JP4269103B2 - Electric control device - Google Patents
Electric control device Download PDFInfo
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- JP4269103B2 JP4269103B2 JP2003146349A JP2003146349A JP4269103B2 JP 4269103 B2 JP4269103 B2 JP 4269103B2 JP 2003146349 A JP2003146349 A JP 2003146349A JP 2003146349 A JP2003146349 A JP 2003146349A JP 4269103 B2 JP4269103 B2 JP 4269103B2
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- heat
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- fan
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Description
【０００１】
【発明の属する技術分野】
本発明は、ファンを用いた冷却構造を有する電気制御装置に関するもので、例えばサーボ制御装置のような電気制御装置に関するものである。
【０００２】
【従来の技術】
半導体素子が取付けられたヒートシンクの冷却フィンに冷却風を流通させて冷却することは公知である（例えば、特許文献１参照）。
【０００３】
【特許文献１】
特開平１０−１５０２８４号公報
【０００４】
特許文献１記載の発明は、ヒートシンクを大きくすることなく半導体素子を確実に冷却するもので、半導体素子を取付けた第１のヒートシンクと、半導体素子を取付けた第２のヒートシンクと、風洞を形成する覆板と、冷却風を導く整流板とを有し、第１のヒートシンクは空間を介して第２のヒートシンクを配設され、覆板は両ヒートシンクを覆って底板との間に風洞を形成し、整流板は斜辺部を有する部材からなり第１のヒートシンクの側面と第２のヒートシンクの側面に跨がって配置され、一方端を第２のヒートシンクの側面に取付け、他方端を第１のヒートシンクの側面に取付けるようにしている。
しかしながら、半導体素子のそれぞれに別個のヒートシンクを設けているため、２個のヒートシンクの間に隙間ができ、その隙間を塞ぐための底板が別途必要となり、また、冷却ファンへ通じる風洞を形成する覆板も別途必要となり、部品点数が多くなり、取付工数も増え、コスト高となった。
【０００５】
図５は本発明の前提となった電気制御装置を示すもので、これは特許文献１記載の発明ような底板や覆板は必要としないものである。
図において、１は複数の発熱素子、２はファン、３は制御基板、４はヒートシンクである。複数の発熱素子１、ファン２および制御基板３は共通の大きなヒートシンク４の上に搭載されている。ヒートシンク４のファン２の冷却風は発熱素子１および制御基板３に吹き付けられ、これらを冷却する。
これによれば、複数の半導体素子は共通の大きなヒートシンクに搭載されているため、複数の半導体素子の間に隙間がなく、したがって底板が不要となり、また、冷却ファンへ通じる風洞を形成する覆板も不要となり、部品点数も取付工数も減り、コストダウンとなった。
しかしながら、複数の発熱素子１は周辺部品も含めて密集して配設されているため、発熱素子１への冷却風は十分にあたらず、放熱効果は十分ではなかった。
【０００６】
【発明が解決しようとする課題】
このように、上述の電気制御装置では、発熱素子が装置内部にその他部品と密集して搭載されているような場合、ヒートシンクによる放熱は、熱を拡散するだけにとどまり、装置外部への積極的な放熱は行えず、ファンを利用して放熱する場合も、発熱素子周辺が密集しているため、ファンの冷却風が十分に発熱素子に届かず、放熱効果は発熱素子に対して十分ではなく、温度上昇を効率よく抑えることは出来なかった。
また、放熱効果を上げようとすると発熱素子の間隔を大きくとる必要があり小型化できないという問題があった。
【０００７】
【課題を解決するための手段】
上記問題を解決するために、請求項１記載の発明は電気制御装置に係り、ヒートシンクとファンと発熱素子と制御基板とを有して制御装置筐体で覆われた電気制御装置であって、前記制御装置筐体が吸込口と吐出口とを備え、前記発熱素子と前記ファンと前記制御基板が前記ヒートシンクの上に搭載され、前記ヒートシンクには前記発熱素子搭載面と非搭載面を貫通する切欠き穴が設けられ、この切欠き穴に対向させて前記ファンを搭載し、前記ファンにより前記吸込口から空気が前記制御装置筐体の内に取り込まれ、前記制御基板の周辺を通過して前記切欠き穴へと導かれ、前記切欠き穴を通って非搭載面側に流れ、前記発熱素子の裏側のヒートシンク面を通り、前記発熱素子からの熱を伝え、前記吐出口から装置の外部へと流れ出るようにしたことにより、前記発熱素子の熱を前記吐出口の直前で放熱されるため、内部の温度上昇を防ぐことを可能にしたことを特徴とするものである。
