JP4288740B2 - Resin molded product having conductive portion and method for producing the same - Google Patents

Resin molded product having conductive portion and method for producing the same Download PDF

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Publication number
JP4288740B2
JP4288740B2 JP4953399A JP4953399A JP4288740B2 JP 4288740 B2 JP4288740 B2 JP 4288740B2 JP 4953399 A JP4953399 A JP 4953399A JP 4953399 A JP4953399 A JP 4953399A JP 4288740 B2 JP4288740 B2 JP 4288740B2
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Japan
Prior art keywords
conductive
resin
molded product
conductive portion
resin molded
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JP4953399A
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Japanese (ja)
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JPH11342522A (en
Inventor
晃和 松本
孝巳 野田
健志 谷垣
省吾 井沢
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Aisin Corp
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Aisin Seiki Co Ltd
Aisin Corp
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  • Parts Printed On Printed Circuit Boards (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、導電部を有する樹脂成形品とその製造方法に関し、更に詳細には内部に3次元形状を呈する導電部を有する樹脂成形品及びその製造方法に関する。
【0002】
【従来の技術】
従来、導電部を有する樹脂成形品として、例えば、特開平10−9893号公報及び特開平10−12995号公報に開示されるものがある。前者の公報に開示される樹脂成形品等は、例えば金属板をプレス成形した導電部を一体的に有するもので、図11に3次元形状を呈する導電部を有する樹脂成形品の製造方法を示す。図11においては、先ず、導電部となる金属板が、プレス型A,Bにより所定形状に切断される。その後、曲げ型A,BおよびC,Dにより3次元的な所定形状となるように、数回曲げ加工を施され、金型を開いて、導電部が所定形状に曲げられたプレス品として金型より取り出される。一方、樹脂成形品は、凹凸の2つの金型により、キャビティ空間を作り、そのキャビティ空間に樹脂を射出装置から射出することにより成形される。そして、射出成形された樹脂成形品上にプレス成形された導電部をセットした後、取付部位を熱間プレス型により熱かしめを行い、樹脂成形品と導電部とが一体化される。
【0003】
また、後者の公報に開示される樹脂成形品においては、樹脂成形品の表面に金属メッキを施こすことにより、導電部を有する樹脂成形品が製造される。
【0004】
【本発明が解決しようとする課題】
しかしながら、上記した前者の樹脂成形品においては、導電部がプレス成形されて形成されるため、導電部のパターン形状が制約を受けると共に、プレス加工により材料ロスが発生するという問題があった。更に、導電部のパターンを3次元的な複雑なものにしようとすると、複雑になればなる程、導電部のパターンの曲げ加工が何回も必要になり、製造コストが増大するという問題があった。
【0005】
