JP4313109B2 - High precision press machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The invention according to the claims relates to a high-precision press for a part such as a semiconductor substrate that requires accuracy with respect to parallelism between both surfaces.
[0002]
[Prior art]
For example, the following Patent Document 1 describes a press machine that applies pressure to a stacked semiconductor substrate or the like. The apparatus described in the document 1 is as shown in FIG. 7, and its features are as follows. That is, a) The semiconductor substrate Y is attached to the surface of one plate 150 of a pair of upper and lower plates (pressing members) 110 and 150 facing each other, and the surface of the substrate Y is placed on the surface of the other opposing plate 110. A sheet film X with a thin film to be transferred is attached, and one plate 150 is moved to press both the parts between the opposing surfaces of both plates 110 and 150. b) One of the plates 150 is held rotatably (swinged) by a bearing 160 (a set of a convex plate 161 and a concave plate 162) having a spherical surface centered on the center of the surface of the substrate Y. The pair of plates 110 and 150 are automatically corrected in inclination during pressurization, and pressurize both parts in parallel. c) In addition, in order to prevent air (bubbles) from being present between the bonding surfaces of the substrate Y and the sheet film X, the upper and lower plates 110 and 150 are covered with a chamber 120 that can be evacuated. It is said.
[0003]
On the other hand, Patent Document 2 described below describes a technique for forming a fine concavo-convex pattern on the surface of a substrate such as an optical information recording medium. The technique includes a process in which a resist film is formed on a substrate, and a pattern member is transferred onto the resist film by pressing the mold member over the surface of the film.
[0004]
[Patent Document 1]
JP 2001-135634 A
[Patent Document 2]
Japanese Patent Laid-Open No. 1-196749
[0005]
[Problems to be solved by the invention]
The press machine described in Patent Document 1 (see FIG. 7) has room for improvement in the following points.
[0006]
B) One of the upper and lower plates 150 is always in a freely rotatable state, including when pressurized, and is unstable. Therefore, it is necessary to perform the pressurizing operation performed for each substrate Y using the plate 150 or the like at a very carefully and slow speed every time.
[0007]
B) The spherical bearing 160 including the convex plate and the concave plate causes a very small angular displacement from a stationary state due to a general characteristic that a large static frictional force works at the start of relative motion. Not necessarily smooth. When the semiconductor substrate Y or the like is sandwiched between objects, the thickness of the object is not uniform, so that the amount of tilt correction required between the plates 110 and 150 is very small (for example, a length of several tens of millimeters). On the other hand, since the difference in thickness is several μm, it is about 1 / 10,000 radians. Therefore, it is unlikely that the inclination between the plates 110 and 150 is always corrected smoothly during pressurization.
[0008]
C) After the pressurization operation is completed, it is impossible to separate the two parts (sheet film X and substrate Y, etc.) vertically and take them out. In the case of the apparatus of Patent Document 1, the purpose is to join the substrate Y and the thin film on the sheet film X, but when the purpose is not to join (for example, a pattern on the substrate as in the example of Patent Document 2). However, since the plurality of superposed parts are taken out while being overlapped, another work is required to separate them.
[0009]
On the other hand, Patent Document 2 does not specifically disclose an appropriate pressing machine that can press a substrate having a resist film and a mold member after setting necessary conditions such as parallelism.
[0010]
The invention according to the claims is made to solve the above-described problems. In other words, it is easy to handle plates, etc., and has excellent followability (correction performance) against uneven thickness of the object to be pressed, or it is possible to separate and take out the parts after pressing. This is to provide a new high-precision press machine.
