JP4314289B2 - Printed wiring board position error acquisition method, program, and electronic circuit component mounting system - Google Patents

Description

  The present invention relates to an electronic circuit component mounting system for mounting a plurality of electronic circuit components on a printed wiring board, a printed wiring board position error acquisition method, an electronic circuit component mounting method, and a position error acquisition method executed in the system. It is about the program.

  A plurality of component mounting units each having a mounting head and a head moving device for moving the mounting head are arranged along a straight line, and at least two of the plurality of component mounting units are printed on one sheet at the same time. An electronic circuit component mounting system for mounting electronic circuit components in parallel to a board is already known. In this type of electronic circuit component mounting system, one printed wiring board is arranged in a state that spans the movement range of the mounting head of at least two component mounting units, and the at least two component mounting of the printed wiring board The electronic circuit component is mounted in parallel in an area corresponding to the movement range of each component mounting head of the unit.

  In general, in an electronic circuit component mounting system, a reference mark or the like is placed on a printed wiring board in order to suppress a mounting position error of the electronic circuit component to the printed wiring board due to a positioning error of the printed wiring board with respect to the component mounting unit. While a reference unit is provided, a recognition device such as an imaging device is provided corresponding to the electronic component mounting unit, and a positioning error of the printed wiring board with respect to the component mounting unit is acquired based on a recognition result of the reference unit by the recognition device. Things are also done. When electronic circuit components are mounted on a printed wiring board, the position of the mounting head set in advance is corrected so as to reduce at least the printed wiring board position error (parallel movement error and rotation error). It is. Besides this, correction to reduce the holding position error (parallel movement error and rotation error) of the electronic circuit component by the mounting head is also usually performed, but since it is not directly related to the present invention, The description regarding this correction is omitted.

As described above, even when a plurality of component mounting units perform mounting operations on a single printed wiring board at the same time, a plurality of reference portions are provided in the area corresponding to each component mounting unit of the printed wiring board. If the reference unit can be recognized by a recognition device provided for each component mounting unit, similarly, a positioning error of the printed wiring board with respect to each component mounting unit is detected. Then, it is possible to mount the electronic circuit component while correcting the amount. However, when the number of reference portions corresponding to each component mounting unit is one or less, the positioning error of the printed wiring board with respect to each component mounting unit cannot be acquired.
Therefore, conventionally, the positioning accuracy of the printed wiring board is improved by a mechanical positioning device such as forming a plurality of positioning holes in the printed wiring board and inserting positioning pins into the positioning holes, or the printed wiring board is palletized. By holding the printed circuit board holding position error with the wiring board holding device, detecting the printed wiring board holding position error with the imaging device, etc., and moving the wiring board holding device with high accuracy, Efforts were made to ensure the accuracy of mounting circuit components.
However, there is a limit to improving the positioning accuracy of the printed wiring board by the mechanical positioning device, and it is difficult to sufficiently increase the mounting accuracy of the electronic circuit components, and the printed wiring board is fixedly held. When the wiring board holding device is moved with high accuracy, there is a problem that it is inevitable that the configuration of the device becomes complicated and the cost becomes high.

  In the electronic circuit component mounting system of the type in which a plurality of component mounting units perform mounting operation on a single printed wiring board at the same time with the above circumstances as a background, an increase in device cost is avoided as much as possible. However, it is an object to sufficiently increase the mounting accuracy of electronic circuit components.

The above-described problem is solved by having a printed wiring board position error acquisition method, an electronic circuit component mounting method, a printed wiring board position error acquisition program, and an electronic circuit component mounting system, each having the following structural features. The
(i) Printed wiring board position error acquisition method This is an area in which two adjacent electronic circuit components can be mounted among a plurality of component mounting units each having a mounting head and a head moving device that moves the mounting head. There are overlapping portions in which the mounting regions overlap each other and non-overlapping portions in which the mounting regions do not overlap in the mounting region, and the recognition regions which are recognizable regions of the two recognition devices corresponding to the component mounting units adjacent to each other. In an electronic circuit component mounting system in which there are also an overlapping portion and a non-overlapping portion, one of the plurality of component mounting units of a printed wiring board having a size spanning the mounting region and the recognition region of the plurality of component mounting units. A position error for one of
Recognized by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. A wiring board reference part recognition step in which each of the wiring board reference parts that can be recognized but cannot be recognized by other recognition devices is recognized;
Based on the recognition result of each recognition device in the wiring board reference part recognition step, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit is An acquired wiring board reference portion specific position acquisition step;
Based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step, the position error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. A printed circuit board position error acquisition method comprising: a printed circuit board position error acquisition step.
(ii) Electronic circuit component mounting method Mounting region that is a region in which two adjacent electronic circuit components can be mounted among a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head. In addition, there are overlapping portions where the mounting regions overlap with each other and non-overlapping portions which do not overlap with each other, and they also overlap with the recognition regions which are recognizable regions of the two recognition devices corresponding to the component mounting units adjacent to each other. In an electronic circuit component mounting system in which a portion and a non-overlapping portion exist, a method of mounting an electronic circuit component on a printed wiring board having a size that spans the mounting region and the recognition region of the plurality of component mounting units,
Recognizable by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. However, the wiring board reference part recognition process in which each of the wiring board reference parts that cannot be recognized by other recognition devices is recognized, and
Based on the recognition result of each recognition device in the wiring board reference part recognition step, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit is An acquired wiring board reference portion specific position acquisition step;
Based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step, the position error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. Wiring board position error acquisition step,
A mounting step of mounting electronic circuit components on the printed wiring board by each of the plurality of component mounting units while correcting at least the wiring board position error acquired in the wiring board position error acquisition step. Component mounting method.
(iii) Printed wiring board position error acquisition program An area where two adjacent electronic circuit components can be mounted among a plurality of component mounting units each having a mounting head and a head moving device for moving the mounting head. There are overlapping portions in which the mounting regions overlap each other and non-overlapping portions in which the mounting regions do not overlap in the mounting region, and the recognition regions which are recognizable regions of the two recognition devices corresponding to the component mounting units adjacent to each other. In an electronic circuit component mounting system in which there are also an overlapping portion and a non-overlapping portion, one of the plurality of component mounting units of a printed wiring board having a size spanning the mounting region and the recognition region of the plurality of component mounting units. A program executed by a computer to obtain a position error for one
Recognized by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. A recognition result acquisition step for acquiring information of a recognition result that is a result of recognition of each wiring board reference portion that is possible but not recognized by other recognition devices;
Based on the recognition result acquired in the recognition result acquisition step, the wiring board that acquires the wiring board reference portion unique position that is the position of each wiring board reference portion in the unique coordinate plane that is a unique coordinate plane for each component mounting unit A reference part specific position acquisition step;
Wiring for acquiring the position error of the printed wiring board with respect to the one specific coordinate plane of the plurality of component mounting units based on the positions of the plurality of wiring board reference parts acquired in the wiring board reference part unique position acquisition step A printed wiring board position error acquisition program including a board position error acquisition step.
(iv) Electronic circuit component mounting system A plurality of component mounting units each having a mounting head and a head moving device for moving the mounting head, and two adjacent electronic circuit components of the plurality of component mounting units In the mounting area, which is an area where the mounting area can be mounted, there are an overlapping part where the mounting areas overlap each other and a non-overlapping part which does not overlap,
A plurality of individual control devices which are provided corresponding to each of the plurality of component mounting units and which control the corresponding component mounting units;
A plurality of recognition devices provided corresponding to each of the plurality of component mounting units and recognizing a wiring board reference portion that is a reference portion of the printed wiring board, each of the two adjacent component mounting units. A recognition region that is a recognizable region of two recognition devices corresponding to the above-described recognition region includes an overlapping portion where the recognition regions overlap each other and a non-overlapping portion that does not overlap each other,
Of the plurality of recognition devices, among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting region and the recognition region of the plurality of component mounting units by controlling the plurality of recognition devices. A wiring board reference part recognition control means for recognizing each wiring board reference part that can be recognized by each of at least two recognition devices but cannot be recognized by other recognition devices;
Based on the recognition result obtained by the control of the wiring board reference part recognition control means, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit A wiring board reference portion specific position acquisition means for acquiring a position;
Based on the positions of the plurality of wiring board reference portions acquired by the wiring board reference portion unique position acquisition means, the positional error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. Wiring board position error acquisition means, and the individual control device controls the component mounting unit to correct the position error of the printed wiring board acquired by the wiring board position error acquisition means to An electronic circuit component mounting system characterized by being mounted.
According to these inventions, in the mounting area, which is an area in which two adjacent electronic circuit components can be mounted among a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head. There are overlapping portions where the mounting regions overlap each other and non-overlapping portions which do not overlap each other, and there are also overlapping portions in the recognition regions which are recognizable regions of the two recognition devices corresponding to each of the component mounting units adjacent to each other. In the electronic circuit component mounting system in which there is a non-overlapping portion, it is possible to acquire a positional error with respect to one of the plurality of component mounting units of the printed wiring board having a size extending over the plurality of component mounting units.
Among the plurality of wiring board reference portions of the printed wiring board having a size extending over the mounting area and the recognition area of the plurality of component mounting units, each of the plurality of recognition apparatuses can be recognized by each of the recognition apparatuses. The wiring board reference part, which cannot be recognized by some of the recognition devices, is recognized by a plurality of recognition devices, and based on the recognition result, each wiring in the unique coordinate plane, which is a unique coordinate plane for each component mounting unit The position of the printed wiring board relative to one specific coordinate plane of the plurality of component mounting units is acquired based on the acquired positions of the plurality of wiring board reference parts, which are the positions of the board reference parts. Is obtained.
If the relative position error between multiple component mounting units is negligibly small, each component mounting unit has its own unique position based on the unique position of each wiring board reference portion within the unique coordinate plane of each component mounting unit. The position error of the printed wiring board with respect to the coordinate plane can be acquired with high accuracy. On the other hand, if the relative position error between the multiple component mounting units is relatively large, the relative position error between the component mounting units is acquired as described later, and the relative wiring error is also taken into account for printed wiring. It is desirable to obtain the position error of the plate. In any case, if the position error of the printed wiring board is obtained, the mounting position error of the electronic circuit component based on the position error can be reduced.

Aspects of the Invention

  Hereinafter, in the present application, in addition to the above-described inventions (the “present invention” to “the present invention” as claimed in the claims), the inventions that can be claimed (hereinafter “claimable”) The invention may also be referred to as “invention.” The claimable invention may include a subordinate concept invention of the present invention, a superordinate conception of the present invention, or an invention of another concept). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is only for the purpose of facilitating the understanding of the claimable invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. Absent. In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items.

(1) Each recognition device provided corresponding to each of a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head allows the head movement range of the plurality of component mounting units. A wiring board reference part recognition step in which a wiring board reference part that can be recognized by each recognition device is recognized among a plurality of wiring board reference parts of the printed wiring board having a size spanning,
Based on the recognition result of each recognition device in the wiring board reference part recognition step, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit is An acquired wiring board reference portion specific position acquisition step;
The wiring from which the position error of the printed wiring board with respect to the unique coordinate plane of each of the plurality of component mounting units is acquired based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step A printed wiring board position error acquisition method including a board position error acquisition step.

  In the wiring board reference portion recognition step, a reference portion corresponding to each of a plurality of component mounting units on one printed circuit board is recognized by a recognition device corresponding to each of the component mounting units, and based on the recognition result In the wiring board reference portion unique position acquisition step, the unique position of each wiring board reference portion in the unique coordinate plane of each component mounting unit is obtained. Based on the positions of the plurality of wiring board reference portions thus acquired, in the wiring board position error acquisition step, the position error of the printed wiring board with respect to each unique coordinate plane of the plurality of component mounting units is acquired.

