JP4295580B2 - Manufacturing method of rigid-flex multilayer printed wiring board - Google Patents

Manufacturing method of rigid-flex multilayer printed wiring board Download PDF

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JP4295580B2
JP4295580B2 JP2003299469A JP2003299469A JP4295580B2 JP 4295580 B2 JP4295580 B2 JP 4295580B2 JP 2003299469 A JP2003299469 A JP 2003299469A JP 2003299469 A JP2003299469 A JP 2003299469A JP 4295580 B2 JP4295580 B2 JP 4295580B2
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rigid
wiring board
printed wiring
multilayer printed
adhesive sheet
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JP2005072219A (en
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博之 大谷
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日本シイエムケイ株式会社
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本発明はリジッド・フレックス多層プリント配線板の製造方法に関する。   The present invention relates to a method for manufacturing a rigid-flex multilayer printed wiring board.

従来から可撓性を有する配線の接続部や機器筐体を兼用させた回路構成もしくは配線ないし回路ユニットの積層化、コンパクト化として図２に示されるような折り曲げ可能なプリント配線板の製造方法が既に知られている（例えば特許文献１参照）。   2. Description of the Related Art Conventionally, there is a method of manufacturing a printed wiring board that can be folded as shown in FIG. 2 as a circuit configuration or wiring or circuit unit that is also used as a flexible wiring connection part or a device case, or as a compact structure. It is already known (for example, see Patent Document 1).

以下該図２を用いて従来の製造方法を説明する。
図２（ａ）：まず、両面フレキシブル基板１１に回路１２を形成し、当該回路形成が施されたフレキシブル基板の上下にカバーレイ１３を積層してフレキシブル基板Ｐとする。 The conventional manufacturing method will be described below with reference to FIG.
FIG. 2A: First, a circuit 12 is formed on the double-sided flexible substrate 11, and coverlays 13 are stacked on the upper and lower sides of the flexible substrate on which the circuit is formed to form a flexible substrate P.

図２（ｂ）：次に、フレキシブル基板Ｐの上下に開口部を設けた接着シート１４を重ね、次いで銅箔１５を重ねる。   FIG. 2B: Next, the adhesive sheets 14 provided with openings on the upper and lower sides of the flexible substrate P are stacked, and then the copper foil 15 is stacked.

図２（ｃ）：次に、プレスにて一括積層する。因に、この積層により接着シート１４の開口部には該接着シート１４の樹脂が流れ出し、フロー部１６が形成される。   FIG. 2 (c): Next, the layers are laminated together by a press. Incidentally, by this lamination, the resin of the adhesive sheet 14 flows out to the opening of the adhesive sheet 14, and the flow part 16 is formed.

図２（ｄ）：次に、貫通穴を施し、全面にパネルめっき１７（無電解・電解銅めっき）を施す。
図２（ｅ）：次に、最外層の回路１８を形成し、リジッド・フレックス多層プリント配線板を得る。
特開平８−１０７２７４号公報 FIG. 2D: Next, through holes are provided, and panel plating 17 (electroless / electrolytic copper plating) is applied to the entire surface.
FIG. 2E: Next, the outermost circuit 18 is formed to obtain a rigid-flex multilayer printed wiring board.
JP-A-8-107274

しかしながら、前記リジッド・フレックス多層プリント配線板の製造方法は、予めフレキ部の折り曲げ部分にあたる接着シート１４に開口部を設けて積層するが、たとえローフロータイプの接着シートを使用したとしても接着シートの樹脂が、積層の際流れ出て、フロー部１６が形成されてしまい（図２（ｃ）参照）、その部分のフレキ部は折り曲げできないという問題が発生していた。特に折り曲げ部分の幅が狭い場合は、樹脂がフローして開口部を埋めてしまい、単なるリジッド板になってしまうこともあった。   However, in the manufacturing method of the rigid-flex multilayer printed wiring board, an opening is provided in the adhesive sheet 14 corresponding to the bent portion of the flexible portion in advance, and even if a low-flow type adhesive sheet is used, the adhesive sheet The resin flowed out at the time of lamination, and the flow portion 16 was formed (see FIG. 2C), which caused a problem that the flexible portion at that portion could not be bent. In particular, when the width of the bent portion is narrow, the resin may flow to fill the opening, resulting in a simple rigid plate.

さらに、接着シート付近に回路形成をした場合に、樹脂流れにより回路が斜めになる問題も発生していた。   Further, when a circuit is formed in the vicinity of the adhesive sheet, there is a problem that the circuit is inclined due to the resin flow.

本発明は、上記記載の問題点に鑑み、予め開口部を設けた接着シートを積層してリジッド・フレックス多層プリント配線板を製造しても、接着シートの樹脂が流れ出すのを防止することができるリジッド・フレックス多層プリント配線板の製造方法を提供することを目的とする。   In view of the above-described problems, the present invention can prevent the resin of the adhesive sheet from flowing out even when a rigid-flex multilayer printed wiring board is manufactured by laminating adhesive sheets provided with openings in advance. An object of the present invention is to provide a method for manufacturing a rigid-flex multilayer printed wiring board.

