JP4368011B2 - Double floor structure and its construction method - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a double floor structure used when forming a double floor in an office or the like, such as a floor panel or a double floor panel including a border material used for the end of a column or a wall. A double-floor structure capable of starting up or pulling out wirings such as wiring and piping laid inside the double floor according to a required position from an opening at a floor surface position on the panel material, and It relates to the construction method.
[0002]
[Prior art]
In recent years, with the increase in use of office automation equipment in offices and the like, the necessity of such wiring processing and management / management has increased, and the use of free access floors such as double floor panels has expanded. With this free access floor, various wiring devices can be freely installed from the double floor surface to the user-friendly floor position required by the user according to the layout. It is often necessary to start up wiring from the inside of a double floor in order to connect to an OA device, near a desk, a wall, a pillar, or the like, for example, to connect to an OA tap or the like.
[0003]
In addition, the following structures and formation / construction methods are known as the rising structure of the wiring that inserts and starts up wiring (including piping and the like) laid in advance through the opening.
[0004]
(1) In the support leg type double floor panel, a notch is provided at the predetermined position of the upper surface of the panel so that an opening hole and a cutout for taking out the underfloor wiring can be formed or an opening hole can be formed as necessary. (Japanese Utility Model Laid-Open No. 60-152740, Japanese Patent Laid-Open No. 62-13651, Japanese Utility Model Laid-Open No. 62-101943, Japanese Utility Model Laid-Open No. 4-86844, Japanese Patent Laid-Open No. 4-222757).
(2) In some cabinets and piping / wiring equipment, an opening hole is formed by knockout so that piping / wiring can be inserted into a predetermined position on the side wall of the box (Japanese Utility Model Laid-Open No. 61-65817, No. 61-97884).
(3) There is a wiring outlet cover provided on the floor panel so that an insertion opening is opened in the cover so that the wiring can be taken out only at the cover installation position (Japanese Utility Model Laid-Open No. 4-118724, Japanese Utility Model Laid-Open No. 5). -89683, Japanese Utility Model Laid-Open No. 6-9330, Japanese Utility Model Laid-Open No. 6-62733, Japanese Utility Model Laid-Open No. 6-77430, Japanese Patent Laid-Open No. 11-44082).
(4) A border cover is prepared for a border material such as an end cover, and a number of opening holes are made in advance in this, and wiring is inserted from a necessary place as necessary to start up (Actual Hei 4) -36040, JP-A-7-317285, JP-A-9-119208).
(5) There is a special structure in which a large number of slits are formed in a floor panel by openings that vertically penetrate so that the remaining portion is in a lattice shape (Japanese Patent Laid-Open No. 9-88312).
(6) A large number of small blocks with legs and flat surfaces are gathered together through flexible sheets fixed over the entire surface of the small blocks, and the small parts are separated from the sheet portion on the approaching part. There is a laying panel in which a cable outlet can be opened by bending or cutting a block body and a sheet (Japanese Utility Model Laid-Open No. 3-111731).
[0005]
On the other hand, the following structure is widely known as a floor panel material and a border material for installation around a column and near a wall.
(7) Some small block bodies and supporting legs are arranged side by side to form a floor panel (Japanese Utility Model Publication No. 5-18427, Japanese Patent Application Laid-Open No. 10-102741, Japanese Patent Application Laid-Open No. 10-325232, Japanese Patent Application Laid-Open No. 11- 22165).
[0006]
As described above, in this type of technology, due to the response by each of the above structures, problems such as difficulty in construction, an increase in the number of parts, and troublesome handling of wiring on the floor remain. Wiring can be set up and pulled out.
[0007]
[Problems to be solved by the invention]
However, each of the above conventional techniques has the following problems.
[0008]
First, in the case of (1) and (2) above, since the wiring extraction opening is provided only at a predetermined position in the relatively large floor panel main body, cabinet and wiring apparatus main body, There is no degree of freedom, and the wiring start position is uniquely determined at the time of installation, and it is not possible to accurately start up the wiring at the optimal position for any use, for example, when you want to change the layout or ease of use Impossible.
[0009]
For example, when installing an opening in the floor panel, the opening is formed in the thickness part of the floor panel body, so it is necessary to consider maintaining the strength of the floor panel. The strength must be designed. For this reason, the design of the floor panel is difficult and the structure is complicated. Further, for example, it is difficult to provide a plurality of wiring rising openings so that the wiring can be set up at an arbitrary position on the floor panel body.
