JP4347454B2 - Method for sealing solar cell module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solar cell module sealing method in which a semiconductor cell provided on a glass substrate is sealed with a sealing member.
[0002]
[Prior art]
The solar cell module has an amorphous silicon type using amorphous silicon in addition to a crystal type using single crystal silicon or polycrystalline silicon, and in any case, silicon itself easily causes a chemical reaction, It is also vulnerable to physical shock.
[0003]
Therefore, the semiconductor cell formed in the solar cell module for the purpose of protecting the silicon is made of ethylene vinyl acetate-copolymer (hereinafter referred to as EVA) or ethylene-vinyl acetate-triallyl isocyanurate ternary polymerization crosslinked product. A structure of laminating with a sealing member mainly composed of (hereinafter referred to as EVAT) is employed.
[0004]
A conventional apparatus for laminating a solar cell module with a sealing member such as EVA or EVAT is disclosed in Japanese Patent Laid-Open No. 10-95089. In the apparatus disclosed in this publication, an upper chamber having a diaphragm and a lower chamber having a heater panel are provided so as to be openable and closable, and the solar battery module and the solar cell module are stacked on the heater panel and the diaphragm. The sealing member and the sealing member are integrated by being heated under pressure.
[0005]
At that time, one side of the substrate of the solar cell module is directly heated by the heater panel, but the sealing member provided on the other side is heated by the heat transfer from the heater panel through the substrate. In the heating process, a temperature difference occurs between one side surface and the other side surface of the substrate, and the substrate is likely to warp due to the temperature difference. For this reason, the edge of the substrate may be damaged during pressurization, or the substrate may not be heated uniformly as a whole.
[0006]
Therefore, in the prior art disclosed in the above publication, the laminated body composed of the joined solar cell module and the sealing member is preheated by a preheating heater before being loaded into the chamber and laminated by heating and pressing. I am doing so.
[0007]
[Problems to be solved by the invention]
If preheating is performed before the object to be laminated is laminated, the temperature difference between the substrate and the sealing member can be reduced as compared with the case where preheating is not performed.
[0008]
By the way, in order to pressurize and heat the laminated body heated by the heater panel after being preheated by the preheating heater, the diaphragm provided in the upper chamber is expanded, and this diaphragm is brought into contact with the laminated body. Like to do.
[0009]
However, since the diaphragm is usually at a considerably lower temperature than the heater panel, when the diaphragm is expanded and brought into contact with the object to be laminated, the diaphragm takes the heat of the laminated body.
[0010]
Therefore, a considerable temperature difference is generated between the surface side that contacts the heater panel and the surface side that contacts the diaphragm. Therefore, the substrate warps due to the temperature difference, and damage and temperature unevenness may occur due to pressurization and heating in that state. Especially when the temperature unevenness occurs, the thermal contraction of the sealing member becomes uneven. There may be a habit.
[0011]
It is an object of the present invention to provide a method for sealing a solar cell module that can uniformly laminate a laminate of a solar cell module and a sealing member by heating.
[0012]
[Means for Solving the Problems]
The invention of claim 1 comprises a lower chamber having a mounting board provided with a heater, and an upper chamber provided with an inflatable diaphragm so as to be opened and closed relative to the lower chamber, In the solar cell module sealing method of laminating a laminate of a solar cell module and a sealing member placed on the mounting plate described above,
A step of preheating to a predetermined temperature by inflating the diaphragm and bringing it into contact with the mounting plate ;
Supplying the laminate to be laminated on the table,
A method of sealing a solar cell module, comprising the step of expanding the diaphragm and pressurizing and heating the object to be laminated.
[0013]
The invention of claim 2 comprises a lower chamber having a mounting board provided with a heater, and an upper chamber provided with an inflatable diaphragm so as to be opened and closed relative to the lower chamber, In the solar cell module sealing method of laminating a laminate of a solar cell module and a sealing member placed on the mounting plate described above,
A step of preheating to a predetermined temperature by inflating the diaphragm and bringing it into contact with the mounting plate ;
Supplying the laminate to be laminated on the table,
Closing the lower chamber and the upper chamber, depressurizing the inside of these chambers and degassing the sealing member;
A method of sealing a solar cell module, comprising the step of expanding the diaphragm and pressurizing and heating the object to be laminated.
