JP4249930B2 - Pre-positioning mechanism and method - Google Patents

Pre-positioning mechanism and method Download PDF

Info

Publication number
JP4249930B2
JP4249930B2 JP2002028976A JP2002028976A JP4249930B2 JP 4249930 B2 JP4249930 B2 JP 4249930B2 JP 2002028976 A JP2002028976 A JP 2002028976A JP 2002028976 A JP2002028976 A JP 2002028976A JP 4249930 B2 JP4249930 B2 JP 4249930B2
Authority
JP
Japan
Prior art keywords
substrate
pushing
feed roller
preliminary positioning
detection sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002028976A
Other languages
Japanese (ja)
Other versions
JP2003226424A (en
Inventor
稔 氏益
雄二 岡村
学 加藤
圭一 神部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orc Manufacturing Co Ltd
Original Assignee
Orc Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orc Manufacturing Co Ltd filed Critical Orc Manufacturing Co Ltd
Priority to JP2002028976A priority Critical patent/JP4249930B2/en
Publication of JP2003226424A publication Critical patent/JP2003226424A/en
Application granted granted Critical
Publication of JP4249930B2 publication Critical patent/JP4249930B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、プリント基板や液晶基板などの露光作業により所定のパターンを形成する基板の位置を予備的に位置決めするための予備位置決め機構に係り、特に基板が薄板である場合に適正な予備位置決め作業を行うことができる予備位置決め機構およびその方法に関する。
【0002】
【従来の技術】
従来において、基板に所定パターンを露光作業により形成する場合には、搬入ステージ、整合ステージ、露光ステージおよび搬出ステージなどの各ステージを備える露光装置が使用されている。そして、各ステージに基板を搬送するためには、搬送手段であるハンドラが一般的に使用されている。搬入ステージでは、基板を受け取る送りローラが設けられ、送りローラの回転により所定位置まで基板を導き入れ、予備位置決め機構により基板の位置を予備位置決めする。基板の予備位置決めが終了すると、ハンドラは、送りローラ近傍まで降下し、吸着パットを基板に当接して基板を真空吸着し、その状態で上昇することで、基板を送りローラからハンドラに受け渡している。ハンドラは、基板を保持した状態で、ガイドフレームに沿って水平方向に移動し、次ステージ(整合ステージ等)に基板を搬送している。
【0003】
ここで、基板の位置を予備位置決めする際、基板を導き入れると共に、基板を載置するための送りローラと、基板の端面を押動し、基準位置にその基板を予備位置決めする押動部を有する移動機構部とから構成された予備位置決め機構が知られている。この予備位置決め機構では、基板が送りローラ上の所定位置に載置されると、その基板の四方の近傍に配置された移動機構部の押動部が、送りローラの上端より突出し、送りローラ間を移動し、基板の端面を押動して、基板を基準位置に移動させている。
【0004】
【発明が解決しようとする課題】
しかしながら、従来の基板の予備位置決め機構の構成では以下のような問題点が存在した。
【0005】
送りローラ上の基板は、特に基板が薄い場合には基板自体に腰が無いために、基板の端面に反りが生じやすかった。さらに、このような端面に反りが生じた基板は、押動部で押動されると、その端面が押動部の下に潜り込み、端面に曲がり、折れ等の変形が生じる(図4参照)。従来の予備位置決め装置では、このような基板も、基板が基準位置に移動するまで、押動部により押動されるので、基板の端面が復元することなく変形してしまい、適切な予備位置決めができない不良基板が発生するという問題があった。また、この不良基板もハンドラで次ステージ(整合ステージ)に搬送されてしまうという問題もあった。
【0006】
そこで、本発明は、このような問題点を解決すべく創案されたもので、その目的は、基板の端面に反りが生じても適正な予備位置決めができ、また位置決め不良基板を次ステージへ搬送することのない予備位置決め機構を提供することにある。
【0007】
【課題を解決するための手段】
前記の課題を解決するため、請求項1に記載の発明は、矩形薄板状の基板を所定位置に導き入れる送りローラと、この送りローラの所定位置に支持された前記基板の四辺の近傍に配置され、前記基板の端面を押動する押動部を有する移動機構部と、前記押動部で押動した前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサと、この基板検出センサで感知できなかった前記基板を前記送りローラ上から排出するための基板排出機構部とを備える予備位置決め機構として構成したものである。
【0008】
前記の構成において、基板検出センサが押動部で押動した基板の周縁となる位置に配置されていることにより、基板の端面の曲がり、折れ等の変形を検出し、押動部の押動を停止および退行移動させて、基板の端面の変形を復元させる(基板の端面の曲がり、折れ等がなくなり、水平状態に戻る)。また、変形が復元しない基板は基板排出機構部により予備位置決め機構外に排出させる。
【0009】
請求項2に記載の発明は、矩形薄板状の基板を所定位置に導き入れる送りローラと、この送りローラで所定位置に配置された前記基板の四辺の近傍に配置され、前記送りローラ間を移動して前記基板の端面を押動する押動部を有する移動機構部と、前記送りローラの上端が突出する貫通穴を有すると共に、前記押動部が移動する貫通長穴を有する前記基板の載置板と、この載置板に載置された基板に対して前記押動部が押動する前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサと、前記送りローラまたは前記載置板の少なくとも一方を昇降させるための昇降機構部と、前記基板検出センサで感知できなかった前記基板を前記載置板上から排出するための基板排出機構部とを備える予備位置決め機構として構成したものである。
【0010】
前記の構成において、載置板上に基板が載置されるので、基板の端面に反りが発生しにくくなり、基板の端面を押動部で押動しても曲がり、折れ等の変形が発生しにくくなる。また、発生した基板の端面の変形は基板検出センサが検出し、再度、基板の予備位置決めがなされる。さらに、変形した基板は基板排出機構部により予備位置決め機構外に排出される。
【0011】
請求項3に記載の発明は、前記基板検出センサが、前記移動機構部の押動部を支持する支持躯体側に配置された予備位置決め機構として構成したものである。
【0012】
前記の構成により、基板の端面の曲がり、折れ等の変形を検出し、押動部の押動を停止および退行移動させて、基板の端面の変形を復元させる(基板の端面の曲がり、折れ等がなくなり、水平状態に戻る)。また、変形が復元しない基板は基板排出機構部により予備位置決め機構外に排出させる。
【0013】
請求項4に記載の発明は、矩形薄板状の基板の端面を、前記基板の四辺の近傍に配置された移動機構部の押動部で押動することにより、前記基板を予備位置決めする方法において、前記押動部で押動する前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサにより前記基板の端面を感知しながら、前記基板の端面を前記押動部で押動して、前記基板センサの感知が正常にならないときは、前記押動部の押動を停止し、退行移動させ、再度、前記基板の端面を前記押動部で押動して、前記基板検出センサの感知が正常なときには前記押動部の押動による予備位置決めを行い、前記基板検出センサの感知が正常にならないときには基板排出機構部により前記基板を排出する予備位置決め方法として構成したものである。
【0014】
前記の構成により、基板検出センサが基板の端面の変形を検出し、押動部の停止および退行移動させるので、基板の変形が復元し、再度、基板の予備位置決めがなされる。また、変形が復元しない基板は基板排出機構部により予備位置決め機構外に排出される。
【発明の実施の形態】
【0015】
以下、本発明にかかる予備位置決め機構の実施の形態を図面に基づき説明する。
図1は第1の実施形態の予備位置決め作業を示す模式図、図2は移動機構部の斜視図、図3は移動機構部の平面図、図4は基板の端面の状態を示す模式図、図5は第2の実施形態の載置板の平面図、図6は第2の実施形態の予備位置決め作業を示す模式図、図7は第2の実施形態の載置板昇降機構部の断面図、図8は第3の実施形態の予備位置決め作業を示す模式図、図9は第3の実施形態の載置板の平面図、図10は第3の実施形態の送りローラ昇降機構部の部分断面図である。
【0016】
予備位置決め機構1は、図1〜図3で示すように、基板Wを載置する送りローラ2aと、基板Wの端面を押動して基板Wを移動させるための移動機構部31、32、41、42と、基板検出センサ31h、32h、41h、42hと、基板排出機構部6から構成されている。
【0017】
送りローラ2aは、図5で示すように、支持フレーム2fに複数列に配置された回転軸2bに支持されており、その回転軸2bの両端に取り付けたプーリ2dに掛け渡した無端ベルト2cを介して、駆動モータ(図示せず)により所定速度で回転するように構成されている。
【0018】
また、送りローラ2aは、列ごとに、あるいは、所定の位置ごとに、それぞれが、独立した駆動源(駆動モータ)を介して回転するように構成しても構わない。そして、送りローラ2aの駆動源を異ならせる場合は、所定位置の送りローラ2aに駆動源を設けないで従動回転する従動送りローラ(図示せず)を設ける構成としても良い。
【0019】
移動機構部31、32、41、42は、図1〜図3で示すように、基板Wの四方で設置板30上の対面する位置に配置され、その押動部31a、32a、41a、42aで基板W中心方向に、基板Wを四方から押動する。
【0020】
移動機構部31、32は、基板Wの対向する端部を押動する押動部31a、32aと、この押動部31a、32aを支持する支持躯体31b、32bと、この支持躯体31b、32bを支持する基台31j、32jと、この基台31j、32jを支持する架台31d、32dとを備えている。そして、この架台31d、32dは、支持躯体31b、32bの移動方向に沿って設けたガイド31c、32cを摺動自在に保持し、駆動モータ31fによって駆動する駆動ベルト31eに接続されている(移動機構部31、32で共有)。
【0021】
したがって、駆動モータ31fの回転によって駆動ベルト31eが駆動すると、架台31d、32dがガイド31c、32cに沿って移動し、架台31d、32dに支持されている支持躯体31b、32b、押動部31a、32aが基板W側に移動する。また、駆動モータ31fの反転駆動により、押動部31a、32aは基板Wから離間する方向に移動する。また、対面する2つの移動機構部31、32のそれぞれが駆動ベルト31e、駆動モータ31fを備えた構成としても良い。
【0022】
また、基台31j、32jは、押動部31a、32aを、基板Wの大きさ、予備位置決めする基準位置に対応して1つ以上支持できるように構成されている。そして、支持躯体31b、32bの後方には、基板Wの端面に押動部31a、32aが当接する際に、その衝撃を吸収するように、弾性部材の伸縮方向と、押動部31a、32aの移動方向が沿うように、弾性部材31g、32gが設けられている。
【0023】
また、基板Wが送りローラ2aに搬入されて来たときに、邪魔にならないように、押動部31a、32aが上下に移動して送りローラ2aから出没自在になるように支持躯体31b、32bを上下動させる上下駆動部31i、32iを備える。
【0024】
また、前記の駆動モータ31fとしては、交流(または直流)モータやパルスモータ等が使用される。特に、パルスモータは動力制御をパルス量で制御するので、前記支持躯体31b、32bの移動精度が高まり、押動部31a、32aを数mm単位で制御できる。なお、パルスモータでは、押動部31a、32aの制御幅が狭いので、基板Wの厚さに対応した調整が必要でないため、作業効率の面からパルスモータの使用が好ましい。
【0025】
さらに、移動機構部41、42は移動機構部31、32と同一の構造であり、図3における押動部41a、42aは押動部31a、32a、支持躯体41b、42bは支持躯体31b、32b、ガイド41c、42cはガイド31c、32c、架台41d、42dは架台31d、32d、駆動ベルト41eは駆動ベルト31e、駆動モータ41fは駆動モータ31f、弾性部材41g、42gは弾性部材31g、32g、上下駆動部41i、42iは上下駆動部31i、32i、基台41j、42jは基台31j、32jと同一であるが、押動部41a、42a間の距離、ガイド41c、42cの長さは押動部31a、32a間、ガイド31c、32cと異なる場合がある。また、押動部41a、42aは、基板Wの搬入時(搬入方向A)の障害にならないので、上下駆動部41i、42iによる上下動を行わない構成としても良い。
【0026】
基板検出センサ31h、32h、41h、42hは、押動部31a、32a、41a、42aで押動した基板Wの周縁に対向する位置に配置される。周縁に対向する位置は、押動部31a、32a、41a、42aの前方(基板W側)で、基板Wの端面を検出できる位置ならば移動機構部31、32、41、42上に限定されず、例えば、設置板30上でも構わない。なお、作業性または検出精度の点から、押動部31a、32a、41a、42aを支持する支持躯体31b、32b、41b、42b側に配置され、図1〜図4では押動部31a、32a、41a,42aの基端近傍の基板W側(支持躯体31b、32b、41b、42bの先端)に配置されることが好ましい。
【0027】
この基板検出センサ31h、32h、41h、42hには、光電センサや静電容量センサ等が使用される。この基板検出センサ31h、32h、41h、42hは、基板Wを感知した場合を正常、基板Wを感知しない場合を異常と判断する。すなわち、基板Wの水平が狂うような曲がり、折れ等の変形が生じた基板Wは、基板検出センサ31h、32h、41h、42hでは感知できず、異常と判断する。このような基板Wの変形は、図4に示すように、端面に反りが生じた基板Wを押動部31a、32a、41a、42a(32a、41a、42aは図示せず)で押動し、基板Wの端面が押動部の下部に潜り込んでしまった場合等に発生する。
【0028】
基板排出機構部6は、図1に示すように、端面が変形した基板Wを予備位置決め機構1外に排出する機能を有するものであれば特に限定されず、例えば、搬入ステージから次ステージ(整合ステージ等)に基板Wを搬送しているハンドラ20に、端面が変形し位置決め不良となった基板Wの排出機能を兼用させることできる。ハンドラ20はガイドレールに沿って水平、垂直方向に移動できるように配置されている。前記ハンドラ20は、基板Wを吸着する吸着パッド21と、この吸着パッド21を支持する保持板22と、この保持板22を上下動自在に支持する緩衝部23と、この緩衝部23を支持する支持フレーム24とから構成されている。緩衝部23は載置板5上の基板Wと当接した際の衝撃を吸収するようにコイルスプリング、ゴム筒、板バネ、エアークッション等の弾性部材で構成されている。
【0029】
予備位置決め機構1の予備位置決め方法は、下記の通りである。
(第1工程)図1(a)で示すように、送りローラ2aの上に基板Wを受け取ると、送りローラ2aが回転し、基板Wを所定の位置まで移動させて、停止する。
【0030】
(第2工程)図1(b)で示すように、移動機構部31、32、41、42(41、42は図示せず)の押動部31a、32a、41a、42a(41a、42aは図示せず)が、上下駆動部31i、32i、41i、42i(41i、42iは図示せず)により送りローラ2aの上端から突出する。さらに押動部31a、32a、41a、42a(41a、42aは図示せず)が、駆動モータ31f、41f(41fは図示せず)の駆動により送りローラ2a間を移動して、基板Wの端面を押動して予備位置決めを行う。
【0031】
(第3工程)基板検出センサ31h、32h、41h、42hが基板Wを感知して正常と判断された場合には、駆動モータ31f、41fが停止して押動部31a、32a、41a、42aによる押動が停止し、基板Wを次ステージ(整合ステージ等)に搬出する指示を基板排出機構部6に出力する。(第6工程)の動作に移る。
【0032】
(第4工程)基板検出センサ31h、32h、41h、42hが基板Wを感知できず異常と判断された場合、すなわち、図4に示されているような端面が変形した基板Wが発生した場合には、押動部31a、32a、41a、42a(32a、41a、42aは図示せず)の押動が停止し、駆動モータ31f、41f(図示せず)が反転駆動して押動部31a、32a、41a、42a(32a、41a、42aは図示せず)が退行移動する。そして、再度、押動部31a、32a、41a、42aによる予備位置決めをやり直す指示を移動機構部31、32、41、42に出力する。
【0033】
(第5工程)再度の予備位置決めで、基板Wが感知された場合には(第3工程)へ、基板Wが感知されない場合には、基板Wを予備位置決め機構1外に排出する指示を基板排出機構部6に出力する。
【0034】
(第6工程)図1(c)で示すように、基板排出機構部6のハンドラ20が、送りローラ2a近傍まで降下し、吸着パット21が基板Wに当接して、基板Wを真空吸着する。その状態でハンドラ20が上昇することで、基板Wが送りローラ2aからハンドラ20に受け渡される。ハンドラ20が基板Wを保持した状態で、ガイドフレームに沿って水平方向に移動して、基板Wを次ステージに搬出、または予備位置決め機構1外に排出する。
【0035】
前記(第4工程)の動作において、押動部31a、32a、41a、42aが停止し、駆動モータ31f、41fが反転駆動して押動部31a、32a、41a、42aが退行移動することにより、基板Wの端面の曲がり、折れ等の変形が復元し、再度、押動部31a、32a、41a、42aで押動することができ、基板Wが適正な位置に予備位置決めされる。
【0036】
また前記(第4工程)の動作において、基板W端面の曲がり、折れ等の変形が復元しない場合には、(第6工程)の動作において、基板排出機構部6により基板Wが予備位置決め機構1外に排出される。
【0037】
つぎに、本発明の第2の実施形態について説明する。予備位置決め機構10は、図6に示すように、前記予備位置決め機構1に、基板Wの反りを防止するための載置板5と、この載置板5を昇降させる昇降機構部としての載置板昇降機構部9を追加した予備位置決め機構である。なお、前記した構成と同じ部材については同じ符号を付して説明を省略する。
【0038】
載置板5は、図5に示すように、その貫通穴5aが、送りローラ2aの回転の障害にならず、かつ、その送りローラ2aの上端が少なくとも載置板5より上方に突出できるように構成されている。そして、予備位置決め用の貫通長穴5bを、移動機構部31、32、41、42の押動部31a、32a、41a、42aの基板W中心方向への移動の障害にならないように、送りローラ2aの送り方向に沿ったA方向に2本の貫通長穴5bと、送りローラ2aの送り方向に直交するB方向に2本の貫通長穴5bを形成している。
【0039】
また、貫通穴5aおよび貫通長穴5bは、それぞれの開口周縁を面取りするように形成されており、載置板5上の基板Wの移動がスムーズにできるように構成されている。この貫通穴5aおよび貫通長穴5bの面取りは基板Wが薄板である場合に重要であり、基板Wの端部が貫通穴5aおよび貫通長穴5bに引っ掛かることを防止し、移動をスムーズにしている。
【0040】
さらに、図5には載置板5に開口部5c(図5では4箇所)が形成されている。開口部5cは、基板Wの予備位置決め時には空気を吹いて基板Wの移動をスムーズにし、また、予備位置決め終了時には真空吸引して載置板5上での基板Wの位置を固定する。
