JP4234725B2 - Mounting condition determining method, mounting condition determining apparatus, component mounting method, component mounter, and program - Google Patents

Description

  The present invention relates to a mounting condition determination method for determining a mounting condition in equipment for producing a component mounting board.

  In recent years, manufacturers of component mounting boards, particularly large manufacturers, produce a wide variety of component mounting boards. Such a manufacturer has production facilities (hereinafter simply referred to as “equipment”) such as various types of component mounting machines suitable for mounting these components, depending on the types of components mounted on the board. A plurality of types of component mounting boards are produced by a plurality of production lines (hereinafter simply referred to as “lines”) having different equipment configurations.

  Here, among the plurality of facilities, there are many facilities having common attributes such as the same model and the same parts mounted on the board.

  In such a case, there are many mounting conditions that should be unified to the optimal one by nature because of the same model and the same parts in multiple facilities with common attributes. To do.

  Mounting conditions are information for identifying components such as nozzles used to mount components on the board, information for controlling the operation and position of each component, etc., and specific values for each facility. It is information that can improve the production status in equipment such as a component mounter by setting or changing to the above.

  Examples of such mounting conditions include a camera for optically recognizing information about the component such as the moving speed of the component, the nozzle to be used, the component size, and the suction state of the component when the component is mounted on the board. There are a position, a light for illuminating the component, a light amount of the light, and each of the numerical control (NC) data including information indicating the position of the mounting point of the component on the board, and combinations thereof.

  By unifying the mounting conditions of each facility to the optimum one, the productivity of each facility is improved, and the productivity of the entire production system including these facilities is also improved.

  Therefore, a technique for unifying these mounting conditions with a plurality of facilities is also disclosed (for example, see Patent Document 1).

  According to this technique, in a production system including a plurality of lines having the same equipment configuration, there is an analyzer that analyzes the production status of each line. This analysis apparatus can feed back information for improving the problem as a result of the analysis to each line.

For example, when a component mounting error occurs in a certain line at a prescribed rate or more, the analysis apparatus analyzes the cause and can reflect the mounting conditions for improvement in each line.
Japanese Patent No. 3461915

  However, the above-described conventional technique is a technique for realizing a system that collects necessary data and feeds back to each line when a problem occurs in a certain line by an analysis apparatus positioned at a higher position on the control system.

  Therefore, for one facility on a certain line, after a problem occurs in the own facility or another facility, a mounting condition for improving the problem is obtained. That is, the above conventional technique is a technique for improving the mounting conditions triggered by the occurrence of a problem.

  Therefore, for example, in one facility that constitutes a line, since the mounting conditions for demonstrating the original performance are not set, the productivity can be improved even in a state where the original productivity is not expressed. It will wait for the mounting conditions to be obtained from the analyzer.

  Therefore, in order to improve the above conditions at an early stage, even if a problem such as a minor error occurs in each equipment, let the analyzer analyze the cause and feed back the mounting conditions for improving the problem to each equipment. It is possible to make it.

  However, in this case, the analysis apparatus increases the processing load for analyzing errors and generating mounting conditions. Moreover, in each facility, it is necessary to frequently perform a change process to the mounting condition transmitted from the analyzer. For this reason, productivity in each facility may be lowered, which is not realistic.

  In view of the above-described conventional problems, an object of the present invention is to provide a mounting condition determination method for efficiently improving the productivity of each facility in a production system including a plurality of facilities.

In order to achieve the above object, the mounting condition determination method of the present invention includes a mounting condition set in at least one of a plurality of facilities for producing a component mounting board under the set mounting condition. A mounting condition determination method for determining, wherein the equipment is acquired in the acquisition step, and the acquisition step acquires the mounting conditions in other equipment voluntarily without receiving an instruction to acquire the mounting conditions from outside the equipment. the implementation conditions, see contains a setting step of setting said equipment, the mounting condition is information for identifying the components including nozzles used to mount components on a substrate, or operating the components Contains control information .

  Thus, according to the mounting condition determining method of the present invention, the equipment for producing the component mounting board can acquire the mounting conditions of other equipment without depending on the instruction from the outside. In addition, the component can be mounted on the board under the acquired mounting conditions.

  As a result, it is possible to voluntarily acquire mounting conditions that can improve the productivity of the own equipment, and it is possible to efficiently improve the productivity.

  In addition, the mounting condition determination method of the present invention is further shown in a collection step of collecting performance information indicating results related to production work from the equipment and the other equipment, and in the performance information collected in the collection step. A comparison step for comparing the results in the other equipment with the results related to the production work in the equipment, and in the acquisition step, as a result of the comparison in the comparison step, the results of the other equipment are higher. In this case, the facility may acquire a mounting condition related to the production work in the other facility.

  Thereby, a certain installation can acquire and set a better mounting condition from another installation.

  Further, as a result of the comparison in the comparison step, when a result related to the production work in the equipment is higher, a notification step of notifying the other equipment of a mounting condition related to the production work in the equipment is included. Also good.

  Thereby, a better mounting condition is set also in the other equipment subjected to the comparison. That is, productivity can be improved for the other facilities.

  In the collecting step, the performance information is collected from the plurality of facilities, in the comparing step, the plurality of facilities are compared, and in the obtaining step, as a result of comparison in the comparing step, the facilities in the facility are compared. The mounting conditions related to the production work may be acquired from the other equipment that is higher than the results related to the production work and is the highest among the plurality of equipments.

  As a result, a certain facility can acquire and set the best mounting condition among a plurality of facilities. That is, it is possible to acquire mounting conditions that can improve productivity most and mount components on a board under the mounting conditions.

  Further, the facility and the other facility communicate with a mounting condition determining device, the collecting step and the comparing step are executed in the mounting condition determining device, and the obtaining step is the mounting condition determining The apparatus may include a first acquisition step for acquiring a mounting condition related to the production work in the other facility, and a second acquisition step for the facility to acquire the mounting condition from the mounting condition determination device.

  As a result, each facility can improve the productivity of its own equipment from the mounting condition determination device that performs these comparisons, etc., without collecting work performance information and comparing the work results of its own equipment with other equipment. Implementation conditions can be acquired and set.

Further, the mounting condition determining apparatus of the present invention is a mounting condition determining apparatus for determining a mounting condition in equipment for producing a component mounting board under a set mounting condition, wherein the mounting condition determining apparatus An acquisition unit that is provided in the facility, communicates with the other facility, and acquires the mounting condition in the other facility spontaneously without receiving an instruction to acquire the mounting condition from outside the facility, and the acquisition unit Setting means for setting the acquired mounting condition in the facility, and the mounting condition is information for specifying a component including a nozzle used for mounting a component on a board, or operates the component Control information to be included .

  Thereby, the installation provided with this mounting condition determination apparatus can acquire the mounting conditions which can improve the productivity of an own installation spontaneously from another installation. That is, productivity can be improved efficiently.

  The mounting condition determining apparatus of the present invention is a mounting condition determining apparatus that determines a mounting condition set in at least one of a plurality of facilities for producing a component mounting board under the set mounting conditions. The mounting condition determining apparatus communicates with the equipment and other equipment, obtains the obtaining means for obtaining the mounting conditions in the other equipment from the other equipment, and the mounting conditions transmitted from the equipment. Request receiving means for receiving the request, and condition transmitting means for transmitting the mounting condition acquired by the acquiring means to the equipment as a response to the request for the mounting condition received by the request receiving means. Also good.

  That is, the mounting condition determining apparatus of the present invention may exist independently from each facility. Thereby, each facility does not need to have a function of collecting work result information from other facilities. In addition, it is not necessary to communicate with each of the other facilities, and it is possible to acquire a mounting condition that can improve the productivity of the own facility only by requesting the mounting condition determining apparatus. That is, productivity can be improved efficiently.

  As described above, the mounting condition determination method of the present invention can efficiently optimize the mounting conditions for the equipment for producing the component mounting board. That is, productivity can be improved efficiently.

  Furthermore, the present invention is realized as a program including characteristic steps in the mounting condition determining method of the present invention, realized as a storage medium such as a CD-ROM storing the program, or realized as an integrated circuit. You can also. The program can also be distributed via a transmission medium such as a communication network.

  The present invention can provide a mounting condition determination method for efficiently improving the productivity of each facility in a production system including a plurality of facilities.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic diagram illustrating an outline of a hardware configuration of a production system according to the first embodiment.

  As shown in FIG. 1, the production system 1 in Embodiment 1 is composed of four lines, and each line has a facility configuration corresponding to the type of component on the component mounting board to be produced by that line.

  In the present embodiment, each of the plurality of facilities constituting these lines is a component mounter, and each component mounter can exchange information via a local area network (LAN) 5.

  In the figure, symbols such as “M123-1” attached to each component mounter are individual codes that are a type of identification information for identifying the component mounter. One component mounter is specified from the plurality of component mounters by the individual code. In addition, for example, simply “M123-1” indicates a component mounter to which the individual code is attached.

  The individual code is a code composed of “model code—equipment number”, which means that the component mounters having the same model code are the same model.

  Further, in the LAN 5, each component mounting machine can transmit the information with the individual code as the destination, so that the information can reach the component mounting machine with the individual code as the destination. As such a technique, for example, Domain Name System (DNS) in Transmission Control Protocol / Internet Protocol (TCP / IP) is adopted.

  The functional configuration of each component mounter will be described later with reference to FIG. 3, taking the component mounter 10 with the individual code “M123-1” as an example.

  The plurality of component mounters shown in FIG. 1 can be grouped regardless of which line they are on, depending on the type of each model, the components mounted on the board, the attributes of the manufacturer, and the like.

  FIG. 2 is a diagram showing an example of grouping of component mounters constituting the production system in the first embodiment.

  As shown in FIG. 2, the component mounters belonging to the production system 1 are divided into groups classified by manufacturers (hereinafter referred to as “manufacturer groups”), which are broadly classified. The component mounters in each manufacturer group are classified into groups classified by category (hereinafter referred to as “category groups”) according to their models. That is, each model is divided into a plurality of categories.

  Specifically, each model can be divided into a plurality of categories according to the similarity of models, the respective mounting modes, and the like. In the present embodiment, each model is divided into each category group according to each mounting mode, for example, a modular machine or a rotary machine.

  In addition, the component mounters in the category group are divided into machine type groups (hereinafter referred to as “model groups”) which are sub-classifications, and each component mounter belongs to one of the model groups.

  Thus, each group is associated with attributes such as the model and category of the component mounter.

  A symbol such as “AAA” in the figure is a code for identifying each group. For example, “AAA” is a manufacturer code for identifying the A company group, and “G-AM” is a category code for identifying the M group.

