JP4320349B2 - Conductive member supply apparatus and conductive member supply method - Google Patents

Description

  The present invention relates to a conductive member supply device and a conductive member supply method for supplying a minute conductive member used for electrical bonding between electrodes of a minute electronic component to a joining device one by one.

  In the manufacturing process of a magnetic head or the like, the electrode of the magnetic head slider and the electrode of the flexure are joined by electrical joining using a conductive member. Specifically, both electrodes are arranged at an angle of 90 degrees, one small solder ball is arranged between these electrodes, and the solder ball is melted by heat rays or the like to be electrically connected between these electrodes. I do. A conventional soldering apparatus provided with a solder ball supply device will be described below with reference to the drawings.

  FIG. 25 is a partial cross-sectional view of a conventional soldering apparatus 501. The soldering apparatus 501 holds an optical system 503 such as a laser oscillator for melting the solder balls 515, a solder ball supply unit 505 for supplying the solder balls 515 individually, and a solid solder ball 515. Nozzle tip 507 and a gas supply unit 511 for supplying nitrogen gas into the nozzle tip 507.

  Here, the solder ball supply unit 505 includes a rotatable disk-shaped solder ball moving plate 513. A plurality of ball storage holes 517 are provided on the outer peripheral portion of the solder ball moving board 513, and each ball storage hole 517 stores one solder ball 515. When the ball storage hole 517 coincides with a hole (not shown) provided at the bottom of the ball storage unit 519, one solder ball 515 is stored in the ball storage hole 517 from the ball storage unit 519.

When the solder ball moving board 513 rotates and the ball storage hole 517 coincides with the ventilation path 521, the solder ball falls to the tip 507 via the ventilation path 521, and the solder ball 515 is held near the opening 509 of the tip 507. Is done.
The solder ball 515 held in the vicinity of the opening 509 of the front end 507 is irradiated with the laser of the optical system 503 to melt the solder ball 515, and the electrode 525 of the magnetic head slider 523 and the electrode 529 of the flexure 527 Soldering is performed between them (see Patent Document 1).

Further, as another configuration, a soldering device having a detachable solder supply unit, wherein the solder supply unit sucks and holds the solder balls of the solder storage unit and supplies the solder balls to the soldering device, It is disclosed in Patent Document 2.
Japanese Patent Laid-Open No. 2002-170351 (paragraph numbers [0116] to [0125], FIG. 20 and the like) Japanese Patent Application No. 2005-124607 (paragraph numbers [0030] to [0032], FIGS. 1 to 3 etc.)

  In the soldering apparatus 501 of Patent Document 1, a solder ball moving plate 513 is used to separate one solder ball from a plurality of solder balls 515 stored in the solder ball storage unit 519 and convey the solder ball to the front end portion 507. Is used. However, with recent miniaturization of electronic components, the size of the conductive member for connecting the electrodes has also become very small. Therefore, it is becoming difficult to mechanically separate a single solder ball like the solder ball moving board 513 and transport it to the tip 507. For example, there is a possibility that the solder ball 515 is clogged in the movable clearance between the solder ball moving board 513 and the solder ball apparatus main body to which the solder ball moving board 513 is mounted, or the solder ball is deformed or damaged.

  Moreover, in the structure attracted | sucked by the solder suction part of patent document 2, if the dimension of an electroconductive member is miniaturized, it will also be influenced by the weak static electricity which could be disregarded conventionally, and only by attracting and holding an electroconductive member, It is expected that it will be difficult to reliably suck one conductive member.

  Furthermore, in Patent Document 1, if the ball storage hole 517 of the solder ball moving board 513 is formed with high dimensional accuracy so as to reliably receive only one solder ball, the manufacturing cost of the device itself may increase. In addition, the structure is complicated, and it is becoming difficult to reduce the manufacturing cost of the device.

  Accordingly, an object of the present invention is to provide a conductive member supply device and a conductive member supply method capable of supplying a single small conductive member used for a small electronic component stably and at high speed to a bonding apparatus. .

  In order to solve the above problems, a first aspect of a conductive member supply device that supplies conductive members one by one to a joining device having a nozzle according to the present invention includes: an internal space in which the conductive member is stored; A storage portion having a first vent communicating with the internal space, an alignment path communicating with the internal space by aligning the conductive members in a line, and a second vent communicating with the alignment path A first stopper for blocking / opening the alignment path, and a first air supply means for supplying air from the first vent to the alignment path via the internal space A conductive member transfer section having a transfer path that communicates the inside of the nozzle of the joining device and the alignment path of the alignment section, and a second air supply that supplies air into the alignment path from the second vent hole. 2 with the air supply means and the stopper closed. By controlling the first air supply means to operate and supply air, the conductive member is introduced into the alignment path, and the second air supply means is operated to supply air to the alignment path. Control means, and a distance in the alignment direction between the second vent and the first stopper is substantially equal to a dimension of one to one half of the conductive member, and is within the alignment path. The conductive member is supplied to the inside of the nozzle through the transfer path by the air from the first air supply means or the second air supply means.

According to the second aspect of the conductive member supply device of the present invention, the second air supply means supplies the air from the second vent into the alignment path, thereby forming the one-row shape. Among the aligned conductive members, the first conductive member at the head of the row in contact with the first stopper and the second conductive member connected to the first conductive member are separated from each other.
Furthermore, according to the 3rd aspect of the electroconductive member supply apparatus of this invention, the said transfer part has a 3rd vent hole connected to the said transfer path, and the said transfer is carried out via the said 3rd vent hole. A third air supply means for supplying air to the road or a third suction means for applying a suction force is provided.

  According to the 4th aspect of the electroconductive member supply apparatus of this invention, the said electroconductive member supply part has a 2nd stopper for opening / blocking the said transfer path.

  In order to solve the above-mentioned problem, the conductive member which supplies the conductive member stored in the internal space of the storage portion of the present invention one by one from the alignment path of the alignment portion communicating with the internal space into the nozzle of the joining device. In a first aspect of the supply method, the conductive member stored in the internal space is connected to the internal space from the first vent hole in a state where the alignment path is blocked by the first stopper. An alignment step of supplying air and aligning the conductive members in the alignment path of the alignment portion in a line; the conductive members aligned in the alignment step communicated with the alignment path; A separation step of separating one conductive member by supplying air from a second vent having a distance in the direction in which the conductive members are aligned from the stopper of the second vent having a size of one conductive member to one half of the conductive member; Open the first stopper A supply step of supplying the one conductive member into the nozzle of the joining device through the transfer path of the transfer unit communicating with the alignment path and the alignment path by supplying air from the second vent; .

  Furthermore, according to the 2nd aspect of the electroconductive member supply method of this invention, the said supply process includes the process of providing attraction | suction force in the said transfer path from the 3rd ventilation hole connected to the said transfer path.

  According to a third aspect of the conductive member supply method of the present invention, the supply step further includes a step of locking the one conductive member by a second stopper provided in the transfer path, The conductive member is transferred to the second stopper by the suction force applied from the third vent.

  Moreover, according to the 4th aspect of the electroconductive member supply method of this invention, the said supply process includes the process of supplying air in the said transfer path from the 3rd ventilation hole connected to the said transfer path.

  According to a fifth aspect of the conductive member supply method of the present invention, the supply step further includes a step of locking the one conductive member by a second stopper provided in the transfer path, The conductive member is transferred to the second stopper by air supplied from the third vent.

  According to a sixth aspect of the conductive member supply method of the present invention, the supplying step includes a step of locking the one conductive member by a second stopper provided in the transfer path, The conductive member is transferred to the second stopper by air supplied from the second vent.

  As the air supplied by the air supply means, it is desirable to use a nitrogen mixed gas or the like for the purpose of preventing oxidation of the conductive member.

  Furthermore, in this specification, a conductive member means a member that can electrically connect members to be joined, such as a metal material or an alloy such as solder or gold. The shape of the conductive member is not limited to a spherical shape, but includes a cubic shape, a cone shape, and the like.

  A joining apparatus means the apparatus for electrically connecting between the members by apply | coating the electroconductive member fuse | melted with the heat | fever between the members to join, and cooling and solidifying it.

  It is a configuration in which one conductive member is separated and transferred from the conductive members arranged in a row using air, and since the conductive member is not mechanically supplied, the conductive member is deformed, It can be prevented from being damaged. As a result, one conductive member can be reliably and easily supplied to the joining apparatus regardless of the size of the conductive member.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments and examples of a conductive member supply apparatus and a conductive member supply method according to the present invention will be described with reference to the drawings. In the drawings, the same parts are denoted by the same reference numerals.

(Embodiment 1)
The first embodiment is an example in which the conductive member supply device is applied to a solder ball supply device. FIG. 1A to FIG. 1E are partial cross-sectional views illustrating a process of separating and supplying one solder ball from another solder ball according to the first embodiment of the present invention. . In addition, from the viewpoint of clarifying the drawing, the components of the solder ball supply device are described only in FIG. 1A, and are omitted in FIGS. 1B to 1E. FIG. 2 is a diagram illustrating a process of a solder ball supply method using the solder ball supply apparatus of FIG.

  As shown in FIG. 1A, the solder ball supply device 1 includes a storage portion 4 provided with an internal space 5 for accommodating a solder ball 3 that is a spherical conductive member, and an alignment path 9 that communicates with the internal space 5. The first main vent (first vent path) formed by the apparatus main body 7 having the alignment portion 8 provided with the stopper 11, the stopper 11 for opening and closing the alignment path 9, and the bottom block 23 described later. A first air supply unit 19 (first air supply means) that supplies air and a second air that is provided in the apparatus main body 7 and supplies air into a second vent 15 that communicates with the alignment path 9. A supply unit 17 (second air supply unit) and a control unit 21 (control unit) for driving the first air supply unit 19 and the second air supply unit 17 at a predetermined timing are provided. Furthermore, in this embodiment, although not an essential element of the present invention, a drive unit 13 for driving a stopper 11 that opens or blocks the alignment path 9 is provided, and the drive unit 13 causes the stopper 11 to be driven by a command from the control unit 21. It is a configuration that operates.