また、後者のようにメッキを施すことに導電部を有する樹脂成形品を得るものでは、3次元形状をした導電部を形成することは可能であるが、そのためにメッキ工程数が増大し、同じく製造コストの増大を招く。
【0006】
そこで、本発明は上記の問題点に鑑みてなされたものであり、製造コストの増大を招くことなく製造可能な、3次元形状の導電部を有する樹脂成形品及びその製造方法を提供することを技術的課題とする。
【0007】
【課題を解決するための手段】
上記課題を解決するために講じた技術的手段は、射出成形により形成される導電部を有する導電性樹脂成形品において、前記導電部を熱可塑性樹脂中に射出成形時に溶融する合金を配合することにより形成し、導電性を付与し、更に、貫通孔が形成された金属製のコネクタ端子を有し、貫通孔を含むコネクタ端子の一端側部位を導電性樹脂により被覆してコネクタ端子と導電部を電気的に接続したことを特徴とする導電部を有する導電性樹脂成形品としたことである。
【0008】
この手段によれば、導電性樹脂の流動性によって、3次元形状の複雑な形状の導電部でも容易に形成することができ、当該樹脂成形品の製造コストを低減することが可能となる。
【0009】
上記した手段において、導電性樹脂を樹脂成形時に成形可能であると共に鉛を含まず錫を主成分とした低融点合金を、熱可塑性樹脂または熱硬化性樹脂に混練して生成すれば、樹脂成形時には合金が溶け、電気が流れ易い導電部を有する導電性樹脂を形成することができる。
【0010】
また、好ましくは、樹脂成形品が導電性樹脂から成るコネクタ端子を有する構成とすれば、樹脂成形品に導電性樹脂により導電部を形成する際に導電部と電気的接続が良好なコネクタ端子を一体で設けることが可能となる。このため、コネクタ端子と導電部との接続にリード線を用い、リード線を半田付けする必要がなくなることから、部品点数が削減される。
【0011】
また、樹脂成形品が金属製のコネクタ端子を有する場合には、コネクタ端子に貫通孔を形成し、貫通孔を含むコネクタ端子の一端側部位を導電性樹脂により被覆することで、部品点数の削減を図りつつ、導電部と金属製コネクタ端子間の良好な電気的接続を得ることができる。
【0012】
【発明の実施の形態】
以下、本発明の実施形態を図面を参照して説明する。
【0013】
図1乃至図3は、本発明に従った導電部を有する樹脂成形品の第1実施形態を示す。本第1実施形態では、車両のブレーキランプまたはウィンカ等を点滅または点灯させるランプユニットに本発明を適用した例を示す。
【0014】
このランプユニットは、樹脂により成形された樹脂成形品である回路基板1に点灯または点滅するランプ6が取り付けられるものであり、2つの筒状5aとなったランプソケット5を回路基板1の両側にもっている。ランプソケット5からは配線パターン(導体部)2,3,4が、2つのランプソケット5のプラス端子3b、4cおよびマイナス端子2b,2cからコネクタ部7にまで延びており、それぞれのランプソケット5にランプ6のプラス端子6a、マイナス端子6bが嵌まり、回路基板上のそれぞれのプラス端子3b,4c、マイナス端子2b,2cに接触する。従って、コネクタ部7の端子2a,3aに対して外部から所定の電圧を印加すれば、ランプ6が点灯または点滅し、同様に端子2a,4aに所定の電圧を印加すれば、ランプ6が点灯または点滅する。
【0015】
そこで、上記の構成において導電部となる配線パターン2、3、4に導電性樹脂を用いていることを特徴とする。この導電性樹脂は、2種類のものが考えられ、その1つは熱可塑性樹脂中に導電性の繊維が配合されたものを使用し、導電性の繊維は物理的に接合しているものと、低融点の半田により接合されているものがある。導電性の金属繊維としては、体積固有抵抗が10- Ω・cm程、例えば、銅系、ニッケル系、鉄系といったものを用いることができ、熱可塑性樹脂の中に電気抵抗を小さくする範囲内(最大で80重量%)で混合する。この場合、導電性の繊維のアスペクト比は、1〜1000までのものを使用すると良い。
【0016】
また、導電性の繊維が配合される熱可塑性樹脂としては、プロピレン、ポリエチレン、ポリスチレン、アクリロニトリル・ブタジエン・スチレン樹脂、変性ポリフェニレンオキサイド樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンテレフタレート樹脂、ポリアミド樹脂、芳香族ポリアミド樹脂、ポリフェニレンサルファイド樹脂、液晶ポリマー、ポリエーテルイミド、ポリベンゾイミダゾール、ポリエーテルエーテルケトン、ポリエーテルサルフォン等の樹脂を用いることが可能であり、特にアクリロニトリル・ブタジエン・スチレン樹脂、ポリブチレンテレフタレート樹脂を用いれば、高温時の粘度が合い、低融点合金と良く混ざり合う。尚、この場合、他の樹脂とのポリマーブレンドしたものを用いても良い。