このように、ヒートシンクに発熱素子搭載面と非発熱素子搭載面とを貫通させる切欠き穴を設けたので、ファンからの冷却風が切欠き穴を通って発熱素子の裏面のヒートシンク面に流れるため、発熱素子からの熱はヒートシンクを介して冷却風に伝わり、その冷却風は密集していない流路を通過でき外部へ放出できるため、効率よく放熱が可能になり温度上昇を抑えることが可能になる。その結果、発熱素子を密集して配置しても効率よく放熱ができるので、ユニットの小型化が可能となる。
【０００８】
【発明の実施の形態】
以下、本発明について、図面に基づいて詳しく説明する。
図１は本発明の実施の形態を示す電気制御装置の分解斜視図、図２は図１の制御基板とヒートシンクを組み立てた電気制御装置の斜視図、図３は図２に示す電気制御装置の冷却風の流れを示す側面断面図である。
図１〜図３において、１は発熱素子、２はファン、３は制御基板、４はヒートシンク、
発熱素子１、ファン２、および制御基板３はヒートシンク４の上に搭載されており、ヒートシンク４には切欠き穴４−１が発熱素子搭載面と非搭載面を貫通するように設けられている。そして、この切欠き穴４−１に対向させてファン２を搭載している。したがって、ファン２からの冷却風は切欠き穴４−１を通って非搭載面側に冷却風を流すことになる。搭載面からの冷却風が非搭載面に流れ込むと、発熱素子１の裏側のヒートシンク面を通過するように冷却風は流れていく。このように、発熱素子１からヒートシンク４に伝わった熱が、この流れの冷却風に伝わり、装置外部へ導かれるため、たとえ発熱素子１の搭載側が部品により密集していたとしても、ヒートシンク４を介して十分に放熱することが可能となる。
【０００９】
図４は第２の実施の形態で、図３記載の電気制御装置を内蔵した制御装置筐体の側面断面図である。
図４において、１は発熱素子、２はファン、３は制御基板、４はヒートシンク、４−１は切欠き穴、５は制御装置筐体、５−１は制御装置筐体における空気の吐出口、５−２は制御装置筐体における空気の吸込口である。
図４から判るように、図３の電気制御装置は制御装置筐体５で覆われており、空気の吸込口５−２には防塵用のフィルタを有している。
この場合、冷却風の流れは、まず吸込口５−２からフィルタを介して塵埃の取り除かれた空気が制御装置筐体５の内に取り込まれ、制御基板３の周辺を通過し切欠き穴４−１へと導かれ、切欠き穴４−１を通過し、発熱素子１の裏側のヒートシンク面を通り、吐出口５−１から装置の外部へと流れ出る。
このような冷却風の流れにより、温度上昇のないフィルタからの冷却風はまず制御基板３を冷却し、切り欠き穴４−１へと流れた後、発熱素子裏側のヒートシンク面を通り発熱素子１からの熱を伝え、装置外部へ放出される。
このように、発熱素子１の熱は吐出口５−１の直前で放熱されるため、内部の温度上昇を防ぐことが可能になる。
また、吐出口５−１に防塵用のフィルタを設けて、吐出口５−１からフィルタを介して塵埃の取り除かれた空気を室内に放出するようにしてもよい。
【００１０】
【発明の効果】
以上、本発明によれば、ヒートシンクに発熱素子搭載面と非発熱素子搭載面とを貫通させる切欠き穴を設け、ファンを稼動させると、切欠き穴及び発熱素子を搭載した裏側のヒートシンク面に冷却風が流れるような流路を設けたので、発熱素子側が密集していて冷却風が十分に通過していなくても、発熱素子の裏面のヒートシンク面には冷却風が流れるため、発熱素子からの熱はヒートシンクを介して冷却風に伝わり、その冷却風は密集していない流路を通過でき外部へ放出できるため、効率よく放熱が可能になり温度上昇を抑えることが可能になる。その結果、発熱素子を密集して配置しても効率よく放熱ができるため、ユニットの小型化が可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態を示す電気制御装置の正面方向の分解斜視図である。
【図２】図１の制御基板とヒートシンクを組み立てた電気制御装置の正面方向の斜視図である。
【図３】図２に示す電気制御装置の冷却風の流れを示す側面断面図である。
【図４】第２の実施の形態で、図３記載の電気制御装置を内蔵した制御装置筐体の側面断面図である。
【図５】本発明の前提となった電気制御装置を示す側面断面図である。
【符号の説明】
１ 発熱素子
２ ファン
３ 制御基板
４ ヒートシンク
４−１ 切欠き穴
５ 制御装置筐体
５−１ 吐出口
５−２ 吸込口[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electric control apparatus having a cooling structure using a fan, and relates to an electric control apparatus such as a servo control apparatus.
