JP4230815B2

JP4230815B2 - Electrode substrate and manufacturing method thereof

Info

Publication number: JP4230815B2
Application number: JP2003127372A
Authority: JP
Inventors: 泰楠山; 雅宏林; 勝己柴山
Original assignee: Hamamatsu Photonics KK
Current assignee: Hamamatsu Photonics KK
Priority date: 2003-05-02
Filing date: 2003-05-02
Publication date: 2009-02-25
Anticipated expiration: 2023-05-02
Also published as: JP2004335614A

Description

【０００１】
【発明の属する技術分野】
本発明は、電極基板及びその製造方法に関する。
【０００２】
【従来の技術】
従来、無機絶縁性物質からなる基板（例えば、ガラス基板）に、その厚さ方向の上面から下面に達する微細孔と、この微細孔に柱状の導電性部材（導電体層）とを設けた電極基板が知られている。（例えば、特許文献１参照。）
【０００３】
【特許文献１】
特開平３−２０３３４１号公報
【０００４】
【発明が解決しようとする課題】
しかしながら、基板を厚さ方向に貫通し、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することは困難であり、容易に実現できるものではなかった。
【０００５】
本発明は上述の点に鑑みてなされたもので、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することを容易に行うことが可能な電極基板及びその製造方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明に係る電極基板は、貫通孔を有するマルチチャンネル部材を複数含み、当該マルチチャンネル部材が２次元状に配置された状態で互いに融着されて一体形成されたキャピラリー基板と、貫通孔に設けられ、キャピラリー基板の両主面間を電気的に導通する導電性部材とを有し、マルチチャンネル部材は、第１の組成を有するガラス部材が複数互いに融着されて一体形成され、主面に垂直な方向から見て３角形状、４角形状及び６角形状のうちのいずれかの形状を呈しており、ガラス部材は、その貫通用領域に貫通孔が形成されている第１のガラス部材と、第１の組成とは異なる第２の組成のガラス部材をその貫通用領域に有する第２のガラス部材とを含むことを特徴としている。
【０００７】
また、本発明に係る電極基板は、貫通孔を有するマルチチャンネル部材を複数含み、当該マルチチャンネル部材が２次元状に配置された状態で互いに融着されて一体形成されたキャピラリー基板と、貫通孔に設けられ、キャピラリー基板の両主面間を電気的に導通する導電性部材とを有し、マルチチャンネル部材が、第１の組成からなり貫通孔を有するガラス部材が複数互いに融着されて一体形成され、主面に垂直な方向から見て３角形状、４角形状及び６角形状のうちのいずれかの形状を呈しており、一部のガラス部材の貫通孔には、第１の組成とは異なる第２の組成からなるガラス部材が充填されていることを特徴としている。
【０００８】
これら、本発明に係る電極基板それぞれによれば、貫通孔を有するガラス部材が複数互いに融着されて一体形成されることにより、マルチチャンネル部材に複数の貫通孔が設けられることとなる。また、このマルチチャンネル部材は、主面に垂直な方向から見て３角形状、４角形状及び６角形状のうちのいずれかの形状を呈していることから、当該マルチチャンネル部材が２次元状に配置された状態で互いに融着されて一体形成することが可能となり、これにより、キャピラリー基板が構成されることとなる。これらの結果、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することを容易に行うことができる。また、第２の組成のガラス部材をその貫通用領域に有する第２のガラス部材を含むことにより、電極基板の主面上に平坦で一定の広さを有するスペースが設けられる。または、一部のガラス部材の貫通孔に第２の組成のガラス部材が充填されていることにより、電極基板の主面上に平坦で一定の広さを有するスペースが設けられる。よって、導電性部材を互いに電気的に接続するための配線パターンを容易に設けることができる。また、第２の組成が第１の組成とは異なるので、第２の組成からなるガラス部材をキャピラリー基板から除去することにより貫通孔を追加して設けることができる。
【０００９】
また、第２の組成は、エッチングによりキャピラリー基板から除去することが可能な組成であることが好ましい。このように構成した場合、第２の組成からなるガラス部材をエッチングによりキャピラリー基板から容易に除去することができるので、貫通孔を容易に追加して設けることができる。
【００１０】
また、第２の組成は、第１の組成よりもＨＣｌ溶液またはＨＮＯ₃溶液中での溶解速度が大きい組成であることが好ましい。このように構成した場合、電極基板をＨＣｌ溶液またはＨＮＯ₃溶液中に浸すことより、第２の組成からなるガラス部材を容易に除去することができるので、貫通孔を容易に追加して設けることができる。