  As described above, the component mounters in the production system 1 are grouped according to the attributes of the respective manufacturers and models, and the component mounters in one group have their device configurations and components mounted on the board. It has common attributes such as suitability.

  In other words, the component mounters in each group have a common attribute in the group, so that a common mounting condition can be set.

  For example, component mounters belonging to a certain model group have substantially the same device configuration, performance, and properties due to the same model.

  Therefore, for example, one component mounter belonging to a certain model group can utilize mounting conditions such as a nozzle used in another component mounter in the group and a moving speed of components.

  Therefore, if an optimum mounting condition is found in the group, the productivity of each component mounting machine can be improved by giving the mounting condition to all the component mounting machines in the group.

  FIG. 3 is a functional block diagram showing a functional configuration of the component mounter in the first embodiment. In addition, illustration and description of components such as a camera for optically recognizing information on a power supply unit and components originally provided in the component mounter are omitted, and components and components for explaining the features of the present invention are illustrated and described. I do. The same applies to the other drawings.

  A component mounter 10 shown in FIG. 3 is a component mounter represented by “M123-1” in FIGS. 1 and 2.

  As shown in FIG. 3, the component mounter 10 includes a mounting condition determination device 11. The mounting condition determining device 11 is a device for determining mounting conditions to be set in the component mounting machine 10.

  The mounting condition determined by the mounting condition determining device 11 is notified to the setting unit 20 provided in the component mounter 10 and is set in the mechanism control unit 22 by the setting unit 20. The mechanism control unit 22 controls the mechanism unit 23 in accordance with the set mounting conditions. In addition, the mounting conditions are stored in the condition storage unit 21.

  The condition storage unit 21 is a storage device that stores mounting conditions. In the present embodiment, nozzles, component dimensions, NC data, and the like used when mounting components on a substrate are stored as mounting conditions. Further, when the mounting condition is notified from the mounting condition determining device 11 to the setting unit 20, the setting condition is rewritten to the notified mounting condition.

  The mechanism unit 23 includes devices such as a mounting head 23a for picking up components and mounting components on a board, and an XY robot 23b for moving the mounting head in the X-axis direction and the Y-axis direction orthogonal to each other. As shown in the figure, the X-axis direction is a direction parallel to the transport direction of the substrate 23e, and the Y-axis direction is a direction perpendicular to the X-axis direction and parallel to the plate surface of the substrate 23e.

  The mounting head 23a can adsorb components from the component supply unit 23c while moving in the X-axis direction and the Y-axis direction by the XY robot 23b, and can mount the adsorbed components on the substrate 23e conveyed by the conveyor 23d.

  Note that the mounting means in the component mounter of the present invention is realized by components other than the mounting condition determining device 11 in the component mounter 10, such as the mechanism unit 23.

  The error detection unit 24 is a processing unit that detects errors in production work performed by the component mounter 10 and generates work result information.

  The production work refers to various work in the production of the component mounting board. In addition to the substantive work for mounting the part on the board, the work for checking the substantive work, for example, the part is a nozzle. It also includes the work of confirming whether it is adsorbed correctly.

  The work result information is information indicating a result related to a production work performed by the component mounter, and for example, a component adsorption rate is generated as the work result information. The suction rate is a value indicating the rate at which the nozzle has succeeded in sucking the component. For example, in the operation of sucking 100 components, the error detection unit 24 detects a failure in sucking one component. The adsorption rate is 99%.

  As work performance information, in addition to the suction rate, the mounting rate, which is the rate at which the suctioned component was successfully mounted on the board, the mounting accuracy indicating the accuracy of mounting the component on the board after mounting the component, and the component suction There is a recognition error rate that represents a rate at which a camera that optically recognizes information about a component such as a state has failed to recognize.

  In addition, there are information such that the higher the value, such as the adsorption rate and the mounting rate, and the information that the result is higher when the value is lower, such as the recognition error rate.

  The work result information is generated by the error detection unit 24 for each component to be mounted and each component such as a nozzle. Further, the work result information generated by the error detection unit 24 is stored in the result information storage unit 25.

  Here, the other component mounters belonging to the M123 group to which M123-1 belongs are the same model as the M123-1, and have the same functional configuration as the functional configuration shown in FIG. Further, regarding the component mounting machines of other groups, there are differences in the devices constituting the mechanism unit 23, etc., but as a functional configuration, the mounting condition determining device 11, the setting unit 20, the condition storage unit 21, It is the same in that the mechanism control unit 22, the mechanism unit 23, the error detection unit 24, and the result information storage unit 25 are provided.

  Accordingly, other component mounters including the mounting condition determining device 11 can perform various production operations under the mounting conditions notified from the mounting condition determining device 11, as with the component mounter 10.

  As illustrated in FIG. 3, the mounting condition determination device 11 includes a communication unit 12, an identification unit 13, a group storage unit 14, a collection unit 15, a determination unit 16, and an acquisition unit 17.

  The communication unit 12 is an example of a setting unit in the mounting condition determining device of the present invention, and exchanges information with other component mounting machines and components other than the mounting condition determining device 11 of the own equipment. It is a processing part. The “own equipment” refers to equipment provided with the mounting condition determining device 11. For example, in this description, the component mounting machine 10 (M123-1) shown in FIG.

  The identification unit 13 is a processing unit that identifies an in-group facility that is a facility such as a component mounter belonging to a predetermined group based on identification information for identifying each component mounter. In the present embodiment, the predetermined group is a group to which the own equipment belongs. The result identified by the identification unit 13 is stored in the group storage unit 14. Information stored in the group storage unit 14 will be described later with reference to FIG.

  The collection unit 15 is a processing unit that collects work performance information from the in-group equipment identified by the identification unit 13. In the present embodiment, work result information is collected from component mounters belonging to the same group as the own equipment, including the own equipment.

  The type of work result information collected by the collection unit 15 from the equipment in the group is selected depending on which group to which the own equipment belongs is a target for collecting work result information.

  Here, a case where arbitrary four types of components A to D are mounted on a substrate is assumed. In addition, these four types of components A to D are components that are commonly mounted in the group equipment of the M123 group.

  In this case, the equipment in each group belonging to the M123 group has the same model, and the mechanism and functional configuration for mounting components on the board are the same. Therefore, the mounting conditions related to the suction rate and mounting rate for the components A to D can be utilized in common. Therefore, when the M123 group is a target of collection of work performance information, the suction rate and the mounting rate for the parts A to D are collected.

  The determination unit 16 is an example of a comparison unit in the mounting condition determination apparatus of the present invention, and can compare results such as suction rates for a plurality of component mounting machines. In addition, by this comparison, it is possible to determine not only which of the two grades is higher, but also the highest grade among a plurality of grades.

  In the present embodiment, the determination unit 16 is a processing unit that determines a specific facility that is a facility whose performance related to the production work satisfies a predetermined standard, and the work results collected from each component mounter by the collection unit 15. Determine specific equipment based on information.

  The predetermined standard may be a standard that is at least a result higher than the result of the own equipment, but in the present embodiment, work result information indicating the highest result from a plurality of equipment in the group is provided. The transmitted in-group equipment is determined as the specific equipment. In other words, the best component mounter in a certain type of production work is determined as a specific facility within the group.

  The acquisition unit 17 is a processing unit that acquires a mounting condition related to the production work from the specific equipment determined by the determination unit 16. This association will be described later with reference to FIG.

  The mounting condition acquired by the acquiring unit 17 is notified to the setting unit 20 of the own equipment by the communication unit 12, and the mechanism control unit 22 controls the mechanism unit 23 according to the mounting condition as described above.

  In addition, the communication part 12 can acquire the work performance information and mounting conditions of own equipment via the setting part 20, and notifies other component mounting machines or the own equipment collection part 15 and acquisition part 17 Can do.

  As described above, the mounting condition determining apparatus 11 according to the present embodiment determines the equipment having the highest production performance as the specific equipment, and acquires the mounting conditions from the specific equipment. In other words, by determining the specific equipment, it is possible to determine the optimal mounting condition, and it is possible to set the optimal mounting condition in the component mounting machine.

  FIG. 4 is a flowchart showing an outline of an operation related to setting of mounting conditions of the component mounter 10 according to the present invention.

  As shown in FIG. 4, the component mounter 10 acquires mounting conditions for other equipment spontaneously, that is, without receiving an instruction to acquire mounting conditions from outside the component mounter 10 (S <b> 1). Furthermore, the acquired mounting conditions are set in the component mounting machine 10 that is itself (S2).

  In this way, the component mounter 10 voluntarily acquires the mounting conditions of other component mounters without receiving an instruction from an operator or other equipment. As a result, the mounting conditions can be optimized efficiently, and the productivity can be improved efficiently.

  Hereinafter, a specific operation of the component mounter 10 according to the first embodiment will be described with reference to FIGS.

  FIG. 5 is a flowchart showing an outline of an operation flow related to setting of mounting conditions performed by the component mounter 10 according to the first embodiment.

  With reference to FIG. 5, an outline of an operation related to setting of mounting conditions performed by each component mounter including the component mounter 10 of the production system 1 will be described. Details of the operation will be described later with reference to the flowcharts of FIGS.

  First, the identification unit 13 identifies in-group equipment belonging to a predetermined group from among a plurality of component mounters in the production system 1 (S11). Specifically, based on identification information transmitted from each component mounter, a component mounter belonging to the same group as its own equipment is identified.

  The determination unit 16 determines specific equipment that is a component mounter whose results related to the production work satisfy a predetermined standard (S12). Specifically, based on the work result information collected by the collection unit 15, the component mounter having the highest grade is determined as the above-mentioned specific equipment.

  The acquisition unit 17 acquires the mounting conditions from the specific equipment determined by the determination unit 16 (S13). For example, the mounting condition related to the suction rate of the component A is acquired from the specific equipment having the highest suction rate of the component A.

  The mounting condition acquired by the acquiring unit 17 is notified to the setting unit 20 by the communication unit 12, and the setting condition is set by the setting unit 20 (S14).

  When each component mounter performs the above-described operation, each component mounter can find and further obtain an optimal mounting condition within the group according to the attribute of the own equipment. Each component mounting machine mounts a component on a substrate under the acquired mounting conditions, thereby improving the component adsorption rate, the component mounting rate, and the like, thereby improving productivity.

  Here, the identification information that the identification unit 13 refers to when identifying the equipment in the group (S15) is specifically an individual code or the like, and is collected by requesting other component mounting machines via the LAN 5. .

