JP4305700B2 - Molding material for sealing Rotary powder compression molding machine for tablet production - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to easy part replacement wear resistance of the rotary powder compression molding machine.
[0002]
[Prior art]
There are two types of powder compression molding machines for molding a sealing molding material tablet: a hydraulic type and a rotary type. The hydraulic type is suitable for manufacturing high-density products because the tablet is molded hydraulically, but its production capacity is poor. On the other hand, the rotary type is currently the mainstream because it can efficiently produce tablets corresponding to the multi-plunger method, which is a high-efficiency molding method for electronic component devices such as semiconductor packages.
In powder compression molding machines, when used to manufacture tablets of different types of sealing materials, it is necessary to replace parts such as molds and rails and clean the inside of the molding machine at the time of product type switching in order to avoid mixing different types. is there. There are many parts that need to be replaced in a rotary powder compression molding machine. Currently, parts such as multiple dies and rails are removed one by one, the inside is cleaned, and then another part is attached. However, it takes a lot of time and effort to complete the replacement of all parts, and this internal cleaning makes it difficult to eliminate the powder that has entered the gaps in the rail fixing base. Mixing is not completely prevented. In order to perform the cleaning operation around the rail and the pressure roll completely, it is necessary to disassemble all parts, but it is difficult to perform this disassembly operation on a daily basis. If the cleaning work around the rail and the pressure roll is not performed for a long time, there is a problem that the performance of the rotary powder compression molding machine deteriorates due to wear, and it becomes difficult to manufacture a tablet of a certain standard.
[0003]
[Problems to be solved by the invention]
Conventionally, when switching the type of the molding material tablet for sealing, it takes a lot of time to replace parts of the rotary powder compression molding machine, so the productivity is low. Moreover, the sealing molding material tablet mixed with different varieties has a problem in reliability. Furthermore, when the device of the electronic component device is sealed by using a standard-sized tablet manufactured using a worn rotary powder compression molding machine, there is a problem that molding becomes difficult due to insufficient filling. The present invention has been made in view of such circumstances, less possibility of easy replacement of parts different varieties mixed, is intended to provide the abrasion resistance of rotary powder compression molding machine.
[0004]
[Means for Solving the Problems]
As a result of intensive studies in order to solve the above-mentioned problems, the inventors have manufactured a sealing molding material tablet by using a rotary powder compression molding machine in which at least a mold and a rail can be integrally detached. The inventors have found that the object can be achieved, and have completed the present invention.
[0005]
That is, the present invention is a (1) mold, have a rail and turntable slides molds, rotary powder compression molding machine to which a detachable structure in one portion as integrally at least the mold and rails The mold and the rail are attached to the turntable, the turntable has a vertical shaft, and the vertical shaft is fixed by a hydraulic clamp unit provided on the upper and lower surfaces of the vertical shaft mounting base, A rotary powder compression molding machine for manufacturing a molding material tablet for sealing, in which the hydraulic clamp unit has a fixed key for preventing vertical misalignment of the rotary disk, and (2) mold, rail, rail fixing base, rotation The present invention relates to a rotary powder compression molding machine for producing a sealing molding material tablet according to the above (1), wherein a board and a standing shaft are integrated into a structure that can be detached at once .
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The rotary powder compression molding machine in the present invention is not limited with respect to other parts as long as it has a structure in which at least the mold and the rail are integrated and detachable at a time.
Embodiments of the present invention will be described below with reference to the drawings. The rotary powder compression molding machine according to the present invention has, for example, the form shown in FIG. 1 and is composed of three types of molds, an upper mold 11, a mortar mold 12, and a lower mold 13, and these molds are slid. It has a structure such that it has a rail 14 that moves, a rail fixing base 15, a standing shaft 16 that includes a turntable 4 that rotates these, and the like, and at least the molds 11 to 13 and the rail 14 can be attached and detached at once. Yes. FIG. 2 shows a molding part of the rotary powder compression molding machine of FIG. 1, and the molding part including the molds 11 to 13, the rail 14, the rail fixing base 15, the turntable 4 and the standing shaft 16 is shown. It is more preferable that the structure is detachable from the rotary powder compression molding machine at once. The upper metal mold 11, the mortar metal mold 12, the lower metal mold 13, the rail 14, and the rail fixing base 15 are attached to the turntable 4. The turntable 4 has a vertical shaft 16 and is fixed by hydraulic clamp units 21 provided on the upper and lower surfaces of the vertical shaft mounting base (upper) 10 and the vertical shaft mounting base (lower) 17. The hydraulic clamp unit 21 has a fixed key 22 for preventing the vertical misalignment of the turntable 4.
