JP4313390B2 - Conductive member supply apparatus and conductive member supply method - Google Patents

Description

  The present invention relates to a conductive member supply device and a conductive member supply method for supplying minute conductive members, which are used for electrical bonding between electrodes of minute electronic components, one by one.

  In the manufacturing process of a magnetic head or the like, the electrode of the magnetic head slider and the electrode of the flexure are joined by soldering using solder balls. Specifically, both electrodes are disposed at an angle of 90 degrees, a small conductive member is disposed between these electrodes, and the conductive member is melted by heat rays or the like to electrically connect the electrodes. Joint. Below, the conventional soldering apparatus provided with an electroconductive member supply apparatus is demonstrated with reference to drawings.

  FIG. 15 is a partial cross-sectional view of a conventional soldering apparatus 501. The soldering apparatus 501 holds an optical system 503 such as a laser oscillator for melting the solder balls 515, a solder ball supply unit 505 for supplying the solder balls 515 individually, and a solid solder ball 515. Nozzle tip 507 and a gas supply unit 511 for supplying nitrogen gas into the nozzle tip 507.

  Here, the solder ball supply unit 505 includes a rotatable disk-shaped solder ball moving plate 513. A plurality of ball storage holes 517 are provided on the outer peripheral portion of the solder ball moving board 513, and each ball storage hole 517 stores one solder ball 515. When the ball storage hole 517 coincides with a hole (not shown) provided at the bottom of the ball storage unit 519, one solder ball 515 is stored in the ball storage hole 517 from the ball storage unit 519.

  When the solder ball moving board 513 rotates and the ball storage hole 517 coincides with the ventilation path 521, the solder ball falls to the tip 507 via the ventilation path 521, and the solder ball 515 is held near the opening 509 of the tip 507. Is done.

  The solder ball 515 held in the vicinity of the opening 509 of the front end 507 is irradiated with the laser of the optical system 503 to melt the solder ball 515, and the electrode 525 of the magnetic head slider 523 and the electrode 529 of the flexure 527 Soldering is performed between them (see Patent Document 1). Further, Patent Document 2 discloses a configuration in which one solder ball is mechanically supplied from a plurality of solder balls accommodated in a storage unit, like the solder ball moving board of FIG.

Japanese Patent Application No. 2002-170351 (paragraph numbers [0116] to [0125], FIG. 20 etc.) Japanese Patent Application No. 2005-079492

  In the soldering apparatus 501 of Patent Document 1, a solder ball moving plate 513 is used to separate one solder ball from a plurality of solder balls 515 stored in the solder ball storage unit 519 and convey the solder ball to the front end portion 507. Is used. However, with recent miniaturization of electronic components, the size of the conductive member for connecting the electrodes has also become very small. Therefore, it is becoming difficult to mechanically separate and transport one solder ball like the solder ball moving board 513. For example, there is a possibility that the solder ball 515 is clogged in the movable clearance between the solder ball moving board 513 and the solder ball apparatus main body to which the solder ball moving board 513 is mounted, or the solder ball is deformed or damaged.

  Furthermore, if the solder ball storage hole 517 of the solder ball moving board 513 is formed with high dimensional accuracy so as to reliably receive only one solder ball, the manufacturing cost of the device itself may increase.

  Accordingly, the present invention provides a conductive member supply device and a conductive member supply capable of reliably supplying a single minute conductive member used for a minute electronic component to the next step with a simple configuration. It aims to provide a method.

In order to solve the above-described problem, a first aspect of the conductive member supply device of the present invention is a storage having an internal space in which the conductive member is stored and a first vent hole communicating with the internal space. An alignment portion having a portion, a conductive member aligned in a line, an alignment path communicating with the internal space, and a second vent opening communicating with the alignment path, and blocking / opening the alignment path A stopper, a first air supply means for supplying air to the alignment path from the first vent through the internal space, and an air is always supplied into the alignment path from the second vent. The conductive member is introduced into the alignment path by operating the first air supply means and supplying air in a state where the alignment path is blocked by the stopper and the second air supply means. Control means for controlling the second ventilation From the center, distance L in a direction the alignment to the contact portion of the stopper which the conductive member contacts, when the diameter of one fraction of the conductive member and D D ≦ L ≦ 1.5 × D of
Holds.

According to the second aspect of the conductive member supply device of the present invention, the supply of air from the first vent is stopped, and the alignment from the second vent by the second air supply means. By supplying air into the path, among the conductive members arranged in a row, the first conductive member at the head of the row in contact with the stopper, and the second conductive member connected to the first conductive member, Separate them.

  Furthermore, according to the 3rd aspect of the electroconductive member supply device of this invention, the 1st suction means which provides a suction force to the said interior space via the 1st vent provided in the said storage part is further provided. Prepare.

  According to the 4th aspect of the electroconductive member supply apparatus of this invention, the 2nd suction means which vacuum-sucks the said electroconductive member in the said alignment path is further provided.

  Moreover, according to the 5th aspect of the electroconductive member supply apparatus of this invention, the said stopper and the said alignment path are nozzles which adsorb | suck a electroconductive member.

In order to solve the above-described problem, the first aspect of the conductive member supply method of the present invention is to provide one conductive member stored in the internal space of the storage portion from the alignment path of the alignment portion communicating with the internal space. A method of supplying conductive members one by one, wherein the conductive member in a direction in which the conductive members are aligned from a blocking step of blocking the alignment path by a stopper and a contact portion of the stopper that contacts the conductive member From the second ventilation port provided in the alignment path in communication with the second ventilation path having a center line at a distance of not less than one piece and not more than 1.5 pieces in diameter, After the air supply step of constantly supplying air, the blocking step, and the air supply step, the conductive member stored in the internal space is aired from the first vent that communicates with the internal space. Supplying the alignment portion of the Aligning said conductive members in the column path in a row, by the first stops supplying the air from the vent, and the air being supplied from the second vent, in the alignment path An alignment separation step of separating adjacent conductive members from each other; and a step of opening the stopper and discharging the one conductive member after the alignment separation step. In the alignment separation step and the discharge step, air is constantly supplied from the second vent into the alignment path.

