JP4310844B2 - Disk substrate, disk substrate manufacturing apparatus, and disk substrate manufacturing method - Google Patents

Disk substrate, disk substrate manufacturing apparatus, and disk substrate manufacturing method Download PDF

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JP4310844B2
JP4310844B2 JP11930999A JP11930999A JP4310844B2 JP 4310844 B2 JP4310844 B2 JP 4310844B2 JP 11930999 A JP11930999 A JP 11930999A JP 11930999 A JP11930999 A JP 11930999A JP 4310844 B2 JP4310844 B2 JP 4310844B2
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disk substrate
outer peripheral
injection molding
manufacturing
burr
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JP2000311396A (en
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弘樹 跡部
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Sony Corp
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Sony Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、樹脂を射出成型して製造されるディスク基板の外周髭バリの発生を防止した、ディスク基板およびディスク基板の製造装置およびディスク基板の製造方法に関するものである。
【０００２】
【従来の技術】
一般に樹脂製のディスク基板（磁気ディスク、光ディスク）は、図４に示すような射出成型用金型１を用いて製造される。図４において射出成型用金型１は、可動側金型２と、該金型２に対向配設された固定側金型３と、これら金型２、３の外周対向部位に配設された外周リング４と、可動側金型２の中心部に設けられたゲートカットパンチ５と、固定側金型３の中心部に設けられたスプールブッシュ６と、樹脂注入後に剪断分離されるスプール７等を備えて構成されている。
【０００３】
このように構成された射出成型用金型１内で成形される樹脂製のディスク基板１０は、可動側金型２、固定側金型３、外周リング４、ゲートカットパンチ５、スプールブッシュ６の各部品による閉じられた空間内にスプールブッシュ６から樹脂を射出成形機によって注入し、ゲートカットパンチ５を押し込む事によってスプール７を剪断し、可動側金型２を開いた後にスプール７を分離することにより作成される。
【０００４】
【発明が解決しようとする課題】
前記射出成型時に、可動側金型２、固定側金型３、外周リング４による各金型構成部品の隙間に樹脂が侵入して、図５に示すような外周バリ１０ａが形成される。ディスク基板１０は可動側金型２を開くと可動側金型２に張り付いてくる。この為、固定側金型３と外周リング４によって作られた外周バリ１０ａは、ディスク基板１０の最外周部１０ｂとの境界１０ｃから剥がれ、図６の様な髭バリ１０ｄとなってしまう。
【０００５】
この髭バリ１０ｄは非常にもろく欠けやすい為、ディスク搬送時等に脱落し磁気記録障害や膜剥がれ等の品質上の問題を引き起こす。
【０００６】
本発明は上記の点に鑑みてなされたものでその目的は、樹脂製のディスク基板外周部の髭バリを防止したディスク基板およびディスク基板の製造装置およびディスク基板の製造方法を提供することにある。
【０００７】
【課題を解決するための手段】
上記課題を解決するために本発明の請求項１、４、７に係るディスク基板は、樹脂を射出成型して製造されるディスク基板において、外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなる外周バリが、前記射出成型後にディスク外周に形成されていることを特徴とし、また、ｙ≧１５μｍとなる外周バリが、前記射出成型後に可動側金型面側のディスク外周に形成されていることを特徴とし、また、１７μｍ≦ｙ≦３０μｍとなる外周バリが、前記射出成型後にディスク外周に形成されていることを特徴としている。
【０００８】
このため外周に形成された外周バリによって髭バリが生じることはない。したがってディスク搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことはない。
【０００９】
また本発明の請求項２、５、８に係るディスク基板の製造装置は、樹脂を射出成型してディスク基板を製造するディスク基板の製造装置において、