[0011]
[Means for Solving the Problems]
  The high-precision press machine according to claim 1 is a device that pressurizes a part (referred to as one or a plurality of parts) between two opposing surfaces,
  a) A spherical surface centered on a pressure member (such as a plate) including one of the two surfaces, preferably on the normal of the surface (preferably on the line of the resultant force of the applied pressure, more preferably on a position close to the surface). Rotate through the bearing (change the angle so that the head swings with respect to the bearing center).
  b) A fixing means for stopping the rotation of the pressure member is provided, and an elastic sheet (made of rubber, resin, or the like) is attached to one of the two surfaces easily.And
  a ')The spherical bearing is formed by fitting a concave annular sphere to the outside of a convex annular sphere,
  b ') The fixing means is located around the spherical bearing and applies an inward pressure to the spherical bearing to stop the relative movement between the two spheres ----It is characterized by.
  In addition, although a) “a pressure member including one surface” is described in the above a), an example in which a pressure member including the other surface is rotatably supported via a spherical bearing is excluded as in a). Not the purpose. In addition, the surface designated as “one of the two surfaces” in b) above is not limited to the surface supported through the spherical bearing in a), and the other surface is also an elastic sheet as in b). It does not exclude the example of attaching.
[0012]
This high-precision press can be used as follows. That is, 1) Use the self-alignment feature of the spherical bearing of a) above when starting to use after assembling the equipment, or when resuming use after inspection and maintenance. Adjust the parallelism of the two surfaces. This adjustment can be performed by using the fixing means of b) without using the fixing means of b), so that the two opposing surfaces are slowly overlapped while the pressure member is rotatable, and in this state, the fixing means of b) is used. . It is preferable to directly superimpose the two surfaces without attaching the elastic sheet of b).
[0013]
2) Open the two surfaces overlapped in 1) above, and attach an elastic sheet to one of the two surfaces. As the elastic sheet, a sheet having elasticity and thickness that can sufficiently absorb the distribution of thickness that can be possessed by the component to be pressed under the pressure at the time of pressing is used.
[0014]
3) After completing the parallelism adjustment in 1) above and attaching the elastic sheet in 2), by opening and closing the pressure member as appropriate, the parts are sandwiched between the two opposing surfaces and pressed. To do. In other words, open the pressure member (between the two surfaces), place the parts inside it, close the pressure member, apply appropriate pressure, open the pressure member again, and pressurize Repeat the process of removing the parts.
[0015]
The advantages of this press are as follows.
・ The two opposing surfaces of the pressure member can be arranged with a high degree of parallelism by utilizing the alignment of the rotatable spherical bearing, and such a pressure member can be used in a stable state that does not rotate. can do. This is because the rotation of the pressure member is stopped by the fixing means after adjusting the parallelism between the two surfaces as in 1) above. As long as the pressure member is used in a stable state where it does not rotate, the operation of 3) performed by opening and closing the member can be performed efficiently.
[0016]
・ Even if the part is pressurized with the fixing member stopped rotating as described above, even if the part thickness is non-uniform, the pressure is evenly applied to the part. Can be added. This is because the elastic sheet is attached to at least one of the two surfaces to be overlapped as described in 2) above, and the uneven thickness of the parts is substantially eliminated by the elastic displacement of the sheet. Even if the thickness is not uniform, if the deviation is within about 10 μm, the part is appropriately displaced by the action of the elastic sheet, and the applied pressure can be applied uniformly to the part. Such an action by the elastic sheet is more smoothly exhibited as the thickness deviation is smaller than in the example of FIG. 7 in which smoothness is likely to be hindered by the influence of static frictional force.
[0017]
-Since the elastic sheet can be easily attached and detached, it is convenient to attach the elastic sheet as in 2) above, or to replace it when it deteriorates and its elasticity decreases.
[0018]
  The high-precision press according to claim 2 is a device that pressurizes a plurality of parts with two opposing surfaces,
  c) Connect an air evacuation means to make the space sandwiched between the two surfaces low pressure (close to vacuum), and
  d) Connect the suction means that makes the low pressure (close to vacuum) between each of the two surfaces and the parts that are in close contact with the surfaces.And
  a ") a pressure member including the one surface which is rotatable via a spherical bearing is connected to a hollow spindle, and the spindle is supported via the spherical bearing;
  d ') Connect the hollow part of the spindle to the vacuum pump as part of the adsorption means ----It is characterized by.