  Furthermore, according to the second aspect of the conductive member supply method of the present invention, the alignment / separating step includes a step of performing vacuum suction from a first vent communicating with the internal space.

  According to a third aspect of the conductive member supply method of the present invention, the alignment separation step includes a step of vacuum-sucking the conductive member into the alignment path.

  As the air supplied by the air supply means, it is desirable to use a nitrogen mixed gas or the like for the purpose of preventing oxidation of the conductive member.

  Furthermore, in this specification, a conductive member means a member that can electrically connect members to be joined, such as a metal material or an alloy such as solder or gold. The shape of the conductive member is not limited to a spherical shape, but includes a cubic shape, a cone shape, and the like.

  Since one conductive member is separated and transported from the aligned conductive members using air, the conductive member can be prevented from being deformed or damaged. As a result, one conductive member can be reliably and easily supplied to the next step regardless of the size of the conductive member. Further, since air for separating one conductive member from the aligned conductive members is always supplied, a conductive member supply device or a conductive member that can control only air for aligning the conductive members It becomes a supply method and the structure can be simplified.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments and examples of a conductive member supply apparatus and a conductive member supply method according to the present invention will be described with reference to the drawings. In the drawings, the same parts are denoted by the same reference numerals.

(Embodiment 1)
The first embodiment is an example in which the conductive member supply device is applied to a solder ball supply device. FIG. 1A to FIG. 1E are partial cross-sectional views illustrating a process of separating and supplying one solder ball from another solder ball according to the first embodiment of the present invention. . In addition, from the viewpoint of clarifying the drawing, the components of the solder ball supply device are described only in FIG. 1A, and are omitted in FIGS. 1B to 1E. FIG. 2 is a diagram illustrating a process of a solder ball supply method using the solder ball supply apparatus of FIG.

  As shown in FIG. 1A, a solder ball supply device 1 includes a storage unit 4 that accommodates a solder ball 3 that is a spherical conductive member, an alignment path 9 that communicates with an internal space 5, and an alignment unit 8. A first air supply section for supplying air to a first vent (first vent path) formed by the main body 7, a stopper 11 for opening and closing the alignment path 9, and a bottom block 23 described later. 19 (first air supply means) and a second air supply portion 17 (second air supply) that is provided in the apparatus main body 7 and constantly supplies air into a second vent 15 communicating with the alignment path 9. Means) and a control unit 21 (control means) for driving the first air supply unit 19 and the second air supply unit 17 at a predetermined timing. Furthermore, in this embodiment, although not an essential element of the present invention, a drive unit 13 for driving a stopper 11 that opens or blocks the alignment path 9 is provided, and the drive unit 13 causes the stopper 11 to be driven by a command from the control unit 21. It is a configuration that operates.

  Below, the detail of each element of the solder ball supply apparatus 1 is demonstrated. The storage part 4 is a lower part of the substantially cylindrical apparatus main body 7, and the solder balls 3 are stored in an internal space 5 defined by the inner peripheral surface thereof. The alignment unit 8 is an upper part of the apparatus main body 7, is defined by an inner peripheral surface thereof, and has an alignment path 9 that communicates with the internal space 5.

  The inner diameter of the internal space 5 of the storage part 4 is larger than the inner diameter of the alignment path 9 of the alignment part 8, and the internal space 5 and the alignment path 9 are connected by a taper part 25. The other end of the alignment path 9 constitutes an outlet 27 to the outside of the apparatus body 7. The inner diameter of the alignment path 9 is slightly larger than the outer diameter of the solder ball 3. Accordingly, when a plurality of solder balls 3 enter the alignment path 9, the solder balls 3 are aligned in a line along the longitudinal direction (hereinafter also referred to as an alignment direction in which the solder balls are aligned). In this embodiment, when the stopper 11 is shut off, the solder balls (3a, 3b) can be arranged in a line in the alignment path 9.

  Further, a hole, that is, a stopper accommodating path 29 is formed in a substantially vertical direction of the alignment path 9 of the apparatus main body 7. The stopper 11 is accommodated in the stopper accommodating passage 29, and the stopper 11 slides. One end of the stopper accommodating path 29 communicates with the alignment path 9, and the other end forms an opening communicating with the outside of the apparatus.

  Further, a second vent 15 is provided in the alignment path 9 below the stopper accommodating path 29 of the apparatus main body 7 in the alignment direction. The second vent hole 15 is provided with a second vent path 16 extending to the alignment path 9. One end of the second vent path 16 communicates with the alignment path 9, and the other end is the apparatus body 7. Configure the opening to the outside.

  The stopper housing hole 29 of the apparatus main body 7 houses a rod-shaped stopper 11 that is slidably dimensioned therein. The tip 11 a of the stopper 11 enters the alignment path 9 and blocks the alignment path 9. In addition, what is necessary is just to satisfy the dimensional relationship which can interrupt | block the movement of the solder ball 3 in the interruption | blocking position (refer FIG. 1 (A), (B)) where the front-end | tip part 11a interrupts the alignment path 9. FIG. In this embodiment, since the cross section of the alignment path 9 is substantially circular, air passes through the alignment path 9 even when the stopper 11 protrudes into the alignment path 9 and the alignment path 9 is blocked. Can do.

  Further, the stopper 11 is connected to a driving unit 13 such as a known motor or a piezoelectric actuator that drives the stopper 11. The stopper 11 is moved in the left-right direction in FIG. 1 by the drive unit 13 to block / open the alignment path 9.

