JP4272634B2 - Main crimping device for electronic parts - Google Patents

Description

The present invention relates to the crimping equipment of electronic components for main bonding an electronic component provisionally crimped board pressurized and heated.

  When an electronic component such as a semiconductor chip is mounted on a substrate, a thermosetting adhesive member such as an anisotropic conductive member may be used. When a thermosetting adhesive member is used, it takes a long time to melt and cure the thermosetting adhesive member.

  Therefore, after the electronic component is temporarily pressure-bonded to the substrate via a thermosetting adhesive member, the main pressure bonding for melting and curing the thermosetting adhesive member is performed with a larger number of main pressure bonding apparatuses than the temporary pressure bonding apparatus. In order to increase productivity.

  When the electronic component is finally pressure-bonded to the substrate, the electronic component temporarily bonded to the substrate is thermocompression-bonded by a pressurizing tool that can be driven in the vertical direction above the substrate intermittently conveyed in a predetermined direction. . When the electronic component is thermocompression-bonded by the pressure tool, the thermosetting adhesive member melts and is pushed out from between the substrate and the electronic component and adheres to the pressure tool, which may cause dirt.

  If the pressure tool becomes dirty, when the electronic component is pressed by this pressure tool, the dirt will be interposed between the pressure tool and the electronic component, and the electronic component cannot be uniformly pressed. It may not be crimped parallel to the board, or it may cause damage to electronic components.

  Therefore, when electronically bonding an electronic component, a dirt prevention tape formed of fluororesin or the like is interposed between the electronic component and the pressure tool to prevent dirt generated during the main pressure bonding from adhering to the pressure tool. Like to do.

  The antifouling tape is supplied from a supply reel and is taken up by a take-up reel, and a portion between the supply reel and the take-up reel is guided so as to face the substrate. The anti-smudge tape is intermittently sent by a predetermined length in a predetermined direction every time an electronic component is finally pressure-bonded by a pressure tool.

  A portion of the antifouling tape facing the substrate is spaced from the substrate at a predetermined interval. Therefore, when the electronic component is finally pressure-bonded to the substrate by the pressure tool through the antifouling tape, the pressure tool is stretched between the supply reel and the take-up reel with a constant tension. The electronic component is finally pressure-bonded to the substrate while being further stretched by applying tension to the antifouling tape.

  However, if the anti-smudge tape is greatly stretched during the main press bonding, the tension of the anti-stain tape acts on the electronic component temporarily bonded to the substrate. In some cases, the mounting accuracy with respect to is reduced.

The present invention can improve the mounting accuracy of an electronic component by preventing the antifouling tape from being stretched by a pressurizing tool when mounting the electronic component on a substrate via the antifouling tape. and to provide a main bonding equipment of.

The present invention is an electronic component main crimping apparatus for press-bonding an electronic component temporarily bonded to a substrate with a pressurizing tool,
Supplied from the supply reel and taken up by the take-up reel, and when the electronic component is finally pressure-bonded to the substrate, the pressure tool is contaminated by being interposed between the pressure tool and the electronic component. Anti-stain tape to prevent
A pair of guide rollers for guiding a part of the antifouling tape to face the substrate;
When the electronic component is finally pressure-bonded to the substrate via the antifouling tape by the pressure tool, at least one of the pair of guide rollers is made elastically displaceable and is pressed by the pressure tool. An anti-elongation mechanism for preventing the increase in the tension of the anti-smudge tape by elastically displacing the guide roller by the anti-stain tape;
The elongation preventing mechanism is
A lever in which a midway portion is rotatably supported by a support shaft and the guide roller is rotatably provided at one end;
A spring that urges the lever in a predetermined rotation direction;
When the antifouling tape is wound up, the lever is held unrotatable, and when the pressurizing tool is pressed, the lever is resisted against the biasing force of the spring by the pressing force of the pressurizing tool applied to the guide roller. Stopper means for enabling rotation in the direction;
In the crimping apparatus of electronic components and having a.