[0007]
When the dies 11 to 13 and the rail 14 are removed, the pressure roll fixing base (upper) 1, the pressure roll fixing base (lower) 7, the pressure roll (upper) shaft 2 and the pressure roll (lower) shaft 6 The periphery and the gap can be easily cleaned. Further, it is preferable to remove the rail fixing base 15, the turntable 4 and the standing shaft 16 because this cleaning becomes easier.
The upper mold 11, mortar mold 12, lower mold 13, rail 14, and rail fixing base 15 attached to the removed rotating plate 4 are separately removed and cleaned, and then attached to the rotating plate 4 and stored again. It is preferable.
[0008]
As a powdery epoxy resin molding material for sealing molded into a molding material tablet for sealing by a rotary powder compression molding machine in the present invention, there is no particular limitation as it is generally used as an epoxy molding material for sealing, An epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and the like are included.
[0009]
The epoxy resin used in the sealing epoxy resin molding material of the present invention is not particularly limited as it is generally used for the sealing epoxy resin molding material. For example, phenol novolac type epoxy resin, orthocresol novolak Phenols such as epoxy resin, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F and / or naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene and formaldehyde, acetaldehyde, propionaldehyde Epoxidized novolak resin obtained by condensation or cocondensation with a compound having an aldehyde group such as benzaldehyde and salicylaldehyde under an acidic catalyst, bisphenol A, bisphenol F, bisphenol S, diglycidyl ether such as alkyl-substituted or unsubstituted biphenol, stilbene-type diglycidyl ether, epoxidized phenol / aralkyl resin, naphthol / aralkyl resin, phenols with dicyclopentadiene and terpenes Epoxidized adduct or polyaddition product, glycidyl ester type epoxy resin obtained by reaction of polybasic acid such as phthalic acid and dimer acid and epichlorohydrin, obtained by reaction of polyamine such as diaminodiphenylmethane, isocyanuric acid and epichlorohydrin A glycidylamine type epoxy resin, a trimethylolpropane type epoxy resin, an epoxy resin having a naphthalene ring, a linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peracid such as peracetic acid, and Such as alicyclic epoxy resins. These may be used in combination of two or more even with these alone.
[0010]
The curing agent used in the epoxy resin molding material for sealing of the present invention is not particularly limited as it is generally used for epoxy resin molding materials for sealing. For example, phenol, cresol, resorcin, catechol, bisphenol Condensation or cocondensation of phenols such as A, bisphenol F, phenylphenol, aminophenol and / or naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene and compounds having an aldehyde group such as formaldehyde under an acidic catalyst And phenol / aralkyl resins and naphthol / aralkyl resins synthesized from phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl. More than types They may be used in combination.
[0011]
The equivalent ratio of the epoxy resin and the curing agent, that is, the ratio of the number of epoxy groups in the epoxy resin / the number of hydroxyl groups in the curing agent is not particularly limited, but is 0.5 to 2 in order to keep each unreacted component small. Is preferably set in the range of 0.7 to 1.3. In order to obtain a molding material for sealing excellent in reflow crack resistance, it is more preferable to set this ratio in the range of 0.8 to 1.2.
[0012]
The curing accelerator used in the epoxy resin molding material for sealing of the present invention is generally used in the epoxy resin molding material for sealing and is not particularly limited. For example, 1,8-diaza-bicyclo [ 5.4.0] Undecene-7, 1,5-diaza-bicyclo [4.3.0] nonene-5,6-dibutylamino-1,8-diaza-bicyclo [5.4.0] undecene-7 , 6-n-hexyl-1,8-diazabicyclo [5.4.0] undecene-7 and the like, and these compounds include maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1, 4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquino , Quinone compounds such as phenyl-1,4-benzoquinone, diazophenylmethane, compounds having intramolecular polarization formed by adding a compound having a π bond such as phenol resin, benzyldimethylamine, triethanolamine, dimethylaminoethanol , Tertiary amines such as tris (dimethylaminomethyl) phenol and derivatives thereof, imidazoles such as 2-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole and derivatives thereof, tributylphosphine, dibutyl Phenylphosphine, butyldiphenylphosphine, ethyldiphenylphosphine, methyldiphenylphosphine, triphenylphosphine, tris (4-methylphenyl) phosphine, tris (4-methoxyphenyl) phosphine, tri Organic phosphines such as (2,6-dimethoxyphenyl) phosphine, diphenylphosphine, and phenylphosphine, and compounds having a π bond such as maleic anhydride, quinone compounds, diazophenylmethane, and phenol resin are added to these organic phosphines. Phosphorus compounds having intramolecular polarization, tetraphenyl boron salts such as tetraphenylphosphonium tetraphenyl borate, triphenylphosphine tetraphenyl borate, 2-ethyl-4-methylimidazole tetraphenyl borate, N-methylmorpholine tetraphenyl borate And derivatives thereof. These may be used alone or in combination of two or more.