Further, a stopper that contacts the solder ball 3 from the center line of the second air passage 16 (a line extending in a direction substantially perpendicular to the direction in which the alignment passage 9 extends and passing through the center of the second air vent). 11 when the distance to the contact portion 11a is L and the outer diameter of the solder ball 3 is D,
D ≦ L ≦ 1.5xD
It is preferable to dimension so as to satisfy the relationship.

  A second air supply unit 17 that supplies compressed air is connected to the second air ventilation path 16.

  Further, the bottom block 23 attached to the lower end of the apparatus main body in FIG. 1 is formed of a porous body made of sintered metal or the like. The fine through holes of the porous body constitute the first air passage. A first air supply unit 19 is connected to the bottom block 23. Accordingly, the air from the first air supply unit 19 is supplied into the internal space 5 through the bottom block 23.

  Furthermore, the solder ball supply device 1 includes a control unit 21. The control unit 21 is connected to the drive unit 13, the first air supply unit 19, and the second air supply unit 17. A drive signal from the control unit 21 is applied to the drive unit 13, the second air supply unit 17, and the first air supply unit 19, and each can be driven at a predetermined operation timing.

  The operation of the solder ball supply device having the above configuration will be described below. First, a plurality of solder balls 3 are loaded into the internal space 5 of the solder ball supply apparatus 1 from a solder ball loading hole (not shown) (see member 314 in FIG. 8) (FIG. 1A). The stopper 11 is in a state where the alignment path 9 is blocked (S1 in FIG. 2).

  Next, the second air supply unit 17 that has received the drive signal from the control unit 21 is driven (S2 in FIG. 2), and the air 31 passes from the second vent 15 into the alignment path 9 in a direction crossing it. Supplied. The air 31 from the second air supply unit 17 collides with a wall in the alignment path, and the air 33 flowing upward in FIG. 1C and the air 35 flowing downward in FIG. Branch to

  The supply of the air 31 from the second air supply unit 17 is maintained until the end of a series of steps for supplying the solder balls, as will be described later. Further, the timing at which the stopper 11 cuts off the alignment path 9 and the timing at which the second air supply unit 17 is driven do not matter. At least, the stopper 11 can be closed and the second air supply unit 17 can be driven before the start of the alignment / separation process described later. The same applies to other embodiments and examples.

  Next, the solder balls are aligned and separated. The first air supply unit 19 that has received the drive signal from the control unit 21 is driven to supply air into the internal space 5 through the bottom block 23 (S3 in FIG. 2). The air flows upward from the bottom block 23, and the solder ball 3 floats upward and is guided into the alignment path 9. The solder balls 3 guided into the alignment path 9 are locked by the stopper 11 and aligned in the alignment path 9 (FIG. 1B, S4 in FIG. 2). The solder ball 3 in the internal space 5 can be efficiently guided into the alignment path 9 by the taper portion 25 provided between the internal space 5 and the alignment path 9.

  Further, the driving of the first air supply unit 19 is stopped by a signal from the control unit 21 (S5 in FIG. 2), and the supply of air from the bottom block 23 side is stopped. Since air from the second air supply unit 17 is constantly supplied, the air 31 is supplied from the second vent 15 into the alignment path 9 when the solder ball enters the alignment path 9. . The air 31 separates the solder balls 3a and 3b adjacent in the alignment path 9 from each other. That is, the first solder ball 3a at the head of the row in contact with the stopper 11 is separated from the second solder ball connected thereto. Further, the upper solder balls 3 a of the adjacent solder balls 3 are maintained in contact with the stopper 11 by the upward air 33. On the other hand, the lower solder ball 3 b is returned into the internal space 5 by the downward air 35. As a result, a single solder ball 3 a is separated and held in the alignment path 9. As described above, in the alignment / separation process, the solder balls contacting the stopper are separated from the other solder balls almost simultaneously with stopping the supply of air from the first air supply unit 19.

  Next, as shown in FIG. 1D, the stopper is opened and the solder balls are discharged. In this step, by applying a drive signal from the control unit 21 to the drive unit 13, the stopper 11 is moved to the right (arrow 37) in FIG. 1D and the alignment path 9 is opened (S7 in FIG. 2). ). At this time, the solder balls 3a are moved in the direction of the discharge port 27 of the alignment path 9 by the upward air 33 in the alignment path 9 and conveyed to the next step. On the other hand, since the solder balls in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air 35 flowing in the alignment path 9, the solder balls are supplied through the alignment path 9. There is no accidental discharge to the outside of the device 1.

  Next is a step of closing the stopper shown in FIG. A drive signal from the control unit 21 is applied to the drive unit 13, the stopper 11 is moved in the left direction (arrow 39), and the alignment path 9 is blocked (S8 in FIG. 2). Then, the solder balls are supplied to a predetermined number of solder balls 3 by repeating again from the step S3 in order. After repeating the above steps and supplying a predetermined number of solder balls, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 21 and the supply of air is stopped (S9 in FIG. 2).

(Embodiment 2)
The second embodiment of the conductive member supply device of the present invention is a configuration of a solder ball supply device in which a suction part (suction means) is further provided in the solder ball supply device of the first embodiment. FIG. 3 is a partial cross-sectional view of the solder ball supply apparatus 101 according to the second embodiment. FIG. 4 is a process diagram showing a process of supplying solder balls using the solder ball supply apparatus of FIG. Since the configuration of the solder ball supply device 101 is similar to that of the solder ball supply device 1 of FIG. 1, only different parts will be described. Therefore, the parts that are not particularly described have the same configuration as that of the first embodiment.