【００１１】
また、第２の組成におけるＳｉＯ₂の組成比率は、第１の組成におけるＳｉＯ₂の組成比率よりも小さいことが好ましい。このように構成した場合、第２の組成は、ＨＣｌ溶液などの酸性溶液中での溶解速度が第１の組成よりも大きくなるので、第２の組成からなるガラス部材を容易に除去することができ、貫通孔を容易に追加して設けることができる。
【００１２】
また、本願発明に係る電極基板は、コアガラス部分と当該コアガラス部分の周囲に設けられた被覆ガラス部分とを含むファイバ状のガラス部材を束ねて束状のガラス部材を形成し、束状のガラス部材を所望の厚みに切断し、一部のコアガラス部分を除去して形成した、複数の貫通孔を備えるキャピラリー基板と、貫通孔に設けられ、キャピラリー基板の両主面間を電気的に導通する導電性部材と、を有することを特徴としている。
【００１３】
本発明に係る電極基板では、ファイバ状のガラス部材が束ねられて形成された束状のガラス部材が所望の厚みに切断され、そして、上記コアガラス部分が除去されることにより、キャピラリー基板に複数の貫通孔が設けられることとなる。この結果、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することを容易に行うことができる。また、一部のコアガラス部材のみを除去することによって、電極基板の主面上においてコアガラス部材が除去されていない部分は平坦となり、導電性部材を互いに電気的に接続するための配線パターンを容易に設けることができる。
【００１４】
また、貫通孔は、一方の主面側の開口部から当該主面に直交する方向に見て、他方の主面側の開口部が見通せないように形成されていることが好ましい。このように構成した場合には、Ｘ線等のエネルギー線が貫通孔を一方の主面側から他方の主面側に通過してしまうのを確実に防ぐことができる。
【００１５】
また、貫通孔は、少なくとも一方の主面側の開口部が当該主面に対してその開口軸を傾斜されて形成されていることが好ましい。このように形成した場合には、一方の主面側の開口部から当該主面に直交する方向に見て、他方の主面側の開口部が見通せ得ない貫通孔の構成を、簡易に実現することができる。
【００１６】
また、貫通孔は、当該貫通孔の開口部の間隔が一方の主面側と他方の主面側とで異なるように形成されていることが好ましい。このように形成した場合、貫通孔に設けた導電性部材のピッチを、一方の主面側と他方の主面側との間で拡大、縮小することができる。
【００１７】
また、導電性部材は、貫通孔内に形成される第１の電極部分と、主面における貫通孔の開口部外周に形成される第２の電極部分とを含むことが好ましい。このように構成した場合、導電性部材として、第２の電極部分が主面における貫通孔の開口部外周に形成されるので、導電性部材がキャピラリー基板から外れてしまうのを防ぐことができる。
【００１８】
また、第１の電極部分は、貫通孔の内壁に形成されることが好ましい。または、第１の電極部分は、貫通孔内を充填して形成されることが好ましい。これらのように構成した場合、貫通孔内に第１の電極部分を容易に形成することができる。
【００１９】
また、第２の電極部分は、互いに隣接する少なくとも２つの貫通孔の開口部外周にわたって形成されることが好ましい。このように構成した場合、キャピラリー基板の主面上に第２の電極部分を広く設けることができるので、電極基板に電気的に接続される電子デバイスと導電性部材との相対位置精度を緩和することができる。
【００２０】
また、導電性部材は、所望の貫通孔にのみ設けられていることが好ましい。
【００２１】
また、キャピラリー基板は、加熱、冷却されることにより強化ガラス化されていることが好ましい。このように構成した場合、複数の貫通孔が形成されたキャピラリー基板の強度を高めることができ、当該キャピラリー基板の破損等を防ぐことができる。
【００２２】
また、貫通孔は、その開口部が４角形状を呈しており、主面に直交する方向から見て、互いに直交する２方向に並んで配置されていることが好ましい。このように構成した場合、貫通孔に設けた導電性部材と、キャピラリー基板に電気的に接続される電子デバイスの回路パターンとを容易に整合させることができる。
【００２３】
また、貫通孔は、その開口部が円形状を呈しており、主面に直交する方向から見て、互いに直交する２方向に並んで配置されていることが好ましい。このように構成した場合、貫通孔に設けた導電性部材と、キャピラリー基板に電気的に接続される電子デバイスの回路パターンとを容易に整合させることができる。
【００２４】
また、複数の貫通孔のうちいずれかは、その孔径が他の貫通孔と異なることが好ましい。このように構成した場合、孔径が大きい貫通孔に設けられた導電性部材における抵抗損失を低減することができる。また、孔径が大きい貫通孔内に電気配線等を挿通することも可能になる。
【００２５】
また、貫通孔が所定のピッチで並設された列が隣接して複数列設けられており、貫通孔の複数列において、一方の列が隣接する他方の列に対して貫通孔の半ピッチずれて配置され、一方の列の貫通孔の間に隣接する他方の列の貫通孔が配置されていることが好ましい。このように構成した場合、貫通孔に設けられる導電性部材同士を隣接する列を跨いで電気的に接続する際に、直線状の配線によって当該導電性部材同士を容易に接続することができる。
