JP4309729B2 - 核酸センサ用基板 - Google Patents
核酸センサ用基板 Download PDFInfo
- Publication number
- JP4309729B2 JP4309729B2 JP2003325992A JP2003325992A JP4309729B2 JP 4309729 B2 JP4309729 B2 JP 4309729B2 JP 2003325992 A JP2003325992 A JP 2003325992A JP 2003325992 A JP2003325992 A JP 2003325992A JP 4309729 B2 JP4309729 B2 JP 4309729B2
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- nucleic acid
- layer
- substrate
- acid sample
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 87
- 108020004707 nucleic acids Proteins 0.000 title claims description 72
- 150000007523 nucleic acids Chemical class 0.000 title claims description 72
- 102000039446 nucleic acids Human genes 0.000 title claims description 72
- 239000011521 glass Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 20
- 238000003860 storage Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 239000003153 chemical reaction reagent Substances 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 8
- 238000009529 body temperature measurement Methods 0.000 claims description 2
- 239000010931 gold Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 12
- 238000009396 hybridization Methods 0.000 description 11
- 108090000623 proteins and genes Proteins 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000126 substance Substances 0.000 description 7
- 238000000018 DNA microarray Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 201000010099 disease Diseases 0.000 description 2
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003752 polymerase chain reaction Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 208000035473 Communicable disease Diseases 0.000 description 1
- 206010061818 Disease progression Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920001222 biopolymer Polymers 0.000 description 1
- 238000013098 chemical test method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000005750 disease progression Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
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- Sampling And Sample Adjustment (AREA)
- Investigating Or Analysing Materials By The Use Of Chemical Reactions (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Description
2・・・・・・・・・絶縁基板
3・・・・・・・・・受光素子
4・・・・・・・・・サブマウント
5a,5b・・・・・電極パッド
6・・・・・・・・・貫通導体
7・・・・・・・・・ガラス基板
8・・・・・・・・・貯留部
9a・・・・・・・・核酸検体注入部
9b・・・・・・・・試薬注入部
10・・・・・・・・・流路
11a・・・・・・・・測温用抵抗体
11b・・・・・・・・加熱用抵抗体
12a,12b・・・・・測温用抵抗体の両端部
12c,12d・・・・・加熱用抵抗体の両端部
13・・・・・・・・・電極
14・・・・・・・・・Ti層
15・・・・・・・・・Pt層
16・・・・・・・・・Au層
Claims (1)
- 絶縁基板の一方主面に、核酸検体注入部から合流部にかけて形成された溝から成る第1の流路および試薬注入部から前記合流部にかけて形成された溝から成る第2の流路ならびに前記合流部から試薬との反応によって蛍光標識された核酸検体の貯溜部にかけて形成された溝から成る第3の流路を有するガラス基板と、前記貯溜部の近傍に形成された、Ti層とPt層とAu層とが順次積層されて成る電極と、該電極に電気的に接続されて前記核酸検体の蛍光を受光する受光素子とが設けられており、前記絶縁基板の他方主面に、前記電極に貫通導体を介して電気的に接続された、Ti層とPt層とAu層とが順次積層されて成る電極パッドと、前記ガラス基板を加熱するための加熱用抵抗体と、前記ガラス基板の温度を計測するための測温用抵抗体とが設けられていることを特徴とする核酸センサ用基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003325992A JP4309729B2 (ja) | 2003-09-18 | 2003-09-18 | 核酸センサ用基板 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2003325992A JP4309729B2 (ja) | 2003-09-18 | 2003-09-18 | 核酸センサ用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005091201A JP2005091201A (ja) | 2005-04-07 |
JP4309729B2 true JP4309729B2 (ja) | 2009-08-05 |
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JP2003325992A Expired - Fee Related JP4309729B2 (ja) | 2003-09-18 | 2003-09-18 | 核酸センサ用基板 |
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JP (1) | JP4309729B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006300860A (ja) * | 2005-04-25 | 2006-11-02 | Kyocera Corp | マイクロ化学チップ |
JP5751183B2 (ja) * | 2012-01-26 | 2015-07-22 | Wgp株式会社 | ガラスシステム、処理装置およびプログラム |
US10639630B2 (en) | 2015-01-30 | 2020-05-05 | Hewlett-Packard Development Company, L.P. | Microfluidic temperature control |
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2003
- 2003-09-18 JP JP2003325992A patent/JP4309729B2/ja not_active Expired - Fee Related
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JP2005091201A (ja) | 2005-04-07 |
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