JP4322605B2

JP4322605B2 - Optical element

Info

Publication number: JP4322605B2
Application number: JP2003323085A
Authority: JP
Inventors: 健史浪江; 正典小林; 健司亀山; ゆみ松木; 俊晴村井; 才明鴇田; 浩之杉本; 康之滝口
Original assignee: Ricoh Co Ltd
Current assignee: Ricoh Co Ltd
Priority date: 2003-09-16
Filing date: 2003-09-16
Publication date: 2009-09-02
Anticipated expiration: 2023-09-16
Also published as: JP2005091587A

Description

本発明は、絶縁基板上に複数の電極を形成し、その電極間を抵抗体により接続し、該抵抗体に電圧を印加することにより電極間に電位差を生じさせることで電界を発生させ、それにより液晶分子層を配向させる光学素子に関する。 In the present invention, a plurality of electrodes are formed on an insulating substrate, the electrodes are connected by a resistor, and a voltage is applied to the resistor to generate a potential difference between the electrodes. The present invention relates to an optical element for aligning a liquid crystal molecular layer.

現在、液晶材料を用いた光偏向素子なる光学素子が各種提案されており、例えば、透明な複数の電極を、それより高いシート抵抗の接続用ストライプ電極か、抵抗で電極間を接続し、電界をかける方式の光学素子が種々提案されている（例えば特許文献１、特許文献２、特許文献３、特許文献４、特許文献５等参照）。上記の光学素子の例では、電極を接続する高いシート抵抗の接続用ストライプ電極や抵抗体は基板上に形成されるか、電極間を別々の抵抗にて接続している。 At present, various optical elements as light deflecting elements using liquid crystal materials have been proposed. For example, a plurality of transparent electrodes can be connected to each other with a striped electrode for connection with a higher sheet resistance, or between the electrodes with a resistor. Various types of optical elements have been proposed (see, for example, Patent Document 1, Patent Document 2, Patent Document 3, Patent Document 4, and Patent Document 5). In the example of the optical element described above, the high-sheet-resistance connecting stripe electrode and the resistor for connecting the electrodes are formed on the substrate, or the electrodes are connected by separate resistors.

ここで、一例として特許文献３に記載の光偏向素子は、透明な一対の基板と、この一対の基板間に充填されたホメオトロピック配向をなすキラルスメクチックＣ相よりなる液晶と、この液晶に電界を作用させる少なくとも１組以上の電界印加手段とを備える構成としたものであり、キラルスメクチックＣ相よりなる液晶を利用しているので、従来の光偏向素子に比して、構成が複雑であることに伴う高コスト、装置大型化、光量損失、光学ノイズを改善でき、かつ、従来のスメクチックＡ液晶やネマチック液晶などにおける応答性の鈍さも改善でき、高速応答が可能となるようにしたものである。 Here, as an example, the optical deflection element described in Patent Document 3 includes a pair of transparent substrates, a liquid crystal composed of a chiral smectic C phase having a homeotropic orientation filled between the pair of substrates, and an electric field applied to the liquid crystal. And at least one set of electric field applying means that act on the liquid crystal. Since the liquid crystal composed of the chiral smectic C phase is used, the structure is more complicated than that of the conventional optical deflection element. High cost, large equipment, light loss, and optical noise can be improved, and the responsiveness of conventional smectic A liquid crystals and nematic liquid crystals can also be improved, enabling high-speed response. is there.

図７は特許文献５に記載の光偏向装置の構成例を示しており、同図（Ａ）は上面側から見た概略断面図であり、（Ｂ）は光の透過方向から見た正面図である。また、図７において、図中の符号１はライン電極、２，３は透明な絶縁基板（透明基板）、４は電圧印加手段、５は液晶分子層、６はスペーサ、７は交流電源、８は配向膜、９は抵抗である。
この光偏向装置の構成では、ライン形状をした複数のライン電極１群が両透明基板２，３上に形成され、各透明基板上でのライン電極１の位置が交互に配置されている。そして、図７（Ｂ）中の左端のライン電極１から印加電圧が段階的に増加あるいは減少していくように、印加電圧を両透明基板間で交互に段階的に異なる値に設定する電圧印加手段４が構成されている。このような構成により、逆電界の発生を防止し、ライン電極近傍でも反対側の透明基板のライン電極による電位差の発生により、ライン電極付近でも光偏向効果を得られるようにしている。 FIG. 7 shows a configuration example of the optical deflecting device described in Patent Document 5, wherein FIG. 7A is a schematic cross-sectional view seen from the upper surface side, and FIG. 7B is a front view seen from the light transmission direction. It is. In FIG. 7, reference numeral 1 in the drawing is a line electrode, 2 and 3 are transparent insulating substrates (transparent substrates), 4 is a voltage applying means, 5 is a liquid crystal molecular layer, 6 is a spacer, 7 is an AC power source, 8 Is an alignment film, and 9 is a resistance.
In this configuration of the optical deflection apparatus, a group of line electrodes 1 having a line shape are formed on both transparent substrates 2 and 3, and the positions of the line electrodes 1 on the transparent substrates are alternately arranged. Then, a voltage application for alternately setting the applied voltage to different values between both transparent substrates so that the applied voltage gradually increases or decreases from the leftmost line electrode 1 in FIG. 7B. Means 4 are configured. With such a configuration, generation of a reverse electric field is prevented, and a light deflection effect can be obtained also in the vicinity of the line electrode by generating a potential difference between the line electrode on the opposite transparent substrate even in the vicinity of the line electrode.

