JP4240207B2 - Board inspection equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention ensures that the probe itself and the substrate to be inspected are damaged by the excessive contact pressure of the probe when a necessary electrical inspection is performed on the substrate to be inspected placed in the apparatus main body using the probe. This is a technique related to a substrate inspection apparatus that can be prevented.
[0002]
[Prior art]
There are two types of board inspection devices: one-sided inspection type that can only perform electrical inspection of one surface of the substrate to be inspected, and double-sided inspection type that can perform electrical inspection on both surfaces simultaneously. There is.
[0003]
In this case, for the double-sided inspection type substrate inspection apparatus, normally, when the probe is raised from below and brought into contact with the substrate to be inspected, the substrate to be inspected is prevented from being pushed up by excessive contact pressure. A rise restricting means is attached (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-344539 (paragraph numbers “0002” to “0005”, FIG. 16)
[0005]
FIG. 4 is an explanatory view showing an example of the rise restricting means employed in the conventional apparatus including Patent Document 1. As shown in FIG. 4A, the substrate inspection apparatus 111 is a substrate to be inspected. A substrate mounting portion 113 that supports P from the lower surface peripheral portion side and a substrate mounting portion 113 placed on the substrate mounting portion 113 by pushing down the substrate P to be inspected from the upper surface peripheral portion side. a plurality of probes 125 to the substrate fixing mechanism 112 of the substrate pressing portion 114., come in contact with the cushioning on the lower surface P ₁ side of the substrate to be inspected P whose position is fixed to a fixed position on the lower surface P ₁ one side inspection mechanism is capable of providing the contact with the lift, which is controlled by installing a elevation regulating section 126 for position regulating the height of contact probes 125 on the base portion 124 of the lifting platform 123 to a side 122 And at least comprising the whole There. Incidentally, the upper surface P ₂ of the inspected substrate P is to be able to test over the other-side inspection mechanism (not shown) moves to X-Y axis direction and the Z-axis direction are separately arranged with a freely probe ing.
[0006]
Of these, the substrate placement portion 113 of the substrate fixing mechanism 112 is substantially square to allow underpin its lower periphery side while being exposed to the lower surface P ₁ side is a surface to be inspected area of the inspected substrate P It is formed in a frame shape.
[0007]
The substrate pressing portion 114, while being exposed to the upper surface P ₂ side to be inspected surface area of the substrate to be inspected P placed on the substrate platform 113, via a suitable lifting means It is formed in a substantially rectangular frame shape so that it can be pressed down from the upper surface peripheral edge side and fixed to the substrate mounting portion 113.
[0008]
Therefore, when inspecting the inspected substrate P, first, the inspected substrate P is positioned and placed at a predetermined position on the substrate placing portion 113, and then the substrate pressing portion 114 is lowered to be inspected. By being pressed against the inspection substrate P, the position is fixed to the substrate fixing mechanism 112 side.
[0009]
Thereafter, the side of the one side inspection mechanism 122, the probe 125 is in contact with the lower surface P ₁ side further increased also, the upper surface is inspected substrate of the elevation regulating portion 126 as shown in FIG. 4 (b) when it came to abut on the lower surface P ₁ of P, automatically stopping the rise.
[0010]
Thus, the inspection substrate P, by its lower surface P ₁ side one side inspecting mechanism 122, the other-side inspection mechanism top P ₂ side is not shown, so that the respective electrical test is performed.
[0011]
[Problems to be solved by the invention]
However, in the case of the substrate inspection apparatus 111 shown in FIG. 4, if the initial height position on the side of the one-side inspection mechanism 122 is inappropriate, even if the lifting platform 123 comes into contact with the substrate platform 113, it does not stop. Therefore, as a result of applying an excessive pressure in the push-up direction to the substrate fixing mechanism 112 side, the substrate P to be inspected also warps as shown in FIG. Even if an attempt is contacted with a probe that such under conditions not shown on the upper surface P ₂ side of the substrate to be inspected P other-side inspection mechanism is provided, it is impossible to contact the probe to its periphery neighboring region In addition to this, the probe is brought into contact with the central region, resulting in inconvenience that the reliability of the measurement result is impaired and the probe provided in the other side inspection mechanism is damaged.
[0012]
Furthermore, when the setting of the initial height position on the side of the one-side inspection mechanism 122 is inappropriate, the one-side inspection mechanism 122 itself or the side of the other inspection mechanism (not shown) may be damaged, There is also a problem that workability is hindered by taking time for adjustment work to avoid this.