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなる外周バリが形成される形成手段を備えたことを特徴とし、
また、ｙ≧１５μｍとなる外周バリが可動側金型面側に形成される形成手段を備えたことを特徴とし、
また、１７μｍ≦ｙ≦３０μｍとなる外周バリが形成される形成手段を備えたことを特徴としている。
【００１１】
このため前記形成手段が形成した外周バリによって髭バリが生じることはない。したがって搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことのないディスク基板を製造することができる。
【００１２】
また本発明の請求項３、６、９に係るディスク基板の製造方法は、樹脂を射出成型してディスク基板を製造するディスク基板の製造方法において、
射出成型用金型内に樹脂を射出することによって、外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなるディスク基板の外周バリを形成する工程を備えたことを特徴とし、
また、ｙ≧１５μｍとなるディスク基板の外周バリを可動側金型面側に形成する工程を備えたことを特徴とし、
また、１７μｍ≦ｙ≦３０μｍとなるディスク基板の外周バリを形成する工程を備えたことを特徴としている。
【００１３】
このため前記工程を実施して形成された外周バリによって髭バリが生じることはない。したがって搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことのないディスク基板の製造方法を提供することができる。
【００１４】
【発明の実施の形態】
以下図面を参照しながら本発明の実施の形態を説明する。本発明では、樹脂製ディスク基板金型の形成キャビティー構成部品の隙間や型温、充填時間、保圧、樹脂温度等の成形条件を調整する事により、外周バリの長さｘ、外周バリの厚さをｙとした場合、ｙ＞ｘの関係、あるいはｙ＞２０μｍになるように樹脂製ディスク基板を成形するものである。
【００１５】
すなわち、例えば非晶質ポリオレフィン樹脂を用いて図４に示した金型により以下の条件で射出成形を行った。
（１）型温（金型の温度）範囲：１０５〜１２５℃
（２）充填時間：０．２３〜０．４５秒
（３）保圧範囲：３４．５〜４０．２Ｋｇｆ／ｃｍ2
（４）樹脂温度：３００〜３３０℃
（５）型温差（可動側金型と固定側金型の温度差）：±５℃
また評価サンプルとして以下のものを使用した。
（評価サンプル１）標準条件：型温１１０℃、充填時間０．３ｓｅｃ、保圧３４．５，３４．５ｋｇｆ／ｃｍ2、樹脂温度３２０℃、型温差０℃成形品３枚。
（評価サンプル２）標準条件に対し、型温１０５，１１５，１２０，１２５℃成形品各３枚。
（評価サンプル３）標準条件に対し、充填時間０．２３，０．２７，０．３５，０．４，０．４５ｓｅｃ成形品各３枚。
（評価サンプル４）標準条件に対し、保圧３４．５＆３４．５，３７＆３７，３７＆４０，４０．２＆４０．２ｋｇｆ／ｃｍ2成形品各３枚。
（評価サンプル５）標準条件に対し、樹脂温度３００，３１０，３３０℃成形品各３枚。
（評価サンプル６）標準条件に対し、型温差−５，−２，＋２，＋５成形品各３枚。
（評価サンプル７）金型に１０μｍスペーサによりｄｏｗｎ面隙間を拡大後、標準条件で成形した追加サンプル３枚。
（評価サンプル８）スプールブッシュ交換＆１０μｍスペーサ導入金型により標準条件で成形した追加サンプル３枚。
【００１６】
そしてその後前記評価サンプル１〜評価サンプル８全てについて図５に示す外周バリ１０ａの長さ寸法ｘ及び厚さ寸法ｙを測定し、その結果を髭バリの有無に対応して表すと、ｘとｙの関係は図１のように示される。図１から、外周バリの厚さ寸法ｙ＞２０μｍであれば確実に髭バリが存在しない事がわかる。また、ｙ＝ｘのラインを含んだ上の領域すなわちｙ≧ｘでも髭バリが一切存在しない事がわかる。つまり、各外周金型隙間寸法や成形条件を調整して、ｙ＞２０μｍまたはｙ≧ｘが成り立つ樹脂製ディスク基板を成形すれば外周部髭バリのない基板を作る事ができる。
【００１７】
また前記図１の外周バリ長さｘと厚さｙの寸法関係を可動側金型２側のみについて表すと図２のように示され、固定側金型３側のみについて表すと図３のように示される。
【００１８】
また、外周リングと金型間の隙間寸法と標準条件成形品横バリ厚さ寸法の関係を表１に示す。
【００１９】
【表１】

Figure 0004310844
【００２０】
この表１は前記評価サンプル１、評価サンプル７、評価サンプル８についての外周部金型隙間寸法とバリ厚さ寸法の関係を表している。この表１によれば、可動側金型隙間寸法と横バリ厚さ寸法の間にあまり変化がないが、固定側金型横バリ厚さ寸法は金型隙間寸法の約５０％になっている。
【００２１】
固定金型側外周金型隙間をスペーサにより意図的に１０μｍ拡大し、標準条件で成形した追試結果においても固定金型側横バリ厚さ寸法は金型隙間寸法の約５０％になっている（可動金型側外周隙間寸法は変えていない。スペーサ材質は金型と同材質）。
【００２２】
尚表１における２重丸印は全周髭バリ無しを示し、×印は髭バリ多数有りを示している。
【００２３】
【発明の効果】