[0002]
[Prior art]
It is publicly known that cooling air is circulated through cooling fins of a heat sink to which a semiconductor element is attached (see, for example, Patent Document 1).
[0003]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 10-150284
The invention described in Patent Document 1 reliably cools a semiconductor element without enlarging the heat sink, and forms a first heat sink to which the semiconductor element is attached, a second heat sink to which the semiconductor element is attached, and a wind tunnel. A cover plate and a baffle plate for guiding cooling air; the first heat sink is provided with a second heat sink through a space; the cover plate covers both heat sinks and forms a wind tunnel between the bottom plate and the heat sink; The rectifying plate is made of a member having a hypotenuse and is disposed across the side surface of the first heat sink and the side surface of the second heat sink, with one end attached to the side surface of the second heat sink and the other end connected to the first heat sink. It is attached to the side of the heat sink.
However, since a separate heat sink is provided for each of the semiconductor elements, a gap is formed between the two heat sinks, and a separate bottom plate is required to close the gap, and a cover that forms a wind tunnel leading to the cooling fan is formed. A separate plate is required, increasing the number of parts, increasing the number of mounting steps, and increasing the cost.
[0005]
FIG. 5 shows an electric control device which is a premise of the present invention, which does not require a bottom plate or a cover plate as in the invention described in Patent Document 1.
In the figure, 1 is a plurality of heating elements, 2 is a fan, 3 is a control board, and 4 is a heat sink. The plurality of heating elements 1, the fan 2 and the control board 3 are mounted on a common large heat sink 4. Cooling air from the fan 2 of the heat sink 4 is blown to the heating element 1 and the control board 3 to cool them.
According to this, since the plurality of semiconductor elements are mounted on a common large heat sink, there is no gap between the plurality of semiconductor elements, so that the bottom plate is unnecessary, and the cover plate that forms a wind tunnel leading to the cooling fan The number of parts and mounting man-hours has been reduced, leading to cost reduction.
However, since the plurality of heating elements 1 are densely arranged including peripheral components, the cooling air to the heating elements 1 is not sufficient and the heat dissipation effect is not sufficient.
[0006]
[Problems to be solved by the invention]
As described above, in the above-described electric control device, when the heat generating elements are mounted in close proximity to other components inside the device, the heat dissipation by the heat sink only diffuses the heat, and is positive to the outside of the device. Even when using a fan to dissipate heat, the area around the heating element is dense, so the cooling air from the fan does not reach the heating element sufficiently, and the heat dissipation effect is not sufficient for the heating element. The temperature rise could not be suppressed efficiently.
Further, when trying to increase the heat dissipation effect, there is a problem in that it is necessary to increase the interval between the heat generating elements and the size cannot be reduced.