特開２０００−２１４４２９号公報JP 2000-214429 A 特開平１０−２２１７０３号公報JP-A-10-221703 特開２００２−３２８４０２号公報JP 2002-328402 A 特開２００３−９８５０４号公報JP 2003-98504 A 特開２００３−９８５０２号公報JP 2003-98502 A

前述の従来技術では、複数の電極を接続する抵抗体を基板上に形成している。形成する成膜方法としてはスパッタリング、蒸着等の方法が考えられるが、これらの方法は成膜装置の関係から、基板面積によって一度に抵抗体を成膜できる数が制限される。結果的には抵抗体の成膜に大きなコストがかかるようになり、光学素子の製造コストが増大する。 In the prior art described above, a resistor for connecting a plurality of electrodes is formed on a substrate. As a film forming method to be formed, methods such as sputtering and vapor deposition are conceivable. However, these methods limit the number of resistors that can be formed at a time depending on the substrate area because of the film forming apparatus. As a result, a large cost is required for the film formation of the resistor, and the manufacturing cost of the optical element increases.

本発明は上記事情に鑑みなされたものであり、複数の電極を接続する抵抗体を、絶縁基板上に直接形成せず、抵抗体のみを抵抗基板として別の支持体に形成することで、製造コストを下げるとともに、抵抗体成膜時の電極や抵抗体の変質等をなくすことができる構成の光学素子を実現することを課題（目的）とし、さらには、抵抗基板の抵抗体で電極間を電気的に接続し、抵抗体に電圧を印加することにより、電極間に電位差を生じさせることにより、二絶縁基板間にある液晶分子層へ電界をかけ、光学素子の液晶の駆動を実現することを課題（目的）とする。
また、絶縁基板の電極を抵抗体に対して電気的に接続し、且つ外部と電気的に接続する導電材を設けることにより、絶縁基板上の電気的構造を電極のみとし、電気的に外部と接続する構造を備えずに済むようにして、基板面積を減らすことができるようにし、製造コストを下げることができるようにした構成の光学素子を実現することを課題（目的）とする。 The present invention has been made in view of the above circumstances, and does not directly form a resistor for connecting a plurality of electrodes on an insulating substrate, but by forming only the resistor as a resistor substrate on another support. The objective (object) is to realize an optical element having a structure capable of reducing the cost and eliminating the deterioration of the electrode and the resistor when the resistor film is formed. Applying an electric field to the liquid crystal molecular layer between the two insulating substrates by electrically connecting and applying a voltage to the resistor to create a potential difference between the electrodes, thereby realizing liquid crystal driving of the optical element Is an issue (purpose).
Further, by providing a conductive material that electrically connects the electrode of the insulating substrate to the resistor and electrically connects to the outside, the electrical structure on the insulating substrate is limited to the electrode, and It is an object (object) to realize an optical element having a configuration in which a connection structure can be omitted, a substrate area can be reduced, and a manufacturing cost can be reduced.

上記目的を達成するための手段として、本発明は以下のような構成を特徴とする。
すなわち本発明の第１の構成は、絶縁基板上に複数の電極を形成し、その電極間を抵抗体により接続し、該抵抗体に電圧を印加することにより電極間に電位差を生じさせることで電界を発生させ、それにより液晶分子層を配向させる光学素子において、液晶分子層を含む光学的要素を備えた構造体を挟む二つの透明な絶縁基板の少なくとも一方に複数の電極を形成し、前記絶縁基板とは異なる支持体に形成された抵抗体により、複数の電極を電気的に接続し、前記抵抗体に電圧を印加して電位勾配を発生させ、電極間に電界を発生することで、前記液晶分子層を配向させる構成であり、前記抵抗体を形成するための支持体として、絶縁体のセラミックを用い、前記支持体の抵抗体非形成面の形状に凹凸をつけ、表面積を大きくしたことを特徴とするものである。
本発明の第２の構成は、第１の構成の光学素子において、前記絶縁基板に形成された複数の電極と抵抗体を、異方性導電性ペーストを用いて電気的に接続することを特徴とするものである。
また、本発明の第３の構成は、第１の構成の光学素子において、前記絶縁基板に形成された複数の電極と抵抗体を、異方性導電膜を用いて電気的に接続することを特徴とするものである。 As means for achieving the above object, the present invention is characterized by the following configurations.
That is, in the first configuration of the present invention, a plurality of electrodes are formed on an insulating substrate, the electrodes are connected by resistors, and a voltage is applied to the resistors to generate a potential difference between the electrodes. In the optical element for generating an electric field and thereby aligning the liquid crystal molecular layer, a plurality of electrodes are formed on at least one of the two transparent insulating substrates sandwiching the structure including the optical element including the liquid crystal molecular layer, By electrically connecting a plurality of electrodes by a resistor formed on a support different from the insulating substrate, applying a voltage to the resistor to generate a potential gradient, and generating an electric field between the electrodes, The liquid crystal molecular layer is oriented , and an insulator ceramic is used as a support for forming the resistor, and the shape of the resistor non-formation surface of the support is made uneven to increase the surface area. That features It is intended to.
According to a second configuration of the present invention, in the optical element of the first configuration, the plurality of electrodes and the resistor formed on the insulating substrate are electrically connected using an anisotropic conductive paste. It is what.
According to a third configuration of the present invention, in the optical element of the first configuration, the plurality of electrodes and the resistor formed on the insulating substrate are electrically connected using an anisotropic conductive film. It is a feature.