上述の説明からわかるように本発明によれば、樹脂製ディスク基板金型の形成キャビティー構成部品の隙間や成形条件を調整する事により、外周バリの長さｘ、外周バリの厚さをｙとした場合、ｙ≧ｘの関係、あるいはｙ＞２０μｍになるように樹脂製ディスク基板を成形して、樹脂製ディスク基板の品質に関わる外周部髭バリのない樹脂製ディスク基板を得ることができる。
【００２４】
すなわち、本発明の請求項１、４、７に係るディスク基板によれば、外周に形成された外周バリによって髭バリが生じることはない。したがってディスク搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことはない。
【００２５】
また本発明の請求項２、５、８に係るディスク基板の製造装置によれば、形成手段が形成した外周バリによって髭バリが生じることはない。したがって搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことのないディスク基板の製造装置を提供することができる。
【００２６】
また本発明の請求項３、６、９に係るディスク基板の製造方法によれば、前記工程を実施して形成された外周バリによって髭バリが生じることはない。したがって搬送時等に髭バリが脱落し、磁気記録障害や膜剥れ等の品質上の問題を起こすことのないディスク基板の製造方法を提供することができる。
【図面の簡単な説明】
【図１】本発明の一実施形態例による製造方法で作成した樹脂製ディスクの、外周バリ長さ及び厚さ寸法の関係を説明する寸法散布図。
【図２】本発明の一実施形態例による製造方法で作成した樹脂製ディスクの、可動金型側外周バリ長さ及び厚さ寸法の関係を説明する寸法散布図。
【図３】本発明の一実施形態例による製造方法で作成した樹脂製ディスクの、固定金型側外周バリ長さ及び厚さ寸法の関係を説明する寸法散布図。
【図４】金型構造説明図。
【図５】樹脂製ディスクの外周断面説明図。
【図６】樹脂製ディスクの簡略図。
【符号の説明】
１…射出成型用金型、２…可動側金型、３…固定側金型、４…外周リング、５…ゲートカットパンチ、６…スプールブッシュ、７…スプール、１０…樹脂製ディスク、１０ａ…外周バリ、１０ｂ…最外周部、１０ｃ…外周バリと最外周部の境界、１０ｄ…外周髭バリ、ｘ…外周バリ長さ、ｙ…外周バリ厚さ。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a disk substrate, a disk substrate manufacturing apparatus, and a disk substrate manufacturing method, which prevent the occurrence of burrs on the outer periphery of a disk substrate manufactured by injection molding of a resin.
[0002]
[Prior art]
In general, a resin disk substrate (magnetic disk, optical disk) is manufactured using an injection mold 1 as shown in FIG. In FIG. 4, an injection mold 1 is disposed at a movable side mold 2, a fixed side mold 3 disposed opposite to the mold 2, and outer peripheral facing portions of these molds 2 and 3. An outer peripheral ring 4, a gate cut punch 5 provided at the center of the movable mold 2, a spool bush 6 provided at the center of the fixed mold 3, a spool 7 sheared and separated after resin injection, and the like It is configured with.
[0003]
The resin-made disc substrate 10 molded in the injection mold 1 thus configured includes a movable mold 2, a fixed mold 3, an outer ring 4, a gate cut punch 5, and a spool bush 6. Resin is injected from the spool bush 6 into the closed space of each part by an injection molding machine, the spool 7 is sheared by pushing the gate cut punch 5, and the spool 7 is separated after the movable die 2 is opened. It is created by.
