JP4318663B2 - 光照射装置 - Google Patents
光照射装置 Download PDFInfo
- Publication number
- JP4318663B2 JP4318663B2 JP2005130927A JP2005130927A JP4318663B2 JP 4318663 B2 JP4318663 B2 JP 4318663B2 JP 2005130927 A JP2005130927 A JP 2005130927A JP 2005130927 A JP2005130927 A JP 2005130927A JP 4318663 B2 JP4318663 B2 JP 4318663B2
- Authority
- JP
- Japan
- Prior art keywords
- led element
- light
- light irradiation
- lead
- optical unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Description
2…LED素子
3a、3b…リード
4…光学ユニット
41…ボディ
42…リード保持部
45…側周面
4b…先端面
Claims (3)
- LED素子と、前記LED素子に電気的に接続されており、基板に形成されたスルーホールに嵌入される複数のリードと、前記LED素子に電気的に接続されておらず、前記リードより径が大きい円柱状をなし、その先端面が前記LED素子と接し、その基端面が基板に接するように構成してあり、前記LED素子から発生した熱を外部に放出する放熱用リードと、光学ユニットとを備えている光照射装置であって、
前記LED素子が、200mA以上の電流を連続して流すことのできるパワーLED素子であり、
前記光学ユニットが、ボディと、前記ボディの基端に連続して形成されたリード保持部とからなり、
前記ボディが、光軸を中心とし、基端から先端に向かって末広がりな形状をなす中実透明体であって、側面に形成された前記LED素子からの光をボディ内方へ反射する側周面と、先端に形成された前記LED素子からの光を外部に射出する先端面とを備えており、
前記光学ユニットは、前記LED素子と前記リードとを内包した状態で一体として成形してあることを特徴とする光照射装置。 - 複数の型を使用して成形されたものである請求項1記載の光照射装置。
- 前記ボディは、回転体形状をなすものである請求項1又は2記載の光照射装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005130927A JP4318663B2 (ja) | 2005-04-28 | 2005-04-28 | 光照射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005130927A JP4318663B2 (ja) | 2005-04-28 | 2005-04-28 | 光照射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006310521A JP2006310521A (ja) | 2006-11-09 |
JP4318663B2 true JP4318663B2 (ja) | 2009-08-26 |
Family
ID=37477078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005130927A Expired - Fee Related JP4318663B2 (ja) | 2005-04-28 | 2005-04-28 | 光照射装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4318663B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009010081A (ja) * | 2007-06-27 | 2009-01-15 | Mac Eight Co Ltd | 発光ダイオード用ソケット |
JP4964753B2 (ja) * | 2007-12-12 | 2012-07-04 | 株式会社小糸製作所 | 車両用照明灯具 |
WO2009144963A1 (ja) * | 2008-05-27 | 2009-12-03 | シャープ株式会社 | Led光源装置、バックライト装置および液晶表示装置 |
-
2005
- 2005-04-28 JP JP2005130927A patent/JP4318663B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006310521A (ja) | 2006-11-09 |
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