[0019]
According to this high-precision press, air (bubbles) can be prevented from being present between a plurality of parts to be pressurized, and the supply of the plurality of parts between the two surfaces and the removal of each part after pressurization are extremely difficult. It becomes easy. This is because the pressure can be supplied from the parts supply, and further the parts can be recovered as follows.
[0020]
(1) A plurality of parts are supplied between two facing surfaces in a state where a plurality of parts to be pressurized simultaneously are overlapped.
(2) When the two facing surfaces are brought close to each other and each surface is lightly touching or very close to the outer surface of the plurality of parts, the adsorbing means of d) is activated to Make a low pressure between the outer surface. As a result, the plurality of parts are separated with a small distance and are attracted to the two surfaces.
{Circle around (3)} The air exclusion means of c) above is activated to lower the space between the two surfaces to a low pressure. As a result, the air between the plurality of parts separated by the above (2) is eliminated, and troubles caused by air (bubbles) remaining between the parts can be avoided.
(4) The two surfaces facing each other are further brought closer together, and the plurality of parts are pressed between the two surfaces.
(5) Stop the operation of the air excluding means in c) above to return the pressure between the two surfaces to atmospheric pressure, and pull the two surfaces apart. In the case where the plurality of parts are not joined in an inseparable manner by the pressure of (4) above, the plurality of parts are thereby attracted to and separated from the two surfaces.
(6) By appropriately adjusting the pressure by the adsorbing means in d) above, each part can be easily recovered from each of the two surfaces, and the work for separating the parts after pressurization is possible. It is not necessary separately.
[0021]
  This claim 2The high-precision press described in 2) is characterized by the above c) and d)WithThe apparatus of claim 1 is also provided with the features a) and b).Therefore, this high-precision press can perform operations such as pressurization for multiple parts that require accuracy with respect to the parallelism between outer surfaces, etc., with appropriate accuracy, quickly, and without the hassle of workers. Make it possible to implement.
[0022]
  The high precision press according to claim 3 is:
  b ") The elastic sheet is made of a breathable material, and is attached by overlapping a breathable plastic film whose periphery is fixed with an annular stopper on the pressure member.
[0024]
According to a fourth aspect of the present invention, there is provided a high-precision press machine that is particularly intended for pressurizing a component including a semiconductor substrate.
[0025]
In such a press machine, the above-mentioned operational characteristics are particularly advantageous. Because, a) When pressing parts including a semiconductor substrate, a parallelism of a certain level or more is required between the outer surfaces. B) Normally, it is required to efficiently pressurize a large number of parts. C) In general, even if the thickness becomes non-uniform, only a slight deviation suitable to be solved by an elastic sheet is generated. This is because the characteristics of each of the press machines described above are extremely suitable for the circumstances specific to the semiconductor substrate, such as the need to prevent the presence of air. Therefore, the press machine of this claim can perform the pressurization process with respect to the said components especially smoothly and with high precision.
[0026]
The high-precision press machine according to claim 5 is a pressurizing object that is a combination of a semiconductor substrate having a resist film on the surface and a mold (mold member) that performs pattern transfer on the resist film. It is characterized by being.
[0027]
When pattern transfer is performed on a resist film on a semiconductor substrate using a mold, in addition to the above a) to d), the parallel pattern required between the surfaces and the air between the parts because the transfer pattern is precise and fine. There is a special situation that the required accuracy of the non-intervening is particularly high. F) After pressurizing both parts, it is necessary to separate and remove the semiconductor substrate from the mold to be reused. The high-precision press having the above-described features exhibits advantageous effects very appropriately in response to such demands. That is, it can be said that it is particularly suitable for performing the pressurizing process on the component.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the invention is shown in FIGS. FIG. 1 is a front view showing an entire high-precision press machine 1 (partially shown in a sectional view), and FIG. 2 shows details of the press machine 1 showing a substrate mounting table 10, a mold holding plate 50, and the like. FIG. The illustrated press 1 is a device that presses a semiconductor substrate having a resist film on its surface (reference numeral A in FIG. 2) and a patterned mold (reference numeral B in FIG. 2). Thus, pattern transfer is performed on the resist film.
