JP4293032B2 - Manufacturing method of electronic component mounting structure - Google Patents

Description

  The present invention relates to a method of directly bonding electrode terminals formed on a substrate, and more particularly to a method of manufacturing a connection pad for bonding an electrode terminal of a semiconductor element or the like and an electrode terminal of a wiring substrate by a flip chip method.

  2. Description of the Related Art In recent years, with the increase in speed and size of devices, semiconductor devices have been highly integrated, and a multichip module in which a plurality of semiconductor devices are arranged on one substrate has been performed. A multichip module mounted with high density is required to shorten the distance between electrodes in order to perform high-speed signal processing. In addition, the number of electrode terminals is increasing with the higher functionality of semiconductor elements, and the electrode terminal pitch can be narrowed from about 100 μm to several μm to several tens μm in order to reduce the size of the semiconductor elements. It is requested. Therefore, it is necessary to reduce the pitch of the connection pads formed for joining the electrode terminals of the semiconductor element and the electrode terminals of the substrate.

  In the conventional manufacturing method, such connection pads are generally formed with bump electrodes called bumps on the electrode terminals of the semiconductor element by solder plating, gold plating or wire bump methods. For this reason, the pitch between the electrode terminals had to be relatively large. In addition, with such a connection method using bumps, repair is not easy even if a defective semiconductor element or connection failure is found by inspection, and other good semiconductor elements and wiring boards are often discarded. It was an obstacle to cost.

  On the other hand, there is a method of bonding a substrate and a semiconductor element using a thermoviscous adhesive made of a conductive polymer. In this method, it is shown that a conductive polymer composed of a thermoviscous adhesive is formed by screen printing (for example, Patent Document 1).

On the other hand, there is also a method of forming a conductive organic electrode patterned on a substrate using a hydrophobic mask. According to this, a solution in which a conductive organic substance is dissolved in an organic solvent is dropped on the water surface. A method of forming a conductive organic electrode on a substrate surface by forming a thin film and placing the surface of the substrate on which an opening having a predetermined electrode pattern shape is provided in advance through a hydrophobic mask. There is (for example, Patent Document 2).
JP-A-7-226419 JP 2002-216553 A

  In the first example described above, it is stated that a conductive polymer is used. However, the materials described in the examples include a conductive metal filler in an insulating organic polymer. Since it is restricted by the particle size of the metal filler and the like, it is difficult to produce unless a screen printing or ink jet method is used. For this reason, it is difficult to produce at a fine pitch.

  In the second example, a conductive organic thin film patterned on a substrate is manufactured through a hydrophobic mask. However, in such a method, the mask cannot be made too thin. The opening cannot be made too small. For this reason, it is difficult to produce with fine pitch even by this method. Actually, in the example of the pattern produced on the substrate, the width is 3 mm and the length is 25 mm. In this method, the material must be deposited on the surface of water, and there is a restriction on the conductive polymer material that can be used.

  An object of the present invention is to solve such a conventional problem and to provide a method of manufacturing an electronic component mounting structure capable of forming a connection pad easily at a low cost even with a fine pitch. .

  In order to solve the above-described problems, in the method for manufacturing an electronic component mounting structure according to the present invention, a solution containing a conductive polymer is attached to at least a substrate surface on which a plurality of electrode terminals are formed. It consists of a method of selectively forming a connection pad made of a conductive polymer by transferring and applying from a roller and aggregating and fixing the solution on the electrode terminal by a dewetting method. By this method, it is possible to realize a fine-pitch connection pad, which cannot be obtained by conventional screen printing or ink jet method, by a simple method.

  In addition, when applying the solution onto the substrate surface through the roller to which the solution is attached, one of the rotation speed of the roller, the moving speed, the gap between the roller and the substrate, the concentration of the solution, and the heating temperature of the substrate. By setting the above conditions in advance, a connection pad may be selectively formed on the surface of the electrode terminal, and the height of the connection pad may be adjusted.

  Further, in the dewetting method, by providing a difference in surface free energy between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to be made of a conductive polymer. A connection pad may be formed. In this case, the surface free energy may be smaller on the surface of the electrode terminal than on the surface other than the electrode terminal.