  If the relative position error between multiple component mounting units is negligibly small, the uniqueness of each wiring board reference part in the unique coordinate plane of each component mounting unit acquired in the wiring board reference part unique position acquisition step Based on the position, the position error of the printed wiring board with respect to each unique coordinate plane of the component mounting unit is obtained with high accuracy. On the other hand, when the relative position error between the plurality of component mounting units is relatively large, the relative position error between the component mounting units is acquired as will be described later, and the printed wiring is also considered in consideration of the relative position error. It is desirable to obtain plate position errors. In any case, if the position error of the printed wiring board is obtained, the mounting position error of the electronic circuit component based on the position error can be reduced.

(2) The wiring board reference portion unique position acquisition step is performed in an individual control device corresponding to each of the plurality of component mounting units, and the wiring board reference portion unique position acquired in each individual control device is another individual control. In each individual control device supplied to the apparatus, the wiring is based on at least one of the supplied wiring board reference portion unique positions and at least one of the wiring board reference portion unique positions acquired in each individual control device itself. The printed circuit board position error acquisition method according to item (1), wherein the board position error acquisition step is performed.
When the wiring board reference portion unique position acquisition step is performed in the individual control device corresponding to each of the plurality of component mounting units, the unique position of the wiring board reference portion corresponding to each component mounting unit is determined in each individual control device. The obtained unique position of the wiring board reference portion is supplied to another individual control device. Each individual control device mounts a component corresponding to each individual control device based on the wiring board reference portion unique position acquired by itself and one or more wiring board reference portion unique positions supplied from other individual control devices. The position error of the printed wiring board with respect to the unique coordinate plane of the unit is acquired.

(3) A recognition result of the wiring board reference part in the wiring board reference part recognition step is supplied to a common computer which is a computer common to the plurality of component mounting units, and the wiring board reference part unique position acquisition step and the wiring The printed wiring board position error acquisition method according to item (1), wherein the board position error acquisition step is performed in the common computer.
In the printed wiring board position error acquisition method of this section, the position error of the printed wiring board with respect to the specific coordinate plane of the component mounting unit corresponding to each individual control device is acquired by a computer common to the plurality of component mounting units. It is not essential that the number of the common computer is one. For example, the recognition data of the wiring board reference part by the recognition device is processed to acquire the position error of the wiring board reference part with respect to the recognition device, and the wiring board reference Acquiring the position error of the wiring board reference portion with respect to each component mounting unit and the position error of the entire printed wiring board based on the position errors of the parts may be performed in different common computers.

(4) A relative position acquisition step in which relative positions of the plurality of component mounting units are acquired at least before the wiring board position error acquisition step, and the wiring board position error acquisition step includes the relative position acquisition. The printed wiring board position error acquisition method according to any one of (1) to (3), wherein the positional error of the printed wiring board is acquired in consideration of the relative position acquired in the process.
The relative position acquisition step may be a step of reading the relative position acquired in advance and stored in the memory, or a step of actually detecting the relative position. In the latter case, the relative position acquisition process is a relative position detection process. This process may be performed prior to or after the wiring board reference portion recognition process. You may perform after a board reference | standard part specific position acquisition process.

(5) The relative position acquisition step includes:
A plurality of device reference portions provided in a main body of the plurality of component mounting units by the recognition device provided in each mounting head of the plurality of component mounting units, which are dedicated to each component mounting unit. A device reference unit recognition step for recognizing a dedicated device reference unit and a shared device reference unit that is shared by two adjacent parts among the plurality of component mounting units;
The printed wiring board position error acquisition method according to item (4), further including a step of acquiring a relative position between the two component mounting units adjacent to each other based on a recognition result of the device reference portion recognition step.
The “main body” may be dedicated to a plurality of component mounting units, or may be shared by at least some of the plurality of component mounting units. If the dedicated device reference unit and the shared device reference unit are recognized by two recognition devices corresponding to two component mounting units adjacent to each other, the relative position of the two component mounting units is determined based on the recognition result. Acquisition is possible. In addition, when the relative rotational position error between two component mounting units adjacent to each other can be ignored, the recognition of the shared device reference unit is only performed by the two recognition devices corresponding to the two component mounting units. The relative positions of the two component mounting units can be acquired, and the arrangement or recognition of the dedicated device reference unit is not essential, and this aspect is also an embodiment of the present invention.

(6) The relative position acquisition step includes:
Preparing a relative position detection reference plate having a size that spans the head movement range of the plurality of component mounting units, and having one or more reference plate reference portions for each head movement range;
The relative position detection reference plate is disposed in a state that spans the head movement range of the plurality of component mounting units, and at least one of the plurality of reference plate reference portions provided on the relative position detection reference plate is the A reference plate reference portion recognition step recognized by the recognition device provided in each mounting head of a plurality of component mounting units;
The printed wiring board position error acquisition method according to item (4), further including a step of acquiring relative positions of the plurality of component mounting units based on a recognition result of the reference plate reference portion recognition step.
If a relative position detection reference plate having a size that spans the head movement range of a plurality of component mounting units and having one or more reference plate reference portions provided for each head movement range is adjacent to each other. The relative position of the two component mounting units can be easily detected. When the relative rotational position error between adjacent component mounting units can be ignored, the relative position can be obtained if one reference plate reference portion is provided for each head movement range. Is not negligible, it is necessary to provide two or more reference plate reference portions for each head movement range.

(7) The printed wiring board position error acquisition method according to any one of (1) to (6), wherein a recognition device provided in each of the plurality of component mounting heads is used as the recognition device.
A reference mark is preferable as the reference portion, and an imaging device is preferable as the recognition device. Although it is possible to provide a dedicated moving device that moves the recognition device within the component mounting head movement range, if a recognition device is provided on the component mounting head, the configuration of the device can be simplified and the device cost can be reduced. In addition, it is not necessary to consider the relative position error between the component mounting head moving device and the recognition device moving device, and accordingly, the error acquisition of the printed wiring board position is facilitated.

(8) The wiring board position error acquisition step is performed with respect to the unique coordinate plane of each of the plurality of component mounting units based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step. The printed wiring board position error acquisition method according to any one of (1) to (7), including a step of acquiring a wiring board virtual coordinate plane of the printed wiring board.
The wiring board virtual coordinate plane is a coordinate plane virtually imagined on the printed wiring board based on the positions of a plurality of wiring board reference portions. When the dimensional error of the printed wiring board is negligible, the wiring board virtual coordinate plane is a normal one having no dimensional error. It can be regarded as the same as the wiring board reference coordinate plane set on the printed wiring board. Regardless of whether or not the dimensional error can be ignored, the relative position of the wiring board virtual coordinate plane with respect to the unique coordinate plane of the component mounting unit can be considered as a kind of position error of the printed wiring board with respect to the unique coordinate plane.

(9) Each step of the printed wiring board position error acquisition method according to any one of (1) to (8);
A mounting step in which an electronic circuit component is mounted on the printed wiring board by each of the plurality of component mounting units while correcting at least the wiring board position error acquired in the wiring board position error acquisition step. Circuit component mounting method.
If the position error of the printed wiring board with respect to each of the plurality of component mounting units can be acquired, the mounting accuracy in each component mounting unit can be improved by mounting the electronic circuit component in consideration of the position error.

(10) The wiring board position error acquisition step is performed with respect to the unique coordinate plane of each of the plurality of component mounting units based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step. Including a step of obtaining a wiring board virtual coordinate plane of the printed wiring board, and the electronic circuit component mounting method includes:
The coordinate values of a plurality of component mounting points set in advance with the coordinate values on the wiring board reference coordinate plane set for the regular one of the printed wiring boards are expressed as the wiring board reference coordinate plane, the wiring board virtual coordinates, and the like. The electronic circuit component mounting method according to (9), further comprising: a conversion step of converting the value to a corresponding component mounting point on the specific coordinate plane based on a relative positional relationship between the plane and the specific coordinate plane.
The above-mentioned “value relating to the component mounting point” includes the coordinate value of the position of the mounting head when the electronic circuit component is actually mounted, as well as the printed wiring board having a normal dimension, and the position. Position correction amount of the mounting head from the component mounting point when there is no error to the actual printed wiring board position when there is an error (If the dimensional error cannot be ignored, the dimensional error is also (Corrected together with the position error)).
By using coordinate conversion among the wiring board reference coordinate plane, the wiring board virtual coordinate plane, and the unique coordinate plane, the coordinates and position correction amounts of the corresponding component mounting points on the unique coordinate plane can be easily obtained. .

(11) Each recognition device provided corresponding to each of a plurality of component mounting units each having a mounting head and a head moving device that moves the mounting head allows the head movement range of the plurality of component mounting units to be set. A recognition result acquisition step of acquiring information on a result of recognition of each of the wiring board reference portions that can be recognized by each recognition device among the plurality of wiring board reference portions of the printed wiring board having a size spanning,
Based on the acquired recognition result, the wiring board reference unit unique position that acquires the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit A position acquisition step;
The wiring board position for acquiring the position error of the printed wiring board with respect to the specific coordinate plane of each of the plurality of component mounting units based on the positions of the plurality of wiring board reference parts acquired in the wiring board reference part unique position acquisition step A printed wiring board position error acquisition program including an error acquisition step.
A program executed by a computer common to a plurality of component mounting units. In the recognition result acquisition step, not only the step of acquiring the recognition data itself of the wiring board reference unit from the recognition device, but also the wiring board reference for the recognition device acquired by processing the recognition data by another processing computer. The step of acquiring the relative position information of the part is also included. In the former case, for example, the wiring board reference portion unique position acquisition step includes a step of processing the recognition data to acquire the relative position of the reference portion with respect to the recognition device.
The features described in the items (4) to (8) and (14) below can be applied to the printed wiring board position error acquisition program of this item.

(12) (a) A mounting head and a head moving device for moving the mounting head, respectively, and a plurality of component mounting units arranged along a straight line; and (b) a printed wiring board along the straight line. A wiring board transport device that transports and stops at least two of the plurality of component mounting units across the range of movement of the mounting head; and (c) provided corresponding to each of the plurality of component mounting units A plurality of individual control devices each having a computer to control a corresponding component mounting unit; and (d) a reference of the stopped printed wiring board provided corresponding to each of the plurality of component mounting units. A program executed in each of the computers of an electronic circuit component mounting system including a plurality of recognition devices for recognizing a wiring board reference portion that is a portion I,
In each unique coordinate plane, which is a coordinate plane unique to one of the at least two component mounting units, acquired based on a recognition result of the wiring board reference portion by a corresponding one of the plurality of recognition devices. Based on the position of the wiring board reference portion and the position of a similar wiring board reference portion in at least one of the at least two component mounting units, the stopping with respect to the unique coordinate plane of the one component mounting unit is stopped. A wiring board position error acquisition program comprising a wiring board position error acquisition step for acquiring a position error of a printed wiring board.
It is a program that is provided corresponding to each of a plurality of component mounting units and that is executed by a computer of a plurality of individual control devices that control the corresponding component mounting units.
The features described in the items (4) to (8) and (14) below can also be applied to the printed wiring board position error acquisition program of this item. Also, a wiring board position error acquisition method performed using the printed wiring board position error acquisition program of this section is an embodiment of the present invention.