[0029]
The press machine 1 is configured as follows.
First, as shown in FIG. 1, an upper frame 3 is integrated on a lower frame 2 containing a substrate mounting table 10 and the like, and a mold holding plate 50 and the like are attached to the upper frame 3 so as to be movable up and down. . The mold holding plate 50 is attached to the lower part of the elevating frame 4, and the elevating frame 4 is connected to a nut member 4 a on the feed screw 5 provided in the upper frame 3. An elevating drive means 6 including a motor 6a, a speed reducer 6b, a transmission gear 6c, and the like is disposed on the side of the upper end portion of the upper frame 3, and the feed screw 5 is rotationally driven by the power of the motor 6a. By driving the motor 6a, the elevating frame 4 moves up and down via the feed screw 5 and the nut member 4a. Since the mold holding plate 50 moves up and down together with the lifting frame 4, the distance from the lower substrate mounting base 10 can be changed as appropriate.
[0030]
If the semiconductor substrate A is placed on the upper surface 10A of the substrate mounting table 10, the mold B is held on the lower surface 50A of the mold holding plate 50, and the mold holding plate 50 is lowered to apply a downward force, the substrate mounting table 10 and The substrate A and the mold B can be sandwiched and pressed using the mold holding plate 50 as a pressing member.
[0031]
The substrate mounting table 10 is provided with the following components as related to it.
[0032]
First, air exclusion means 20 is provided so as to surround the substrate mounting base 10. As shown in FIG. 2, the means 20 surrounds the lower support plate 12 of the substrate mounting base 10 with a cylindrical bellows 22, and is attached to the through hole 12a penetrating the support plate 12 in the thickness direction and the outside thereof. The exhaust port 21 is connected to a vacuum exhaust pump (not shown) (a valve is appropriately used). The bellows 22 is made of a metal having a bellows shape, and a lower end portion is joined to the support plate 12, and an annular flange 23 having an O-ring 24 around the entire periphery is attached to the upper end portion. Since the center line of the bellows 22 is oriented vertically and the displacement of the flange 23 is guided by a plurality of vertical guide rods 25 with springs, the flange 23 is displaced up and down with the joint surface horizontal. Can do. When the mold holding plate 50 is lowered as described above, the elevating flange 54 that is integrally connected to the elevating frame 4 and surrounds the mold holding plate 50 covers the flange 23, and the bellows 22 is operated by the O-ring 24. Seal the inside space. If the evacuation pump is started in this state, the space, that is, the space sandwiched between the upper surface 10A of the substrate mounting base 10 and the lower surface 50A of the mold holding plate 50 can be reduced to a low pressure (for example, 10 Torr or less).
[0033]
The second of the configurations related to the substrate mounting table 10 is that the suction means 30 for lowering the pressure between the upper surface 10A of the mounting table 10 and the substrate A installed there is provided. The suction means 30 is formed by forming a vent hole 11a from the upper surface to the side surface with respect to the pressurizing face plate 11 of the substrate mounting table 10, and connecting the vent hole 11a to a vacuum exhaust pump (not shown) (using a valve as appropriate). It is. In the connection path to the pump, an exhaust port 31 and a joint 32 are provided at both ends of a through hole 12b that penetrates the lower support plate 12, and a pipe 33 and a joint 34 are connected between the joint 32 and the vent hole 11a. ing. If the substrate A is placed on the upper surface 10A of the substrate mounting table 10 (pressurizing face plate 11) under atmospheric pressure and the vacuum pump is operated, the substrate A is placed on the upper surface using the pressure difference between the upper and lower surfaces of the substrate A. 10A can be adsorbed. The low pressure between the upper surface 10A and the substrate A may be, for example, about 10 Torr or less. It is also preferable to use the same pump as the vacuum exhaust pump of the air exclusion means 20.