  In this embodiment, a signal including identification information such as an individual code is referred to as an enemy ally signal. Upon receiving a request for an enemy ally signal, each component mounter transmits an enemy ally signal as a response to the request. To do.

  FIG. 6 is a diagram illustrating an outline of a data configuration of an enemy ally signal according to the first embodiment.

  As shown in FIG. 6, the enemy friend signal includes a manufacturer code, a category code, and an individual code.

  Moreover, the enemy friend signal shown in FIG. 6 is an example of the enemy friend signal transmitted from the component mounting machine M123-2 to another component mounting machine. As shown in FIG. 6, in this enemy and friend signal, the manufacturer code “AAA” of the company A that manufactured M123-2 and the category code “G−” of the M group to which the category group to which M123-2 belongs are included. AM ”and the individual code“ M123-2 ”are included.

  The individual code is composed of the model code and the equipment number as described above, and the model code is information indicating the model. That is, the component mounter including “M123” in the individual code means that the model is “M123”. The equipment number is a unique number within the same model.

  When M123-1 receives the enemy friendly signal shown in FIG. 6, it can be identified from the manufacturer code and category code that M123-2 is a component mounter belonging to the same manufacturer group and category group as the own equipment ( (See FIG. 2). Further, it can be identified from the model code included in the individual code that it belongs to the same model group as the own equipment.

  FIG. 7 is a diagram schematically illustrating a request and reception of a friendly friend signal performed by the component mounter 10 according to the first embodiment. The component mounting machine 10, M123-1, transmits a request for an enemy ally signal to all the component mounting machines such as M123-2 in the production system 1, thereby receiving the enemy ally signal from all the component mounting machines. be able to. Similarly, the other component mounters can receive enemy friendly signals from all the component mounters.

  When each component mounter receives a request for an enemy ally signal, the communication unit 12 transmits an enemy ally signal including a model code of its own equipment as a response to the request. Information such as the model code of the own equipment may be held by the communication unit 12, and may be held by a component unit of the component mounting machine 10 other than the mounting condition determining device 11, for example, the condition storage unit 21. May be. When a configuration unit other than the mounting condition determination device 11 holds information such as a model code, the communication unit 12 may receive the information from the configuration unit, generate an enemy friend signal, and transmit it as a response to the request.

  FIG. 8 is a flowchart showing a flow of operations when the component mounter 10 in the first embodiment identifies other component mounters. That is, it is a flowchart illustrating in detail the operation (S11) for identifying the in-group equipment belonging to the same group as the own equipment, shown in the flowchart of FIG.

  With reference to FIG. 8, the flow of operations when identifying other component mounters performed by each component mounter of the production system 1 including the component mounter 10 will be described.

  A request for an enemy ally signal is broadcast to all the component mounters connected to the LAN 5 from the communication unit 12 of each component mounter (S21). The communication unit 12 receives an enemy ally signal transmitted in response to the request (S22).

  The identification unit 13 reads the individual code indicating the component mounting machine that is the transmission source of the enemy ally signal from the enemy ally signal received by the communication unit 12. Furthermore, from the model code and category code included in the individual code, whether the component mounter that is the transmission source of the individual code is (1) equipment belonging to the same model group as the own equipment, or (2) Whether the equipment belongs to the same category group is identified (S23).

  Based on the result of the identification, the identification unit 13 records a table that records a solid code of a component mounting machine that belongs to the same model group as the own equipment, and a table that records a solid code of a component mounting machine that belongs to the same category group as the own equipment. Is created (S24). Each created table is stored in the group storage unit 14.

  Each component mounter in the production system 1 can identify whether or not all other component mounters belong to the same group as its own equipment by the above series of operations.

  In addition, there may be a case where there is a component mounting machine that does not have a function of transmitting and receiving an enemy friend signal. For example, when only the component mounting machine of company A has a function of transmitting and receiving an enemy friend signal, only the component mounting machine belonging to the company A group can be the target and subject of the above-described identification and the like. . That is, only the component mounters belonging to the A company group are unified to the optimum mounting conditions.

  In addition, for example, even if the component mounting machine of Company A and the component mounting machine of Company B both have a function of transmitting and receiving an enemy friendly signal, each component mounting machine can receive a signal from another manufacturer's component mounting machine. It is not necessary to meet the requirements for work performance information and mounting conditions.

  That is, in equipment such as a component mounter, for example, when the mounting conditions relate to the know-how unique to the manufacturer of the equipment, it is not necessary to provide information to equipment of other manufacturers. Even in such a case, the mounting conditions of each facility belonging to each manufacturer group are unified to the optimal mounting conditions in each manufacturer group, and productivity is improved.

  FIG. 9 is a diagram illustrating an example of a group table stored in the group storage unit 14 included in the component mounter 10 according to the first embodiment.

  The “M123 group table” shown in FIG. 9 is a table in which the individual code of the component mounter whose model code is “M123” is recorded. That is, it is a table for specifying a component mounter belonging to the same model group as the own equipment.

  The “M group table” is a table in which individual codes of component mounters having a category code “G-AM” are recorded. That is, it is a table that identifies a component mounter that belongs to the same category group as its own equipment.

  The collection unit 15 of M123-1, which is the component mounter 10, refers to these group tables, so that other component mounters belonging to the M group, which is the same category group as the own equipment, and the same model group as the own equipment Work result information can be collected from other component mounters belonging to the M123 group.

  FIG. 10 is a flowchart showing an operation flow when the component mounter 10 according to the first embodiment acquires a mounting condition from a specific facility and sets the mounting condition in the own facility. That is, it is a flowchart illustrating in detail from the operation for determining a specific facility (S12) to the setting of mounting conditions (S14) shown in the flowchart of FIG.

  With reference to FIG. 10, a flow of operations related to acquisition of mounting conditions and setting of the mounting conditions performed by each component mounting machine of the production system 1 including the component mounting machine 10 will be described.

  In each component mounting machine, the production of the component mounting board is started by a predetermined instruction, for example, an instruction from the operator (S31). After the start of production, the error detection unit 24 totals work results in the own equipment based on the detected error type and the like (S32). The work result information generated by the aggregation is stored in the result information storage unit 25.

  The collection unit 15 collects work result information from the facilities in the group including those of the own facility (S33). Specifically, in the case of M123-1, with reference to at least one of the M123 group table and the M group table stored in the group storage unit 14, the individual code recorded in the group table to be referenced is the destination, Send a request for work performance information.

  Which group table is referred to may be, for example, in accordance with an explicit instruction from the operator, or may be changed each time it is referred to.

  Further, as described above, the type of work result information to be collected is selected according to the group to be collected.

  The request for work performance information includes information specifying the type of work performance information to be transmitted. For example, information specifying “suction rate for part A” is included. The equipment in the group that has received this request transmits, for example, information “adsorption rate for component A: 98%” to the requesting component mounter as a response to the request.

  By such a request and response, work performance information of the equipment in the group including the own equipment is collected. Examples of the collected work result information include a suction rate, a mounting rate, a recognition error rate, and a mounting accuracy for each part.

  FIG. 11 is a diagram illustrating an example of work performance information collected by the collection unit 15. FIG. 11 shows an example of work result information held in the determination unit 16 as a result of the above collection by the collection unit 15 of M123-1.

  As shown in FIG. 11, work result information such as the suction rate for the component A is collected from each component mounter belonging to the same model group as the M123-1, and which component mounter has the highest grade is shown. Judgment can be made. In the example of the drawing, M123-3 is “99%” in the suction rate for the part A, which is the highest grade.

  Similarly, other work performance information about other parts, such as the mounting rate for part A and the suction rate for part B, is also collected, and the component mounting with the highest grade recorded for each by the decision unit 16 The machine is determined as the specific equipment (S34).

  FIG. 12 is a diagram illustrating an example of the specific equipment group determined by the determination unit 16.

  As shown in FIG. 12, specific equipment for each part is determined for each type of work result information such as a suction rate and a mounting rate.

  For example, in the adsorption rate for the component A, M123-3 is a specific facility, and in the adsorption rate for the component B, M123-1 is a specific facility. Further, in the mounting rate for the component A, M123-3 is a specific facility, and in the mounting rate for the component B, M123-2 is a specific facility.

  The determination of the specific equipment is also performed by other component mounters such as M123-2. For example, the determination unit 16 of each component mounter belonging to the M123 group determines the same as the determination result of the specific equipment shown in FIG. The result will be obtained.

  The acquisition unit 17 acquires the mounting conditions from the specific equipment determined in this way (S35). Specifically, the mounting condition transmitted from the specific equipment is acquired as a response to the request for the mounting condition. Further, what information is acquired as the mounting condition will be described later with reference to FIGS. 13 and 14.

  The mounting condition acquired by the acquisition unit 17 is notified to the setting unit 20 by the communication unit 12, and is set in the mechanism control unit 22 by the setting unit 20 (S36). The mounting conditions are stored in the condition storage unit 21. The mechanism unit 23 mounts components on the board under the mounting conditions set in the mechanism control unit 22.

  Thereafter, while the production is continuing (No in S37), the above operation is repeated, and when the production is terminated by an operator's instruction or the like (Yes in S37), the series of processes related to the setting of the mounting conditions is also terminated.

  Note that the collection of work performance information from the equipment in the group (S33) to the setting of mounting conditions (S36) are performed spontaneously at a predetermined timing. For example, it is performed every predetermined period. The information about the predetermined timing is information set by the administrator of the production system 1, for example, and is held in the collection unit 15.

  The collection unit 15 has an internal clock or timer, and starts collecting work performance information at the timing indicated by this information. Also, triggered by the fact that the work result information is collected by the collection unit 15 (S33), the mounting condition is set (S36) thereafter.

  In addition, when the own equipment is at the highest level for certain work performance information, it is not necessary to change the mounting conditions related to the work performance information, so the operation of acquiring (S35) and setting (S36) the mounting conditions is performed. Not performed.

  Here, for example, the adsorption rate for the part A is information indicating a result related to the production operation of adsorption of the part A as described above. The quality of such results depends on the mounting conditions under which the production work is performed.

  Therefore, for example, M123-1 obtains the mounting condition related to the suction of the component A from the M123-3 that has the best results for the suction rate of the component A, so that the suction rate of the component A in the M123-1 is obtained. It can be improved.

  That is, the type of work result information such as the suction rate and the mounting condition are associated with each other through what the content of the production work is.

  FIG. 13 is a diagram illustrating an example of the association between the type of work result information such as the suction rate and the mounting conditions.