  In such a method, a step of forming a mask for protecting the surface of the electrode terminal, a step of forming a thin film on the surface of the substrate that reduces wettability to the solution on the surface of the substrate, and after forming the thin film, The surface free energy may be made smaller on the surface of the electrode terminal than on the surface other than the electrode terminal by further adding a step of removing the mask protecting the surface. Alternatively, the surface of the substrate on which the electrode terminal is formed may be subjected to plasma treatment or ultraviolet irradiation treatment so that the surface free energy is smaller on the surface of the electrode terminal than on the surface other than the electrode terminal. By providing a difference in the surface free energy in this way, the solution can be more reliably aggregated and fixed only on the surface of the electrode terminal.

  Further, by providing a difference in chemisorption energy between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to form a connection pad made of a conductive polymer. May be. In this case, the chemisorption energy may be greater on the surface of the electrode terminal than on the surface other than the electrode terminal. As a method for providing the difference in chemisorption energy, for example, the surface of the electrode terminal may be gold (Au) and the surface other than the electrode terminal may be an oxide insulating film.

  Further, by providing a difference in surface shape between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to form a connection pad made of a conductive polymer. Also good. In addition, as a method of providing a difference in the surface shape, for example, a method of providing a minute height difference between the surface of the electrode terminal and the surface other than the electrode terminal, a method of forming minute irregularities on the entire surface other than the electrode terminal, etc. There is.

  Furthermore, it is good also as a method which installs the substrate surface which should apply | coat a solution downward in the perpendicular direction, and applies a solution to a substrate surface from a lower side via a roller. In this method, a solution reservoir for replenishing the solution to the roller may be provided, and the solution reservoir may be disposed at the bottom of the substrate. If the solution is applied through a roller with such an arrangement, an unnecessarily large amount of solution will not adhere to the substrate surface, and the solution can be more selectively aggregated and fixed on the surface of the electrode terminal. .

  Furthermore, when applying the solution on the substrate surface via the roller to which the solution is adhered, the roller application conditions are set in advance according to the arrangement pitch of the electrode terminals on the substrate surface and the thickness of the connection pad to be formed. The application operation may be performed according to the application conditions set above. The application conditions include, for example, the diameter of the roller, the rotation speed, the moving speed, the distance between the roller and the substrate, the temperature of the substrate, the temperature of the conductive polymer solution, and the like. By adopting such a coating method, it is possible to form a connection pad on the electrode terminal surface without causing misalignment or the like even with respect to substrates having different arrangement pitches or the like of the electrode terminals.

Further, as the conductive polymer, a material having conductivity and light transmittance after curing may be used. As this solution, polyisothianaphthene doped with methyl trichloride (CHCl ₃ ) as a solvent and iodine doped as a conductive polymer may be used. By using such a material, electrical connection and optical connection can be performed simultaneously. For example, in a light emitting element such as an LED or a light receiving element, it can be used not only as an electrode terminal for electrical connection but also as an optical waveguide between the light emitting element or the light receiving element and the substrate.

  Alternatively, the conductive polymer material contained in the solution may include a polymer having a polythiophene skeleton or a material obtained by adding a dopant to this polymer. Specifically, for example, polythiophene, polyalkylthiophene, polyisothianaphthene, polyalkylisothianaphthene, polyalkoxyisothianaphthene, polynitroisothianaphthene, polyaminoisothianaphthene, polychenylene vinylene, polyretylene dioxythiophene , Polyalkylenedioxythiophene, or a block copolymer of polythiophene and pyrrole, or the like, as long as it has a polythiophene skeleton.

  Further, as a dopant serving as a donor, an alkali metal such as lithium, sodium, potassium, cesium, or a dopant serving as an acceptor, halogens such as bromine, iodine, chlorine, or Lewis acid such as boron fluoride or fluoride. Scales, arsenic fluoride, ammonium fluoride, antimony fluoride, or protonic acids such as nitric acid, sulfuric acid, hydrofluoric acid, hydrochloric acid, or transition metal halides such as iron chloride, molybdenum chloride, tungsten chloride, molybdenum fluoride, ruthenium fluoride Or low molecular weight materials such as TCNQ, TCNE, or supramolecular materials such as porphyrin, phthalocyanine, or polymers such as polyester sulfonate, polyvinyl sulfonic acid, and the like.