[0013]
In view of the above-mentioned problems seen in the conventional example, the present invention is a height position on the side of the one-side inspection mechanism in relation to the substrate fixing mechanism that fixes the position of the substrate to be inspected when performing electrical inspection. Provides a circuit board inspection device that can reliably prevent damage to the probe and the device itself, as well as increase the efficiency of measurement work and ensure the reliability of measurement results. The purpose is to do.
[0014]
[Means for Solving the Problems]
The present invention has been made to achieve the above-described object, and includes a substrate placement portion for placing a substrate to be inspected via a peripheral portion on the lower surface thereof, and the inspection subject placed on the substrate placement portion. A substrate fixing mechanism for generating a relative pressure contact force between the substrate upper surface peripheral portion of the substrate and the substrate abutting portion to fix the position of the substrate to be inspected; the arranged capable of elevating platform of the lift control with a plurality of probes that come in contact with the cushioning least a first side inspection mechanism comprising, between the lifting table and the substrate platform, said When the probe reaches a position where it comes into contact with the lower surface at a predetermined contact pressure, each has an opposing contact surface that makes surface contact with each other, and energization that is closed when these opposing contact surfaces make surface contact with each other characterized in that so as to stop the previous SL lifting platform in its closed during through circuit That.
[0015]
In this case, an energization circuit composed of a conductive portion with an insulating portion interposed in part is formed on one of the facing contact surfaces, and the other facing contact surface is positioned on both sides of the insulating portion. It is possible to form a conducting portion that closes the energization circuit by short-circuiting the conducting portions to each other at the time of contact. Each of the opposed contact surfaces is formed to have a substantially square planar shape, and the energization circuit of one opposed peripheral surface is formed by interposing the insulating portion separately from each corner portion, The conducting portions of the opposing abutting surfaces can be formed so as to be able to close the energization circuit by having an arrangement relationship corresponding to each of the insulating portions. Further, the energization circuit is formed by enabling the electrode portion provided on one of the opposing contact surfaces and the electrode portion provided at the corresponding position of the other opposing contact surface to be closed when they are in contact with each other. You may do.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic explanatory view showing an example of a substrate inspection apparatus according to the present invention, in which (a) shows a state at the time of non-inspection, and (b) shows a state at the time of inspection.
[0017]
That is, the substrate inspection apparatus 11 includes a substrate platform 13 on which the substrate P to be inspected is placed via the peripheral edge of the lower surface, and an upper surface periphery of the substrate P to be inspected placed on the substrate platform 13. Between the substrate abutting portion 14 and the substrate abutting portion 14 that generates a relative pressure contact force to fix the position of the substrate P to be inspected, and the lower surface P ₁ side of the position-fixed substrate P to be inspected. its entirety at least a plurality of probes 35 and having lifting platform 3 3 provided capable of elevating control to become one side inspecting mechanism 32 to come in contact with the cushioning is configured. Incidentally, the upper surface P ₂ of the inspection substrate P, the foregoing as in the conventional apparatus, the other-side inspection mechanism (not shown) moves to X-Y axis direction and the Z-axis direction are separately arranged with a freely probe It can be inspected through.
[0018]
This will be described in more detail with reference to the illustrated example. The substrate fixing mechanism 12 has a substrate mounting portion 13 that supports the substrate P to be inspected from the periphery of the lower surface thereof, and a substrate mounting portion 13 mounted on the substrate mounting portion 13. The substrate abutting portion 14 that pushes down the inspected substrate P from the periphery of the upper surface thereof via an appropriate lifting means (not shown) to generate a pressure contact force with the substrate mounting portion 13 to fix the position. And is formed. The substrate fixing mechanism 12 may raise the substrate mounting portion 13 side and generate a pressure contact force with the substrate contact portion 14 to fix the position of the substrate to be inspected.
[0019]
Among these, the substrate mounting portion 13 extends in a bowl shape in the horizontal direction from the surrounding frame body portion 15 disposed so as to surround the substrate P to be inspected, and the inner peripheral surface 16 side of the surrounding frame body portion 15. The abutment portion 23 is formed. In this case, the abutment portion 23, places the underside periphery side while being exposed to the lower surface P ₁ side is a surface to be inspected area of the inspected substrate P from the opening 24 which is partitioned and formed on its inner side It is intended to be, and is disposed so as the upper surface P ₂ when obtained by placing the inspected substrate P becomes the top surface 17 substantially flush with the surrounding frame body portion 15.