(13) (a) Each of the mounting heads and a head moving device for moving the mounting head, each having a plurality of component mounting units arranged along a straight line; and (b) a printed wiring board along the straight line. A wiring board transport device that transports and stops at least two of the plurality of component mounting units across the range of movement of the mounting head; and (c) provided corresponding to each of the plurality of component mounting units A plurality of individual control devices each having a computer to control a corresponding component mounting unit; and (d) a reference of the stopped printed wiring board provided corresponding to each of the plurality of component mounting units. A program executed in each of the computers of an electronic circuit component mounting system including a plurality of recognition devices for recognizing a wiring board reference portion that is a portion I,
In each unique coordinate plane, which is a coordinate plane unique to one of the at least two component mounting units, acquired based on a recognition result of the wiring board reference portion by a corresponding one of the plurality of recognition devices. Based on the position of the wiring board reference portion and the position of a similar wiring board reference portion in at least one of the at least two component mounting units, the stopping with respect to the unique coordinate plane of the one component mounting unit is stopped. A wiring board position error acquisition step for acquiring a printed wiring board position error;
A component mounting point that is a mounting point of a plurality of electronic circuit components set in advance with respect to a regular one of the printed wiring boards is at least a printed wiring board position error acquired in the wiring board position error acquiring step. A mounting control step for mounting the electronic circuit component on the mounting head at the position corrected by the minute correction.
It is a program that is provided corresponding to each of a plurality of component mounting units and that is executed by a computer of a plurality of individual control devices that control the corresponding component mounting units.
The features described in the items (4) to (8) and the following item (14) can be applied to the electronic circuit component mounting program of this item.

(14) A plurality of component mounting units each provided with a mounting head and a head moving device that moves the mounting head and arranged along a straight line;
A printed circuit board that conveys the printed wiring board along the straight line, and a wiring board conveying device that stops over the movement range of the mounting head of at least two of the plurality of component mounting units;
A plurality of individual control devices which are provided corresponding to each of the plurality of component mounting units and which control the corresponding component mounting units;
A plurality of recognition devices provided corresponding to each of the plurality of component mounting units and recognizing a wiring board reference portion which is a reference portion of the stopped printed wiring board;
A wiring board in each unique coordinate plane that is a coordinate plane unique to one of the at least two component mounting units based on the recognition result of the plurality of recognition devices corresponding to the at least two component mounting units. Based on the position of the reference portion and the position of a similar wiring board reference portion in at least one of the at least two component mounting units, the stopped print with respect to the unique coordinate plane of the one component mounting unit Wiring board position error acquisition means for acquiring the wiring board position error;
A component mounting point that is a mounting point of a plurality of electronic circuit components set in advance with respect to a regular one of the printed wiring boards is at least a position error of the printed wiring board acquired by the wiring board position error acquisition unit The electronic circuit component mounting system, wherein the individual control device causes the component mounting unit to mount the electronic circuit component at the position corrected by the correction unit.
The wiring board position error acquisition means and the correction means may be provided in each of the individual control devices, or at least one of them may be provided in a separate computer provided separately from the individual control device.
For one of the at least two component mounting units, the position error of the printed wiring board with respect to the specific coordinate plane of the component mounting unit is acquired, while another one of the component mounting units is also printed with respect to its specific coordinate plane. A position error of the wiring board is acquired. Then, component mounting points are corrected for each of these component mounting units, and electronic circuit components are mounted in parallel on the corrected component mounting points.
The electronic circuit component mounting system of this section is suitable for carrying out the electronic component mounting method of the above item (9).
The features described in the items (1) to (8) and (10) to (13) can be applied to the electronic circuit component mounting system of this item.

(15) including relative position acquisition means for acquiring relative positions among the plurality of component mounting units, and the wiring board position error acquisition means also takes into account the relative position acquired by the relative position acquisition means The electronic circuit component mounting system according to item (14), which acquires a position error of the printed wiring board.

  Hereinafter, an electronic circuit component mounting system according to an embodiment of the claimable invention will be described. In FIG. 1, reference numeral 10 denotes a base. A wiring board conveyor 14 is provided on the base 10 as a transfer device for transferring the printed wiring board 12 along one horizontal direction. The printed wiring board 12 has an electronic circuit component (hereinafter simply referred to as a component) 16 (see FIG. 5). ) Is provided. A component supply device 20 that supplies the component 16 to the component mounting device 18 is further provided on the base 10.

  The wiring board conveyor 14 includes a pair of side frames 30 and 32 extending along the transport direction, and a part of the side frames 30 and 32 has a guide 33 for guiding the printed wiring board 12 as shown in FIG. It is composed. One of the side frames 30 and 32 is a fixed frame 30 fixed so as not to move on the base 10, and the other is provided on the base 10 so as to be movable, and a movable frame 32 that can approach and separate from the fixed frame 30. Has been. Although not shown, a moving device that holds the movable frame 32 and moves it in the Y-axis direction is provided below the movable frame 32, and the movable frame 32 approaches and separates from the fixed frame 30 by the moving device. To be moved. An annular conveyor belt 34 is wound around each of the frames 30 and 32 and is driven in synchronization with each other by a conveyor driving motor (see FIG. 6) 36 as a driving source, thereby conveying the printed wiring board 12.

  A wiring board support device 42 that supports the printed wiring board 12 is disposed between the pair of frames 30 and 32 of the wiring board conveyor 14. A plurality of wiring board support devices 42 are arranged along the conveyance direction of the wiring board conveyor 14. A stop device (not shown) is provided at the downstream end of each wiring board support device 42, and the position in the transport direction is defined by contacting the downstream end face of the printed wiring board 12.

  In the wiring board support device 42, a plurality of support pins 72 are provided on the support base 70 and can be moved up and down by a support base lifting device 76. The support 70 is supported by an air cylinder 80 serving as a driving source, and is supported at a rising end position for supporting the printed wiring board 12 and at a falling end position for allowing the printed wiring board 12 to move in the horizontal direction. It is raised and lowered between the working positions. The printed wiring board 12 is sandwiched and clamped from both upper and lower sides by an upward support surface 82 provided on the frames 30 and 32 and a clamp member 84 provided rotatably.

  The component supply device 20 is a feeder-type component supply device that holds a plurality of components 16 and sequentially sends the components 16 one by one to a component supply position. The feeder-type component supply apparatus 20 includes a component supply table 94 in which a large number of component feeders 90 are arranged on a feeder support table 92 and each component supply unit is arranged in a straight line parallel to the X-axis direction. Each component feeder 90 accommodates a large number of components 16, and arranges the components 16 in a line and sends them one by one to the component supply unit. For example, the components 16 are held on a component holding tape (not shown). It is possible to adopt what is supplied in the form of taped parts.

  The component mounting apparatus 18 includes a plurality of component mounting units 100 (see FIG. 3), and these component mounting units 100 are closely arranged along the transport direction. Each mounting unit 100 is disposed such that a mounting region 102 that is a region in which the component 16 can be mounted overlaps with a mounting region 102 of another adjacent component mounting unit 100 at a boundary portion. As shown in FIG. 1, the plurality of component mounting units 100 are fixed side by side on the base 10, extend in the Y-axis direction, and extend to the component supply device 20 beyond the wiring board conveyor 14. A unit main body 104 is provided. A ball screw 106 as a feed screw is attached to the lower surface of the unit main body 104 in parallel with the Y-axis direction, and a Y-axis slide 108 is screwed through a nut 110 so that the ball screw 106 serves as a drive source. The Y-axis slide 108 is guided and moved by the guide rail 114 by being rotated by the servo motor 112 (see FIG. 6). The ball screw 106, the nut 110, and the Y-axis servo motor 112 jointly constitute a Y-axis slide drive device.

  A support member 120 extending along the X-axis direction orthogonal to the Y-axis direction in a horizontal plane is fixed to the lower surface of the Y-axis slide 108 so as not to be relatively movable. The support member 120 protrudes from both sides of the unit main body 104 in the X-axis direction and is formed to have a length that reaches the lower space of the adjacent mounting unit 100. The support member 120 is configured not to interfere with the support members 120 of the component mounting units 100 adjacent to each other when the support member 120 is moved in the Y-axis direction along the unit main body 104 as the Y-axis slide 108 moves. Specifically, the spacer 122 is provided between the Y-axis slide 108 and the support member 120, and the component mounting unit 100 in which the support member 120 is held at a relatively low position and the Y-axis slide 108 are directly held. As a result, the component mounting units 100 each holding the support member 120 at a relatively high position are alternately arranged.

  As shown in FIG. 4, the support member 120 is formed in a U shape in cross section, and the X-axis slide 126 is movably supported via the guide block 124. The X-axis slide 126 is driven by a linear motor 128 provided inside the support member 120. The linear motor 128 is a linear DC brushless motor, and includes a stator 130 having a large number of permanent magnets and a pair of movers 132 each having a plurality of coils. The stator 130 is held in a horizontal posture on the inner surface of the support member 120. The pair of movers 132 is arranged with a slight gap so as to sandwich the stator 130 from above and below, and is connected to each other by a connecting portion at the free end portion side of the stator 130 as a whole. The movable element assembly has a U-shape, and constitutes a movable part 134 of the linear motor. The movable part 134 is engaged with the support member 120 via a guide block 124 holding a large number of balls 136, and is moved to an arbitrary position of the stator 130 by controlling the current supplied to the coil of the movable element 132. Be made. The outer side surface of the support member 120 constitutes a guide for guiding the movement of the linear motor 128.

  An X-axis slide 126 is held on the lower surface of the guide block 124 so as not to be relatively movable. The X-axis slide 126 includes a supported portion 140 and a main body portion 142 that extends downward from the end portion of the supported portion 140, and is fixed to the guide block 124 so as not to move relative to the supported portion 140. A mounting head 144 for holding the component 16 by suction and mounting it on the printed wiring board 12 is held on the main body 142 of the X-axis slide 126. The main body 142 further supports a fiducial mark camera 148 that is an image pickup device for picking up an image of the fiducial mark 146 (see FIG. 1) provided on the printed wiring board 12. In the illustrated example, the mounting head 144 and the reference mark camera 148 are arranged side by side in the Y-axis direction.

Here, as described above, in the plurality of component mounting units 100, the vertical position of the support member 120 is alternately arranged in a relatively high and low position. The vertical positions of the slides 126 are made to coincide. In the relatively high component mounting unit 100 of the support member 120, a spacer 150 having the same thickness as the spacer 122 is disposed between the guide block 124 and the X-axis slide 126, and the relatively low component of the support member 120. In the mounting unit 100, the X-axis slides 126 are directly attached to the guide block 124, so that the heights of all the X-axis slides 126 are matched.

  The reference mark camera 148 is a CCD camera and is supported vertically downward. An illumination device 152 that illuminates the surface of the printed wiring board 12 when the fiducial mark 146 is imaged is provided around the fiducial mark camera 148 in a ring shape. In the present embodiment, the reference mark camera 148 can also capture a calibration mark 160 described later.

  As shown in FIG. 1, the calibration mark 160 has a height that substantially matches the height of the surface between the component supply device 20 and the fixed frame 30 when the printed wiring board 12 is supported by the wiring board support device 42. Is provided. A plurality of calibration marks 160 are provided in parallel with the X-axis direction and at exactly constant intervals. Specifically, it is provided at the center of the imaging area of the reference mark camera 148 of each component mounting unit 100 in the transport direction and at a position on the boundary line that can be imaged by the adjacent component mounting unit 100. . Since the former is a calibration mark unique to each component mounting unit 100, it is referred to as a unique calibration mark 160b, and the latter is referred to as a common calibration mark 160a because it is a calibration mark common to two component mounting units 100 adjacent to each other. As will be described in detail later, the calibration marks 160 are imaged by the reference mark camera 148, whereby the relative positions between the component mounting units 100 are acquired and used to detect misalignment of the printed wiring board 12.