本発明の第４の構成は、絶縁基板上に複数の電極を形成し、その電極間を抵抗体により接続し、該抵抗体に電圧を印加することにより電極間に電位差を生じさせることで電界を発生させ、それにより液晶分子層を配向させる光学素子において、液晶分子層を含む光学的要素を備えた構造体を挟む二つの透明な絶縁基板の少なくとも一方に複数の電極を形成し、前記絶縁基板とは異なる支持体に形成された抵抗体により、複数の電極を電気的に接続し、前記抵抗体に電圧を印加して電位勾配を発生させ、電極間に電界を発生することで、前記液晶分子層を配向させる構成であり、前記絶縁基板に形成された複数の電極と抵抗体を密着させる方向に圧力をかける構造を備えることで、電気的に接続することを特徴とするものである。
本発明の第５の構成は、第４の構成の光学素子において、前記抵抗体を形成するための支持体として、絶縁体であるガラスを用いることを特徴とするものである。
また、本発明の第６の構成は、第４の構成の光学素子において、前記抵抗体を形成するための支持体として、絶縁体のセラミックを用いることを特徴とするものである。
さらに、本発明の第７の構成は、第４の構成の光学素子において、前記抵抗体を形成するための支持体として、絶縁体のフィルムを用いることを特徴とするものである。
また、本発明の第８の構成は、第６の構成の光学素子において、前記支持体の抵抗体非形成面の形状に凹凸をつけ、表面積を大きくしたことを特徴とするものである。 According to a fourth configuration of the present invention, an electric field is generated by forming a plurality of electrodes on an insulating substrate, connecting the electrodes with a resistor, and applying a voltage to the resistor to generate a potential difference between the electrodes. In the optical element for aligning the liquid crystal molecular layer, and forming a plurality of electrodes on at least one of the two transparent insulating substrates sandwiching the structure including the optical element including the liquid crystal molecular layer, By electrically connecting a plurality of electrodes by a resistor formed on a support different from the substrate, applying a voltage to the resistor to generate a potential gradient, and generating an electric field between the electrodes, The liquid crystal molecular layer is oriented, and is provided with a structure in which pressure is applied in the direction in which the plurality of electrodes formed on the insulating substrate and the resistor are brought into close contact with each other, thereby being electrically connected. .
According to a fifth configuration of the present invention, in the optical element of the fourth configuration, glass as an insulator is used as a support for forming the resistor.
According to a sixth configuration of the present invention, in the optical element of the fourth configuration, an insulating ceramic is used as a support for forming the resistor.
Furthermore, a seventh configuration of the present invention is characterized in that, in the optical element of the fourth configuration, an insulating film is used as a support for forming the resistor.
The eighth configuration of the present invention is characterized in that, in the optical element of the sixth configuration, the shape of the resistor non-formation surface of the support is made uneven to increase the surface area.

本発明の第９の構成は、第４〜８のいずれか一つの構成の光学素子において、電位勾配を発生させる両端の電極に接続した抵抗体の位置以上の外側位置に、該抵抗体と接続し且つ外部と電気的に接続する導電材を備えた抵抗基板を有することを特徴とするものである。 Ninth aspect of the present onset Ming, in the optical element of the 4-8 any one of a configuration of a position more outer position of the resistor connected to the electrodes at both ends to generate a potential gradient, the resistive element antibodies And a resistance substrate including a conductive material that is electrically connected to the outside.

本発明の光学素子では、絶縁基板上に形成された複数の電極を電気的に接続する抵抗体を異なる支持体に形成することにより、抵抗体を形成する支持体の面積が小さくなり、抵抗体の成膜コストが安価になるとともに、成膜時の影響による電極や抵抗体の変質等をなくすことができる。
そして本発明の第１の構成の光学素子では、抵抗体を形成するための支持体としてセラミックを用いることにより、機械的強度が増し、また、熱伝導率の良い材料を使うことにより放熱が容易になり、抵抗体の放熱による影響を軽減することができる。さらにセラミック支持体の抵抗体非形成面の形状に凹凸をつけ、表面積を大きくすることにより、放熱効果が高まり、抵抗体の発熱による影響が少なくなり、使用できる抵抗体の抵抗値及び材質の範囲が広がる。
本発明の第２の構成の光学素子では、第１の構成の効果に加え、異方性導電性ペーストを使用することにより、複数の電極と抵抗基板の抵抗体とを電気的に接続することができるとともに、抵抗体−電極間間隔のバラツキによるギャップをカバーすることができる。
また、本発明の第３の構成の光学素子では、第１の構成の効果に加え、異方性導電膜を使用することにより、複数の電極と抵抗基板の抵抗体とを電気的に接続することができるとともに、抵抗体−電極間間隔のバラツキによるギャップをカバーすることができる。 In light optical element of the present invention, by forming the resistor different supports for electrically connecting a plurality of electrodes formed on an insulating substrate, the area of the support to form the resistor is reduced, the resistance The film formation cost of the body can be reduced, and the deterioration of the electrode and resistor due to the influence of the film formation can be eliminated.
In the optical element of the first configuration of the present invention, the mechanical strength is increased by using ceramic as a support for forming the resistor, and heat dissipation is facilitated by using a material having good thermal conductivity. Thus, the influence of heat radiation of the resistor can be reduced. In addition, by making the shape of the non-resistor formed surface of the ceramic support uneven, and increasing the surface area, the heat dissipation effect is enhanced and the influence of the heat generated by the resistor is reduced. Spread.
In the optical element of the second configuration of the present invention, in addition to the effect of the first configuration, the anisotropic conductive paste is used to electrically connect the plurality of electrodes and the resistor of the resistance substrate. In addition, a gap due to variations in the distance between the resistor and the electrode can be covered.
In the optical element having the third configuration of the present invention, in addition to the effect of the first configuration, an anisotropic conductive film is used to electrically connect the plurality of electrodes and the resistor of the resistance substrate. In addition, it is possible to cover a gap due to variations in the distance between the resistor and the electrode.