The blending amount of the curing accelerator is not particularly limited as long as the curing acceleration effect is achieved, but is preferably 0.005 to 2% by weight with respect to the whole epoxy resin molding material for sealing, Preferably it is 0.01 to 1 weight%, More preferably, it is 0.05 to 0.5 weight%. If it is less than 0.005% by weight, the curability in a short time tends to be inferior, and if it exceeds 2% by weight, the curing rate tends to be too high and it tends to be difficult to obtain a good molded product.
[0013]
The inorganic filler used for the epoxy resin molding material for sealing of the present invention is not particularly limited as it is generally used for the epoxy resin molding material for sealing. For example, fused silica, crystalline silica, alumina, Zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fosterite, steatite, spinel, mullite, titania powder, or spherical Bead, glass fiber and the like. Furthermore, examples of the inorganic filler having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate, and zinc molybdate. These inorganic fillers may be used alone or in combination of two or more.
The blending amount of the inorganic filler is 70% with respect to the whole epoxy resin molding material for sealing from the viewpoint of flame retardancy, reflow crack resistance, moldability, hygroscopicity, reduction of linear expansion coefficient and improvement of strength. % Or more is preferable, and from the viewpoint of reflow crack resistance and fluidity, the range of 80 to 95% by weight is more preferable, and 88 to 92% by weight is more preferable.
[0014]
A conventionally known flame retardant can be blended with the epoxy resin molding material for sealing of the present invention as necessary. For example, red phosphorus, phosphate ester, melamine, melamine derivatives, compounds having a triazine ring, nitrogen-containing compounds such as cyanuric acid derivatives and isocyanuric acid derivatives, phosphorus / nitrogen-containing compounds such as cyclophosphazene, zinc oxide, iron oxide, oxidation Examples thereof include metal compounds such as molybdenum and ferrocene, antimony oxide, and brominated resin. These may be used alone or in combination of two or more.
[0015]
Moreover, an anion exchanger can also be mix | blended with the epoxy resin molding material for sealing of this invention from a viewpoint of improving the moisture resistance of a semiconductor element, such as IC, and a high temperature leaving property. The anion exchanger is not particularly limited, and conventionally known anion exchangers can be used. Examples thereof include hydrotalcites and hydrous oxides of elements selected from magnesium, aluminum, titanium, zirconium, and bismuth. These can be used alone or in combination of two or more.
[0016]
Further, in the epoxy resin molding material for sealing of the present invention, as other additives, a release agent such as higher fatty acid, higher fatty acid metal salt, ester wax, polyolefin wax, polyethylene, polyethylene oxide, dye, carbon Add colorants such as black, coupling agents such as epoxy silane, amino silane, ureido silane, vinyl silane, alkyl silane, organic titanate, aluminum alcoholate, stress relaxation agents such as silicone oil and silicone rubber powder, etc. as required. be able to.
[0017]
Weigh the various ingredients as described above to a prescribed amount, first mix well with a mixer, etc., and then heat-knead using a general method of kneading with a mixing roll, an extruder, a raking machine, etc. Thereby, the powdery epoxy resin molding material for sealing used in the present invention can be prepared. The various blending components may be added all at the same time, but the order of addition can also be set as appropriate. Moreover, various compounding components can be pre-kneaded as required. For example, an epoxy resin and a curing agent, a curing agent and a curing accelerator, an epoxy resin and / or a curing agent and a release agent, an epoxy resin and / or a curing agent and a stress relaxation agent, a filler and a coupling agent at room temperature or It may be used by pre-kneading under heating.