[0034]
In addition, the substrate mounting base 10 and the lower support plate 12 integrated therewith are arranged via an X table 41 and a Y table 42 that are movable in the horizontal direction with respect to the lower frame 2 shown in FIG. Since the X table 41 and the Y table 42 enable horizontal movement in directions orthogonal to each other, the position of the substrate mounting base 10 can be freely changed in the horizontal direction. When the area of the resist film of the substrate A is large, the horizontal position of the substrate A is sequentially changed and the pattern transfer by the mold B needs to be performed a plurality of times. It is good to change the position of.
[0035]
On the other hand, the upper mold holding plate 50 is provided with the following components in relation thereto.
[0036]
First, as shown in FIG. 2, the pressing face plate 51 of the mold holding plate 50 is supported via a spherical bearing 60. That is, the pressing face plate 51 is integrally connected to the hollow support shaft 52, and the support shaft 52 is moved up and down via a spherical bearing 60 formed by fitting the convex annular sphere 61 and the concave annular sphere 62 together. It is supported in the lower case 53 of the frame 4. Since the center of the spherical surface is on a perpendicular line passing through the center of the lower surface 50A of the pressing face plate 51, the pressing face plate 51 can rotate (precession) so as to swing its neck around the center.
[0037]
The second component is that a fixing means 70 for stopping the rotation by the spherical bearing 60 is provided around the spherical bearing 60. As shown in FIG. 2, the fixing means 70 is formed by fitting cylindrical wedge members 72 and 73 having a truncated pyramid (or frustum) -like outer peripheral surface onto bolts 71 (the wedge members 72 and 73 have end portions on the narrow side). The one wedge member 72 is screwed to the bolt 71, and an expandable cylindrical member 74 is arranged around the wedge members 72 and 73. And the outer case 53. When the bolt 71 is tightened, the wedge members 72 and 73 approach to expand the outer diameter of the cylindrical member 74, so that an inward pressure is applied to the spherical bearing 60 and the relative movement between the spheres 61 and 62 is applied. Can be stopped. If relative displacement does not occur between the two spheres 61 and 62, the mold holding plate 50 (pressing face plate 51) cannot perform the above-described rotational movement.
[0038]
A third component related to the mold holding plate 50 is that the elastic sheet 81 can be attached to the lower surface 50 </ b> A of the pressing face plate 51. As the elastic sheet 81, for example, a natural rubber sheet having a thickness of 1 mm is used. The elastic sheet 81 is attached not by using an adhesive or the like but by the following sheet mounting means 80 so that it can be easily attached to and detached from the lower surface 50A. That is, an annular stopper 83 can be screwed around the lower surface 50A. When the elastic sheet 81 is mounted, the elastic sheet 81 is applied to the lower surface 50A, and a thin plastic film 82 (thickness 100 μm) is formed on the lower surface of the sheet 81. The periphery of the film 82 is fixed by the metal fitting 83. If the metal fitting 83 is removed with a screw, the elastic sheet 81 and the film 82 can be easily replaced.
[0039]
Further, as a fourth component part, the mold holding plate 50 is also provided with a suction means 90 for lowering the pressure between the lower surface 50A and the mold B installed therein. The suction means 90 forms a vent hole 51 a penetrating between the upper and lower surfaces with respect to the pressurizing face plate 51 of the mold holding plate 50, and the vent hole 51 a is provided in the hollow portion of the support shaft 52 in the upper part or the case 53. In addition, a vacuum exhaust pump (not shown) is connected (a valve is used as appropriate) through a through hole 92 and an exhaust port 91 outside the through hole 92. If the mold B is stacked on the lower surface 50A of the mold holding plate 50 (pressurizing face plate 51) under atmospheric pressure and the vacuum pump is operated, the mold B is moved to the lower surface 50A using the pressure difference between the upper and lower surfaces. Can be adsorbed. The space between the upper surface 10A and the substrate A may be, for example, about 10 Torr or less. It is also preferable to use the same pump as the vacuum exhaust pump of the air exclusion means 20. The elastic sheet 81 and the plastic film 82 described above are made of a material having air permeability, or the center portion (on the extension line of the air hole 51a) is used.