Specific examples in the case of producing the above solution include polyethylene dioxythiophene (Poly- (3,4-ethylene-dioxy-thiophene)) and polystyrene sulfonate to which the above donor material and acceptor material are added. (Poly- (4-styrene-sulfate)) in a solution of water (H ₂ O) or ethyl alcohol (C ₂ H ₅ OH) as a solvent, or metal in a solvent of methyl trichloride (CHCl ₃ ) Various solutions such as a solution in which polyhexylthiophene (Poly- (3-hexylthiophene)) doped with bismuth is dissolved, or polystyrene (Poly-styrene) in which metal nanoparticles are mixed in methyl trichloride (CHCl ₃ ) as a solvent Can be used.

  By using such a material, a conductive polymer material having high conductivity can be easily and selectively formed on the surface of the electrode terminal of the substrate using a roller. When polystyrene containing metal nanoparticles is used as the conductive polymer material, the metal nanoparticles are relatively conductive such as gold (Au), silver (Ag), nickel (Ni), and copper (Cu). It is desirable to use a good metal.

  According to the method for manufacturing an electronic component mounting structure of the present invention, for example, a solution containing a conductive polymer can be selectively applied onto the surface of an electrode terminal of a semiconductor substrate on which a semiconductor element is formed. The applied solution becomes a connection pad by heating or drying, and can be connected to the electrode terminal formed on the wiring board after dicing into a semiconductor element chip via the connection pad. For this reason, it is possible to manufacture a connection pad that is low in cost and high in mass productivity, and has a great effect in a field that requires various mountings.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same element and description may be abbreviate | omitted.

(First embodiment)
FIG. 1 is a conceptual configuration diagram for explaining a method of manufacturing an electronic component mounting structure according to a first embodiment of the present invention. A solution (hereinafter referred to as a conductive polymer solution) 4 containing a conductive polymer adhering to the surface of the roller 1 is fixed to the surface of the substrate holder 3 as the roller 1 advances while rotating in the direction of the arrow. Transferred to the surface of the substrate 2.

  In the present embodiment, a semiconductor substrate on which a large number of semiconductor elements are formed is described as an example of the substrate 2. 2A and 2B are views showing the shape of the semiconductor substrate. FIG. 2A is a plan view and FIG. 2B is a partially enlarged view. As shown in the drawing, a plurality of semiconductor elements 21 are regularly formed, and electrode terminals 20 corresponding to the respective semiconductor elements 21 are exposed on the surface. The electrode terminals 20 are regularly arranged as shown in FIG. With respect to the running direction 22 of the roller 1, the rows of electrode terminals 20 are arranged at fixed intervals. Further, the pitch of each electrode terminal 20 is constant. Such an arrangement of the electrode terminals 20 needs to be set as appropriate according to the design of the semiconductor element 21, but is preferably in the range of several μm to several tens of μm.

  In the case of the pattern configuration shown in FIG. 2, since the electrode terminals 20 are arranged on both sides of the semiconductor element 21, the distance between the rows of the electrode terminals 20 with respect to the running direction 22 of the roller 1 is the element. In the case of sandwiching the region where only the film is formed or the dicing line region, it becomes relatively large. For this reason, according to such arrangement | positioning, the rotation speed of the roller 1, a moving speed, and the space | interval of the roller 1 and the semiconductor substrate 2 are set. That is, in a region where only elements are formed, the conductive polymer solution is added to the semiconductor substrate 2 by increasing the rotation speed and movement speed of the roller 1 or increasing the gap between the roller 1 and the semiconductor substrate 2. 4 is hardly applied, and a more selective connection pad can be formed.

  Since the electrode terminals 20 of the semiconductor element 21 are also provided on the element formation surface constituting the semiconductor element 21, in that case, the electrode terminals 20 may be arranged on the entire surface of the semiconductor element 21 at substantially equal intervals. it can. In this case, dummy electrode terminals that do not actually need to be electrically connected can also be provided. If such a dummy electrode terminal is provided and a dummy electrode terminal is also provided on the corresponding wiring board and these are connected by a connection pad, the mechanical connection strength can be increased.