【0017】
更に、低融点合金は融点が100℃以上のものであれば良く、射出成形時に溶融する合金を使用する。その成分としてSn−Pb系、Sn−Ag−Pb系、Sn−Bi系、Sn−Bi−In系、Bi−Pb系、Bi−Sn系、Sn−Cu系、Sn−Cu−Ni−P系、Sn−Ag系、Sn−Bi−Pb系、Sn−In系のものを使用可能であり、特に融点が200°C程のSn−CU−Ni−P系を用いれば、成形時に熱可塑性樹脂となじみ易いものとなる。
【0018】
また、別の実施例としては、熱可塑性樹脂中に10重量%以上の低融点合金が混合されたものを用いれば、低融点合金は成形時に溶けて網目状につながり、導電性を向上させることができる。この場合、低融点合金および熱可塑性樹脂は、上記したものと同じものを使用する。この低融点合金が混合された一方の導電性樹脂によれば、上記した他方の金属繊維混入のものに比し、抵抗が小さく、導電部を細く又は薄くできる。
【0019】
次に、導電部を有する回路基板1の製造方法について説明を行うが、この製造方法には2種類ある。その1つの方法は、端子2a,3a,4aおよび配線パターン2,3,4に上記した導電性樹脂のみを使用する場合(A)と、図2に示すようにコネクタ端子2aa,3aa,4aaが金属の場合(B)であり、これらの場合の製造方法について説明する。
【0020】
(A)導電部となる端子2a,2b,2c,3a,3b,4a,4cおよび配線パターン2、3、4に導電性樹脂を使用する場合
図3に示されるように、凹凸の2つの金型21、22を重ね合せ、2つの金型21,22間でキャビティ空間12をつくり、キャビティ空間12を作った場所に、図示しない外部の樹脂押出装置により樹脂注入口22aより絶縁性の樹脂を射出させ、キャビティ空間12に樹脂を注入して1次成形品を作る。この状態では未だ回路基板1に導電部が設けられていない状態である。その次に、一方の金型22を別の金型23に変えて、重ね合わせ導電性樹脂が成形されるキャビティ空間23bを作り、同じように樹脂注入口23aより樹脂を射出させるのであるが、今度は導電性をもった上記の導電性樹脂を射出し、キャビティ空間23bに樹脂を充填させる。その結果、導電部となる端子2a,2b,2c,3a,3b,4a,4cの部分をもつ配線パターン2,3,4に導電性樹脂が設けられた回路基板1を2次成形により作ることができる。
【0021】
この場合、順序を逆にして導電部を導電性樹脂により1次成形品を作り、1次成形品を金型にセットして、絶縁部分を2次成形品により作っても良い。
【0022】
(B)コネクタ部7のコネクタ端子2aa,3aa,4aaが金属の場合
導電性樹脂を射出成形する前の回路基板1の本体を成形前、または成形後に、金型内にコネクタ端子2aa,3aa,4aaを予めセットした後、導電部を導電性樹脂により成形する。その後、導電性樹脂を別の金型にセットし、絶縁性の樹脂を射出成形し、樹脂金型から成形品を取り出す方法もとることができる。
【0023】
この場合、図4及び図5に示すように、コネクタ端子2aa、3aa、4aaの一端側部位に貫通孔2aa1、3aa1、4aa1を設け、これら貫通孔を含むコネクタ端子の一端側部位の全周を導電性樹脂で覆い、貫通孔2aa1、3aa1、4aa1内に導電性樹脂を充填させる。これにより、金属と導電性樹脂の線膨張係数の違い(金属:1×10―5、導電性樹脂:3×10―5)によりコネクタ端子2aa、3aa、4aaと導電部が剥離することなく、導電部とコネクタ端子間の電気的接続の耐熱衝撃性の信頼性を確保することができる。尚、同導電性樹脂が上記したSn系である場合には、コネクタ端子2aa、3aa、4aaにSnメッキを施すことで、射出成形時に同系のSn同士が融着して、導電部とコネクタ端子間の電気的接続の信頼性を更に向上することができる。
【0024】