[0010]
Secondly, in the case of (3) and (4) above, since separate members such as a cover material and a border cover have to be used, there is a disadvantage that the number of parts increases and the cost increases. An increase in the amount of data also complicates the structure.
[0011]
Thirdly, in the case of (5) above, since a dedicated floor panel is provided in addition to the above (3) and (4), this also increases the complexity of the structure and the number of parts, which is low. Costing becomes very difficult.
[0012]
Fourthly, in the case of (6) above, since the cable outlet is opened by bending or cutting the small block body and the sheet, the opening larger than the size necessary for wiring removal or wiring to be drawn out For example, it is not possible to make the minimum opening necessary for use, and the appearance is not good.
[0013]
Fifth, when using panel materials and border materials with the structure as described in (7) above, it is very inconvenient because, for example, borders, pillars, etc. cannot be set up unless separate members such as border covers are used. is there. In particular, for a border material, there is a demand for a structure capable of reliably and easily starting up a wiring at an arbitrary position without increasing the number of parts, and a construction method thereof.
[0014]
As described above, in general, the start-up and removal of wiring may be necessary depending on the layout of the OA equipment or the like when installing the wiring equipment, for example, near the wall or around the pillar after installing the panel material or border material. In particular, with the recent increase in the use of OA equipment, there is a great need in the double-floor industry for the need for good wiring start-up / drawing at an arbitrary and optimal position in the actual office environment where each person has a personal computer. Is growing.
[0015]
The present invention has been made in view of the above-described conventional problems, and the object of the present invention is to start up the wiring laid inside the double floor or the double floor structure used as a panel material or a border material. It is an object of the present invention to provide a double-floor structure that can be pulled out easily and satisfactorily with a very simple configuration, and that can reliably perform a smooth wiring start-up at an arbitrary position, and a construction method therefor. .
[0016]
[Means for Solving the Problems]
  The double-floor structure of the present invention has a plurality of supports and wiring inside.spaceA double-floor structure in which is formed,A connecting portion for connecting the supports is formed integrally with the support, and a cutting portion or a cut portion capable of dividing the double floor structure is provided in the connecting portion, and a lower side of the connecting portion. At least a part of the wiring space is formed,On the upper surface of the double-floor structure, there is a wiring drawing area that becomes an opening for drawing wiring,By openingA plurality of wirings are arranged at predetermined intervals so as to communicate with the wiring space.The wiring drawing area can be opened by, for example, punching or excision, and the cutting section or the cutting section is formed, for example, by a plurality of predetermined sections on the upper surface of the double floor structure. Provided.
[0017]
  Further, the double floor structure of the present invention is a double floor structure in which a wiring space is formed inside by a plurality of supports,A cutting part or a cutting part capable of dividing the double floor structure is provided,Wiring extraction areas are provided at predetermined intervals on the top surface of the double floor structure.A plurality of wiring drawing areas are provided, and at least a part of the wiring drawing area can be opened and is provided across the cutting part or the cutting part.It is characterized by that.The wiring drawing area can be opened by, for example, punching or excision, and the cutting section or the cutting section is formed, for example, by a plurality of predetermined sections on the upper surface of the double floor structure. Provided.
[0018]
The double floor structure of the present invention is a double floor structure in which a wiring space is formed inside by a plurality of supports, and at least a connecting portion is provided between the supports. A wiring drawing area is provided at predetermined intervals so as to communicate with the wiring space on the support or the connecting portion, which is the upper surface of the heavy-floor structure. That is, the wiring line drawing area is provided in the connecting portion or the support body or in both the connecting portion and the support body.
[0019]
  Further, the double floor structure of the present invention is a double floor structure in which a wiring space is formed inside by a plurality of supports,A connecting portion for connecting the supports is provided, and the connecting portion is provided with at least a plurality of cutting portions or incisions capable of dividing the support,Top surface of double floor structureA plurality of wiring drawing regions are arranged at predetermined intervals.It is characterized by that.The wiring drawing area can be opened by, for example, punching or excision, and the cutting section or the cutting section is formed, for example, by a plurality of predetermined sections on the upper surface of the double floor structure. Provided.In addition, the double floor structure of the present invention,A connecting portion that is thin and flexible and connects the supports is provided, at least a part of the wiring space is formed below the connecting portion, and the wiring drawing area Is provided in the connecting portion, and the upper surface of the support and the connecting portion form a substantially coplanar ceiling surface..