[0007]
[Means for Solving the Problems]
In order to solve the above problem, the invention according to claim 1 relates to an electric control device, and includes an electric control device having a heat sink, a fan, a heating element, and a control board and covered with a control device casing, The control device housing includes a suction port and a discharge port, and the heating element, the fan, and the control board are mounted on the heat sink, and the heat sink passes through the heating element mounting surface and the non-mounting surface. A notch hole is provided, the fan is mounted so as to face the notch hole, and air is taken into the control device casing from the suction port by the fan and passes through the periphery of the control board. Guided to the notch hole, flows through the notch hole to the non-mounting surface side, passes through the heat sink surface on the back side of the heat generating element, transfers heat from the heat generating element, and from the discharge port to the outside of the apparatus To flow into By the, to be radiating heat of the heat generating element immediately before the discharge port, it is characterized in that it possible to prevent the temperature rise inside.
In this way, the heat sink is provided with a notch hole that penetrates the heat generating element mounting surface and the non-heat generating element mounting surface, so the cooling air from the fan flows through the notch hole to the heat sink surface on the back surface of the heat generating element. The heat from the heating element is transferred to the cooling air through the heat sink, and the cooling air can pass through the non-condensed flow path and can be discharged to the outside, enabling efficient heat dissipation and suppressing temperature rise. Become. As a result, even if the heat generating elements are arranged densely, heat can be radiated efficiently, so that the unit can be downsized.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
1 is an exploded perspective view of an electric control apparatus showing an embodiment of the present invention, FIG. 2 is a perspective view of the electric control apparatus in which the control board and the heat sink of FIG. 1 are assembled, and FIG. 3 is an electric control apparatus shown in FIG. It is side surface sectional drawing which shows the flow of cooling air.
1 to 3, 1 is a heating element, 2 is a fan, 3 is a control board, 4 is a heat sink,
The heat generating element 1, the fan 2, and the control board 3 are mounted on the heat sink 4, and the heat sink 4 is provided with a notch 4-1 so as to penetrate the heat generating element mounting surface and the non-mounting surface. . And the fan 2 is mounted facing this notch hole 4-1. Accordingly, the cooling air from the fan 2 flows through the notch 4-1 to the non-mounting surface side. When the cooling air from the mounting surface flows into the non-mounting surface, the cooling air flows so as to pass through the heat sink surface on the back side of the heating element 1. In this way, the heat transmitted from the heating element 1 to the heat sink 4 is transmitted to the cooling air of this flow and guided to the outside of the apparatus. Therefore, even if the mounting side of the heating element 1 is concentrated by components, the heat sink 4 It is possible to sufficiently dissipate heat.
[0009]
FIG. 4 is a side sectional view of a control device housing in which the electric control device shown in FIG. 3 is built in the second embodiment.
In FIG. 4, 1 is a heating element, 2 is a fan, 3 is a control board, 4 is a heat sink, 4-1 is a notch hole, 5 is a control device housing, and 5-1 is an air outlet in the control device housing. Reference numeral 5-2 denotes an air suction port in the control device casing.
As can be seen from FIG. 4, the electric control device of FIG. 3 is covered with a control device housing 5, and the air suction port 5-2 has a dustproof filter.
In this case, the flow of the cooling air is such that air from which dust has been removed is first taken into the control device housing 5 through the filter through the suction port 5-2, passes through the periphery of the control board 3, and is formed in the cutout hole 4. -1, passes through the notch hole 4-1, passes through the heat sink surface on the back side of the heating element 1, and flows out from the discharge port 5-1 to the outside of the apparatus.
With such a flow of cooling air, the cooling air from the filter that does not increase in temperature first cools the control board 3 and flows to the notch hole 4-1, and then passes through the heat sink surface on the back side of the heat generating element. Heat is transferred from the device and released to the outside of the device.
Thus, since the heat of the heat generating element 1 is radiated immediately before the discharge port 5-1, it is possible to prevent an internal temperature rise.
Further, a dust-proof filter may be provided at the discharge port 5-1, and air from which dust has been removed may be discharged from the discharge port 5-1 through the filter.