【００２６】
また、マルチチャンネル部材は、主面に垂直な方向から見て、４角形状を呈しているとと共に、互いに直交する２方向それぞれについて直線状に整列して配置されていることが好ましい。また、マルチチャンネル部材は、主面に垂直な方向から見て４角形状を呈し、マルチチャンネル部材が所定の方向に並設された列が隣接して複数列設けられており、マルチチャンネル部材の複数列において、一方の列が隣接する他方の列に対して所定の方向にずれて配置されていることが好ましい。
【００２７】
一方、本発明に係る電極基板の製造方法は、コアガラス部分と当該コアガラス部分の周囲に設けられた被覆ガラス部分とを含むファイバ状のガラス部材を束ねて、束状のガラス部材を形成する工程と、束状のガラス部材を所望の厚みに切断して、板状のガラス部材を形成する工程と、板状のガラス部材から一部のコアガラス部分を除去して、当該板状のガラス部材を厚み方向に貫通する貫通孔を複数形成する工程と、貫通孔に、板状のガラス部材の両主面間を電気的に導通する導電性部材を設ける工程と、を有することを特徴としている。
【００２８】
本発明に係る電極基板の製造方法では、ファイバ状のガラス部材が束ねられて形成された束状のガラス部材が所望の厚みに切断され、そして、一部の上記コアガラス部分が除去されることにより、板状のガラス部分に複数の貫通孔が設けられることとなる。この結果、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することを容易に行うことができる。また、一部のコアガラス部材のみを除去することによって、電極基板の主面上においてコアガラス部材が除去されていない部分は平坦となり、導電性部材を互いに電気的に接続するための配線パターンを容易に設けることができる。
【００２９】
また、束状のガラス部材を形成する工程において、ファイバ状のガラス部材を複数本束ねて所定の型に整列し、整列した状態でファイバ状のガラス部材を線引きし、線引きされたファイバ状のガラス部材を所定のガラス管内に複数本納め、ファイバ状のガラス部材同士を加熱融着して、束状のガラス部材を形成することが好ましい。この場合、極めて細径且つファイバ状のガラス部材にて束状のガラス部材を容易に構成することができる。
【００３０】
また、束状のガラス部材を形成する工程において、所定の型により、ファイバ状のガラス部材をその中心軸方向から見て３角形状、４角形状及び６角形状のうちのいずれかの形状となるように整列することが好ましい。この場合、整列した状態で線引きされたファイバ状のガラス部材を所定のガラス管内に密に納めることができ、大面積化をより一層容易なものとすることができる。
【００３１】
また、板状のガラス部材を形成する工程において、束状のガラス部材をその中心軸に直交する軸に対して斜めに切断することが好ましい。この場合、貫通孔の開口部の開口軸を板状のガラス部材の主面に対して傾斜して形成することが極めて容易に行える。
【００３２】
また、板状のガラス部材を形成する工程において、束状のガラス部材を加熱延伸し、外形がテーパ状となった部分を切断することが好ましい。この場合、貫通孔はその開口部の間隔が板状のガラス部材の一方の主面側と他方の主面側とで異なるように形成されることとなり、貫通孔に設けた導電性部材のピッチを、一方の主面側と他方の主面側との間で拡大、縮小することができる。
【００３３】
また、貫通孔を複数形成する工程において、板状のガラス部材に所望パターンのマスクを設け、マスクを介して一部のコアガラス部分を除去して、貫通孔を複数形成することが好ましい。この場合、所望パターンのマスクによって覆われたコアガラス部分は除去されないので、所望のコアガラス部分のみを確実かつ容易に除去することができる。
【００３４】
また、導電性部材を設ける工程の前に、貫通孔を複数形成した板状のガラス部材を加熱、冷却して、当該板状のガラス部材を強化ガラス化する工程を更に有することが好ましい。この場合、複数の貫通孔が形成された板状のガラス部材の強度を高めることができ、当該板状のガラス部材の破損等を防ぐことができる。
【００３５】
また、導電性部材を設ける工程において、当該導電性部材を貫通孔内と当該貫通孔の開口部外周とにわたって設けることが好ましい。この場合、当該導電性部材が板状のガラス部材から外れてしまうのを防ぐことができる。
【００３６】
また、導電性部材を設ける工程において、貫通孔を複数形成した板状のガラス部材に所望パターンのマスクを設け、マスクを介して板状のガラス部材に導電性金属層を形成し、マスクを除去して、導電性部材を設けることが好ましい。この場合、導電性部材を所望の貫通孔に確実且つ容易に設けることができる。
【００３７】
また、所望パターンにおける貫通孔に対応する部分の開口面積は、貫通孔の開口面積よりも大きく設定されていることが好ましい。この場合、貫通孔内と当該貫通孔の開口部外周とにわたって導電性部材を確実かつ容易に設けることができる。
【００３８】
【発明の実施の形態】
以下、図面を参照しながら本発明による電極基板及びその製造方法の好適な実施形態について詳細に説明する。なお、説明において、同一要素又は同一機能を有する要素には、同一符号を用いることとし、重複する説明は省略する。
【００３９】