  According to the present invention, when the electronic component is finally pressure-bonded to the substrate via the antifouling tape, the tension of the antifouling tape does not increase, so that the electronic component is displaced on the substrate by the tension of the antifouling tape. Is prevented from occurring.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 and FIG. 2 show a schematic configuration of the main pressure bonding apparatus of the present invention, and the main pressure bonding apparatus includes a substrate W transport mechanism 1. As shown in FIG. 3, the transport mechanism 1 has a pair of guide members 2 that are spaced apart in parallel with an interval larger than the width dimension of the substrate W.

  The substrate W is provided on the upper surface of the rectangular frame-shaped or U-shaped holding member 3. The holding member 3 is held by engaging both ends in the width direction with the pair of guide members 2. The holding member 3 held by the guide member 2 is intermittently driven by a predetermined pitch in the direction indicated by the arrows in FIGS.

  As shown in FIG. 4, an electronic component 4 such as a semiconductor chip is temporarily bonded to the substrate W by a tape-like thermosetting adhesive member 5. When the substrate W is conveyed along the guide member 2 and reaches the mounting position 7, the electronic component 4 temporarily bonded to the substrate W is finally bonded.

  A stage 8 is disposed at the mounting position 7 below the substrate W held by the guide member 2. The stage 8 is driven in the vertical direction by a stage drive source 9 and is raised during the main press bonding so as to support the lower surface of the substrate W. The stage 8 incorporates a heater (not shown), and heats the portion of the substrate W supported by the upper surface of the stage 8 during the main press bonding.

  Above the guide member 2 at the mounting position 7, a pressurizing tool 11 incorporating a heater (not shown) is disposed. The pressure tool 11 is driven in the vertical direction by a pressure drive source 12. When the pressing tool 11 is driven in the downward direction, the electronic component 4 is thermocompression bonded to the upper surface of the substrate W whose lower surface is supported by the stage 8.

  Between the pressurizing tool 11 and the substrate W, a dirt prevention tape 14 made of a synthetic resin having heat resistance such as a fluororesin is provided. The antifouling tape 14 is fed from the supply reel 15 and taken up on the take-up reel 16.

  The antifouling tape 14 is guided so that a portion facing the substrate W positioned at the mounting position 7 travels in parallel with the substrate W by a pair of guide rollers 17. A pair of guide rollers 17 is rotatably supported at one end of an L-shaped lever 18.

  The lever 18 is supported by a support shaft 19 so that the middle portion thereof can rotate. A pneumatic cylinder 21 is disposed on one side of the other end of the lever 18 with the tip of the rod 22 facing each other. Furthermore, one end of a spring 23 is connected to the other side of the other end of the lever 18. The other end of the spring 23 is connected to a fixing portion 24 such as an apparatus main body. As a result, the spring 23 biases the lever 18 in the direction in which the guide roller 17 provided at one end thereof is lowered.

  The lever 18 biased in the predetermined rotation direction by the spring 23 is positioned with the other side of the other end abutting against the stopper 23a. As shown in FIG. 5A, if the tip of the rod 22 biased in the protruding direction of the cylinder 21 comes into contact with one side of the other end of the lever 18 positioned by the stopper 23a, the lever 18 is moved to the left and right. It is in a state in which it cannot rotate in either direction.

  As shown in FIG. 5B, when the rod 22 of the cylinder 21 is urged in the immersion direction, the lever 18 can be rotated in the direction indicated by the arrow in FIG. However, in this state, the urging force of the spring 23 acting on the other end of the lever 18 and the tension of the antifouling tape 14 applied to one end of the lever 18 via the guide roller 17 so that the lever 18 does not rotate. In addition, the strength of the spring 23 and the tension of the antifouling tape 14 are set so that the weight of the lever 18 is balanced.

  As shown in FIG. 5B, when the rod 22 is immersed, the antifouling tape 14 is pressed by the pressure tool 11 and when the tension applied to the antifouling tape 14 increases, the tension is reduced to the guide roller 17. Therefore, the lever 18 rotates against the urging force of the spring 23 until the other end contacts the tip of the rod 22 as shown by an arrow in FIG.