本発明の第４の構成の光学素子では、絶縁基板に形成された複数の電極と抵抗体を密着させる方向に圧力をかける構造を備えることで、複数の電極を抵抗体で電気的に接続することができる。
本発明の第５の構成の光学素子では、第４の構成の効果に加え、抵抗体を形成するための支持体としてガラスを用いることにより、抵抗体成膜を蒸着やスパッタリングという方法で行う場合に成膜が容易になる。
また、本発明の第６の構成の光学素子では、第４の構成の効果に加え、抵抗体を形成するための支持体としてセラミックを用いることにより、機械的強度が増し、また、熱伝導率の良い材料を使うことにより放熱が容易になり、抵抗体の放熱による影響を軽減することができる。
さらに、本発明の第７の構成の光学素子では、第４の構成の効果に加え、抵抗体を形成するための支持体として耐熱性、絶縁性の高いフィルムを用いることにより、基板へ熱圧着による接着を容易に行えるようになる。
また、本発明の第８の構成の光学素子では、第６の構成の効果に加え、セラミック支持体の抵抗体非形成面の形状に凹凸をつけ、表面積を大きくすることにより、放熱効果が高まり、抵抗体の発熱による影響が少なくなり、使用できる抵抗体の抵抗値及び材質の範囲が広がる。 In the optical element of the fourth configuration of the present invention, a plurality of electrodes formed on the insulating substrate and a structure in which pressure is applied in a direction in which the resistors are brought into close contact with each other, and the plurality of electrodes are electrically connected by the resistors. be able to.
In the optical element of the fifth configuration of the present invention, in addition to the effect of the fourth configuration, when the resistor film is formed by vapor deposition or sputtering by using glass as a support for forming the resistor. It becomes easy to form a film.
In the optical element of the sixth configuration of the present invention, in addition to the effect of the fourth configuration, the use of ceramic as a support for forming the resistor increases the mechanical strength, and further increases the thermal conductivity. By using a good material, heat dissipation can be facilitated, and the influence of heat dissipation of the resistor can be reduced.
Furthermore, in the optical element of the seventh configuration of the present invention, in addition to the effect of the fourth configuration, a film having high heat resistance and insulation is used as a support for forming the resistor, thereby thermocompression bonding to the substrate. Adhesion by can be easily performed.
Further, in the optical element of the eighth configuration of the present invention, in addition to the effect of the sixth configuration, the heat dissipation effect is enhanced by making the shape of the resistor non-formation surface of the ceramic support uneven, and increasing the surface area. The influence of the heat generation of the resistor is reduced, and the range of the resistance value and material of the resistor that can be used is widened.

本発明の第９の構成の光学素子では、第４〜８のいずれか一つの構成の効果に加え、電位勾配を発生させる最外側電極位置の抵抗体側に、抵抗体と接続し且つ外部と電気的に接続する導電材を備えたことにより、絶縁基板上の電気的構造が電極のみとなり、外部接続電極を構成する必要がなくなり、基板サイズの小型化が可能になり、それにより製造コストを下げることができる。 The optical element of the present onset Ming ninth configuration, in addition to the 4-8 any one configuration of the effects of, the resistor side of the outermost electrode position for generating a potential gradient, connected to the resistor and external By providing a conductive material that is electrically connected to the insulating substrate, the electrical structure on the insulating substrate is only an electrode, eliminating the need to configure an external connection electrode, enabling a reduction in the size of the substrate, thereby reducing the manufacturing cost. Can be lowered.

以下、本発明に係る光学素子の構成、動作及び作用を、図示の実施例に基づいて詳細に説明する。 Hereinafter, the configuration, operation, and action of the optical element according to the present invention will be described in detail based on the illustrated embodiments.