まずは、図１〜図３に基づいて、電極基板の構成を説明する。図１（ａ）は電極基板の構成を示す平面図であり、図１（ｂ）は電極基板に含まれるマルチチャンネル部材の構成を示す平面図であり、図１（ｃ）及び図１（ｄ）はマルチチャンネル部材に含まれるガラス部材の構成を示す斜視図である。図２はマルチチャンネル部材の要部拡大平面図であり、図３は電極基板の断面構成を説明するための図である。なお、図１（ａ）〜（ｄ）は、導電性部材の図示を説明のため省略している。
【００４０】
電極基板１は、図１（ａ）に示されるように、キャピラリー基板３を有している。キャピラリー基板３は、複数の貫通孔７を有するマルチチャンネル部材５を複数含んでいる。マルチチャンネル部材５は、ガラスからなる縁部材９の内側に、２次元状に配置された状態で互いに融着されて一体形成されている。
【００４１】
マルチチャンネル部材５は、図１（ｂ）〜（ｄ）に示されるように、第１のガラス部材１１ａ及び第２のガラス部材１１ｂが複数互いに融着されて一体形成されており、キャピラリー基板３の主面に垂直な方向から見て４角形状（たとえば、１０００μｍ×１０００μｍ程度）を呈している。また、マルチチャンネル部材５は、キャピラリー基板３の主面に垂直な方向から見て、互いに直交する２方向それぞれについて直線状に整列して配置されている。
【００４２】
第１のガラス部材１１ａ及び第２のガラス部材１１ｂは、第１の組成を有する。第１の組成を有するガラス部材は、例えば鉛ガラス、ソーダ石灰ガラス、コバールガラス、パイレックス（登録商標）ガラス等である。第１のガラス部材１１ａ及び第２のガラス部材１１ｂは、マルチチャンネル部材５内において、キャピラリー基板３の主面に垂直な方向から見て、互いに直交する２方向それぞれについて直線状に整列して配置されている。第１のガラス部材１１ａ及び第２のガラス部材１１ｂの外形は、キャピラリー基板３の主面に垂直な方向から見て４角形状（たとえば、１４μｍ×１４μｍ程度）とされている。第１のガラス部材１１ａ及び第２のガラス部材１１ｂそれぞれは、図１（ｃ）及び（ｄ）に示されるように、その内部に柱状の貫通用領域１０を有する。
【００４３】
第１のガラス部材１１ａにおいては、図１（ｃ）に示されるように、貫通用領域１０に貫通孔７が形成されている。また、第２のガラス部材１１ｂは、図１（ｄ）に示されるように、貫通用領域１０にガラス部材８を有している。換言すれば、第２のガラス部材１１ｂにおいては、その貫通孔にガラス部材８が充填されている。ガラス部材８は、第１の組成とは異なる第２の組成からなる。第２の組成のガラス部材としては、例えばエッチングなどの方法によりキャピラリー基板３から除去することが可能な組成のガラス部材が用いられる。具体例としては、第２の組成の具体例としては、第１の組成よりもＨＣｌ溶液またはＨＮＯ₃溶液中での溶解速度が大きくなるような組成とするとよい。例えば、このような第２の組成としては、ＳｉＯ₂の組成比率が、第１の組成のガラス部材におけるＳｉＯ₂の組成比率よりも小さい組成が好適である。
【００４４】
貫通孔７は、その開口部が円形状を呈している。貫通孔７の内径は、たとえば６μｍ程度であり、隣接する貫通孔７またはガラス部材８との間隔（ピッチ）は、たとえば８μｍ程度である。貫通孔７は、図３に示されるように、その中心軸がキャピラリー基板３の主面に直交する方向に延びている。また、ガラス部材８は、その両端面が円形状を呈している。ガラス部材８の寸法は、貫通孔７の寸法とほぼ同じである。
【００４５】
なお、貫通孔７は、図４に示されるように、キャピラリー基板３の一方の主面側の開口部から当該主面に直交する方向に見て、他方の主面側の開口部が見通せないように形成してもよい。図４においては、貫通孔７は、一方の主面側の開口部が当該主面に対してその開口軸を傾斜されて形成されており、一方の主面側の開口部と他方の主面側の開口部とは貫通孔７のピッチより大きくオフセットして設けられている。
【００４６】
なお、貫通孔７は、少なくとも一方の主面側の開口部が当該主面に対してその開口軸を傾斜されて形成されていればよい。たとえば、図５に示されるように、貫通孔７を、湾曲させて形成してもよく、また、他方の主面側の開口部の開口軸が当該主面に対して直交して形成してもよい。
【００４７】
また、電極基板１は、図２及び図３に示されるように、導電性部材１３を有している。この導電性部材１３は、所望の貫通孔７にのみ設けられ、キャピラリー基板３の両主面間を電気的に導通する。この導電性部材１３は、ニッケル、アルミニウム、クロム、銅、銀、金、またはそれらの合金からなり、第１の電極部分１３ａと、第２の電極部分１３ｂとを含んでいる。
【００４８】
第１の電極部分１３ａは、貫通孔７内に形成される。例えば、図３に示されるように、第１の電極部分１３ａは貫通孔７の内壁に形成される。または、図６に示されるように、第１の電極部分１３ａは貫通孔７内を充填して形成されてもよい。第２の電極部分１３ｂは、第１の電極部分１３ａに連続し、キャピラリー基板３の主面における貫通孔７の開口部外周に形成されている。または、第２の電極部分は第１の電極部分に連続しており、互いに隣接する少なくとも２つの貫通孔７の開口部外周にわたって形成されている。
【００４９】
また、電極基板１は、図２及び図３に示されるように、配線パターン２１を有している。配線パターン２１は、キャピラリー基板３の主面上において第２の電極部分１３ｂ同士を電気的に接続している。配線パターン２１は、キャピラリー基板３の主面上に設けられている。
【００５０】
