JP2699490B2 - Manufacturing method of terminal circuit board - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board with terminals which can be used as a module board having a plurality of terminal pins protruding so as to be inserted into a mother board, a connector or the like, and a method of manufacturing the same. It is about.

2. Description of the Related Art As shown in FIGS. 8 (a) and 8 (b), a conventional module substrate contains glass on one side of an end portion of a printed circuit board 41 made of an epoxy resin containing phenol resin or glass. Elongated resin body 43 made of a polyamide resin or the like, and a plurality of terminal pins 44 penetrating therethrough and protruding to both sides.
A connector pin 42 is formed by contacting the terminal pin 44 protruding on one side and passing it through a hole 45 formed in the circuit board 41, and soldering the protruding end portion 44a thereof to the conductor portion formed on the circuit board 41. It is configured by joining at 46.

Problems to be Solved by the Invention By the way, in recent years, the functions of each module substrate have been dramatically advanced with the high integration of ICs, and the number of terminal pins tends to increase accordingly. However, in the module board configured as described above, when the number of the terminal pins 44 increases and the length of the connector 42 becomes relatively long, the linear expansion coefficient between the resin body 43 of the connector 42 and the circuit board 41 is increased. Due to the temperature difference, an excessive stress acts on the solder 46 fixing the terminal pins 44 and the circuit board 41 due to a temperature change, and the solder 46 is cracked and a connection failure occurs, thereby causing an error or malfunction. There was a problem that it might cause.

An object of the present invention is to provide a circuit board with terminals in which terminal pins are integrally formed with a circuit board without using a connector, and a method of manufacturing the same.

Means for Solving the Problems In order to achieve the above object, a circuit board with terminals according to the present invention is a carrier tape made of an insulating material having one end of a plurality of terminal pins arranged in parallel at appropriate intervals and having feed holes at equal intervals. The carrier tape is fed to the molding die of the injection molding machine by a predetermined length for each molding cycle using the feed hole, so that the other end of the terminal pin protrudes into the molding die. After the part is brought into contact with the inner surface of the mold, the synthetic resin is injected into the mold to form the circuit board, and then the carrier tape is further fed without separating the formed circuit board, The molded circuit board is moved to the next conductor pattern forming station.

According to the present invention, since the independent terminal pins are partially embedded in the circuit board and integrated with each other, stress acts on the joint between the terminal pins and the conductor pattern formed on the circuit board due to a temperature change. There is no such thing,
There is no connection failure due to cracks. In addition, since a part of the embedded portion of the terminal pin is exposed on the surface of the circuit board and is connected to the conductor pattern, by forming the conductor pattern on the circuit board, the terminal pin can be joined, and the connector can be mounted or the terminal pin can be connected. The step of joining with the conductor pattern can be omitted.

Also, by injecting synthetic resin into the mold while the terminal pins supported by the carrier tape are in contact with the inner surface of the mold, the circuit board is molded, and the terminal pins are attached simultaneously with the formation of the circuit board. And a part of the terminal pin is exposed on the surface of the circuit board, so that it can be joined to the terminal pin when forming the conductor pattern. In addition, since the carrier tape is made of an insulating material, each terminal pin of the formed circuit board is insulated from each other, and a characteristic test or the like of a circuit formed on each circuit board with the carrier tape attached must be performed. By using a carrier tape as a transfer means, formation of a circuit board, circuit configuration and circuit characteristic tests, and the like can be performed on a series of transfer paths.

Embodiment An embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, reference numeral 1 denotes a carrier tape comprising a support tape 2 made of kraft paper and an adhesive tape 3, and the support tape 2 is formed with perforations 4 at an appropriate pitch.
Ends of a large number of terminal pins 5 arranged in parallel at predetermined intervals are supported between the support tape 2 and the adhesive tape 3 of the carrier tape 1.

By supplying the carrier tape 1 to an injection molding machine described later, the circuit board 6 is formed in a state where the ends of the terminal pins 5 are integrally embedded. Further, a part of the embedded portion of the terminal pin 5 is exposed on the surface of the circuit board 6 to form an exposed portion 7. Reference numeral 8 denotes a hole formed by a punch described later for exposing a part of the terminal pin 5.

As shown in FIG. 2, a conductor pattern 9 is formed on the surface of the formed circuit board 6 with silver paste or the like so as to be connected to the exposed portion 7. Various electronic components are mounted on the circuit board 6 to form a circuit.

Next, the configuration of the molding die 10 in the injection molding machine for forming the circuit board 6 will be described with reference to FIGS.