図6及び図7は、本発明の第2実施形態を示す。本第2実施形態では、本発明を内燃機関の各気筒へ燃料を分配する樹脂製のデリバリパイプ100に適用した例を示す。デリバリパイプ100は、図示しない燃料管路に接続された燃料通路101を有し、該燃料通路101には図示しない燃料噴射弁の取付孔102が開口している。デリバリパイプ100には、取付孔102が開口する側に延在してコネクタ収容部103が形成され、該コネクタ収容部103内には取付孔102への図示しない燃料噴射弁の取付時に燃料噴射弁に電気的に接続される金属製のコネクタ端子104、105が収容されている。デリバリパイプ100の取付孔102が開口する側の反対側には、図示しない内燃機関の制御装置に電気的に接続される金属製のコネクタ端子111を収容するコネクタ部110が形成されており、コネクタ端子111と各コネクタ端子104、105とが導電性樹脂からなる3次元形状を呈する導電部106、107により夫々電気的に接続されている。尚、コネクタ端子104、105、111と導電部104、105との接続部は、図4及び図5と同じ構成となっており、良好な電気的接続を維持できるようになっている。
【0025】
図8は、本発明の第3実施形態を示す。本第3実施形態では、本発明を内燃機関の樹脂製のタイミングベルトカバー200に適用した例を示す。タイミングベルトカバー200は、その一側面の離間した部位に夫々コネクタ部204、205が形成され、両コネクタ部204、205間が導電性樹脂からなる3次元形状を呈する導電部201乃至203により夫々電気的に接続されている。尚、図8において、導電部201乃至203は例えばタイミングベルトカバー200内に埋設され、コネクタ部204、205近傍にて紙面上方に屈曲してコネクタ部204、205へ延びている。図9及び図10は、本発明を車両のドアモジュールの基台を構成するフラットプレート300に適用した第4実施形態を示す。フラットプレート300は、図示しない車両ドアのインナーパネルに取り付けられるドアモジュールの基台となるもので、中央部位と長手方向一端部に夫々コネクタ部301、302を有し、両コネクタ部間が導電性樹脂からなる3次元形状を呈する導電部303により夫々電気的に接続されている。本第4実施形態及び上記した第3実施形態では、コネクタ端子が導電性樹脂により形成されるが、コネクタ端子を金属性として図4及び図5に示す導電部との接続形態をとるようにしても良い。また、上記した第2乃至第4実施形態においては、上記第1実施形態と同様に2種類の導電性樹脂のいずれかを用いることができる。
【0026】
上記した実施形態にて本発明を様々な樹脂成形品に適用した例を説明したが、本発明はこれらに限定されるものではない。
【0027】
【発明の効果】
以上のように、本発明によれば、導電部を導電性樹脂により形成したので、導電性樹脂の流動性によって、3次元形状の複雑な形状の導電部でも容易に形成することができ、当該樹脂成形品の製造コストを低減することができる。
【図面の簡単な説明】
【図1】 本発明に従った導電部を有する樹脂成形品の第1実施形態示す斜視図である。
【図2】 図1に示す第1実施形態における樹脂成形品の金属性のコネクタ端子と導電部との接続部を示す斜視図である。
【図3】 図1に示す第1実施形態における導電部を有する樹脂成形品の製造工程を示す説明図である。
【図4】 図2に示す接続部の拡大図である。
【図5】 図4のA−A断面図である。
【図6】 本発明に従った導電部を有する樹脂成形品の第2実施形態を示す上面図である。
【図7】 本発明に従った導電部を有する樹脂成形品の第2実施形態を示す下面図である。
【図8】 本発明に従った導電部を有する樹脂成形品の第3実施形態を示す平面図である。
【図9】 本発明に従った導電部を有する樹脂成形品の第4実施形態を示す斜視図である。
【図10】 本発明に従った導電部を有する樹脂成形品の第4実施形態を示す斜視図である。
【図11】 従来の導電部を有する樹脂成形品の製造工程を示す説明図である。
【符号の説明】
1 回路基板(樹脂成形品)
2,3,4 配線パターン(導電部)
2b,2c マイナス端子(導電部)
3b,4c プラス端子(導電部)
6 ランプ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin molded product having a conductive part and a manufacturing method thereof, and more particularly to a resin molded product having a conductive part having a three-dimensional shape inside and a manufacturing method thereof.