[0004]
[Problems to be solved by the invention]
At the time of the injection molding, the resin enters the gaps between the mold components formed by the movable mold 2, the fixed mold 3, and the outer ring 4, and an outer peripheral burr 10a as shown in FIG. 5 is formed. The disk substrate 10 sticks to the movable mold 2 when the movable mold 2 is opened. For this reason, the outer peripheral burr 10a made by the fixed side mold 3 and the outer peripheral ring 4 is peeled off from the boundary 10c with the outermost peripheral part 10b of the disk substrate 10 and becomes a flange burr 10d as shown in FIG.
[0005]
The wrinkle burr 10d is very fragile and easily chipped, so that it drops off when the disk is transported and causes quality problems such as magnetic recording failure and film peeling.
[0006]
The present invention has been made in view of the above points, and an object of the present invention is to provide a disk substrate, a disk substrate manufacturing apparatus, and a disk substrate manufacturing method that prevent the outer periphery of the resin disk substrate from being wrinkled. .
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the disk substrates according to claims 1, 4, and 7 of the present invention are disk substrates manufactured by injection molding a resin, wherein the length dimension of the outer peripheral burr is x and the thickness dimension is y. In this case, an outer peripheral burr satisfying y ≧ x or 9 μm ≦ x ≦ 15 μm or 27 μm ≦ x ≦ 33 μm is formed on the outer periphery of the disk after the injection molding , and y ≧ 15 μm. An outer peripheral burr is formed on the outer periphery of the disk on the movable mold surface side after the injection molding, and an outer peripheral burr satisfying 17 μm ≦ y ≦ 30 μm is formed on the outer periphery of the disk after the injection molding. It is characterized by being.
[0008]
For this reason, no burrs are generated by the outer peripheral burrs formed on the outer periphery. Therefore, the burrs are removed when the disk is transported, and there is no problem with quality such as magnetic recording failure or film peeling.
[0009]
Further, the disk substrate manufacturing apparatus according to claims 2 , 5, and 8 of the present invention is a disk substrate manufacturing apparatus for manufacturing a disk substrate by injection molding a resin.
Provided with forming means for forming an outer peripheral burr that satisfies y ≧ x, or 9 μm ≦ x ≦ 15 μm, or 27 μm ≦ x ≦ 33 μm, where x is the length dimension of the outer peripheral burr and y is the thickness dimension. As a feature,
Further, it is characterized by comprising a forming means in which an outer peripheral burr satisfying y ≧ 15 μm is formed on the movable mold surface side,
Further, it is characterized in that a forming means for forming an outer peripheral burr satisfying 17 μm ≦ y ≦ 30 μm is provided .
[0011]
For this reason, no burrs are generated by the outer peripheral burrs formed by the forming means. Accordingly, it is possible to manufacture a disk substrate that does not cause quality problems such as magnetic recording failure and film peeling due to burrs falling off during transportation and the like.
[0012]
The disk substrate manufacturing method according to claims 3 , 6 and 9 of the present invention is a disk substrate manufacturing method for manufacturing a disk substrate by injection molding a resin.
By injecting the resin into the mold for injection molding, when the length dimension of the outer peripheral burr is x and the thickness dimension is y, y ≧ x, or 9 μm ≦ x ≦ 15 μm, or 27 μm ≦ x ≦ 33 μm Characterized in that it comprises a step of forming an outer peripheral burr of the disk substrate,
And a step of forming an outer peripheral burr of the disk substrate satisfying y ≧ 15 μm on the movable mold surface side,
Further, it is characterized in that it includes a step of forming an outer peripheral burr of the disk substrate satisfying 17 μm ≦ y ≦ 30 μm .