[0040]
After performing assembly, inspection, maintenance, etc., the press machine 1 can press the substrate A and the mold B in parallel with the upper surface 10A of the substrate mounting table 10 and the lower surface 50A of the mold holding plate 50 in use. Make the following pre-adjustments.
[0041]
1) The fixing means 70 is released from the fixed state by loosening the bolts 71, and the parallelism between the two opposing surfaces 10A and 50A is obtained by utilizing the self-alignment property (that it can rotate) of the spherical bearing 60. adjust. This adjustment is performed by slowly lowering the mold holding plate 50 with the elastic sheet 81 and the plastic film 82 removed, and overlapping the two surfaces 10A and 50A. The bolts 71 of the fixing means 70 are tightened in a state where both are superposed and pressurized, and the rotation of the mold holding plate 50 by the spherical bearing 60 is stopped.
2) Raise the mold holding plate 50 to open the two surfaces 10A and 50A, and attach the elastic sheet 81 to the lower surface 50A of the mold holding plate 50. This attachment is performed by the sheet mounting means 80.
[0042]
After the above-mentioned pre-adjustment, the full operation of the press machine 1, that is, the substrate A and the mold B are overlapped and pressed, and the pattern of the mold B is transferred onto the resist film on the surface of the substrate A. Start work. The work is basically performed according to the following procedure.
[0043]
{Circle around (1)} The substrate A and the mold B to be simultaneously pressed are placed on the substantially center of the pressing face plate 11 of the substrate mounting base 10 with the mold B facing up.
(2) When the mold holding plate 50 is lowered to bring the two surfaces 10A and 50A closer to each other, and the lower surface 50A of the mold holding plate 50 approaches the upper surface of the mold B (the interval is about 100 μm), the suction means 30 and 90 are caused to function so that the substrate A is attracted to the upper surface 10A of the substrate mounting table 10 and the mold B is attracted to the lower surface 50A of the mold holding plate 50. Thereby, the mold B is separated upward from the substrate A, and a slight gap is formed between them.
(3) When the mold holding plate 50 is lowered as described in (2) above, the flange 23 of the air exclusion means 20 is in close contact with the elevating flange 54 and the inside of the bellows 22 is sealed. The inside of the bellows 22 is set to a low pressure of 10 Torr or less using a vacuum exhaust pump. As a result, the air between the substrate A and the mold B is excluded, and an environment capable of accurate pattern transfer is formed. When the pressure is sufficiently lowered, the pressure difference between the upper and lower surfaces of the mold B disappears, so that the mold B drops a small height (about 100 μm in this example) by its own weight and overlaps the substrate A again.
(4) The mold holding plate 50 is further lowered, and the substrate A and the mold B are pressed between the two surfaces 10A and 50A. As a result, the pattern of the mold B is transferred onto the resist film on the surface of the substrate A.
{Circle around (5)} The exhaust by the air exclusion means 20 is stopped to return the inside of the bellows 22 to atmospheric pressure, and the mold holding plate 50 is raised to separate the two surfaces 10A and 50A. At this time, the substrate A and the mold B are separated from each other up and down while being adsorbed on the two surfaces 10A and 50A.
(6) If the suction force of the suction means 30/90 is strong, the pressure (degree of vacuum) is adjusted appropriately, and the substrate A and the mold B are separately collected from each of the two surfaces 10A, 50A. . However, when the same mold B is repeatedly used when returning to the above (1) and pressurizing the other substrate A, the mold B continues to be adsorbed on the mold holding plate 50 (lower surface 50A). In this case, only the substrate A may be supplied to the substrate mounting base 10 (upper surface 10A).