貫通孔７は、図２に示されるように、主面に直交する方向から見て、互いに直交する２方向に並んで配置されている。この場合、貫通孔７に設けた導電性部材１３と、キャピラリー基板３に電気的に接続される電子デバイス（図示せず）の回路パターンとを容易に整合させることができる。
【００５１】
以上のように、本実施形態の電極基板１においては、第１のガラス部材１１ａの貫通用領域１０に貫通孔７が設けられている。そして、第１のガラス部材１１ａ及び第２のガラス部材１１ｂが複数互いに融着されて一体形成されることにより、マルチチャンネル部材５に複数の貫通孔７が設けられることとなる。また、このマルチチャンネル部材５は、主面に垂直な方向から見て４角形状を呈していることから、当該マルチチャンネル部材５が２次元状に配置された状態で互いに融着されて一体形成することが可能となり、これにより、キャピラリー基板３が構成されることとなる。これらの結果、導電性部材１３を設けるための貫通孔７を、より一層微細な孔径及びピッチで基板１に形成し、しかも当該基板１を大面積化及び薄型化することが容易に行うことができる。
【００５２】
また、本実施形態の電極基板１においては、第２のガラス部材１１ｂは貫通用領域１０にガラス部材８を有している。換言すれば、第２のガラス部材１１ｂにおいては、その貫通孔にガラス部材８が充填されている。第２のガラス部材１１ｂには導電性部材１３は設けられず、また貫通孔７も充填されているため、電極基板１の主面上に平坦で一定の広さを有するスペースが設けられる。このスペースを配線パターン２１のために用いることにより、導電性部材１３の第２の電極部分１３ｂ同士を互いに電気的に接続するための配線パターン２１を容易に設けることができる。
【００５３】
また、本実施形態の電極基板１においては、ガラス部材８が、第１のガラス組成とは異なる第２の組成からなる。この構成によって、所望のガラス部材８をキャピラリー基板３から除去することにより貫通孔７を微細な孔径及びピッチで追加して設けることができる。
【００５４】
また、本実施形態の電極基板１においては、複数の貫通孔７が形成されているので、電極基板１自体が、断熱効果を有する部材として機能することとなると共に軽量化が可能となる。また、４角形状を呈したマルチチャンネル部材５が２次元状に配置されているので、このマルチチャンネル部材５の配置に基づいて、電極基板１の方向性を容易に見分けることができる。また、第１のガラス部材１１ａ及び第２のガラス部材１１ｂが複数互いに融着されてマルチチャンネル部材５が形成され、更に、当該マルチチャンネル部材５が互いに融着されてキャピラリー基板３が形成されているので、電極基板１の機械的強度が高くなり、基板１自体の破損を抑制することができる。また、電極基板１において導電性部材１３を設ける必要のない部分に第２のガラス部材１１ｂを用いれば、Ｘ線等のエネルギー線が、電極基板１の一方の主面側から他方の主面側に通過してしまうのを防ぐことができる。
【００５５】
また、本実施形態の電極基板１において、第２の組成は、エッチングによりキャピラリー基板３から除去することが可能な組成とされている。これにより、第２の組成からなる所望のガラス部材８をエッチングによりキャピラリー基板３から容易に除去することができるので、貫通孔７を微細な孔径及びピッチで容易に追加して設けることができる。
【００５６】
また、本実施形態の電極基板１において、第２の組成は、第１のガラス組成よりもＨＣｌ溶液またはＨＮＯ₃溶液中での溶解速度が大きい組成とされている。これにより、ＨＣｌ溶液またはＨＮＯ₃溶液中に電極基板１を浸すことにより第２の組成からなる所望のガラス部材８を容易に除去することができるので、貫通孔７を微細な孔径及びピッチで容易に追加して設けることができる。
【００５７】
また、本実施形態の電極基板１において、第２の組成におけるＳｉＯ₂の組成比率が、第１の組成におけるＳｉＯ₂の組成比率よりも小さくなるようにするとよい。ガラス部材に含まれるＳｉＯ₂の組成比率が小さいと、ＨＣｌ溶液などの酸性溶液中での当該ガラス部材の溶解速度が速くなる。電極基板１をこのように構成することにより、ＨＣｌ溶液などの酸性溶液中において、第２のガラス部材１１ｂのガラス部材８以外の部分よりもガラス部材８のほうが速く溶解する。これにより、所望のガラス部材８を容易に除去することができ、貫通孔７を微細な孔径及びピッチで容易に追加して設けることができる。
【００５８】
また、本実施形態の電極基板１において、貫通孔７は、一方の主面側の開口部から当該主面に直交する方向に見て、他方の主面側の開口部が見通せないように形成されている。これにより、Ｘ線等のエネルギー線が貫通孔７を一方の主面側から他方の主面側に通過してしまうのを確実に防ぐことができる。特に、キャピラリー基板３をＸ線等のエネルギー線を遮蔽する材料で構成している場合、遮蔽効果を確実なものとすることができる。
【００５９】
また、上記貫通孔７は、少なくとも一方の主面側の開口部が当該主面に対してその開口軸を傾斜されて形成されている。これにより、一方の主面側の開口部から当該主面に直交する方向に見て、他方の主面側の開口部が見通せ得ない貫通孔７の構成を、簡易に実現することができる。
【００６０】
また、本実施形態の電極基板１において、導電性部材１３は、貫通孔７の内壁に形成される第１の電極部分１３ａと、主面における貫通孔７の開口部外周に形成される第２の電極部分１３ｂとを含んでいる。これにより、導電性部材１３として、第２の電極部分１３ｂが主面における貫通孔７の開口部外周に形成されるので、導電性部材１３がキャピラリー基板３から外れてしまうのを防ぐことができる。
