing layer 12 in which two 0.6 mm thick EVA sheets as a sealing material were laminated. Next, the light-transmissive solar cell 9 as a semiconductor photoelectric conversion layer was disposed on the second sealing layer 12 so that the power generation surface was on the bottom.
さらに、太陽電池９の上に、実施形態２と同じように、第１封止層７、複数個のＬＥＤ４が実装されたＬＥＤ基板６、ＬＥＤ封止層５および中間膜層３を積層した。 Further, on the solar cell 9, as in the second embodiment, the first sealing layer 7, the LED substrate 6 on which the plurality of LEDs 4 are mounted, the LED sealing layer 5, and the intermediate film layer 3 were laminated.
次に、中間膜層３の上に、封止材である厚さ０．６ｍｍのＥＶＡシートを３枚積層した別の封止層１３を設けた。そして、この封止層１３の上に、厚さ５．０ｍｍの第１基板としての透明ガラス板８を積層した。 Next, another sealing layer 13 in which three EVA sheets having a thickness of 0.6 mm, which is a sealing material, were laminated on the intermediate film layer 3 was provided. Then, a transparent glass plate 8 as a first substrate having a thickness of 5.0 mm was laminated on the sealing layer 13.
以上の各積層が完了した積層体を熱圧着装置に投入して、約１５０度で１時間の熱圧着処理を行い、封止剤であるＥＶＡを架橋させることで、発電機能を持ち合わせた発光モジュール３１を作製した。 A light emitting module having a power generation function by putting the laminated body in which each of the above laminations is completed into a thermocompression bonding apparatus, performing thermocompression bonding processing at about 150 degrees for 1 hour, and crosslinking EVA as a sealant. 31 was produced.
この実施形態で作製した発電機能を持ち合わせた発光モジュール３１は、太陽電池９の発電面を例えば上方へ向けて、すなわち、透明ガラス板１１を上方へ向けて、主に建物の庇などに設置して利用される。ＬＥＤ４からの光は透明ガラス板８を経て外部（例えば下方）へ出る。 The light emitting module 31 having the power generation function produced in this embodiment is installed mainly on the eaves of a building, for example, with the power generation surface of the solar cell 9 facing upward, that is, with the transparent glass plate 11 facing upward. Used. Light from the LED 4 exits outside (for example, downward) through the transparent glass plate 8.
実施形態１〜３に係る発光モジュール１・２１・３１は、封止剤であるＥＶＡがきわめて安価であり、かつ、長期信頼性を確保することができるので、低コストで高信頼性の発光モジュールを提供することができる。 The light emitting modules 1, 21, and 31 according to the first to third embodiments are low cost and highly reliable light emitting modules because EVA that is a sealant is extremely inexpensive and long-term reliability can be ensured. Can be provided.
さらに配置された中間膜層３は、発光モジュール１・２１・３１に用いる封止層の積層を分断する構造を兼ねるものとなり、分断されていないＥＶＡの厚さを薄くすることが可能になることから、ＥＶＡの吸湿性を低減する効果も得られるものである。 Further, the arranged intermediate film layer 3 also serves as a structure for dividing the stack of sealing layers used in the light emitting modules 1, 21, and 31, and it is possible to reduce the thickness of the undivided EVA. Therefore, the effect of reducing the hygroscopicity of EVA can also be obtained.
本発明による発光モジュールは、その利用範囲が例えば建築物の壁面や庇、自動車のＴＯＰライト部などのように広いものである。また、発電機能を持ち合わせた発光モジュールは、昼間には太陽光を受光することにより発電し、夜間には発光ダイオードにより発光することが可能になり、照明装置や案内標識などとして利用することのできる環境配慮型商品である。 The light emitting module according to the present invention has a wide use range such as a wall surface of a building, a fence, and a TOP light part of an automobile. A light emitting module having a power generation function generates power by receiving sunlight in the daytime and can emit light by a light emitting diode at night, and can be used as a lighting device or a guide sign. It is an environmentally friendly product.
１ ： 発光モジュール
２ ： 第２封止層
３ ： 中間膜層
４ ： 発光ダイオード（ＬＥＤ）
５ ： 発光ダイオード封止層
６ ： 発光ダイオード基板
７ ： 第１封止層
８ ： 透明ガラス板（第１基板）
９ ： 半導体光電変換層（太陽電池）
１０ ： 発光ダイオード露出用の穴
１１ ： 透明ガラス板（第２基板）
１２ ： 第２封止層
１３ ： 別の封止層
２１ ： 発光モジュール
３１ ： 発光モジュール
1: Light emitting module 2: Second sealing layer 3: Intermediate film layer 4: Light emitting diode (LED)
5: Light-emitting diode sealing layer 6: Light-emitting diode substrate 7: First sealing layer 8: Transparent glass plate (first substrate)
9: Semiconductor photoelectric conversion layer (solar cell)
10: Hole for exposing a light emitting diode 11: Transparent glass plate (second substrate)
12: Second sealing layer 13: Another sealing layer 21: Light emitting module 31: Light emitting module
Claims (7)
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| JP2006245809A JP4382788B2 (en) | 2006-09-11 | 2006-09-11 | Light emitting module |
| PCT/JP2007/067593 WO2008032676A1 (en) | 2006-09-11 | 2007-09-10 | Light emitting module |
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| JP2006245809A JP4382788B2 (en) | 2006-09-11 | 2006-09-11 | Light emitting module |
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| JP4382788B2 true JP4382788B2 (en) | 2009-12-16 |
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| JP2009295736A (en) * | 2008-06-04 | 2009-12-17 | Sharp Corp | Light-emitting module |
| TW201123125A (en) * | 2009-12-21 | 2011-07-01 | Aussmak Optoelectronic Corp | Light transmissible display apparatus |
| JP2014127575A (en) * | 2012-12-26 | 2014-07-07 | Nitto Denko Corp | Sealing sheet |
| FR3003931B1 (en) * | 2013-04-02 | 2017-09-01 | Fd Eclairage Arch | LED MODULE FOR LUMINAIRE |
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| JP2001009963A (en) * | 1999-04-26 | 2001-01-16 | Toyo Ink Mfg Co Ltd | Laminate, production thereof and use thereof |
| KR100477746B1 (en) * | 2002-06-22 | 2005-03-18 | 삼성에스디아이 주식회사 | Organic electroluminescence device employing multi-layered anode |
| JP4031784B2 (en) * | 2004-07-28 | 2008-01-09 | シャープ株式会社 | Light emitting module and manufacturing method thereof |
| JP4302036B2 (en) * | 2004-10-20 | 2009-07-22 | シャープ株式会社 | Lighting device with solar cell and manufacturing method thereof |
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