  Since the mounting head 144 is substantially the same as the configuration of the mounting head 144 described in Japanese Patent Application Laid-Open No. 7-45996, a brief description will be given. As shown in FIG. 5, the mounting head 144 includes a suction nozzle 170 as a component holder, a nozzle holder 172 that holds the suction nozzle 170, a holder lifting / lowering device 174, and a holder rotating device 176. The holder lifting / lowering device 174 moves the nozzle holder 172 in a vertical direction that is perpendicular to the horizontal XY coordinate plane, that is, lifts and lowers the nozzle holder 172 so as to approach and separate from the printed wiring board 12. It can also be called an approach / separation device. The holder rotating device 176 rotates the nozzle holder 172 around its vertical rotation axis.

  The holder lifting / lowering device 174 includes a lifting / lowering member 180 and a lifting / lowering member moving device 182 that are movable members provided on a bracket 178 fixed to the main body 142 so as to be movable in the vertical direction. The elevating member moving device 182 uses an elevating motor 184 as a drive source, and the rotation thereof is transmitted to a ball screw 192 that is a feed screw by a rotation transmitting device including a driving pulley 186, a driven pulley 188, and a driving belt 190. The ball screw 192 is provided on the main body 142 so as to be rotatable about the vertical axis and not movable in the axial direction, and is screwed to the elevating member 180 with a fixed nut 194, whereby the ball screw 192 is rotated. The elevating member 180 is moved up and down. The raising / lowering of the raising / lowering member 180 is guided by the guide rod 196 which is a guide member. The driving pulley 186 and the driven pulley 188 are constituted by timing pulleys, and the driving belt 190 is constituted by a timing belt.

  The nozzle holder 172 includes a rod 200, and the rod 200 is held by the elevating member 180 so as to be rotatable around a vertical axis and not relatively movable in the vertical direction. The holder rotation device 176 uses the rotation motor 202 as a drive source, and the rotation is transmitted to the rod 200 by a rotation transmission device including the drive gear 204 and the driven gear 206.

The suction nozzle 170 is detachably held at the lower end of the rod 200 protruding from the elevating member 180. When the rod 200 is rotated, the suction nozzle 170 is rotated about a vertical rotation axis. Further, the rod 200 is raised and lowered by raising and lowering the raising and lowering member 180, and thereby the suction nozzle 170 is raised and lowered. The suction nozzle 170 includes a suction pipe 210, and negative pressure is supplied from a negative pressure source (not shown) through a negative pressure path 212 formed in the rod 200, a negative pressure path formed in the elevating member 180, etc. To do. A circular reflecting plate 214 is attached to the adsorption tube 210. In the illustrated example, the suction nozzle 170 is provided on the side near the component supply device 20 of the X-axis slide 126.

  The electronic circuit component mounting system is controlled by a control device 240 conceptually shown in FIG. The control device 240 is provided corresponding to each component mounting unit 100 and controls the corresponding component mounting units 100 independently of each other. The control device 240 is mainly configured by a computer 250 having a CPU 242, a ROM 244, a RAM 246 and a bus 248 for connecting them. The computer 250 further includes an input / output interface 252, and is connected to various actuators such as the Y-axis servo motor 112 and the linear motor 128 via the drive circuit 260. The amount of rotation of the Y-axis servo motor 112, the lift motor 184, the rotation motor, etc. is detected by the encoder and supplied to the control device 240. However, the encoder 262 for detecting the rotation amount of the Y-axis servo motor 112 is representatively shown in the figure.

An origin detector 264 and a position detector 266 are provided for the linear motor 128, and the current position is detected and supplied to the control device 240. A reference mark camera 148 is further connected to the input / output interface 252 via a control circuit 270. The image data captured by the reference mark camera 148 is processed by the image processing computer 272, and the processing result is supplied to the control device 240. Further, a host computer 280 and a parts data generator (PDG) 282 are connected to the input / output interface 252.
Each of the host computer 280 and the parts data generator (PDG) 282 is connected to a control device 240 provided in each of the plurality of component mounting units 100 belonging to one group. Information regarding the component mounting unit 100, information regarding the printed wiring board 12, particularly the reference mark 146, and the like are exchanged with the computer 280 as necessary.
Furthermore, various programs such as a main program are stored in the ROM 244 and the RAM 246 of the computer 250, although not shown.

The operation of the electronic component mounting system configured as described above will be described.
Since many parts of the mounting operation are already well known, only those parts closely related to the present invention will be described in detail.
The printed wiring board 12 on which the component 16 is to be mounted is conveyed by the wiring board conveyor 14 and is stopped at a predetermined position by a stopping device. The printed wiring board 12 is positioned so that each part of the mounting area on which the component 16 on the printed wiring board 12 is to be mounted is located in the mounting area 102 of the mounting unit 100 associated in advance. Here, it is assumed that the printed wiring board 12 is positioned so as to correspond to each of the predetermined mounting regions 102 of the two component mounting units 100.

  Next, the wiring board support device 42 is raised to the operating position to support the printed wiring board 12. In this state, the mounting operation is performed by the component mounting apparatus 18. Prior to the operation of mounting the component 16 on the printed wiring board 12, the relative positions of the component mounting units 100 and the printed wiring board 12 are acquired. Wiring board position acquisition work is performed.

Here, two reference marks 146 are provided on the printed wiring board 12, and the reference marks 146 are positioned one by one in the imaging area of the reference mark camera 148 of the two component mounting units 100. It shall be. However, it is difficult to accurately obtain the positional deviation of the printed wiring board 12 with only the information based on one reference mark 146 for each component mounting unit 100. In particular, the rotational positional deviation with respect to the component mounting unit 100 is difficult. Can not get. Therefore, one reference mark 146 that can be imaged by the two reference mark cameras 148 is imaged on the common printed wiring board 12, and information on the positions of the reference marks 146 and 2 that are detected and stored in advance. Based on the information on the relative positions of the two component mounting units 100, the positional error of the printed wiring board 12 is acquired for each of the two component mounting units 100.

  First, a description will be given of a relative position detection routine as a kind of routine for obtaining information on the relative positions of adjacent component mounting units 100 in the electronic circuit component mounting system. This routine is performed when the assembly work of the electronic circuit component mounting system is completed or when maintenance and inspection are performed. You may make it acquire at other time, such as at the time of a daily start inspection, and when set time has passed. In this electronic circuit component mounting system, one small printed wiring board 12 can be positioned at a position corresponding to each component mounting unit 100 to perform the mounting operation of the component 16. The printed wiring board 12 may be positioned over the three or more component mounting units 100, and the three or more component mounting units 100 may simultaneously mount the component 16 on one printed wiring board 12. Although it is possible here, since it is assumed that one printed wiring board 12 is positioned at a position across two component mounting units 100, two components from the upstream side in FIG. When the mounting units 100 are grouped, and the component mounting units 100 of each group are simultaneously mounted on a single printed wiring board 12. There will be described.

First, a brief description will be given.
In the present embodiment, as described above, a plurality of calibration marks 160 are provided on the base 10. Among the calibration marks 160, the one provided on the boundary line of the imaging area of the reference mark camera 148 of the component mounting unit adjacent to each other is the common calibration mark 160a as described above, and a line connecting the common calibration marks 160a. A unique calibration mark 160b is provided in the center of each minute. When these calibration marks 160 are imaged, a unique position, which is the position of the calibration mark 160 on the unique coordinate plane, which is a unique coordinate plane for each reference mark camera 148, that is, each component mounting unit 100, is acquired.

  In general, between a plurality of component mounting units 100 adjacent to each other, not only a translational position error corresponding to a relative translation from a regular relative position in both horizontal planes, but also a regular relative in both horizontal planes. There is also usually a relative rotational position error corresponding to the relative rotation from the position. Therefore, in the present embodiment, the positions of the common calibration mark 160a and the unique calibration mark 160b that are obtained one by one by the reference mark camera 148 of each component mounting unit 100 are set as a pair of calibration mark positions and adjacent to each other. Based on the relative position error between the calibration mark pairs of the product mounting unit 100 to be processed, the amount of the translational position error and the relative rotational position error between the plurality of component mounting units 100 representing the relative position of the plurality of component mounting units 100 Obtained as a kind of.

Therefore, here, one common calibration mark 160a and one unique calibration mark 160b are respectively imaged by the reference mark cameras 148 of the two component mounting units 100 that are grouped, and the acquired image data is image processing computer 272. And the image processing is performed to obtain the unique positions of the respective pairs of the common calibration mark 160a and the unique calibration mark 160b on the unique coordinate plane unique to each reference mark camera 148. Then, the unique positions of the common calibration mark 160 a and the unique calibration mark 160 b acquired for one component mounting unit 100 are supplied to the control device 240 of the other component mounting unit 100. Similarly, the unique positions of the common calibration mark 160 a and the unique calibration mark 160 b acquired for the other component mounting unit 100 are also supplied to the control device 240 of the one component mounting unit 100. Then, in the control device 240 of each component mounting unit 100, the unique positions of the common calibration mark 160 a and the unique calibration mark 160 b acquired by itself, and the common calibration mark 160 a and the unique calibration mark 160 b supplied from the other control device 240. Based on the specific position, the translation position error and the relative rotational position error of the specific coordinate plane of the other component mounting unit 100 with respect to the specific coordinate plane of each component mounting unit 100 are determined between a plurality of specific coordinate planes, that is, a plurality of specific coordinate planes. This is acquired as a kind of quantity representing the relative position between the component mounting units 100.

Hereinafter, the relative position detection routine will be described in detail based on the flowchart shown in FIG.
The relative position detection routine is executed in response to an operation member of an operation device (not shown) being operated by an operator. Since this routine is executed in the same manner in the control device 240 of each component mounting unit 100, the first component mounting unit 100, which is one of the two component mounting units 100 that form a group, will be representatively described below. .

  First, in step S1 (hereinafter simply referred to as S1, the same applies to other steps), it is determined whether or not the flag F1 is zero. In the execution of the program this time, since the flag F1 has an initial value of 0, the determination in S1 is YES, and the process proceeds to S2, where the common calibration mark 160a and the unique calibration mark 160b are imaged. Next, in S <b> 3, the unique positions of the calibration marks 160 a and b with respect to the component mounting units 100 are acquired based on the image data of the calibration marks 160 a and b acquired by imaging. As shown in FIG. 9, the unique positions (X12, Y12), (X11, Y11) of the common calibration marks 160a, 160 with respect to the first component mounting unit 100 are acquired. Information regarding this unique position is stored in the RAM 246 and supplied to the host computer 280, and further supplied from the host computer 280 to the control device 240 of another component mounting unit 100 belonging to the same group. In the control device 240 of the other component mounting unit 100, the unique positions (X12, Y12) and (X11, Y11) of the supplied common calibration marks 160a, 160b are stored in the RAM 246 by interruption processing. In S4, the flag F1 is set to 1, and thereafter, the execution of this relative position detection routine is repeated until acquisition of the relative position of the second component mounting unit 100 with respect to the first component mounting unit 100 is completed. Or the execution of S4 is skipped.