  In the present embodiment, the first suction part 41 is connected to the bottom block 23 of the apparatus body 7. The first suction part 41 having a suction source (not shown) is for applying a suction force to the internal space 5 through the bottom block 23. The first suction unit 41 is connected to the control unit 121, and when receiving a drive signal from the control unit 121, the first suction unit 41 operates to apply a suction force to the internal space 5. It has become.

  The control unit 121 is also connected to the first and second air supply units 17 and 19 and the drive unit 13 in the same manner as the control unit 21 of the conductive member supply device 1 of FIG. Therefore, each element can be driven at a predetermined operation timing.

  Next, the operation of the solder ball supply device 101 of the second embodiment will be described. 1A and 1B of the first embodiment, a solder ball loading process and a process of supplying air from the second air supply unit are performed (S1 to S3 in FIG. 4).

  The first air supply unit 19 is stopped, and the air supply to the internal space 5 is stopped. As shown in FIG. 3, the next solder ball alignment / separation step is different from that of the first embodiment. The first air supply unit 19 is stopped via the control unit 121 (S10 in FIG. 4), and the first suction unit 41 is operated to apply a suction force to the internal space 5 (S10 in FIG. 4). ). With this configuration, the air 31 is branched into the downward air 35 and the upward air 33 in the alignment path 9, and an air flow 43 is formed by the suction force of the first suction part 41. The Accordingly, the solder ball 3b is returned to the internal space 5, while one solder ball 3a is separated and held in the alignment path 9. According to this configuration, compared with the first embodiment, the airflow 43 in the internal space 5 is reliably formed, and the solder ball separation process can be speeded up.

  Next is a step of discharging the solder balls (see FIG. 1D). In this step, the operation of the first suction unit 41 is stopped (S11 in FIG. 4). Then, the stopper 11 is moved rightward (S12 in FIG. 4), and the alignment path 9 is opened (see FIG. 1 (D)). At this time, since the supply of the air 31 from the second air supply unit 17 is maintained, the solder ball 3 a is moved in the direction of the discharge port 27 of the alignment path 9 by the upward air 33 in the alignment path 9. It moves and is transported to the next process. On the other hand, since the solder balls 3 in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air 35 flowing in the alignment path 9, the solder balls 3 move along the alignment path 9. As a result, the solder ball supply device 1 is not accidentally discharged to the outside.

  Next to the discharging step is a blocking step with a stopper (see FIG. 1E). A drive signal from the control unit 121 is applied to the drive unit 13, the stopper 11 is moved leftward, and the alignment path 9 is blocked (S8 in FIG. 4). After supplying the predetermined number of solder balls by repeating the above steps, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 121 and the supply of air is stopped (S9 in FIG. 2).

(Embodiment 3)
The third embodiment of the conductive member supply device of the present invention is a configuration of a solder ball supply device in which another solder part (suction means) is provided in the solder ball supply device 101 of the second embodiment. FIG. 5 is a partial cross-sectional view of a solder ball supply apparatus 201 according to the third embodiment. FIG. 6 is a process diagram of a solder ball supplying method using the solder ball supplying apparatus of FIG. Since the configuration of the solder ball supply device 201 is similar to that of the solder ball supply device 101 of FIG. 3, only different parts will be described. Therefore, the parts that are not particularly described have the same configuration as that of the second embodiment.

  In the present embodiment, the second suction part 45 is newly connected to the discharge port 27 of the alignment path 9 of the apparatus main body 7. The second suction part 45 is for applying a suction force in the alignment path 9. Further, the second suction unit 45 is connected to the control unit 221, and receives the drive signal from the control unit 221, so that the second suction unit 45 is activated and applies a suction force to the alignment path 9. is there.

  Further, like the control unit 121 of the conductive member supply device 101 of FIG. 3, the control unit 221 of the conductive member supply device 201 in the third embodiment includes the first and second air supply units 17, 19, 1 suction unit 41 and drive unit 13. Therefore, each element can be driven at a predetermined timing.

  Next, the operation of the solder ball supply device 201 of the third embodiment will be described. As in FIG. 1A of the first embodiment, first, solder balls are loaded in a state where the alignment path 9 is blocked by the stopper 11 (S1 in FIG. 6). Next, the second air supply unit 17 that has received the drive signal from the control unit 21 is driven (S2 in FIG. 6), and air is supplied from the second vent 15 into the alignment path 9. The air branches into air flowing upward in FIG. 5 and air flowing downward in the alignment path 9.

  The next solder ball alignment / separation step is different from the first and second embodiments as shown in FIG. The first air supply unit 19 and the second suction unit 45 are actuated by a drive signal from the control unit 221 (S13 in FIG. 6). Inside the solder ball device 201, an air flow 51 to the outside of the solder ball device 201 is formed through the bottom block 23, the internal space 5, the alignment path 9, and the discharge port 27. Further, since the suction force is applied to the alignment path 9 by the second suction part 45, the formation of the air flow 51 that passes through the internal space 5 and reaches the alignment path 9 is assisted, and the suction force to the solder balls is increased. Can be increased. Thus, the solder balls 3 are aligned in the alignment path 9 by the first air supply unit 19 and the second suction unit 45 (S4 in FIG. 6). Therefore, the solder ball 3 can be quickly and reliably moved into the alignment path 9. Further, according to this configuration, the solder balls can be introduced into the alignment path 9 more quickly than in the first and second embodiments that do not use the second suction part 45.

  Further, in the solder ball alignment / separation step, the operation of the second suction unit 45 is stopped (S14 in FIG. 6). Then, as in the second embodiment, the control unit 221 stops the first air supply unit 19 and activates the first suction unit 41 (S10 in FIG. 6). A suction force is applied in the space 5. With this configuration, the air flow (refer to reference numeral 31 in FIG. 3) is divided into the air flow (refer to reference numeral 35 in FIG. 3) and the air flow (refer to reference numeral 35 in FIG. 3) and the air flow (refer to reference numeral 35 in FIG. 3). The solder ball 3 excluding the solder ball 3a is returned into the internal space 5. As a result, a single solder ball 3 a is separated and held in the alignment path 9.