[0002]
[Prior art]
Conventionally, resin molded products having a conductive portion include those disclosed in, for example, Japanese Patent Application Laid-Open Nos. 10-9893 and 10-12995. The resin molded product disclosed in the former publication, for example, integrally has a conductive part obtained by press-molding a metal plate, and FIG. 11 shows a method for producing a resin molded product having a conductive part having a three-dimensional shape. . In FIG. 11, first, a metal plate serving as a conductive portion is cut into a predetermined shape by press dies A and B. After that, bending is performed several times by the bending dies A, B and C, D so as to obtain a three-dimensional predetermined shape, the die is opened, and the conductive part is bent into a predetermined shape. Removed from the mold. On the other hand, a resin molded product is formed by creating a cavity space with two concave and convex molds and injecting resin from the injection device into the cavity space. Then, after setting the press-molded conductive part on the injection-molded resin molded product, the attachment site is subjected to heat caulking with a hot press die, and the resin molded product and the conductive part are integrated.
[0003]
Moreover, in the resin molded product disclosed in the latter publication, a resin molded product having a conductive portion is manufactured by performing metal plating on the surface of the resin molded product.
[0004]
[Problems to be solved by the present invention]
However, in the former resin molded product, since the conductive portion is formed by press molding, there is a problem that the pattern shape of the conductive portion is restricted and material loss occurs due to press working. Furthermore, if the pattern of the conductive part is to be complicated in three dimensions, the more complicated the pattern becomes, the more the bending process of the pattern of the conductive part becomes necessary, which increases the manufacturing cost. It was.
[0005]
In addition, in the latter case, in order to obtain a resin molded product having a conductive portion by plating, it is possible to form a conductive portion having a three-dimensional shape, but this increases the number of plating steps, Increases manufacturing costs.
[0006]
Then, this invention is made | formed in view of said problem, and provides the resin molded product which has a three-dimensional-shaped electroconductive part which can be manufactured without causing the increase in manufacturing cost, and its manufacturing method. Technical issue.
[0007]
[Means for Solving the Problems]
The technical means taken in order to solve the above problems is to mix an alloy that melts the conductive part in a thermoplastic resin at the time of injection molding in a conductive resin molded product having a conductive part formed by injection molding. The connector terminal and the conductive portion are provided with conductivity by providing a metal connector terminal having a through hole, and covering one end side portion of the connector terminal including the through hole with a conductive resin. This is a conductive resin molded product having a conductive portion characterized by electrically connecting the two .
[0008]
According to this means, the conductive part having a three-dimensional shape can be easily formed by the fluidity of the conductive resin, and the manufacturing cost of the resin molded product can be reduced.
[0009]
In the above-described means, if a conductive resin can be formed at the time of resin molding and a low melting point alloy containing no lead and containing tin as a main component is kneaded with a thermoplastic resin or a thermosetting resin, resin molding is performed. Sometimes, the alloy melts, and a conductive resin having a conductive portion through which electricity easily flows can be formed.
[0010]
Preferably, if the resin molded product has a connector terminal made of a conductive resin, a connector terminal having good electrical connection with the conductive portion when the conductive portion is formed of the conductive resin on the resin molded product. It can be provided integrally. For this reason, it is not necessary to use a lead wire for connecting the connector terminal and the conductive portion, and to solder the lead wire, so that the number of parts is reduced.
[0011]
In addition, when the resin molded product has a metal connector terminal, a through hole is formed in the connector terminal, and one end side portion of the connector terminal including the through hole is covered with a conductive resin, thereby reducing the number of parts. It is possible to obtain a good electrical connection between the conductive portion and the metal connector terminal.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0013]
1 to 3 show a first embodiment of a resin molded product having a conductive portion according to the present invention. In the first embodiment, an example in which the present invention is applied to a lamp unit that blinks or lights a brake lamp or a blinker of a vehicle is shown.