[0020]
Also, the substrate contact portion 14, with respect to the upper surface P ₂ side to be inspected surface area of the substrate to be inspected P placed on the substrate platform 13 side, need other-side inspection mechanism (not shown) located above The planar shape is formed by providing a substantially rectangular opening 25 so that a simple inspection can be performed.
[0021]
On the other hand, substrate-side inspection mechanism 32 disposed below the fixing mechanism 12 is located fixed plurality of probes capable arranged for simultaneous contact of the contact pins 35a to the lower surface P ₁ side of the substrate to be inspected P 35, after installing the elevation regulating portion 36 for position regulation the contact height of the probe 35 in contact with the lower surface P ₁ side on the base portion 34 of the lifting platform 33, which is attached to the elevation frame 33 side It is arranged so that its lifting can be controlled via appropriate lifting means such as a motor or an air cylinder. The probe 35 is formed by a probe main body portion 35b and a contact pin 35a that is held by the probe main body portion 35b so as to be able to advance and retreat. The contact pin 35a is a coil spring built in the probe main body portion 35b. A cushioning property is imparted through an elastic member (not shown).
[0022]
Moreover, the substrate platform 13 and the elevation frame 33, when the contact pins 35a of the probe 25 is brought into contact with the lower surface P ₁ under a state of being position restriction in the elevation regulating unit 3 6, mutually surrounding frame Opposing contact surfaces 42 and 52 that are in surface contact with each other are provided separately.
[0023]
FIG. 2 is an explanatory diagram showing the arrangement relationship of the opposing contact surface 42 of the substrate mounting portion 13 located on the upper side on one side from the bottom surface side, and the opposing contact of the substrate mounting portion 13 in this example. The surface 42 is formed to have a substantially square planar shape along the surface direction of the bottom surface 18 of the surrounding frame main body 15.
[0024]
In this case, the opposing abutment surface 42 on the substrate mounting portion 13 side is provided with insulating portions 45 made of rubber plate material or the like at a total of four corner portions 44, and each of these insulating portions. 45, the conductive portion 47 made of a copper plate material having substantially the same thickness as the insulating portion 45 is provided in the entire region except the non-conductive portion 46 provided to secure the + electrode portion 48 and the − electrode portion 49. An energization circuit 43 is formed by being disposed.
[0025]
On the other hand, FIG. 3 is an explanatory diagram showing the arrangement relationship of the opposing contact surfaces 52 of the lifting platform 33 located on the lower side on the other side, from the upper surface side. In this example, the opposing contact surface 52 provided along the surface direction of the top surface 37 of the lifting platform 33 is substantially in a positional relationship facing the opposing contact surface 42 on the substrate mounting portion 13 side. It is formed to have a square planar shape.
[0026]
In this case, the opposing abutment surface 52 on the lifting platform 33 side is provided with conductive portions 54 made of copper plate materials having substantially the same thickness at each of the four corner portions 53, and between the conductive portions 54. Is provided with an insulating portion 56 made of a rubber plate or the like having substantially the same thickness as the conducting portion 54. In addition, each conductive portion 54 is formed with a surface area larger than the surface area of the insulating portion 45 of the opposing abutment surface 42 on the substrate mounting portion 13 side. When the contact is made, the energization circuit 43 can be closed by short-circuiting the conductive portions 47 and 47 adjacent to the insulating portion 45. When the energization circuit 43 is closed, the current supplied from the positive electrode portion 48 side is adjacent to each other through the non-conductive portion 46 through the conductive portion 47 and the conductive portion 54. -Since it flows to the electrode part 49 side, by taking this as a control signal, the I / O port and relay circuit of the control part (not shown) can be turned on to stop the raising of the lifting platform 33.
[0027]
Next, the operation of the present invention will be described. The substrate P to be inspected has a lower peripheral edge on the abutment portion 23 of the substrate mounting portion 13 in a state where the substrate contact portion 14 side is raised. by placing the parts can be arranged in a state where the lower surface P ₁ side of the inspection region was exposed from the opening 24 as shown in FIG. 1 (a).