  Below, the detail of each element of the solder ball supply apparatus 1 is demonstrated. The storage part 4 is a lower part of the substantially cylindrical apparatus main body 7, and the solder balls 3 are stored in an internal space 5 defined by the inner peripheral surface thereof. The alignment unit 8 is an upper part of the apparatus main body 7, is defined by an inner peripheral surface thereof, and has an alignment path 9 that communicates with the internal space 5.

  The inner diameter of the internal space 5 of the storage part 4 is larger than the inner diameter of the alignment path 9 of the alignment part 8, and the internal space 5 and the alignment path 9 are connected by a taper part 25. The other end of the alignment path 9 constitutes an opening 27 to the outside of the apparatus body 7. The inner diameter of the alignment path 9 is slightly larger than the outer diameter of the solder ball 3. Accordingly, when a plurality of solder balls 3 enter the alignment path 9, the solder balls 3 are aligned in a line along the longitudinal direction (hereinafter also referred to as an alignment direction in which the solder balls are aligned). In this embodiment, when the stopper 11 is closed, the solder balls (3a, 3b) can be arranged in a line in the alignment path 9.

  Further, a hole, that is, a stopper accommodating path 29 is formed in a substantially vertical direction of the alignment path 9 of the apparatus main body 7. The stopper 11 is accommodated in the stopper accommodating passage 29, and the stopper 11 slides. One end of the stopper accommodating path 29 communicates with the alignment path 9, and the other end forms an opening communicating with the outside of the apparatus.

  Further, a second vent 15 is provided in the alignment path 9 below the stopper accommodating path 29 of the apparatus main body 7 in the alignment direction. The second air vent 15 is provided with a second air vent path 16 extending to the alignment path 9. One end of the second air vent path 16 communicates with the alignment path 9, and the other end is the device. An opening to the outside of the main body 7 is formed. The second air ventilation path 16 extends so as to be substantially orthogonal to the direction in which the alignment path 9 extends.

  The stopper housing hole 29 of the apparatus main body 7 houses a rod-shaped stopper 11 that is slidably dimensioned therein. The tip 11 a of the stopper 11 enters the alignment path 9 and blocks the alignment path 9. In addition, what is necessary is just to satisfy the dimensional relationship which can interrupt | block the movement of the solder ball 3 in the closed position (refer FIG. 1 (A), (B)) where the front-end | tip part 11a interrupts the alignment path 9. FIG. In this embodiment, since the cross section of the alignment path 9 is substantially circular, air passes through the alignment path 9 even when the stopper 11 protrudes into the alignment path 9 and the alignment path 9 is blocked. Can do.

  Further, the stopper 11 is connected to a driving unit 13 such as a known motor or a piezoelectric actuator that drives the stopper 11. The stopper 11 is moved in the left-right direction in FIG. 1 by the drive unit 13 to block / open the alignment path 9.

Further, the minimum length K in the direction in which the solder balls are aligned between the center line C of the second air passage 16 having a substantially circular cross section and the line C ′ passing through the lower end 11b of the stopper 11 and parallel to the center line C. However, it is preferable that the solder ball 3 is sized so as to have a diameter of one to half of the solder balls 3.

  A second air supply unit 17 that supplies compressed air is connected to the second air ventilation path 16. As described above, by having the positional relationship between the second air ventilation path 16 and the stopper 11, the solder ball 3a locked to the stopper 11 can be separated from the other solder balls 3b by compressed air. You can be sure.

  Further, the bottom block 23 attached to the lower end of the apparatus main body in FIG. 1 is formed of a porous body made of sintered metal or the like. The fine through hole of the porous body constitutes the first air passage. A first air supply unit 19 is connected to the bottom block 23. Accordingly, the air from the first air supply unit 19 is supplied into the internal space 5 through the bottom block 23.

  Furthermore, the solder ball supply device 1 includes a control unit 21. The control unit 21 is connected to the drive unit 13, the first air supply unit 19, and the second air supply unit 17. A drive signal from the control unit 21 is applied to the drive unit 13, the second air supply unit 17, and the first air supply unit 19, and each can be driven at a predetermined operation timing.

  The operation of the solder ball supply device having the above configuration will be described below. First, a plurality of solder balls 3 are loaded into the internal space 5 of the solder ball supply apparatus 1 from a solder ball loading hole (not shown) (see member 314 in FIG. 8) (FIG. 1A). The stopper 11 is in a state where the alignment path 9 is blocked (S1 in FIG. 2).

  The next step is to align the solder balls. The first air supply unit 19 that receives the drive signal from the control unit 21 is driven to supply air into the internal space 5 through the bottom block 23 (S2 in FIG. 2). The air flows upward from the bottom block 23, and the solder ball 3 floats upward and is guided into the alignment path 9. The solder balls 3 introduced into the alignment path 9 are locked by the stopper 11 and aligned in the alignment path 9 (FIG. 1B, S3 in FIG. 2). The solder ball 3 in the internal space 5 can be efficiently guided into the alignment path 9 by the taper portion 25 provided between the internal space 5 and the alignment path 9.

  Furthermore, the process of separating the solder balls continues. The second air supply unit 17 that receives the drive signal from the control unit 21 is driven (S4 in FIG. 2), and the air 31 is supplied from the second vent 15 into the alignment path 9. The air 31 branches into an air 33 flowing upward in FIG. 1C and an air 35 flowing downward in the alignment path 9. The air 31 separates the solder balls 3a and 3b adjacent in the alignment path 9 from each other. That is, the first solder ball 3a at the head of the row in contact with the stopper 11 is separated from the second solder ball 3b connected to the first solder ball 3a. Further, the upper solder balls 3 a of the adjacent solder balls 3 are maintained in contact with the stopper 11 by the upward air 33. On the other hand, the lower solder ball 3 b is returned into the internal space 5 by the downward air 35. As a result, a single solder ball 3 a is separated and held in the alignment path 9.

  Next, as shown in FIG. 1D, the stopper is opened and the solder balls are discharged. In this step, in a state where the supply of the air 31 from the second air supply unit 17 is maintained, the drive of the first air supply unit 19 is stopped by a signal from the control unit 21 (S5 in FIG. 2), Air supply from the bottom block 23 side is stopped. Next, by applying a drive signal from the control unit 21 to the drive unit 13, the stopper 11 is moved to the right (arrow 37) in FIG. 1D, and the alignment path 9 is opened (S7 in FIG. 2). . At this time, the solder ball 3a moves toward the opening 27 of the alignment path 9 by the upward air 33 in the alignment path 9, and is conveyed to the next step. On the other hand, since the solder balls in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air 35 flowing in the alignment path 9, the solder balls are supplied through the alignment path 9. There is no accidental discharge to the outside of the device 1.

  The last is a step of closing the stopper shown in FIG. A drive signal from the control unit 21 is applied to the drive unit 13, the stopper 11 is moved in the left direction (arrow 39), and the alignment path 9 is blocked (S8 in FIG. 2). After the shut-off or simultaneously with the shut-off, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 21 and the supply of air is stopped (S8 in FIG. 2). Then, the solder balls are supplied to the remaining solder balls 3 by repeating again from the step S2 in order.

(Embodiment 2)
The second embodiment of the conductive member supply device of the present invention is a configuration of a solder ball supply device in which a suction part (suction means) is further provided in the solder ball supply device of the first embodiment. FIG. 3 is a partial cross-sectional view of the solder ball supply apparatus 101 according to the second embodiment. FIG. 4 is a process diagram showing a process of supplying solder balls using the solder ball supply apparatus of FIG. Since the configuration of the solder ball supply device 101 is similar to that of the solder ball supply device 1 of FIG. 1, only different parts will be described. Therefore, the parts that are not particularly described have the same configuration as that of the first embodiment.

  In the present embodiment, the first suction part 41 is connected to the bottom block 23 of the apparatus body 7. The first suction part 41 having a suction source (not shown) is for applying a suction force to the internal space 5 through the bottom block 23. The first suction unit 41 is connected to the control unit 121, and when receiving a drive signal from the control unit 121, the first suction unit 41 operates to apply a suction force to the internal space 5. It has become.

  The control unit 121 is also connected to the first and second air supply units 17 and 19 and the drive unit 13 in the same manner as the control unit 21 of the conductive member supply device 1 of FIG. Therefore, each element can be driven at a predetermined operation timing.

  Next, the operation of the solder ball supply device 101 of the second embodiment will be described. 1A and 1B of the first embodiment, a solder ball loading process and an alignment process for aligning solder balls are performed (S1 to S3 in FIG. 4).

  The first air supply unit 19 is stopped, and the air supply to the internal space 5 is stopped. As shown in FIG. 3, the next solder ball separation step is different from that of the first embodiment. In the solder ball separation process of the second embodiment, a drive signal is sent from the control unit 121 to the second air supply unit 17 to supply air 31 (S4 in FIG. 4). Further, the first air supply unit 19 is stopped via the control unit 121 (S9 in FIG. 4), and the first suction unit 41 is operated to apply a suction force to the internal space 5 (FIG. 4). S9). With this configuration, the air 31 is branched into the downward air 35 and the upward air 33 in the alignment path 9, and an air flow 43 is formed by the suction force of the first suction part 41. The Accordingly, the solder ball 3b is returned to the internal space 5, while one solder ball 3a is separated and held in the alignment path 9. According to this configuration, compared with the first embodiment, the air flow 43 in the internal space 5 is reliably formed except for the solder balls 3a, and the speed of the solder ball separation process can be realized.