  As shown in FIG. 1, when the roller 1 rotates on the semiconductor substrate 2, the conductive polymer solution 4 forms a thin film on the semiconductor substrate 2. However, an unstable state gradually occurs at the liquid phase, solid phase, or gas phase three-phase interface, and as a result, the conductive polymer solution 4 is regularly broken to form island-like regular patterns. This is called the self-organization phenomenon.

  FIG. 3 is a principle diagram for explaining a method of forming a regular pattern by this self-organization phenomenon. In FIG. 3, the substrate 30 is transported in the substrate transport direction 35 by the substrate transport roller 32. At this time, a conductive polymer solution 33 is applied to the surface of the roller 31, and the conductive polymer solution 33 is transferred to the substrate 30. The conductive polymer solution 33 is appropriately applied onto the roller 31 from a dispenser or the like (not shown). If the conveyance speed of the substrate 30, the gap between the roller 31 and the substrate 30, the concentration and the temperature of the conductive polymer solution 33 and the temperature of the substrate 30 are set in advance, the conductive polymer solution applied from the roller 31. 33 are aggregated into a droplet 34 by a constant arrangement pitch by a self-organization phenomenon. The present invention actively applies this phenomenon to selectively agglomerate the conductive polymer solution 4 on the electrode terminals 20 of the semiconductor substrate 2 to form droplets, which are heated or dried to connect the connection pads. Form.

In the present embodiment, in the semiconductor substrate 2 and coating method as shown in FIGS. 1 and 2, the transport speed of the semiconductor substrate 2, the gap between the roller 1 and the semiconductor substrate 2, the conductivity, based on the arrangement pitch of the electrode terminals 20 The concentration and temperature of the conductive polymer solution 4 and the temperature of the semiconductor substrate 2 are set and applied. As the conductive polymer solution 4, for example, the solvent is ethyl alcohol (C ₂ H ₅ OH), and the conductive polymer material is polyethylene dioxythiophene (Poly- (3,4-ethylene-dioxy-thiophene)) and polystyrene. Sulfonate (Poly- (4-styrene-sulfonate)) can be used.

  In addition, as shown in FIG. 2, when the electrode terminals 20 are arranged only in both lateral portions of the semiconductor element 21, the region portion where the electrode terminals are formed and the region portion where the electrode terminals are not formed are The selectivity can be further improved by changing the gap between the roller 1 and the semiconductor substrate 2 or the transport speed of the roller 1 while the roller 1 is running. When the roller 1 is conveyed and the conductive polymer solution 4 is applied onto the semiconductor substrate 2 by setting as described above, droplets are selectively formed on the surface of the electrode terminal 20. Since this self-organization phenomenon can form a very regular fine pattern, the connection pads can be formed easily and in a simple manner even when the pitch of the electrode terminals is reduced.

  A connection pad (not shown) made of a conductive polymer is formed on the surface of the electrode terminal 20 by evaporating the solvent in the droplets aggregated and fixed in this way.

  After a connection pad made of a conductive polymer is formed on the surface of the electrode terminal 20, the semiconductor substrate 2 is diced to form individual semiconductor element chips. When this semiconductor element chip is aligned and pressed with the electrode terminals of the wiring substrate, the electrode terminals are electrically and mechanically connected to each other by connection pads formed on the semiconductor element chip.

  In addition, when the thickness of a connection pad is required to some extent, after drying once, the same application | coating process should just be repeated again.

  FIG. 4 is a diagram showing the semiconductor substrate 25 in the case where the arrangement configuration of the electrode terminals is different in the method for manufacturing the electronic component mounting structure according to the present embodiment. An electrode terminal 42 is provided in the outer peripheral region of the semiconductor element 41, and a connection pad is formed on the surface of the electrode terminal 42. As a coating method, the method shown in FIG. 1 is used. That is, the conveyance speed of the roller 1, the gap between the roller 1 and the semiconductor substrate 25, the concentration and temperature of the conductive polymer solution 4, the temperature of the semiconductor substrate 25, and the like are set in advance. After the setting, the conductive polymer solution 4 is applied by adhering and fixing the semiconductor substrate 25 to the substrate holder 3 and transporting the roller 1.