  As shown in FIG. 13, for example, the mounting condition related to the suction rate is a set of three items of a nozzle, a suction operation pattern, and a suction correction value. Specifically, the nozzle number for specifying the nozzle, the pattern number for specifying the suction operation pattern, and the numerical values in the X-axis direction and the Y-axis direction (see FIG. 3) for correcting the suction position of the nozzle are specified equipment as the mounting conditions. Acquired and set by other component mounters.

  For example, when the M123-1 acquires and sets the mounting conditions including the above three items for the part A from the specific equipment M123-3, the adsorption rate of the part A in the M123-1 is improved. Other work performance information such as the mounting rate is also associated with the mounting conditions as shown in FIG.

  Such acquisition of mounting conditions from a specific facility is performed spontaneously at a predetermined timing as described above in each component mounter belonging to the same group as the specific facility. The adsorption rate and the like are improved, and as a result, productivity is improved.

  FIG. 14 is a diagram illustrating an example of mounting conditions acquired from a specific facility to each component mounter.

  In the example of FIG. 14, the mounting condition related to the suction rate of the component A is acquired by the other component mounting machine belonging to the M123 group from the specific facility M123-3.

  In the example of the mounting condition shown in FIG. 14, the nozzle is the nozzle number “2”, the suction operation pattern is the pattern number “3”, and the suction correction value is “(0.002, 0.001)” (the unit is mm). These numbers and values are set as mounting conditions in each component mounting machine.

  In addition, each component mounting machine includes a plurality of components such as a mounting condition related to the adsorption rate of the component B, a mounting condition related to the mounting rate of the component A, and a mounting condition related to the recognition error rate of the component C. Implementation conditions corresponding to the type of work performance information are acquired from each specific facility. In other words, the best mounting conditions are acquired and set.

  For example, when each specific facility is determined as shown in FIG. 12, the mounting condition related to the suction rate of the component A of M123-3 is set in another component mounting machine belonging to the M123 group. Further, the mounting condition related to the suction rate of the component B of M123-1 is set in another component mounting machine belonging to the M123 group.

  Similarly, with respect to the mounting rate and the recognition error rate, the mounting conditions corresponding to the highest grade are set for all the component mounting machines belonging to the M123 group.

  As described above, the component mounter 10 according to the present embodiment collects work performance information from component mounters belonging to the same group as its own facility, and determines the component mounter having the highest grade as the specific facility. Furthermore, the mounting conditions related to the work result information can be acquired from the specific equipment and set in the own equipment.

  In addition, the group of component mounters for which the collection of work performance information and the acquisition of the mounting conditions are divided according to attributes such as the model. That is, each component mounter belonging to a certain group has commonality such as device configuration. Therefore, each component mounting machine can set the mounting conditions acquired from the specific equipment determined within the group to which the equipment belongs to the equipment itself, and can improve the productivity of the equipment. .

  Further, other component mounting machines also include a mounting condition determining device 11 similar to the component mounting machine 10, and each component mounting machine can acquire and set the best mounting conditions in the group to which the own equipment belongs. it can. In other words, each component mounter can autonomously optimize the mounting conditions.

  As a result, all the component mounting machines that belong to the production system 1 are set with the mounting conditions that improve the productivity most in each group, and the entire production system 1 as well as the productivity of each component mounting machine. Productivity is improved.

  In the present embodiment, the processing contents when determining the mounting conditions, the configuration of the mounting condition determining apparatus 11, and the like are not limited to the above described contents. Therefore, a modification of the present embodiment will be described below.

(Modification 1 of Embodiment 1)
As a first modification of the first embodiment, a modification of the mounting condition determination method will be described.

  As shown in FIG. 13, both the suction rate and the mounting rate have nozzles as items of mounting conditions. Therefore, for example, for component A, the nozzle with the highest suction rate is the nozzle with nozzle number “2”, but the nozzle with the highest mounting rate is the nozzle with nozzle number “3”.

  As described above, when the mounting conditions corresponding to the highest grades conflict with each other, in the above example, the nozzle used for sucking and mounting the component A may be determined by majority vote. For example, in the group in the above situation, the suction rate of the component A is a predetermined rate, for example, 97% or more, and the nozzles used by the top five component mounters for the suction and mounting of the component A are checked. . Further, the mounting rate of the part A is similarly examined.

  Of the nozzles examined in this way, it may be determined which of the nozzle with the nozzle number “2” and the nozzle with the nozzle number “3” is used more frequently.

  As described above, when the majority decision is made, for example, the nozzle with the nozzle number “3” may be selected as the mounting condition instead of the nozzle with the nozzle number “2” having the highest suction rate for the component A. obtain. However, as described above, by adding the condition that the adsorption rate and the mounting rate are equal to or higher than a predetermined rate, a certain level of the adsorption rate and the mounting rate is secured.

  Also, a method other than majority vote may be used. For example, a determination method that prioritizes the suction rate for the nozzles may be used. Further, for example, the product of the suction rate and the mounting rate of the nozzle with the nozzle number “2” is compared with the product of the suction rate and the mounting rate of the nozzle with the nozzle number “3”, and the larger one is adopted. Good. Even in these cases, a certain level of the adsorption rate and the mounting rate can be ensured by providing a restriction of a predetermined rate or more for each of the adsorption rate and the mounting rate.

  Also, this predetermined rate may be set to a different value for each component mounter. For example, if a value exceeding the current adsorption rate of the component A in M123-1 is set as a predetermined rate in M123-1, the adsorption rate of the component A in M123-1 can be improved at least from the current value. it can.

  Therefore, for other component mounting machines, if a value corresponding to the work performance such as the current suction rate is set as a predetermined rate, productivity can be improved at least as compared with the current level.

(Modification 2 of Embodiment 1)
As a second modification of the first embodiment, a modification of the identification information acquisition method in the mounting condition determining apparatus 11 will be described.

  The mounting condition determination device 11 receives the identification information such as the individual code of each component mounting machine via the LAN 5. However, it may be obtained by other means. For example, when there is not much change of equipment or grouping in the production system 1, identification information such as individual codes transmitted by each component mounter with an enemy friendly signal is recorded on a recording medium such as a CD-ROM. The mounting condition determination device 11 may acquire the individual codes and the like by reading the recording medium such as the CD-ROM.

  Similarly, the work result information of each component mounting machine may be acquired by means other than collecting via the LAN 5. For example, once a day, work result information of each component mounting machine is collected and stored in a recording medium such as a CD-ROM, and the mounting condition determination device 11 reads out the CD-ROM or the like to determine specific equipment. Also good.

  By doing so, for example, the communication load on the LAN 5 can be reduced.

(Modification 3 of Embodiment 1)
As a third modification of the first embodiment, a case will be described in which the basic unit of the mounting condition acquired by each component mounter is other than a component.

  In the description of the present embodiment, the mounting conditions that each component mounter obtains and sets from other component mounters are assumed to acquire and set the mount conditions that improve the suction rate and the like for each component with the component as a basic unit. .

  However, units other than parts may be used as basic units. For example, using the nozzle as a basic unit, the recognition error rates are tabulated for each used nozzle in each component mounting machine. Furthermore, the recognition error rate for each nozzle in another component mounting machine is collected, and the component mounting machine having the lowest recognition error rate is determined as the specific equipment for each nozzle.

  Thereby, each component mounting machine can acquire the mounting condition which improves the recognition error rate for every nozzle from a specific installation, and can set it to an own installation, and can improve productivity as a result.

  For example, it is assumed that M123-1 uses the nozzle of nozzle number 1. In this case, M123-1 is the nozzle number as a mounting condition related to the recognition error rate from the component mounting device having the lowest recognition error rate among the other component mounting devices using the nozzle of nozzle number 1. The amount of light when using one nozzle is acquired.

  Thereby, the recognition error rate at the time of using the nozzle of the nozzle number 1 of M123-1 can be reduced.

  Similarly, for example, in a group of component mounters having a plurality of cameras, each component mounter may collect a recognition error rate for each camera and determine a specific facility. Thereby, for each camera to be used, it is possible to set mounting conditions such as the light quantity of light that minimizes the recognition error rate, thereby improving productivity.

(Modification 4 of Embodiment 1)
As a fourth modification of the first embodiment, a modification of the contents of the mounting conditions acquired by each component mounter will be described.

  In the present embodiment, the association between the type of work performance information and the mounting conditions is the combination shown in FIG. However, combinations other than those shown in FIG. For example, in the example illustrated in FIG. 13, the mounting condition related to the suction rate for a certain component is configured from information of three items, that is, a nozzle, a suction operation pattern, and a suction correction value. However, for example, when the success or failure of component adsorption depends mostly on the selection of the nozzle, the item of the mounting condition may be only “nozzle”. The same applies to other types of work performance information.

  That is, each component mounting machine only needs to acquire at least one type of information that can improve productivity as a mounting condition. Such information includes, as described above, the nozzle number and moving speed of the nozzle having the best component adsorption rate, NC data in the component mounting machine having the best mounting accuracy, and the like.

  Each component mounter obtains at least one type of information as such mounting information as a mounting condition, and sets or changes it to a specific value or the like indicated in the information, thereby producing work according to the mounting condition. It is possible to improve the efficiency.

(Modification 5 of Embodiment 1)
As a fifth modification of the first embodiment, a modification of the method for selecting the type of work result information collected by each component mounter will be described.

  In the present embodiment, the type of work result information collected by the collection unit 15 from the equipment in the group is selected depending on which group to which the own equipment belongs is a target for collecting work result information. However, conversely, a group to be collected may be selected according to the type of work result information collected by the collection unit 15.

  For example, it is assumed that the collection unit 15 collects a recognition error rate as work result information. In this case, devices related to the recognition error rate are a camera, a light, and the like. Therefore, a group of component mounters that share the same camera, light, etc. may be the target of collecting work performance information.

  In other words, either the selection of the type of work performance information to be collected or the selection of the group to be collected may be the main. In either case, the component mounter 10 according to the present embodiment can acquire a mounting condition that can improve the productivity of its own equipment from another component mounter.

(Modification 6 of Embodiment 1)
As a sixth modification of the first embodiment, a case will be described in which each component mounter uses one component mounter as a comparison target when acquiring mounting conditions.

  In the above description, the case where each component mounter belonging to the M123 group collects the suction rate from a plurality of other component mounters and determines a specific facility has been described. However, in order to improve the suction rate and the like in each component mounting machine, it is only necessary to collect work result information such as the suction rate from at least one other component mounting machine.