Next, in S5, it is awaited that information regarding the unique positions of the common calibration mark 160a and the unique calibration mark 160b acquired in the second component mounting unit 100, which is the other component mounting unit belonging to the same group, is waited for. In the second component mounting unit 100, as in the first component mounting unit 100, the relative position detection routine is executed. Therefore, the specific positions (X21, Y21) and (X) of the common calibration mark 160a and the specific calibration mark 160b If X22, Y22) is acquired, the information should be supplied to the controller 240 of the first component mounting unit 100 via the host computer 280. In the execution of the program this time, if the information on the specific positions of the calibration marks 160a and 160b is not supplied, the determination in S5 is NO and one execution of this program is completed. On the other hand, if the information on the unique position is supplied, and if the information is acquired, the determination in S5 is YES, and the process proceeds to S6, and the unique coordinates for the two unique coordinate planes of the two pairs of calibration marks 160a and 160b are obtained. Based on the positions (X12, Y12), (X11, Y11) and (X21, Y21), (X22, Y22), the relative positions of the two unique coordinate planes are acquired. Among the unique positions, (X12, Y12) and (X21, Y21) are the coordinates on the unique coordinate plane of the first and second component mounting units 100 of the same common calibration mark 160a, respectively, and supply calibration marks. Since the 160a and the two unique calibration marks 160b are provided on the straight line at a known interval as described above, the relative position between the unique coordinates of the two component mounting units 100 can be acquired.

  The acquired relative position between the unique coordinates is a value representing the relative position of the second component mounting unit 100 with respect to the first component mounting unit 100, and the rewritable portion of the ROM 244 or the backup portion of the RAM 246, that is, the present electronic circuit component. The voltage is stored in the portion where the voltage continues to be applied even when the mounting system is powered off. Thereafter, in S7, an end process such as returning each value to an initial value is executed, and a series of executions of the program ends. This program is executed in each control device 240 of each component mounting unit 100. Once the relative position between the unique coordinate planes is acquired, the same value is used until the calibration marks 160a and 160b are next imaged and the relative position between the component mounting units 100 is acquired.

Next, a position error detection routine for the printed wiring board 12 will be described. First, a brief description will be given.
The printed wiring board 12 is carried into the system by the wiring board conveyor 14 and positioned over the mounting area of the two component mounting units 100 forming a group. In this state, one reference mark 146 is positioned in the imaging area of each component mounting unit 100. Each component mounting unit 100 images each of the reference marks 146 that can be imaged by the reference mark camera 148, and acquires the specific position of the reference mark 146 based on the image data obtained by the imaging. Information related to the specific position of the reference mark acquired by the first component mounting unit 100 is supplied to the control device 240 of the second component mounting unit 100 via the host computer 280. Similarly, information acquired by the second component mounting unit 100 and related to the unique position of the reference mark is supplied to the control device of the first component mounting unit 100. Based on the specific position of the two reference marks 146 and the relative position of the component mounting units 100 acquired and stored in advance, the positional deviation of the printed wiring board is detected. Hereinafter, of the two reference marks 146 provided on the printed wiring board 12, the one located in the imaging area of the first component mounting unit is positioned in the imaging area of the first component mounting unit 146. This is called the second reference mark 146.

  The position error detection routine will be specifically described based on the flowchart shown in FIG. This position error detection routine is executed by each of the first and second component mounting units 100 every time the printed wiring board 12 is carried in. Since the respective operations are the same, the first component mounting unit 100 is hereinafter described. Will be described representatively. In the main program, the transfer operation of the printed wiring board 12 is monitored, and if it is detected that the printed wiring board 12 is positioned at a predetermined position, execution of this routine is instructed.

First, in step S11, it is asked whether or not the flag F2 is zero. In the execution of the program this time, since the flag F2 is the initial value 0, the determination in S11 is YES. Proceeding to S12, it is instructed to image the reference mark 146, and an image of the first reference mark 146 is acquired by imaging. Next, proceeding to S13, the unique position of the first reference mark 146 is acquired based on the image data, stored in the RAM 246, and information on the position is supplied to the control device 240 of the second component mounting unit 100. . In S14, the flag F2 is set to 1, and thereafter, the execution of S11 to S14 is skipped until the position error of the printed wiring board 12 with respect to the first component mounting unit is acquired. In S15, it is awaited that information regarding the position on the unique coordinate plane of the second reference mark 146 imaged by the second component mounting unit 100 is supplied. In the second component mounting unit 100 as well, as in the case of the first component mounting unit 100, the operation of acquiring the position of the second reference mark 146 is performed in parallel. The information regarding the specific position of the second component mounting unit 100 of the second reference mark 146 is awaited to be supplied to the first component mounting unit 100. Here, the unique position of the first fiducial mark 146 is (X
13 and Y13), and the unique position of the second reference mark 146 is (X23, Y23). While the information on the specific position of the second reference mark 146 is not supplied to the first component mounting unit 100, the determination in S15 is NO, S16 to S18 are skipped, and one execution of this program ends. Thereafter, if the unique position of the second reference mark 146 is supplied while the execution of this program is repeated, the determination in S15 is YES, and the process proceeds to S16, where the first component mounting unit 100 of the second reference mark 146 is obtained. A virtual position (X23 ′, Y23 ′) that is a position on the unique coordinate plane is calculated. Specifically, the virtual position (X23 ′, Y23 ′) is acquired based on the previously acquired relative position of the first and second component mounting units 100 and the unique position of the second reference mark 146.

  In S17, the relative position of the printed wiring board 12 with respect to the first component mounting unit 100 based on the unique position (X13, Y13) of the first reference mark 146 and the virtual position (X23 ′, Y23 ′) of the second reference mark 146. Is calculated, and the mounting position of the component 16 set in advance on the printed wiring board 12 is corrected based on the relative position. The acquisition of the relative position and the mounting position correction amount of the printed wiring board 12 is already well known and will not be described in detail. For example, the specific position (X13, Y13) of the first reference mark 146 and the second reference Based on the virtual position (X23 ′, Y23 ′) of the mark 146, the relative position of the wiring board virtual coordinate plane virtualized by the printed wiring board 12 with respect to the unique coordinate plane of the first component mounting unit 100 is calculated. Based on the above, the component mounting position is calculated. The wiring board virtual coordinate plane is set on a regular printed wiring board having no dimensional error when a dimensional error caused by expansion and contraction of at least one of the X-axis direction and the Y-axis direction of the printed wiring board 12 can be ignored. In this case, the translation position error and the relative rotation position error with respect to the unique coordinates of the first component mounting unit 100 on the wiring board reference coordinate plane are calculated. However, if the dimensional error of the printed wiring board 12 cannot be ignored, it is necessary to consider the expansion and contraction of at least one of the X axis and the Y axis that define the wiring board reference coordinate plane. become. In any case, the correction amount of the component mounting position set in each part on the printed wiring board 12 is coordinate conversion corresponding to each of the above-described cases with respect to each component mounting position on the wiring board reference coordinate plane. It can be calculated by applying Finally, in S18, an end process such as returning the flag F2 to the initial value 0 is performed, and a series of executions of the program ends.

Later, the component 16 is mounted while the component mounting position correction amount acquired as described above is being corrected. In the present embodiment, in addition to the above correction, correction for reducing the holding position error of the component 16 by the mounting head 144 is also performed. However, since this is not directly related to the present invention, description regarding this correction is omitted.
Although the first component mounting unit 100 has been described above, the component mounting position is corrected in the same manner for the second component mounting unit. Therefore, using the mounting program including the mounting position of the component 16 on the printed wiring board 12, the first and second component mounting units 100 can be mounted in parallel at the same time.

  As is clear from the above description, in the electronic circuit component mounting system, the reference mark 146 forms a “wiring board reference portion”, and the reference mark camera 148 forms a “recognition device”.

According to this component mounting system, when the component 16 is mounted on the printed wiring board 12 having a size that extends over the mounting region of the two component mounting units 100, the mounting region (imagingable region) of each component mounting unit 100 is used as a reference. If one mark 146 is provided, the translation position error and the relative rotation position error of the printed wiring board 12 are detected by referring to the information regarding the position of the reference mark 146 acquired by the other component mounting unit 100. Thus, the component 16 can be mounted with high accuracy. Therefore, it is not essential to increase the positioning accuracy of the printed wiring board 12, and an increase in equipment cost can be suppressed. Furthermore, since the number of reference marks 146 to be provided on one printed wiring board 12 is small, and the arrangement position of the reference marks 146 may be any position within each imaging region, the printed circuit board is designed. The effect of improving the degree of freedom in doing is obtained.

  In the present embodiment, the relative position between the component mounting units 100 is actually detected. However, when the relative position error is so small that it can be ignored, the component mounting units 100 are not connected to each other. It is not indispensable to detect the relative position, and the setting value of the relative position between the component mounting units 100 stored in the memory may be read and used.

Even when the relative positions between the component mounting units 100 are actually detected, the detection work may be performed at a timing different from that of the present embodiment. For example, the transport work of the printed wiring board 12 is performed. May be performed each time. In the latter case, for example, it may be performed prior to imaging the reference mark 146 of the printed wiring board 12 or after the execution thereof, or after the specific position of the reference mark 146 is acquired. May be.
Furthermore, in order to detect the relative positions between the component mounting units 100, a physical measuring machine such as a laser measuring machine may be used outside the system without providing the calibration mark 160.

  In addition, one common control device may be provided for the plurality of component mounting units 100, and the above routine may be executed for each of the component mounting units 100. In the above-described embodiment, each control device 240 is connected to the host computer 280, and information regarding the specific position acquired in each component mounting unit 100 is supplied to the host computer 280, and one group from the host computer 280. Information is supplied to the other component mounting units 100 belonging to the above, but the information may be directly supplied between the control devices 240 without providing the host computer 280.

Another embodiment of the electronic circuit component mounting system will be described with reference to FIGS.
Although this system is partially different with respect to the components of the component mounting unit, the other components are almost the same as the system in the above-described embodiment. Therefore, common elements are described by using common reference numerals. Will be omitted and only different parts will be described in detail.

  The component mounting unit 300 in this system includes a unit main body 104 extending in the Y-axis direction as in the above embodiment, and a ball screw 106 serving as a feed screw along the Y-axis direction is disposed on the lower surface of the unit main body 104. . As the ball screw 106 is rotated by a Y-axis servo motor 112 as a drive source, the Y-axis slide 302 is guided by the guide rail 304 and moves. The Y-axis slide 302 is screwed to the ball screw 106 by a nut (not shown) and is fitted to the guide rail 304 via a pair of guide blocks 306 so as to be relatively movable.

  The Y-axis slide 302 has an L-shaped cross section, is a horizontal plate, and is supported by the guide block. The first part 308 extends downward from one end of the first part 308. Two parts 310. A turning device 312 is attached to the lower surface of the first part 308 to support the mounting head 144 so as to be turnable around the vertical axis.

The turning device 312 includes a turning member 314 and a driving device 316 that turns the turning member 314. The rotating member 314 is fixed to the disk-shaped supported portion 318, the shaft portion 320 extending below the supported portion 318 along the rotation axis, and the lower end portion of the shaft portion 320, and is fixed to the unit main body 104.
A plate-like rotation part 322 that is narrower and narrower than the width is integrally formed. The rotation member 314 is rotatably supported by a support member 324 attached to the lower surface of the first part 308 in the supported portion 318. The rotating portion 322 has one end surface in the longitudinal direction (right end surface in the drawing) as a partial cylindrical surface centered on the rotation axis and a plurality of teeth, and one end portion of the rotating portion 322 is a sector gear. 326.