[0013]
For this reason, no burrs are generated by the outer peripheral burrs formed by performing the above steps. Therefore, it is possible to provide a method for manufacturing a disk substrate that does not cause burrs to fall off during transport or the like and causes quality problems such as magnetic recording failure or film peeling.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In the present invention, the length of the outer peripheral burr x and the outer peripheral burr are adjusted by adjusting the molding conditions such as the gap between the forming cavity components of the resin disk substrate mold, mold temperature, filling time, holding pressure, and resin temperature. When the thickness is y, the resin disk substrate is molded so that y> x or y> 20 μm.
[0015]
That is, for example, injection molding was performed under the following conditions using a mold shown in FIG. 4 using an amorphous polyolefin resin.
(1) Mold temperature (mold temperature) range: 105-125 ° C
(2) Filling time: 0.23 to 0.45 seconds (3) Holding pressure range: 34.5 to 40.2 Kgf / cm 2
(4) Resin temperature: 300-330 ° C
(5) Mold temperature difference (temperature difference between movable mold and fixed mold): ± 5 ° C
The following samples were used as evaluation samples.
(Evaluation Sample 1) Standard conditions: mold temperature 110 ° C., filling time 0.3 sec, holding pressure 34.5, 34.5 kgf / cm 2 , resin temperature 320 ° C., mold temperature difference 0 ° C. 3 molded products.
(Evaluation sample 2) Three molds each having a mold temperature of 105, 115, 120, and 125 ° C. with respect to standard conditions.
(Evaluation sample 3) 3 times each of the molded products for filling time 0.23, 0.27, 0.35, 0.4, 0.45 sec with respect to standard conditions.
(Evaluation Sample 4) Three pressure-retained products each having a holding pressure of 34.5 & 34.5, 37 & 37, 37 & 40, 40.2 & 40.2 kgf / cm 2 with respect to standard conditions.
(Evaluation Sample 5) Three pieces each of resin temperature 300, 310, and 330 ° C. molded products with respect to standard conditions.
(Evaluation Sample 6) Three molds each with a mold temperature difference of -5, -2, +2, +5 with respect to standard conditions.
(Evaluation Sample 7) Three additional samples molded under standard conditions after expanding the down surface gap with a 10 μm spacer on the mold.
(Evaluation Sample 8) Three additional samples molded under standard conditions by changing the spool bushing & 10 μm spacer introduction mold.
[0016]
Then, the length dimension x and the thickness dimension y of the outer peripheral burr 10a shown in FIG. 5 are measured for all of the evaluation samples 1 to 8, and the results are expressed in correspondence with the presence or absence of wrinkles. This relationship is shown in FIG. From FIG. 1, it can be seen that if the thickness dimension y> 20 μm of the outer peripheral burr, there is no wrinkle burr. It can also be seen that there is no burrs even in the upper region including the line y = x, that is, y ≧ x. In other words, if the resin disk substrate satisfying y> 20 μm or y ≧ x is formed by adjusting the dimensions of the outer peripheral mold gaps and the molding conditions, it is possible to produce a substrate having no outer peripheral surface burrs.
[0017]
Further, the dimensional relationship between the outer peripheral burr length x and the thickness y in FIG. 1 is expressed as shown in FIG. 2 only for the movable mold 2 side, and is expressed as shown in FIG. 3 only for the fixed mold 3 side. Shown in
[0018]
Table 1 shows the relationship between the clearance between the outer peripheral ring and the mold and the standard condition molded product lateral burr thickness.
[0019]
[Table 1]
Figure 0004310844
[0020]
Table 1 shows the relationship between the outer peripheral mold gap dimension and the burr thickness dimension for the evaluation sample 1, the evaluation sample 7, and the evaluation sample 8. According to Table 1, there is not much change between the movable mold gap dimension and the horizontal burr thickness dimension, but the fixed mold horizontal burr thickness dimension is about 50% of the mold gap dimension. .
[0021]
In the follow-up test result, the fixed mold side outer peripheral mold gap was intentionally enlarged by 10 μm with a spacer and molded under standard conditions, the fixed mold side lateral burr thickness dimension was about 50% of the mold gap dimension ( The outer peripheral clearance of the movable mold is not changed, and the spacer material is the same as the mold.
[0022]
In Table 1, double circles indicate that there are no burrs around the circumference, and x indicates that there are many burrs.