【0041】
載置板昇降機構部9は、載置板5を昇降させる機能を有するものであれば特に限定されず、例えば、図7に示すように、載置板5を着脱自在に支持する支持脚7と、この支持脚7の上部に設けた緩衝部8と、支持脚7を上下動自在に保持する駆動部9Aとから構成されている。
【0042】
また、緩衝部8は、載置板5に接続して設けた筒状の当接部8aと、この当接部8aに設けた支持棹8cと、この支持棹8cに巻回して設けた弾性部材であるコイルスプリング8bとから構成されている。そして、支持脚7の上端に取り付けた支持環7aが、コイルスプリング8bの下端を支持すると共に、支持棹8cが支持脚7の内部に沿って摺動自在となるように構成されている。そのため、載置板5上の基板Wが、後記する基板排出機構部6としてのハンドラ20に当接した際、コイルスプリング8bが収縮し、支持環7aおよび支持脚7が、支持棹8c側に摺動することで、衝撃を吸収するように構成されている。また、弾性部材として、ゴム筒、板バネ、エアークッション等を使用しても良い。
【0043】
さらに、駆動部9Aは、設置板30の下方に設けられており、その設置板30を貫通して配置されている支持脚7の下端を保持する保持部9hと、この保持部9hを固定支持する固定板9gと、この固定板9gに設けられた移動ブロック9dと、この移動ブロック9dを移動させる送りネジ9cと、この送りネジ9cを伝達ベルト9bを介して回動させる駆動モータ9aと、送りネジ9cに対して平行に配置され、固定板9gに取り付けた摺動部9eを介して移動ブロック9dの移動をガイドするガイドフレーム9fとから構成されている。前記の送りねじ機構の代わりに、シリンダ機構、ラックアンドピニオン等により支持脚7を上下動させ、載置板5を昇降移動させる構成であっても良い。
【0044】
基板排出機構部6は、図6に示すように、搬入ステージから次ステージ(整合ステージ等)に基板Wを搬送しているハンドラ20を用いることができる。
予備位置決め機構10の予備位置決め方法は、以下の通りである。
【0045】
(第A工程)図6(a)で示すように、載置板5の貫通穴5a(図示せず)から上端を突出した送りローラ2aの上に基板Wを受け取ると、送りローラ2aが回転し、基板Wを所定の位置まで移動させて、停止する。
【0046】
(第B工程)図6(b)で示すように、載置板昇降機構部9の駆動部9Aを介して支持脚7が上方に移動して載置板5が上昇し、送りローラ2aの上端が基板Wに接触しない状態で載置板5上に基板Wが支持される。移動機構部31、32、41、42(41、42は図示せず)の上下駆動部31i、32i、41i、42i(41i、42iは図示せず)により押動部31a、32a、41a、42a(41a、42aは図示せず)が送りローラ2aの上端から突出し、駆動モータ31f、41f(41fは図示せず)の駆動により、押動部31a、32a、41a、42a(41a、42aは図示せず)が載置板5の貫通長穴5b(図示せず)に沿って移動して、基板Wの端面を押動して予備位置決めを行う。このとき、開口部5cから空気が流出して基板Wの移動をスムーズにしている。
【0047】
(第C工程)基板検出センサ31h、32h、41h、42hが基板Wを感知して正常と判断された場合には、駆動モータ31f、41fが停止して押動部31a、32a、41a、42aによる押動が停止し、基板Wを次ステージ(整合ステージ等)に搬出する指示を基板排出機構部6に出力する。(第F工程)の動作に移る。
【0048】
(第D工程)基板検出センサ31h、32h、41h、42hが基板Wを感知できず異常と判断された場合、すなわち、図4に示されているような端面が変形した基板Wが発生した場合には、押動部31a、32a、41a、42a(32a、41a、42aは図示せず)の押動が停止し、駆動モータ31f、41f(図示せず)が反転駆動して押動部31a、32a、41a、42a(32a、41a、42aは図示せず)が退行移動する。そして、再度、押動部31a、32a、41a、42aによる予備位置決めをやり直す指示を移動機構部31、32、41、42に出力する。
【0049】
(第E工程)再度の予備位置決めで、基板Wが感知された場合には(第C工程)へ、基板Wが感知されない場合には、基板Wを予備位置決め機構10外に排出する指示を基板排出機構部6に出力する。
【0050】
(第F工程)図6(c)で示すように、載置板昇降機構部9の駆動部9Aにより支持脚7がさらに上方に移動して、載置板5が上昇し、待機している基板排出機構部6のハンドラ20の吸着パット21が基板Wに当接して、基板Wを真空吸着する。その状態で載置板5が降下することで、基板Wが載置板5からハンドラ20に受け渡される。ハンドラ20が基板Wを保持した状態で、ガイドフレームに沿って水平方向に移動して、基板Wを次ステージに搬出、または予備位置決め機構10外に排出する。
【0051】
前記(前記B工程)の動作において、基板Wは載置板5上で支持保持されるので、基板W端面の反りが発生しにくくなり、押動部31a、32a、41a、42aの押動による基板Wの端面の変形が発生しにくくなり、基板Wが適正な位置に予備位置決めされる。
【0052】
前記(前記D工程)の動作において、押動部31a、32a、41a、42aが停止し、駆動モータ31f、41fが反転駆動して押動部31a、32a、41a、42aが退行移動することにより、基板Wの端面の曲がり、折れ等の変形が復元し、再度、押動部31a、32a、41a、42aで押動することができ、基板Wが適正な位置に予備位置決めされる。
【0053】
また前記(前記D工程)の動作において、基板W端面の曲がり、折れ等の変形が復元しない場合には、(前記F工程)の動作において、基板排出機構部6により基板Wが予備位置決め機構10外に排出される。
【0054】
つぎに、本発明の第3の実施形態について説明する。予備位置決め機構40は、図8に示すように、前記予備位置決め機構10の載置板昇降機構部9の代わりに、前記載置板5を送りローラ2a上に配置するための受渡機構部51と、基板Wを載置板5の上に支持するための送りローラ昇降機構部2g(図10)を備えた予備位置決め機構である。なお、前記した構成と同じ部材については同じ符号を付して説明を省略する。
【0055】
受渡機構部51は、図9に示すように、載置板5の端面に接続された受渡腕51cと、この受渡腕51cで載置板5を送りローラ2a上から垂直方向に立ち上げるための回転軸51bと、この回転軸51bを回転させる駆動モータ51aから構成されている。この受渡機構部51により、開口部5cの真空吸引により載置板5上に固定された基板Wが次ステージ(整合ステージ等)へ受け渡される。
【0056】
送りローラ昇降機構部2gは、送りローラ2aを昇降させる機能を有するものであれば特に限定されず、例えば、図10に示すように、シリンダ機構により支持フレーム2fに固定された駆動モータ2eを降下させて、送りローラ2aの上端が基板Wと接触しない状態にして、基板Wを載置板5上に支持させるように構成されており、シリンダ機構の代わりに、送りネジ機構、ラックアンドピニオン等により駆動モータ2eを上下動させ、送りローラ2aを昇降移動させる構成であっても良い。
【0057】
予備位置決め機構40の予備位置決め方法は、以下の通りである。
(第イ工程)図8(a)で示すように、受渡機構部51を介して載置板5を送りローラ2a上に閉じて、この載置板5の貫通穴5a(図示せず)から上端を突出した送りローラ2aの上に基板Wを受け取ると、送りローラ2aが回転し、基板Wを所定の位置まで移動させて、停止する。
【0058】
(第ロ工程)図8(b)で示すように、送りローラ昇降機構部2g(図10)のシリンダ機構により送りローラ2aを降下させて、送りローラ2aの上端が基板Wに接触しない状態で載置板5上に基板Wが支持される。移動機構部31、32、41、42(41、42は図示せず)の上下駆動部31i、32i、41i、42i(41i、42iは図示せず)により押動部31a、32a、41a、42a(41a、42aは図示せず)が送りローラ2aの上端から突出し、駆動モータ31f、41f(41fは図示せず)の駆動により、押動部31a、32a、41a、42a(41a、42aは図示せず)が載置板5の貫通長穴5b(図示せず)に沿って移動して、基板Wの端面を押動して予備位置決めを行う。
【0059】
(第ハ工程)基板検出センサ31h、32h、41h、42hが基板Wを感知して正常と判断された場合には、駆動モータ31f、41fが停止して押動部31a、32a、41a、42aによる押動が停止し、載置板5の開口部5cで基板Wを真空吸引して、載置板5上に基板Wを固定し、受渡機構部51により基板Wを次ステージ(整合ステージ等)へ受け渡す。
【0060】
(第ニ工程)基板検出センサ31h、32h、41h、42hが基板Wを感知できず異常と判断された場合、すなわち、図4に示されているような端面が変形した基板Wが発生した場合には、押動部31a、32a、41a、42a(32a、41a、42aは図示せず)の押動が停止し、駆動モータ31f、41f(図示せず)が反転駆動して押動部31a、32a、41a、42a(32a、41a、42aは図示せず)が退行移動する。そして、再度、押動部31a、32a、41a、42aによる予備位置決めをやり直す指示を移動機構部31、32、41、42に出力する。
【0061】
(第ホ工程)再度の予備位置決めで、基板Wが感知された場合には(第ハ工程)へ、基板Wが感知されない場合には、基板Wを予備位置決め機構40外に排出する指示を基板排出機構部6に出力する。
【0062】
(第ヘ工程)図8(c)で示すように、基板排出機構部6のハンドラ20が、送りローラ2a近傍まで降下し、吸着パット21が基板Wに当接して、基板Wを真空吸着する。その状態でハンドラ20が上昇することで、基板Wが送りローラ2aからハンドラ20に受け渡される。ハンドラ20が基板Wを保持した状態で、ガイドフレームに沿って水平方向に移動して、基板Wを予備位置決め機構40外に排出する。
【0063】
前記(前記ロ工程)の動作により、基板Wは載置板5上で支持保持されるので、基板W端面の反りが発生しにくくなり、押動部31a、32a、41a、42aの押動による基板Wの端面の変形が発生しにくくなり、基板Wが適正な位置に予備位置決めされる。
【0064】
前記(前記ニ工程)の動作において、押動部31a、32a、41a、42aが停止し、駆動モータ31f、41fが反転駆動して押動部31a、32a、41a、42aが退行移動することにより、基板Wの端面の曲がり、折れ等の変形が復元し、再度、押動部31a、32a、41a、42aで押動することができ、基板Wが適正な位置に予備位置決めされる。
【0065】
また前記(前記ニ工程)の動作において、基板W端面の曲がり、折れ等の変形が復元しない場合には、(前記ヘ工程)の動作において、基板排出機構部6により基板Wが予備位置決め機構40外に排出される。
【0066】
【発明の効果】
前記したように、本発明において、基板検出センサが押動部で押動した基板の周縁となる位置または移動機構部の押動部を支持する支持躯体側に配置されていることにより、基板の端面に反りが生じても適正な予備位置決めができ、また位置決め不良基板を次ステージへ搬送することのない予備位置決め機構を提供できる。
【0067】
また、本発明において、基板を載置板上で支持するための載置板昇降機構部または送りローラ昇降機構部が備えられていることにより、基板の端面に反りが発生しにくくなり、さらに適正な予備位置決めが可能となる。
【0068】
また、所定位置に導き入れられた基板を、移動機構部の押動部の押動により予備位置決め作業を行う際に、押動部で押動した基板の周縁となる位置に配置された基板検出センサの感知が正常にならないときは、前記押動部の押動を停止し、退行移動させた後に再度押動による予備位置決めを行う、または、前記基板検出センサの感知が正常にならないときには基板排出機構部により前記基板を排出するので、基板の端面に反りが生じても適正な予備位置決めができ、また位置決め不良基板を次ステージへ搬送することのない予備位置決め方法を提供できる。
【図面の簡単な説明】
【図1】本発明の第1の実施形態の予備位置決め作業を示す模式図である。
【図2】本発明の移動機構部の斜視図である。
【図3】本発明の移動機構部の平面図である。
【図4】本発明の基板の端面の状態を示す模式図である。
【図5】本発明の第2の実施形態の載置板の平面図である。
【図6】本発明の第2の実施形態の予備位置決め作業を示す模式図である。
【図7】本発明の第2の実施形態の載置板昇降機構部の断面図である。
【図8】本発明の第3の実施形態の予備位置決め作業を示す模式図である。
【図9】本発明の第3の実施形態の載置板の平面図である。
【図10】本発明の第3の実施形態の送りローラ昇降機構部を示す部分断面図である。
【符号の説明】
1、10、40 予備位置決め機構
2a 送りローラ
2b 回転軸
2c 無端ベルト
2d プーリ
2e 駆動モータ
2f 支持フレーム
2g 送りローラ昇降機構部
30 設置板
31、32、41、42 移動機構部
31a、32a、41a、42a 押動部
31b、32b、41b、42b 支持躯体
31c、32c、41c、42c ガイド
31d、32d、41d、42d 架台
31e、41e 駆動ベルト
31f、41f 駆動モータ
31g、32g、41g、42g 弾性部材
31h、32h、41h、42h 基板検出センサ
31i、32i、41i、42i 上下駆動部
31j、32j、41j、42j 基台
5 載置板
5a 貫通穴
5b 貫通長穴
5c 開口部
51 受渡機構部
51a 駆動モータ
51b 回転軸
51c 受渡腕
6 基板排出機構部
7 支持脚
8 緩衝部
9 載置板昇降機構部
9A 駆動部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a preliminary positioning mechanism for preliminarily positioning the position of a substrate on which a predetermined pattern is formed by an exposure operation such as a printed circuit board or a liquid crystal substrate, and in particular, an appropriate preliminary positioning operation when the substrate is a thin plate. The present invention relates to a pre-positioning mechanism and a method thereof.
[0002]
[Prior art]
Conventionally, when a predetermined pattern is formed on a substrate by an exposure operation, an exposure apparatus including each stage such as a carry-in stage, an alignment stage, an exposure stage, and a carry-out stage is used. And in order to convey a board | substrate to each stage, the handler which is a conveyance means is generally used. In the carry-in stage, a feed roller for receiving the substrate is provided, the substrate is guided to a predetermined position by the rotation of the feed roller, and the position of the substrate is preliminarily positioned by the preliminary positioning mechanism. When the pre-positioning of the substrate is completed, the handler descends to the vicinity of the feed roller, a suction pad is brought into contact with the substrate, the substrate is vacuum-sucked, and the substrate is transferred from the feed roller to the handler by raising in that state. . The handler moves in the horizontal direction along the guide frame while holding the substrate, and conveys the substrate to the next stage (alignment stage or the like).
[0003]
Here, when the position of the substrate is preliminarily positioned, the substrate is introduced, a feed roller for placing the substrate, and a pushing portion for preliminarily positioning the substrate at the reference position by pushing the end surface of the substrate. There is known a preliminary positioning mechanism composed of a moving mechanism section having the same. In this preliminary positioning mechanism, when the substrate is placed at a predetermined position on the feed roller, the pushing portion of the moving mechanism portion arranged in the vicinity of the four sides of the substrate protrudes from the upper end of the feed roller, and between the feed rollers. And the end surface of the substrate is pushed to move the substrate to the reference position.
[0004]
[Problems to be solved by the invention]
However, the configuration of the conventional substrate preliminary positioning mechanism has the following problems.
[0005]
The substrate on the feed roller is prone to warp on the end surface of the substrate because the substrate itself is not thin, especially when the substrate is thin. Further, when the substrate having such a warped end surface is pushed by the pushing portion, the end surface is submerged under the pushing portion, bent to the end surface, and deformed such as bent (see FIG. 4). . In the conventional preliminary positioning apparatus, such a substrate is also pushed by the pushing portion until the substrate moves to the reference position, so that the end surface of the substrate is deformed without being restored, and appropriate preliminary positioning is performed. There was a problem that a defective substrate could not be generated. There is also a problem that this defective substrate is also transferred to the next stage (alignment stage) by the handler.