本発明は、リジッド部とフレキ部を備えたリジッド・フレックス多層プリント配線板の製造方法であって、フレキ部材の少なくとも一方の面に回路形成を施す工程と、前記フレキ部材の上下に開口部を備えた接着シートを重ねる工程と、前記接着シートの上下に、当該接着シートの開口部に嵌合可能な凹状突出部を備えた金属層を重ねる工程と、プレス加工にて一括積層する工程とを有することを特徴とする。   The present invention relates to a method of manufacturing a rigid-flex multilayer printed wiring board having a rigid portion and a flexible portion, the step of forming a circuit on at least one surface of the flexible member, and openings on the upper and lower sides of the flexible member. A step of stacking the provided adhesive sheets, a step of stacking a metal layer provided with a concave protrusion that can be fitted to the opening of the adhesive sheet on the upper and lower sides of the adhesive sheet, and a step of collectively laminating by pressing. It is characterized by having.

本発明によれば、プレス加工による一括積層時に、接着シートの開口部に金属層の凹状突出部が嵌合して該開口部を閉塞するので、接着シートの樹脂が流れ出すのを防止することができ、樹脂流れがもたらす従来の種々の問題を解消し得る。   According to the present invention, the concave protrusion of the metal layer is fitted to the opening of the adhesive sheet and closes the opening at the time of batch lamination by press working, so that the resin of the adhesive sheet can be prevented from flowing out. The conventional problems caused by the resin flow can be solved.

本発明において、金属層の凹状突出部は、接着シートの開口部に嵌合可能なように当該開口部の形状に対応せしめた形状とし、またその突出寸法は接着シートの厚さ寸法と略同一とするのが、接着シートの開口部をより完全に閉塞せしめる上で、特に望ましい。   In the present invention, the concave protrusion of the metal layer has a shape corresponding to the shape of the opening so that it can be fitted into the opening of the adhesive sheet, and the protrusion dimension is substantially the same as the thickness dimension of the adhesive sheet. This is particularly desirable for more completely closing the opening of the adhesive sheet.

本発明において、金属層としては、銅箔等の単一金属箔であっても良いが、銅箔とアルミ箔とを接着剤を介して貼り合わせた貼合体とするのが、強度が増し、プレス時に破れることがないので、望ましい。尚、当該銅箔の厚みとしては９〜３５μｍ程度、アルミ箔の厚みとしては２００〜５００μｍ程度が好ましい。   In the present invention, the metal layer may be a single metal foil such as a copper foil, but the bonded body obtained by bonding the copper foil and the aluminum foil via an adhesive increases the strength, This is desirable because it does not break during pressing. The thickness of the copper foil is preferably about 9 to 35 μm, and the thickness of the aluminum foil is preferably about 200 to 500 μm.

金属層が、斯かる貼合体の場合、貼合体とした後、すなわち銅箔及びアルミ箔に凹状突出部を形成しても良いが、銅箔又はアルミ箔の何れか一方のみに凹状突出部を形成した後、当該突出方向とは反対側に他方のアルミ箔又は銅箔を貼り合わせて貼合体としたものであっても良い。   In the case where the metal layer is such a bonded body, a concave protrusion may be formed on the copper foil and the aluminum foil after forming the bonded body, that is, the concave protrusion on only one of the copper foil and the aluminum foil. After forming, the other aluminum foil or copper foil may be bonded to the opposite side to the protruding direction to form a bonded body.

実施例
図１は本発明の１実施例を示すもので、以下該図１に基いて本発明を更に説明する。 Embodiment FIG. 1 shows one embodiment of the present invention, and the present invention will be further described with reference to FIG.

図１（ａ）：まず、両面フレキシブル基板１に回路形成２を施し、当該回路形成が施されたフレキシブル基板の上下にカバーレイ３を積層してフレキシブル基板Ｐとした。
図１（ｂ）：他方、銅箔５ａとアルミ箔５ｂとを接着剤５ｃを介して貼合体５とした。 FIG. 1A: First, circuit formation 2 is performed on the double-sided flexible substrate 1, and coverlays 3 are stacked on the upper and lower sides of the flexible substrate on which the circuit formation has been performed to form a flexible substrate P.
FIG. 1B: On the other hand, the copper foil 5a and the aluminum foil 5b were used as the bonded body 5 through the adhesive 5c.

図（ｃ）：次に、上記貼合体５に、金型にて銅箔５ａ側に突出する凹状突出部５ｄを加工形成した。尚、該凹状突出部５ｄは、その形状を接着シート４の開口部形状に対応せしめて嵌合可能な形状とすると共に、その突出寸法を接着シート４の厚さ寸法と略同一とした。   Figure (c): Next, a concave protrusion 5d protruding toward the copper foil 5a was processed and formed on the bonded body 5 with a mold. The concave protruding portion 5 d has a shape that can be fitted to the shape of the opening of the adhesive sheet 4, and the protruding dimension is substantially the same as the thickness of the adhesive sheet 4.

図１（ｄ）：前記フレキシブル基板Ｐに、予め開口部を設けた接着シート４を上下に重ね、更にその上下に凹状突出部５ｄを形成した貼合体５を、当該凹状突出部５ｄを接着シート４の開口部に対向せしめて重ね、次いでプレスにて一括積層し、凹状突出部５ｄを接着シート４の開口部に嵌合せしめた。
図１（ｅ）：次に、貼合体５からアルミ箔５ｂを引き剥がした。 FIG. 1 (d): An adhesive sheet 4 provided with openings in advance is vertically stacked on the flexible substrate P, and a bonded body 5 in which concave protrusions 5d are formed on the upper and lower sides thereof is bonded to the concave protrusions 5d. 4, facing each other to the opening of 4, and then stacked together by a press, and the concave protrusion 5 d was fitted into the opening of the adhesive sheet 4.
FIG. 1 (e): Next, the aluminum foil 5 b was peeled off from the bonded body 5.

図１（ｆ）：次に、貫通穴を施し、全面にパネルめっき７を施した。
図１（ｇ）：次に、外層の回路８を形成し、リジッド・フレックス多層プリント配線板を得た。
得られたリジッド・フレックス多層プリント配線板には接着シート４の樹脂流れは認められなかった。 FIG. 1 (f): Next, through holes were provided, and panel plating 7 was applied to the entire surface.
FIG. 1G: Next, the outer layer circuit 8 was formed to obtain a rigid-flex multilayer printed wiring board.
The resin flow of the adhesive sheet 4 was not recognized in the obtained rigid-flex multilayer printed wiring board.

本発明方法を示す概略断面工程説明図。FIG. 3 is a schematic cross-sectional process explanatory diagram showing the method of the present invention. 従来方法を示す概略断面工程説明図。Schematic cross-sectional process explanatory drawing which shows a conventional method.

符号の説明Explanation of symbols

１、１１：両面フレキシブル基板
２、１２：回路
３、１３：カバーレイ
４、１４：接着シート
５：貼合体
５ａ、１５：銅箔
５ｂ：アルミ箔
５ｃ：接着剤
５ｄ：凹状突出部
１６：フロー部
７、１７：パネルめっき（無電解・電解銅めっき）
８、１８：外層の回路
Ｐ：フレキシブル基板 DESCRIPTION OF SYMBOLS 1, 11: Double-sided flexible substrate 2, 12: Circuit 3, 13: Coverlay 4, 14: Adhesive sheet 5: Bonding body 5a, 15: Copper foil 5b: Aluminum foil 5c: Adhesive 5d: Concave protrusion 16: Flow Part 7, 17: Panel plating (electroless / electrolytic copper plating)
8, 18: Circuit of outer layer P: Flexible substrate

Claims (4)

リジッド部とフレキ部を備えたリジッド・フレックス多層プリント配線板の製造方法であって、フレキ部材の少なくとも一方の面に回路形成を施す工程と、前記フレキ部材の上下に開口部を備えた接着シートを重ねる工程と、前記接着シートの上下に、当該接着シートの開口部に嵌合可能な凹状突出部を備えた金属層を重ねる工程と、プレス加工にて一括積層する工程とを有することを特徴とするリジッド・フレックス多層プリント配線板の製造方法。   A method of manufacturing a rigid-flex multilayer printed wiring board having a rigid portion and a flexible portion, the step of forming a circuit on at least one surface of the flexible member, and an adhesive sheet having openings above and below the flexible member A step of stacking a metal layer provided with a concave protrusion that can be fitted to an opening of the adhesive sheet on the upper and lower sides of the adhesive sheet, and a step of laminating at a time by pressing. A manufacturing method of a rigid-flex multilayer printed wiring board. 金属層の凹状突出部の突出寸法が、接着シートの厚さ寸法と略同一であることを特徴とする請求項１記載のリジッド・フレックス多層プリント配線板の製造方法。   2. The method of manufacturing a rigid-flex multilayer printed wiring board according to claim 1, wherein a protruding dimension of the concave protruding portion of the metal layer is substantially the same as a thickness dimension of the adhesive sheet. 金属層が、銅箔とアルミ箔とを接着剤を介して貼り合わせた貼合体であることを特徴とする請求項１又は２記載のリジッド・フレックス多層プリント配線板の製造方法。   The method for producing a rigid-flex multilayer printed wiring board according to claim 1 or 2, wherein the metal layer is a bonded body obtained by bonding a copper foil and an aluminum foil through an adhesive. 銅箔及び／又はアルミ箔に凹状突出部が形成されていることを特徴とする請求項３記載のリジッド・フレックス多層プリント配線板の製造方法。   4. The method of manufacturing a rigid-flex multilayer printed wiring board according to claim 3, wherein concave protrusions are formed on the copper foil and / or the aluminum foil.
JP2003299469A 2003-08-25 2003-08-25 Manufacturing method of rigid-flex multilayer printed wiring board Expired - Fee Related JP4295580B2 (en)

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