JP4345464B2 - 電子部品が接合された回路基板用部材の製造方法 - Google Patents

電子部品が接合された回路基板用部材の製造方法 Download PDF

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Publication number
JP4345464B2
JP4345464B2 JP2003408671A JP2003408671A JP4345464B2 JP 4345464 B2 JP4345464 B2 JP 4345464B2 JP 2003408671 A JP2003408671 A JP 2003408671A JP 2003408671 A JP2003408671 A JP 2003408671A JP 4345464 B2 JP4345464 B2 JP 4345464B2
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Prior art keywords
flexible film
reinforcing plate
circuit pattern
electronic component
circuit board
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Japanese (ja)
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JP2005174980A5 (https=
JP2005174980A (ja
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孝義 赤松
太 奥山
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Toray Industries Inc
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Toray Industries Inc
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  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2003408671A 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法 Expired - Fee Related JP4345464B2 (ja)

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JP2003408671A JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

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JP2003408671A JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

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JP2005174980A JP2005174980A (ja) 2005-06-30
JP2005174980A5 JP2005174980A5 (https=) 2007-01-25
JP4345464B2 true JP4345464B2 (ja) 2009-10-14

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JP2003408671A Expired - Fee Related JP4345464B2 (ja) 2003-12-08 2003-12-08 電子部品が接合された回路基板用部材の製造方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6580808B2 (ja) * 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 表示装置及びその製造方法
JP2019068016A (ja) * 2017-10-05 2019-04-25 Dic株式会社 補強部付フレキシブルプリント配線板の製造方法

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JP2005174980A (ja) 2005-06-30

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