Reference numeral 11 denotes a fixed-side mold plate, which is attached to the fixed-side mounting plate 12, and a sprue bushing 13 is attached by a locate ring 14. Further, the fixed side mold plate 11 has a punch 15 that presses the end of the terminal pin 5 to plastically deform the mold when the mold is closed, and abuts against the inner surface of the mold. A pad 17 for pressing and fixing an intermediate portion of the fifth member 5 is provided.

Reference numeral 18 denotes a movable mold plate, which is attached to a movable mounting plate 20 via a spacer block 19. The movable mold plate 18 is provided with pilot pins 21 which are fitted and positioned in the feed holes 4 of the carrier tape 1 supporting the terminal pins 5.
Reference numeral 22 denotes a protruding plate that can move relatively to the movable mold plate 18,
The ejector pin 23 is fixed. Reference numeral 24 denotes a core pin which projects into a molding space 25 formed between the fixed mold plate 11 and the movable mold plate 18 when the mold plate is closed.

 Next, a manufacturing process of the circuit board with terminals will be described.

First, as shown in the lower half of FIG. 1 (a) and FIG. 1 (c), a carrier tape 1 supporting a large number of terminal pins 5 is prepared, and the carrier tape 1 is used by using the perforations 4 thereof. Then, it is sequentially fed into the molding die 10 of the injection molding machine by a predetermined length every molding cycle. The carrier tape 1 is positioned at a position corresponding to the molding space 25 by the pilot pin 21 as shown in FIG. In this state, each terminal pin 5
Are projected into the molding space 25 and are respectively opposed to the punches 15.

Next, when the molding die 10 is closed, as shown in FIG. 4, the intermediate portion of the terminal pin 5 located in the molding die 10 is pressed and fixed by the pad 17 and the tip portion is pressed by the punch 15. When pressed, it is plastically deformed, and a part thereof comes into contact with the inner surface of the molding space 25.
In this state, the sprue bushing 13 to the runner 26 and the gate 27
Through which plasticized synthetic resin is injected into the molding space 25. Thereafter, when the synthetic resin is cooled and solidified, the molding die 10 is opened and the molded circuit board 6 is ejected from the molding space 25, so that the terminal as shown in the upper half of FIG. 1 (a) and FIG. A circuit board 6 having the pins 5 integrated is obtained. Thereafter, the carrier tape 1 is moved to move to the next molding step, and the above operation is repeated.

On the other hand, as shown in FIG. 2, the circuit board 6 sent out from the mold 10 is printed or drawn to form a conductor pattern 9 as shown in FIG. A module board completed by mounting components, testing a circuit characteristic by bringing a probe into contact with each terminal pin 5 at the next station, and then separating the carrier tape 1 used as a moving means between these stations. Is obtained.

It is to be noted that, as the terminal pin 5, a copper wire or a brass wire plated with tin is suitable, and the cross-sectional shape thereof may be not only circular but also rectangular. Further, it is preferable to form a deformed portion in the embedded portion of the terminal pin 5 in the circuit board 6 so as to increase the bonding strength between the terminal pin 52 and the synthetic resin. As the molding resin for the circuit board 6, a thermoplastic polyimide resin or an aromatic resin which has good moldability, has heat resistance to withstand the formation of a conductor pattern and soldering, and has excellent electrical properties such as insulating properties and high-frequency properties. Polyester resin (liquid crystal polymer) is suitable. Further, the conductor pattern 9 can be formed by plating.

In the above embodiment, the terminal pins are partially exposed on one side of the circuit board 6 and a circuit is formed on one side. However, as in the second embodiment shown in FIG. The portions may be bent in two directions to form exposed portions 7a and 7b on both sides of the circuit board 6, so that circuits can be formed on both sides of the circuit board 6.

Further, in the above-described embodiment, the example in which the terminal pin 5 is plastically deformed by the punch 15 provided in the molding die 10 has been described.
The terminal pins may be formed in advance so as to be in contact with the inner surface of the molding space 25. In that case, as in the third embodiment shown in FIG.
When the molding die 10 is closed and pressed against the opposing surfaces of the molding space 25 when the molding die 10 is closed, the distal ends of the terminal pins 31 are elastically deformed. By pressing against the inner surface of the molding space 25
7a and 7b can be reliably formed on both surfaces of the circuit board 6.