[0023]
【The invention's effect】
As can be seen from the above description, according to the present invention, the length of the outer peripheral burr and the thickness of the outer peripheral burr are set to y by adjusting the gaps and molding conditions of the forming cavity components of the resin disk substrate mold. In this case, the resin disk substrate is molded so as to satisfy the relationship y ≧ x or y> 20 μm, and a resin disk substrate free from outer peripheral burrs related to the quality of the resin disk substrate can be obtained. .
[0024]
That is, according to the disk substrates according to claims 1, 4, and 7 of the present invention, no burrs are generated by the outer peripheral burrs formed on the outer periphery. Therefore, the burrs are removed when the disk is transported or the like, and quality problems such as magnetic recording failure and film peeling do not occur.
[0025]
According to the disk substrate manufacturing apparatus of the second, fifth, and eighth aspects of the present invention, no burrs are generated by the outer peripheral burrs formed by the forming means. Accordingly, it is possible to provide a disk substrate manufacturing apparatus that does not cause quality problems such as magnetic recording failure and film peeling due to burrs falling off during transportation and the like.
[0026]
In addition, according to the method for manufacturing a disk substrate according to claims 3 , 6 and 9 of the present invention, no burrs are generated by the outer peripheral burr formed by carrying out the above steps. Therefore, it is possible to provide a method for manufacturing a disk substrate that does not cause burrs to fall off during transport or the like and causes quality problems such as magnetic recording failure or film peeling.
[Brief description of the drawings]
FIG. 1 is a dimension scatter diagram for explaining the relationship between the outer peripheral burr length and the thickness dimension of a resin disc produced by a manufacturing method according to an embodiment of the present invention.
FIG. 2 is a dimension scatter diagram for explaining the relationship between a movable mold side outer peripheral burr length and a thickness dimension of a resin disc produced by a manufacturing method according to an embodiment of the present invention.
FIG. 3 is a dimension scatter diagram for explaining the relationship between a fixed mold side outer peripheral burr length and a thickness dimension of a resin disc produced by a manufacturing method according to an embodiment of the present invention.
FIG. 4 is an explanatory diagram of a mold structure.
FIG. 5 is a cross-sectional explanatory view of a resin disc.
FIG. 6 is a simplified diagram of a resin disc.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Injection molding die, 2 ... Movable side die, 3 ... Fixed side die, 4 ... Outer ring, 5 ... Gate cut punch, 6 ... Spool bush, 7 ... Spool, 10 ... Resin disc, 10a ... Peripheral burrs, 10b: outermost peripheral part, 10c: boundary between outer peripheral burrs and outermost peripheral part, 10d: outer peripheral burrs, x: outer peripheral burr length, y: outer peripheral burr thickness.

Claims (9)

樹脂を射出成型して製造されるディスク基板において、
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなる外周バリが、前記射出成型後にディスク外周に形成されていることを特徴とするディスク基板。In the disk substrate manufactured by injection molding resin,
When the length dimension of the outer peripheral burr is x and the thickness dimension is y, an outer peripheral burr satisfying y ≧ x or 9 μm ≦ x ≦ 15 μm or 27 μm ≦ x ≦ 33 μm is formed on the outer periphery of the disk after the injection molding. A disc substrate characterized by the above. 樹脂を射出成型してディスク基板を製造するディスク基板の製造装置において、
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなる外周バリが形成される形成手段を備えたことを特徴とするディスク基板の製造装置。 In a disk substrate manufacturing apparatus that manufactures a disk substrate by injection molding resin ,