[0006]
Therefore, the present invention was created to solve such problems, and its purpose is to perform proper pre-positioning even if the end face of the substrate is warped, and to transport a poorly positioned substrate to the next stage. It is an object of the present invention to provide a pre-positioning mechanism that does not.
[0007]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 is arranged in the vicinity of a feed roller for introducing a rectangular thin plate-like substrate into a predetermined position and four sides of the substrate supported at the predetermined position of the feed roller. And a moving mechanism having a pusher that pushes the end face of the substrate, and a position facing the periphery of the substrate pushed by the pusher. The deformation of the end face of the substrate is detected by the presence or absence of sensing. It is configured as a preliminary positioning mechanism including a substrate detection sensor and a substrate discharge mechanism for discharging the substrate that could not be detected by the substrate detection sensor from the feed roller.
[0008]
In the above-described configuration, the substrate detection sensor is disposed at a position that becomes the periphery of the substrate pushed by the pushing portion, thereby detecting deformation such as bending or bending of the end surface of the substrate, and pushing the pushing portion. Is stopped and retracted to restore the deformation of the end face of the substrate (the end face of the substrate is not bent, bent, etc., and returns to the horizontal state). Further, the substrate whose deformation is not restored is discharged out of the preliminary positioning mechanism by the substrate discharging mechanism.
[0009]
According to a second aspect of the present invention, a feed roller that guides a rectangular thin plate-shaped substrate to a predetermined position, and the four rollers of the substrate disposed at the predetermined position by the feed roller are moved between the feed rollers. The moving mechanism portion having a pushing portion that pushes the end surface of the substrate, the through-hole through which the upper end of the feed roller protrudes, and the through-hole that moves the pushing portion are mounted on the substrate. The placement plate and the substrate placed on the placement plate are disposed at a position facing the periphery of the substrate where the pushing portion pushes against the placement plate. The deformation of the end face of the substrate is detected by the presence or absence of sensing. A substrate detection sensor, an elevating mechanism for moving up and down at least one of the feed roller or the mounting plate, and a substrate discharge for discharging the substrate that could not be detected by the substrate detection sensor from the mounting plate It is comprised as a preliminary positioning mechanism provided with a mechanism part.
[0010]
In the above configuration, since the substrate is placed on the mounting plate, it is difficult for the end surface of the substrate to be warped, and even when the end surface of the substrate is pushed by the pushing portion, bending, deformation or the like occurs. It becomes difficult to do. Further, the substrate detection sensor detects the generated deformation of the end face of the substrate, and the substrate is preliminarily positioned. Further, the deformed substrate is discharged out of the preliminary positioning mechanism by the substrate discharge mechanism.
[0011]
According to a third aspect of the present invention, the substrate detection sensor is configured as a preliminary positioning mechanism disposed on a support housing side that supports the pushing portion of the moving mechanism portion.
[0012]
With the above configuration, the deformation of the end surface of the substrate is detected, and the deformation of the end surface of the substrate is restored by stopping and retreating the pushing portion of the pushing portion (bending, bending, etc. of the end surface of the substrate). Will disappear and return to the horizontal state). Further, the substrate whose deformation is not restored is discharged out of the preliminary positioning mechanism by the substrate discharging mechanism.
[0013]
According to a fourth aspect of the present invention, in the method for pre-positioning the substrate, the end surface of the rectangular thin plate-like substrate is pushed by a pushing portion of a moving mechanism portion disposed in the vicinity of the four sides of the substrate. And disposed at a position facing the periphery of the substrate that is pushed by the pushing portion. The deformation of the end face of the substrate is detected by the presence or absence of sensing. While the end surface of the substrate is sensed by the substrate detection sensor and the end surface of the substrate is pushed by the pushing portion, and the sensing of the substrate sensor is not normal, the pushing of the pushing portion is stopped. Retreating, and again pushing the end face of the substrate with the pushing portion, and when the sensing of the substrate detecting sensor is normal, pre-positioning by pushing the pushing portion is performed, and the substrate detecting sensor This is configured as a preliminary positioning method in which the substrate is ejected by the substrate ejection mechanism when sensing is not normal.
[0014]
With the above configuration, the substrate detection sensor detects the deformation of the end face of the substrate and stops and retracts the pushing portion, so that the deformation of the substrate is restored and the substrate is preliminarily positioned again. A substrate whose deformation is not restored is discharged out of the preliminary positioning mechanism by the substrate discharge mechanism.
DETAILED DESCRIPTION OF THE INVENTION
[0015]
Embodiments of a preliminary positioning mechanism according to the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic diagram illustrating a preliminary positioning operation of the first embodiment, FIG. 2 is a perspective view of a moving mechanism unit, FIG. 3 is a plan view of the moving mechanism unit, and FIG. 4 is a schematic diagram illustrating a state of an end surface of a substrate. FIG. 5 is a plan view of the mounting plate according to the second embodiment, FIG. 6 is a schematic view showing a preliminary positioning operation according to the second embodiment, and FIG. 7 is a cross-sectional view of the mounting plate lifting mechanism according to the second embodiment. FIG. 8, FIG. 8 is a schematic view showing the preliminary positioning operation of the third embodiment, FIG. 9 is a plan view of the mounting plate of the third embodiment, and FIG. 10 is a drawing of the feed roller lifting mechanism portion of the third embodiment. It is a fragmentary sectional view.
[0016]
As shown in FIGS. 1 to 3, the preliminary positioning mechanism 1 includes a feed roller 2 a on which the substrate W is placed, and moving mechanisms 31 and 32 for moving the substrate W by pushing the end surface of the substrate W. 41, 42, substrate detection sensors 31h, 32h, 41h, 42h, and a substrate discharge mechanism section 6.
[0017]
As shown in FIG. 5, the feed roller 2a is supported by a rotating shaft 2b arranged in a plurality of rows on a support frame 2f, and an endless belt 2c stretched around pulleys 2d attached to both ends of the rotating shaft 2b. Via a drive motor (not shown).
[0018]
Moreover, you may comprise the feed roller 2a so that it may each rotate via an independent drive source (drive motor) for every row | line or for every predetermined position. And when making the drive source of the feed roller 2a different, it is good also as a structure which provides the driven feed roller (not shown) rotated by a feed roller 2a of a predetermined position without providing a drive source.
[0019]
As shown in FIGS. 1 to 3, the moving mechanism parts 31, 32, 41, 42 are arranged at facing positions on the installation plate 30 in four directions of the substrate W, and the pushing parts 31 a, 32 a, 41 a, 42 a. Then, the substrate W is pushed from four directions toward the center of the substrate W.
[0020]
The moving mechanism units 31 and 32 include pushing units 31a and 32a that push the opposing ends of the substrate W, support housings 31b and 32b that support the pushing units 31a and 32a, and support housings 31b and 32b. And bases 31d and 32d for supporting the bases 31j and 32j. The mounts 31d and 32d are slidably held by guides 31c and 32c provided along the moving direction of the support housings 31b and 32b, and are connected to a driving belt 31e driven by a driving motor 31f (moving). Shared between the mechanism units 31 and 32).
[0021]