図１は本発明の一実施例を示す図であって、光学素子と電源を含む電気配線の概略構成図であり、液晶分子層５を挟む一方の透明な絶縁基板２に複数のライン電極１を配置し、その複数のライン電極１に電気的配線を施した例である。また、図１（Ａ）は光学素子を上から見たときの断面図であり、（Ｂ）は光学素子を正面から見た正面図である。光は図１（Ａ）では紙面上下方向、（Ｂ）では紙面に対して正背面方向に通過する。この構成では、絶縁基板２に形成され平行に配置されたライン形状をした複数の電極（ライン電極）１と、抵抗基板１３として支持体１２に形成された抵抗体１０とが電気的に接続され、両端のライン電極１が電源１１に接続されている。また、２つの絶縁基板２，３に挟まれて、液晶分子層５、スペーサ６、配向膜８等を備えている。抵抗体１０は、ライン電極１より高い抵抗値を有し、その抵抗値は略均一である。また、抵抗体１０には電圧が印加される。この電圧は、液晶分子層５の配向が可能な電界を発生し、且つ絶縁破壊を起こさない範囲である。電源１１は交流電源であるが、正負の所定電圧を交互に矩形的に発生するものが好ましい。この電源１１により抵抗体１０に印加される電圧の正負により、図１の第一電界方向と第二電界方向に電界が発生する。 FIG. 1 is a diagram showing an embodiment of the present invention, which is a schematic configuration diagram of electrical wiring including an optical element and a power source, and a plurality of line electrodes 1 are formed on one transparent insulating substrate 2 sandwiching a liquid crystal molecular layer 5. Is arranged and electrical wiring is applied to the plurality of line electrodes 1. 1A is a cross-sectional view of the optical element as viewed from above, and FIG. 1B is a front view of the optical element as viewed from the front. In FIG. 1A, light passes in the vertical direction on the paper surface, and in FIG. In this configuration, a plurality of line-shaped electrodes (line electrodes) 1 formed on the insulating substrate 2 and arranged in parallel are electrically connected to the resistor 10 formed on the support 12 as the resistor substrate 13. The line electrodes 1 at both ends are connected to the power source 11. In addition, a liquid crystal molecular layer 5, a spacer 6, an alignment film 8, etc. are provided between two insulating substrates 2 and 3. The resistor 10 has a higher resistance value than the line electrode 1, and the resistance value is substantially uniform. A voltage is applied to the resistor 10. This voltage is in a range where an electric field capable of aligning the liquid crystal molecular layer 5 is generated and dielectric breakdown does not occur. The power supply 11 is an AC power supply, but preferably generates a positive and negative predetermined voltage alternately in a rectangular shape. Electric fields are generated in the first electric field direction and the second electric field direction of FIG. 1 by the positive / negative of the voltage applied to the resistor 10 by the power source 11.

本実施例においては、抵抗体１０は絶縁基板２へ形成せず、抵抗基板１３として絶縁基板２とは別の支持体１２に抵抗体１０を作成することを特徴としている。ここで、図２は図１のライン電極１と抵抗基板１３に注目した概略断面図である。抵抗基板１３を構成する支持体１２は電気的配線がなされることから、絶縁帯域の抵抗特性を有することが条件となり、これらの特性を有するガラス、セラミック、フィルム等が使用される。そして、この支持体１２の一面に抵抗体１０が形成される。 In this embodiment, the resistor 10 is not formed on the insulating substrate 2, and the resistor 10 is formed on a support 12 different from the insulating substrate 2 as the resistor substrate 13. Here, FIG. 2 is a schematic sectional view focusing on the line electrode 1 and the resistance substrate 13 of FIG. Since the support body 12 constituting the resistance substrate 13 is electrically wired, it is necessary to have resistance characteristics of an insulating band, and glass, ceramic, film, etc. having these characteristics are used. The resistor 10 is formed on one surface of the support 12.

支持体１２としてガラスを用いる場合、ガラスはスパッタリング、蒸着等の方法で抵抗体１０を成膜する際に、多くの抵抗膜材料と相性が良い上に、熱変形等の熱による影響が少ないという利点がある。また、支持体１２としてセラミックを用いる場合には、熱伝導性の高いものを用いることにより、抵抗体１０による発熱の影響を支持体１２がより放熱することで、少なくすることができる。この際、図３に示すように、セラミックからなる支持体１２の抵抗体１０を形成しない面に凹凸を付けた形状にし、表面積を大きくすることにより、放熱効果を一層高めることができる。 When glass is used as the support 12, the glass is compatible with many resistance film materials when the resistor 10 is formed by a method such as sputtering or vapor deposition, and is less affected by heat such as thermal deformation. There are advantages. Further, when ceramic is used as the support 12, the use of a material having high thermal conductivity can reduce the influence of heat generated by the resistor 10 as the support 12 further dissipates heat. At this time, as shown in FIG. 3, the heat dissipation effect can be further enhanced by forming the surface of the support 12 made of ceramic without unevenness on the surface where the resistor 10 is formed and increasing the surface area.

さらに、支持体１２としてフィルムを用いる場合には、抵抗体１０の形成方法として、塗布等の方法が容易である。また、スパッタリングや蒸着等の方法でもよく、前処理が必要な場合もあるが支持体１２に抵抗体１０を形成することができる。また、フィルムは柔軟性が高く、形成された抵抗体１０の接着性が悪いと剥がれたり、変形により膜が割れたりする可能性もあるが、絶縁基板２上のライン電極１と電気的に接続する場合、密着性に優れるという利点がある。さらに、熱伝導性にも優れ、圧力にも強いため、熱圧着という方法に適している。支持体１２に用いるフィルムの具体例としては、ポリイミドフィルム、エポキシフィルム等の耐熱性と絶縁性が高いフィルムが考えられる。 Further, when a film is used as the support 12, a method such as coating is easy as a method of forming the resistor 10. Further, a method such as sputtering or vapor deposition may be used, and a pretreatment may be necessary, but the resistor 10 can be formed on the support 12. Further, the film is highly flexible, and may peel off if the formed resistor 10 has poor adhesion, or the film may crack due to deformation, but it is electrically connected to the line electrode 1 on the insulating substrate 2. When it does, there exists an advantage that it is excellent in adhesiveness. Furthermore, since it is excellent in thermal conductivity and strong in pressure, it is suitable for a method called thermocompression bonding. As a specific example of the film used for the support 12, a film having high heat resistance and insulation, such as a polyimide film and an epoxy film, can be considered.