  When the roller 1 moves in the direction of the arrow 43 on the semiconductor substrate 25, the conductive polymer solution 4 selectively aggregates and adheres to the electrode terminals 42. At this time, as shown in FIG. 4, the application condition of the roller 1 is changed in the regions indicated by the regions a, b, and c. For example, the conveyance speed of the roller 1 is decreased in the region a, the gap between the roller 1 and the semiconductor substrate 25 is increased in the region b, and the speed of the roller 1 is also decreased. In the region c, the gap between the roller 1 and the semiconductor substrate 25 is increased so that the thin film of the conductive polymer solution 4 does not adhere to the semiconductor substrate 25. In order to enable such coating, the coating conditions may be set in advance based on the arrangement of the semiconductor elements 41 formed on the semiconductor substrate 25 and the arrangement of the electrode terminals 42 of the semiconductor elements 41. For example, if the diameter, rotational speed, moving speed of the roller 1, the distance between the roller 1 and the semiconductor substrate 25, the temperature of the semiconductor substrate 25, the temperature of the conductive polymer solution 4 and the like are set based on experimental conditions and the like, FIG. Even if the electrode terminals 42 are arranged as shown in FIG.

  According to the manufacturing method of the present embodiment, a connection pad made of a conductive polymer can be selectively formed on the surface of an electrode terminal provided at a predetermined position on a substrate by a simple method, so that it is inexpensive and greatly increases mass productivity. Can improve.

(Second Embodiment)
FIG. 5 is a diagram for explaining a method of manufacturing the electronic component mounting structure according to the second embodiment of the present invention. Fig.5 (a) is the perspective view, FIG.5 (b) is the figure which took out only a part of cross section along the AA line. Also in the present embodiment, a semiconductor substrate in which a large number of semiconductor elements are arranged will be described as an example of the substrate.

  The semiconductor substrate 52 is held downward with respect to the vertical direction by the substrate holder 51 by a vacuum chuck (not shown). As a method of transporting the substrate holder 51 in the horizontal direction, in the present embodiment, the transport screw 58 is rotated. The method of transporting the substrate holder 51 is not limited to the method using the transport screw 58, and any known technique can be used as long as it is a method of moving the substrate holder 51 at a predetermined speed in the horizontal direction.

A reservoir 55 that stores a conductive polymer solution 53 is installed below the semiconductor substrate 52, and the roller 54 rotates in contact with the conductive polymer solution 53. In the present embodiment, as the conductive polymer solution 53, a case where the solvent is methyl trichloride (CHCl ₃ ) and the conductive polymer material is polyhexylthiophene doped with metal (Poly- (3-hexylthiophene)). As an example, when the semiconductor substrate 52 is conveyed while the roller 54 rotates, electrode terminals (not shown) in which droplets 57 of the conductive polymer solution 53 are arranged on the surface of the semiconductor substrate 52 by a self-organization phenomenon. Z) formed on top.

  The surface freeness of the surface of the semiconductor substrate 52 other than the electrode terminals is such that a self-organization phenomenon occurs more reliably at the time of coating, and the droplets 57 of the conductive polymer solution 53 are selectively formed only on the electrode terminals. It is effective to increase energy.

  FIG. 6 is a process diagram showing a manufacturing method for increasing the surface free energy of the surface other than the electrode terminals. A photoresist 62 is applied to the semiconductor substrate 52. This is shown in FIG. Thereafter, a photoresist pattern 64 is formed on the electrode terminal 60 through an exposure and development process. This is shown in FIG. After this state, a liquid repellent film 63 having liquid repellency, for example, water repellency when the solvent is water, is applied to the entire surface. This is shown in FIG. Thereafter, the photoresist pattern 64 is peeled off. When the photoresist pattern 64 is peeled off, a pattern in which the liquid repellent film 63 is formed on the surface other than the electrode terminal 60 is produced. This state is shown in FIG. In this way, a difference in surface free energy between the surface of the electrode terminal 60 and the other surface is provided. When the conductive polymer solution 53 is applied to the semiconductor substrate 52 by the method shown in FIG. 5, droplets 57 are formed only on the electrode terminals 60. If this droplet 57 is heated or dried, a connection pad is obtained.