Accordingly, when the drive belt 31e is driven by the rotation of the drive motor 31f, the gantry 31d and 32d move along the guides 31c and 32c, and the supporting housings 31b and 32b supported by the gantry 31d and 32d, the pushing portion 31a, 32a moves to the substrate W side. Further, the pushing portions 31a and 32a move in the direction away from the substrate W by the reverse drive of the drive motor 31f. Moreover, it is good also as a structure with each of the two moving mechanism parts 31 and 32 which face each other provided with the drive belt 31e and the drive motor 31f.
[0022]
The bases 31j and 32j are configured to support one or more pushers 31a and 32a corresponding to the size of the substrate W and the reference position for preliminary positioning. And in the rear of the support housings 31b and 32b, when the pushing portions 31a and 32a come into contact with the end surface of the substrate W, the elastic member expands and contracts and the pushing portions 31a and 32a absorb the impact. The elastic members 31g and 32g are provided so that the movement direction of the
[0023]
Further, when the substrate W is carried into the feed roller 2a, the support casings 31b and 32b are arranged so that the pushing portions 31a and 32a move up and down so that they can protrude and retract from the feed roller 2a so as not to get in the way. Are provided with vertical drive units 31i and 32i.
[0024]
As the drive motor 31f, an AC (or DC) motor, a pulse motor, or the like is used. In particular, since the pulse motor controls the power control by the amount of pulses, the movement accuracy of the support housings 31b and 32b is improved, and the pushing portions 31a and 32a can be controlled in units of several mm. In the pulse motor, since the control width of the pushing portions 31a and 32a is narrow, adjustment corresponding to the thickness of the substrate W is not necessary. Therefore, it is preferable to use the pulse motor from the viewpoint of work efficiency.
[0025]
Further, the moving mechanism parts 41 and 42 have the same structure as the moving mechanism parts 31 and 32, the pushing parts 41a and 42a in FIG. 3 are the pushing parts 31a and 32a, and the supporting housings 41b and 42b are the supporting housings 31b and 32b. The guides 41c and 42c are guides 31c and 32c, the mounts 41d and 42d are mounts 31d and 32d, the drive belt 41e is a drive belt 31e, the drive motor 41f is a drive motor 31f, and the elastic members 41g and 42g are elastic members 31g and 32g. The drive units 41i and 42i are the same as the base units 31j and 32j, but the distance between the push units 41a and 42a and the lengths of the guides 41c and 42c are pushing. There may be a difference between the portions 31a and 32a and the guides 31c and 32c. Moreover, since the pushing parts 41a and 42a do not become an obstacle at the time of carrying in the substrate W (in the carrying-in direction A), the vertical movements by the vertical driving parts 41i and 42i may not be performed.
[0026]
Substrate detection sensors 31h, 32h, 41h, and 42h are arranged at positions facing the periphery of the substrate W pushed by the pushing portions 31a, 32a, 41a, and 42a. The position facing the peripheral edge is limited to the position on the moving mechanism parts 31, 32, 41, and 42 as long as the end face of the substrate W can be detected in front of the pushing parts 31a, 32a, 41a, and 42a (on the substrate W side). For example, it may be on the installation plate 30. From the viewpoint of workability or detection accuracy, the pushers 31a, 32a, 41a, and 42a are disposed on the support housings 31b, 32b, 41b, and 42b that support the pushers 31a, 32a, 41a, and 42a. , 41a, 42a are preferably disposed on the substrate W side (the tips of the support housings 31b, 32b, 41b, 42b) in the vicinity of the base ends.
[0027]
For the substrate detection sensors 31h, 32h, 41h, and 42h, photoelectric sensors, capacitance sensors, or the like are used. The substrate detection sensors 31h, 32h, 41h, and 42h determine that the case where the substrate W is sensed is normal and the case where the substrate W is not sensed is abnormal. That is, the substrate W in which the substrate W is bent or deformed such that it is bent horizontally cannot be detected by the substrate detection sensors 31h, 32h, 41h, and 42h, and is determined to be abnormal. As shown in FIG. 4, the deformation of the substrate W is performed by pushing the substrate W whose end face is warped by pushing portions 31 a, 32 a, 41 a, 42 a (32 a, 41 a, 42 a are not shown). This occurs when the end surface of the substrate W has entered the lower portion of the pushing portion.
[0028]
As shown in FIG. 1, the substrate discharge mechanism unit 6 is not particularly limited as long as it has a function of discharging the substrate W whose end face is deformed to the outside of the preliminary positioning mechanism 1. The handler 20 that is transporting the substrate W to a stage or the like can also be used for the discharge function of the substrate W whose end face has been deformed to cause positioning failure. The handler 20 is arranged so as to be movable in the horizontal and vertical directions along the guide rail. The handler 20 supports a suction pad 21 that sucks the substrate W, a holding plate 22 that supports the suction pad 21, a buffer portion 23 that supports the holding plate 22 so as to move up and down, and a buffer portion 23. And a support frame 24. The buffer portion 23 is composed of an elastic member such as a coil spring, a rubber tube, a leaf spring, an air cushion or the like so as to absorb an impact when contacting the substrate W on the placement plate 5.
[0029]
The preliminary positioning method of the preliminary positioning mechanism 1 is as follows.
(First Step) As shown in FIG. 1A, when a substrate W is received on the feed roller 2a, the feed roller 2a rotates, moves the substrate W to a predetermined position, and stops.
[0030]
(Second Step) As shown in FIG. 1B, the pushing portions 31a, 32a, 41a, 42a (41a, 42a) of the moving mechanism portions 31, 32, 41, 42 (41, 42 are not shown) (Not shown) protrudes from the upper end of the feed roller 2a by the vertical drive units 31i, 32i, 41i, 42i (41i, 42i are not shown). Further, the pushing portions 31a, 32a, 41a, 42a (41a, 42a are not shown) are moved between the feed rollers 2a by driving of the drive motors 31f, 41f (41f are not shown), and the end face of the substrate W is moved. To perform preliminary positioning.
[0031]
(Third Step) When the substrate detection sensors 31h, 32h, 41h, 42h sense the substrate W and are determined to be normal, the drive motors 31f, 41f are stopped and the pushing portions 31a, 32a, 41a, 42a Is stopped, and an instruction to carry the substrate W to the next stage (alignment stage or the like) is output to the substrate discharge mechanism 6. The operation proceeds to (Sixth Step).
[0032]
(4th process) When the board | substrate detection sensors 31h, 32h, 41h, and 42h cannot detect the board | substrate W and it is judged that it is abnormal, ie, when the board | substrate W which the end surface deform | transformed as shown in FIG. 4 generate | occur | produces The pushing portions 31a, 32a, 41a, 42a (32a, 41a, 42a are not shown) are stopped, and the drive motors 31f, 41f (not shown) are driven in reverse to push the pushing portion 31a. , 32a, 41a, 42a (32a, 41a, 42a not shown) move backward. And the instruction | indication which redoes preliminary positioning by the pushing parts 31a, 32a, 41a, 42a is output to the movement mechanism parts 31, 32, 41, 42 again.
[0033]
(Fifth step) If the substrate W is detected in the preliminary positioning again (third step), if the substrate W is not detected, an instruction to eject the substrate W out of the preliminary positioning mechanism 1 is given. Output to the discharge mechanism section 6.
[0034]
(Sixth Step) As shown in FIG. 1C, the handler 20 of the substrate discharge mechanism unit 6 descends to the vicinity of the feed roller 2a, the suction pad 21 comes into contact with the substrate W, and vacuum sucks the substrate W. . In this state, the handler 20 is raised, so that the substrate W is transferred from the feed roller 2a to the handler 20. With the handler 20 holding the substrate W, the handler 20 moves in the horizontal direction along the guide frame, and the substrate W is carried out to the next stage or discharged out of the preliminary positioning mechanism 1.
[0035]
In the operation of the above (fourth step), the pushing parts 31a, 32a, 41a, 42a are stopped, the drive motors 31f, 41f are driven reversely, and the pushing parts 31a, 32a, 41a, 42a move backward. Then, the deformation of the end surface of the substrate W such as bending or bending is restored and the substrate W can be pushed again by the pushing portions 31a, 32a, 41a, and 42a, and the substrate W is preliminarily positioned at an appropriate position.
[0036]
Further, when the deformation of the end face of the substrate W is not restored in the operation of the (fourth step), the substrate discharge mechanism unit 6 moves the substrate W to the preliminary positioning mechanism 1 in the operation of the (sixth step). Discharged outside.
[0037]