支持体１２を絶縁基板２上のライン電極１に電気的に接続する方法としては、接続材として異方性導電性ペーストや異方性導電膜を用いて接続する方法や、支持体１２と絶縁基板２を近付ける方向に力を与え固定することにより接続する方法がある。異方性導電性ペーストや異方性導電膜は、熱圧着することにより、圧力の方向に導電性が高く、異なる方向には高い絶縁性を持つので、抵抗体１０と絶縁基板２上のライン電極１を押し付ける方向に圧力をかけて熱圧着することにより、双方を電気的に接続することができる。
また、支持体１２と絶縁基板２を近付ける方向に押し付けて固定する方法では、抵抗基板１３の抵抗体１０が、絶縁基板２のライン電極１に押し付けられる方向に圧力をかけて固定する構造を設けるか、二つの基板を挟みこむ部品等を加えることにより、電気的に接続することができる。 As a method of electrically connecting the support 12 to the line electrode 1 on the insulating substrate 2, a method of connecting using an anisotropic conductive paste or an anisotropic conductive film as a connecting material, or insulation from the support 12 is provided. There is a method of connecting by applying a force in the direction in which the substrate 2 is approached and fixing. The anisotropic conductive paste and the anisotropic conductive film have high conductivity in the direction of pressure and high insulation in different directions by thermocompression bonding. By applying pressure in the direction in which the electrode 1 is pressed and thermocompression bonding, both can be electrically connected.
Further, in the method of pressing and fixing the support body 12 and the insulating substrate 2 in the approaching direction, a structure is provided in which the resistor 10 of the resistance substrate 13 is fixed by applying pressure in the direction of pressing the line electrode 1 of the insulating substrate 2. Alternatively, electrical connection can be achieved by adding a component or the like sandwiching two substrates.

本実施例では、光学素子を以上のような構成にし、電極間を抵抗体１０で電気的に接続して電圧を印加することにより、抵抗体１０に直線状の電位傾斜を発生させることができ、ライン電極１が電位を持ち、各電極間で電界が発生し、それにより液晶分子層５が配向し、光の偏向角を変えることができる。 In the present embodiment, the optical element is configured as described above, and a linear potential gradient can be generated in the resistor 10 by electrically connecting the electrodes with the resistor 10 and applying a voltage. The line electrode 1 has a potential, and an electric field is generated between the electrodes, whereby the liquid crystal molecular layer 5 is aligned and the light deflection angle can be changed.

以上説明したように、本実施例の光学素子では、絶縁基板２上に形成された複数のライン電極１を電気的に接続する抵抗体１０を異なる支持体１２に形成することにより、抵抗体１０を形成する支持体１２の面積が小さくなり、抵抗体１０の成膜コストが安価になるとともに、成膜時の影響による電極１や抵抗体１０の変質等をなくすことができる。
そして、抵抗体１０を形成するための支持体１２としてガラスを用いることにより、抵抗体成膜を蒸着やスパッタリングという方法で行う場合に成膜が容易になる。また、抵抗体１０を形成するための支持体１２としてセラミックを用いることにより、機械的強度が増し、また、熱伝導率の良い材料を使うことにより放熱が容易になり、抵抗体の放熱による影響を軽減することができる。さらに、セラミック支持体の抵抗体非形成面の形状に凹凸をつけ、表面積を大きくすることにより、放熱効果が高まり、抵抗体１０の発熱による影響が少なくなり、使用できる抵抗体１０の抵抗値及び材質の範囲が広がる。
また、抵抗体１０を形成するための支持体１２として耐熱性、絶縁性の高いフィルムを用いることにより、基板へ熱圧着による接着を容易に行えるようになる。
さらにまた、支持体１２を絶縁基板２上のライン電極１に電気的に接続する方法として、異方性導電性ペーストを使用することにより、複数のライン電極１と抵抗基板１３の抵抗体１０とを電気的に接続することができるとともに、抵抗体−電極間間隔のバラツキによるギャップをカバーすることができる。また、異方性導電膜を使用することにより、複数のライン電極１と抵抗基板１３の抵抗体１０とを電気的に接続することができるとともに、抵抗体−電極間間隔のバラツキによるギャップをカバーすることができる。 As described above, in the optical element of the present embodiment, the resistor 10 is formed by forming the resistor 10 that electrically connects the plurality of line electrodes 1 formed on the insulating substrate 2 on the different support 12. As a result, the area of the support 12 that forms the substrate is reduced, the film formation cost of the resistor 10 is reduced, and alteration of the electrode 1 and the resistor 10 due to the influence of the film formation can be eliminated.
By using glass as the support 12 for forming the resistor 10, the film formation is facilitated when the resistor film is formed by a method such as vapor deposition or sputtering. Further, the use of ceramic as the support 12 for forming the resistor 10 increases the mechanical strength, and the use of a material having good thermal conductivity facilitates heat dissipation, and the influence of the resistor due to heat dissipation. Can be reduced. Furthermore, by making the shape of the non-resistor forming surface of the ceramic support uneven, and increasing the surface area, the heat dissipation effect is enhanced, and the influence of heat generated by the resistor 10 is reduced. Wide range of materials.
Further, by using a film having high heat resistance and insulation as the support 12 for forming the resistor 10, it is possible to easily adhere to the substrate by thermocompression bonding.
Furthermore, as a method of electrically connecting the support 12 to the line electrode 1 on the insulating substrate 2, by using an anisotropic conductive paste, the plurality of line electrodes 1 and the resistors 10 on the resistance substrate 13 Can be electrically connected to each other, and a gap due to variation in the distance between the resistor and the electrode can be covered. Further, by using an anisotropic conductive film, the plurality of line electrodes 1 and the resistor 10 of the resistor substrate 13 can be electrically connected, and a gap due to variations in the distance between the resistors and the electrodes is covered. can do.