  Accordingly, the guide roller 17 is displaced in the upward direction, so that the length of the traveling path between the supply reel 15 and the take-up reel 16 of the antifouling tape 14 is reduced. That is, the length of the antifouling tape 14 between the supply reel 15 and the take-up reel 16 is longer than the length of the traveling path, so that the antifouling tape 14 has a margin corresponding to the length.

  In the present invention, when the antifouling tape 14 is pressed by the pressure tool 11 by the guide roller 17, the lever 18, the cylinder 21 and the spring 23, the tension acting on the antifouling tape 14 as will be described later. The anti-elongation mechanism 20 is configured to prevent the anti-stain tape 14 from elongating.

  The supply reel 15 is provided with a torque adjusting mechanism 25 that adjusts the torque (tension) generated in the dirt prevention tape 14 when the dirt prevention tape 14 is wound around the take-up reel 16. The torque adjusting mechanism 25 can set the torque so that the anti-stain tape 14 can be wound around the take-up reel 16 with a tension that does not cause elongation.

  The take-up reel 16 is integrally provided with a driven pulley 26. A belt 31 is stretched between the driven pulley 26 and a drive pulley 29 provided on the rotary shaft 28 of the take-up motor 27. When the take-up motor 27 is operated, the antifouling tape 14 is taken up by the take-up reel 16 while being given a predetermined tension.

  The stage drive source 9, the pressure drive source 12, the control valve for controlling the supply of compressed air to the cylinder 21 and the take-up motor 27 are controlled by a control device 33.

  According to the main pressure bonding apparatus having such a configuration, the substrate W to which the electronic component 4 is temporarily bonded is conveyed to the mounting position 7, and the predetermined electronic component 4 temporarily bonded to the substrate W is When positioned downward, the control device 33 operates the stage drive source 9 to raise the stage 8, and the lower surface of the substrate W is supported by the upper surface. At this time, the intermittent feeding of the antifouling tape 14 is stopped.

  When the lower surface of the substrate W is supported by the stage 8, the control device 33 retracts the rod 22 of the cylinder 21 from the protruding position shown in FIG. 5A to the immersive position shown in FIG. The source 12 is activated to lower the pressure tool 11.

  When the pressing tool 11 descends and the upper surface of the portion held in parallel with the substrate W is pressed by the pair of guide rollers 17 of the antifouling tape 14, the tension applied to the antifouling tape 14 increases.

  When the tension applied to the antifouling tape 14 is increased, the antifouling tape 14 is stretched and hits the electronic component 4, so that the electronic component 4 may be displaced. However, when the antifouling tape 14 is pressed by the pressure tool 11 and the tension increases, and the increase in the tension is transmitted to the lever 18 via the guide roller 17, the lever 18 held elastically and pivotally is held. From the state shown in FIG. 5 (b), as shown in FIG. 5 (c), the guide roller 17 is rotated in a direction to rise against the urging force of the spring 23. FIG. 2 shows a state where the pair of guide rollers 17 are displaced in the upward direction.

  When the pair of guide rollers 17 are displaced in the upward direction, the length of the travel path between the supply reel 15 and the take-up reel 16 of the antifouling tape 14 is shortened according to the amount of displacement. If the length of the travel path of the anti-stain tape 14 is shortened, the anti-stain tape 14 has a margin for the length of the travel path.

  For this reason, when the pressure tool 11 thermocompression-bonds the electronic component 4 via the dirt prevention tape 14, even if the dirt prevention tape 14 is pressed by the pressure tool 11, the pair of guide rollers 17 is displaced in the upward direction. Thus, the tension of the antifouling tape 14 is not increased by the pressing force of the pressing tool 11.

  Therefore, since the tension of the antifouling tape 14 is hardly applied to the electronic component 4 before the main press-bonding on the substrate W at the time of the main press-bonding, the electronic component 4 can be finally press-bonded without causing a positional shift. .

  When the thermocompression bonding of the electronic component 4 by the pressurizing tool 11 is performed for a predetermined time and the thermosetting adhesive member 5 is melt-cured, the pressurizing tool 11 is raised and the stage 8 is lowered. When the pressurizing tool 11 is lifted, the pressing force applied to the antifouling tape 14 by the pressurizing tool 11 is released, so that the lever 18 returns to the position where the other end hits the stopper 23a by the biasing force of the spring 23. As a result, the pair of guide rollers 17 are displaced in the downward direction, so that the travel path length of the antifouling tape 14 becomes the original length.

  When the lever 18 returns to the position where it comes into contact with the stopper 23 a by the restoring force of the spring 23, the rod 22 of the cylinder 21 is biased in the protruding direction, and its tip abuts against one side of the other end of the lever 18. As a result, the lever 18 is held so as not to rotate in either the left or right direction.

  When the lever 18 is held unrotatable, the substrate W is fed at a predetermined pitch, the electronic component 4 in the temporarily press-bonded state is positioned below the pressurizing tool 11, and the winding motor 27 is operated to wind up. The reel 16 is rotated by a predetermined angle, and the antifouling tape 14 is intermittently fed for a predetermined length, and the unused portion of the antifouling tape 14 is positioned so as to face the electronic component 4. When the intermittent feeding of the antifouling tape 14 is stopped, the above-described main press bonding is repeatedly performed.

  When the antifouling tape 14 is intermittently fed, even if the tension applied to the antifouling tape 14 fluctuates, the guide roller 17 does not move up and down together with the lever 18 due to the fluctuation of the tension. Feeding can be performed reliably.

  In the above embodiment, a lever and a cylinder are used as a driving mechanism for displacing the guide roller. However, a guide roller is provided on a cylinder rod without using a lever, and the cylinder is directly displaced in the upward direction. Also good.

  In addition, the pair of guide rollers was displaced in the upward direction in order to allow the anti-stain tape to have a sufficient length during the main pressure bonding, but only one of the pair of guide rollers was displaced to increase the length of the anti-stain tape. You may make it give margin of.

1 is a schematic configuration diagram of a main crimping apparatus according to an embodiment of the present invention. FIG. 2 is a schematic configuration diagram when the main crimping apparatus illustrated in FIG. 1 final crimps an electronic component to a substrate. Sectional drawing of a conveyance mechanism. The expanded sectional view which shows the electronic component temporarily crimped | bonded to the board | substrate with the thermosetting adhesive member. (A)-(c) is explanatory drawing explaining the motion of a cylinder and a lever.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Conveyance mechanism, 4 ... Electronic component, 8 ... Stage, 11 ... Pressure tool, 14 ... Anti-stain tape, 15 ... Supply reel, 16 ... Take-up reel, 17 ... Guide roller, 18 ... Lever (drive mechanism), 20 ... Elongation prevention mechanism, 21 ... Cylinder (drive mechanism), 33 ... Control device.

Claims (1)

An electronic component final crimping apparatus for press-bonding an electronic component temporarily bonded to a substrate with a pressure tool,
Supplied from the supply reel and taken up by the take-up reel, and when the electronic component is finally pressure-bonded to the substrate, the pressure tool is contaminated by being interposed between the pressure tool and the electronic component. Anti-stain tape to prevent
A pair of guide rollers for guiding a part of the antifouling tape to face the substrate;
When the electronic component is finally pressure-bonded to the substrate via the antifouling tape by the pressure tool, at least one of the pair of guide rollers is made elastically displaceable and is pressed by the pressure tool. An anti-elongation mechanism for preventing the increase in the tension of the anti-smudge tape by elastically displacing the guide roller by the anti-stain tape;
The elongation preventing mechanism is
A lever in which a midway portion is rotatably supported by a support shaft and the guide roller is rotatably provided at one end;
A spring that urges the lever in a predetermined rotation direction;
When the antifouling tape is wound up, the lever is held unrotatable, and when the pressurizing tool is pressed, the lever is resisted against the biasing force of the spring by the pressing force of the pressurizing tool applied to the guide roller. Stopper means for enabling rotation in the direction;
Pressure bonding apparatus of electronic components and having a.

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