  For example, in the T121 group shown in FIG. 2, only the component mounters T121-1 and T121-2 belong. In this case, T121-1 collects, for example, the suction rate for the part A from T121-2, and compares it with the suction rate in its own equipment. As a result of the comparison, if the suction rate of T121-2 is higher, the mounting condition related to the suction rate of component A is acquired from T121-1, and set in the own equipment. Thereby, the adsorption | suction rate of the components A in T121-1 can be improved.

  Conversely, if the suction rate of T121-1 is higher, that is, if the result in the own equipment is higher, the mounting condition related to the suction rate of the component A of the own equipment is set to T121-. 2 may be given. Thereby, the adsorption | suction rate of the components A in T121-2 can be improved.

  In addition, in this way, the method for determining the mounting conditions to be set in the own equipment by comparison with one other equipment can be implemented even in a situation where communication with a plurality of equipment is possible. In this case, as a result The implementation condition corresponding to the highest grade in the group will be set in.

  FIG. 15 is a schematic diagram showing a state in which a method for determining and acquiring a mounting condition to be set in the own equipment by comparing with another equipment is performed on a plurality of component mounting machines.

  In FIG. 15, it is assumed that the suction rates for the parts A of M123-1, M123-2, and M123-3 increase in the order of M123-1, M123-2, and M123-3. Further, the mounting conditions related to the suction rate are assumed to be a mounting condition α, a mounting condition β, and a mounting condition γ.

  That is, the mounting condition γ of M123-3 is the mounting condition that maximizes the suction rate for the component A, which means that the suction rate for the component A decreases in the order of the mounting condition β and the mounting condition α.

  As shown in the upper part of FIG. 15, M123-1 compares the adsorption rate for the part A with M123-2. From this comparison, M123-1 acquires the mounting condition β from M123-2 and sets it in its own equipment because M123-2 has a higher suction rate.

  Thereby, the adsorption | suction rate about the component A of M123-1 is improved equivalent to M123-2.

  Thereafter, as shown in the lower part of FIG. 15, M123-1 compares the suction rate of the part A with M123-3. As a result of this comparison, M123-1 acquires the mounting condition γ from M123-3 and sets it in its own equipment because M123-3 has a higher suction rate.

  As a result, the mounting condition γ having the highest suction rate among the three mounting conditions is set in M123-1.

  As described above, when M123-1 sequentially performs the above method on other component mounting machines belonging to the M123 group, the M123-1 has a mounting condition corresponding to the highest grade in the M123 group. Will be set.

  Further, the other component mounters belonging to the M123 group perform the same operation as the M123-1, so that the mount conditions of all the component mounters belonging to the M123 group are unified to the optimum mount conditions.

(Modification 7 of Embodiment 1)
As a seventh modification of the first embodiment, a case where each component mounting machine gives mounting conditions to other component mounting machines will be described.

  In the present embodiment, each component mounter acquires a mounting condition from another component mounter. However, each component mounter may notify other component mounters of the mounting conditions that have caused the improvement of the production status in its own equipment. For example, after the mounting conditions related to the suction rate of the component A are changed by the operator or by the mounting conditions acquired from another component mounting machine, the determination unit 16 determines the suction rate and the results for the changed component A. The suction rate of the part A before change stored in the information storage unit 25 is compared. As a result of comparison, when the suction rate is improved after the change, the mounting condition after the change is read from the condition storage unit 21 and notified to the other component mounting machine, so that the mounting condition is changed to the other component. Set to the mounting machine.

  Even in such a method, it is possible to improve the suction rate for the component A of the other plurality of component mounting machines.

(Modification 8 of Embodiment 1)
As a modified example 8 of the first embodiment, a modified example other than the above modified examples of the configuration and functions of the production system 1 and the component mounting machine will be described.

  In the production system 1 shown in FIG. 1, the LAN 5 to which each component mounter is connected may be wired or wireless. Also, the communication protocol is not limited to the above-mentioned TCP / IP, and may be another protocol. Any component mounting machine may be used as long as it can transmit and receive an enemy ally signal, work result information, and mounting conditions.

  Moreover, in this Embodiment, the several installation for producing a component mounting board | substrate demonstrated as each component mounting machine. However, a plurality of component mounters may be connected and operated under common mounting conditions.

  In this case, each of a plurality of component mounters operating under common mounting conditions can identify other component mounters that are not included in the plurality of component mounters, or can be mounted from other component mounters. It is not necessary to acquire That is, a plurality of component mounters may be used as one facility to identify other component mounters and acquire mounting conditions. Moreover, what is necessary is just to set the acquired mounting conditions for each component mounting machine. In addition, component mounters other than a plurality of component mounters handled as one facility may transmit and receive information using the plurality of component mounters as one facility.

  Thus, the mounting condition determination method of the present invention is effective even when a plurality of component mounters are handled as one facility. The same applies to the case where facilities constituting one line are operated in common under the same mounting conditions. In this case, one line can be handled as one facility.

  In the description of the flowchart of FIG. 10, the component mounter 10 according to the present embodiment performs a series of operations from collection of work performance information from the equipment in the group (S33) to setting of mounting conditions (S36). It is assumed that it is performed every time a predetermined period has elapsed. However, other timings may be used. For example, the above-described series of operations may be performed only when the power is turned on.

  Further, for example, in order to distribute the communication load of the LAN 5, the component mounters may be adjusted by communicating with each other so that the above-described series of operations are shifted on the time axis for each component mounter or group. Good.

  Further, the above-described series of operations may be performed by detecting a change in the productivity of the own equipment, for example, detecting that the adsorption rate of the part A has fallen below a predetermined value.

  That is, the timing for performing the above series of operations is determined appropriately by the administrator of the production system 1 in consideration of the operating rate of each component mounting machine, a variation in productivity, and the like, and set in each component mounting machine. be able to. Thereby, each component mounting machine can acquire mounting conditions from other component mounting machines spontaneously according to each state etc.

  In FIG. 3, the component mounter 10 includes a mounting condition determining device 11 inside. However, the component mounter 10 may include a mounting condition determination device 11 outside. In other words, in the present embodiment, each component mounting machine only needs to be able to exchange information with one mounting condition determination device 11 dedicated to its own equipment, regardless of whether it is wired or wireless.

  Thereby, for example, even when the mounting condition determining apparatus 11 of the present embodiment is externally attached to an existing component mounter, the above-described autonomous optimization of the mounting conditions can be performed.

  Further, the group storage unit 14 of the mounting condition determination device 11 provided in the component mounter 10 stores an M123 group table that is a model group table and an M group table that is a category group table. In addition, the mounting condition determination device 11 refers to one of these two tables and collects work performance information.

  However, a group group table other than the model and category may be stored, and work result information may be collected by referring to the table.

  For example, in this embodiment, a manufacturer table that is a table for each manufacturer may be created and stored. Each component mounter having the same manufacturer may have commonality in terms of configuration or function, handling of NC data, and the like due to the same manufacturer. Therefore, it is possible to set the optimum mounting conditions for all the component mounting machines of the same manufacturer in accordance with the contents of the mounting conditions.

  This makes it possible to unify the mounting conditions for a larger number of component mounters. For example, the administrator of the production system 1 can easily manage the mounting conditions of each component mounter.

(Modification 9 of Embodiment 1)
As a ninth modification of the first embodiment, a case will be described in which the mounting condition determination device 11 does not identify other component mounters.

  In the present embodiment, the mounting condition determination device 11 included in the component mounter 10 identifies a component mounter that belongs to the same group as its own equipment.

  However, this identification need not be performed. For example, in the production system 1, when the component mounter 10 and the plurality of component mounters that can communicate with the component mounter 10 are all products of the same manufacturer, as described above, optimum mounting conditions for all the component mounters are set. It is also possible to set in common.

  Therefore, without identifying which group each equipment belongs to, it is possible to acquire the mounting conditions that can voluntarily improve the productivity from among the mounting conditions of a plurality of equipments, and set them in the own equipment. .

  Even when the manufacturers are different, the items that can be set as mounting conditions, their names, and the correspondence between the set mounting conditions and the operation of the mechanism are less than when the manufacturers are the same. However, there may be a case where the mounting conditions that can be set are common among the facilities.

  Furthermore, even if the items that can be set as mounting conditions and their names are different, if they have information to convert them, differences in these names that exist between manufacturers can be absorbed. it can.

  For example, in the production system 1, the component mounting machine of company A (hereinafter referred to as “mounting machine A”) handles the suction correction value internally by the code “VP”, and the component mounting machine of company B ( Hereinafter, in “mounting machine B”), it is assumed that the suction correction value is internally handled by the code “REP”.

  In this case, since the codes representing the suction correction value are different between the mounting machine A and the mounting machine B, when one of them acquires the suction correction value as the mounting condition from the other, it cannot be set correctly.

  Therefore, if conversion information such as “VP: REP” is stored in at least the component mounting machine that acquires the mounting condition, the suction correction value acquired as the mounting condition can be correctly recognized and set.

  Further, the conversion may be performed on the side that transmits the mounting conditions. For example, when the mounting machine B stores the conversion information and transmits a suction correction value as a mounting condition from the mounting machine B to the mounting machine A, the “VP” used as the code representing the suction correction value is “VP”. "To send.

  By doing so, the mounting machine A can correctly recognize and set the suction correction value acquired from the mounting machine B.

  Even if the data format of the mounting conditions, for example, the number of digits is different, differences between manufacturers can be absorbed using the information for conversion as described above and conversion formulas.

  In this way, even when facilities of different manufacturers are mixed in the production system, it is possible to make settings in common and there may be effective mounting conditions. Even in this case, the mounting condition determining apparatus 11 can improve the productivity from the mounting conditions of a plurality of facilities as described above without identifying which group each facility belongs to. Can be found and set in your own equipment.

  Further, even when the mounting condition determining apparatus 11 does not identify other equipment, it is only necessary to be able to communicate with at least one other equipment as in the case of identifying other equipment.

  Even in this case, the mounting condition of one equipment having the highest work result is set in the other equipment by comparing the two work results. That is, the productivity of at least one facility is improved. Furthermore, by repeatedly performing such a comparison between each facility and a plurality of other facilities, the best mounting conditions among these facilities are set for each facility.

(Embodiment 2)
In the first embodiment, each of the plurality of component mounters includes the mounting condition determining device 11 and autonomously optimizes the mounting conditions.

  However, each component mounter does not include the mounting condition determination device 11, but one mounting condition determination device 11 independent of each component mounter acquires the mounting condition from at least one component mounter, and each component mounter A form in which the mounting conditions are transmitted in response to a request from is also possible.