Further, as in the fourth embodiment shown in FIG. 7, when an enlarged portion 34 projecting in the thickness direction is formed at the side end of the circuit board 6 where the terminal pins 5 are embedded, The buried portion can be reinforced and the circuit board 6 can be prevented from falling down when it is mounted on the mother board 35 as shown in the figure, so that a stable mounting state can be ensured. When the circuit board 6 is intended to be stably mounted, the expanding portion 34 may not be formed over the entire length of one side of the circuit board 6 but may be provided only at a part such as both ends.

According to the circuit board with terminals of the present invention, as is apparent from the above description, the independent terminal pins are partially embedded in the circuit board and integrated with each other, so that the terminal pins and the There is no stress acting on the joints of the conductor patterns formed on the circuit board, and no connection failure due to cracks occurs. In addition, since a part of the embedded portion of the terminal pin is exposed on the surface of the circuit board and is connected to the conductor pattern, by forming the conductor pattern on the circuit board, the terminal pin can be joined, and the connector can be mounted or the terminal pin can be connected. The step of joining with the conductor pattern can be omitted.

Also, the formation of the enlarged portion at the end of the terminal pins of the circuit board has the effect of reinforcing the embedded portion of the terminal pins of the circuit board and stabilizing the circuit board when it is mounted on a mother board or the like. can get.

Furthermore, according to the method for manufacturing a circuit board with terminals of the present invention, the circuit board is formed by injecting a synthetic resin into the mold while the terminal pins supported by the carrier tape are in contact with the inner surface of the mold. By doing so, the terminal pins can be attached at the same time as the formation of the circuit board, and a part of the terminal pins is exposed on the surface of the circuit board, so that it can be joined to the terminal pins when forming the conductor pattern. Also, since the carrier tape is made of an insulating material, the terminal pins of the formed circuit board are insulated from each other, so that a characteristic test or the like of a circuit formed on the circuit board with the carrier tape attached can be performed. By using the carrier tape as a transfer means, the formation of a circuit board, a test of the circuit configuration and characteristics of the circuit, and the like can be performed on a series of transfer paths.

Also, when the terminal pins are deformed by a punch provided in a molding die and brought into contact with the inner surface of the die, the terminal pins can be easily obtained,
On the other hand, if the bent portion is formed in advance on the terminal pin so as to be in contact with the inner surface of the mold, the structure of the mold can be simplified. or,
When the terminal pins are brought into contact with both opposing surfaces of the inner surface of the molding die, they are exposed on both surfaces of the circuit board, so that a great effect is exhibited such that a circuit can be formed on both surfaces.

[Brief description of the drawings]

1 to 4 show a first embodiment of the present invention. FIG. 1 (a) is a plan view showing the main states of the manufacturing process continuously, and FIG. ), (C) is a II-II cross section of FIG. (A), FIG. 2 is a plan view showing the formed circuit board alone, and FIGS. 3 and 4 Fig. 5 is a partially longitudinal front view showing a state in which a mold is opened and a state in which the mold is closed. Fig. 5 shows a second embodiment of the present invention. Fig. 5 (a) continuously shows main states in a manufacturing process. FIG. 6B is a plan view, FIG. 6B is a cross-sectional view taken along the line III-III of FIG. 7A, FIG. 6C is a cross-sectional view taken along the line IV-IV of FIG. FIG. 4A is a plan view showing the main states of the manufacturing process continuously, FIG. 4B is a cross-sectional view taken along line V-V of FIG. 4A, and FIG. (A) is a sectional view taken along the line VI-VI, (d) is a sectional view taken along the line VII-VII of FIG. Shows a fourth embodiment of the present invention, FIG. (A) is a front view, FIG. (B)
FIG. 8A shows a conventional example, FIG. 8A is a front view, and FIG. 8B is a vertical side view. 1 ... carrier tape, 5 ... terminal pins, 6 ... circuit board, 7, 7a, 7b ... exposed part, 9 ... conductor pattern, 10 ...
… Molding die, 15… Punch, 25… Molding space, 35… A huge part.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masariki Narita 1006 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Industrial Co., Ltd. (56) References Japanese Utility Model sho 59-37703 (JP, U)

Claims (1)

(57) [Claims] An end of a large number of terminal pins arranged in parallel at appropriate intervals is supported by a carrier tape made of an insulating material having equally spaced perforations, and the carrier tape is used by using the perforations in an injection molding machine. After sending the other end of the terminal pin into the molding die and bringing a part of the terminal pin into contact with the inner surface of the molding die by sending it to the molding die by a predetermined length every molding cycle, it is synthesized into this molding die. The circuit board is molded by injecting the resin, and then the carrier circuit tape is further fed without separating the molded circuit board, thereby moving the molded circuit board to the next conductor pattern forming station. Method of manufacturing a terminal circuit board.