[0014]
In this lamp unit, a lamp 6 to be lit or blinked is attached to a circuit board 1 which is a resin molded product formed of resin, and lamp sockets 5 having two cylindrical shapes 5a are provided on both sides of the circuit board 1. I have. From the lamp socket 5, wiring patterns (conductor portions) 2, 3, 4 extend from the plus terminals 3 b, 4 c and the minus terminals 2 b, 2 c of the two lamp sockets 5 to the connector portion 7. The positive terminal 6a and the negative terminal 6b of the lamp 6 are fitted into the lamp 6 and come into contact with the positive terminals 3b and 4c and the negative terminals 2b and 2c on the circuit board. Therefore, if a predetermined voltage is applied to the terminals 2a and 3a of the connector section 7 from the outside, the lamp 6 is turned on or blinks. Similarly, if a predetermined voltage is applied to the terminals 2a and 4a, the lamp 6 is turned on. Or blink.
[0015]
Therefore, in the above configuration, a conductive resin is used for the wiring patterns 2, 3, and 4 that are conductive portions. There are two types of this conductive resin, one of which uses a mixture of thermoplastic fibers in a thermoplastic resin, and the conductive fibers are physically bonded. Some are joined by low melting point solder. The conductive metal fibers, the volume resistivity of 10 - about 4 Omega · cm, for example, copper, nickel, can be used as such iron-based, a range to reduce the electrical resistance in a thermoplastic resin Mix in (up to 80% by weight). In this case, it is preferable to use conductive fibers having an aspect ratio of 1 to 1000.
[0016]
In addition, the thermoplastic resin blended with the conductive fiber includes propylene, polyethylene, polystyrene, acrylonitrile / butadiene / styrene resin, modified polyphenylene oxide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polyamide resin, aromatic polyamide resin. , Polyphenylene sulfide resin, liquid crystal polymer, polyetherimide, polybenzimidazole, polyetheretherketone, polyethersulfone, and other resins can be used, especially acrylonitrile / butadiene / styrene resin and polybutylene terephthalate resin. For example, it has a high viscosity at high temperatures and mixes well with low melting point alloys. In this case, a polymer blend with another resin may be used.
[0017]
Further, the low melting point alloy only needs to have a melting point of 100 ° C. or higher, and an alloy that melts at the time of injection molding is used. As its components, Sn-Pb, Sn-Ag-Pb, Sn-Bi, Sn-Bi-In, Bi-Pb, Bi-Sn, Sn-Cu, Sn-Cu-Ni-P Sn-Ag, Sn-Bi-Pb, and Sn-In can be used, and if a Sn-CU-Ni-P system having a melting point of about 200 ° C is used, a thermoplastic resin may be used during molding. It becomes easy to become familiar with.
[0018]
As another example, if a low melting point alloy of 10% by weight or more is mixed in a thermoplastic resin, the low melting point alloy is melted at the time of forming and connected to a network to improve conductivity. Can do. In this case, the same low melting point alloy and thermoplastic resin as those described above are used. According to one conductive resin mixed with this low melting point alloy, the resistance is small and the conductive portion can be made thin or thin as compared with the other mixed metal fiber.
[0019]
Next, a method for manufacturing the circuit board 1 having a conductive portion will be described. There are two types of this manufacturing method. One method is to use only the above-described conductive resin for the terminals 2a, 3a, 4a and the wiring patterns 2, 3, 4 (A), and to connect the connector terminals 2aa, 3aa, 4aa as shown in FIG. In the case of metal (B), the manufacturing method in these cases will be described.
[0020]
(A) When conductive resin is used for the terminals 2a, 2b, 2c, 3a, 3b, 4a, 4c and the wiring patterns 2, 3, 4 to be conductive parts, as shown in FIG. The molds 21 and 22 are overlapped to form a cavity space 12 between the two molds 21 and 22, and an insulating resin is applied to the place where the cavity space 12 is formed from an resin injection port 22a by an external resin extrusion device (not shown). The resin is injected into the cavity space 12 to make a primary molded product. In this state, the circuit board 1 is not yet provided with a conductive portion. Next, one mold 22 is changed to another mold 23 to create a cavity space 23b in which the superimposed conductive resin is molded, and the resin is injected from the resin injection port 23a in the same manner. This time, the conductive resin having conductivity is injected to fill the cavity space 23b with the resin. As a result, the circuit board 1 in which the conductive resin is provided on the wiring patterns 2, 3, 4 having the portions of the terminals 2 a, 2 b, 2 c, 3 a, 3 b, 4 a, 4 c to be conductive portions is made by secondary molding. Can do.