  In this case, one mounting condition determination device 11 is connected to the LAN 5 so as to be able to communicate with all the component mounting machines, and this mounting condition determination device 11 is connected to the component mounting machine identification for each group, the determination of specific equipment, Acquisition of mounting conditions, transmission of mounting conditions according to the request of each component mounting machine, etc. are performed. As a result, as in the first embodiment, it is possible to set an optimum mounting condition corresponding to the attribute of each component mounter in each component mounter. That is, the productivity of each component mounter can be improved.

  Thus, as a second embodiment, a production system including a plurality of component mounters and one mounting condition determination device will be described.

  FIG. 16 is a schematic diagram illustrating an overview of the hardware configuration of the production system according to the second embodiment.

  As shown in FIG. 16, the production system 2 according to the second embodiment is configured with four lines, similar to the production system 1 according to the first embodiment. The equipment configuration of each line is also the same, and each equipment is a component mounter of the same model as the plurality of component mounters shown in the first embodiment.

  However, unlike the first embodiment, each component mounting machine does not include the mounting condition determination device 11, and one mounting condition determination device 11 is connected to the LAN 5. Each component mounter can communicate with at least the mounting condition determination device 11 via the LAN 5.

  Each component mounter is grouped according to the attributes such as the model as in the first embodiment, and the group name of each group and the component mounters constituting each group are the same as those shown in FIG. is there.

  Similarly to the first embodiment, the mounting condition determining apparatus 11 transmits information with the individual code as the destination, so that the information can reach the component mounting machine of the individual code that is the destination.

  The functional configuration of each component mounter will be described by taking the component mounter 30 to which the individual code “M123-1” is attached as an example.

  FIG. 17 is a functional block diagram showing a functional configuration of the component mounter and the mounting condition determining apparatus in the second embodiment.

  The component mounter 30 shown in FIG. 17 does not include the mounting condition determination device 11 unlike the component mounter 10 in the first embodiment. Moreover, the communication part 26 which communicates with the mounting condition determination apparatus 11 via LAN5 is provided.

  The communication unit 26 is a processing unit that can receive a mounting condition transmitted from the mounting condition determining device 11 as a response to the request by transmitting a mounting condition request to the mounting condition determining device 11. Further, the communication unit 26 realizes a function for requesting and receiving a mounting condition included in the request transmitting unit and the condition receiving unit in the component mounter of the present invention.

  Similar to the component mounter 10 in the first embodiment, the component mounter 30 can transmit identification information such as an individual code using an enemy ally signal. Specifically, the communication unit 26 transmits an enemy friend signal to the mounting condition determining device 11 as a response to the request from the mounting condition determining device 11. The content of the identification information included in the enemy friend signal is the same as that shown in FIG.

  The functions of the setting unit 20, the condition storage unit 21, the mechanism control unit 22, the mechanism unit 23, the error detection unit 24, and the result information storage unit 25, which are other components, are the same as those in the first embodiment.

  That is, the setting unit 20 receives the mounting condition transmitted from the mounting condition determining device 11 in response to a request from the component mounting machine 30 and sets the mounting condition in the mechanism control unit 22. In addition, the mounting conditions are stored in the condition storage unit 21. The mechanism unit 23 mounts components on the board under the mounting conditions set in the mechanism control unit 22.

  Further, the error detection unit 24 detects errors in the production work performed by the component mounter 30, and totals the work results in the own equipment based on the types of detected errors. The work result information generated by the aggregation is stored in the result information storage unit 25.

  The mounting conditions stored in the condition storage unit 21 and the work performance information stored in the performance information storage unit 25 are transmitted to the mounting condition determination device 11 via the communication unit 26.

  The mounting condition determination device 11 is connected to the LAN 5 independently, and can exchange information with each component mounting machine connected to the LAN 5.

  The configuration of the mounting condition determination device 11 in the second embodiment is different from the mounting condition determination device 11 in the first embodiment, and includes an acquisition condition storage unit 18 for storing the acquired mounting conditions.

  The mounting condition determination device 11 according to the second embodiment acquires and stores mounting conditions from specific equipment in advance, reads the mounting conditions from the acquisition condition storage unit 18 in response to a request from each component mounting machine, and mounts each component. Can be sent to the machine.

  In the first embodiment, various processes for optimizing the mounting conditions are performed on one component mounting machine, whereas in the second embodiment, mounting is performed for a plurality of component mounting machines. Various processes for optimizing conditions can be performed.

  The component mounter 30 shown in FIG. 17 is a component mounter represented by “M123-1” in FIG. 16, but the other component mounters have the same functional configuration.

  That is, the other component mounters belonging to the M123 group to which M123-1 belongs are the same model as the M123-1, and have the same functional configuration as the functional configuration shown in FIG. Further, regarding the component mounting machines of other groups, although there are differences in the devices constituting the mechanism unit 23, the functional unit includes a communication unit 26, a setting unit 20, a condition storage unit 21, a mechanism control, respectively. It is the same in that the unit 22, the mechanism unit 23, the error detection unit 24, and the result information storage unit 25 are provided.

  Accordingly, other component mounting machines such as M123-2 can transmit a request for mounting conditions to the mounting condition determining apparatus 11 in the same manner as the component mounting machine 30, and the mounting conditions transmitted in response to the request can be transmitted. Can be received. Furthermore, various production operations can be performed under the received mounting conditions.

  The outline of the operation of the component mounter 30 in the present embodiment is the same as the outline of the operation of the component mounter 10 in the first embodiment shown in FIG.

  That is, the component mounter 30 acquires the mounting conditions of other equipment spontaneously, that is, without receiving an instruction to acquire the mounting conditions from outside the component mounter 30 (S1). Furthermore, the acquired mounting conditions are set in the component mounting machine 30 (S2).

  However, the component mounter 30 in the present embodiment does not directly acquire the mounting conditions from the other component mounters, but acquires the mounting conditions of the other component mounters via the mounting condition determination device 11. Is different.

  For example, from M123-1, the procedure for obtaining the mounting condition of M123-2 is as follows: (1) The mounting condition determining device 11 acquires the mounting condition from M123-2, and (2) M123-1 is the mounting condition determining device. 11 is obtained by two procedures of acquiring the mounting condition from 11.

  Further, the mounting condition determining apparatus 11 in the present embodiment is different in that the above-described series of operations is performed on a plurality of component mounting machines as described above. That is, in the first embodiment, in the mounting condition determining apparatus 11 provided in each component mounter, the “predetermined group” is a group to which one component mounter including itself belongs. However, in the second embodiment, the above-described series of operations can be performed for a plurality of groups, and the mounting conditions can be optimized for a plurality of component mounters belonging to the plurality of groups.

  FIG. 18 is a flowchart showing an operation flow when the mounting condition determining apparatus 11 according to the second embodiment identifies a plurality of component mounters.

  A request for an enemy ally signal is broadcast from the communication unit 12 of the mounting condition determining device 11 to all the component mounting machines connected to the LAN 5 (S41). The communication unit 12 receives an enemy ally signal transmitted in response to the request (S42).

  The identification unit 13 reads the individual code indicating the component mounting machine that is the transmission source of the enemy ally signal from the enemy ally signal received by the communication unit 12. Further, it is identified from the model code and category code included in the individual code, to which group the component mounter that is the transmission source of the individual code belongs (S43).

  Note that information necessary for the identification is stored in the group storage unit 14, and the identification unit 13 performs the identification with reference to this information. For example, the group storage unit 14 stores a model code such as “M123” and a category code such as “M” for reference. The identification unit 13 refers to these model codes, and if any of them is included in the individual code, it identifies that the individual code belongs to the group corresponding to the character string.

  In the present embodiment, the M123, M221, T121, and Z005 model groups and the M, T, and Z category groups (see FIG. 2) are the targets of identification.

  The identification unit 13 creates a plurality of model tables and a plurality of category tables from the identification result (S44). Each created table is stored in the group storage unit 14.

  The mounting condition determination device 11 in the production system 2 can identify which group of component mounting machines in the production system 2 is a component mounting machine by the series of operations described above.

  FIG. 19 is a diagram illustrating an example of a group table stored in the group storage unit 14 included in the mounting condition determining apparatus 11 according to the second embodiment.

  The group storage unit 14 illustrated in FIG. 19 stores a group table for each model and a group table for each category, which are generated according to the result of identification (S43) by the identification unit 13 described above.

  In the mounting condition determining apparatus 11, the collection unit 15 can transmit / receive information to / from component mounters belonging to any group by referring to these group tables.

  Specifically, the collection unit 15 can transmit a request for predetermined work result information to all the component mounters belonging to each group, and collect work result information from each component mounter as a response thereto. it can.

  FIG. 20 is a flowchart showing an operation flow when the mounting condition determining apparatus 11 according to the second embodiment acquires mounting conditions from specific equipment and sets the mounting conditions in each component mounter.

  In each component mounting machine, the production of the component mounting board is started by a predetermined instruction, for example, an instruction from the operator (S51). After the start of production, work result information such as a suction rate for each component is generated in each component mounting machine.

  The collection unit 15 collects work performance information from the equipment in each group for each group (S52). Specifically, each group table stored in the group storage unit 14 is referred to, and a request for work performance information is transmitted to the individual code recorded in each group table. In response to this request, work result information transmitted from each component mounter is collected.

  The types of work performance information collected include the suction rate, mounting rate, recognition error rate, mounting accuracy, and the like for each component, as in the first embodiment. In addition, any one or a plurality of types of these work performance information are collected.

  Information about what kind of work result information is requested for which group is held in the collection unit 15. For example, the collection unit 15 holds collection information for specifying work result information to be collected such as “M123: parts A, B, C, D: suction rate, mounting rate”. The collection unit 15 collects work performance information based on this collection information and the individual codes of the component mounters stored in the group storage unit 14.

  For example, in the case where the above collection information is held, the suction rate and the mounting rate for each of the parts A to D with respect to M123-1, M123-2, M123-3, and M123-4 belonging to the M123 group Send a request. Thus, the suction rate and the mounting rate for each of the components A to D are collected from all the component mounting machines belonging to the M123 group.

  Collected information about other groups is also held in the collecting unit 15, and work result information corresponding to each group is collected.

  FIG. 21 is a diagram illustrating an example of work performance information collected by the collection unit 15. Based on the work result information collected by the collection unit 15, the specific unit is determined by the determination unit 16.

  FIG. 21 shows the work result information of the component mounters belonging to each of the M123 group and the M221 group, but the work result information is also collected from the component mounters belonging to other groups.

  As shown in FIG. 21, when work performance information such as the suction rate for the component A is collected for each group, it can be determined which component mounter has the highest grade. For example, in the suction rate for the part A in the M123 group, M123-3 is “99%”, which is the highest grade.