  Next is a step of discharging the solder balls (see FIG. 1D). In this step, the operation of the first suction part 41 is stopped (S10 in FIG. 4). And supply of the air 31 from the 2nd air supply part 17 is maintained, the stopper 11 is moved rightward (S7 of FIG. 4), and the alignment path 9 is open | released (refer FIG.1 (D)). At this time, the solder ball 3a moves toward the opening 27 of the alignment path 9 by the upward air 33 in the alignment path 9, and is conveyed to the next step. On the other hand, since the solder balls 3 in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air 35 flowing in the alignment path 9, the solder balls 3 move along the alignment path 9. As a result, the solder ball supply device 1 is not accidentally discharged to the outside.

  The last is a blocking process using a stopper (see FIG. 1E). A drive signal from the control unit 121 is applied to the drive unit 13, the stopper 11 is moved leftward, and the alignment path 9 is blocked (S8 in FIG. 4). After or simultaneously with the shut-off, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 121 (S8 in FIG. 4) and the supply of air is stopped.

(Embodiment 3)
The third embodiment of the conductive member supply device of the present invention is a configuration of a solder ball supply device in which another solder part (suction means) is provided in the solder ball supply device 101 of the second embodiment. FIG. 5 is a partial cross-sectional view of a solder ball supply apparatus 201 according to the third embodiment. FIG. 6 is a process diagram of a solder ball supplying method using the solder ball supplying apparatus of FIG. Since the configuration of the solder ball supply device 201 is similar to that of the solder ball supply device 101 of FIG. 3, only different parts will be described. Therefore, the parts that are not particularly described have the same configuration as that of the second embodiment.

  In the present embodiment, the second suction part 45 is newly connected to the second ventilation path 16 of the apparatus main body 7. The second suction part 45 is for applying a suction force to the alignment path 9 via the second ventilation path 16 and the second ventilation port 15. The second suction unit 45 is connected to the control unit 221, and receives the drive signal from the control unit 221, so that the second suction unit 45 is activated and applies a suction force to the second vent 15. It is the structure to do.

  Further, like the control unit 121 of the conductive member supply device 101 of FIG. 3, the control unit 221 of the conductive member supply device 201 in the third embodiment includes the first and second air supply units 17, 19, 1 suction unit 41 and drive unit 13. Therefore, each element can be driven at a predetermined timing.

  Next, the operation of the solder ball supply device 201 of the third embodiment will be described. As in FIG. 1A of the first embodiment, first, solder balls are loaded in a state where the alignment path 9 is blocked by the stopper 11 (S1 in FIG. 6).

  The next solder ball arranging step is different from the first and second embodiments as shown in FIG. The first air supply unit 19 and the second suction unit 45 are operated by a drive signal from the control unit 221 (S11 in FIG. 6). Inside the solder ball device 201, an air flow 51 to the outside of the solder ball device 201 is formed through the bottom block 23, the internal space 5, the alignment path 9, and the opening 27, and the solder balls 3 are aligned (S3 in FIG. 6). ). Further, since the suction force is applied to the second ventilation port 15 by the second suction part 45, a part of the air that has passed through the internal space 5 and reached the alignment path 9 is part of the second ventilation path 16. Inward air flow (arrow 49) is formed. Therefore, the solder ball 3 can be quickly and reliably moved into the alignment path 9. Further, according to this configuration, the solder balls can be introduced into the alignment path 9 more quickly than in the first and second embodiments that do not use the second suction part 45.

  Next is a solder ball separation step. In this step, the operation of the second suction unit 45 is stopped and the second air supply unit 17 is operated (S4 in FIG. 6). Then, similarly to the second embodiment, the control unit 221 stops the first air supply unit 19 and operates the first suction unit 41 (S9 in FIG. 6), and the air 31 (see FIG. 3). While supplying, a suction force acts in the internal space 5. With this configuration, the air flow 43 (see FIG. 3) is formed by the downward air (see reference numeral 35 in FIG. 3) where the air 31 branches off in the alignment path 9 and the suction force by the first suction portion, and solder The solder balls 3 excluding the balls 3a are returned into the internal space 5. As a result, a single solder ball 3 a is separated and held in the alignment path 9.

  Next is a step of opening the stopper and discharging the solder ball (see FIG. 1D). In this step, the operation of the first suction unit 41 is stopped (S10 in FIG. 6) while the supply of the air 31 from the second air supply unit 17 is maintained, and the suction from the bottom block 23 side is stopped. Further, by applying a drive signal from the control unit 221 to the drive unit 13, the stopper 11 is moved to the right, and the alignment path 9 is opened (shown by a broken line in FIG. 5). At this time, the solder ball 3a moves toward the opening 27 of the alignment path 9 by the upward air in the alignment path 9 (see reference numeral 33 in FIG. 3) and is discharged to the next step. On the other hand, the solder balls in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air flowing in the alignment path 9 (see reference numeral 35 in FIG. 3). 9 is not accidentally discharged to the outside of the solder ball supply device 1.

  The last is a blocking process using a stopper (see FIG. 1D). A drive signal from the control unit 221 is applied to the drive unit 13, the stopper 11 is moved leftward, and the alignment path 9 is blocked (S8 in FIG. 6). After or simultaneously with the shut-off, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 221 and the supply of air is stopped (S8 in FIG. 6).

  In addition, in said 2nd Embodiment-3rd Embodiment, although it was set as the structure which provides a suction force through the 1st and 2nd ventilation port, respectively, the 1st or 2nd suction part, It goes without saying that a suction port may be provided corresponding to each of the two suction portions.

  Below, the Example which applied the electroconductive member supply apparatus of this invention to the soldering apparatus is described. 7 is a schematic diagram of a soldering apparatus, FIG. 8 is a partial cross-sectional view showing a solder ball supply unit and a nozzle, and FIG. 9 is an enlarged view of a part IX in FIG.

  The soldering apparatus 351 includes a gantry 353, a laser irradiation unit 355 for melting a spherical solder ball, an adsorption unit 357 for attracting and holding the solder ball, and a gantry 353, which are disposed on the work surface 353a of the gantry 353. An x-axis direction moving stage 365 that can move in the x-direction and a y-axis direction moving stage 361 that can move in the y-axis direction, and a work 359 that is fixed to the upper surface of the x-axis direction moving stage 365 are disposed on the work surface 353a. A work tray 367 to be conveyed and a z-axis direction moving stage 363 that is fixed on the y-axis direction moving stage 361 and can move in the z-axis direction.

  The suction unit 357 is fixed to the z-axis direction moving stage 363 via the arm 369, and the nozzle arm 369 moves in the vertical direction in FIG. Similarly to the suction unit 357, the laser irradiation unit 355 is also connected to the z-axis direction moving stage 363 via the irradiation unit support member 371. Therefore, the adsorption part 357 and the laser irradiation part 355 are movable in the vertical direction of FIG.

  Further, since the z-axis direction moving stage 363 is fixed to the y-axis direction moving stage 361, the z-axis direction moving stage 363 can move in the y-axis direction (left and right direction in FIG. 7), and the laser irradiation unit 355. And the adsorption | suction part 357 can move to a y-axis direction.

  On the other hand, the laser irradiation unit 355 and the suction unit 357 are moved in the x-axis direction (the front and back direction in FIG. 7) by moving the work tray 367 fixed to the x-axis direction stage 365.

  The work placement surface 368 of the work tray 367 is inclined with respect to the vertical direction, the work 359 is placed on the placement surface 368, and the electrodes are joined. In this embodiment, the work 359 is an electronic component used for a hard disk, and more specifically, a flexure 372 on which a magnetic head slider 370 is mounted. The magnetic head slider electrode and the flexure electrode are joined by soldering using solder balls. Here, both electrodes are arranged with an angle of 90 degrees, solder balls are arranged at the corners formed by these electrodes, and the balls are melted by heat rays or the like to make electrical connection between these electrodes. Is called.

  The solder ball supply device 301 is fixed to the upper surface 353 a of the gantry 353. Details of the solder ball supply device 301 will be described with reference to FIGS. FIG. 8 is a partial cross-sectional view showing a solder ball supply unit and a nozzle, and FIG. 9 is an enlarged view of a portion IX in FIG.

  A solder ball supply device 301 having a configuration similar to that of the second embodiment constitutes an apparatus main body 307, a first air supply unit 319, a first suction unit 341, a second air supply unit 342, and a stopper. A nozzle 373 and a control unit 321 are provided. The configuration of the solder ball supply device 301 is the same configuration and operation method (FIG. 4) as in the second embodiment unless otherwise specified.

  The apparatus main body 307 has a substantially rectangular parallelepiped shape and includes a central block 308, plate-like upper blocks 310 mounted on the upper and lower surfaces in the thickness direction, and a bottom block 312. The central block 308 has a through hole that defines an internal space 305 in which the solder ball 303 is stored, and the through hole expands downward in the thickness direction. Further, a solder replenishing hole 314 is provided that extends in a substantially horizontal direction of the central block 308 and communicates the internal space 305 with the outside. A solder ball 303 is loaded into the internal space 305 through the solder replenishment hole 314. A replenishment hole lid 316 that closes the solder replenishment hole 314 is screwed to the central block 314 except when the solder ball is loaded.

  Further, the central block 308 is provided with a second ventilation configuration path 318. The second ventilation constituting path 318 extends from the side surface of the central block 308 in the front and back direction of the drawing, and further bends and extends to the upper surface side in the thickness direction, and opens at the upper surface.

  Further, the upper block 310 mounted on the upper surface of the central block 308 has a nozzle housing hole 375 for inserting a tip portion of a nozzle 373, which will be described later, and a groove 377 that continues to the nozzle housing hole 375 and extends in the left direction in FIG. And having. When the upper block 310 is mounted on the central block 308, a horizontal passage in the right direction is formed by the groove 377 and the upper surface of the central block 308. This horizontal passage and the above-described second ventilation configuration path 318 constitute a second ventilation path. Accordingly, the air from the second air supply unit 342 is supplied to the nozzle housing hole 375 through the second air passage.

