JP4380408B2 - Electronic component sealing method - Google Patents

Description

  The present invention relates to a sealing and a sealing method suitable for hermetic sealing corresponding to miniaturization of electronic components, piezoelectric elements, and surface acoustic wave elements.

  Conventionally widely used sealing methods include a sealing container using a clad material and a sealing container using seam sealing. As an example of sealing, in the case of a sealed container constituting a piezoelectric oscillator or a piezoelectric vibrator, seam welded sealing is widely used in consideration of a high airtight environment and reliability.

This seam welded seal is a member called a seal ring in the vicinity of the sealing portion, for example, brazed to the sealing portion of a container made of a ceramic material, and nickel plating of a metal lid is performed to form a brazing material. In order to join the sealing part and lid of the container, a current and pressure by a roller are applied to the sealing part to melt the brazing material (plating) by heat generated from the seal ring, and the container and the lid are joined to form an airtight container. Constructing sealing method is used as mainstream.
JP 2002-203921 A JP 11-31748 A

  In the conventional seam welded sealing described above, since the melting temperature of the brazing material is high, heat stress is applied to the metal lid and the container due to the temperature generated during sealing, and the ceramic container may be damaged in some cases. There is.

  In addition, the brazing material that is plating is melted at a high temperature at the time of sealing, and there is a possibility that the plating material at a high temperature may be scattered inside the container, that is, inside the container that stores the piezoelectric components. Conceivable.

  In addition, in the case of a seam welded seal, as described in the background art of the related art, it is an indispensable member to arrange a seam ring in the seam welded seal. Therefore, the wall width (thickness) of the container is required to arrange the seam ring. On the other hand, since the container itself (for example, a piezoelectric vibrator or a piezoelectric oscillator) is desired to be reduced in size and weight, it is also necessary to reduce the wall width of the container in which the seam ring is arranged.

  As described above, in the airtight container using the conventional sealing method, there are problems with the temperature environment at the time of sealing, the problem of the sealing environment and the reduction in size and weight, so it is necessary to select better sealing conditions. There is a problem that there is.

In order to solve the problem, in the method of sealing an electronic component container that forms a sealed container structure by joining the container part and the lid part, the lid part is formed by applying a release material to the inside of the concave mold and sealing it inside Injecting the member and curing in a state where the sealing surface of the container contacts the sealing member, and taking out from the mold after the sealing member is cured, the lid part and the container are joined to form a sealed container It is the sealing method of the electronic component container.

  According to the present invention, when the lid portion is made of a material composed of metal fine particles of several nanometers and a dispersion material that can be combined with the metal fine particles, the labor of the sealing operation can be greatly reduced. Moreover, since the structure of the lid member is a few nanometer particles, the strain component at the joint with the container can be reduced, so that the strain component exerted on various elements housed in the sealed container can also be reduced. In addition, since the lid portion can be made of a conductive material, it can also have an effect of blocking high frequency noise with respect to an element stored in the container.

  Therefore, the present invention relates to an electronic component container that forms a sealed container structure by joining a container part and a lid part, wherein the lid part is made of metal fine particles of several nanometer particles and a dispersion material that can be combined with the metal fine particles. This is an electronic component container.

  At this time, the metal fine particles have an average particle diameter of 1 to 100 nm, gold, silver, copper, platinum, palladium, rhodium, osmium, ruthenium, iridium, iron, tin, zinc, cobalt, nickel, chromium, titanium, tantalum, tungsten. In addition, at least one kind of indium and silicon, or two or more kinds of metal alloy fine particles are used, and the dispersing material is amine, alcohol, or thiol.

  Further, in the method of sealing an electronic component container having a sealed container structure by joining the container part and the lid part, the lid part is formed by applying a release material to the inside of the concave mold, and injecting a sealing member therein. Curing in a state where the sealing surface of the container is in contact with the sealing member, and taking out from the mold after the sealing member is cured, the lid part and the container are joined to form a sealed container. The airtight container is composed of both nanometer-sized metal fine particles and a dispersing material that can be combined with the metal fine particles.