As the liquid repellent film 63, a fluorocarbon-based chemical adsorption film, for example, a chlorosilane-based surfactant having a fluorinated alkyl group, particularly CF ₃ (CF ₂ ) _n CH ₂ CH ₂ S semiconductor element l ₃ (however, In the formula, n is an integer, and about 3 to 25 is most easy to handle). Thus, good water repellency and oil repellency can be obtained.

  FIG. 7 is a process diagram showing another method for increasing the surface free energy of the surface other than the surface of the electrode terminal 60 of the semiconductor substrate 52. A photoresist 62 is applied to the surface of the semiconductor substrate 52. This state is shown in FIG. Next, a photoresist pattern 64 is formed on the surface of the electrode terminal 60 through exposure and development processes of the photoresist 62. This state is shown in FIG. Thereafter, the semiconductor substrate 52 is placed in a plasma processing apparatus, and plasma processing is performed in a gas containing fluoride gas. By this plasma treatment, fluorine is attached to the surface of the semiconductor substrate 52. By this treatment, the surface treatment layer 65 of the semiconductor substrate 52 has liquid repellency, for example, water repellency when the solvent is water. This state is shown in FIG. Thereafter, the photoresist pattern 64 on the electrode terminal 60 is peeled off. This state is shown in FIG. When the conductive polymer solution 53 is applied by the method shown in FIG. 5 using the semiconductor substrate 52 that has been subjected to such treatment, droplets 57 are formed only on the electrode terminals 60. If this droplet 57 is heated or dried, a connection pad is obtained.

  In the manufacturing method of the present embodiment, since the liquid repellent film 63 or the surface treatment layer 65 having liquid repellency is formed on the surface of the semiconductor substrate 52 excluding the surface of the electrode terminal 60, the conductive polymer The solution 53 is repelled and does not adhere on this surface. Therefore, the effect of liquid repellency is also added and the self-organization phenomenon can be generated more reliably. Furthermore, since the semiconductor substrate 52 is applied in the vertical direction downward, even if it partially adheres to the surface of the liquid repellent film 63 or the surface treatment layer 65, it immediately falls to the reservoir 55. Due to these effects, the conductive polymer solution 53 can be selectively aggregated only on the surface of the electrode terminal 60 to form the droplets 57.

  In this embodiment, when the thickness of the connection pad is increased, the droplets are formed, dried, and then applied in the same manner, so that the droplets agglomerate only on the surface of the electrode terminal. Can be increased in thickness.

  The manufacturing method of the electronic component mounting structure according to the present invention can not only make a fine and high-density connection pad very easily and in a short time, but also easily form a connection pad even on a narrow pitch electrode terminal. Therefore, the present invention is particularly useful in the field where the electrode terminals of a semiconductor element chip and the like and the electrode terminals of the wiring board are joined by a flip chip method.

The conceptual block diagram for demonstrating the manufacturing method of the structure for electronic component mounting concerning the 1st Embodiment of this invention. The figure which shows the shape of the semiconductor substrate used for the manufacturing method of the embodiment Principle diagram for explaining a method of forming a regular pattern by the self-organization phenomenon used in the manufacturing method of the embodiment The figure which shows the semiconductor substrate when the arrangement structure of an electrode terminal differs in the manufacturing method of the embodiment The figure for demonstrating the manufacturing method of the structure for electronic component mounting concerning the 2nd Embodiment of this invention. Process drawing which shows the manufacturing method for enlarging the surface free energy of surfaces other than an electrode terminal in the manufacturing method of the embodiment Process drawing which shows another method for enlarging the surface free energy of surfaces other than the surface of the electrode terminal of a semiconductor substrate in the manufacturing method of the embodiment