  Further, the bottom block 312 attached to the lower surface of the central block 308 is composed of a sintered body (porous body). A first air supply part 319 and a first suction part 341 are connected to the bottom block 312 via a tube 323. With the above configuration, the air from the first air supply unit 319 and the suction force from the first suction unit 341 are applied to the internal space 305 through the first vent that is a fine hole of the bottom plate block 312. .

  The nozzle 373 on which the solder ball 303 is held by suction has a tapered shape and functions as a stopper of the solder ball supply device 301. The nozzle 373 includes a solder ball holding part 373a and a nozzle body 373b. The solder ball holding part 373a constituting the tip part of the nozzle 373 defines an opening 373d of the nozzle 373, and the peripheral wall part 373f for positioning the solder ball 303 in the radial direction and the solder ball positioning in the axial direction upward. A contact portion 373c to perform. Here, the inner diameter of the peripheral wall portion 373f (opening) is slightly larger than the outer diameter of the solder ball 303a. Further, the vertical distance from the opening 373d to the contact portion 373c in a state where the nozzle 373 is upright is dimensioned to be approximately the same as the outer diameter of the solder ball 303a. Accordingly, the solder ball holding portion 373a is dimensioned so as to accommodate only one solder ball 303a. That is, the solder ball holding portion 373a functions as a stopper of the solder supply device 301.

  The nozzle main body 373b is provided with a suction air supply path 373e that passes through the contact portion 373c of the solder ball holding portion 373a and applies a suction force. A suction pump (not shown) is connected to the suction air supply path 373e, and suction force is supplied to the solder ball holding portion 373a via the suction air supply path 373e to suck and hold the solder balls. In this embodiment, when the nozzle 373 is inserted into the nozzle housing hole 375, the central axes of the nozzle 373, the nozzle housing hole 375, and the internal space 305 are substantially aligned.

  The operation of the soldering apparatus 351 having the above configuration will be briefly described. First, the work 359 is supplied to the work tray 367. In FIG. 7, only one workpiece 359 is shown, but it goes without saying that a plurality of workpieces may be placed. That is, the number of workpieces and the number of nozzles 373 may be combined to perform the soldering operation for all the workpieces 359 at a time, or the single nozzle 373 may repeat the soldering operation for each workpiece.

  Next, a solder ball supplying step of supplying the solder balls 303 to the nozzles 373 of the suction unit 357 using the solder ball supplying device 301 is performed. In the solder ball supplying step, first, the nozzle 373 moves using an x-axis direction moving stage (not shown), a y-axis direction moving stage 361, and a z-axis direction moving stage 363 according to a command from the drive unit 379. Then, it is inserted into the nozzle accommodation hole 375 of the apparatus main body 307. Thereafter, similar to the flowchart of the second embodiment shown in FIG. 4, the solder balls are accommodated in the solder ball holding portion 373a. That is, the state where the nozzle 373 is inserted into the nozzle housing hole 375 corresponds to the state where the stopper in the second embodiment is closed. Further, the nozzle holding portion 373a corresponds to the alignment path. The minimum length between the center line C of the groove 377 having a substantially circular cross section of the upper block 310 and the line C ′ passing through the contact point of the solder ball holding portion 373a with the solder ball 303a and parallel to the center line C. K is preferably dimensioned to be one to one half the diameter of solder ball 303a.

  Air is supplied from the first air supply unit 319 into the internal space 305, the plurality of solder balls 303 float, and the solder balls 303 are introduced into the solder ball holding unit 373a.

  Next, air for separating the solder balls 303a from other solder balls is supplied from the second air supply unit 342 in the vicinity of the opening 373d of the nozzle 373 in the horizontal direction. This air separates one solder ball 303 a from the other solder balls 303. Further, at the same time as or before the operation of the second air supply unit 342, the first air supply unit 319 is deactivated and the first suction unit 341 is activated so that the suction force is generated in the internal space 305. Give. At this time, a part of the air supplied from the second air supply unit 342 branches, and a downflow toward the bottom block 312 is formed in the internal space 305. Therefore, the other solder balls 303 are separated from the solder balls 303a and returned to the internal space 305.

  Further, the operation of the first suction unit 341 is stopped by a command from the control unit 321, the suction pump (not shown) of the nozzle 373 is operated, and suction air is applied to the solder ball 303 a to be sucked into the solder ball holding unit 373 a. To do.

  Next, a transfer process for transferring the solder balls 303a to the workpiece 359 is performed. Specifically, the nozzle 373 is moved upward in the figure from the nozzle housing hole 375, and the second air supply unit 342 is stopped. After moving the nozzle 373 from the nozzle housing hole 375, the second air supply unit 342 is stopped by maintaining the air below the internal space 305 by the second air supply unit 342, and other solders. This is to prevent the ball from being attracted to the nozzle.

  The nozzle 373 is positioned by appropriately moving the y-axis direction moving stage 361, the z-axis direction moving stage 363, and the x-axis direction moving stage 365 at the corner formed by the electrode of the flexure 372 and the electrode of the head slider 370. .

  The last is a bonding process. The laser irradiation unit 355 irradiates the solder ball 303a held by the solder ball holding unit 373a of the adsorption unit 357 with laser light, melts the solder ball 303a, and solders the electrode of the flexure 372 and the electrode of the head slider 370. To do.

  The second embodiment is an example in which the conductive member supply device of the present invention is applied to a soldering device, as in the first embodiment. FIG. 10 is a partial cross-sectional view showing the solder ball supply unit and the nozzle, and FIG. 11 is an enlarged view of the XI portion of FIG.

  Regarding the configuration of the second embodiment, only the parts different from the first embodiment will be described. Therefore, configurations and operations not particularly specified are the same as those in the first embodiment.

  The solder ball supply device 401 includes an apparatus main body 407, a first air supply unit 419, a first suction unit 441, a second air supply unit 420, and an adsorption unit (reference numeral 357 in FIG. 7) that constitutes a stopper. No. 473) and a control unit 421.

  The apparatus main body 407 includes a substantially rectangular parallelepiped central block 408 and a plate-like bottom block 412 attached to the lower surface in the thickness direction. That is, unlike the first embodiment, no upper block is provided.

  The central block 408 is provided with a second ventilation path 418. The second ventilation path 418 extends from the side surface of the central block 408 in the front and back direction of the drawing, further extends to the upper surface side in the thickness direction, and is opened on the upper surface 408a. And a groove 418 b that is continuous with the internal space 405.

The nozzle 473 that sucks and holds the solder ball 403 has a tapered shape and functions as a stopper and an alignment path of the solder ball supply device 401. The nozzle 473 includes a solder ball holding part 473a and a nozzle body 473b. The solder ball holding portion 473a constituting the tip portion of the nozzle 473 defines an opening 473d of the nozzle 473, a peripheral wall portion 473f for positioning the solder ball 403a in the radial direction, and a solder ball upward in the axial direction of the nozzle 473. And a contact portion 473c for positioning. The difference from the first embodiment is that an inclined surface 473g is formed on the outer peripheral surface of the nozzle 473, connected to the inclined surface 473g, and a notch 473h of the peripheral wall portion 473f is provided. The inclined surface 473g is brought into contact with the groove 418b of the central block 408a to constitute the second ventilation path 418. Accordingly, the nozzle 473 is arranged in such a relationship that the central axis X1 of the nozzle 473 and the central axis X2 of the internal space 405 intersect obliquely. The second air passage 418 is completed when the nozzle 473 and the central block 408 are joined, and the air from the second air supply unit 420 is supplied to the internal space 403.
Further, the solder ball holding portion 473a is dimensioned so as to accommodate only one solder ball 403a as in the first embodiment. That is, the solder ball holding portion 473a functions as an alignment path of the solder supply device 401. Further, the contact portion 473c and the peripheral wall portion 473f serve as a stopper of the solder device 401. The minimum length K between the center line C of the groove 418b having a substantially rectangular cross section and the line C ′ passing through the upper end of the solder ball 403a and parallel to the center line C is a diameter corresponding to one solder ball to one half. It is preferable to dimension so that it may become length.

  Since the operation of the soldering apparatus 401 having the above configuration is the same as that of the first embodiment, the description thereof is omitted.

  Example 3 is a modification of the solder ball supply device of the third embodiment. FIG. 12 is a cross-sectional view of a main part of the solder ball supply device. FIG. 13 is a timing chart showing the first operation timing, and FIG. 14 is a timing chart showing the second operation timing.

  The solder ball supply device 501 of the third embodiment has a configuration similar to the solder ball supply device 201 of FIG. The difference is that the second suction portion 545 is disposed downstream of the stopper 511 in the direction in which the solder ball advances. Further, the second ventilation port 515 and the second suction port 516 are provided at different locations with respect to the alignment path 509, and a plurality of second suction ports 516 are provided in the direction in which the alignment path 509 extends. It is a point provided at equal intervals.

  The experimental conditions are as follows. The solder ball 503 has a diameter of about 100 μm. The gas supplied from the first and second air supply units 519 and 517 is nitrogen gas. The environment in which the solder ball supply device 501 is arranged was room temperature 25.3 to 26.4 ° C. and humidity 48.3 to 51.7%. Further, the air pressure supplied from the first air supply unit is about 50 to 80 kPa, and the air pressure supplied from the second air supply unit is about 50 to 60 kPa. Further, as a countermeasure against charging of the solder balls, an ionizer is inserted from the first air supply unit 519 and the second air supply unit 517 in front of a regulator (not shown) for adjusting the gas flow rate, and the supplied nitrogen gas is neutralized. is doing. Further, a ground is connected to the reservoir 504 that defines the internal space 505.