[0021]
In this case, the order may be reversed, and the conductive portion may be made of a conductive resin to make a primary molded product, the primary molded product may be set in a mold, and the insulating portion may be made of a secondary molded product.
[0022]
(B) When the connector terminals 2aa, 3aa, 4aa of the connector part 7 are metal, the connector terminals 2aa, 3aa, After 4aa is set in advance, the conductive portion is molded with a conductive resin. Thereafter, a method can be used in which the conductive resin is set in another mold, the insulating resin is injection-molded, and the molded product is taken out from the resin mold.
[0023]
In this case, as shown in FIGS. 4 and 5, through holes 2aa1, 3aa1, 4aa1 are provided in one end side portions of the connector terminals 2aa, 3aa, 4aa, and the entire circumference of the one end side portion of the connector terminal including these through holes is provided. Cover with conductive resin, and fill the through holes 2aa1, 3aa1, 4aa1 with conductive resin. Accordingly, the connector terminals 2aa, 3aa, 4aa and the conductive portion are not peeled off due to the difference in coefficient of linear expansion between the metal and the conductive resin (metal: 1 × 10 −5 , conductive resin: 3 × 10 −5 ) The reliability of the thermal shock resistance of the electrical connection between the conductive portion and the connector terminal can be ensured. If the conductive resin is Sn-based as described above, Sn plating is applied to the connector terminals 2aa, 3aa, 4aa, so that Sn of the same system is fused together at the time of injection molding, so that the conductive portion and the connector terminal The reliability of the electrical connection between them can be further improved.
[0024]
6 and 7 show a second embodiment of the present invention. The second embodiment shows an example in which the present invention is applied to a resin delivery pipe 100 that distributes fuel to each cylinder of an internal combustion engine. The delivery pipe 100 has a fuel passage 101 connected to a fuel pipe (not shown), and a fuel injection valve mounting hole 102 (not shown) is opened in the fuel passage 101. The delivery pipe 100 is formed with a connector housing portion 103 extending to the side where the mounting hole 102 opens, and the fuel injection valve is mounted in the connector housing portion 103 when a fuel injection valve (not shown) is attached to the mounting hole 102. The metal connector terminals 104 and 105 that are electrically connected to each other are accommodated. On the side opposite to the side where the mounting hole 102 of the delivery pipe 100 is opened, a connector portion 110 is formed which accommodates a metal connector terminal 111 that is electrically connected to a control device for an internal combustion engine (not shown). The terminal 111 and the connector terminals 104 and 105 are electrically connected by conductive portions 106 and 107 each having a three-dimensional shape made of a conductive resin. Note that the connection portions between the connector terminals 104, 105, and 111 and the conductive portions 104 and 105 have the same configuration as that shown in FIGS. 4 and 5, so that a good electrical connection can be maintained.
[0025]
FIG. 8 shows a third embodiment of the present invention. In the third embodiment, an example in which the present invention is applied to a resin-made timing belt cover 200 of an internal combustion engine is shown. The timing belt cover 200 has connector portions 204 and 205 formed in spaced apart portions on one side surface thereof, and the portions between the connector portions 204 and 205 are electrically connected by conductive portions 201 to 203 each having a three-dimensional shape made of conductive resin. Connected. In FIG. 8, the conductive portions 201 to 203 are embedded in, for example, the timing belt cover 200, bent upward in the drawing in the vicinity of the connector portions 204 and 205, and extend to the connector portions 204 and 205. 9 and 10 show a fourth embodiment in which the present invention is applied to a flat plate 300 constituting a base of a vehicle door module. The flat plate 300 serves as a base of a door module that is attached to an inner panel of a vehicle door (not shown). The flat plate 300 has connector portions 301 and 302 at a central portion and one end portion in the longitudinal direction, respectively. Each is electrically connected by a conductive portion 303 having a three-dimensional shape made of resin. In the fourth embodiment and the third embodiment described above, the connector terminal is formed of a conductive resin, but the connector terminal is made of metal so that the connection form with the conductive portion shown in FIGS. 4 and 5 is taken. Also good. In the second to fourth embodiments described above, any one of two types of conductive resins can be used as in the first embodiment.