【００６１】
また、本実施形態の電極基板１において、導電性部材１３の第１の電極部分１３ａは、貫通孔７の内壁に形成されている。または、第１の電極部分１３ａは、貫通孔７内を充填して形成されている。第１の電極部分１３ａをこれらのうちの何れかの構成とすることにより、貫通孔７内に第１の電極部分１３ａを容易に形成することができる。
【００６２】
また、本実施形態の電極基板１において、導電性部材１３の第２の電極部分１３ｂは、互いに隣接する少なくとも２つの貫通孔７の開口部外周にわたって形成されている。これにより、キャピラリー基板３の主面上に第２の電極部分１３ｂを広く設けることができるので、電極基板１に電気的に接続される電子デバイスと導電性部材１３との相対位置精度を緩和することができる。
【００６３】
続いて、図７〜図１６に基づいて、本実施形態に係る電極基板の変形例の構成を説明する。
【００６４】
図７は、電極基板の変形例の構成を示す平面図である。図７に示された電極基板１においては、キャピラリー基板３の主面に垂直な方向から見て４角形状を呈したマルチチャンネル部材５が所定の方向に並設された列が隣接して複数列設けられており、上記マルチチャンネル部材５の複数列において、一方の列が隣接する他方の列に対して上記所定の方向にずれて配置されている。
【００６５】
図８は、電極基板の変形例の構成を示す平面図である。図７に示された電極基板１においては、外形が４角の縁部材１５の内側に、キャピラリー基板３の主面に垂直な方向から見て、４角形状を呈したマルチチャンネル部材５が互いに直交する２方向（図８における、左右方向及び上下方向）それぞれについて直線状に整列して配置されている。
【００６６】
図９（ａ）は電極基板の変形例の構成を示す平面図であり、図９（ｂ）は電極基板に含まれるマルチチャンネル部材の構成を示す平面図である。図１０は電極基板の要部拡大平面図である。図１１は電極基板の変形例の構成を示す平面図である。図９〜図１１に示された電極基板１においては、マルチチャンネル部材５が、キャピラリー基板３の主面に垂直な方向から見て３角形状（一辺の長さが、たとえば、１０００μｍ程度）を呈している。このマルチチャンネル部材５は、図９（ｂ）に示されるように、その外形がキャピラリー基板３の主面に垂直な方向から見て円形状（直径が、たとえば６μｍ程度）とされたガラス部材１７が、密に配置されている。たとえば、一辺に１４１体のガラス部材１７があるとすると、一つのマルチチャンネル部材５内に、１００１１体のガラス部材１７が配置されていることとなる。ガラス部材１７には、貫通用領域に貫通孔７が形成された第１のガラス部材、及び貫通用領域にガラス部材８を有する第２のガラス部材が含まれる。
【００６７】
また、図１０に示されるように、電極基板１には貫通孔７が所定のピッチで並設された列が隣接して複数列設けられており、貫通孔７の複数列において、一方の列が隣接する他方の列に対して貫通孔７の半ピッチずれて配置され、一方の列の貫通孔７の間に隣接する他方の列の貫通孔７が配置されている。この場合、導電性部材１３（１３ｂ）同士を隣接する列を跨いで電気的に接続する際に、直線状の配線パターン２１によって当該導電性部材１３同士を容易に接続することができる。
【００６８】
図１２は、電極基板の変形例の構成を示す平面図である。図１２に示された電極基板１においては、キャピラリー基板３の主面に垂直な方向から見て６角形状を呈したマルチチャンネル部材５が、２次元状に配置された状態で互いに融着されて一体形成されている。
【００６９】
図１３は、電極基板の変形例の構成を示す平面図であり、図１４は、電極基板の変形例における断面構成を示す図である。図１３及び図１４に示された電極基板１においては、複数の貫通孔のうちいずれかの貫通孔７ａについて、その孔径が他の貫通孔７ｂの孔径と異なる。この場合、孔径が大きい貫通孔７ａに設けられた導電性部材１３における抵抗損失を低減することができる。また、孔径が大きい貫通孔７ａ内に電気配線等を挿通することも可能となる。
【００７０】
図１５は、電極基板の変形例における断面構成を示す図である。図１５に示された電極基板１においては、貫通孔７は、他の貫通孔７の開口部との間隔が一方の主面側と他方の主面側とで異なるように形成されている。この場合、貫通孔７に設ける導電性部材（図示せず）のピッチを、一方の主面側と他方の主面側との間で拡大、縮小することができる。また、貫通孔７は、一方の主面側における開口部の孔径と他方の主面側における開口部の孔径とが異なっており、テーパ状に形成されている。
【００７１】
図１６は、電極基板の変形例の構成を示す平面図である。図１６に示された電極基板１においては、貫通孔７は、その開口部が４角形状を呈しており、主面に直交する方向から見て、互いに直交する２方向それぞれについて直線状に整列して配置されている。また、導電性部材１３の第２の電極部分１３ｂの外形も４角形状を呈している。この場合、貫通孔７に設けた導電性部材１３と、キャピラリー基板３に電気的に接続される電子デバイス（図示せず）の回路パターンとを容易に整合させることができる。
【００７２】
次に、図１７〜図２２に基づいて、電極基板の製造方法について説明する。
【００７３】