  As shown in FIGS. 13 and 14, the operation timing was tested for success or failure of the separation of the solder balls at two timings. 13 and 14, SV on the vertical axis indicates the operation of the second suction unit 545, CB indicates the operation of the second air supply unit 517, and BB indicates the operation of the first air supply unit 519. BV indicates the operation of the first suction portion 541, and the stopper indicates the operation of the stopper 511. The horizontal axis indicates time (T).

  As shown in the timing chart of FIG. 13, each element is operated by the control unit 521. First, the second suction part 545 is operated at t1. Then, at t2, the first air supply unit 519 is operated to introduce the solder ball 503 into the alignment path 509. In the initial state, since the stopper 511 is closed, the solder ball 503 is engaged with the stopper 511. Next, at t3, the second air supply unit 517 is operated to separate the solder ball 503a from the other solder balls 503. At t3, the first air supply unit 519 is further stopped, and the first suction unit 541 is operated. Thereby, an air flow from the second vent 515 to the internal space 505 is formed, and the solder balls 503 excluding the solder balls 503a are returned to the internal space 505. Further, at t4, the operation of the second suction unit 545 and the first suction unit 541 is stopped, while the operation of the second air supply unit 517 is maintained, and the air causes the solder balls 503a to enter the alignment path 509. Maintained. Then, at t5, the stopper 511 is opened, and the solder ball 503a is sent in the arrow x direction. Then, at t6, the stopper 511 is shut off, and finally the second air supply unit 517 is stopped. This is to prevent another solder ball 503 from passing through the stopper 511 by mistake while the stopper 511 is opened. It took about 0.45 seconds to perform this operation pattern in one step.

  In the second operation pattern shown in FIG. 14, the operations at t1 and t2 are the same as those in FIG. At t3, the second suction part 545 is stopped and the second air supply part 517 is operated to separate the solder balls 503a aligned in the alignment path 509 from the other solder balls 503. At t4, the first air supply unit 519 is stopped and the first suction unit 541 is operated to return the solder balls 503 excluding the solder balls 503a into the internal space 505. The first suction portion 541 is stopped at t5, the stopper 511 is opened at t6, and the air from the second air supply portion 517 is sent over the stopper 511 in the x direction. Then, at t7, the second air supply unit 517 is stopped, and the alignment path 509 is blocked by the stopper 511, and one process is completed. According to this operation timing, the time required for one supply process was about 0.41 seconds.

  According to the embodiment of the present invention, it is possible to reliably supply a single solder ball and sufficiently satisfy the time required for the supply work as compared with the configuration shown in the background art, regardless of which timing chart is used. It became.

  In Example 4, the conductive member supply device of the present invention is applied to a soldering device. FIG. 15 is a partial cross-sectional view showing a solder ball supply unit and a nozzle. FIG. 16 is a process diagram illustrating a process of supplying solder balls in the fourth embodiment. Note that, unlike the first, second, and third embodiments, the soldering apparatus according to the fourth embodiment is configured to discharge the solder balls supplied into the nozzle.

  A solder ball supply device 601 having a configuration similar to that of the second embodiment is fixed, and includes a device main body 607, a first air supply unit 619, a first suction unit 641, and a second air supply unit 617. , A stopper 611, a control unit 621, and a conductive member transfer unit that connects the apparatus main body 607 and a soldering device 602 described later, that is, a solder transfer tube 681. The configuration of the solder ball supply device 601 is the same as that of the second embodiment (FIG. 3) and the operation method (FIG. 4) unless otherwise specified.

  The apparatus main body 607 includes a substantially rectangular parallelepiped central block 608 and a plate-like bottom block 612 attached to the lower surface in the thickness direction. The central block 608 has a through hole that defines an internal space 605 that stores the solder balls 603 and an alignment path 609 that continues to the internal space 605, and the through hole expands downward in the thickness direction. To do. One end of a hollow solder transfer tube 681 is attached to the upper end of the alignment path 609, that is, the opening 627 at the upper end of the apparatus main body 608. The solder transfer tube 681 is indicated by reference numerals 681a, 681b, 681c in FIG. 15 and is shown as a divided member, but these are continuous members. The same applies to other embodiments described later.

  Further, the central block 608 is provided with a stopper 611 that is a bar-shaped member that blocks and opens the alignment path 609. The vertical length K of the alignment path 609 from the center line C of the second vent 615 having a substantially circular cross section, which will be described later, to the line C ′ passing through the lower end of the stopper 611 and parallel to the center line C is defined as the solder ball It is dimensioned to be approximately equal to the diameter of one to half of 603. Further, the alignment path 609 has an inner diameter of the alignment path so that a single solder ball 603a is in contact with the stopper 611 among solder balls aligned in the alignment path 609 with the stopper 611 closed. It is attached.

  In addition, a solder replenishing hole 614 extending in a substantially horizontal direction of the central block 608 and communicating with the internal space 605 and the outside is provided. A solder ball 603 is loaded into the internal space 605 through the solder replenishment hole 614. A replenishment hole lid 616 that closes the solder replenishment hole 614 is screwed to the central block 608 except when the solder ball is loaded.

  Further, the second air passage 618 provided in the central block 608 extends from the side surface of the central block 608 in the front and back direction of the drawing and is bent toward the inner space 605 side on the right in the horizontal direction in the drawing. It extends and communicates with the internal space 605 through a second vent 615 that is an opening of the alignment path 609.

  The bottom block 612 attached to the lower surface of the central block 608 is composed of a sintered body (porous body). A first air supply unit 619 and a first suction unit 641 are connected to the bottom block 612 via a tube 623. With the above configuration, the air from the first air supply unit 619 and the suction force from the first suction unit 641 are applied to the internal space 605 through the first vent hole that is a fine hole of the bottom plate block 612. .

  Next, the nozzle 673 of the soldering device 602 connected to the solder ball supply device 601 will be described. Since the movable soldering apparatus of the present embodiment has the same configuration as the soldering apparatus shown in FIG. 7, only different parts will be described.

  The nozzle 673 of the soldering apparatus 602 has a nozzle tip 673a and a nozzle body 673b.

  A solder accommodation space 683 is provided inside the nozzle body 673b, and a solder introduction port 673i communicating with the solder accommodation space 683 is opened to the outside. The solder introduction port 673 i and the opening 627 of the central block 608 are connected by a solder transfer tube 681.

  The nozzle tip 673a is provided with a nozzle discharge path 673e extending in the axial direction of the nozzle tip 673a and a discharge port 673f that communicates with the nozzle discharge path 673e and opens to the outside.

  The solder balls 603 transferred from the solder ball supply device 601 to the solder accommodating space 683 of the nozzle 673 via the solder transfer tube 681 are discharged to the outside of the nozzle 673 through the nozzle discharge path 673e.

  When the soldering device 601 is movable as in the above configuration and the solder ball supply device 602 is fixed, the flexible solder transfer tube 681 is operated within the movable range of the nozzle. By setting the length so as not to hinder, the degree of freedom of soldering work can be improved.

  In order to transfer the solder balls into the solder accommodating space 683 of the soldering apparatus 602, for example, as disclosed in Japanese Patent Application No. 2005-124607, a mechanism for supplying the solder balls from the internal space 605 into the solder accommodating space 683 is required. It becomes. However, according to the present embodiment, by using the air from the second air supply unit 617 included in the solder ball supply device 601, the solder balls 603 discharged from the solder ball supply device 601 are transferred to the soldering device 602. It can be transferred into the solder accommodating space 683. As a result, it is possible to simplify the configuration necessary for transferring the solder balls.

  The operation of the soldering apparatus 602 having the above configuration will be briefly described. As shown in FIG. 16, the process of supplying the solder ball 603 to the nozzle 673 is substantially the same as the process diagram shown in FIG. 4, although the shape of each element of the solder supply apparatus is different from that in FIG. That is, the process is the same up to the step of discharging the solder balls from the solder supply device. However, the solder balls 603 discharged from the solder ball supply device 601 are transferred into the solder accommodating space 683 of the soldering device 602 through the solder transfer tube 681 (S12 in FIG. 16).

  And finally, it is the block process of the alignment path 609 by the stopper 611 (S8 of FIG. 16). The above process is one process in which one solder ball 603 is supplied from the solder ball supply device 601 to the soldering device 602.

  The fifth embodiment is a modification of the fourth embodiment. That is, the third suction portion is provided in the solder transfer tube. Hereinafter, a different part from Example 4 is demonstrated about Example 5 of the electroconductive supply apparatus of this invention. Therefore, unless otherwise specified, the same configuration and operation as in the fourth embodiment are performed.

  FIG. 17 is a partial cross-sectional view showing a solder ball supply unit and a nozzle. FIG. 18 is a process diagram illustrating a process of the solder ball supply method according to the fifth embodiment.

  A solder transfer tube 781b that connects the solder ball supply device 701 and the soldering device 702 is provided with a solder transfer portion 787 having a substantially rectangular parallelepiped shape. The solder transfer section 787 includes a lower plate transfer block 787a and an upper plate transfer block 787b fixed to the upper surface in the drawing of the lower plate transfer block 787a. On the upper surface of the lower plate transfer block 787a, a groove 787c is formed in the longitudinal direction. Therefore, a solder transfer path 791 is formed by the groove 787c and the lower surface of the upper plate transfer block 787b.

  The upper plate transfer block 787b is composed of a sintered body (porous body). Further, a third suction part 789 is connected to the upper plate transfer block 787b in a substantially vertical direction with respect to the upper surface of the upper plate transfer block 787b in the drawing. Accordingly, the suction force from the third suction part 789 (third suction means) is applied to the solder ball transfer path 791 through the third vent hole which is a fine hole of the upper plate transfer block 781b. The third suction unit 789 is connected to the control unit 721 and is driven when a drive signal from the control unit 721 is received. Therefore, the third suction unit 789 can also be driven at a predetermined drive timing with respect to the drive timings of other air supply units, suction units, stoppers, and the like.