  On the other hand, the driving device 316 includes a turning motor 328 held by the second portion 310 of the Y-axis slide 302, and is rotated by a so-called scissors gear 330 in which a pair of spur gears are combined and given a relative rotational moment by an elastic member. The rotation is transmitted to the sector gear 326 of the moving member 314. Thereby, the rotation member 314 can be rotated only within a certain angle range. The turning motor 328 is a servo motor that is a kind of electric motor that can accurately control the amount of rotation, and can rotate both in the forward direction and in the reverse direction.

  A rotating body 340 is attached to an end portion of the rotating portion 322 opposite to the sector gear 326 side so as to be rotatable around a vertical axis. The rotating body 340 includes a cylindrical main body portion 342 and a pair of arm portions 344 and 346 extending along one diameter thereof, and is rotated by a switching motor 348 serving as a driving source. A support portion 349 extending downward from the lower surface of the rotation member 314 is provided, and the switching motor 348 is fixedly supported by the support portion 349, and around the vertical axis as the rotation member 314 rotates. Can be swiveled. A driving pulley 350 is provided in the switching motor 348, and the rotation is transmitted to a driven pulley 354 provided in the rotating body 340 via the timing belt 352.

  A mounting head 144 and a reference mark camera 148 are respectively attached below the pair of arm portions 344 and 346. The mounting head 144 and the reference mark camera 148 are configured such that the distances from the rotation center of the rotating body 340 to the respective center of gravity are substantially equal. Note that the configurations of the mounting head 144 and the reference mark camera 148 are substantially the same as in the above-described embodiment, and thus the description thereof is omitted.

  Further, the support unit 349 is fixedly provided with a positioning device 360 for positioning the rotational direction position of the rotating body 340, and the arm 344 and 346 of the rotating body 340 are arranged in the longitudinal direction of the rotating member 314. Position in a state extending in a parallel direction. Since the rotation member 314 is normally held in a state extending in parallel to the Y-axis direction, the arm portions 344 and 346 are also positioned in a state parallel to the Y-axis direction. As a result, when the rotating member 314 is rotated by the driving device 316, the arm portion 344 of the rotating body 340 is integrally rotated, so that the mounting head 144 or the reference mark camera 148 positioned at the working position is moved. The rotating member 314 is turned around the rotation center.

  The positioning device 360 includes a solenoid 362 and an engagement pin 364 that protrudes in a horizontal direction from an end surface of the solenoid 362 facing the rotating body 340, and the engaging pin 364 protrudes toward the rotating body 340. Is being energized. On the other hand, positioning holes 366 that engage with the engaging pins 364 are formed in the distal end surfaces of the arm portions 344 and 346, respectively. The engaging pin 364 always engages with the positioning hole 366 of the arm part 344 or the arm part 346 to fix the rotating body 340 to the rotating member 314. However, the positioning hole is obtained when the solenoid 362 is excited. The rotating body 340 is allowed to be rotated by the driving device 316 by separating from the 366. The tip of the engagement pin 364 is a tapered portion having a tapered outer peripheral surface, and the positioning hole 366 is a tapered hole having a tapered inner peripheral surface, so that the rotating body 340 is accurately positioned at a fixed rotational position. The In this state, the current supply to the switching motor 348 is stopped.

As a result, the mounting head 144 and the reference mark camera 148 are either at a work position that is a positioning position far from the rotation center of the rotating member 314 or a standby position that is a positioning position near the rotation center. Is selectively positioned. Of the mounting head 144 and the reference mark camera 148, the one located at the operating position is switched. The rotating body 340, the switching motor 348, and the positioning device 360 cooperate with each other to mount the mounting head 144 and the reference mark camera 148. A switching device 368 for switching between the above is configured.

  Also in this component mounting system, each component mounting unit 300 is controlled by an individual control device 370, but the relative position between a plurality of component mounting units 300 belonging to a group is detected, and each of the component mounting units 300 is detected. The positioning error of the printed wiring board 12 is performed in the host computer 280 common to all the component mounting units 300. Each control device 370 is composed mainly of a computer 250 having a CPU 242, a ROM 244, a RAM 246 and a bus 248 for connecting them, as in the control device 240 described above, and is connected to an input / output interface 252 via a drive circuit 260. Various actuators such as the Y-axis servo motor 112, the turning motor 328, and the switching motor 348 of each component mounting unit 300 are connected. Further, a reference mark camera 148 is connected to the input / output interface 252 via the control circuit 270, and image data acquired by imaging is processed by the image processing computer 272 and supplied to the computer 250. The ROM 244 or the RAM 246, which is a memory of the computer 250, stores various programs including the main program, data related to the printed wiring board 12 and the component 16, and the like, although not shown. Further, a host computer 280 and a parts data generator (PDG) 282 are connected to the input / output interface 252, and supplies information and programs related to the printed wiring board 12 and the parts 16 to the control device 370 as necessary. Each of the host computer 280 and the part data generator (PDG) 282 is connected to a control device 370 provided in each of a plurality of component mounting units 300 belonging to a group, and the host computer 280 and the plurality of control devices 370 are connected. Various data and commands are sent and received between them.

  The operation of the electronic circuit component mounting system having the above configuration will be described. Since many parts of the operation are the same as those in the above-described embodiment, a brief description will be given, and only different parts will be described in detail.

  Also in this component mounting system, components are mounted on a printed wiring board whose mounting area is smaller than the mounting area of one component mounting unit 300 or a printed wiring board having a size that spans the mounting area of two component mounting units 300 However, the case where the component 16 is mounted on the printed wiring board 12 having a size that covers the three component mounting units 300 will be described below.

  In the present embodiment, the reference mark camera 148 is determined in advance in a state where the reference mark camera 148 is positioned at the work position every time the system is operated for a certain period of time, in addition to the maintenance inspection and the change of the type of the printed wiring board 12. For each group of a plurality of component mounting units 300, the relative position between the component mounting units 300 is detected. The relative position change between the component mounting units 300 due to the thermal expansion of each component of the system is also detected. When the printed wiring board 12 is carried into the component mounting system, a positional error of the printed wiring board 12 with respect to each of the component mounting units 300 is detected prior to the start of the component mounting operation. Thereafter, the switching motor 348 is operated so that the mounting head 144 is positioned at the work position, and the reference mark camera 148 is positioned at the standby position, and a mounting operation for mounting the component 16 on the printed wiring board 12 is executed. Is done. Hereinafter, it demonstrates in order.

When detecting the relative position between the component mounting units 300, it is first confirmed that the reference mark camera 148 is positioned at the work position. In this embodiment, the reference mark camera 148 should be positioned at the working position when the system is started. On the other hand, when the relative position between the component mounting units 300 is detected between the component mounting operations, depending on the case, which of the reference mark camera 148 and the mounting head 144 is positioned at the work position. Therefore, when the current position of the reference mark camera 148 is detected and is at the standby position, the switching device 368 rotates the rotating body 340 so that the reference mark camera 148 is moved to the work position. Positioned. Which of the reference mark camera 148 and the mounting head 144 is positioned at the work position is detected by the encoder of the switching motor 348 in the present embodiment. For example, a detected portion provided on the rotating body 340 is detected. It is also possible to detect which is in the working position by detecting with a photoelectric sensor such as a reflection type or a transmission type.

  In a state where the reference mark camera 148 is positioned at the work position, the reference mark camera 148 can be moved to an arbitrary position in the imaging region by the movement of the Y-axis slide 302 and the rotation of the rotation member 314. Therefore, as in the above-described embodiment, the calibration mark 160 provided on the base 10 is imaged, the image data is supplied to the image processing computer 272, and the position of the calibration mark 160 obtained by processing the image data. Are supplied to the control device 370. Based on this data, the control device 370 acquires a relative position between the component mounting units 300. A unique coordinate plane is set for each component mounting unit 300, and a relative position between the unique coordinate planes is acquired. The operation for acquiring the relative position will be described in detail later.

  If the printed wiring board 12 is carried in, the reference mark 146 located in each imaging area is imaged by the reference mark camera 148 before the component mounting operation is started, and the positional deviation of the printed wiring board 12 with respect to the component mounting unit 300 is detected. Is detected. Since this work is the same as the work in the above-described embodiment, detailed description is omitted, but the image processing computer 272 acquires the position of the image of the reference mark 146 captured by each reference mark camera 148. At the same time, it is supplied to the control device 370. In the control device 370, for each component mounting unit 300, with respect to each component mounting unit 300 of the printed wiring board 12 based on the position of the reference mark 146 and the virtual position of the reference mark 146 of the other component mounting unit 300. A correction amount of the position error and the component mounting position is acquired. Thereafter, the switching motor 348 is rotated to position the mounting head 144 at the work position, and the reference mark camera 148 is positioned at the standby position. In this state, a mounting operation for mounting the component 16 on the printed wiring board 12 is performed. As with the fiducial mark camera 148, the mounting head 144 is positioned at the correction component mounting position by the movement of the Y-axis slide 302 and the rotation of the rotating member 314, and the component 16 is mounted on the printed wiring board 12.

  Hereinafter, the relative position detection will be specifically described based on the flowchart shown in FIG. Here, for simplification of explanation, it is assumed that the relative rotational position error between the component mounting units 300 is negligible and only the translational position error is detected. This relative position detection routine is executed independently by the host computer 280 for each group to which the plurality of component mounting units 300 belong.

In S51, it is asked whether or not the reference mark camera 148 is at the work position. Information is requested from the host computer 280 to the computer 250 of each component mounting unit 300, and in response to the request, the computer 250 detects the state in each component mounting unit 300, and the fiducial mark camera 148 moves to the working position in the host computer 280. Information on whether or not it is in is supplied. If there is a group of component mounting units 300 whose relative positions are to be detected this time and the reference mark camera 148 is not at the work position, the determination in S51 is NO, and the process proceeds to S52 to respond from the host computer 280. The computer 250 is instructed by the switching device 368 that the positions of the mounting head 144 and the reference mark camera 148 should be changed, and the reference mark camera 148 is positioned at the work position by the computer 250 accordingly. On the other hand, when all the reference mark cameras 148 are at the work position, the determination in S51 is YES, and the process proceeds to S53. In S52, it is possible to instruct each computer 250 from the beginning that all the reference mark cameras 148 should be positioned at the work positions. In S53, the common calibration mark 160a is imaged by each reference mark camera 148, and the position of the common calibration mark 160a should be detected on the basis of the imaging result for each of the plurality of component mounting units 300 belonging to each group. Instructed. In response to this instruction, in each component mounting unit 300, the first component mounting unit 300 disposed upstream in the transport direction, the second component mounting unit 300 adjacent to the downstream side, and the second component mounting unit 300, The common calibration marks 160a provided between the third component mounting unit 300 located on the most downstream side are sequentially imaged. Thereby, interference of the reference mark cameras 148 between the component mounting units 300 adjacent to each other is avoided. For example, the common calibration mark 160a is imaged sequentially from the component mounting unit 300 located on the upstream side.

  Here, for simplification, the second component mounting unit 300 images the common calibration mark 160a on both sides, and the first and third component mounting units 300 image the common calibration mark 160a on the second component mounting unit 300 side. However, in practice, it is also possible to detect the unique calibration mark 160b unique to each component mounting unit 300 together with them, in which case the first to third components are detected. It is possible to detect the relative position in consideration of the relative rotational position error between the mounting units 300. Although illustration is omitted, it is possible to set so that the unique calibration mark 160b is also detected in a routine higher than the relative position detection routine. The imaging result is sent to the image processing computer 272, where the position of the common calibration mark 160 a on the unique coordinate plane of each component mounting unit 300 is acquired and supplied to the host computer 280 via the computer 250. Thereafter, in S54, it is determined whether or not the positions of all calibration marks 160 (here, all common calibration marks 160a) have been acquired. If they have not yet been acquired, S55 and 56 are skipped and executed once. However, if it has been acquired, the relative position acquisition in S55 is executed.