The prepared epoxy resin molding material for sealing is cooled and pulverized as necessary, and tableted with a rotary powder compression molding machine according to the present invention in a size and weight suitable for the sealing conditions. The molding material tablet for sealing is manufactured. The tablet molding conditions are not particularly limited as long as the tablet can be molded to a size suitable for the application, but the rotational speed of the rotary powder compression molding machine is preferably set to 1-50 rpm, more preferably 3-30 rpm, 20 rpm is more preferable.
[0018]
As an electronic component device obtained by sealing an element with a sealing molding material tablet obtained in the present invention, a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, a support member such as a semiconductor chip It is equipped with active elements such as transistors, diodes, thyristors, etc., passive elements such as capacitors, resistors, resistor arrays, coils, switches, etc., and the necessary parts are sealed with the sealing molding material tablet of the present invention. An electronic component device obtained in this way can be mentioned. As such an electronic component device, for example, a semiconductor element is fixed on a lead frame, and a terminal part and a lead part of an element such as a bonding pad are connected by wire bonding or bump, and then the sealing molding material of the present invention DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead package) ), TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat Package), and other general resin-encapsulated ICs, and semiconductor chips connected to the tape carrier by bumps are sealed with the sealing molding material tablet of the present invention. Stopped TCP (Tape Carrier Package), wiring formed on wiring boards and glass, wire bonding, flip chip bonding, soldering, etc. COB (Chip On Boad) module in which active elements such as semiconductor chips, transistors, diodes, thyristors and / or passive elements such as capacitors, resistors, coils, etc. are sealed with the molding material tablet for sealing of the present invention, A device is mounted on the surface of a hybrid IC, a multi-chip module, an organic substrate on which a terminal for connecting a wiring board is formed on the back surface, and after connecting the device and the wiring formed on the organic substrate by bump or wire bonding, Examples thereof include BGA (Ball Grid Array) and CSP (Chip Size Package) in which the element is sealed with a molding material tablet for sealing. Also, the sealing molding material tablet of the present invention can be effectively used for a printed circuit board.
[0019]
As a method for sealing an element using the sealing molding material tablet of the present invention, a low-pressure transfer molding method is most common, but an injection molding method, a compression molding method, or the like may be used.
[0020]
【Example】
EXAMPLES Next, although an Example demonstrates this invention, the scope of the present invention is not limited to these Examples.
[0021]
Measurement of part replacement time Conventional rotary powder compression molding machine having the same structure as the rotary powder compression molding machine of the present invention except that the mold and rail are not integrated and removable at once. Was used, the time required for detaching the mold and rail was 8 hours / unit. On the other hand, using the rotary powder compression molding machine of the present invention shown in FIG. 1, the upper mold 11, the mortar mold 12, the lower mold 13 and the rail 14, the rail fixing base 15, the turntable As a result of measuring the time required to attach and detach 4 and the standing shaft 16 as one body, it was reduced to 1/8 of the conventional type at 1 hour / unit. Moreover, by removing these dies 11 to 13 and the rail 14, it was possible to clean a place that could not be cleaned in the past, and to reduce the possibility of mixing different varieties.
[0022]
Manufacture of molding material tablets for sealing 85 parts by weight of cresol novolac type epoxy epoxy resin (trade name ESCN195, manufactured by Sumitomo Chemical Co., Ltd.) and brominated epoxy resin (trade name BREN-S, manufactured by Nippon Kayaku Co., Ltd.) as epoxy resins 15 parts by weight, 51 parts by weight of a phenol novolac resin (trade name H-1 manufactured by Meiwa Kasei Co., Ltd.) as a curing agent, 2 parts by weight of triphenylphosphine as a curing accelerator, an average particle diameter of 17.5 μm as an inorganic filler, a specific surface area 3.8 parts by weight of spherical fused silica of 3.8 m ² / g, 1 part by weight of carnauba wax (manufactured by Clariant) as an additive, ² parts by weight of carbon black (trade name MA-100, manufactured by Mitsubishi Chemical Corporation), trioxide 6 parts by weight of antimony, γ-glycidoxypropyltrimethoxysilane (epoxysilane coupling) 2 parts by weight of pre-mixing agent) was premixed by dry blending, followed by heat kneading with a biaxial roll under conditions of a kneading temperature of 80 ° C. and a kneading time of 10 minutes, and cooling and pulverizing. The obtained pulverized product was molded at a rotational speed of 10 rpm using a rotary powder compression molding machine shown in FIG. 1 to which a new mold or a mold after operation for 2,700 hours was attached, and 100 new molds were used for 2,700 hours. 100 molds after operation, and a total of 200 molding molding material tablets for examples were produced. The tablet size was 13 mm in diameter and 15 mm in height. Similarly, using a conventional rotary powder compression molding machine fitted with a new mold or a mold after 2,700 hours of operation, 100 new molds, 100 after 2,700 hours of operation, a total of 200 The comparative molding material tablet of the comparative example was manufactured.