  The operation of the solder ball supply apparatus having the above configuration will be described. The procedure up to the procedure of stopping the first suction unit 741 in the discharging process (S10 in FIG. 18) is the same as that in the fourth embodiment (FIG. 16).

  In the fifth embodiment, the stopper 711 is then opened, the alignment path is opened, and the third suction unit 789 is driven (S13 in FIG. 18). When the third suction unit 789 is driven, a suction force is applied to the solder transfer path 791. The compressed air from the second air supply unit 717 supplementarily applies a biasing force to the solder transfer unit 787 to the solder ball 703 c that moves beyond the stopper 711. That is, the distance between the solder ball supply device 701 and the soldering device 702 is such that the urging force sufficient to transfer the solder ball 703c cannot be obtained only with the compressed air from the second air supply unit 717. Even in such a case, it is possible to supplementarily apply a biasing force including a suction force to the solder ball 703c. As a result, it is possible to prevent the solder ball 703c from stopping in the solder transfer tubes 781a to 781c, and to reliably supply the solder ball 703 into the solder accommodating space 783 of the nozzle 783 (S12 in FIG. 18).

  In the discharging process, after the solder ball 703c passes through the stopper 711, the stopper 711 is closed. Next, after the solder ball reaches the solder accommodating space 783, the second air supply unit 717 is stopped, and the third suction unit 789 is stopped immediately before the solder ball passes through the solder transfer path 791 (S14 in FIG. 18). ).

  The sixth embodiment is a modification of the fifth embodiment, and has a configuration in which a third air supply unit is provided in the solder transfer tube instead of the third suction unit. Hereinafter, a different part from Example 5 is demonstrated about Example 6 of the electroconductive supply apparatus of this invention. Therefore, unless otherwise specified, the same configuration and operation as in the fifth embodiment are performed.

  FIG. 19 is a partial cross-sectional view showing a solder ball supply unit and a nozzle. The solder transfer unit includes a solder transfer tube 881 that connects the solder ball supply device 801 and the soldering device 802, and a solder transfer block 887 that is mounted in the middle of the solder transfer tube 881. The solder transfer block 887 is a through hole penetrating in the longitudinal direction, and a solder transfer path 891 through which the solder ball passes is engraved. Also, both ends of the solder transfer configuration path 891 are connected to the solder transfer tube 881, and the solder transfer tube 881 and the solder transfer configuration path 891 are connected to the solder ball from the solder supply device 801 to the solder accommodating space 883 of the soldering device 802. Configure the transfer path.

  Furthermore, a third air passage 892 is provided in the solder transfer portion 887. The third ventilation path 892 extends while being inclined with respect to the solder transfer configuration path 891, and communicates with the solder transfer configuration path 891 through the third ventilation port 893.

  A third air supply unit 889 (third air supply means) is connected to the third ventilation path 892. The compressed air from the third air supply unit 889 forms a flow in the direction along the air flowing in the direction (arrow 895) in which the solder ball 803 is transferred in the solder transfer path 891. That is, the third air supply unit 889 functions as a means for assisting the urging force from the second air supply unit 817, and therefore the angle formed between the solder transfer configuration path 891 and the third air supply path 893. α is preferably an acute angle.

  As described above, the compressed air from the third air supply unit 889 passes through the third air supply path 892 and is given into the solder transfer configuration path 891 through the third vent 893 of the solder transfer section 887. The The third air supply unit 889 is connected to the control unit 821, and the third air supply unit 889 is driven by a drive signal from the control unit 821. Therefore, the third air supply unit 889 can also be driven at a predetermined drive timing with respect to other air supply units, suction units, stoppers, and the like. Since other configurations are the same as those of the fifth embodiment, details are omitted.

  The operation of the solder ball supply apparatus having the above configuration will be briefly described. What is different from the fifth embodiment is a discharge process. The procedure is the same up to the procedure of stopping the first suction part 841 in the discharging process (see S10 in FIG. 18). Next, the stopper 811 is opened, the alignment path 809 is opened, and the third air supply unit 889 (corresponding to S13 in FIG. 18) is driven. When the third air supply unit 889 is driven, compressed air is supplied into the solder transfer path 891, and an urging force to the soldering device 802 is additionally applied to the solder ball 803c that moves beyond the stopper 811. be able to. That is, by providing the third air supply unit 889, even when it is necessary to increase the distance between the solder ball supply device 801 and the soldering device 802, the solder ball 803c is compressed by compressed air. A biasing force can be applied. As a result, the solder ball 803 can be prevented from stopping in the solder transfer tube 881, and the solder ball 803 can be reliably supplied into the solder accommodating space 883 of the nozzle 873 (see S12 in FIG. 18).

  As described above, if the solder ball 803 can be supplied to at least the solder transfer unit 887 by the compressed air from the second air supply unit 817, the transfer from the solder transfer unit 887 to the soldering device 802 is performed in the third way. This can be performed by compressed air from the air supply unit 889.

  As described above, when the urging force of the compressed air from the second air supply unit 817 is not sufficient, the solder ball 803 is surely soldered by providing the third air supply unit 889 in the middle of the solder transfer tube 881. The device 802 can be supplied.

  In the discharging process, after the solder ball 803c passes through the stopper 811, the stopper 811 is closed and the second air supply unit 817 and the third air supply unit 889 are stopped (corresponding to S14 in FIG. 18). .

  In the seventh embodiment, the second stopper is provided in the fourth embodiment (FIG. 15). Hereinafter, Example 7 will be described with reference to the drawings. FIG. 20 is a partial cross-sectional view showing a solder ball supply unit and a nozzle. FIG. 21 is a process diagram illustrating the process of the solder ball supply method according to the seventh embodiment.

  The second stopper 997 is a solder transfer tube 981 that connects the solder ball supply device 901 and the soldering device 902 and is mounted in the vicinity of the soldering device 902 to open / close the solder transfer tube 981. The second stopper 997 is disposed inside the solder transfer tube 981 (ie, the solder ball is transferred) via the second stopper main body 998 fixed to the solder transfer tube 981 and the stopper hole 998a of the solder transfer tube 981. And a rod-shaped second stopper 999 that opens / blocks the solder transfer tube 981. Further, the second stopper 999 is connected to the second drive unit 994. By the second drive unit 994, the second stopper 999 moves in the direction of the arrow 996 to open or block the inside of the solder transfer tube 981.

  In addition, since the second drive unit 994 is connected to the control unit 921, when the drive signal is received from the control unit 921, the stopper 999 is driven to block / open the inside of the solder transfer tube 981. As described above, since the nozzle driving unit 913, the air supply unit, the suction unit, and the like are connected to the control unit 921, each element can be driven at a predetermined driving timing. Other configurations are the same as those in the fourth embodiment, and thus details are omitted.

  The operation of the solder ball supply apparatus having the above configuration will be described. First, the first stopper 911 and the second stopper 999 are closed (S1 in FIG. 21). In the discharging process for discharging a single solder ball, the first stopper 911 is opened as described in connection with the fourth embodiment (FIG. 16). The solder ball 903c is transferred to the second stopper 999 (S15).

  Next, the first stopper 911 is closed and the second air supply unit 917 is stopped (S16).

  Next, the first air supply unit 919 is driven (S2), and the second stopper 999 is opened (S17). The solder ball 903 d that has reached the second stopper 999 is introduced into the solder accommodating space 983 of the soldering apparatus 902 by compressed air from the first air supply unit 919. Thereafter, the second stopper 999 is closed (S18).

  On the other hand, the solder balls 903 transferred next from the interior space 905 are aligned in the alignment path 909 by the compressed air from the first air supply unit 919 (S3). In the same manner as described above, the air is separated by the air from the second air supply unit (S4) and transferred to the second stopper (S15).

  In this way, the opening of the second stopper 999 and the first air supply unit 919 are synchronized. As a result, the first solder ball 903 that reaches the second stopper 999 can be transferred into the soldering apparatus 902, and the next solder ball in the internal space 903 can be introduced into the alignment path 909. . That is, in the above-described embodiments and examples, the solder balls are transferred by the compressed air from the second air supply unit, but in this example (and Example 9 described later), from the position of the second stopper 999. The solder ball 903d is transferred by compressed air from the first air supply unit 919.

  According to the above configuration, even when the length of the solder transfer tube 981 is increased as compared with the solder ball supply devices of the fourth to sixth embodiments, the solder is accommodated in the solder accommodating space 983 of the nozzle 973 with appropriate timing. Can be introduced.

  The eighth embodiment is a modification of the seventh embodiment. FIG. 22 is a cross-sectional view of a solder system including a solder ball supply device and a soldering device. In the seventh embodiment, the solder ball supply unit and the soldering device are separated from each other, but in the eighth embodiment, the solder ball supply device and the soldering device are integrally formed. Although a mechanism for moving the apparatus having the configuration of the eighth embodiment is not shown, positioning can be performed by providing a drive mechanism similar to that shown in FIG.

  The solder ball supply device 1001 is attached to a side portion of a soldering device 1102 described later. The solder ball supply apparatus 1001 includes an apparatus main body 1002 having a substantially rectangular parallelepiped shape and an end plate 1123 that closes the opening of the apparatus main body 1002. Further, the apparatus main body 1002 includes a storage unit 1004, an alignment unit 1008, and a transfer unit 1081.