[0044]
【Example】
Since the press machine 1 introduced above can appropriately transfer a minute pattern that requires particularly high precision, the inventors have a minimum line width of a nanometer (nm) level for manufacturing a semiconductor substrate. This press 1 was used for a part of the process of nanoimprint lithography (room temperature nanoimprint). The entire process and the transfer status will be shown below.
[0045]
Example 1
According to the steps shown in FIGS. 3A to 3E, room temperature nanoimprinting using HSQ (hydrogenated silsesquioxane polymer) was performed. That is,
(A) An HSQ layer Ab is spin-coated on a Si (silicon) substrate Aa. The rotation speed is 4000 rpm, and the film thickness is about 1 μm. Next, in order to increase the viscosity of HSQ, pre-baking is performed at 50 ° C. for 10 minutes.
(B) The substrate A having the HSQ layer Ab on its upper surface is faced down, the Si mold mask B is faced up, and both are supplied to the press 1 in FIG.
(C) Using the press machine 1, the mold mask B is pressed against the HSQ layer Ab of the substrate A at 5 to 11 MPa, and the pressure state is maintained at room temperature for about 1 minute.
(D) The pressurization is stopped, and the mold mask B is pulled away from the substrate A (the HSQ layer Ab) using the function of the press 1.
(E) The residual film etching process of the transfer pattern obtained on the HSQ layer Ab of the substrate A is performed by RIE (reactive ion etching). The condition is CF in a high frequency of 100W._FourThe gas is allowed to flow at a pressure of 2.0 Pa and a flow rate of 80 sccm, and the etching time is 4 minutes.
FIGS. 4A and 4B show SEM images of the mold mask B used and the HSQ layer Ab after imprinting (before etching). Although the minimum line width is 50 nm, such a minute pattern is appropriately transferred. This result confirms that the press machine 1 is an apparatus suitable for transferring such a micropattern.
[0046]
(Example 2)
Room temperature nanoimprinting of a two-layer resist using HSQ as an upper layer was performed by the steps shown in FIGS. That is,
(A) On the Si substrate Ac with a step, a photoresist (AZ resist manufactured by Zipley Co., Ltd.) is applied as a lower layer resist Ad with a thickness of 1.5 μm and heated at 200 ° C. for 30 minutes. Next, 0.3 μm of HSQ is applied as an upper layer resist Ae on the lower layer resist Ad and prebaked at 50 ° C. for 10 minutes.
(B) Both are supplied to the press 1 of FIG. 1 with the substrate A ′ having the upper layer resist Ae on the upper surface and the Si mold mask B ′ facing upward.
(C) Using the press machine 1, the mold mask B ′ is pressed against the upper layer resist Ae (HSQ) of the substrate A ′ at 5 to 11 MPa and held at room temperature for about 1 minute.
(D) The pressurization is stopped and the mold mask B ′ is pulled away from the substrate A ′ using the function of the press 1.
(E) The residual film etching process of the transfer pattern obtained on the upper layer resist Ae (HSQ) of the substrate A ′ is performed by RIE. The condition is CF in a high frequency of 100W._FourThe gas is allowed to flow at a pressure of 2.0 Pa and a flow rate of 20 sccm, and the etching time is 4 minutes.
(F) O₂By RIE using (oxygen), etching of the lower layer resist Ad (photoresist) is performed by RIE using the upper layer resist Ae (HSQ) as a mask. The condition is that O in a high frequency of 100 W.₂The gas is allowed to flow at a pressure of 2.0 Pa and a flow rate of 20 sccm, and the etching time is 30 minutes.
FIG. 6 shows SEM images of the substrate A ′ obtained by the above (a) to (f). The width of the groove is about 2 μm. These results show that the press 1 shown in FIGS. 1 and 2 can perform high-precision pressing (transfer of minute patterns) even on a stepped substrate by using a two-layer resist process. .