まず、図１７（ａ）に示されるように、コアガラス部分３３と当該コアガラス部分３３の周囲に設けられた被覆ガラス部分３５とを含む母材３１を用意する。この母材３１は、外径が４０〜４５ｍｍ程度であり、コアガラス部分３３の外径は２８ｍｍ〜３１ｍｍである。コアガラス部分３３は、酸溶解性ガラスからなり、被覆ガラス部分３５は、鉛ガラス、ソーダ石灰ガラス、コバールガラス、パイレックス（登録商標）ガラス等からなる。
【００７４】
次に、図１７（ｂ）に示されるように、上記母材３１を線引きして、ファイバ状のガラス部材（以下、シングルファイバと称する）３７を作製する。シングルファイバ３７の外径は、たとえば０．４ｍｍ程度である。
【００７５】
次に、図１７（ｃ）に示されるように、上記シングルファイバ３７を複数本束ねて所定の型３９に整列する。ここでは、シングルファイバ３７の中心軸方向から見て、６角形状を呈した型３９を用い、１万本程度のシングルファイバ３７を型積みする。これにより、シングルファイバ３７は、図１７（ｄ）に示されるように、その中心軸方向から見て６角形状となるように整列される。なお、シングルファイバ３７の中心軸方向から見て、３角形状あるいは４角形状を呈した型を用い、シングルファイバ３７を、その中心軸方向から見て３角形状あるいは４角形状となるように整列してもよい。
【００７６】
次に、図１７（ｅ）に示されるように、整列した状態でシングルファイバ３７の束を線引きして、マルチファイバ４１を作製する。マルチファイバ４１の外径は、たとえば０．７ｍｍ程度である。
【００７７】
次に、図１８（ａ）に示されるように、線引きしたマルチファイバ４１を所定のガラス管４３内に複数本整列して、納める。ガラス管４３の内径は、１００ｍｍ程度である。
【００７８】
次に、図１８（ｂ）に示されるように、ガラス管４３内に納められたマルチファイバ４１同士を加熱融着する。このとき、ガラス管４３の一方の端部に当該ガラス管より細いガラス管４５を接続し、ロータリーポンプ等で排気して内部の圧力を低下させる。加熱温度は、たとえば６００℃程度であり、内部の圧力は、０．５Ｐａ程度である。なお、ガラス管４３の他方の端部は封止されている。
【００７９】
以上の工程により、ガラス管４３内において複数のマルチファイバ４１が融着された状態の束状のガラス部材４７が形成されることとなる。
【００８０】
続いて、ガラス管４５、及び、封止していた部分を取り除いた後に、図１９（ａ）に示されるように、ガラス管４３の外周を砥石４９等により研磨して、束状のガラス部材４７の整形（外径出し）を行う。束状のガラス部材４７の外径出しは、外周研磨機を用いることができる。
【００８１】
そして、図１９（ｂ）に示されるように、束状のガラス部材４７を所望の厚みに切断する。このとき、束状のガラス部材４７をその中心軸に直交する軸ｌに対して斜め（所定の角度θを有する状態）に、スライサー５１で切断し、その後、切断面を研磨する。これらの工程により、図２０（ａ）及び（ｂ）に示されるように、板状のガラス部材５３が形成されることとなる。
【００８２】
続いて、図２０（ｃ）に示されるように、板状のガラス部材５３に所望パターンのマスク５４を設ける。ここで、マスク５４の所望パターンには、除去したいコアガラス部分５３に対応する部分に開口が設けられている。マスク５４としては、フォトリソグラフィ法により形成したレジスト層を用いるようにしてもよく、また、ニッケル等からなる蒸着マスクを用いるようにしてもよい。
【００８３】
次に、図２１（ａ）に示されるように、板状のガラス部材５３から一部のコアガラス部分３３を除去（芯抜き）する。このとき、ＨＮＯ₃あるいはＨＣｌを用い、エッチング技術によりマスク５４を介してコアガラス部分３３を除去する。そして、図２１（ｂ）に示されるように、マスク５４を除去する。これにより、板状のガラス部材５３を厚み方向に貫通する貫通孔７が複数形成された上記キャピラリー基板３が形成される。
【００８４】
次に、図２２（ａ）に示されるように、貫通孔７が複数形成された板状のガラス部材５３（キャピラリー基板３）に所望パターンのマスク５５を設ける。上記マスク５５としては、フォトリソグラフィ法により形成したレジスト層を用いるようにしてもよく、また、ニッケル等からなる蒸着マスクを用いるようにしてもよい。ここで、上記マスク５５の所望パターンにおける貫通孔７に対応する部分の開口面積は、貫通孔７の開口面積よりも大きく設定されている。
【００８５】
次に、図２２（ｂ）に示されるように、上記マスク５５を介して板状のガラス部材５３に導電性金属層（たとえば、ニッケル、アルミニウム、クロム、銅、銀、金、またはそれらの合金からなる）５７を形成する。導電性金属層５７は、蒸着（物理蒸着（ＰＶＤ）法、化学蒸着（ＣＶＤ）法）、めっき等により形成することができる。そして、図２２（ｃ）に示されるように、マスク５５を除去する。これらの工程により、板状のガラス部材５３の両主面間を電気的に導通する導電性部材１３（導電性金属層５７）、及び導電性部材１３の第２の電極部分１３ｂ同士を電気的に接続する配線パターン２１が設けられることとなる。なお、導電性部材１３は、図２２（ｃ）に示されるように、貫通孔７の内壁と当該貫通孔７の開口部外周とにわたって設けられる。
【００８６】
これらの工程により、上述した構成の電極基板１が製造されることとなる。
【００８７】