  The next step is to open the stopper and discharge the solder ball (see FIG. 1D). In this step, the operation of the first suction unit 41 is stopped (S11 in FIG. 6), and suction from the bottom block 23 side is stopped. Further, by applying a drive signal from the control unit 221 to the drive unit 13, the stopper 11 is moved to the right, and the alignment path 9 is opened (shown by a broken line in FIG. 5). At this time, by the upward air in the alignment path 9 (see reference numeral 33 in FIG. 3), the solder balls 3a move toward the discharge port 27 of the alignment path 9 and are discharged to the next process (FIG. 6). S12). On the other hand, the solder balls in the internal space 5 including the solder balls 3b are held in the internal space 5 by the downward air flowing in the alignment path 9 (see reference numeral 35 in FIG. 3). 9 is not accidentally discharged to the outside of the solder ball supply device 1.

  After the discharging process, a blocking process using a stopper (see FIG. 1D). A drive signal from the control unit 221 is applied to the drive unit 13, the stopper 11 is moved leftward, and the alignment path 9 is blocked (S8 in FIG. 6). After supplying the predetermined number of solder balls by repeating the above steps, the operation of the second air supply unit 17 is stopped by the stop signal from the control unit 21 and the supply of air is stopped (S9 in FIG. 2).

  In the second embodiment, the first suction unit is configured to apply a suction force through the first vent. However, the suction port is configured to correspond to the first suction unit. Needless to say.

  Below, the Example which applied the electroconductive member supply apparatus of this invention to the soldering apparatus is described. 7 is a schematic diagram of a soldering apparatus, FIG. 8 is a partial cross-sectional view showing a solder ball supply unit and a nozzle, and FIG. 9 is an enlarged view of a part IX in FIG.

  The soldering apparatus 351 includes a gantry 353, a laser irradiation unit 355 for melting a spherical solder ball, an adsorption unit 357 for attracting and holding the solder ball, and a gantry 353, which are disposed on the work surface 353a of the gantry 353. An x-axis direction moving stage 365 that can move in the x-direction and a y-axis direction moving stage 361 that can move in the y-axis direction, and a work 359 that is fixed to the upper surface of the x-axis direction moving stage 365 are disposed on the work surface 353a. A work tray 367 to be conveyed and a z-axis direction moving stage 363 that is fixed on the y-axis direction moving stage 361 and can move in the z-axis direction.

  The suction unit 357 is fixed to the z-axis direction moving stage 363 via the arm 369, and the nozzle arm 369 moves in the vertical direction in FIG. Similarly to the suction unit 357, the laser irradiation unit 355 is also connected to the z-axis direction moving stage 363 via the irradiation unit support member 371. Therefore, the adsorption part 357 and the laser irradiation part 355 are movable in the vertical direction of FIG.

  Further, since the z-axis direction moving stage 363 is fixed to the y-axis direction moving stage 361, the z-axis direction moving stage 363 can move in the y-axis direction (left and right direction in FIG. 7), and the laser irradiation unit 355. And the adsorption | suction part 357 can move to a y-axis direction.

  On the other hand, the laser irradiation unit 355 and the suction unit 357 are moved in the x-axis direction (the front and back direction in FIG. 7) by moving the work tray 367 fixed to the x-axis direction stage 365.

  The work placement surface 369 of the work tray 367 is inclined with respect to the vertical direction, the work 359 is placed on the placement surface 369, and the electrodes are joined. In this embodiment, the work 359 is an electronic component used for a hard disk, and more specifically, a flexure 372 on which a magnetic head slider 370 is mounted. The magnetic head slider electrode and the flexure electrode are joined by soldering using solder balls. Here, both electrodes are arranged with an angle of 90 degrees, solder balls are arranged at the corners formed by these electrodes, and the balls are melted by heat rays or the like to make electrical connection between these electrodes. Is called.

  The solder ball supply device 301 is fixed to the upper surface 353 a of the gantry 353. Details of the solder ball supply device 301 will be described with reference to FIGS.

  A solder ball supply device 301 having a configuration similar to that of the second embodiment constitutes an apparatus main body 307, a first air supply unit 319, a first suction unit 341, a second air supply unit 342, and a stopper. A nozzle 373 and a control unit 321 are provided. The configuration of the solder ball supply device 301 is the same configuration and operation method (FIG. 4) as in the second embodiment unless otherwise specified.

  The apparatus main body 307 has a substantially rectangular parallelepiped shape and includes a central block 308, plate-like upper blocks 310 mounted on the upper and lower surfaces in the thickness direction, and a bottom block 312. The central block 308 has a through hole that defines an internal space 305 in which the solder ball 303 is stored, and the through hole expands downward in the thickness direction. Further, a solder replenishing hole 314 is provided that extends in a substantially horizontal direction of the central block 308 and communicates the internal space 305 with the outside. A solder ball 303 is loaded into the internal space 305 through the solder replenishment hole 314. A replenishment hole lid 316 that closes the solder replenishment hole 314 is screwed to the central block 314 except when the solder ball is loaded.

  Further, the central block 308 is provided with a second ventilation configuration path 318. The second ventilation constituting path 318 extends from the side surface of the central block 308 in the front and back direction of the drawing, and further bends and extends to the upper surface side in the thickness direction, and opens at the upper surface.

  Further, the upper block 310 mounted on the upper surface of the central block 308 has a nozzle housing hole 375 for inserting a tip portion of a nozzle 373, which will be described later, and a groove 377 that continues to the nozzle housing hole 375 and extends in the left direction in FIG. And having. When the upper block 310 is mounted on the central block 308, a horizontal passage in the right direction is formed by the groove 377 and the upper surface of the central block 308. This horizontal passage and the above-described second ventilation configuration path 318 constitute a second ventilation path. Accordingly, the air from the second air supply unit 342 is supplied to the nozzle housing hole 375 through the second air passage.

  Further, the bottom block 312 attached to the lower surface of the central block 308 is composed of a sintered body (porous body). A first air supply part 319 and a first suction part 341 are connected to the bottom block 312 via a tube 323. With the above configuration, the air from the first air supply unit 319 and the suction force from the first suction unit 341 are applied to the internal space 305 through the first vent that is a fine hole of the bottom block 312. .

  The nozzle 373 on which the solder ball 303 is held by suction has a tapered shape and functions as a stopper of the solder ball supply device 301. The nozzle 373 includes a solder ball holding part 373a and a nozzle body 373b. The solder ball holding part 373a constituting the tip part of the nozzle 373 defines an opening 373d of the nozzle 373, and the peripheral wall part 373f for positioning the solder ball 303 in the radial direction and the solder ball positioning in the axial direction upward. A contact portion 373c to perform. Here, the inner diameter of the peripheral wall portion 373f (opening) is slightly larger than the outer diameter of the solder ball 303a. Further, the vertical distance from the opening 373d to the contact portion 373c in a state where the nozzle 373 is upright is dimensioned to be approximately the same as the outer diameter of the solder ball 303a. Accordingly, the solder ball holding portion 373a is dimensioned so as to accommodate only one solder ball 303a. That is, the solder ball holding portion 373a functions as a stopper of the solder supply device 301.

  The nozzle main body 373b is provided with a suction air supply path 373e that passes through the contact portion 373c of the solder ball holding portion 373a and applies a suction force. A suction pump (not shown) is connected to the suction air supply path 373e, and suction force is supplied to the solder ball holding portion 373a via the suction air supply path 373e to suck and hold the solder balls. In this embodiment, when the nozzle 373 is inserted into the nozzle housing hole 375, the central axes of the nozzle 373, the nozzle housing hole 375, and the internal space 305 are substantially aligned.

  The operation of the soldering apparatus 351 having the above configuration will be briefly described. First, the work 359 is supplied to the work tray 367. In FIG. 7, only one workpiece 359 is shown, but it goes without saying that a plurality of workpieces may be placed. That is, the number of workpieces and the number of nozzles 373 may be combined so that all workpieces 359 are soldered at once, or the soldering operation is repeated for each workpiece with a single nozzle 373.

  Next, a solder ball supplying step of supplying the solder balls 303 to the nozzles 373 of the suction unit 357 using the solder ball supplying device 301 is performed. In the solder ball supplying step, first, the nozzle 373 moves using an x-axis direction moving stage (not shown), a y-axis direction moving stage 361, and a z-axis direction moving stage 363 according to a command from the drive unit 379. Then, it is inserted into the nozzle accommodation hole 375 of the apparatus main body 307. Thereafter, similar to the flowchart of the second embodiment shown in FIG. 4, the solder balls are accommodated in the solder ball holding portion 373a. That is, the state where the nozzle 373 is inserted into the nozzle housing hole 375 corresponds to the state where the stopper in the second embodiment is closed. Further, the nozzle holding portion 373a corresponds to the alignment path.

  First, air for separating the solder balls 303a from other solder balls is supplied in the horizontal direction from the second air supply unit 342 in the vicinity of the opening 373d of the nozzle 373. Next, air is supplied from the first air supply unit 319 into the internal space 305, the plurality of solder balls 303 float, and the solder balls 303 are introduced into the solder ball holding unit 373a.

  Then, the first air supply unit 319 is deactivated and the first suction unit 341 is activated to apply a suction force to the internal space 305. Further, one solder ball 303 a is separated from the other solder balls 303 by the air from the second air supply unit 342. At this time, a part of the air supplied from the second air supply unit 342 branches, and a downflow toward the bottom flock 312 is formed in the internal space 305. Therefore, the other solder balls 303 are separated from the solder balls 303a and returned to the internal space 305.

  Further, the operation of the first suction unit 341 is stopped by a command from the control unit 321, the suction pump (not shown) of the nozzle 373 is operated, and suction air is applied to the solder ball 303 a to be sucked into the solder ball holding unit 373 a. To do.

  Next, a transfer process for transferring the solder balls 303a to the workpiece 359 is performed. Specifically, the nozzle 373 is moved upward in the figure from the nozzle housing hole 375, and the second air supply unit 342 is stopped. After moving the nozzle 373 from the nozzle housing hole 375, the second air supply unit 342 is stopped by maintaining the air below the internal space 305 by the second air supply unit 342, and other solders. This is to prevent the ball from being attracted to the nozzle.

  Then, the y-axis direction moving stage 361, the z-axis direction moving stage 363, and the x-axis direction moving stage 365 are appropriately moved and positioned at corners formed by the electrodes of the flexure 372 and the head slider.

  The last is a bonding process. A laser beam is irradiated from the laser irradiation unit 355 to the solder ball 303a held by the solder ball holding unit 373a of the adsorption unit 357, and the solder ball 303a is melted, and the electrode of the flexure 372 and the electrode of the head slider 370 Perform soldering.

  The second embodiment is an example in which the conductive member supply device of the present invention is applied to a soldering device, as in the first embodiment. FIG. 10 is a partial cross-sectional view showing the solder ball supply unit and the nozzle, and FIG. 11 is an enlarged view of the XI portion of FIG.

  Regarding the configuration of the second embodiment, only the parts different from the first embodiment will be described. Therefore, configurations and operations not particularly specified are the same as those in the first embodiment.

  The solder ball supply device 401 includes an apparatus main body 407, a first air supply unit 419, a first suction unit 441, a second air supply unit 420, and an adsorption unit (reference numeral 357 in FIG. 7) that constitutes a stopper. No. 473) and a control unit 421.

  The apparatus main body 407 includes a substantially rectangular parallelepiped central block 408 and a plate-like bottom block 412 attached to the lower surface in the thickness direction. That is, unlike the first embodiment, no upper block is provided.

  The central block 408 is provided with a second ventilation path 418. The second ventilation path 418 extends from the side surface of the central block 408 in the front and back direction of the drawing, further extends to the upper surface side in the thickness direction, and is opened on the upper surface 408a. And a groove 418 b that is continuous with the internal space 405.

  The nozzle 473 that sucks and holds the solder ball 403 has a tapered shape and functions as a stopper and an alignment path of the solder ball supply device 401. The nozzle 473 includes a solder ball holding part 473a and a nozzle body 473b. The solder ball holding portion 473a constituting the tip portion of the nozzle 473 defines an opening 473d of the nozzle 473, a peripheral wall portion 473f for positioning the solder ball 403a in the radial direction, and a solder ball upward in the axial direction of the nozzle 473. And a contact portion 473c for positioning. The difference from the first embodiment is that an inclined surface 473g is formed on the outer peripheral surface of the nozzle 473, connected to the inclined surface 473g, and a notch 473h of the peripheral wall portion 473f is provided. The inclined surface 473g is brought into contact with the groove 418b of the upper surface 408a to constitute the second ventilation path 418. Therefore, the nozzle 473 is arranged in such a relationship that the central axis of the nozzle 473 and the central axis of the internal space 405 intersect obliquely. The second air passage 418 is completed when the nozzle 473 and the central block 408 are joined, and the air from the second air supply unit 420 is supplied to the internal space 403.

  Further, the solder ball holding portion 473a is dimensioned so as to accommodate only one solder ball 403a as in the first embodiment. That is, the solder ball holding portion 473a functions as an alignment path of the solder supply device 401. Further, the contact portion 473c and the peripheral wall portion 473f serve as a stopper of the solder device 401.

  Since the operation of the soldering apparatus 401 having the above configuration is the same as that of the first embodiment, the description thereof is omitted.

  Example 3 is a modification of the solder ball supply device of the third embodiment. FIG. 12 is a cross-sectional view of a main part of the solder ball supply device. FIG. 13 is a timing chart showing the first operation timing, and FIG. 14 is a timing chart showing the second operation timing.

  The solder ball supply device 501 of the third embodiment has a configuration similar to the solder ball supply device 201 of FIG. The difference is that a plurality of second suction ports 516 are provided at equal intervals in the direction in which the alignment path 509 extends.

  The experimental conditions are as follows. The solder ball 503 has a diameter of about 60 μm. The gas supplied from the first and second air supply units 519 and 517 is nitrogen gas. Further, the air pressure supplied from the first air supply unit uses about 50 kPa, and the air pressure supplied from the second air supply unit is about 50 kPa. Further, as a countermeasure against charging of the solder balls, an ionizer is inserted from the first air supply unit 519 and the second air supply unit 517 in front of a regulator (not shown) for adjusting the gas flow rate, and the supplied nitrogen gas is neutralized. is doing. Further, a ground is connected to the reservoir 504 that defines the internal space 505.

  As shown in FIGS. 13 and 14, the operation timing was tested for success or failure of the separation of the solder balls at two timings. 13 and 14, SV on the vertical axis indicates the operation of the second suction unit 545, CB indicates the operation of the second air supply unit 517, and BB indicates the operation of the first air supply unit 519. BV indicates the operation of the first suction portion 541, and the stopper indicates the operation of the stopper 511. The horizontal axis indicates time (T).

  As shown in the timing chart of FIG. 13, each element is operated by the control unit 521. First, the second air supply unit 517 is operated at t1. Next, the second suction part 545 is operated at t2. Then, at t3, the first air supply unit 519 is operated to introduce the solder balls 503 into the alignment path 509. In the initial state, since the stopper 511 is closed, the solder ball 503 is engaged with the stopper 511. Next, at t4, the first air supply unit 519 is stopped and the first suction unit 541 is operated. Thereby, an air flow from the second vent 515 to the internal space 505 is formed, and the solder balls 503 excluding the solder balls 503a are returned to the internal space 505. Further, at t5, the operation of the second suction unit 545 and the first suction unit 541 is stopped, while the operation of the second air supply unit 517 is maintained, and the solder ball 503a is moved into the alignment path 509 by the air. Maintained. Then, at t6, the stopper 511 is opened, and the solder ball 503a is sent in the arrow x direction. The stopper 511 is shut off at t7, and the second air supply unit 517 is stopped at the final t8. It took about 0.3 seconds to perform this operation pattern in one step.

  In the second operation pattern shown in FIG. 14, the operations at t1, t2, and t3 are the same as those in FIG. At t4, the second suction unit 545 is stopped, and at t5, the first air supply unit 519 is stopped and the first suction unit 541 is operated to align the solder balls 503a aligned in the alignment path 509. And other solder balls 503 are separated. The solder balls 503 excluding the solder balls 503a are returned into the internal space 505. The first suction portion 541 is stopped at t6, the stopper 511 is opened at t7, and the air from the second air supply portion 517 is sent in the x direction over the stopper 511. At t8, the alignment path 509 is blocked by the stopper 511 and the second air supply unit 517 is stopped, and one process is completed. According to this operation timing, the time required for one supply process was about 0.3 seconds.

  According to the embodiment of the present invention, it is possible to reliably supply a single solder ball and sufficiently satisfy the time required for the supply work as compared with the configuration shown in the background art, regardless of which timing chart is used. It became.

In the present embodiment and examples, a pressure source that applies a known pressurized gas can be used as the air supply unit, and a vacuum source that can suck air can be used as the suction unit. It is also possible to use a pressure source that can be switched between a positive pressure and a negative pressure that serve both as an air supply unit and a suction unit.
The shape, position, etc. of the stopper are not limited to the shapes of the above-described embodiment and examples.

  In the present embodiment and example (excluding the second operation pattern of Example 3), a downflow is formed in the internal space by the second air supply unit, and the unexpected discharge of the conductive member in the internal space is prevented. For the purpose of preventing, the stopper 511 is closed before the stop of the second air supply unit, but the present invention is not limited to this configuration.

  The present invention can be embodied in many forms without departing from its essential characteristics. Therefore, it is needless to say that the above-described embodiments are exclusively explanatory and do not limit the present invention.

(A)-(E) are the partial cross sections which show the solder ball supply apparatus by the 1st Embodiment of this invention for every process. It is process drawing which shows the process of supplying the solder ball of 1st Embodiment. It is a partial cross section figure which shows the solder ball supply apparatus of the 2nd Embodiment of this invention. It is process drawing which shows the process of supplying the solder ball of 2nd Embodiment. It is a partial cross section figure which shows the solder ball supply apparatus of 3rd Embodiment. It is process drawing which shows the process of supplying the solder ball of 3rd Embodiment. 1 is a schematic diagram of a soldering apparatus of Example 1. FIG. 7 is a partial cross-sectional view showing the solder ball supply unit and the nozzle. It is an enlarged view of the IX part of FIG. FIG. 6 is a partial cross-sectional view illustrating a solder ball supply unit and a nozzle according to a second embodiment. It is an enlarged view of the XI part of FIG. FIG. 6 is a cross-sectional view of a main part of a solder ball supply device of Example 3. 12 is a timing chart of a first operation pattern according to the third embodiment. 12 is a timing chart of a second operation pattern according to the third embodiment. It is a fragmentary sectional view of the conventional soldering apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder ball supply apparatus 3 Solder ball 5 Internal space 9 Alignment path 11 Stopper 13 Drive part 15 Second vent 17 Second air supply part 19 First air supply part 21 Control part

Claims (8)

A conductive member supply device for supplying conductive members one by one,
A storage section having an internal space in which the conductive member is stored, and a first vent communicating with the internal space;
An alignment section having a conductive path aligned in a line, an alignment path communicating with the internal space, and a second vent opening communicating with the alignment path;
A stopper for blocking / opening the alignment path;
First air supply means for supplying air from the first vent to the alignment path through the internal space;
A second air supply means connected to a second air passage communicating with the second air vent, and supplying air from the second vent into the alignment passage;
Control means for controlling the conductive member to be introduced into the alignment path by operating the first air supply means and supplying air in a state where the alignment path is blocked by the stopper. ,
In the state where the alignment path is blocked by the stopper, air is supplied to the conductive member stored in the internal space from the first ventilation port communicating with the internal space, and the alignment portion is aligned. The conductive members are aligned in a line in the path, the supply of air from the first vent is stopped, and the air supplied from the second vent is used in the alignment path. The process of separating adjacent conductive members from each other is defined as an alignment separation process,
After the alignment separation step, the step of opening the stopper, discharging one conductive member, and blocking the alignment path by the stopper is defined as a discharge step.
The second air supply means constantly supplies air into the alignment path at least in the alignment separation step and the discharge step,
Let L be the distance in the alignment direction from the center line of the second air passage to the contact portion of the stopper that the conductive member contacts, and D be the diameter of one conductive member.
D ≦ L ≦ 1.5 × D
The conductive member supply apparatus characterized by these.   By supplying air into the alignment path from the second ventilation port by the second air supply means, the first of the row heads in contact with the stopper among the conductive members aligned in a row. The conductive member supply apparatus according to claim 1, wherein the conductive member and the second conductive member connected to the conductive member are separated from each other.   Furthermore, the electroconductive member supply apparatus of Claim 1 or 2 provided with the 1st suction means which provides a suction force to the said interior space through the 1st vent provided in the said storage part.   The conductive member supply device according to any one of claims 1 to 3, further comprising a second suction unit that vacuum-sucks the conductive member into the alignment path. The stopper and the alignment path, conductive member supply apparatus according to any one of claims 1 to 4, which is a nozzle for adsorbing a conductive member. A conductive member supply method for supplying the conductive members stored in the internal space of the storage portion one by one from the alignment path of the alignment portion communicating with the internal space,
A blocking step of blocking the alignment path by a stopper;
A center line having a center line at a distance of not less than one and not more than 1.5 diameters of the conductive member in the direction in which the conductive member is aligned from the contact portion of the stopper with which the conductive member contacts . An air supply step of supplying air into the alignment path from a second ventilation port provided in the alignment path in communication with the two ventilation paths;
After the blocking step and the air supply step, air is supplied to the conductive member stored in the internal space from a first ventilation port communicating with the internal space, and the alignment path of the alignment unit The conductive members are lined up in a line , the supply of air from the first vent is stopped, and the air supplied from the second vent is adjacent in the alignment path. An alignment separation process for separating the conductive members from each other;
After the alignment and separation step, the stopper is opened, and a discharge step of discharging one conductive member,
A conductive member supply method in which air is constantly supplied from the second vent into the alignment path at least in the alignment separation step and the discharge step.   The conductive member supplying method according to claim 6, wherein the alignment / separating step includes a step of performing vacuum suction from the first vent communicating with the internal space.   The conductive member supply method according to claim 6, wherein the alignment separation step includes a step of vacuum suctioning the conductive member into the alignment path.

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