[0010]
【The invention's effect】
As described above, according to the present invention, the heat sink is provided with a notch hole that penetrates the heating element mounting surface and the non-heating element mounting surface, and when the fan is operated, the notch hole and the heat sink surface on the back side where the heating element is mounted are provided. Since the flow path for cooling air flow is provided, even if the heat generating element side is dense and the cooling air does not pass sufficiently, the cooling air flows to the heat sink surface on the back surface of the heat generating element. This heat is transmitted to the cooling air through the heat sink, and the cooling air can pass through the non-congested flow path and can be discharged to the outside. Therefore, it is possible to efficiently dissipate the heat and suppress the temperature rise. As a result, even if the heat generating elements are arranged densely, heat can be efficiently radiated, so that the unit can be downsized.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electric control device according to an embodiment of the present invention in the front direction.
FIG. 2 is a front perspective view of the electric control device in which the control board and the heat sink of FIG. 1 are assembled.
3 is a side sectional view showing a flow of cooling air of the electric control device shown in FIG. 2;
4 is a side cross-sectional view of a control device housing in which the electric control device shown in FIG. 3 is built in the second embodiment. FIG.
FIG. 5 is a side cross-sectional view showing an electric control device as a premise of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heating element 2 Fan 3 Control board 4 Heat sink 4-1 Notch hole 5 Control device housing | casing 5-1 Discharge port 5-2 Suction port
Claims (1)
前記制御装置筐体が吸込口と吐出口とを備え、
前記発熱素子と前記ファンと前記制御基板が前記ヒートシンクの上に搭載され、
前記ヒートシンクには前記発熱素子搭載面と非搭載面を貫通する切欠き穴が設けられ、この切欠き穴に対向させて前記ファンを搭載し、
前記ファンにより前記吸込口から空気が前記制御装置筐体の内に取り込まれ、前記制御基板の周辺を通過して前記切欠き穴へと導かれ、前記切欠き穴を通って非搭載面側に流れ、前記発熱素子の裏側のヒートシンク面を通り、前記発熱素子からの熱を伝え、前記吐出口から装置の外部へと流れ出るようにしたことにより、前記発熱素子の熱を前記吐出口の直前で放熱されるため、内部の温度上昇を防ぐことを可能にしたことを特徴とする電気制御装置。 An electric control device having a heat sink, a fan, a heating element, and a control board and covered with a control device casing,
The control device housing includes a suction port and a discharge port,
The heating element, the fan, and the control board are mounted on the heat sink,
The heat sink is provided with a notch hole penetrating the heating element mounting surface and the non-mounting surface, and the fan is mounted facing the notch hole,
Air is taken into the control device casing from the suction port by the fan, passes through the periphery of the control board, is guided to the notch hole, and passes through the notch hole to the non-mounting surface side. The heat flows through the heat sink surface on the back side of the heat generating element, transmits heat from the heat generating element, and flows out from the discharge port to the outside of the device, so that the heat of the heat generating element is immediately before the discharge port. An electric control device characterized by being able to prevent an internal temperature rise due to heat dissipation .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003146349A JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003146349A JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
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| Publication Number | Publication Date |
|---|---|
| JP2004349548A JP2004349548A (en) | 2004-12-09 |
| JP4269103B2 true JP4269103B2 (en) | 2009-05-27 |
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| JP2003146349A Expired - Fee Related JP4269103B2 (en) | 2003-05-23 | 2003-05-23 | Electric control device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007335669A (en) * | 2006-06-15 | 2007-12-27 | Yaskawa Electric Corp | Motor control device |
| JP4936019B2 (en) | 2006-09-04 | 2012-05-23 | 株式会社安川電機 | Motor control device |
| KR101319660B1 (en) | 2006-09-06 | 2013-10-29 | 가부시키가이샤 야스카와덴키 | Motor control device |
| WO2008029638A1 (en) | 2006-09-07 | 2008-03-13 | Kabushiki Kaisha Yaskawa Denki | Motor controller |
| JP4936022B2 (en) | 2006-09-13 | 2012-05-23 | 株式会社安川電機 | Motor control device |
| US12075593B2 (en) | 2020-03-27 | 2024-08-27 | Sony Interactive Entertainment Inc. | Electronic apparatus |
| JP7542608B2 (en) * | 2020-03-27 | 2024-08-30 | 株式会社ソニー・インタラクティブエンタテインメント | Electronics |
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2003
- 2003-05-23 JP JP2003146349A patent/JP4269103B2/en not_active Expired - Fee Related
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