Next, a second embodiment of the present invention will be described. As shown in FIG. 6, the preliminary positioning mechanism 10 is placed on the preliminary positioning mechanism 1 as a mounting plate 5 for preventing the substrate W from warping and a lifting mechanism unit for moving the mounting plate 5 up and down. This is a preliminary positioning mechanism to which a plate lifting mechanism unit 9 is added. In addition, about the same member as the above-mentioned structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.
[0038]
As shown in FIG. 5, the mounting plate 5 has a through hole 5 a that does not obstruct the rotation of the feed roller 2 a, and the upper end of the feed roller 2 a can protrude at least above the placement plate 5. It is configured. Then, the feed roller is arranged so that the through-hole 5b for preliminary positioning does not become an obstacle to the movement of the pushing portions 31a, 32a, 41a, 42a of the moving mechanism portions 31, 32, 41, 42 toward the center of the substrate W. Two through long holes 5b are formed in the A direction along the feed direction 2a, and two through long holes 5b are formed in the B direction perpendicular to the feed direction of the feed roller 2a.
[0039]
Further, the through hole 5a and the through long hole 5b are formed so as to chamfer the peripheral edges of the respective openings, and are configured so that the substrate W on the mounting plate 5 can be moved smoothly. The chamfering of the through hole 5a and the through long hole 5b is important when the substrate W is a thin plate. The end of the substrate W is prevented from being caught by the through hole 5a and the through long hole 5b, and the movement is made smooth. Yes.
[0040]
Further, in FIG. 5, openings 5 c (four places in FIG. 5) are formed in the mounting plate 5. The opening 5c blows air at the time of preliminary positioning of the substrate W to smoothly move the substrate W, and at the end of preliminary positioning, vacuum suction is performed to fix the position of the substrate W on the mounting plate 5.
[0041]
The mounting plate elevating mechanism unit 9 is not particularly limited as long as it has a function of moving the mounting plate 5 up and down. For example, as shown in FIG. 7, a support leg 7 that detachably supports the mounting plate 5. And the buffer part 8 provided in the upper part of this support leg 7, and the drive part 9A which hold | maintains the support leg 7 so that vertical movement is possible.
[0042]
The buffer portion 8 includes a cylindrical abutting portion 8a provided connected to the mounting plate 5, a support rod 8c provided on the abutting portion 8a, and an elastic member provided around the support rod 8c. It is comprised from the coil spring 8b which is a member. The support ring 7a attached to the upper end of the support leg 7 supports the lower end of the coil spring 8b, and the support rod 8c is slidable along the inside of the support leg 7. Therefore, when the substrate W on the mounting plate 5 comes into contact with a handler 20 as the substrate discharge mechanism 6 described later, the coil spring 8b contracts, and the support ring 7a and the support leg 7 are moved to the support rod 8c side. It is configured to absorb the impact by sliding. Moreover, you may use a rubber cylinder, a leaf | plate spring, an air cushion etc. as an elastic member.
[0043]
Further, the drive unit 9A is provided below the installation plate 30, and a holding unit 9h that holds the lower end of the support leg 7 disposed through the installation plate 30, and the holding unit 9h is fixedly supported. A fixing plate 9g to be moved, a moving block 9d provided on the fixing plate 9g, a feed screw 9c for moving the moving block 9d, a drive motor 9a for rotating the feed screw 9c via a transmission belt 9b, The guide frame 9f is arranged in parallel to the feed screw 9c and guides the movement of the moving block 9d through a sliding portion 9e attached to the fixed plate 9g. Instead of the feed screw mechanism, the support leg 7 may be moved up and down by a cylinder mechanism, rack and pinion or the like, and the mounting plate 5 may be moved up and down.
[0044]
As shown in FIG. 6, the substrate discharge mechanism 6 can use a handler 20 that transports the substrate W from the carry-in stage to the next stage (alignment stage or the like).
The preliminary positioning method of the preliminary positioning mechanism 10 is as follows.
[0045]
(Process A) As shown in FIG. 6A, when the substrate W is received on the feed roller 2a protruding from the through hole 5a (not shown) of the mounting plate 5, the feed roller 2a rotates. Then, the substrate W is moved to a predetermined position and stopped.
[0046]
(Step B) As shown in FIG. 6 (b), the support leg 7 is moved upward through the drive portion 9A of the placement plate lifting mechanism portion 9 to raise the placement plate 5, and the feed roller 2a. The substrate W is supported on the mounting plate 5 in a state where the upper end does not contact the substrate W. Pushing parts 31a, 32a, 41a, 42a by vertical drive parts 31i, 32i, 41i, 42i (41i, 42i not shown) of the moving mechanism parts 31, 32, 41, 42 (41, 42 not shown). (41a and 42a are not shown) protrude from the upper end of the feed roller 2a, and by driving of drive motors 31f and 41f (41f not shown), the pushing portions 31a, 32a, 41a and 42a (41a and 42a are shown) (Not shown) moves along a through-hole 5b (not shown) of the mounting plate 5 and pushes the end face of the substrate W to perform preliminary positioning. At this time, air flows out from the opening 5c, and the movement of the substrate W is made smooth.
[0047]
(Step C) When the substrate detection sensors 31h, 32h, 41h, 42h sense the substrate W and are determined to be normal, the drive motors 31f, 41f are stopped and the pushing portions 31a, 32a, 41a, 42a Is stopped, and an instruction to carry the substrate W to the next stage (alignment stage or the like) is output to the substrate discharge mechanism 6. The operation proceeds to (Step F).
[0048]
(Step D) When the substrate detection sensors 31h, 32h, 41h, and 42h cannot detect the substrate W and are determined to be abnormal, that is, when the substrate W having a deformed end surface as shown in FIG. 4 occurs. The pushing portions 31a, 32a, 41a, 42a (32a, 41a, 42a are not shown) are stopped, and the drive motors 31f, 41f (not shown) are driven in reverse to push the pushing portion 31a. , 32a, 41a, 42a (32a, 41a, 42a not shown) move backward. And the instruction | indication which redoes preliminary positioning by the pushing parts 31a, 32a, 41a, 42a is output to the movement mechanism parts 31, 32, 41, 42 again.
[0049]
(Step E) If the substrate W is detected in the preliminary positioning again (step C), if the substrate W is not detected, an instruction to discharge the substrate W out of the preliminary positioning mechanism 10 is given. Output to the discharge mechanism section 6.
[0050]
(Step F) As shown in FIG. 6C, the support leg 7 is further moved upward by the drive unit 9A of the mounting plate elevating mechanism unit 9, and the mounting plate 5 is lifted and stands by. The suction pad 21 of the handler 20 of the substrate discharge mechanism unit 6 comes into contact with the substrate W and vacuum-sucks the substrate W. In this state, the placement plate 5 is lowered, so that the substrate W is transferred from the placement plate 5 to the handler 20. With the handler 20 holding the substrate W, the handler 20 moves in the horizontal direction along the guide frame, and the substrate W is carried out to the next stage or discharged out of the preliminary positioning mechanism 10.
[0051]
In the operation of the above (Step B), since the substrate W is supported and held on the mounting plate 5, the end surface of the substrate W is less likely to be warped, and the pushing portions 31 a, 32 a, 41 a, and 42 a are pushed. The end face of the substrate W is hardly deformed, and the substrate W is preliminarily positioned at an appropriate position.
[0052]
In the operation (step D), the pushing portions 31a, 32a, 41a, 42a are stopped, the drive motors 31f, 41f are driven reversely, and the pushing portions 31a, 32a, 41a, 42a move backward. Then, the deformation of the end surface of the substrate W such as bending or bending is restored and the substrate W can be pushed again by the pushing portions 31a, 32a, 41a, and 42a, and the substrate W is preliminarily positioned at an appropriate position.
[0053]
Further, when the deformation of the end face of the substrate W is not restored in the operation of the (D process), the substrate discharge mechanism 6 performs the preliminary positioning mechanism 10 in the operation of the (F process). Discharged outside.
[0054]
Next, a third embodiment of the present invention will be described. As shown in FIG. 8, the preliminary positioning mechanism 40 includes a delivery mechanism unit 51 for arranging the mounting plate 5 on the feed roller 2a, instead of the mounting plate lifting mechanism unit 9 of the preliminary positioning mechanism 10. The preliminary positioning mechanism includes a feed roller lifting mechanism 2g (FIG. 10) for supporting the substrate W on the placement plate 5. In addition, about the same member as the above-mentioned structure, the same code | symbol is attached | subjected and description is abbreviate | omitted.