Provided with forming means for forming an outer peripheral burr that satisfies y ≧ x, or 9 μm ≦ x ≦ 15 μm, or 27 μm ≦ x ≦ 33 μm, where x is the length dimension of the outer peripheral burr and y is the thickness dimension. An apparatus for manufacturing a disc substrate. 樹脂を射出成型してディスク基板を製造するディスク基板の製造方法において、
射出成型用金型内に樹脂を射出することによって、外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧ｘ、又は９μｍ≦ｘ≦１５μｍ、又は２７μｍ≦ｘ≦３３μｍとなるディスク基板の外周バリを形成する工程を備えたことを特徴とするディスク基板の製造方法。 In the disk substrate manufacturing method of manufacturing a disk substrate by injection molding resin ,
By injecting the resin into the mold for injection molding, when the length dimension of the outer peripheral burr is x and the thickness dimension is y, y ≧ x, or 9 μm ≦ x ≦ 15 μm, or 27 μm ≦ x ≦ 33 μm A method of manufacturing a disk substrate, comprising the step of forming an outer peripheral burr of the disk substrate. 樹脂を射出成型して製造されるディスク基板において、
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧１５μｍとなる外周バリが、前記射出成型後に可動側金型面側のディスク外周に形成されていることを特徴とするディスク基板。 In the disk substrate manufactured by injection molding resin ,
When the length dimension of the outer peripheral burr is x and the thickness dimension is y, an outer peripheral burr satisfying y ≧ 15 μm is formed on the outer periphery of the disk on the movable mold surface side after the injection molding. Disc substrate. 樹脂を射出成型してディスク基板を製造するディスク基板の製造装置において、
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧１５μｍとなる外周バリが可動側金型面側に形成される形成手段を備えたことを特徴とするディスク基板の製造装置。 In a disk substrate manufacturing apparatus that manufactures a disk substrate by injection molding resin,
Manufacturing of a disk substrate comprising a forming means for forming an outer peripheral burr on the movable mold surface side where y ≧ 15 μm, where x is the length dimension of the outer peripheral burr and y is the thickness dimension. apparatus. 樹脂を射出成型してディスク基板を製造するディスク基板の製造方法において、In the disk substrate manufacturing method of manufacturing a disk substrate by injection molding resin,
射出成型用金型内に樹脂を射出することによって、外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、ｙ≧１５μｍとなるディスク基板の外周バリを可動側金型面側に形成する工程を備えたことを特徴とするディスク基板の製造方法。  By injecting resin into the mold for injection molding, if the length dimension of the outer peripheral burr is x and the thickness dimension is y, the outer peripheral burr of the disk substrate where y ≧ 15 μm is placed on the movable mold surface side. A method of manufacturing a disk substrate, comprising the step of forming. 樹脂を射出成型して製造されるディスク基板において、In a disk substrate manufactured by injection molding of resin,
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、１７μｍ≦ｙ≦３０μｍとなる外周バリが、前記射出成型後にディスク外周に形成されていることを特徴とするディスク基板。  A disk substrate, wherein an outer peripheral burr satisfying 17 μm ≦ y ≦ 30 μm is formed on the outer periphery of the disk after the injection molding, where x is the length dimension of the outer peripheral burr and y is the thickness dimension. 樹脂を射出成型してディスク基板を製造するディスク基板の製造装置において、  In a disk substrate manufacturing apparatus that manufactures a disk substrate by injection molding resin,
外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、１７μｍ≦ｙ≦３０μｍとなる外周バリが形成される形成手段を備えたことを特徴とするディスク基板の製造装置。An apparatus for manufacturing a disk substrate, comprising: a forming means for forming an outer peripheral burr satisfying 17 μm ≦ y ≦ 30 μm, where x is a length dimension of the outer peripheral burr and y is a thickness dimension. 樹脂を射出成型してディスク基板を製造するディスク基板の製造方法において、In the disk substrate manufacturing method of manufacturing a disk substrate by injection molding resin,
射出成型用金型内に樹脂を射出することによって、外周バリの長さ寸法をｘ及び厚さ寸法をｙとした場合、１７μｍ≦ｙ≦３０μｍとなるディスク基板の外周バリを形成する工程を備えたことを特徴とするディスク基板の製造方法。  A step of forming an outer peripheral burr of the disk substrate such that 17 μm ≦ y ≦ 30 μm by injecting resin into an injection mold, where the length dimension of the outer peripheral burr is x and the thickness dimension is y; A method of manufacturing a disk substrate, characterized in that
JP11930999A 1999-04-27 1999-04-27 Disk substrate, disk substrate manufacturing apparatus, and disk substrate manufacturing method Expired - Fee Related JP4310844B2 (en)

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