  The storage unit 1004 of the apparatus main body 1002 is defined by an end plate 1123 and a recess provided inside the apparatus main body 1002, and includes an internal space 1005 for storing the solder balls 1003. The alignment unit 1008 that is continuous with the storage unit 1004 is provided with an alignment path 1009 that communicates with the internal space 1005. Further, the transfer unit 1081 is continuous to the alignment unit 1008. A transfer path 1091 that communicates with the alignment path 1009 is provided in the transfer unit 1081. Further, the transfer unit 1081 is fixed to the nozzle body 1105. The transfer unit 1081 communicates with the solder accommodating space 1109 of the soldering apparatus 1102. That is, the internal space 1005 communicates with the solder accommodating space 1109. In this embodiment, the alignment path 1009 and the transfer path 1091 extend in a straight line from the internal space 1005 in the short direction of the apparatus main body 1002 and have a diameter slightly larger than that of the solder ball 1003. .

  Further, the end plate 1123 is provided with a first ventilation hole 1124 communicating with the internal space 1005. The first vent 1124 is formed of a porous body made of sintered metal or the like as in the above-described embodiment. For clarity of FIG. 22, the hatching of the end plate 1123 is omitted, and the hatching of the first vent 1124 indicates a porous body (the same applies to FIG. 24 described later).

  Further, the alignment unit 1008 is provided with a second air supply path 1015. The second ventilation path 1015 communicates with the alignment path 1009 via the second ventilation hole 1016.

  In addition, a boundary region between the alignment path 1009 and the transfer path 1091 is provided with a first stopper accommodating path 1029 that communicates with the alignment path 1009 and accommodates the first stopper 1011 in a removable manner. Furthermore, the transfer unit 1081 is provided with a second stopper accommodating path 1121 that communicates with the transfer path 1091 and accommodates the second stopper 1099 in a removable manner. By inserting / removing the first stopper 1011 and the second stopper 1099, the alignment path 1009 and the transfer path 1091 are opened / closed.

  Next, the soldering apparatus 1102 will be described. The soldering apparatus 1102 includes a nozzle 1107 for discharging a solder member and a nozzle body 1105 for holding the nozzle 1107. The nozzle body 1105 has a substantially conical cylinder shape, and has a tapered solder introduction space 1183 inside thereof.

  A solder introduction port 1103 a is provided on the side surface of the nozzle body 1105. The solder introduction port 1103a communicates with the solder transfer path 1091 described above. Therefore, the solder ball 1003 is introduced into the solder introduction space 1183 of the nozzle body 1105 from the solder transfer path 1091 through the solder introduction port 1103a.

  A lid 1110 is mounted on the upper surface of the nozzle body 1105 via an O-ring (not shown). Note that laser light from a laser irradiation unit (not shown) (see 355 in FIG. 7) passes through the lid 1110 and enters the solder introduction space 1183 of the nozzle body 1105. Therefore, the solder introduction space 1183 of the nozzle body 1105 also functions as a laser path.

  The nozzle 1107 fixed to the lower end of the nozzle body 1105 is a tapered cylindrical member, and has a solder accommodating space 1109 inside thereof and communicates with the solder introduction space 1183 of the nozzle body 1105. The lower end of the nozzle 1107 constitutes an opening 1115 for injecting the solder ball 1003 to the outside of the nozzle.

  The inner diameter of the solder accommodating space 1109 and the diameter of the opening 1115 of the nozzle 1107 are at least slightly larger than the outer diameter of the solder ball 1003, and the solder ball 1003 can freely move in the solder accommodating space 1109.

  Further, an L-shaped stopper 1117 for opening and closing the opening 1115 is disposed in the vicinity of the opening 1115. The L-shaped stopper 1117 opens and closes the opening 1115 by moving in the direction of the arrow 1119 (left-right direction) by a known driving means such as a piezo element.

  Needless to say, the distance (L) from the end plate 1124 of the solder ball supply apparatus main body 1002 to the opening 1115 of the nozzle 1107 of the soldering apparatus 1102 can be changed as appropriate.

  Further, similarly to the other embodiments described above, an air supply unit, a suction unit, a control unit, a drive unit and the like are provided.

  Next, a solder supply method in the system configured as described above will be briefly described with reference to the drawings. Accordingly, the eighth embodiment performs the same operation as that of the seventh embodiment. In FIG. 22A, the first solder ball 1003b has already reached the second stopper 1099. That is, it shows a state after the processes from S1 to S16. The first and second stoppers 1029 and 1099 are in a closed state.

  Next, as shown in FIG. 22B, the solder balls 1003 are aligned in a line in the alignment path 1009 (S3) by the compressed air from the first air supply unit 1019 (S2). Further, almost simultaneously with the driving of the first air supply unit 1019, the second stopper 1099 is opened, the transfer path 1091 is opened, and the first solder ball 1003b is introduced into the solder accommodating space 1109 (S17).

  Then, the second air supply unit 1017 is operated to supply the compressed air into the alignment path 1009 via the second air supply path 1015 (S4). As a result, the solder ball 1003b and the other solder balls 1003 are separated.

  Next, the first air supply unit 1019 is stopped and the first suction unit 1041 is operated (S9). As a result, the solder balls 1003 other than the solder ball 1003c are pulled back into the internal space 1005 (FIG. 22C).

  Next, the first suction unit 1041 is stopped (S10), the first stopper 1011 is opened (S7), and the alignment path 1009 is opened. The solder ball 1003c reaches the second stopper 1099 and is locked by the compressed air from the second air supply unit 1017 (S15, FIG. 22D).

  On the other hand, the solder ball 1003b located in the nozzle 1107 is discharged to the outside of the nozzle 1107 when the L-shaped stopper 1117 opens the opening 1115 at a predetermined timing (FIG. 22D). That is, the solder ball 1003b is discharged in a state where the solder ball 1003c is locked to the second stopper 1099.

  Next, the alignment path 1009 is blocked by closing the first stopper 1011 (S16). Further, the opening 1115 is closed by the L-shaped stopper 1117, and the state shown in FIG.

  As described above, when the first solder ball of a plurality of continuous solder balls is discharged, the second solder ball reaches the second stopper 1121. Therefore, as a whole, the time required for one cycle of the solder ball supplying process can be shortened.

  The inventors have found that one cycle of supplying a solder ball to a soldering apparatus using the solder ball supply apparatus having the above configuration is about 400 ms / piece. Accordingly, the time required for the solder ball supplying process can be shortened as compared with the conventional configuration.

  The ninth embodiment is a modification of the eighth embodiment. FIG. 23 is a flowchart, and FIGS. 24A to 24D are cross-sectional views illustrating steps of a solder system including a solder ball supply device, a soldering device, a laser irradiation unit, and a control unit. The solder ball supply device according to the eighth embodiment has a configuration including two stoppers, but the ninth embodiment has a configuration including a single stopper. Although a mechanism for moving the solder system of the ninth embodiment is not shown, positioning can be performed by providing a drive mechanism similar to that shown in FIG.

  The solder ball supply device 2001 is attached to a side portion of a soldering device 2102 to be described later. The solder ball supply device 2001 includes a device main body 2002 having a substantially rectangular parallelepiped shape and an end plate 2123 that closes the opening of the device main body 2002. Furthermore, the apparatus main body 2002 includes a storage unit 2004, an alignment unit 2008, and a transfer unit 2081.

  The storage portion 2004 of the apparatus main body 2002 is defined by an end plate 2123 and a recess provided inside the apparatus main body 2002, and includes an internal space 2005 for storing the solder balls 2003. The alignment unit 2008 that is continuous with the storage unit 2004 is provided with an alignment path 2009 that communicates with the internal space 2005. Further, the transfer unit 2081 is continuous with the alignment unit 2008. In the transfer unit 2081, a transfer path 2091 communicating with the alignment path 2009 is provided. In addition, the transfer unit 2081 is fixed to the nozzle body 2105. The transfer unit 2081 communicates with the solder accommodating space 2109 of the soldering apparatus 2102. That is, the internal space 2005 communicates with the solder accommodating space 2109. In the present embodiment, the alignment path 2009 and the transfer path 2091 extend in a straight line from the internal space 2005 in the short direction of the apparatus main body 2002, and the diameter thereof is slightly larger than that of the solder ball 2003. .

  Further, the end plate 2123 is provided with a first vent 2124 communicating with the internal space 2005. The first vent 2124 is formed of a porous body made of sintered metal or the like as in the above-described embodiment.

  Further, the alignment unit 2008 is provided with a second air supply unit 2017. The second ventilation path 2015 communicates with the alignment path 2009 via the second ventilation port 2016. The ventilation path 2015 extends so as to be substantially orthogonal to the direction extending to the alignment path 2009. The minimum length K between the center line C of the second air passage 2015 having a substantially circular cross section and the line C ′ passing through the end surface 2011a of the stopper 2011 and parallel to the center line C is equal to one solder ball 2003. It is preferable that the length is one to half the diameter (FIG. 24B).

  In addition, a first stopper accommodating path 2029 that communicates with the alignment path 2009 and accommodates the first stopper 2011 in a detachable manner is provided in a boundary region between the alignment path 2009 and the transfer path 2091. By inserting / removing the first stopper 2011, the alignment path 2009 and the transfer path 2091 are opened or blocked.

  Next, the soldering apparatus 2102 will be described. The soldering apparatus 2102 includes a nozzle 2107 for discharging a solder member and a nozzle body 2105 for holding the nozzle 2107. The nozzle body 2105 has a substantially conical cylinder shape, and has a tapered solder introduction space 2183 inside thereof.

  A solder introduction port 2103 a is provided on the side surface of the nozzle body 2105. The solder introduction port 2103a communicates with the solder transfer path 2091 described above. Accordingly, the solder ball 2003 is introduced from the solder transfer path 2091 into the solder introduction space 2183 of the nozzle body 2105 through the solder introduction port 2103a.

  A lid 2110 is attached to the upper surface of the nozzle body 2105 via an O-ring (not shown). Note that a laser irradiation unit 2355 is attached to the lid 2110, and laser light passes through the lid 2110 and enters the solder introduction space 2183 of the nozzle body 2105. Therefore, the solder introduction space 2183 of the nozzle body 2105 also functions as a laser path.