[0055]
As shown in FIG. 9, the delivery mechanism 51 includes a delivery arm 51 c connected to the end surface of the placement plate 5, and the delivery arm 51 c for raising the placement plate 5 from the feed roller 2 a in the vertical direction. The rotary shaft 51b and a drive motor 51a that rotates the rotary shaft 51b are configured. By the delivery mechanism 51, the substrate W fixed on the placement plate 5 by vacuum suction of the opening 5c is delivered to the next stage (alignment stage or the like).
[0056]
The feed roller elevating mechanism 2g is not particularly limited as long as it has a function of raising and lowering the feed roller 2a. For example, as shown in FIG. 10, the drive motor 2e fixed to the support frame 2f by the cylinder mechanism is lowered. The upper end of the feed roller 2a is not in contact with the substrate W, and the substrate W is supported on the mounting plate 5. The feed screw mechanism, rack and pinion, etc. are used instead of the cylinder mechanism. Thus, the drive motor 2e may be moved up and down to move the feed roller 2a up and down.
[0057]
The preliminary positioning method of the preliminary positioning mechanism 40 is as follows.
(First Step) As shown in FIG. 8 (a), the mounting plate 5 is closed on the feed roller 2a via the delivery mechanism 51, and from the through hole 5a (not shown) of the mounting plate 5. When the substrate W is received on the feed roller 2a protruding from the upper end, the feed roller 2a rotates, moves the substrate W to a predetermined position, and stops.
[0058]
(Step B) As shown in FIG. 8B, the feed roller 2a is lowered by the cylinder mechanism of the feed roller lifting mechanism 2g (FIG. 10), and the upper end of the feed roller 2a is not in contact with the substrate W. The substrate W is supported on the mounting plate 5. Pushing parts 31a, 32a, 41a, 42a by vertical drive parts 31i, 32i, 41i, 42i (41i, 42i not shown) of the moving mechanism parts 31, 32, 41, 42 (41, 42 not shown). (41a and 42a are not shown) protrude from the upper end of the feed roller 2a, and by driving of drive motors 31f and 41f (41f not shown), the pushing portions 31a, 32a, 41a and 42a (41a and 42a are shown) (Not shown) moves along a through-hole 5b (not shown) of the mounting plate 5 and pushes the end face of the substrate W to perform preliminary positioning.
[0059]
(Step C) When the substrate detection sensors 31h, 32h, 41h, and 42h sense the substrate W and are determined to be normal, the drive motors 31f and 41f stop and the pushing portions 31a, 32a, 41a, and 42a Is stopped, the substrate W is vacuum-sucked through the opening 5c of the mounting plate 5, the substrate W is fixed on the mounting plate 5, and the substrate W is moved to the next stage (alignment stage or the like) by the delivery mechanism unit 51. ).
[0060]
(Second Step) When the substrate detection sensors 31h, 32h, 41h, and 42h cannot detect the substrate W and are determined to be abnormal, that is, when the substrate W having a deformed end surface as shown in FIG. 4 is generated. The pushing portions 31a, 32a, 41a, 42a (32a, 41a, 42a are not shown) are stopped, and the drive motors 31f, 41f (not shown) are driven in reverse to push the pushing portion 31a. , 32a, 41a, 42a (32a, 41a, 42a not shown) move backward. And the instruction | indication which redoes preliminary positioning by the pushing parts 31a, 32a, 41a, 42a is output to the movement mechanism parts 31, 32, 41, 42 again.
[0061]
(Step E) If the substrate W is detected in the preliminary positioning again (step C), and if the substrate W is not detected, an instruction to discharge the substrate W out of the preliminary positioning mechanism 40 is given. Output to the discharge mechanism section 6.
[0062]
(Step F) As shown in FIG. 8C, the handler 20 of the substrate discharge mechanism unit 6 descends to the vicinity of the feed roller 2a, the suction pad 21 comes into contact with the substrate W, and the substrate W is vacuum-sucked. . In this state, the handler 20 is raised, so that the substrate W is transferred from the feed roller 2a to the handler 20. With the handler 20 holding the substrate W, the handler 20 moves in the horizontal direction along the guide frame and discharges the substrate W out of the preliminary positioning mechanism 40.
[0063]
The substrate W is supported and held on the mounting plate 5 by the above-described operation (b), so that the end surface of the substrate W is less likely to warp, and the pushing portions 31a, 32a, 41a, and 42a are pushed. The end face of the substrate W is hardly deformed, and the substrate W is preliminarily positioned at an appropriate position.
[0064]
In the operation of the above (the above-mentioned two steps), the pushing portions 31a, 32a, 41a, 42a are stopped, the drive motors 31f, 41f are driven reversely, and the pushing portions 31a, 32a, 41a, 42a move backward Then, the deformation of the end surface of the substrate W such as bending or bending is restored and the substrate W can be pushed again by the pushing portions 31a, 32a, 41a, and 42a, and the substrate W is preliminarily positioned at an appropriate position.
[0065]
Further, when the deformation of the end face of the substrate W is not restored in the operation (the second step), the substrate discharge mechanism 6 performs the preliminary positioning mechanism 40 in the operation (the step F). Discharged outside.
[0066]
【The invention's effect】
As described above, in the present invention, the substrate detection sensor is disposed at the position of the periphery of the substrate pushed by the pushing portion or the support housing side that supports the pushing portion of the moving mechanism portion. Even if the end face is warped, it is possible to perform proper preliminary positioning, and it is possible to provide a preliminary positioning mechanism that does not transport a poorly positioned substrate to the next stage.
[0067]
Further, in the present invention, since the mounting plate elevating mechanism unit or the feed roller elevating mechanism unit for supporting the substrate on the mounting plate is provided, the end surface of the substrate is less likely to be warped, and more appropriate. Preliminary positioning is possible.
[0068]
In addition, when the substrate guided to a predetermined position is preliminarily positioned by the pushing of the pushing portion of the moving mechanism portion, the substrate detection arranged at the position that becomes the periphery of the substrate pushed by the pushing portion. If the sensor sensing is not normal, stop the pushing of the pusher and move it backward and then perform pre-positioning by pushing again, or if the substrate detection sensor sense does not become normal, eject the board Since the substrate is discharged by the mechanism portion, it is possible to provide an appropriate preliminary positioning even if the end face of the substrate is warped, and to provide a preliminary positioning method that does not transport a poorly positioned substrate to the next stage.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing a preliminary positioning operation according to a first embodiment of the present invention.
FIG. 2 is a perspective view of a moving mechanism unit of the present invention.
FIG. 3 is a plan view of a moving mechanism unit of the present invention.
FIG. 4 is a schematic view showing a state of an end face of the substrate of the present invention.
FIG. 5 is a plan view of a mounting plate according to a second embodiment of the present invention.
FIG. 6 is a schematic diagram showing a preliminary positioning operation according to a second embodiment of the present invention.
FIG. 7 is a cross-sectional view of a mounting plate lifting mechanism according to a second embodiment of the present invention.
FIG. 8 is a schematic diagram showing a preliminary positioning operation according to a third embodiment of the present invention.
FIG. 9 is a plan view of a mounting plate according to a third embodiment of the present invention.
FIG. 10 is a partial cross-sectional view showing a feed roller lifting mechanism according to a third embodiment of the present invention.
[Explanation of symbols]
1, 10, 40 Preliminary positioning mechanism
2a Feed roller
2b Rotating shaft
2c endless belt
2d pulley
2e Drive motor
2f Support frame
2g Feed roller lifting mechanism
30 Installation board
31, 32, 41, 42 Moving mechanism
31a, 32a, 41a, 42a Pushing part
31b, 32b, 41b, 42b support housing
31c, 32c, 41c, 42c Guide
31d, 32d, 41d, 42d
31e, 41e Drive belt
31f, 41f Drive motor
31g, 32g, 41g, 42g Elastic member
31h, 32h, 41h, 42h Substrate detection sensor
31i, 32i, 41i, 42i Vertical drive unit
31j, 32j, 41j, 42j Base
5 Mounting plate
5a Through hole
5b Through long hole
5c opening
51 Delivery mechanism
51a Drive motor
51b Rotating shaft
51c Delivery arm
6 Substrate ejection mechanism
7 Support legs
8 Buffer part
9 Mounting plate lifting mechanism
9A Drive unit