In S55, as shown in FIG. 13, the unique position of the common calibration mark 160 common to the first and second component mounting units 300 is the unique position (AX1, AY1) for the first component mounting unit 300. For the second component mounting unit 300, it is acquired as a unique position (AX2, AY2). In addition, the unique position of the common calibration mark 160 common to the second and third component mounting units 300 is the unique position (BX2, BY2) for the second component mounting unit 300, with respect to the third component mounting unit 300. Is acquired as the unique position (BX3, BY3). Based on these, in S55, a relative position error between the first to third component mounting units 300 (here, a translation position error) is acquired. Specifically, the position error of the proper position (previously stored) of the unique position (AX1, AY1) of the common calibration mark 160 with respect to the first component mounting unit 300 is acquired as (ΔAX1, ΔAY1). The position error of the common position (AX2, AY2) of the common calibration mark 160 with respect to the normal position of the common calibration mark 160 with respect to the second component mounting unit 300 of the same common calibration mark 160 is acquired as (ΔAX2, ΔAY2), and the difference between the two position errors ( The relative position error of the second component mounting unit 100 with respect to the first component mounting unit 100 is acquired as ΔAX2-ΔAX1, ΔAY2-ΔAY1). Similarly, the relative position error of the third component mounting unit 100 with respect to the second component mounting unit 100 is acquired as (ΔBX3-ΔBX2, ΔBY3-ΔBY2). Based on these two relative position errors, the relative position errors of the third component mounting unit 100 with respect to the first component mounting unit 100 are (ΔBX3-ΔBX2- (ΔAX2-ΔAX1), ΔBY3-ΔBY2- (ΔAY2-ΔAY1). ). The relative position error between the first to third component mounting units 100 is a kind of quantity representing the relative position between these component mounting units.
If the relative position is acquired as described above, the execution of this program ends after the end process of S56 is performed.

  Thereafter, the component mounting operation is started, the printed wiring board 12 is carried in by the wiring board conveyor 14, and the reference mark 146 is imaged by the reference mark camera 148 of each component mounting unit 300. The unique position of the reference mark 146 is acquired, and the positioning error for each of the first to third component mounting units 300 of the printed wiring board 12 is acquired based on the acquired unique position and the above-described relative position error. . The component mounting positions of the component 16 mounted by each of the first to third component mounting units 300 are the positioning error of the acquired printed wiring board 12, the second and third components relative to the first component mounting unit 300. Correction of the difference in the normal position of the component mounting unit 300, the acquired relative position error of the second and third component mounting units 300 with respect to the first component mounting unit 300, and the holding position error of the component 16 by the mounting head 144 Is performed, and mounting is performed. Therefore, it is possible to cause the three component mounting units 300 to perform the component mounting operation using the mounting program including the component mounting position set for the printed wiring board 12 as it is.

  At an appropriate time after the imaging of all the calibration marks 160 is completed, the position of the reference mark camera 148 and the mounting head 144 is changed by the switching device 368 in each component mounting unit 300 so that the mounting head 144 is moved. Positioned at the working position. Then, after the component mounting position is corrected, the component 16 is mounted.

  In the present embodiment, the host computer 280, which is a computer common to the plurality of component mounting units 300, includes all the relative positions of the plurality of component mounting units 300, the positioning error of the printed wiring board 12, and the correction of the component mounting positions. However, at least one of these can be performed by the computer 250 dedicated to each component mounting unit 300. In particular, it is effective that the component mounting position is corrected by the computer 250. Conversely, the image processing computer 272 is provided exclusively for each of the plurality of component mounting units 300, but may be shared by the plurality of component mounting units 300.

FIG. 14 shows a component mounting system 400 according to another embodiment.
Also in the present system 400, the wiring board conveyor 14 and the component supply device 20 are provided on the base 410, and a plurality of component mounting units 412 are provided side by side at a constant arrangement pitch in the conveyance direction of the printed wiring board 12. ing.

  As shown in FIGS. 15 and 16, the component mounting unit 412 includes an XY robot 442 as an XY moving device. The XY robot 442 is supported by a support 444 and held by a frame 446 disposed above the base 410. A pair of guide rails 448 are fixed to the lower surface of the frame 446 in parallel with the Y axis direction, and a Y axis slide 452 is movably fitted in the guide block 450. The nut 454 of the Y-axis slide 452 is screwed into a ball screw 456 which is a feed screw extending in the Y-axis direction, and the ball screw 456 is rotated by a Y-axis servo motor 458 (see FIG. 17) which is a drive source. The slide 452 is moved in the Y axis direction. The nut 454, the ball screw 456, the Y-axis servo motor 458, and the like constitute a Y-axis slide drive device, and the guide rail 448 and the guide block 450 constitute a guide device that guides the movement of the Y-axis slide 452.

An X-axis slide 460 is provided on the Y-axis slide 452 so as to be movable in the X-axis direction orthogonal to the Y-axis direction in the horizontal plane. A ball screw 462, which is a feed screw extending in the X-axis direction, is attached to the lower surface of the Y-axis slide 452, and the X-axis slide 460 is screwed with a nut (not shown), and the ball screw 462 is connected to the X-axis servo motor 464. The X-axis slide 460 is guided by the guide rail 466 and moved in the X-axis direction. The ball screw 462, the nut, the X-axis servo motor 464, and the like constitute an X-axis slide drive device, and the guide rail 466 and the like constitute a guide device that guides the movement of the X-axis slide 460. The Y-axis slide 452, the X-axis slide 460, the Y-axis slide drive device, the X-axis slide drive device, and each guide device constitute an XY robot 442.

  The mounting head 144 and the reference mark camera 148 are held on the X-axis slide 460, and are moved to an arbitrary position in the horizontal plane by the XY robot 442. Since the mounting head 144 and the reference mark camera 148 are the same as those in the above-described embodiments, detailed illustration and description thereof will be omitted.

  As shown in FIG. 14, the mounting heads 144 of the plurality of component mounting units 412 are moved to arbitrary positions in the mounting region 470 where the components 16 can be mounted, and are conveyed by the wiring board conveyor 14. A predetermined component 16 is mounted on the printed wiring board 12 at a predetermined mounting position on the printed wiring board 12 according to a mounting program. In the present system 400, the mounting regions 470 of the component mounting units 412 adjacent to each other are arranged with a gap, and in the illustrated example, the spacing between the mounting regions 470 is the same as or slightly the width of the mounting region 470. It is narrowed to.

  The system 400 includes a plurality of control devices 500 shown in FIG. 17, and each work of the component mounting unit 412 is controlled. Since the configuration of these control devices 500 is almost the same as that of the control devices 240 and 370 in the above-described embodiment, it will be briefly described. They are directly connected, and information can be supplied between the control devices 500.

  In this embodiment, the component mounting units 412 are arranged without gaps, but their mounting regions 470 are arranged so as not to overlap each other, and are arranged with a gap in the transport direction. Since the width in the transport direction of the imaging region is the same as that of the mounting region 470, the relative position between the component mounting units 412 cannot be acquired by imaging the common calibration mark 160a as in the above-described embodiments. . Therefore, in the present embodiment, the relative displacement between the component mounting units 412 is detected using the reference plate 510.

  The reference plate 510 is made of glass and has a size that spans the mounting areas 470 of the plurality of component mounting units 412 as shown in FIG. The reference plate 510 is formed to have a size that spans a plurality of component mounting units 412 belonging to a group in which the components 16 are simultaneously mounted on one printed wiring board 12. Here, the mounting area of the two component mounting units 412 is used. The size spans 470. A plurality of reference marks 514 serving as a reference portion are provided in an area to be imaged 512 that is a portion facing the imaging area on the reference plate 510. In the illustrated example, two fiducial marks 514 are provided on the diagonal line in the imaged area 512. The reference mark 514 desirably has a clear contrast with the background glass. For example, it is desirable that the reference plate 510 be white and the reference mark 514 be black. The shape of the reference mark 514 can be various shapes such as a circle, a triangle, a rectangle, and a cross, and the color is not limited to black.

  An operation for detecting the relative position between the component mounting units 412 using the reference plate 510 configured as described above will be described. This relative position detection operation is also performed when the assembly of the system 400 is completed, at the time of maintenance inspection, at the start-up, or when a certain period of time has elapsed (including every assembly of a certain number of printed wiring boards), as in the above-described embodiment. Can be.

  First, a brief description will be given. When the reference plate 510 is supplied to the wiring board conveyor 14 by an operator or automatically and the execution of the relative position detection routine is instructed, a plurality of (two in the illustrated example) parts of the reference plate 510 belong to a group. It is transported to a position corresponding to the mounting unit 412 and positioned. If the reference plate 510 is positioned so that the imaged area 512 on the downstream side of the reference plate 510 faces the downstream of the two component mounting units 412 belonging to the group, the other component mounting unit. 412 is also manufactured so that the imaged area 512 provided with the reference mark 514 is opposed.

  When the reference mark 514 is imaged by the reference mark camera 148 of each component mounting unit 412, the unique position of the reference mark 514 with respect to the component mounting unit 412 is acquired and the information is used as a control device for the other component mounting unit 412. 470. In each control device 500, information regarding the reference plate 510 is stored in advance, and the relative position between the reference marks 514 on one reference plate 510 is known. Therefore, the virtual position of the reference mark 514 located outside the imaging area can be acquired based on the specific positions of some of the reference marks 514 acquired by imaging. The virtual position is associated with the unique position supplied from the other control device 470, and the relative position between the component mounting units 412 is calculated based on the virtual position. Hereinafter, a detailed description will be given based on the flowchart shown in FIG.

  If execution of the relative position detection routine is instructed in the main program, first, in S101, it is asked whether or not the flag F4 is zero. In the execution of the program this time, since the flag F4 is the initial value 0, the determination in S101 is YES, and the process proceeds to S102 to instruct that the reference plate 510 should be carried into the component mounting system 400. Next, in S103, it is awaited that the reference plate 510 is positioned at a position corresponding to the group of component mounting units. If the reference plate 510 is positioned so that the imaged area 512 provided with the reference mark 514 of the reference plate 510 is opposed to each component mounting unit 412, the determination in S103 is YES, and the process proceeds to S104 to proceed to the flag F4. Is set to 1. Thereafter, S102 to S104 are skipped.

  Next, in S105, it is asked whether or not the flag F5 is 0. If the flag F5 is the initial value 0, the determination in S105 is YES, and the process proceeds to S106. In S <b> 106, the reference mark camera 148 of each component mounting unit 412 issues an instruction to image the nth reference mark 514 provided in each imaged region 512 on the reference plate 510. In the illustrated example, two reference marks 514 are provided in each of the imaged areas 512, and these are sequentially imaged by the reference mark camera 148. In the execution of the program this time, the number n is set to the initial value 1, so that the first reference mark 514 is imaged. The image data acquired by the imaging operation is sent to the image processing computer 272 in S107, the position of the reference mark 514 is acquired by image processing, and is supplied to the computer 250 of the control device 500. In S108, 1 is added to the number n to obtain a new number n. In S109, it is asked whether or not the number n is larger than a preset set value N (2 in the present embodiment). Since the number n is 2 in the execution of this program, the determination in S109 is NO, and one execution of this program is completed. S106 to S109 are repeatedly executed until all the reference marks 514 are imaged.