  The nozzle 2107 fixed to the lower end of the nozzle body 2105 is a tapered cylindrical member, and includes a solder accommodating space 2109 therein. The solder housing space 2109 communicates with the solder introduction space 2183 of the nozzle body 2105. The lower end of the nozzle 2107 constitutes an opening 2115 for injecting the solder ball 2003 to the outside of the nozzle.

  The inner diameter of the solder accommodating space 2109 of the nozzle 2107 and the diameter of the opening 2115 are at least slightly larger than the outer diameter of the solder ball 2003, and the solder ball 2003 can freely move in the solder accommodating space 2109.

  Further, an L-shaped stopper 2117 for opening and closing the opening 2115 is disposed in the vicinity of the opening 2115. The L-shaped stopper 2117 opens and closes the opening 2115 by moving in the direction of arrow 2119 (left-right direction) by a driving means such as a known piezo element.

  Needless to say, the distance (L) from the end plate 2124 of the solder ball supply apparatus body 2002 to the opening 2115 of the nozzle 2107 of the soldering apparatus 2102 can be changed as appropriate.

  Further, similarly to the other embodiments described above, air supply units 2019 and 2017, a suction unit 2041, a control unit 2121 and a drive unit 2013 are provided.

  Next, a solder supply method in the solder system having the above configuration will be briefly described with reference to the drawings. Accordingly, the ninth embodiment performs the same operation as that of the eighth embodiment. In FIG. 24A, the first solder ball 2003 b has already reached the solder accommodating space 2109 and is supported by the L-shaped stopper 2117. That is, it shows a state after the processes from S1 to S8. The stopper 2011 is in a closed state (S1).

  Next, as shown in FIG. 24B, the solder balls 2003 are aligned in a line in the alignment path 2009 by the compressed air from the first air supply unit 2019 (S2) (S3).

  And the 2nd air supply part 2017 is operated, and compressed air is supplied in the alignment path 2009 via the 2nd air supply path 2015 (S4). As a result, air is supplied from the second air supply unit 2017 between the solder ball 2003 c and the other solder balls 2003. When the second air supply unit 2017 is driven, the L-shaped stopper 2117 is also opened, and the first solder ball 2003b in the solder accommodating space 2109 is discharged to the outside of the nozzle 2107. The L-shaped stopper 2117 immediately closes the opening 2115 after discharging the solder balls 2003b.

  Next to S4, the first air supply unit 2019 is stopped and the first suction unit 2041 is operated (S9). As a result, the solder balls 2003 other than the solder ball 2003c are pulled back into the internal space 2005 (FIG. 24C).

  Next, the first suction unit 2041 is stopped (S10), the first stopper 2011 is opened (S7), and the alignment path 2009 is opened. The solder ball 2003c is introduced into the solder accommodating space 2109 by the compressed air from the second air supply unit 2017 (S8, FIG. 24D).

  Next, by closing the stopper 2011, the alignment path 2009 is blocked (S8), and the state shown in FIG.

  As described above, when the first of the plurality of solder balls is discharged, the second solder ball reaches the stopper 2011. Therefore, compared with Example 8, as a whole, the time required for one cycle of the solder ball supplying process can be shortened.

  In addition, although the structure of Embodiment 2 shown in FIG. 3 was applied to the solder ball supply apparatuses of Examples 4 to 9, it goes without saying that the structure of Embodiment 1 or 3 can be applied.

In the present embodiment and examples, a pressure source that applies a known pressurized gas can be used as the air supply unit, and a vacuum source that can suck air can be used as the suction unit. It is also possible to use a pressure source that can be switched between a positive pressure and a negative pressure that serve both as an air supply unit and a suction unit.
Further, in the above-described embodiment and examples, compressed air is supplied to the solder balls aligned in the alignment path from the direction substantially orthogonal through the vents, and a single solder ball and other solder balls are supplied. However, the alignment path and the ventilation path are not necessarily orthogonal to each other. Any configuration may be used as long as the compressed air can be supplied from a direction having an inclination angle with respect to the alignment path so that the solder balls can be separated from each other.

  The shape, position, etc. of the stopper are not limited to the shapes of the above-described embodiment and examples.

  The present invention can be embodied in many forms without departing from its essential characteristics. Therefore, it is needless to say that the above-described embodiments are exclusively explanatory and do not limit the present invention.

(A)-(E) are the partial cross sections which show the solder ball supply apparatus by the 1st Embodiment of this invention for every process. It is process drawing which shows the process of supplying the solder ball of 1st Embodiment. It is a partial cross section figure which shows the solder ball supply apparatus of the 2nd Embodiment of this invention. It is process drawing which shows the process of supplying the solder ball of 2nd Embodiment. It is a partial cross section figure which shows the solder ball supply apparatus of 3rd Embodiment. It is process drawing which shows the process of supplying the solder ball of 3rd Embodiment. 1 is a schematic diagram of a soldering apparatus of Example 1. FIG. It is the fragmentary sectional view which showed the solder ball supply part and the nozzle. It is an enlarged view of the IX part of FIG. FIG. 6 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle according to a second embodiment. It is an enlarged view of the XI part of FIG. FIG. 6 is a cross-sectional view of a main part of a solder ball supply device of Example 3. 12 is a timing chart of a first operation pattern according to the third embodiment. 12 is a timing chart of a second operation pattern according to the third embodiment. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle according to a fourth embodiment. 10 is a process diagram illustrating a process of supplying solder balls in Example 4. FIG. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle of Example 5. FIG. 10 is a process diagram illustrating a process of supplying solder balls in Example 5. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle of Example 6. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle of Example 7. FIG. 10 is a process diagram illustrating a process of supplying solder balls in Example 7. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle according to an eighth embodiment. FIG. 10 is a process diagram illustrating a process of supplying solder balls in Example 9. FIG. 10 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle of Example 9. It is a fragmentary sectional view of the conventional soldering apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder ball supply apparatus 3 Solder ball 5 Internal space 9 Alignment path 11 Stopper 13 Drive part 15 Second vent 17 Second air supply part 19 First air supply part 21 Control part 681 Transfer part 789 Third suction Portion 791 Transfer path 889 Third air supply portion 999, 1121 Second stopper

Claims (10)

A conductive member supply device for supplying conductive members one by one to a joining device having a nozzle,
A storage section having an internal space in which the conductive member is stored, and a first vent communicating with the internal space;
An aligning portion having an alignment path that aligns the conductive members in a line and communicates with the internal space; and a second vent that communicates with the alignment path;
A first stopper for blocking / opening the alignment path;
First air supply means for supplying air from the first vent to the alignment path through the internal space;
A conductive member transfer section having a transfer path that communicates the inside of the nozzle of the joining apparatus and the alignment path of the alignment section;
Second air supply means for supplying air into the alignment path from the second vent;
With the stopper closed, the first air supply means is operated to supply air, whereby the conductive member is introduced into the alignment path, and the second air supply means is operated to operate the alignment. Control means for controlling to supply air to the road,
The minimum length in the alignment direction between the center line of the second vent hole and the line passing through the first stopper lower end and parallel to the center line is one to one half of the conductive member. Equal to the dimension,
The conductive member supply device in which the conductive member in the alignment path is supplied to the inside of the nozzle through the transfer path by the air from the first air supply unit or the second air supply unit.   By supplying air into the alignment path from the second ventilation port by the second air supply means, among the conductive members aligned in a single row, the first column in contact with the first stopper is arranged. The conductive member supply apparatus according to claim 1, wherein the first conductive member and the second conductive member connected to the first conductive member are separated from each other.   Further, the transfer unit has a third vent communicating with the transfer path, and has a third air supply means or a suction force for supplying air to the transfer path via the third vent. The electroconductive member supply apparatus of Claim 1 or 2 provided with the 3rd suction means to provide.   Furthermore, the said electroconductive member supply part is a electroconductive member supply apparatus as described in any one of Claims 1-3 which has a 2nd stopper for opening / blocking the said transfer path. A conductive member supply method for supplying the conductive members stored in the internal space of the storage portion one by one from the alignment path of the alignment portion communicating with the internal space into the nozzle of the joining device,
In a state where the alignment path is blocked by the first stopper, air is supplied to the conductive member stored in the internal space from the first vent hole communicating with the internal space, and Aligning the conductive members in a line in the alignment path;
A separation step of separating one conductive member by supplying air from the second vent communicating with the alignment path to the conductive members aligned in the alignment step;
By opening the first stopper and supplying air from the second vent hole, the one piece is inserted into the nozzle of the joining apparatus via the alignment path and the transfer path of the transfer section communicating with the alignment path. A supply step of supplying a conductive member,
The minimum length in the direction in which the conductive members are aligned between the center line of the second vent and the line passing through the lower end of the first stopper and parallel to the center line is one conductive member. The size is from one minute to one and a half.
Conductive member supply method.   The conductive member supply method according to claim 5, wherein the supplying step includes a step of applying a suction force into the transfer path from a third vent communicating with the transfer path.   Further, the supplying step includes a step of locking the one conductive member by a second stopper provided in the transfer path, and the second stopper is provided by a suction force applied from the third vent hole. The conductive member supply method according to claim 6, wherein the conductive member is transferred.   The conductive member supplying method according to claim 5, wherein the supplying step includes a step of supplying air into the transfer path from a third vent communicating with the transfer path.   Further, the supplying step includes a step of locking the one conductive member by a second stopper provided in the transfer path, and the air is supplied from the third vent to the second stopper. The conductive member supply method according to claim 8, wherein the conductive member is transferred.   The supplying step includes a step of locking the one conductive member by a second stopper provided in the transfer path, and the conductive material is supplied to the second stopper by air supplied from the second vent hole. 6. The conductive member supply method according to claim 5, wherein the member is transferred.

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