Claims (4)

矩形薄板状の基板を所定位置に導き入れる送りローラと、
この送りローラの所定位置に支持された前記基板の四辺の近傍に配置され、前記基板の端面を押動する押動部を有する移動機構部と、
前記押動部で押動した前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサと、
この基板検出センサで感知できなかった前記基板を前記送りローラ上から排出するための基板排出機構部とを備えることを特徴とする予備位置決め機構。
A feed roller for guiding a rectangular thin plate-like substrate into a predetermined position;
A moving mechanism portion that is disposed in the vicinity of the four sides of the substrate supported at a predetermined position of the feed roller and has a pushing portion that pushes the end face of the substrate;
A substrate detection sensor that is arranged at a position facing the periphery of the substrate pushed by the pushing unit and detects deformation of the end face of the substrate by the presence or absence of sensing ;
A preliminary positioning mechanism, comprising: a substrate discharge mechanism for discharging the substrate that could not be detected by the substrate detection sensor from above the feed roller.
矩形薄板状の基板を所定位置に導き入れる送りローラと、
この送りローラで所定位置に配置された前記基板の四辺の近傍に配置され、前記送りローラ間を移動して前記基板の端面を押動する押動部を有する移動機構部と、
前記送りローラの上端が突出する貫通穴を有すると共に、前記押動部が移動する貫通長穴を有する前記基板の載置板と、
この載置板に載置された基板に対して前記押動部が押動する前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサと、
前記送りローラまたは前記載置板の少なくとも一方を昇降させるための昇降機構部と、
前記基板検出センサで感知できなかった前記基板を前記載置板上から排出するための基板排出機構部とを備えることを特徴とする予備位置決め機構。
A feed roller for guiding a rectangular thin plate-like substrate into a predetermined position;
A moving mechanism unit that is disposed in the vicinity of the four sides of the substrate disposed at a predetermined position by the feed roller, and has a pushing unit that moves between the feed rollers and pushes the end surface of the substrate;
The substrate mounting plate having a through hole from which the upper end of the feed roller protrudes, and a through long hole through which the pushing portion moves,
A substrate detection sensor that is disposed at a position facing a peripheral edge of the substrate on which the pushing portion is pushed with respect to the substrate placed on the placement plate and detects the deformation of the end surface of the substrate based on the presence or absence of sensing ;
An elevating mechanism for elevating and lowering at least one of the feed roller or the mounting plate;
A preliminary positioning mechanism, comprising: a substrate discharge mechanism section for discharging the substrate that could not be detected by the substrate detection sensor from the mounting plate.
前記基板検出センサが、前記移動機構部の押動部を支持する支持躯体側に配置されたことを特徴とする請求項1または2に記載の予備位置決め機構。  The preliminary positioning mechanism according to claim 1, wherein the substrate detection sensor is arranged on a support housing side that supports a pushing portion of the moving mechanism portion. 矩形薄板状の基板の端面を、前記基板の四辺の近傍に配置された移動機構部の押動部で押動することにより、前記基板を予備位置決めする方法において、
前記押動部で押動する前記基板の周縁に対向する位置に配置され前記基板の端面の変形を感知の有無によって検出する基板検出センサにより前記基板の端面を感知しながら、前記基板の端面を前記押動部で押動して、前記基板検出センサの感知が正常にならないときは、前記押動部の押動を停止し、退行移動させる第1工程と、再度、前記基板の端面を前記押動部で押動して、前記基板検出センサの感知が正常なときには前記押動部の押動による予備位置決めを行い、前記基板検出センサの感知が正常にならないときには基板排出機構部により前記基板を排出する第2工程とを備えることを特徴とする予備位置決め方法。
In the method of pre-positioning the substrate by pushing the end face of the rectangular thin plate-like substrate with the pushing portion of the moving mechanism portion arranged in the vicinity of the four sides of the substrate,
The end surface of the substrate is detected while detecting the end surface of the substrate by a substrate detection sensor that is disposed at a position opposite to the peripheral edge of the substrate that is pushed by the pushing portion and detects deformation of the end surface of the substrate based on the presence or absence of sensing. When the substrate detecting sensor is not normally sensed by pushing the pushing portion, the first step of stopping and pushing backward the pushing portion, and again, the end face of the substrate is moved to the end face. When the detection of the substrate detection sensor is normal by pushing by the pressing unit, preliminary positioning is performed by the pressing of the pressing unit, and when the detection of the substrate detection sensor is not normal, the substrate discharge mechanism unit performs the positioning. And a second step of discharging the pre-positioning method.
JP2002028976A 2002-02-06 2002-02-06 Pre-positioning mechanism and method Expired - Fee Related JP4249930B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002028976A JP4249930B2 (en) 2002-02-06 2002-02-06 Pre-positioning mechanism and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002028976A JP4249930B2 (en) 2002-02-06 2002-02-06 Pre-positioning mechanism and method