[0026]
Although the example which applied this invention to various resin molded products was demonstrated in above-described embodiment, this invention is not limited to these.
[0027]
【The invention's effect】
As described above, according to the present invention, since the conductive portion is formed of the conductive resin, it is possible to easily form even a three-dimensional complicated conductive portion due to the fluidity of the conductive resin. The manufacturing cost of the resin molded product can be reduced.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first embodiment of a resin molded product having a conductive portion according to the present invention.
2 is a perspective view showing a connection portion between a metallic connector terminal and a conductive portion of the resin molded product according to the first embodiment shown in FIG. 1; FIG.
FIG. 3 is an explanatory view showing a manufacturing process of a resin molded product having a conductive portion in the first embodiment shown in FIG. 1;
4 is an enlarged view of the connecting portion shown in FIG.
5 is a cross-sectional view taken along the line AA in FIG.
FIG. 6 is a top view showing a second embodiment of a resin molded product having a conductive portion according to the present invention.
FIG. 7 is a bottom view showing a second embodiment of a resin molded product having a conductive portion according to the present invention.
FIG. 8 is a plan view showing a third embodiment of a resin molded product having a conductive portion according to the present invention.
FIG. 9 is a perspective view showing a fourth embodiment of a resin molded product having a conductive portion according to the present invention.
FIG. 10 is a perspective view showing a fourth embodiment of a resin molded product having a conductive portion according to the present invention.
FIG. 11 is an explanatory view showing a manufacturing process of a resin molded product having a conventional conductive part.
[Explanation of symbols]
1 Circuit board (resin molded product)
2, 3, 4 Wiring pattern (conductive part)
2b, 2c Negative terminal (conductive part)
3b, 4c Positive terminal (conductive part)
6 lamps

Claims (2)

射出成形により形成される導電部を有する導電性樹脂成形品において、
前記導電部を熱可塑性樹脂中に射出成形時に溶融する合金を配合することにより形成し、
導電性を付与し、
更に、貫通孔が形成された金属製のコネクタ端子を有し、
前記貫通孔を含む前記コネクタ端子の一端側部位を前記導電性樹脂により被覆して前記コネクタ端子と前記導電部を電気的に接続したことを特徴とする導電部を有する導電性樹脂成形品。
In a conductive resin molded product having a conductive part formed by injection molding,
Forming the conductive part by blending an alloy that melts during injection molding in a thermoplastic resin,
Imparts conductivity,
Furthermore, it has a metal connector terminal in which a through hole is formed,
A conductive resin molded article having a conductive portion, wherein one end side portion of the connector terminal including the through hole is covered with the conductive resin, and the connector terminal and the conductive portion are electrically connected.
前記導電性樹脂は、樹脂成形時に成形可能であると共に鉛を含まず錫を主成分とした低融点合金を、熱可塑性樹脂または熱硬化性樹脂に混練して生成され、前記導電性樹脂を射出成形することにより前記導電部が形成されることを特徴とする請求項1に記載の導電部を有する導電性樹脂成形品。  The conductive resin can be molded at the time of resin molding, and is produced by kneading a low melting point alloy containing no lead and containing tin as a main component with a thermoplastic resin or a thermosetting resin, and injecting the conductive resin. The conductive resin molded article having a conductive portion according to claim 1, wherein the conductive portion is formed by molding.
JP4953399A 1998-02-26 1999-02-26 Resin molded product having conductive portion and method for producing the same Expired - Fee Related JP4288740B2 (en)

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JP10-45898 1998-02-26
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