  In short, in the present invention, several nanometers as a condition for selecting a better sealing condition from the temperature environment at the time of sealing, which is a problem of the conventional seam welding sealing, the problem of the sealing environment and the miniaturization, the problem with respect to light weight It uses a metal particle fine particle and a sealing member made of a dispersion material that can be combined with the metal fine particle, and houses various electronic components such as piezoelectric vibrators, piezoelectric oscillators (including electronic components for driving), and surface acoustic wave devices. To do.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. In each figure, the same numerals indicate the same objects. FIG. 1 is a partial cross-sectional view showing the structure of an electronic component container 4 of the present invention. The lid part 2 is made of a material composed of metal particles of several nanometers as a sealing member 3 and a dispersion material that can be combined with the metal fine particles, and the container part 1 is made of a ceramic material. The lid part 2 and the container part 1 This constitutes a sealed container structure.

  At this time, the metal fine particles have an average particle diameter of 1 to 100 nm, gold, silver, copper, platinum, palladium, rhodium, osmium, ruthenium, iridium, iron, tin, zinc, cobalt, nickel, chromium, titanium, tantalum, tungsten. , Indium, and silicon, at least one type or two or more types of metal alloy fine particles are used, and amine, alcohol, and thiol are used as the dispersion material.

  FIG. 2 shows a cross-sectional view of the sealing form, but the components housed in the container include a piezoelectric vibrator, a quartz base plate, a surface acoustic wave element, an electronic component (capacitor, resistor, coil, integrated circuit). ). 2A shows a concave container, and FIG. 2B shows a container form in which the crystal base plate and the integrated circuit are separated.

  On the other hand, the flow chart shown in FIG. 3 shows that the lid part 2 and the container part 1 are made into a sealed container structure with the sealing member 3 (metal fine particles of several nanometer particles and a dispersing material that can be combined with the metal fine particles) used in the present invention. An example of the manufacturing process for this is shown.

  Specifically, in the sealing method of the electronic component container 4 which forms a sealed container structure by joining the container part 1 and the lid part 2, the lid part 2 is formed by applying a release material to the inside of the concave mold, The sealing member 3 is injected into the container and cured in a state where the sealing surface of the container is in contact with the sealing member 3. After the sealing member 3 is cured, the lid part 2 and the container are joined and sealed. It constitutes a container.

  In short, regarding the sealing method, a metal fine particle of several nanometers and a dispersion material that can be bonded to the metal fine particle are formed into a sheet shape with a predetermined size, and this sheet-like state is used as the lid portion 2 as it is. is there. As a sheet-like manufacturing method using the actual sealing member 3, a release material is applied to the inside of the mold as shown in FIG. 3, and the sealing member 3 is injected into the mold (FIG. 3 (a)). It hardens | cures in the state which made the sealing surface contact | abut the sealing member 3 (FIG.3 (b)), and if it removes from a type | mold after the sealing member 3 hardens | cures, it will seal in the state which the sealing member 3 used as the cover part 2 The container can be configured ((FIG. 3C). At this time, in order to stabilize the contact state with the sealing surface of the container, the sealing member 3 is formed at the time when the sealing member 3 is injected. It may be temporarily cured.

  As described above, by using a metal nanoparticle of several nanometers and a dispersing material capable of binding to the metal microparticle as the sealing member 3 and substituting for the lid part 2, various problems listed as conventional problems are solved. can do. In addition, although ceramic is mentioned as an example as a material of the container part 1 by the above-mentioned content, even if it is the container part 1 formed with resin, there exists the same effect, The metal microparticle of several nanometer particle | grains, and the said metal It is not related to a method of forming a dispersion material that can be combined with fine particles in the lid portion 2.

  The sealing member used in the present invention is not only for joining the lid part and the container part, but because the material itself used for the lid part is in place of the lid part, by processing the same material into a desired shape, It can also be applied and developed to obtain more versatile shapes and structures.

It is sectional drawing of the electronic component container which shows one Example of this invention. It is sectional drawing which shows the sealing form of this invention. It is a flowchart which shows the sealing method of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container part 2 Lid part 3 Sealing member 4 Electronic component container

Claims (1)

In the method of sealing an electronic component container that forms a sealed container structure by joining the container part and the lid part, the lid part is formed by applying a release material to the inside of the concave mold, injecting a sealing member into the container, An electronic component container characterized by being cured in a state where the sealing surface is in contact with the sealing member, and taking out from the mold after the sealing member is cured, thereby joining the lid part and the container to form a sealed container. Sealing method.

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