  In the adsorption rate for the part A in the M221 group, M221-1 is “99%”, which is the highest grade.

  Similarly, other work result information about other parts, such as a mounting rate for part A and an adsorption rate for part B, is also collected for each model group and each category group. The component mounter that records the highest grade for is determined as the specific equipment (S53).

  FIG. 22 is a diagram illustrating an example of the specific equipment group determined by the determination unit 16.

  As shown in FIG. 22, specific equipment for each part is determined for each type of work result information such as an adsorption rate and a mounting rate.

  In the example illustrated in FIG. 22, in the M123 group, M123-3 is the specific equipment in the suction rate for the part A, and M123-1 is the specific equipment in the suction rate for the part B. In addition, regarding the mounting rate of the component A, M123-3 is a specific facility, and for the mounting rate of the component B, M123-2 is a specific facility.

  The plurality of specific facilities are also determined for other model groups and category groups.

  The acquisition unit 17 acquires the mounting conditions from the specific equipment determined in this way (S54). Specifically, the mounting condition transmitted from the specific equipment is acquired as a response to the request from the mounting condition determining apparatus 11. Further, what information is acquired as the mounting condition is the same as that described in Embodiment 1 with reference to FIGS. 13 and 14.

  For example, the contents of the mounting conditions acquired from M123-3, which is a specific facility for the suction rate of the part A, are information that specifies each of the nozzle, the suction operation pattern, and the suction correction value that the M123-3 uses for suctioning the part A It is.

  The acquisition unit 17 also acquires the respective mounting conditions from other specific equipment determined by the determination unit 16. The acquisition unit 17 stores the acquired mounting conditions in the acquisition condition storage unit 18.

  The communication unit 12 receives a request for mounting conditions transmitted from each component mounting machine (S55). When a request for mounting conditions is received by the communication unit 12, each mounting condition acquired by the acquiring unit 17 is read from the acquisition condition storage unit 18, and each response as a response to each request for mounting conditions by the communication unit 12. It is transmitted to the component mounting machine (S56).

  As described above, the communication unit 12 according to the present embodiment realizes the function of receiving the request for the mounting condition and transmitting the mounting condition included in the request receiving unit and the condition transmitting unit in the mounting condition determining apparatus of the present invention. .

  Specifically, the mounting conditions are transmitted to each component mounter belonging to the corresponding group. At the time of this transmission, the individual code for each group stored in the group storage unit 14 is referred to.

  For example, a mounting condition acquired from a specific facility belonging to the M123 group is transmitted as a response to a request from a component mounting machine belonging to the M123 group other than the specific facility.

  Similarly, the mounting condition acquired from the specific equipment belonging to the M221 group is transmitted as a response to a request from a component mounting machine other than the specific equipment belonging to the M221 group.

  In this way, the communication unit 12 transmits each mounting condition to the in-group equipment belonging to the corresponding group, depending on which group of the specific equipment each acquired mounting condition is.

  In each component mounting machine, components are mounted under the mounting conditions transmitted from the mounting condition determining device 11.

  Thereafter, while the production is continuing (No in S57), the above operation is repeated, and when the production is terminated by an operator's instruction or the like (Yes in S57), the series of processes related to the setting of the mounting conditions is also terminated.

  Note that the collection of work result information from the equipment in the group (S52) to acquisition of the mounting conditions (S54) are performed at a predetermined timing. For example, it is performed every predetermined period. Information about the predetermined timing is held in the collection unit 15.

  These operations may be performed in response to reception of a request for mounting conditions (S55). That is, as shown in FIG. 20, the specific equipment is determined in advance, the mounting conditions are acquired and stored, and the mounting conditions may be transmitted in response to a request from the component mounting machine. As a trigger, the group to which the component mounter belongs is collected from the work result information (S52) to the acquisition of the mounting condition (S54), and the acquired mounting condition is transmitted to the component mounter ( S56).

  When the mounting conditions are acquired in advance and stored in the acquisition condition storage unit 18, for example, even when the component mounting machine that is the specific equipment is in a power-off state, the mounting conditions of the specific equipment are changed to other components. It can be transmitted in response to a request from the mounting machine.

  Further, when the specific equipment is determined in response to the reception of the request for the mounting condition, the specific equipment is determined based on the results of each component mounting machine at the time when the request is received. Accordingly, the results such as the adsorption rate in each component mounting machine reflect, for example, the temperature, atmospheric pressure, and humidity at that time. Therefore, each component mounting machine can acquire the mounting conditions according to the environment at that time and capable of improving productivity via the mounting condition determining device 11.

  Each component mounter transmits a request for a mounting condition to the mounting condition determining apparatus 11 at a predetermined timing. The predetermined timing is, for example, information set by the administrator of the production system 2 and is held in the communication unit 26.

  The communication unit 26 has a clock or a timer inside, and transmits a mounting condition request to the mounting condition determination device 11 at the timing indicated by this information.

  Further, instead of transmitting a request for mounting conditions every time a predetermined period elapses, for example, it may be transmitted only when the power of the component mounter 30 is turned on.

  Further, for example, in order to distribute the communication load of the LAN 5, the transmission of the request for the mounting condition may be shifted on the time axis for each group or component mounting machine. Further, the above-described series of operations may be performed by detecting a change in the productivity of the own equipment, for example, detecting that the adsorption rate of the part A has fallen below a predetermined value.

  In short, it is only necessary that the mounting conditions can be acquired spontaneously regardless of what triggers the acquisition of the mounting conditions.

  FIG. 23 is a schematic diagram illustrating a state in which the mounting condition determining apparatus 11 according to the second embodiment transmits mounting conditions corresponding to each group to each of the component mounting machines in a plurality of groups.

  As shown in FIG. 23, the mounting condition determining apparatus 11 according to the present embodiment can optimize mounting conditions for a plurality of groups.

  For example, when the mounting condition determining apparatus 11 determines M123-3 as the specific equipment having the best suction rate of the part A in the M123 group, as shown in FIG. The condition α is acquired.

  Furthermore, when a mounting condition request is received from equipment in the group other than the specific equipment belonging to the M123 group, that is, M123-1, M123-2, and M123-4, the acquired mounting condition α is obtained as a response to the request. Is transmitted to these three component mounting machines.

  In each component mounting machine, the mounting condition α received from the mounting condition determining device 11 is set.

  Thereby, the mounting conditions related to the suction rate of the component A in all the component mounting machines belonging to the M123 group are unified to the optimal mounting conditions. For example, the nozzles used for picking up and mounting the part A are unified into nozzles optimal for picking up the part A.

  Further, for example, when the mounting condition determining apparatus 11 determines M221-1 as the specific equipment having the lowest recognition error rate of the component D in the M221 group, as shown in FIG. Get related implementation condition β.

  Furthermore, when a request for mounting conditions is received from equipment in the group other than the specific equipment belonging to the M221 group, that is, M221-2, M221-3, and M221-4, the acquired mounting condition β is returned as a response to the request. Is transmitted to these three component mounting machines.

  In each component mounter, the mounting condition β received from the mounting condition determination device 11 is set.

  Thereby, the mounting conditions related to the recognition error rate of the component D in all the component mounting machines belonging to the M221 group are unified to the optimal mounting conditions. For example, the light quantity of the light when the camera recognizes the part D is unified to the optimum light quantity.

  The mounting condition determination device 11 finds the optimal mounting condition in each group with the same operation for other groups, and transmits it in response to a request from a component mounting machine belonging to each group.

  In addition, mounting conditions related to other types of work performance information, for example, an optimal mounting that improves or improves the mounting rate for component A, the suction rate for component B, or the mounting accuracy for the nozzle of nozzle number 1 and the like. The condition is found in each group, and is transmitted in response to a request from a component mounter belonging to each group.

  As described above, the mounting condition determining apparatus 11 according to the present embodiment can transmit the optimal mounting condition corresponding to each group to the equipment in each group for a plurality of groups.

  Thereby, the mounting conditions can be unified within each group, and the productivity of the equipment within each group is improved.

  In addition, each component mounting machine can acquire mounting conditions that can improve the productivity of its own equipment without including the collection unit 15 and the determination unit 16 for optimizing the mounting conditions, and also has an economic effect. is there. Moreover, since this acquisition is performed spontaneously, it is possible to efficiently optimize the mounting conditions of the own equipment.

  In addition, when the administrator of the production system 2 changes or corrects the function for optimizing the mounting conditions for each component mounting machine, the administrator only has to give instructions to one mounting condition determination device, and the efficiency. These changes can be made automatically. In addition, each component mounter does not need to directly exchange information with other equipment, and for example, the LAN 5 is not subjected to a load due to communication between the component mounters.

  For each component mounter that can communicate with the mounting condition determining apparatus 11 in the present embodiment, there are items that can be set as mounting conditions, regardless of whether or not they are products of the same manufacturer. There may be cases where there is commonality.

  Further, even if items that can be set as mounting conditions and their names are different, if the mounting condition determining device 11 or each component mounting machine has information for converting it, it exists between manufacturers. Differences in these names can be absorbed.

  In such a case, the mounting condition determination device 11 according to the present embodiment does not need to identify which group each component mounting machine belongs to, similarly to the mounting condition determination device 11 according to the first embodiment.

  In addition, the mounting condition determination device 11 in the present embodiment determines a component mounting machine having the highest grade in work performance information as a specific facility from among a plurality of component mounting machines.

  However, the mounting condition determination apparatus 11 may determine a component mounting machine that acquires mounting conditions by comparing the results of two component mounting machines.

  For example, work result information such as the adsorption rate of the part A is collected from M123-1 and M123-2 and compared. As a result of the comparison, if the suction rate of M123-2 is higher, the mounting condition related to the suction rate is acquired from M123-2.

  After that, when a mounting condition request is received from M123-1, the mounting condition of M123-2 is transmitted to M123-1 which is the requested equipment as a response to the request. If the comparison result shows that the M123-1 adsorption rate is higher, the M123-1 acquires the mounting conditions related to the adsorption rate, and transmits the M123-1 mounting conditions to the M123-2. .

  It should be noted that the collection of the work performance information and the acquisition of the mounting conditions from the component mounting machine performed by the mounting condition determining apparatus 11 may be performed when the request for the mounting conditions is received from the component mounting machine.

  In other words, from a certain component mounting machine, acquiring the mounting conditions corresponding to the results from other component mounting machines whose results related to production work are at least higher than the own equipment improves the productivity of the own equipment. It is significant in making it happen.