Explanation of symbols

1,31,54 Roller 2,25,52 Semiconductor substrate (substrate)
3, 51 Substrate holder 4, 33, 53 (Conductive polymer) solution 20, 42, 60 Electrode terminal 21, 41 Semiconductor element 30 Substrate 32 Substrate transport roller 34, 57 Droplet 55 Reservoir 58 Transport screw 62 Photo resist 63 Liquid film 64 Photoresist pattern 65 Surface treatment layer

Claims (15)

A solution containing a conductive polymer on a substrate surface having at least a plurality of electrode terminals formed on the surface is transferred and applied from a roller to which the solution is adhered, and the solution is aggregated on the electrode terminals by a dewetting method. A method of manufacturing a structure for mounting an electronic component, wherein a connection pad made of a conductive polymer is selectively formed on the electrode terminal. When the solution is applied onto the substrate surface through the roller to which the solution is attached, the rotation speed of the roller, the movement speed, the gap between the roller and the substrate, the concentration of the solution, and the concentration of the substrate The connection pad is selectively formed on the surface of the electrode terminal by setting one or more conditions of the heating temperature in advance, and the height of the connection pad is adjusted. 2. A method for producing an electronic component mounting structure according to 1. By providing a difference in surface free energy between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to form the connection pad made of a conductive polymer. The manufacturing method of the structure for electronic component mounting of Claim 1 or Claim 2 characterized by the above-mentioned. By providing a difference in chemisorption energy between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to form the connection pad made of a conductive polymer. The manufacturing method of the structure for electronic component mounting of Claim 1 or Claim 2 characterized by the above-mentioned. By providing a difference in surface shape between the surface of the electrode terminal and the surface other than the electrode terminal, the solution is selectively aggregated and fixed on the electrode terminal to form the connection pad made of a conductive polymer. The method for manufacturing an electronic component mounting structure according to claim 1 or 2, wherein: 4. The method for manufacturing an electronic component mounting structure according to claim 3, wherein the surface of the electrode terminal has a surface free energy smaller than that of a surface other than the electrode terminal. 5. The method for manufacturing an electronic component mounting structure according to claim 4, wherein the surface of the electrode terminal has a larger chemical adsorption energy than the surface other than the surface of the electrode terminal. Forming a mask for protecting the surface of the electrode terminal, forming a thin film on the surface of the substrate to reduce wettability of the surface of the substrate with respect to the solution, and forming the thin film; The surface free energy is made smaller on the surface of the electrode terminal than on the surface other than the electrode terminal by further adding a step of peeling the mask that protects the surface. The manufacturing method of the structure for electronic component mounting of description. The surface free energy of the surface of the electrode terminal is made smaller than the surface other than the electrode terminal by performing plasma treatment or ultraviolet irradiation treatment on the surface of the substrate on which the electrode terminal is formed. Item 7. A method for manufacturing an electronic component mounting structure according to Item 6. The substrate surface to which the solution is to be applied is placed downward in the vertical direction, and the solution is applied to the substrate surface from the lower side via the roller. A method for manufacturing an electronic component mounting structure according to claim 1 . 11. The method of manufacturing an electronic component mounting structure according to claim 10, further comprising: a solution reservoir for replenishing the roller with the solution, wherein the solution reservoir is disposed below the substrate. The roller application conditions are set in advance according to the arrangement pitch of the electrode terminals on the substrate surface and the thickness of the connection pad to be formed, and the solution is applied to the substrate surface via the roller. when applying a solution, method for manufacturing an electronic component mounting structure according to any one of claims 1 to 11, characterized in that performing the coating operation according to the coating condition set. As the conductive polymer, a method of manufacturing an electronic component mounting structure according to any one of claims 1 to 12, characterized in that a material having a conductive and optically transparent after curing . Any of the preceding claims, characterized in that a composition comprising a material obtained by adding a dopant to the polymer or the polymer having the polythiophene backbone as the conductive polymer material contained in said solution to claim 13 1 The manufacturing method of the structure for electronic component mounting as described in a term . 14. The structure for mounting an electronic component according to claim 13, wherein the solution uses methyl trichloride (CHCl ₃ ) as a solvent and polyisothianaphthene doped with iodine as a conductive polymer. Production method.

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