The tablet height of the molding material tablets for sealing of the produced Examples and Comparative Examples was measured and evaluated by a process capability index (CPk). The process capability index is calculated according to the following formula, and the higher the value, the better the process capability is judged. The process capability index is used as an index for evaluating mold wear of a rotary powder compression molding machine.
CPk = (1−k) × (tolerance ÷ 6σ)
Here, σ indicates a standard deviation (in this example, the standard deviation when the tablet height is measured). The tolerance is a value indicating a standard width, and is defined by a difference between a standard upper limit (hereinafter referred to as SU) and a standard lower limit (hereinafter referred to as SL). For example, when the tablet height standard is the specified value ± 0.6 (mm), SU is the specified value +0.6, and SL is the specified value −0.6, so the tolerance is 1.2. In this embodiment, the specified value is 15 (mm). k is a value indicating a degree, and is defined by {(SU + SL) / 2−average measured value} ÷ {(SU−SL) / 2}.
The CPk value when a new mold was used showed the same value in both the examples and comparative examples. The value obtained by dividing the CPk value when using a mold after operation for 2,700 hours by the CPk value when using a new mold was 0.99 in the example and 0.75 in the comparative example. That is, in the conventional rotary compression molding machine, the tablet process capacity decreased to 75% of the initial value due to mold wear after operating for 2,700 hours, whereas in the rotary compression molding machine of the present invention, it operated for 2,700 hours. Later, the tablet process capability was almost the same as the initial value, and it was shown that the molding material tablet for sealing according to the standard could be manufactured.
[0023]
Manufacture of electronic component equipment
Using the compression molding machine tablet of Examples and Comparative Examples manufactured with a rotary compression molding machine after operation for 2,700 hours, 54 pin QFP (external dimensions 20 mm x 14 mm x 2 mm, lead frame material 42 alloy, semiconductor element dimensions) 8 mm × 10 mm) was subjected to transfer molding under the conditions of 175 ° C., 7 MPa, 90 seconds. In the comparative example, molding could not be performed due to poor filling. On the other hand, the examples had good moldability.
[0024]
【The invention's effect】
The sealing molding material tablet according to the present invention is manufactured using a rotary powder compression molding machine in which parts can be easily exchanged as shown in the examples, so the productivity is high, and the possibility of mixing different varieties, There are few standards, and if an element is sealed using this molding material tablet for sealing, an electronic component device having excellent moldability and reliability can be obtained, and its industrial value is great.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an embodiment of a rotary powder compression molding machine according to the present invention. FIG. 2 is a schematic view showing a molding part of the rotary powder compression molding machine shown in FIG.
1: Pressure roll (upper) fixed base 2: Pressure roll (upper) shaft 3: Pressure roll (upper) 4: Turntable 5: Pressure roll (lower) 6: Pressure roll (lower) shaft 7: Pressure roll (lower) fixing base 8: V pulley 9: V belt 10: Standing shaft mounting base (upper)
11: Upper metal mold 12: Mill metal mold 13: Lower metal mold 14: Rail 15: Rail fixing base 16: Vertical shaft 17: Vertical shaft mounting base (lower) 18: Worm wheel 19: Main motor 20: Motor pulley 21 : Hydraulic clamp unit 22: Fixed key

Claims (2)

Mold, have a rail and turntable slide mold, and at least the mold and the rotary powder compression molding machine was removable structure at once as a single rail, the mold and the rails It is attached to the turntable, the turntable has a vertical shaft, the vertical shaft is fixed by a hydraulic clamp unit provided on the upper and lower surfaces of the vertical shaft mounting base, and the hydraulic clamp unit is A rotary powder compression molding machine for producing a molding material tablet for sealing having a fixed key for preventing misalignment of the direction. The rotary powder compression molding machine for manufacturing a molding material for sealing according to claim 1, wherein the mold, rail, rail fixing base, turntable, and vertical shaft are integrated and can be detached at a time.

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