  As described above, in the mounting condition determining apparatus 11 according to the present embodiment, similarly to the mounting condition determining apparatus 11 according to the first embodiment, one result can be obtained by comparing the results of the two component mounting machines such as the suction rate. You may determine the mounting conditions which should be set to a component mounting machine. Even in this case, the productivity of the component mounter in which the mounting conditions are set is improved.

  Further, in the production system 2 in the present embodiment, a plurality of component mounting machines and one mounting condition determining device 11 are connected to the LAN 5, and each component mounting machine can improve productivity from the mounting condition determining device 11. The condition is assumed to be acquired spontaneously.

  When the production system is configured by a plurality of component mounters and one device that can fetch mounting conditions from each component mounter as in this production system 2, each component mounter is the same as that in the second embodiment. A functional configuration other than the component mounter 30 may be used.

  For example, a plurality of component mounters having the same functional configuration as the component mounter 10 in the first embodiment, and a device having a function of communicating with each component mounter and storing information (hereinafter referred to as “management device”). The mounting condition determination method of the present invention can be implemented in a production system configured with

  For example, in this production system, each component mounting machine transmits the mounting conditions of its own equipment to the management apparatus together with the individual code. The management apparatus stores each mounting condition in association with the individual code.

  The component mounter collects work result information from other component mounters and determines specific equipment. Furthermore, a request for mounting conditions including the individual code of the specific equipment is transmitted to the management apparatus. The management apparatus transmits the mounting condition of the specific equipment corresponding to the request to the requesting component mounting machine.

  The mounting condition determination method of the present invention can also be implemented by such operations of the component mounting machines and the management apparatus.

  Further, the above-described management device may collect work result information of each component mounter, and each component mounter may receive the work result information of each component mounter from the management device and determine specific equipment.

  As described above, the processing related to the determination of specific equipment, in other words, the determination of the mounting conditions that can improve the productivity in each component mounting machine, may be performed intensively by one apparatus as in the present embodiment. Alternatively, it may be performed in a distributed manner on each component mounter.

  Also, the mounting condition determining device 11 in the present embodiment also acquires the identification information and work performance information of each component mounting machine via a recording medium such as a CD-ROM, as in the mounting condition determining device 11 in the first embodiment. May be. By doing so, for example, the communication load on the LAN 5 can be reduced.

  Further, the contents of the mounting conditions acquired by the acquisition unit 17 and the type of work result information may be other than those shown in FIG. 13 as in the first embodiment.

  Further, the LAN 5 in the present embodiment is not limited to a specific one as to whether the LAN 5 is wired or wireless and what the communication protocol is.

  A plurality of component mounting machines may be handled as one facility, and one line may be handled as one facility.

  That is, the function for optimizing the mounting conditions for the equipment such as a plurality of component mounting machines included in the mounting condition determining apparatus 11 in the present embodiment includes the contents of the mounting conditions, the type of work performance information, the communication form, It does not depend on the communication protocol, the unit of equipment handled as equipment, etc., and the function is not lost.

  The operations of the communication unit 12, the identification unit 13, the group storage unit 14, the collection unit 15, and the determination unit 16 included in the mounting condition determination device 11 in the first and second embodiments are a central processing unit (CPU), a storage device, And a computer having an interface for inputting and outputting information.

  For example, the CPU receives an enemy ally signal transmitted from each component mounter via the interface. Furthermore, with reference to the information read from the storage device, it is recognized to which group the component mounter that transmitted the enemy ally signal belongs. The recognized results are grouped for each group under the control of the CPU and stored in the storage device.

  Further, the CPU refers to the information read from the storage device, and transmits a request for work performance information to each component mounter via the interface. Furthermore, the work result information transmitted as a response to the request is received via the interface, and the component mounter that has transmitted the work result information indicating the result satisfying a predetermined standard is specified. A request for a mounting condition is transmitted to the identified component mounter via the interface, and the mounting condition transmitted as a response to the request is received via the interface.

  Thereafter, the CPU refers to the information read from the storage device, identifies the component mounter to which the received mounting conditions are to be transmitted, and transmits the mounting conditions via the interface.

  The mounting condition determination method of the present invention is also realized by such an operation of the computer, and the operation of the mounting condition determination apparatus of the present invention is realized.

  Similarly, the operation of each component of the setting unit 20, the mechanism control unit 22, the error detection unit 24, and the communication unit 26 in the component mounter 10 and the component mounter 30 has a CPU, a storage device, an interface, and the like. It can be realized by a computer.

  The present invention can be used as a method for determining optimum mounting conditions for a plurality of component mounting machines. In particular, it is useful as a method for determining optimum mounting conditions in a production system including a plurality of lines for producing a plurality of types of component mounting boards. By applying the present invention, the productivity of a plurality of facilities constituting the production system is efficiently improved.

2 is a schematic diagram showing an outline of a hardware configuration of a production system in Embodiment 1. FIG. It is a figure which shows an example of grouping of the component mounting machines which comprise the production system in Embodiment 1. FIG. 3 is a functional block diagram showing a functional configuration of a component mounter in the first embodiment. FIG. It is a flowchart which shows the outline | summary of the operation | movement which concerns on the setting of the mounting conditions of the component mounting machine which concerns on this invention. FIG. 6 is a flowchart showing an outline of an operation flow related to setting of mounting conditions performed by the component mounter in the first embodiment. 6 is a diagram illustrating an outline of a data configuration of an enemy ally signal in Embodiment 1. FIG. It is a figure which represents typically the request | requirement and reception of the enemy friend signal which the component mounting machine in Embodiment 1 performs. FIG. 10 is a flowchart showing an operation flow when the component mounter in the first embodiment identifies another component mounter. It is a figure which shows the example of the group table memorize | stored in the group memory | storage part with which the component mounting machine in Embodiment 1 is provided. It is a flowchart which shows the flow of operation | movement at the time of the component mounting machine in Embodiment 1 acquiring mounting conditions from a specific installation, and setting the mounting conditions to an own installation. 6 is a diagram illustrating an example of work result information collected by a collecting unit in Embodiment 1. FIG. FIG. 3 is a diagram illustrating an example of a specific facility group determined by a determination unit in the first embodiment. It is a figure which shows the example of correlation with the kind of work performance information, such as an adsorption rate, and mounting conditions. It is a figure which shows the example of the mounting conditions acquired by each component mounting machine from specific equipment. It is a schematic diagram which shows a mode that the method of determining and acquiring the mounting conditions set to a self-equipment by comparison with another one equipment is implemented with respect to several component mounting machines. 6 is a schematic diagram showing an outline of a hardware configuration of a production system in Embodiment 2. FIG. FIG. 10 is a functional block diagram illustrating a functional configuration of a component mounter and a mounting condition determination device in a second embodiment. FIG. 10 is a flowchart showing an operation flow when the mounting condition determining apparatus according to the second embodiment identifies a plurality of component mounters. It is a figure which shows the example of the group table memorize | stored in the group memory | storage part with which the component mounting machine in Embodiment 2 is provided. It is a flowchart which shows the flow of operation | movement at the time of the mounting condition determination apparatus in Embodiment 2 acquiring mounting conditions from specific equipment, and setting the mounting conditions to each component mounting machine. It is a figure which shows the example of the work performance information collected by the collection part in Embodiment 2. FIG. It is a figure which shows the example of the specific installation group determined by the determination part in Embodiment 2. FIG. It is a schematic diagram which shows a mode that the mounting condition determination apparatus in Embodiment 2 transmits the mounting conditions according to each group with respect to each component mounting machine of a some group.

Explanation of symbols

1, 2 Production system 2 Production system 5 LAN
DESCRIPTION OF SYMBOLS 10, 30 Component mounting machine 11 Mounting condition determination apparatus 12, 26 Communication part 13 Identification part 14 Group storage part 15 Collection part 16 Determination part 17 Acquisition part 18 Acquisition condition storage part 20 Setting part 21 Condition storage part 22 Mechanism control part 23 Mechanism Unit 23a mounting head 23b XY robot 23c component supply unit 23d conveyor 23e substrate 24 error detection unit 25 results information storage unit

Claims (7)

A mounting condition determination method for determining a mounting condition set in at least one of a plurality of facilities for producing a component mounting board under a set mounting condition,
A collection step of collecting performance information indicating performance related to production work from the equipment and other equipment;
A comparison step for comparing the results in the other equipment with the results related to the production work in the equipment, indicated in the results information collected in the collecting step;
Comparison of the results in the comparison step, if the results of the other equipment is higher, the facility, an instruction to obtain the mounting conditions for the production operations in spontaneously the other equipment without receiving from the outside of the plant An acquisition step for acquiring related implementation conditions;
A setting step for setting the mounting conditions acquired in the acquisition step in the equipment,
The mounting condition includes information for specifying a component including a nozzle used for mounting a component on a substrate, or control information for operating the component. And a notification step of notifying the other equipment of a mounting condition related to the production work in the equipment when a result related to the production work in the equipment is high as a result of the comparison in the comparison step. Item 1. A mounting condition determination method according to Item 1 . In the collecting step, the results information is collected from the plurality of facilities,
In the comparison step, the plurality of facilities are compared,
In the acquisition step, as a result of the comparison in the comparison step, the result is higher than the result related to the production work in the equipment, and is related to the production work from another equipment that is the highest in the plurality of equipment. mounting condition determining method according to claim 1, wherein obtaining the mounting conditions. A mounting condition determining device for determining mounting conditions in equipment for producing a component mounting board under set mounting conditions,
The mounting condition determination device is provided in the facility, communicates with other facilities,
A collecting means for collecting performance information indicating results related to production work from the equipment and the other equipment;
Comparison means for comparing the results in the other equipment and the results related to the production work in the equipment, shown in the results information collected by the collecting means,
As a result of the comparison by the comparison means, when the result in the other equipment is higher, the instruction to acquire the mounting condition is voluntarily related to the production work in the other equipment without receiving an instruction from outside the equipment. Acquisition means for acquiring the mounting conditions;
Setting means for setting the mounting conditions acquired by the acquisition means in the equipment,
The mounting condition includes information for specifying a component including a nozzle used for mounting a component on a substrate or control information for operating the component. A component mounting method for mounting a component on a board,
The component mounting method which mounts components on a board | substrate under the mounting conditions set by the mounting condition determination method of any one of Claims 1-3 . A component mounter that is equipment for producing a component mounting board,
The mounting condition determining device according to claim 4 ,
A component mounting machine comprising: mounting means for mounting a component on a substrate under mounting conditions set by the mounting condition determining device. A program for determining mounting conditions set in at least one of a plurality of facilities for producing a component mounting board,
The program for making a computer perform the step contained in the mounting condition determination method of any one of Claims 1-3 .

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