Publications (2)

Publication Number Publication Date
JP2003226424A JP2003226424A (en) 2003-08-12
JP4249930B2 true JP4249930B2 (en) 2009-04-08

Family

ID=27749961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002028976A Expired - Fee Related JP4249930B2 (en) 2002-02-06 2002-02-06 Pre-positioning mechanism and method

Country Status (1)

Country Link
JP (1) JP4249930B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4754885B2 (en) * 2004-11-30 2011-08-24 株式会社ダイヘン Substrate transfer device
JP4980761B2 (en) * 2007-03-23 2012-07-18 リンテック株式会社 Conveying apparatus and conveying method
KR100924266B1 (en) 2008-01-18 2009-10-30 주식회사 에스에프에이 Apparatus for transferring substrate

Also Published As

Publication number Publication date
JP2003226424A (en) 2003-08-12

Similar Documents

Publication Publication Date Title
KR100957615B1 (en) Work receiving device
US5848868A (en) Wafer conveying apparatus
KR100839503B1 (en) Inline Buffer Apparatus
JP4835573B2 (en) Substrate transport apparatus and substrate transport method
CN212711629U (en) Automatic feeding and discharging device for testing machine
CN111584391A (en) Substrate processing apparatus and substrate processing method
KR101162348B1 (en) Transport system
JP4249930B2 (en) Pre-positioning mechanism and method
JP2015228452A (en) Detector, detection method, substrate transfer device and substrate processing device
JP2003229470A (en) Preliminary positioning mechanism and method therefor
JP2000124690A (en) Substrate-setting equipment for mounting apparatus and switching of backup pin
JPS61142039A (en) Substrate positioning apparatus
KR100699544B1 (en) Strip processing system for semiconductor device
KR101784487B1 (en) Apparatus of aligning substrate supporter and substrate processing system comprising the same, and method of aligning substrate supporter
CN209939861U (en) PCB board self-cleaning and check out test set
CN109592407B (en) PCB board self-cleaning and check out test set
JP2862956B2 (en) Substrate transfer device
JP2021192405A (en) Substrate detection device, substrate detection method, and substrate processing unit
KR20010081967A (en) Substrate centering apparatus
JP2714300B2 (en) Printed circuit board support device
CN114878579B (en) Double-sided detection equipment and detection method for fragile hollowed-out etched part
JP2005086035A (en) Component mounter, method and program for discharging printed circuit board
JP2002261144A (en) Method and device for delivering substrate
CN114833082B (en) Height difference gap measuring equipment and measuring method thereof
US6322313B1 (en) Apparatus and method for inserting a wafer, substrate or other article into a process module

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041213

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080513

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080710

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090106

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090116

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120123

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4249930

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120123

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120123

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120123

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130123

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130123

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140123

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees