JP4258660B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4258660B2
JP4258660B2 JP2005090415A JP2005090415A JP4258660B2 JP 4258660 B2 JP4258660 B2 JP 4258660B2 JP 2005090415 A JP2005090415 A JP 2005090415A JP 2005090415 A JP2005090415 A JP 2005090415A JP 4258660 B2 JP4258660 B2 JP 4258660B2
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JP
Japan
Prior art keywords
stress
wiring
layer
stress relaxation
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005090415A
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English (en)
Japanese (ja)
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JP2005191605A (ja
JP2005191605A5 (enExample
Inventor
伸晃 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2005090415A priority Critical patent/JP4258660B2/ja
Publication of JP2005191605A publication Critical patent/JP2005191605A/ja
Publication of JP2005191605A5 publication Critical patent/JP2005191605A5/ja
Application granted granted Critical
Publication of JP4258660B2 publication Critical patent/JP4258660B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2005090415A 1997-01-17 2005-03-28 半導体装置 Expired - Lifetime JP4258660B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005090415A JP4258660B2 (ja) 1997-01-17 2005-03-28 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1991597 1997-01-17
JP2005090415A JP4258660B2 (ja) 1997-01-17 2005-03-28 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP53270398A Division JP3811957B2 (ja) 1997-01-17 1998-01-16 電子部品及び半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008247471A Division JP2009027185A (ja) 1997-01-17 2008-09-26 電子部品および半導体装置

Publications (3)

Publication Number Publication Date
JP2005191605A JP2005191605A (ja) 2005-07-14
JP2005191605A5 JP2005191605A5 (enExample) 2007-03-08
JP4258660B2 true JP4258660B2 (ja) 2009-04-30

Family

ID=34796884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005090415A Expired - Lifetime JP4258660B2 (ja) 1997-01-17 2005-03-28 半導体装置

Country Status (1)

Country Link
JP (1) JP4258660B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW448524B (en) * 1997-01-17 2001-08-01 Seiko Epson Corp Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment
KR100759309B1 (ko) 2005-08-08 2007-09-17 세이코 엡슨 가부시키가이샤 반도체 장치
JP4235835B2 (ja) 2005-08-08 2009-03-11 セイコーエプソン株式会社 半導体装置
JP4997848B2 (ja) * 2006-07-04 2012-08-08 Ｔｄｋ株式会社 電子部品
JP5284125B2 (ja) * 2009-01-23 2013-09-11 株式会社東芝 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP2005191605A (ja) 2005-07-14

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