[0047]
【The invention's effect】
The high precision press according to claim 1 has the following effects.
-Two opposing surfaces of the pressure member can be arranged with high parallelism, and such a pressure member can be used in a stable state where it does not rotate, and the pressure work can be performed efficiently.
-Even when the thickness of a part to be pressurized is not uniform, it is possible to apply pressure evenly to the part.
-The elastic sheet can be easily attached and removed, and can be replaced in a short time.
[0048]
  According to the high precision press according to claim 2, in addition to preventing the presence of air (bubbles) between a plurality of parts to be pressurized, the supply of the plurality of parts between two opposing surfaces of the pressure member and Each part after pressurization can be taken out very easily.
  This claim 2The high precision press machine described in,the aboveIn order to combine the effects, press work for multiple parts that require accuracy with respect to parallelism between outer surfaces, etc. should be carried out quickly and appropriately without any hassle to workers. Enable.
[0049]
The high-precision press according to claim 4 can perform the pressure treatment on the target component (including the semiconductor substrate) particularly smoothly and with high accuracy. Further, the high-precision press of claim 5 is particularly advantageous for performing a process of transferring a pattern to a semiconductor substrate.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a front view (partially shown in a cross-sectional view) showing an overall structure of a high-precision press machine 1 according to an embodiment of the invention.
2 is a detailed view showing a substrate mounting base 10, a mold holding plate 50, and the like in the press 1 of FIG.
FIGS. 3A to 3E are conceptual diagrams showing a room temperature nanoimprint process using HSQ (hydrogenated silsesquioxane polymer).
4A and 4B are SEM images showing the mold mask B used in the step of FIG. 3 and the HSQ layer Ab after imprinting (before etching), respectively.
FIGS. 5A to 5F are conceptual diagrams showing a room temperature nanoimprint process of a two-layer resist using HSQ as an upper layer.
6 is an SEM image showing a substrate A ′ obtained by the process of FIG. 5;
FIG. 7 is a front view (cross-sectional view) showing a conventional press machine that applies pressure to a semiconductor substrate.
[Explanation of symbols]
1 Press machine
10 Substrate installation table (pressure member)
10A surface (upper surface)
20 Air exclusion means
30.90 Adsorption means
50 Mold holding plate (pressure member)
50A surface (bottom surface)
60 Spherical bearing
70 Fixing means
80 Seat mounting means
81 Elastic sheet
A substrate
B mold

Claims (5)

It is a high-precision press that presses parts with two opposing surfaces,
A pressure member including one of the two surfaces is rotatably supported via a spherical bearing having a center on a perpendicular to the surface, and a fixing means for stopping the rotation of the pressure member is provided. And an elastic sheet is easily attached to and detached from one of the two surfaces .
And the spherical bearing is formed by fitting a concave annular sphere to the outside of the convex annular sphere, and the fixing means is disposed around the spherical bearing and applies inward pressure to the spherical bearing. A high-precision press machine for stopping relative movement between the two spheres . The space sandwiched between opposite said second surface with an air removing means for the low pressure, that it comprises a suction means for between components in close contact with the surfaces and the surfaces of the two faces to the low pressure,
The pressure member including the one surface that is rotatable via a spherical bearing is connected to a hollow spindle, and the spindle is supported via the spherical bearing. The high precision press according to claim 1, wherein the portion is connected to a vacuum exhaust pump as a part of the suction means . The elastic sheet is made of a breathable material, and is attached by overlapping a breathable plastic film that is fixed around the pressure member with an annular stopper. Item 3. The high precision press according to Item 2.   The high precision press according to any one of claims 1 to 3, wherein the component to be pressurized includes a semiconductor substrate.   The high-pressure component according to claim 4, wherein the component to be pressurized is a combination of a semiconductor substrate having a resist film on a surface thereof and a mold for performing pattern transfer on the resist film. Precision press machine.

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