[0015]
According to the present invention, by preheating the diaphragm to a predetermined temperature before pressurizing and heating the object to be laminated, the surface side in contact with the mounting board during the pressure heating of the object to be laminated and the diaphragm A large temperature difference can be prevented from occurring on the surface to be pressed.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
[0017]
The to-be-laminated body 1 which concerns on this invention has the board | substrate 3 made from glass which comprises the single-crystal type solar cell module 2, as shown in FIG. On this substrate 3, a sheet-like first sealing member 4 made of a material such as EVA or EVAT, a plurality of semiconductor cells 6 connected by inner lead wires and having electrodes 5 at both ends, also such as EVA or EVAT A sheet-like second sealing member 7 made of a material and a back surface protection sheet 8 made of an aluminum foil and a fluororesin are sequentially laminated.
[0018]
The to-be-laminated body 1 is laminated integrally by a sealing device 11 shown in FIGS. The sealing device 11 includes a lower chamber 12 and an upper chamber 13 that is driven to open and close the lower chamber 12 by a driving mechanism (not shown).
[0019]
In the lower chamber 12, a mounting board 14 to which the laminate 1 is supplied is provided. The mounting board 14 has a built-in heater 15 so that the laminate 1 supplied to the mounting board 14 can be heated. In this embodiment, the laminate 1 is supplied so that the substrate 3 faces downward and is bonded to the mounting board 14. Further, a lower suction hole 17 is formed in one side wall of the lower chamber 12, and a lower suction pump 16 is connected to the lower suction hole 17 by piping.
[0020]
The upper chamber 13 is provided with a diaphragm 21 whose peripheral part is hermetically fixed to the inner peripheral wall of the upper chamber 13. An upper suction hole 22 communicating with a space portion separated by a diaphragm 21 is formed on one side wall of the upper chamber 13. An upper suction pump 23 is connected to the upper suction hole 22 by piping.
[0021]
In order to laminate the object to be laminated 11 by the sealing device 11 having the above configuration, that is, to seal the semiconductor cell 6, first, when the upper chamber 13 is closed with respect to the lower chamber 12 as shown in FIG. While energizing the heater 15 provided in the mounting board 14, the lower suction pump 16 is operated and the inside of the lower chamber 12 is decompressed.
[0022]
By reducing the pressure in the lower chamber 12, the diaphragm 21 expands into the lower chamber 12 having a low pressure as shown in FIG. 2 and comes into contact with the upper surface of the mounting board 14. Since the mounting board 14 is heated by the heater 15, the diaphragm 21 in contact with the upper surface is also heated.
[0023]
The diaphragm 21 is heated to substantially the same temperature as the temperature at which the laminate 1 is laminated. That is, the temperature for laminating the laminate 1 is a temperature at which the sealing members 4 and 7 undergo a cross-linking reaction in the entire region, and the sealing members 4 and 7 are thermally decomposed and the decomposition gas does not cause a foaming phenomenon. It is performed at about 150 ° C. Therefore, the diaphragm 21 is heated to about 150.degree.
[0024]
The sealing members 4 and 7 used for the laminate 1 are formed by heat-curing after being molded into a sheet. It has been experimentally confirmed that the heat curing condition is that the temperature is 40 to 60 ° C. and the time is 6 to 12 hours, so that the shrinkage during the lamination hardly occurs.
[0025]
As a result, the sealing members 4 and 7 are gradually shrunk by removing the internal stress, and at the same time, the excess compound is removed. Almost never occurs.
[0026]
If the diaphragm 21 is heated, as shown in FIG. 3, the decompressed state of the upper chamber 13 is released and then the upper chamber 13 is raised, and the laminate 1 is supplied onto the mounting plate 14 of the lower chamber 12. .
[0027]
Next, when the lower chamber 12 and the upper chamber 13 are depressurized as shown in FIG. 4 and the gas contained in the EVA 4 and 7 is removed, the depressurized state of the upper chamber 13 is released as shown in FIG. As a result, the diaphragm 21 provided in the upper chamber 13 expands downward and comes into pressure contact with the body 1 to be laminated placed on the placement board 14, so that the body 1 to be laminated 1 and the diaphragm 21 are placed. Then, they are heated under pressure and integrated, that is, laminated. This lamination is performed at a temperature of about 150 ° C. for about 10 minutes.
[0028]
When laminating the body 1 to be laminated, the body 1 to be laminated is heated from both the upper and lower sides by a mounting board 14 provided with a heater 15 and a preheated diaphragm 21.
[0029]
Therefore, since the temperature difference between the upper surface side and the lower surface side in the thickness direction of the laminated body 1 is almost eliminated, the substrate 3 is warped due to the temperature difference and is damaged by being pressed as in the conventional case, and the temperature distribution is not good. It is possible to eliminate such a situation that the cross-linking reaction of the sealing members 4 and 7 does not occur sufficiently and reliably.
[0030]
Further, the sealing members 4 and 7 are heat-cured in advance. Therefore, even when heated to about 150 ° C. at the time of laminating, it hardly deforms, so that it is possible to prevent the occurrence of wrinkles or the wiring of the semiconductor cell 6 being shifted.
[0031]
When the object to be laminated 1 is laminated in this manner, the decompressed state of the lower chamber 12 is released as shown in FIG. 6, the diaphragm 21 expanded downward is contracted to the original state, and then the upper chamber 13 is Then, the sealing device 11 is opened, the laminated body 1 laminated from the mounting board 14 is taken out, and a new laminated body 1 is laminated by repeating the above-described steps.
[0032]
The present invention is not limited to the one embodiment described above and can be variously modified. For example, although a crystal type solar cell module has been illustrated as an object to be laminated, the present invention can of course be applied to an amorphous silicon type solar cell module using amorphous silicon.
[0033]
In addition, the upper chamber of the sealing device is opened and closed with respect to the lower chamber. However, the lower chamber may be driven to open and close, or both may be moved up and down. Any structure can be used as long as the upper chamber can be opened and closed relatively.
[0034]
【The invention's effect】
According to the first aspect of the present invention, when the object to be laminated placed on the placement board is laminated by heating with the diaphragm, the diaphragm is preheated to a predetermined temperature.
[0035]
Therefore, since it is possible to prevent a large temperature difference between the surface side of the laminate to be in contact with the mounting board and the surface side pressed by the diaphragm, warping due to the temperature difference occurs as in the prior art. It becomes possible to prevent the laminated body from being damaged and the heating temperature from becoming uneven.
[0036]
According to the invention of claim 2, before laminating the object to be laminated, the inside of the chamber is depressurized and degassed from the filler.
[0037]
Therefore, the object to be laminated can be laminated without bubbles remaining in the filler.
[0038]
According to the first and second aspects of the invention , the diaphragm is preheated by the heater provided on the mounting board.
[0039]
Since the heater is naturally necessary for laminating the laminate, the use of the heater eliminates the need for a dedicated heater for preheating the diaphragm, which is economical.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a state in which a sealing device according to an embodiment of the present invention is closed.
FIG. 2 is an explanatory view showing a state where the upper chamber is decompressed in order to preheat the diaphragm.
FIG. 3 is an explanatory view showing a state in which a laminate is supplied to the mounting board.
FIG. 4 is an explanatory view showing a state in which the lower chamber and the upper chamber are decompressed in order to degas EVA similarly.
FIG. 5 is an explanatory view showing a state in which the decompressed state of the upper chamber is released and the diaphragm is expanded downward in order to laminate the object to be laminated.
FIG. 6 is an explanatory view showing a state in which a laminate to be laminated is similarly taken out of the mounting board by opening the sealing device.
FIG. 7 is an explanatory diagram showing a schematic configuration of a laminate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Laminated body 2 ... Solar cell module 4, 7 ... EVA (sealing member)
12 ... Lower chamber 13 ... Upper chamber 14 ... Mounting board 15 ... Heater 21 ... Diaphragm

Claims (2)

A lower chamber having a mounting plate provided with a heater; and an upper chamber having an inflatable diaphragm and opened and closed relative to the lower chamber, and is mounted on the mounting plate. In a solar cell module sealing method for laminating a laminate of a solar cell module and a sealing member to be placed,
A step of preheating to a predetermined temperature by inflating the diaphragm and bringing it into contact with the mounting plate ;
Supplying the laminate to be laminated on the table,
And a step of inflating the diaphragm to pressurize and heat the object to be laminated. A lower chamber having a mounting plate provided with a heater; and an upper chamber having an inflatable diaphragm and opened and closed relative to the lower chamber, and is mounted on the mounting plate. In a solar cell module sealing method for laminating a laminate of a solar cell module and a sealing member to be placed,
A step of preheating to a predetermined temperature by inflating the diaphragm and bringing it into contact with the mounting plate ;
Supplying the laminate to be laminated on the table,
Closing the lower chamber and the upper chamber, depressurizing the inside of these chambers and degassing the sealing member;
And a step of inflating the diaphragm to pressurize and heat the object to be laminated.

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