次に本発明の第２の実施例を説明する。図４〜６は本発明における抵抗基板１３の抵抗体１０の両端部に外部接続用導電材（導線）１４を備え、絶縁基板２のライン電極１と電気的に接続するようにした一例を示す図である。ここで、図４は光学素子と抵抗基板１３の接続部分を基板中央で切断して横から見た概略断面図、図５は図４の省略部分の方向より接続部を見た概略断面図であり、図６は図４を上から見た状態で、かつ絶縁基板２と抵抗基板１３上の電気的配線を抽出して示す概略要部平面図である。 Next, a second embodiment of the present invention will be described. 4 to 6 show an example in which an external connection conductive material (conductive wire) 14 is provided at both ends of the resistor 10 of the resistance substrate 13 according to the present invention and is electrically connected to the line electrode 1 of the insulating substrate 2. FIG. Here, FIG. 4 is a schematic cross-sectional view of the connecting portion between the optical element and the resistor substrate 13 cut at the center of the substrate and viewed from the side, and FIG. FIG. 6 is a schematic plan view of the essential part showing the electrical wiring on the insulating substrate 2 and the resistance substrate 13 in a state as viewed from above in FIG.

図４〜６に示すように、抵抗基板１３の絶縁基板２のライン電極１に接する部分の表面に、抵抗体１０が略均一に形成されており、抵抗基板１３の電位勾配を発生させる両端の電極位置に、外部と電気的に接続するための導電材（導線）１４が接続されている。この導電材（導線）１４に電圧を印加すると、導電材（導線）１４を通して抵抗体１０に直線的な電位勾配が発生するとともに、ライン電極１は抵抗体１０に接続している位置により電位を持つこととなる。そして、抵抗体１０が均一な特性を有している場合、電極間の距離によって電位は直線的に変わることから、電極間距離に関わらず、電極間には直線的な電位勾配が作りだされ、液晶分子層（図示せず）に電界がかかり、配向することになる。 As shown in FIGS. 4 to 6, the resistor 10 is substantially uniformly formed on the surface of the portion of the resistance substrate 13 that is in contact with the line electrode 1 of the insulating substrate 2. A conductive material (conductive wire) 14 for electrical connection to the outside is connected to the electrode position. When a voltage is applied to the conductive material (conductive wire) 14, a linear potential gradient is generated in the resistor 10 through the conductive material (conductive wire) 14, and the line electrode 1 has a potential depending on the position connected to the resistor 10. Will have. When the resistor 10 has a uniform characteristic, the potential varies linearly depending on the distance between the electrodes. Therefore, a linear potential gradient is created between the electrodes regardless of the distance between the electrodes. An electric field is applied to the liquid crystal molecular layer (not shown) and the liquid crystal molecular layer is aligned.

抵抗体１０とライン電極１の接続は、図４の左側より抵抗基板１３の中に絶縁基板２を挿入すると、抵抗体１０とライン電極１が圧着されて電気的に接続される。抵抗体１０とライン電極１が圧着するためには、抵抗基板１３の支持体に弾性変形可能な柔軟な材質を用いる方法や、抵抗基板１３側にバネ等を設け、その力により絶縁基板２を挟みこむ構造を持たせる方法がある。 As for the connection between the resistor 10 and the line electrode 1, when the insulating substrate 2 is inserted into the resistor substrate 13 from the left side of FIG. 4, the resistor 10 and the line electrode 1 are crimped and electrically connected. In order to pressure-bond the resistor 10 and the line electrode 1, a method of using a flexible material that can be elastically deformed for the support of the resistor substrate 13, a spring or the like is provided on the resistor substrate 13 side, and the insulating substrate 2 is attached by the force. There is a method of having a sandwiched structure.

図５、図６はライン電極１を抵抗体１０に接続する部分を表しているが、ライン電極１に抵抗体１０が接続され、その抵抗体１０の両端に外部と接続する導電材（導線）１４が接続されている。この場合、導電材（導線）１４を、電位勾配を発生させる両端の電極位置以上の外側に位置する抵抗体１０に接続する構造にし、これに電圧を印加することにより、電位を印加した導電材（導線）１４の内側に位置する電極間には、電極間距離に関わらず抵抗体１０に直線的な電位勾配が発生し、電極間に電位差を発生させることができる。また、抵抗基板１３側に導電材（導線）１４を持つことにより、絶縁基板２上の電気的構造がライン電極１のみとなり、製造が容易となる。さらに、ライン電極１と外部を接続するための空間を基板上に備える必要がなくなるため、基板サイズを小さくすることができ、製造コストや部品コストを下げることができる。 5 and 6 show a portion where the line electrode 1 is connected to the resistor 10, the resistor 10 is connected to the line electrode 1, and a conductive material (conductive wire) connected to the outside at both ends of the resistor 10. 14 is connected. In this case, the conductive material (conductive wire) 14 is configured to be connected to the resistor 10 located outside the electrode positions at both ends that generate the potential gradient, and a voltage is applied to the conductive material 14 to which a potential is applied. A linear potential gradient is generated in the resistor 10 between the electrodes located on the inner side of the (conductive wire) 14, and a potential difference can be generated between the electrodes. Further, by having the conductive material (conductive wire) 14 on the side of the resistance substrate 13, the electrical structure on the insulating substrate 2 becomes only the line electrode 1, and the manufacture becomes easy. Further, since it is not necessary to provide a space for connecting the line electrode 1 and the outside on the substrate, the substrate size can be reduced, and the manufacturing cost and the component cost can be reduced.