[0020]
  And the construction method of the structure for double floors of this invention is construction of the structure for double floors where wiring space is formed in the inside by a plurality of supports, and the wiring drawing area is provided on the upper surface. In the method, a step of laying the double floor structure as a panel material in a predetermined space on the floor surface, and a border of the double floor structure in a remaining space of the floor surface other than the space where the panel material is laid A step of laying as a material, and for drawing out the wiring of a required route laid in the wiring space from the panel material to the border material from the desired wiring drawing area of the border material, as necessary And a step of opening a wiring drawing area and drawing the wiring from the wiring drawing area.Further, the construction method of the double floor structure of the present invention is the construction method using the double floor structure of the present invention, wherein the double floor structure is laid as a panel material in a predetermined space on the floor surface. Laying the double floor structure as a border material in the remaining space on the floor surface other than the space where the panel material is laid, and laying in the wiring space from the panel material to the border material And a step of pulling out the wiring of the required route from the desired wiring drawing area of the border material.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the double floor structure according to the present invention and the construction method thereof will be described based on specific embodiments shown in the drawings, but the present invention is not limited to such embodiments. FIG. 1 is a perspective view showing a construction state of the double floor structure of the first embodiment, and FIG. 2 is a partial perspective view showing a modification of the double floor structure of FIG.
[0022]
The double-floor structure 1 in the figure is laid on the floor surface as a panel material, and is laid between a plurality of supports 10 arranged in a plane at predetermined intervals and between the supports 10. In the structure 1, a wiring space 30 enclosed between the supports 10 and surrounded by the connection portion 20 and a wiring space 30 in the support 10 are formed inside the structure 1. The main portion of the connecting portion 20 is provided with a wiring drawing area 40 (40a) that can be opened by punching (knockout) or excision. The structure 1 is formed by integrally forming a plurality of supports 10 and a connecting portion 20 between the supports 10, but is formed by installing a separate connecting portion 20 between the plurality of supports 10. It is also possible to do.
[0023]
The predetermined interval for arranging the plurality of supports 10 is equal in the structure 1 but may be different as required. The structure 1 may be changed in the number of supports 10 arranged in parallel. In addition, it can be used as a border material such as an end finish used around a column or near a wall. Therefore, the structure 1 can be used as a double-floor basic panel, a border panel, a water supply, a pipe laying panel for gas, and the like. Also, the wiring lead-out regions 40 are provided at equal intervals, but may be provided at predetermined intervals such as at different intervals.
[0024]
The support 10 may have a suitable shape such as a table having the support legs 11 shown in FIG. 1 or a small block shown in FIG. 2 and may have a solid structure. However, the support 10 is hollow in order to reduce the weight. The shape may be an open bottom surface, or may be formed by integral molding (such as aluminum die casting) of resin or metal. Further, if necessary, reinforcing ribs (not shown) may be formed on the inner surface or the outer surface to improve load resistance and rigidity.
[0025]
The connecting portion 20 has a function of connecting or connecting a plurality of supports 10. In the case of FIGS. 1 and 2, the connecting portion 20 is installed at the upper end of the side surfaces of the supports 10, and the connecting portion 20 is supported. Together with the upper surface 10 a of the body 10, the ceiling surface is substantially flush with the upper surface of the structure 1. The connecting portion 20 may be provided so as to protrude from the side surface or the side of the support portion 10, and can be provided at the upper end, the lower end, or a substantially intermediate position, and is not limited to the case where the support portions 10 are entirely connected to each other. You may connect partially (refer FIG.3, FIG.4, FIG.5, FIG.7 etc.). Therefore, the support portions 10 may be connected to each other by the connecting portion 20 without forming a substantially coplanar ceiling surface, and the upper surface of the structure 1 has, for example, a step between the upper surface 10a of the support portion 10 and the upper surface 10a. In some cases, the connecting portions 20 are not substantially flush with each other. The entire upper surface of the structure 1 may be configured by the connecting portion 20.