[0028]
After the substrate P to be inspected is placed on the substrate platform 13 in this way, the substrate contact portion 14 is lowered to the substrate platform 13 side, and the lower surface side is surrounded by the frame in the substrate platform 13. The main body 15 is brought into close contact with the top surface 17. At this time, the upper surface P ₂ of the inspection substrate P, since the position where the top surface 17 substantially flush with the surrounding frame body portion 15, the substrate to be inspected P also board contact portion 14 and the substrate platform 13 The position of the upper surface P2 as a region to be inspected is fixed in a state where the upper surface P2 is exposed from the opening 25 due to the pressure contact force generated between the _two .
[0029]
After the substrate P to be inspected is fixed to the substrate fixing mechanism 12 in this manner, the elevating platform 33 is lifted so that the lower surface P ₁ side of the substrate P to be inspected exposed from the opening 24 is obtained. The contact pin 35a of the probe 35 can be brought into contact with.
[0030]
Contact pins 35a in contact with the lower surface P ₁ side, since cushioned by the elastic member which had been incorporated in the probe body portion 35b for holding this is granted, the elevation frame 33 maintains its contact state as it rises while regression to the probe body portion 35 side, eventually rise regulating portion 36 reaches the contact on the lower surface P ₁ side of the test board P as shown in FIG. 1 (b).
[0031]
When this rise regulating portion 36 abuts on the lower surface P ₁ side of the substrate to be inspected P is opposed abutment surface 52 of the elevation frame 33 is provided on its top surface 37 is also the surrounding frame in the substrate mounting part 13 in surface contact with contact the opposed abutment surface 42 provided on the bottom surface 18 of the body portion 15.
[0032]
In this case, since the opposing contact surface 52 on the lifting platform 33 side is provided with conductive portions 54 at each of the four corner portions 53 as shown in FIG. 3, these conductive portions 54 are mounted on the substrate. When surface contact is made with the respective insulating portions 45 provided on the opposing contact surface 42 on the side of the mounting portion 13, the conductive portions 54 corresponding to the respective conductive portions 47, 47 adjacent to the insulating portions 45 are simultaneously in surface contact.
[0033]
At this time, in the energization circuit 43 provided in the opposing contact surface 42 on the substrate mounting portion 13 side, the conductive portions 47 and 47 sandwiching the insulating portion 45 are short-circuited through the conductive portion 54, respectively. Closed. Therefore, the current fed from the + electrode portion 48 flows through the energizing circuit 43 through the conductive portion 47 and the conductive portion 54 and reaches the −electrode portion 49 side, and this is not shown as a control signal. By operating the I / O port and the relay circuit of the control unit, it is possible to automatically stop the lifting of the lifting platform 33.
[0034]
Therefore, even if the initial height position on the side of the one-side inspection mechanism 32 and the contact pressure of the probe 35 (pushing amount with cushioning properties) are inappropriate, the probe 35 is pressed with excessive contact pressure. It is possible to prevent the occurrence of problems such as warping the inspected substrate P as in the conventional example shown in FIG.
[0035]
Therefore, with respect to the upper surface P ₂ side of the substrate to be inspected P, it will be able to evenly contacted each probe provided in the other-side inspection mechanism (not shown) located above under proper contact pressure, In addition to ensuring the efficiency of measurement work and ensuring the reliability of measurement results, it is possible to reliably prevent damage to the probe and the device itself.
[0036]
The present invention has been described with reference to the illustrated example, and the specific embodiment thereof is not limited to this. For example, since it is provided a facing abutment surface 42, 52 in surface contact with contact to each other, as the case may be omitted arrangement of the elevation regulating unit 36. Further, as long as the opposing contact surfaces 42 and 52 have an arrangement relationship facing each other, the specific planar shape can be appropriately adopted as desired. Further, the conductive portion 54 provided on the facing contact surface 52 of the lifting / lowering platform 33 can be thickened accordingly if the stroke amount of the contact pin 35a of the probe 35 is large, and accordingly if the stroke amount is small. The thickness can also be reduced.
[0037]
In addition, the energization circuit is disposed so as to be closed when the electrode portion provided on one opposing contact surface and the electrode portion provided at a corresponding position on the other opposing contact surface contact each other. You can also
[0038]
Further, the other side inspection mechanism (not shown) may have a structure similar to that of the one side inspection mechanism 32 and may include a movable probe called a so-called flying probe. Furthermore, the board inspection apparatus 11 can also arrange the board fixing mechanism 12 and the one-side inspection mechanism 32 upside down as necessary.