以上に説明した本発明の光学素子は、光偏向素子、画像表示素子等に応用することができる。そして、これらの光偏向素子、画像表示素子等は、プロジェクションディスプレイ、ヘッドマウントディスプレイなどの電子ディスプレイ装置等に好適に利用することができる。 The optical element of the present invention described above can be applied to a light deflection element, an image display element, and the like. These light deflection elements, image display elements, and the like can be suitably used for electronic display devices such as projection displays and head mounted displays.

本発明の一実施例を示す図であって、光学素子と電源を含む電気配線の概略構成図であり、（Ａ）は光学素子を上から見たときの断面図であり、（Ｂ）は光学素子を正面から見た正面図である。It is a figure which shows one Example of this invention, Comprising: It is a schematic block diagram of the electrical wiring containing an optical element and a power supply, (A) is sectional drawing when an optical element is seen from the top, (B) is It is the front view which looked at the optical element from the front. ライン電極に抵抗基板を接続した状態を示す概略要部断面図である。It is a schematic principal part sectional drawing which shows the state which connected the resistance board | substrate to the line electrode. セラミックからなる支持体表面に凹凸形状を付けた構成の抵抗基板をライン電極に接続した状態を示す概略要部断面図である。It is a schematic principal part sectional drawing which shows the state which connected the resistance board of the structure which provided the uneven | corrugated shape to the support body surface which consists of ceramics to the line electrode. 光学素子と抵抗基板の接続部分を基板中央で切断して横から見た概略断面図である。It is the schematic sectional drawing which cut | disconnected the connection part of an optical element and a resistance board | substrate at the board | substrate center, and was seen from the side. 図４の省略部分の方向より接続部を見た概略断面図である。It is the schematic sectional drawing which looked at the connection part from the direction of the omission part of Drawing 4. 絶縁基板側の基板とライン電極、及び抵抗基板側の抵抗体と導電材（導線）を上から見た概略要部平面図である。It is the general | schematic principal part top view which looked at the board | substrate and line electrode by the side of an insulated substrate, and the resistor and conductive material (conductive wire) by the side of a resistance board | substrate from the top. 従来技術の一例を示す光学素子の構成説明図である。It is structure explanatory drawing of the optical element which shows an example of a prior art.

Explanation of symbols

１：ライン電極、
２，３：絶縁基板（透明基板）
４：電圧印加手段
５：液晶分子層
６：スペーサ
７：交流電源
８：配向膜
９：抵抗
１０：抵抗体
１１：電源
１２：支持体
１３：抵抗基板
１４：導電材（導線）
１５：接続材
1: line electrode,
2, 3: Insulating substrate (transparent substrate)
4: Voltage application means 5: Liquid crystal molecular layer 6: Spacer 7: AC power supply 8: Alignment film 9: Resistance 10: Resistor 11: Power supply 12: Support 13: Resistive substrate 14: Conductive material (conductor)
15: Connection material

Claims

A plurality of electrodes are formed on an insulating substrate, the electrodes are connected by a resistor, and an electric field is generated by applying a voltage to the resistor to generate a potential difference between the electrodes, whereby a liquid crystal molecular layer In the optical element for orienting,
A plurality of electrodes are formed on at least one of two transparent insulating substrates sandwiching a structure including an optical element including a liquid crystal molecular layer, and a plurality of electrodes are formed by resistors formed on a support different from the insulating substrate. The electrode is electrically connected, a voltage is applied to the resistor to generate a potential gradient, and an electric field is generated between the electrodes to align the liquid crystal molecular layer ,
An optical element characterized in that an insulating ceramic is used as a support for forming the resistor, the shape of the resistor non-formation surface of the support is uneven, and the surface area is increased .

The optical element according to claim 1, wherein
An optical element characterized in that a plurality of electrodes and a resistor formed on the insulating substrate are electrically connected using an anisotropic conductive paste .

The optical element according to claim 1, wherein
An optical element, wherein a plurality of electrodes and a resistor formed on the insulating substrate are electrically connected using an anisotropic conductive film .

A plurality of electrodes are formed on an insulating substrate, the electrodes are connected by a resistor, and an electric field is generated by applying a voltage to the resistor to generate a potential difference between the electrodes, whereby a liquid crystal molecular layer In the optical element for orienting ,
A plurality of electrodes are formed on at least one of two transparent insulating substrates sandwiching a structure including an optical element including a liquid crystal molecular layer, and a plurality of electrodes are formed by resistors formed on a support different from the insulating substrate. The electrode is electrically connected, a voltage is applied to the resistor to generate a potential gradient, and an electric field is generated between the electrodes to align the liquid crystal molecular layer,
An optical element comprising: a structure in which pressure is applied in a direction in which a plurality of electrodes formed on the insulating substrate and a resistor are in close contact with each other, thereby being electrically connected .

The optical element according to claim 4 .
An optical element using glass as an insulator as a support for forming the resistor .

The optical element according to claim 4 .
An optical element using an insulating ceramic as a support for forming the resistor .

The optical element according to claim 4 .
An optical element using an insulating film as a support for forming the resistor .

The optical element according to claim 6 .
An optical element, wherein the shape of the resistor non-formation surface of the support is uneven to increase the surface area .

In the optical element as described in any one of Claims 4-8 ,
An optical device comprising a resistance substrate provided with a conductive material connected to the resistor and electrically connected to the outside at a position outside the position of the resistor connected to the electrodes at both ends for generating a potential gradient. element.