[0026]
The connecting portion 20 may be a thin connecting portion that is thinner than the thickness of the block in the height direction or the thickness of the block, and has non-land followability and non-land absorbability so as to follow the unevenness of the floor surface to be constructed. Flexibility may be provided to provide. However, giving the connecting portion 20 flexibility is a suitable configuration, but it is not absolutely necessary and is optional.
[0027]
The connecting portion 20 is formed with a cutting portion 21 having a substantially V-shaped cross section or a substantially concave shape that can be cut along the center, and the double-floor structure 1 is cut by a cutting portion 21 or a cutting portion 41 described later. It can be cut to a predetermined size according to the laying area using a tool such as a cutter, and can be divided into a plurality of sections surrounded by the connecting portion 20, so that it can be used for panel materials, pillar ends, wall ends, etc. Necessary sections such as materials can be formed. Note that the structure 1 can be recognized and used as a plurality of partitioned regions even when the structure 1 is not divided by the lines of the cutting portion 21 and the cutting portion 41. A wiring space 30 to be described later can also be formed between the sections of the structure 1 divided as described above.
[0028]
The wiring space 30 is formed by a connecting portion 20 between the supports 10, and wirings 50 such as wiring and piping are laid in the wiring space 30 substantially vertically and horizontally in a required route. Further, a wiring space 30 is also formed inside the support 10 such as between the support legs 11 in FIG. 1, and wiring 50 of a required route can be laid in the wiring space 30 as necessary. Therefore, for example, it is necessary to have a space where at least a variety of wiring and piping such as a single power / telephone / information line can be laid and the required route can be formed.
[0029]
The wiring space 30 is, for example, a wiring route, and the wiring route is a predetermined route for laying wiring, piping, etc., between the connecting portions 20 between the supports 10 or between the support legs 10, or a wiring groove or the like. When the double floor structure 1 is laid, the predetermined path is formed. Then, by providing the wiring lead-out region 40 on the upper surface of the double floor structure 1 so as to communicate with the wiring route, it is possible to start up the wirings such as wiring and piping gently. The configuration of the wiring space 30 is not limited to the wiring route described above, and includes everything formed inside the double floor structure 1.
[0030]
The wiring lead-out area 40 can be opened by applying a predetermined pressure to raise or pull out the wiring 50 laid in the wiring space 30, and can be opened by the connecting portion 20 forming the upper surface of the structure 1. At least a portion is formed as an area 40a that can be opened by punching with a hammer or the like or cutting with a cutting tool. If the region 40a is defined in advance by the notch 41, or if it is defined by the notch 41 and the cutting portion 21, it is preferable that the region 40a is easily cut when opening as a guide for the punching or excision.
[0031]
The wiring lead-out region 40 having a width dimension D shown in FIG. 2 is provided on the connecting portion 20 so as to straddle the cutting portion 21, and the line of the cutting portion 21 that allows the structure 1 to be divided into a plurality of predetermined sections. It is defined and set by the line of the cut portion 41. Then, when forming an opening in the wiring lead-out area 40, as shown by the mesh pattern in the figure, the opening is partially opened with a predetermined size according to the opening forming position required for use by changing the layout, for example. (For example, the X dimension shown in FIG. 2 and the Y dimension shown in FIG. 3). For example, when recognizing a plurality of divided areas that are divided or not divided by the line of the cutting part 41 instead of the line of the cutting part 21, the size is divided into the B dimension and the H dimension shown in FIG. The area is recognized.
[0032]
The wiring lead-out area 40 may be provided on the upper surface of the structure 1 at predetermined intervals such as equal intervals or different intervals, and the installation position thereof is a predetermined area that is at least a part of the connecting portion 20 or the upper surface of the support portion 10. It is provided in a predetermined area 10a. In addition, the opening of the wiring drawing area 40 has an appropriate shape and diameter as long as the required wiring 50 such as piping and various wirings can be inserted and can be started up and pulled out. It is preferable to have a size that does not cause wrinkles or the like to drop, and the planar shape can be a predetermined shape such as a substantially U shape, a substantially U shape, a substantially V shape, or a substantially semicircular shape.
[0033]
Here, in the double-floor structure of the present invention, the wiring lead-out area 40 is, for example, punched out (knocked out) by applying a predetermined pressure, as shown in FIG. 1, FIG. 2, FIG. 3, FIG. It is a region 40a that can be opened by excision or the like, or an opening region 40b that can be inserted with a previously opened wiring 50, or the openable region 40a and the opening region 40b. Therefore, in addition to the openable area 40a, for example, an open area 40b through which wiring can be inserted may be formed in advance (see FIG. 5). When the wiring area 40 is used, for example, when the structure 1 is divided into predetermined sections by the cutting part 21 or the cutting part 41 provided in at least a part of the connecting part 20, the required wirings are used. When the opening is formed in the drawing area 40 by punching or cutting, the wiring 50 may be inserted into the required wiring drawing area 40 by using the opening area 40b formed in advance.
[0034]
When the double-floor structure 1 of the above embodiment is used, wiring 50 is laid in the wiring space 30 of the structure 1 partitioned and laid as necessary, and the wiring drawing area 40 Among them, for example, the mesh pattern region shown in FIG. 2 is punched or cut by using the cut portion 41 or, in some cases, the cutting portion 21 to form an opening, and wiring 50 laid from the opening is shown in the figure. Launch as shown by the two-dot chain line. As shown in FIG. 1, a finishing material 60 such as carpet or sheet is laid on the upper surface of the structure 1, and a notch 60 a is provided at a position corresponding to the opening, and wiring such as various wirings is provided from the finishing material 60. Class 50 will be pulled out.
[0035]
Here, a modification of the above embodiment will be described. 3A is a plan view showing a modified example of the connecting portion, FIG. 3B is a side view of the modified example shown in FIG. 3A, and FIG. 4 is a side view showing another modified example of the connecting portion. is there.
[0036]
In the case of the example shown in FIG. 3, a modification example is shown in which the area of the wiring lead-out region 40 is set smaller than that in the above embodiment and can be selectively opened at different cutting positions by the cutting part 21 and the cutting part 41. For example, it is configured to open the selected required position of the wiring pattern extraction region 40 having a mesh pattern shown in FIG. The same applies to the case of FIG. 4, but the connecting portion 20 and the wiring drawing region 40 are installed not in the upper ends of the supports 10 but near the center of the side surfaces, and the upper surface of the structure 1 is connected to the upper surface 10 a of the support 10. The connecting portion 20 is configured with a step.
[0037]
Next, a double floor structure according to another embodiment will be described. FIG. 5 is a perspective view showing a construction state of the double floor structure of the second embodiment.
[0038]
In FIG. 5, the double-floor structure 1 is different from the above embodiment in that a plurality of hollow columnar support portions 10 are arranged side by side, and the connecting portions 20 installed between the support bodies 10 are substantially in the same plane and are supported. The upper ends of the body 10 are connected to each other. The connecting portion 20 is provided integrally or separately on the upper portion of the support body 10, and an opening is formed at a position located on the upper portion of the hollow support portion 10, and the support portion 10 is formed inside the connecting portion 20. A wiring lead-out region 40, which is an opening region 40b, is formed at the intersection between the cut portions 21 therebetween. The opening area 40b is previously opened so that wirings can be inserted, and is different from the above embodiment. In addition, an opening region 40b that is half the size of the opening region 40b at the intersection is formed in advance at the peripheral edge of the connecting portion 20 of the structure 1.
[0039]
When the structure 1 is linearly cut in one direction by the cutting part 21, the opening region 40 b at the intersection has a half area on the cutting line and is a half located at the periphery of the connecting part 20. The opening is the same as the opening region 40b. That is, if the cutting portion 21 is linearly cut with a predetermined size of a support 10 unit such as a block, the half opening region 40b can be easily formed. In this embodiment, it is appropriate to provide a region 40a that can be opened by punching or cutting at a predetermined location, and 60 is a finishing material.
[0040]
FIG. 6 is a perspective view showing a construction state of the double floor structure of the third embodiment. In the double-floor structure 1 of the present embodiment, the support body 10 forms a substantially I-shaped support leg in a side view, and a top plate connecting portion 20 is installed at the upper end between the support bodies 10. The connecting portion 20 is provided integrally with or separately from the support 10, and the connecting portion 20 is formed with a number of wiring drawing regions 40 that are regions 40 a that can be opened by punching or cutting. The position and form of the wiring line drawing area 40 are arbitrary, but are preferably provided in a predetermined regular arrangement. Then, a necessary wiring or the like drawable area 40 (40a) is punched or cut as necessary to form an opening.
[0041]
7 is a perspective view showing a construction state of the double floor structure of the fourth embodiment, FIG. 8 is a plan view showing the double floor structure of FIG. 7, and FIG. 9 is a double floor structure of FIG. It is a perspective view which shows the back surface of a body.
[0042]
In the double-floor structure 1 of the present embodiment, the support body 10 is a support leg-integrated block body, and each support body 10 forms a ceiling on the upper surface of the block body, so that the support body 10 is located above the support legs 11. Are connected to each other, and the connecting portion 12 is provided with a wiring lead-out area 40 (40a) that can be opened by punching or cutting, and the support legs of each support 10 that is a block body. A wiring space 30 in which wirings 50 of a required route can be laid between 11 is formed. The support leg 11 is hollowed for weight reduction. Further, a connecting part 20 is installed at the lower end of the side surface between the supports 10, and a line of a cutting part 21 is formed along the center of the connecting part 20, and it is supported by cutting along the cutting part 21. The bodies 10 can be separated from each other. Therefore, the structure 1 can be easily divided into a predetermined size and cut according to the laying area or the like. Then, at a predetermined position such as an end face position cut along the cutting portion 21, the wiring 50 laid by opening the wiring extraction region 40 (40a) can be started.
[0043]
Here, a modified example of the support 10 will be described. 10A is a side view showing a modified example of the support, FIG. 10B is a plan view of the back surface of the modified example shown in FIG. 10A, and FIG. 10C is shown in FIG. FIG. 11A is a side view showing another modification of the support, FIG. 11B is a plan view of the back surface of the modification shown in FIG. 11A, and FIG. FIG. 11C is a perspective view of the back surface of the modification shown in FIG.
[0044]
In the double-floor structure 1 shown in FIGS. 10A to 10C, each support 10 has a horizontal support plane 11 having a substantially triangular shape and has a hollow support leg 11. The connecting portion 20 is provided to form a ceiling surface (upper surface), and the support legs 11 and the support 10 are connected to each other. The connecting portion 20 is formed with openable wiring lead-out areas 40 (40a) surrounded by the cut portions 41 on the four sides of each support 10, and a cut portion is formed at a portion that forms a boundary between the supports 10. 21 is provided.
[0045]
Further, as shown in FIG. 2B, a flat cross-shaped rib 13 is provided on the back surface of the connecting portion 20 to connect the four support legs 11 diagonally in order to improve the strength of the support 10. ing. Between the support legs 11, a wiring space 30 is formed in a substantially octagonal plane shape, and wirings 50 of a required route are laid in the wiring space 30 as shown in FIGS. For example, when a wiring is laid, the wiring can be easily bent and the wiring can be easily pulled out.
[0046]
The support 10 of the double-floor structure 1 shown in FIGS. 11 (a) to 11 (c) has a similar structure to that shown in FIG. 10, but each support leg 11 has a substantially square shape and is located at one corner located in the center. The supporting legs 11 adjacent to each other are coupled to each other by ribs 13. The four support legs 11 connected by the ribs 13 are integrally formed. Further, in this configuration, the wiring space 30 is effectively formed in a wide range between the support legs 11 and in the central portion, and wiring 50 laid on a required route, for example, wiring is extremely easy inside the wiring space 30. It is possible to perform direction change and withdrawal processing. Other configurations are the same as those in FIG.
[0047]
Still another embodiment will be described. FIG. 12 is a perspective view showing the double-floor structure according to the fifth embodiment, and FIG. 13 is a perspective view showing the double-floor structure according to the sixth embodiment.
[0048]
The double-floor structure 1 in FIG. 12 has a configuration similar to that of the embodiment in FIG. 5, but a wiring drawing area 40 is provided in the connecting portion 20 on the substantially same plane provided at the upper end of each support portion 10. As shown, an area 40 a that can be opened by punching or cutting is provided, and an opening area 40 b is provided along one side of the flat connecting portion 20. The region 40 a is formed by being surrounded by a three-way cut portion 41 along one side of the flat plate-like connecting portion 20, or by being surrounded by a three-way slit 42 inside the connecting portion 20. . The cut portions 21 are formed to be connected to each end portion of the slit 42, and the connecting portions 20 are partially coupled to each other. The region 40a surrounded by the slit 42 is configured to be opened at the same time as the structure 1 is cut by the cutting portion 21.
[0049]
The double-floor structure 1 in FIG. 13 is formed by linking a support 10 as a block body with a connecting portion 20 installed at the upper end thereof. An area 40 a that can be opened by punching or cutting is provided as the extraction area 40. The region 40a is surrounded by a U-cut or V-cut cut portion 41, and an end portion of the cut portion 41 is provided with a hole 41a for facilitating opening at a predetermined location. A cut portion 21 is formed at the end portion of the hole 41 a so that the structure 1 can be cut along the cut portion 21. In addition, it is good also as a structure which provides the slit 42 instead of the notch part 41 like FIG.
[0050]
In the double-floor structure 1 of the above-described embodiment, an area 40a that can be opened by punching or excision, an opening area 40b that is provided in advance, or a wiring extraction area that includes both the area 40a and the area 40b. 40 is a position above the wiring space 30 provided at a predetermined position of the upper surface of the support 10 including the connecting portion 12 or the connecting portion 20 between the supports 10, for example. The position of the wiring is appropriate, and it is desirable that the wiring or the like can be gently lifted upward from a required route of the wiring space 30.
[0051]
Further, the wiring lead-out region 40 can be formed in the thin connecting portion 20 between the supports 10 and is surrounded so as to be at least in contact with a cut line including the cutting portion 21, the cutting portion 41, the slit 42, and the like. It is preferable to form them. At this time, for example, when the wiring lead-out region 40 is in contact with at least the cutting portion 21, the region 40 contacts the outer periphery along the cutting line when the structure 1 is divided into a plurality of sections. When the region 40 is an openable region 40a or the like, there is an advantage that the formation of the opening on the outer periphery of the partition becomes easier, and a configuration may be adopted in which the opening is made simultaneously with the cutting as shown in FIG.
[0052]
Next, a construction method of the double floor structure 1 will be described.
[0053]
First, the double-floor structure 1 having a plurality of support bodies 10 installed at the connecting portion 20 and having a wiring drawing area 40 is laid as a panel material in a predetermined space on the floor surface. Then, the remaining space on the floor surface after the panel material is laid, for example, a separate double floor structure 1 or a predetermined section obtained by cutting and dividing the double floor structure 1 at the wall or around the pillar is a border. Lay as a material. Since both the panel material and the border material have a wiring space 30 in which wiring 50 of a required path can be laid, for example, between the supports 10, the wiring space 30 is required in parallel with the above process. Lay route wiring and so on.
[0054]
When the wiring line extraction area 40 is an area 40a that can be opened by punching or excision, the area 40a in the vicinity corresponding to the desired wiring extraction position in the border material or the like is punched out (knocked out) or excised. Open at. Further, when the wiring lead-out area 40 is an opening area 40b formed in advance, it is used as it is.
[0055]
Thereafter, the wiring 50 laid on the required route in the wiring space 30, for example, the wiring, is raised from the area 40 by using the desired wiring drawing area 40 in an open state. Then, a carpet, a sheet, or the like is laid on the upper surface of the structure 1 as the finishing material 60, and the wiring is drawn out by providing a cut 60a or the like at the rising position.
[0056]
As described above, at any wiring drawing position, the wiring drawing area 40 in the vicinity corresponding to the desired wiring drawing position is selected, and the wiring 50 is drawn using the area 40 in the open state. Do. In particular, when the region 40 is a region 40a that can be opened by punching or excision, the necessary and minimum opening of the region from which the wiring 50 can be drawn out can be simplified by punching (knocking out) or excising the region 40a. It can be formed reliably and easily. The method of punching and excision may be any method as long as the wiring 50 can be pulled out, and the method is not limited.
[0057]
According to the double floor structure 1 and its construction method, the wiring 50 is laid on a required route by effectively using the wiring space 30 between the supports 10 or the like, and the laid wiring 50 is placed at a desired position. Since the wiring can be raised upward from the wiring lead-out area 40, it is not necessary to bend the wiring extremely, such as 90 degrees, and natural startup is possible.
[0058]
In addition, when the area 40a that can be opened by punching or excision is used as the wiring drawing area 40, for example, while maintaining the good flatness and high strength of the upper surface of the double floor structure 1, Wiring can be started up in the vicinity etc. by simply forming the necessary and minimum opening by punching or excising from any necessary position such as every 10 units of the predetermined support body, and the construction is simple and reliable. It can be carried out. That is, the wiring start-up opening can be formed by construction by simple punching or cutting work at the site.
[0059]
Moreover, since the wiring drawing area 40 is formed in the double floor structure 1 itself, there is no need to use a border cover provided with a wiring drawing opening or a separate member for forming the opening. The number of points and materials can be reduced, thereby reducing the cost and the ease of construction. The double floor structure 1 can be formed by integral molding to have a simple structure.
[0060]
【The invention's effect】
Since the double floor structure and the construction method thereof according to the present invention are configured as described above, in the double floor structure used as a panel material or a border material, the wiring set up or drawn out inside the double floor Can be easily and satisfactorily performed with an extremely simple configuration. Further, there is an effect that smooth wiring start-up and the like at an arbitrary desired position can be surely performed. Therefore, it is possible to improve the workability of wiring drawing or handling such as wiring drawing around the pillar and near the wall, changing the wiring drawing, moving and adding.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a construction state of a double-floor structure according to a first embodiment.
2 is a partial perspective view showing a modification of the double-floor structure in FIG. 1; FIG.
FIG. 3A is a plan view showing a modification of the connecting portion.
(B) The side view of the modification shown to the figure (a).
FIG. 4 is a side view showing another modification of the connecting portion.
FIG. 5 is a perspective view showing a construction state of the double-floor structure according to the second embodiment.
FIG. 6 is a perspective view showing a construction state of the double-floor structure according to the third embodiment.
FIG. 7 is a perspective view showing a construction state of the double-floor structure according to the fourth embodiment.
8 is a plan view showing the double-floor structure of FIG.
9 is a perspective view showing the back surface of the double floor structure of FIG. 7. FIG.
FIG. 10A is a side view showing a modification of the support.
(B) The top view of the back surface of the modification shown to the figure (a).
(C) The perspective view of the back surface of the modification shown to the figure (a).
FIG. 11A is a side view showing another modification of the support.
(B) The top view of the back surface of the modification shown to the figure (a).
(C) The perspective view of the back surface of the modification shown to the figure (a).
FIG. 12 is a perspective view showing a double-floor structure according to a fifth embodiment.
FIG. 13 is a perspective view showing a double floor structure according to a sixth embodiment.
[Explanation of symbols]
1 Double floor structure
10 Support
20 connecting part
21 Cutting part
30 Wiring space
40, 40a, 40b Wiring area
41 notch
50 Wiring

Claims (5)

A double floor structure in which wiring spaces are formed inside by a plurality of supports,
A cutting part or a cutting part capable of dividing the double floor structure is provided,
It is more disposed wiring tubing accommodation area within each Jo Tokoro intervals on the upper surface of the double-floor construction,
A double floor structure characterized in that at least a part of the wiring lead-out area is openable and is provided across the cut part or the cut part . A double floor structure in which wiring spaces are formed inside by a plurality of supports,
A connecting portion for connecting the supports is provided;
The connecting portion is provided with at least a plurality of cutting portions or cutting portions capable of dividing the support body,
A double floor structure, wherein a plurality of wiring drawing regions are arranged at predetermined intervals on the upper surface of the double floor structure. A double floor structure internal wiring such space Ru formed by a plurality of supports,
A connecting portion for connecting the supports is formed integrally with the support,
A cutting part or a cutting part capable of dividing the double floor structure is provided in the connection part,
At least a part of the wiring space is formed below the connecting portion,
A plurality of wiring drawing areas serving as wiring drawing openings are provided on the upper surface of the double floor structure at predetermined intervals so as to communicate with the wiring space by being opened. Characteristic double floor structure. A connection portion is provided that is thin and flexible and connects the supports.
At least a part of the wiring space is formed below the connecting portion, and the wiring drawing area is provided in the connecting portion;
The double-floor structure according to any one of claims 1 to 3, wherein the upper surface of the support and the connecting portion form a substantially coplanar ceiling surface . In the construction method of the double floor structure according to any one of claims 1 to 4 ,
A step of laying a prescribed space floor the double floor construction as a panel member,
A step of laying the double floor construction to the remaining space of the floor other than the space in which the panel material is laid as a border member,
Double floor construction the wirelines, characterized in that a step of pulling out the desired the wire tubing accommodation region of the border material laid down by the required path to the wiring such space toward the border material from said panel member Construction method.

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