If the imaging operation and the operation for acquiring the unique position are completed for the two reference marks 514, the determination in S109 is YES, and the process proceeds to S110, where the acquired positions of the n reference marks 514 belong to the same group. To the control device 500 of the component mounting unit 412. Thereafter, the flag F5 is set to 1 in S111, and in S112, it is determined whether or not the unique positions of all the reference marks 514 have already been supplied from the control device 500 of the other component mounting unit 412. If not, the determination is no, the processing of S113 and 114 is skipped, and one processing of this routine ends. If the unique positions of the reference marks 514 are supplied from the control device 500 of the other component mounting unit 412, the data is stored in the RAM 246, and if the unique positions of all the reference marks 514 are obtained, these unique positions are obtained in S113. And the relative position between the component mounting units 412 is acquired based on the own position of the reference mark 514 of the self. In S114, the number n, the flag F4, and the flag F5 are returned to the initial value 0, and one execution of this relative position detection routine is completed. Thereafter, until the next relative position detection routine is executed, an operation for detecting a positioning error of the printed wiring board 12 and an operation for mounting the component 16 are performed based on the relative position.

  Next, a mounting operation for mounting the component 16 on the printed wiring board 12 will be described. As shown in FIG. 20, the printed wiring board 12 is formed in a size approximately four times the width of the mounting area 470 of the component mounting unit 412 in the transport direction. When the component 16 is mounted by each unit group, the mounting operation is executed by dividing the mounting area set on the upper surface into four equal parts in the transport direction. The partial regions 520, 522, 524, and 526 are referred to as the first, second, third, and fourth partial regions in order from the most downstream one. First, the component 16 is mounted on the first and third partial areas 520 and 524, and then the printed wiring board 12 is moved and positioned by one partial area on the downstream side, thereby positioning the second and fourth partial areas. Parts are mounted at 522 and 526.

  Specifically, one reference mark 146 is provided in each partial region 520, 522, 524, 526 of the printed wiring board 12 as shown in FIG. In the illustrated example, they are provided near the downstream ends in the first and second partial regions 520 and 522 and near the upstream ends in the third and fourth partial regions 524 and 526, respectively. When the component 16 is mounted on the first and third partial areas 520 and 524 of the printed wiring board 12, the position of the reference mark 146 in the partial areas 520 and 524 is detected by each component mounting unit 412. The positioning error of the printed wiring board 12 with respect to each component mounting unit 412 is acquired in consideration of the relative position between the component mounting units 412 acquired previously. Based on the positioning error, the correction amount of the mounting position of the component 16 is calculated, and the component 16 is mounted on the printed wiring board 12. In this embodiment, correction of the holding position error of the component 16 by the mounting head 144 is also performed, but the description is omitted because it is not directly related to the present embodiment.

In this embodiment, the controller 500 of each component mounting unit 412 is directly connected to supply information to each other. However, they are connected in parallel to the host computer 280 so that all information is stored. Once supplied to the host computer, it may be distributed to each control device. Even in the latter case, it can be considered as an aspect of supplying information to another control device 500.
In addition, at least one of detection of the relative position between the component mounting units 412, acquisition of positioning errors of the printed wiring board 12 with respect to each component mounting unit, and correction of the component mounting position in each component mounting unit is a plurality of component mounting such as a host computer. It can also be executed by a computer common to the units.

The reference plate 510 used in the present embodiment can be used in the above-described two embodiments, that is, in an electronic component mounting system in which the imaging regions and component mounting regions of a plurality of component mounting units partially overlap. it can. Instead of fixedly providing the calibration mark 160 on the apparatus body such as the base of the electronic component mounting system, the reference plate 510 is used. In this case, if the relative rotational position error between the component mounting units is so small that it can be ignored, each recognized region (for example, the imaged region) to be recognized (for example, imaged) by each component mounting unit of the reference plate 510 is detected. It is sufficient that at least one reference mark is provided, but when the relative rotational position error cannot be ignored, it is necessary to provide at least two reference marks in each recognition area. However, not only in the former case but also in the latter case, the printed wiring board 12 can be recognized by at least two reference marks as a whole, that is, by at least two of a plurality of component mounting units forming a group. What is necessary is just to be provided.

  Although some embodiments have been described in detail above, these are merely examples, and the claimable invention is not limited to the aspects described in the above [Problems to be Solved, Problem Solving Means and Effects]. First, the present invention can be implemented in various modifications and improvements based on the knowledge of those skilled in the art.

It is a top view which shows notionally the electronic circuit component mounting system which is one Embodiment of claimable invention. It is a side view (partial cross section) which shows a part of said component mounting system. It is a front view (partial cross section) which shows another part of the said component mounting system. FIG. 4 is an IV view in FIG. 3. It is a side view (partial cross section) which shows the mounting head in the said system. It is a block diagram which shows notionally the control apparatus of the said component mounting system. It is a flowchart of the relative position detection routine performed by the said control apparatus. It is a flowchart of the wiring board position error detection routine performed by the said control apparatus. It is a figure for demonstrating the operation | work by the said relative position detection routine and a wiring board position error detection routine. It is a front view (partial cross section) which shows the principal part of the component mounting unit of the electronic circuit component mounting system which is another embodiment. It is a block diagram which shows notionally the control apparatus of the said component mounting system. It is a flowchart of the relative position detection routine performed by the said control apparatus. It is a figure for demonstrating the operation | work by the said relative position detection routine. It is a top view which shows the components mounting system which is another embodiment. It is a side view which shows the said component mounting system. It is a front view which shows the principal part of the said component mounting system. It is a block diagram which shows notionally the control apparatus of the said component mounting system. It is a top view which shows the reference | standard board for detecting the relative position of a component mounting unit in the said component mounting system. It is a flowchart of the relative position detection routine performed by the said control apparatus. It is a top view which shows the printed wiring board with which components are mounted | worn by the said component mounting system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Base 12: Printed wiring board 14: Wiring board conveyor 16: Electronic circuit component 18: Component mounting apparatus 20: Component supply apparatus 100: Component mounting unit 102: Mounting area 144: Mounting head 146: Reference mark 148: Reference mark camera 160: Calibration mark 170: Suction nozzle 240: Control device 242: CPU 244: ROM 246: RAM
248: Bus 250: Computer 252: Input / output interface 272: Image processing computer 280: Host computer 282: PDG
300: Component mounting unit 302: Y-axis slide 312: Turning device 314: Rotating member 328: Turning motor 348: Switching motor 368: Switching device 370: Control device 400: Component mounting system 410: Base 412: Component mounting unit 442: XY robot 470: Mounting area 500: Control device 510: Reference plate 512: Imaged area 514: Reference mark

Claims (4)

The mounting areas overlap each other in a mounting area where two adjacent electronic circuit components can be mounted among a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head. Overlapping parts and non-overlapping parts that do not overlap, and there are also overlapping parts and non-overlapping parts in the recognition areas that are recognizable areas of the two recognition devices corresponding to each of the component mounting units adjacent to each other. In the electronic circuit component mounting system, a position error of a printed wiring board having a size extending over the mounting region and the recognition region of the plurality of component mounting units with respect to one of the plurality of component mounting units is obtained. And
Recognized by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. A wiring board reference part recognition step in which each of the wiring board reference parts that can be recognized but cannot be recognized by other recognition devices is recognized;
Based on the recognition result of each recognition device in the wiring board reference part recognition step, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit is An acquired wiring board reference portion specific position acquisition step;
Based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step, the position error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. A printed circuit board position error acquisition method comprising: a printed circuit board position error acquisition step. The mounting areas overlap each other in a mounting area where two adjacent electronic circuit components can be mounted among a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head. Overlapping parts and non-overlapping parts that do not overlap, and there are also overlapping parts and non-overlapping parts in the recognition areas that are recognizable areas of the two recognition devices corresponding to each of the component mounting units adjacent to each other. In the electronic circuit component mounting system, a method of mounting an electronic circuit component on a printed wiring board having a size spanning the mounting region and the recognition region of the plurality of component mounting units,
Recognizable by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. However, the wiring board reference part recognition process in which each of the wiring board reference parts that cannot be recognized by other recognition devices is recognized, and
Based on the recognition result of each recognition device in the wiring board reference part recognition step, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit is An acquired wiring board reference portion specific position acquisition step;
Based on the positions of the plurality of wiring board reference portions acquired in the wiring board reference portion unique position acquisition step, the position error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. Wiring board position error acquisition step,
A mounting step of mounting electronic circuit components on the printed wiring board by each of the plurality of component mounting units while correcting at least the wiring board position error acquired in the wiring board position error acquisition step. Component mounting method. The mounting areas overlap each other in a mounting area where two adjacent electronic circuit components can be mounted among a plurality of component mounting units each including a mounting head and a head moving device that moves the mounting head. Overlapping parts and non-overlapping parts that do not overlap, and there are also overlapping parts and non-overlapping parts in the recognition areas that are recognizable areas of the two recognition devices corresponding to each of the component mounting units adjacent to each other. In the electronic circuit component mounting system, to obtain a positional error of the printed wiring board having a size extending over the mounting region and the recognition region of the plurality of component mounting units with respect to one of the plurality of component mounting units. A program executed by a computer,
Recognized by each of at least two recognition devices of the plurality of recognition devices among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting area and the recognition area of the plurality of component mounting units. A recognition result acquisition step for acquiring information of a recognition result that is a result of recognition of each wiring board reference portion that is possible but not recognized by other recognition devices;
Based on the recognition result acquired in the recognition result acquisition step, the wiring board that acquires the wiring board reference portion unique position that is the position of each wiring board reference portion in the unique coordinate plane that is a unique coordinate plane for each component mounting unit A reference part specific position acquisition step;
Wiring for acquiring the position error of the printed wiring board with respect to the one specific coordinate plane of the plurality of component mounting units based on the positions of the plurality of wiring board reference parts acquired in the wiring board reference part unique position acquisition step A printed wiring board position error acquisition program including a board position error acquisition step. A plurality of component mounting units each provided with a mounting head and a head moving device for moving the mounting head, and a mounting area in which two adjacent electronic circuit components of the plurality of component mounting units can be mounted In the region, there are overlapping portions where the mounting regions overlap each other and non-overlapping portions that do not overlap,
A plurality of individual control devices which are provided corresponding to each of the plurality of component mounting units and which control the corresponding component mounting units;
A plurality of recognition devices provided corresponding to each of the plurality of component mounting units and recognizing a wiring board reference portion that is a reference portion of the printed wiring board, each of the two adjacent component mounting units. A recognition region that is a recognizable region of two recognition devices corresponding to the above-described recognition region includes an overlapping portion where the recognition regions overlap each other and a non-overlapping portion that does not overlap each other,
Of the plurality of recognition devices, among the plurality of wiring board reference portions of the printed wiring board having a size spanning the mounting region and the recognition region of the plurality of component mounting units by controlling the plurality of recognition devices. A wiring board reference part recognition control means for recognizing each wiring board reference part that can be recognized by each of at least two recognition devices but cannot be recognized by other recognition devices;
Based on the recognition result obtained by the control of the wiring board reference part recognition control means, the wiring board reference part unique position that is the position of each wiring board reference part in the unique coordinate plane that is unique to each component mounting unit A wiring board reference portion specific position acquisition means for acquiring a position;
Based on the positions of the plurality of wiring board reference portions acquired by the wiring board reference portion unique position acquisition means, the positional error of the printed wiring board with respect to the one unique coordinate plane of the plurality of component mounting units is acquired. Wiring board position error acquisition means, and the individual control device controls the component mounting unit to correct the position error of the printed wiring board acquired by the wiring board position error acquisition means to An electronic circuit component mounting system characterized by being mounted.

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