JP4364768B2 - Thermocompression bonding equipment - Google Patents

Description

  The present invention relates to a thermocompression bonding apparatus in which an object to be bonded held on a pressure bonding table is thermocompression bonded by a thermocompression bonding tool.

  In a thermocompression bonding apparatus that thermocompresses an object to be bonded such as an FPC (Flexible Printed Circuit) substrate, which is temporarily bonded to an attachment portion of an LCD glass substrate through an anisotropic conductive film such as an ACF (Anisotropic Conductive Film) tape. A thermocompression tool having a pressing surface facing each other and a crimping table, and the heated thermocompression tool is pressed against the object to be bonded with a predetermined crimping load in a state where the mounting portion of the glass substrate is placed on the crimping table. The object to be bonded is thermocompression bonded to the mounting portion of the glass substrate.

  This type of thermocompression bonding equipment is equipped with a load measuring device that measures the crimping load in order to prevent crimping failure due to fluctuations in the crimping load, and the crimping load is constantly monitored by the load measuring device or by a load measuring device. The crimping load is appropriately measured.

  For example, the one described in Patent Document 1 is designed so that the pressure-bonding load can be constantly monitored, and a load cell for pressure-bonding load measurement is provided at a joint portion connecting the pressure cylinder and the thermo-compression-bonding head. When the crimping load at that time is out of the set range, the thermocompression bonding apparatus is automatically stopped so that the operator can quickly inspect the thermocompression bonding apparatus and readjust the crimping load.

Further, what is described in Patent Document 2 is a load cell in which a crimping load can be appropriately measured as necessary, and a crimping table on which a body to be crimped is placed on a movable table and a load cell. A unit is provided, and the table can be moved to position the crimping table below the thermocompression bonding head during thermocompression bonding, and when measuring the load, the load cell unit can be positioned below the thermocompression bonding head to monitor the pressure applied to the thermocompression bonding head. It is like that.
Japanese Patent Laid-Open No. 2002-260805 (paragraphs 0016 and 0021, FIG. 1) JP-A-9-162242 (paragraphs, 0021, 0022, 0028, FIG. 1 and FIG. 3)

  Although the thing of above-mentioned patent document 1 has the advantage which can always monitor a crimping | compression-bonding load, since a load cell must be arrange | positioned in the position away from the crimping | compression-bonding head, the applied pressure in a crimping head front-end | tip part, and a load cell There is a problem that a deviation between the measured value and the measured value is unavoidable, and accurate pressure control cannot be performed. And the thing of patent document 1 also has the problem which has to interrupt a thermocompression-bonding operation | work at the time of the maintenance and inspection of a load cell unit.

  On the other hand, although the thing of above-mentioned patent document 2 has an advantage which can solve each problem in above-mentioned patent document 1, since a crimping stand is provided on the movable table, uniform crimping is realized. It may be an obstacle to In other words, in order to achieve uniform crimping, high parallelism between the thermocompression bonding tool and the crimping table is required. However, since the table is configured to move, the crimping table slightly tilts due to backlash and strain, and heat There was a problem that it was difficult to obtain high parallelism between the crimping tool and the crimping table.

  The present invention has been made to solve the above-described conventional problems, and can fix the crimping base, easily obtain high parallelism with the thermocompression bonding tool, and position the load measuring device close to the thermocompression bonding tool. It is intended to provide a thermocompression bonding apparatus that can be placed in the position and can accurately measure the pressure bonding load.

  In order to solve the above-mentioned problem, the invention according to claim 1 is provided such that a thermocompression bonding tool is provided so as to be movable in the vertical direction with respect to the crimping table disposed in the fixed portion, and the thermocompression bonding tool is moved vertically. In a thermocompression bonding apparatus for thermocompression bonding an object to be bonded held on a pressure bonding table, a load measuring device for measuring a pressure bonding load of a thermocompression bonding tool applied to the pressure bonding table is provided, and the load measuring device is connected to the thermocompression bonding tool. A drive device is provided that moves between a work position between the crimping table and a retracted position retracted from the work position.

  According to a second aspect of the present invention, in the first aspect, the load measuring device includes a load cell and a cooling means for cooling the load cell.

  According to a third aspect of the present invention, in the first or second aspect, the load measuring device includes a load cell accommodating portion that accommodates the load cell, and the load cell accommodating portion includes the load cell, the thermocompression bonding tool, and The heat insulating material interposed between each said crimping | compression-bonding bases is provided.

  According to a fourth aspect of the present invention, in the first aspect, the driving device includes a back-and-forth moving means for moving the load measuring device back and forth between the working position and a retracted position, and the thermocompression bonding of the load measuring device. It is comprised by the raising / lowering means to raise / lower in the moving direction of a tool, It is characterized by the above-mentioned.