[0039]
【The invention's effect】
As described above, according to the present invention, the probe included in the raised one-side inspection mechanism is brought into contact with the ascending restriction portion on the lower surface side of the substrate to be inspected that is fixed to the substrate fixing mechanism side. , since it is possible to surely energized by the elevation frame of the opposing abutment surface on the opposing abutment surface of the substrate mounting portion by surface contact to close the current supply circuit, one be it control signals The raising of the side inspection mechanism can be automatically stopped.
[0040]
Therefore, even if the initial height position on the side of the one-side inspection mechanism or the contact pressure of the probe is inappropriate, the occurrence of problems such as deforming the substrate to be inspected by pressing the probe with an excessive contact pressure will occur. Can be prevented.
[0041]
For this reason, each probe provided in the other side inspection mechanism located above can be contacted evenly with an appropriate contact pressure to the upper surface side of the substrate to be inspected, which improves the efficiency of measurement work. As well as ensuring the reliability of the measurement results, it is possible to reliably prevent damage to the probe and the device itself.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view showing an example of a substrate inspection apparatus according to the present invention, in which (a) shows a state during non-inspection, and (b) shows a state during inspection.
FIG. 2 is an explanatory view showing the arrangement relationship of opposing contact surfaces of a substrate mounting portion constituting a substrate fixing mechanism in FIG. 1 from the bottom surface side.
FIG. 3 is an explanatory view showing the arrangement relationship of the opposing contact surfaces of the lifting platform constituting the one-side inspection mechanism in FIG. 1 from the upper surface side.
FIGS. 4A and 4B are schematic explanatory views showing a conventional example of a substrate inspection apparatus, in which FIG. 4A shows a non-inspection state, and FIG. 4B shows an inspection execution state.
FIG. 5 is an explanatory diagram showing an example of a state when a substrate to be inspected is probed with an inappropriate contact pressure using the substrate inspection apparatus shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Board | substrate inspection apparatus 12 Board | substrate fixing mechanism 13 Board | substrate mounting part 14 Board | substrate contact part 15 Enclosure main-body part 16 Inner peripheral surface 17 Top surface 18 Bottom surface 23 Abutment part 24,25 Opening part 32 One side inspection mechanism 33 Lifting board 34 Base part 35 Probe 35a Contact pin 35b Probe main body part 36 Lift restricting part 37 Top face 42 Opposing contact face 43 Energizing circuit 44 Corner part 45 Insulating part 46 Non-conducting part 47 Conductive part 48 + Electrode part 49-Electrode part 52 Opposing Contact surface 53 Corner portion 54 Conductive portion 56 Insulating portion P Substrate to be inspected P ₁ lower surface P ₂ upper surface

Claims (4)

Between the substrate mounting portion for mounting the substrate to be inspected through the lower surface peripheral portion thereof, and the substrate contact portion that contacts the upper surface peripheral portion of the substrate to be inspected placed on the substrate mounting portion. A substrate fixing mechanism that generates a relative pressure contact force to fix the position of the substrate to be inspected;
With position fixed the a plurality of one-side inspection mechanism the elevation frame of the lifting controllably formed by arranged with a probe that come in contact with the cushioning on the lower surface side of the substrate to be inspected at least,
The substrate platform and the lifting platform each have a separate abutment surface that is in surface contact with each other when the probe reaches a position that contacts the lower surface with a predetermined contact pressure,
Substrate inspection device thereof facing abutment surfaces each other, characterized in that so as to stop the previous SL lifting platform in its closed during through the energizing circuit which is closed upon surface contact. On one of the opposing contact surfaces, an energization circuit including a conductive part with an insulating part interposed therebetween is formed, and on the other opposing contact surface, the conductive material located on both sides of the insulating part is formed. The board inspection apparatus according to claim 1, wherein a conductive portion that closes the energization circuit is formed by short-circuiting each other at the time of surface contact . Each of the opposed contact surfaces is formed to have a substantially square planar shape, and the energization circuit of one opposed peripheral surface is formed by interposing the insulating portion separately from each corner portion, and facing the other The board inspection apparatus according to claim 1, wherein the conductive portion of the contact surface is arranged to correspond to each of the insulating portions so that the energization circuit can be closed. The energization circuit is formed by enabling the closing when the electrode portion provided on one of the opposing contact surfaces and the electrode portion provided at the corresponding position of the other opposing contact surface contact each other. Item 4. The substrate inspection apparatus according to Item 1.

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