  According to the invention according to claim 1 configured as described above, the load measuring device for measuring the crimping load of the thermocompression bonding tool applied to the crimping table includes the work position between the thermocompression bonding tool and the crimping table and the work. Since it is moved between the retracted position and the retracted position from the position, the crimping table can be arranged on the fixed part, and this makes it easy to obtain high parallelism between the thermocompression bonding tool and the crimping table. In addition to realizing a uniform crimping operation, the load measuring device can be arranged at a position close to the thermocompression bonding tool, so that the crimping load can be accurately measured.

  According to the invention according to claim 2 configured as described above, since the load cell can be cooled by the cooling means, there is no need to wait for the thermocompression bonding tool to cool down, and it is not necessary to wait for the thermocompression bonding tool to cool down. Immediately after that, it becomes possible to measure the crimping load, and there is an effect that the measurement can be performed in a short time.

  According to the invention according to claim 3 configured as described above, since the heat insulating material is provided between each of the load cell, the thermocompression bonding tool, and the crimping base, The thermal shutoff has an effect of suppressing the temperature rise of the load cell, and particularly when used in combination with the cooling means described above, has an effect of effectively preventing the temperature rise of the load cell.

  According to the invention according to claim 4 configured as described above, the load cell accommodated in the load cell accommodating portion of the load measuring device can be disposed between the thermocompression bonding tool and the crimping table by the back-and-forth movement means of the driving device. Further, the load cell storage portion of the load measuring device can be brought into contact with the crimping table by the lifting / lowering means of the driving device, and there is an effect that the crimping load can be easily and accurately measured by the thermocompression bonding tool.

  Hereinafter, an example in which an embodiment of the present invention is applied to main pressure bonding in a driver chip mounting process of a liquid crystal panel will be described with reference to the drawings.

  In FIG. 1, reference numeral 10 denotes a thermocompression bonding apparatus for thermocompression bonding an object to be bonded 13 temporarily bonded to a mounting portion 12 of a substrate 11 such as an LCD glass substrate. The pressure-bonded body 13 is thermocompression-bonded between the pressing surface 17 of the thermocompression bonding tool 15 and the pressing surface 18 of the pressure-bonding table 16. The thermocompression bonding apparatus 10 includes a load measuring device 21 for measuring a crimping load acting on the thermocompression bonding tool 15, a drive device 22 for moving the load measuring device 21 back and forth, and moving up and down, and each of the devices 10, 21, 22. It is comprised with the control apparatus 23 (refer FIG. 3) which controls an action | operation.

  In the thermocompression bonding apparatus 10, a crimping base 16 is installed on a fixed base 14, and a slider 25 having a thermocompression bonding tool 15 fixed to the tip of a base 19 standing on the base 14 is slidable in the vertical direction. It is mounted on. A heater 27 for heating the thermocompression bonding tool 15 is built in the thermocompression bonding tool 15. The slider 25 is moved up and down toward the crimping table 16 by the pressurizing cylinder device 26, and acts on the thermocompression bonding tool 15 by a pressure control valve (not shown) that controls the supply pressure of the pressurizing cylinder device 26. The crimping load is set in a predetermined range in advance.

  The mounting portion 12 of the substrate 11, which is preliminarily pressure-bonded to the mounting portion 12 of the substrate 11 through an anisotropic conductive film in a state in which the pressure-bonding body 13 is aligned in advance, is crimped. While being placed on the table 16, the slider 25 is lowered by the pressurizing cylinder device 26 and presses the object to be bonded 13 between the pressing surface 17 of the thermocompression bonding tool 15 and the pressing surface 18 of the pressing table 16. It is designed to be thermocompression bonded.

  As shown in FIGS. 2 and 3, the load measuring device 21 includes a storage block 32 that forms a load cell storage portion that stores a load cell 31, and the storage block 32 is arranged in a horizontal direction by a drive device 22 having a configuration described later. While being moved forward and backward by a certain distance, it is moved up and down by a predetermined amount. A cylindrical accommodation hole 33 opening upward is formed in the accommodation block 32, and a disk-shaped load cell set base 34 as a heat insulating material is provided in the load cell holding part 37 at the bottom of the accommodation hole 33. A load cell 31 is installed on the top. A disc-shaped protection plate 35 as a heat insulating material that contacts a load receiving portion provided on the upper surface of the load cell 31 is engaged and held in the housing block 32 so as to be freely movable in the vertical direction. The protection plate 35 is pressed toward the load receiving portion of the load cell 31 by the pressing surface 17 of the thermocompression bonding tool 15. As a material of the heat insulating material constituting the load cell set base 34 and the protection plate 35, machinable ceramic, a heat insulating resin material containing glass fiber, or stainless steel is preferable.

  A contact surface 36 that contacts the pressing surface 18 of the crimping table 16 is formed on the lower surface of the load cell holding portion 37 of the accommodation block 32 where the load cell 31 is installed. When the protective plate 35 is pressed by the thermocompression bonding tool 15 in a state where the contact surface 36 of the load cell holding part 37 is in contact with the pressing surface 18 of the crimping table 16, the pressure bonding applied to the thermocompression bonding tool 15 is performed. An output signal proportional to the load is output from the load cell 31 and input to the control device 23 (see FIG. 3).

  As shown in FIG. 3, a cooling passage 41 is spirally formed in the housing block 32 so as to surround the housing hole 33. Both ends of the cooling passage 41 are connected to the cooling unit 44 via pipes 42 and 43, and the liquid cooled by the cooling unit 44 is circulated through the cooling passage 41, whereby the load cell 31 accommodated in the accommodation hole 33. Is supposed to cool. The cooling unit 45, the cooling passage 41, and the like constitute a cooling device 45 that cools the load cell 31.

  As the load cell 31, various types such as a piezoelectric load cell and a strain gauge load cell which are used for load measurement can be used.

  A guide rail 51 is installed on the base 14 in a horizontal direction perpendicular to the moving direction of the thermocompression bonding tool 15, and a movable table 52 is guided by the guide rail 51 so as to be horizontally movable. The movable base 52 is moved forward and backward by a predetermined distance by a cylinder device 53 for forward / backward movement installed on the base 14. A pair of guide bars 54 are erected on the movable base 52 in the vertical direction, and the storage block 32 is guided by the guide bars 54 so as to be able to move up and down by a predetermined amount. The storage block 32 is moved up and down by a predetermined amount by a vertically moving cylinder device 55 installed on the movable table 52. At the forward end position of the movable table 52, the load cell 31 accommodated in the accommodation block 32 is positioned at the work position P <b> 1 between the thermocompression bonding tool 15 and the crimping table 16. At the retracted end position, the load cell 31 housed in the housing block 32 is retracted to the retracted position P2, so that the housing block 32 does not become an obstacle to the thermocompression work by the thermocompression bonding tool 15. The drive device 22 is constituted by the cylinder devices 53 and 55 for the longitudinal movement and the vertical movement described above.

  Next, the measurement operation of the pressure bonding load in the present embodiment will be described.

  Usually, the load cell 31 accommodated in the accommodation block 32 of the load measuring device 21 is retracted to the retreat position P <b> 2 that does not interfere with the thermocompression work by the thermocompression bonding tool 15, and in this state, the thermocompression bonding unit 20 performs thermocompression bonding. Work is being repeated. That is, the substrate 11 on which the object to be bonded 13 is temporarily bonded to the mounting portion 12 via the anisotropic conductive film is transported above the crimping table 16 by a not-shown transport device, and the mounting portion 12 of the substrate 11 is crimped. It is placed on the table 16. In this state, the slider 25 is lowered by the pressurizing cylinder device 26, and the thermocompression bonding tool 15 heated by the heater 27 presses the object to be bonded 13 against the mounting portion 12 of the substrate 11 with a predetermined pressure load, and the object to be bonded is pressed. 13 is thermocompression bonded to the mounting portion 12 of the substrate 11.

  When measuring the pressure bonding load by the load measuring device 21, the movable table 52 is moved to the forward end position by the forward / backward moving cylinder device 53, and the load cell 31 accommodated in the accommodation block 32 is moved to the thermocompression bonding tool 15 and the pressure bonding table 16. Is positioned at a work position P1 between. Thereafter, the storage block 32 is lowered by the vertically moving cylinder device 55, and the contact surface 36 of the load cell holding portion 37 is brought into contact with the pressing surface 18 of the crimping table 16. In this state, the slider 25 is lowered by the pressurizing cylinder device 26, and the thermocompression bonding tool 15 presses the protective plate 35 that contacts the load cell 31.

  As a result, a pressure load acting on the thermocompression bonding tool 15 is applied to the load cell 31, and an output signal proportional to the pressure load is output from the load cell 31. An output signal from the load cell 31 is input to the control device 23 and displayed on a display device (not shown). As a result of such measurement, if it is confirmed that the crimping load is out of the set range, failure of the pressurizing cylinder device 26, the pressure regulating valve, etc. can be considered. Alternatively, the pressure is adjusted to a predetermined setting range by adjusting the supply pressure to the pressurizing cylinder device 26 or the like.

  The position of the load cell 31 accommodated in the accommodation block 32 between the thermocompression bonding tool 15 and the crimping table 16 is measured so that the measurement of the crimping load by the load measuring device 21 can be performed while the thermocompression bonding tool 15 is heated. Simultaneously with the positioning at P1, the cooling device 45 is activated to circulate the cooling liquid in the cooling passage 41 disposed around the load cell 31 to prevent the temperature of the load cell 31 and the like from rising. Further, the load cell 31 is thermally insulated from the thermocompression bonding tool 15 and the crimping table 16 by the loadcell set table 34 and the protection plate 35 as heat insulating materials interposed between the loadcell 31 and the thermocompression bonding tool 15 and the crimping table 16. Is done.

  Therefore, the cooling action by the cooling device 45 and the heat insulating effect by the heat insulating materials (34, 35) make it difficult for the temperature of the heated thermocompression bonding tool 15 to be transmitted to the load cell 31, and effectively suppress the temperature rise of the load cell 31. Thus, temperature drift of the load cell 31 can be prevented. By providing such a cooling device 45, it is not necessary to wait for the measurement of the crimping load until the thermocompression bonding tool 15 is cooled, and it is possible to measure the crimping load immediately after the thermocompression work. Will be able to do. Of course, the cooling of the load cell 31 by the cooling device 45 may be performed only when it is necessary to measure the crimping load.

  In addition, the measurement of the crimping load by the load measuring device 21 can be periodically performed based on a command from the control device 23, or can be arbitrarily performed based on an operator's button operation.

  In the above-described embodiment, the cooling device 45 that circulates the liquid cooled by the cooling unit 44 and cools the load cell 31 has been described. However, the cooling device 45 is not limited to liquid cooling but uses a fan or the like. An air-cooled type may be used, or a known Peltier element may be used for cooling.

  In the embodiment described above, when the load cell 31 accommodated in the accommodation block 32 is positioned at the work position P <b> 1 between the thermocompression bonding tool 15 and the crimping table 16 during the crimping load measurement by the load measuring device 21. The example in which the storage block 32 is lowered by the cylinder device 55 for vertical movement and the contact surface 36 of the load cell holding portion 37 is brought into contact with the pressing surface 18 of the crimping table 16 has been described. The load cell holding portion 37 is brought into contact with the pressing surface 18 of the crimping table 16 by using the descending operation of the thermocompression bonding tool 15 by floating support with respect to 32 so as to move up and down by a predetermined amount via a spring or the like. According to this, the vertical movement cylinder device 55 of the drive device 22 can be omitted.

  Furthermore, in the above-described embodiment, an example in which the present invention is applied to a so-called main press-bonding process in a driver chip mounting process of a liquid crystal panel in which a pressure-bonded body 13 temporarily bonded to the mounting portion 12 of the substrate 11 is thermocompression bonded. As described above, the present invention can also be applied to the ACF sticking process and the temporary pressure bonding process that require pressure control by the thermocompression bonding tool 15, and can be used for thermocompression bonding of various other objects to be bonded.

It is a schematic diagram of the thermocompression bonding apparatus which shows embodiment of this invention. It is a figure which shows an example of a load measuring device. It is sectional drawing to which the principal part of FIG. 2 was expanded.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Thermocompression bonding apparatus, 11 ... Board | substrate, 13 ... To-be-bonded body, 14 ... Base, 15 ... Thermocompression-bonding tool, 16 ... Crimping base, 20 ... Thermocompression bonding Unit: 21 ... Load measuring device, 22 ... Drive device, 23 ... Computing device, 25 ... Slider, 26 ... Cylinder device for pressurization, 27 ... Heater, 31 ... Load cell , 32... Storage block, 34, 35... Heat insulating material (load cell set base, protective plate), 37... Load cell holding part, 41... Cooling passage, 44. Cooling device, 52... Movable stand, 53... Cylinder device for forward and backward movement, 55... Cylinder device for vertical movement, P 1.

Claims (4)

  A thermocompression bonding apparatus that thermocompression-bonds the object to be bonded held on the crimping table by vertically moving the thermocompression bonding tool with respect to the crimping table disposed in the fixed portion. A load measuring device for measuring a crimping load of a thermocompression bonding tool applied to the crimping table, and a work position between the thermocompression bonding tool and the crimping table and a retreat retracted from the working position. A thermocompression bonding apparatus comprising a drive device that moves between positions. In claim 1,
The load measuring apparatus includes a load cell and a cooling means for cooling the load cell. In claim 1 or claim 2,
The load measuring device includes a load cell accommodating portion that accommodates the load cell, and the load cell accommodating portion is provided with a heat insulating material interposed between the load cell, the thermocompression bonding tool, and the crimping stand. A thermocompression bonding apparatus characterized by that. In claim 1,
The drive device includes a front-rear moving means for moving the load measuring device back and forth between the working position and a retracted position, and a lifting means for moving the load measuring device up and down in the moving direction of the thermocompression bonding tool. A thermocompression bonding apparatus characterized by comprising:

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