以上のように、上述した製造方法によれば、シングルファイバ（ファイバ状のガラス部材）３７が束ねられて形成された束状のガラス部材４７が所望の厚みに切断され、そして、一部の上記コアガラス部分３３が除去されることにより、板状のガラス部材５３に複数の貫通孔７が設けられることとなる。この結果、導電性部材１３を設けるための貫通孔７を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することが容易に行うことができる。また、電極基板１の主面上においてコアガラス部材３３が除去されない部分（ガラス部材８）上は平坦となり、導電性部材１３同士を電気的に互いに接続するための配線パターン２１を容易に設けることができる。
【００８８】
また、上述した製造方法において、束状のガラス部材４７を形成する工程では、シングルファイバ３７を複数本束ねて所定の型３９に整列し、整列した状態でシングルファイバ３７を線引きしてマルチファイバ４１を作製し、マルチファイバ４１を所定のガラス管４３内に複数本納め、マルチファイバ４１同士を加熱融着して、束状のガラス部材４７を形成している。これにより、極めて細径且つ多数のシングルファイバ３７にて束状のガラス部材４７を容易に構成することができる。
【００８９】
また、上述した製造方法において、束状のガラス部材４７を形成する工程では、所定の型３９により、シングルファイバ３７をその中心軸方向から見て３角形状、４角形状及び６角形状のうちのいずれかの形状となるように整列している。これにより、シングルファイバ３７が整列した状態で線引きされて作製されたマルチファイバ４１を所定のガラス管４３内に密に納めることができ、大面積化をより一層容易なものとすることができる。
【００９０】
また、上述した製造方法において、板状のガラス部材５３を形成する工程では、束状のガラス部材４７をその中心軸に直交する軸に対して斜めに切断している。これにより、貫通孔７の開口部の開口軸を板状のガラス部材５３の主面に対して傾斜して形成することが極めて容易に行える。
【００９１】
また、上述した製造方法において、貫通孔７を複数形成する工程では、板状のガラス部材５３に所望パターンのマスク５４を設け、マスク５４を介して一部のコアガラス部材３３を除去して、貫通孔を複数形成している。これにより、所望パターンのマスク５４によって覆われたコアガラス部分３３は除去されないので、所望のコアガラス部分３３のみを確実かつ容易に除去することができる。
【００９２】
また、上述した製造方法において、導電性部材１３を設ける工程では、当該導電性部材１３を貫通孔７の内壁と当該貫通孔７の開口部外周とにわたって設けている。これにより、当該導電性部材１３がキャピラリー基板３（貫通孔７が形成された板状のガラス部材５３）から外れてしまうのを防ぐことができる。
【００９３】
また、上述した製造方法において、導電性部材１３を設ける工程では、貫通孔７を複数形成した板状のガラス部材５３に所望パターンのマスク５５を設け、マスク５５を介して板状のガラス部材５３に導電性金属層５７を形成し、マスク５５を除去して、導電性部材１３を設けている。これにより、導電性部材１３を所望の貫通孔７に確実且つ容易に設けることができる。
【００９４】
また、上述した製造方法では、マスク５５の所望パターンにおける貫通孔７に対応する部分の開口面積は、貫通孔７の開口面積よりも大きく設定されている。これにより、導電性部材１３が貫通孔７の開口部外周にも設けられることとなり、当該導電性部材１３が板状のガラス部材５３から外れてしまうのを防ぐことができる。
【００９５】
なお、板状のガラス部材５３を形成する工程において、図２３（ａ）〜（ｂ）に示されるように、束状のガラス部材４７を加熱延伸し、外形がテーパ状となった部分を切断するようにしてもよい。この場合、貫通孔７（コアガラス部分３３）はその開口部の間隔が板状のガラス部材５３の一方の主面側と他方の主面側とで異なるように形成されることとなり、貫通孔７に設ける導電性部材（図示せず）のピッチを、一方の主面側と他方の主面側との間で拡大、縮小することができる。
【００９６】
また、導電性部材１３を設ける工程の前に、貫通孔７を複数形成した板状のガラス部材５３を加熱、冷却して、当該板状のガラス部材５３を強化ガラス化する工程を更に有していてもよい。この場合、複数の貫通孔７が形成された板状のガラス部材５３の強度を高めることができ、当該板状のガラス部材５３の破損等を防ぐことができる。
【００９７】
続いて、図５に示された、湾曲した貫通孔７を有する電極基板１の製造方法について説明する。
【００９８】
束状のガラス部材４７をその中心軸に直交する軸に対して斜めに切断した後、板状のガラス部材５３を両主面側からホットプレートで挟持して固定する。そして、ホットプレートを加熱（たとえば、５００℃程度）し、板状のガラス部材５３全体が略同じ温度で温まった後に、片側のホットプレートを所定の１軸方向、あるいは、両側のホットプレートを所定の１軸方向に逆方向にずらす。これらの工程により、湾曲した貫通孔７を有する板状のガラス部材５３が形成されることとなる。その後、上述したように導電性部材１３を設けることで、電極基板１が構成される。
【００９９】
【発明の効果】
以上、詳細に説明したように、本発明によれば、導電性部材を設けるための貫通孔を、より一層微細な孔径及びピッチで基板に形成し、しかも当該基板を大面積化及び薄型化することが容易に行うことが可能な電極基板及びその製造方法を提供することができる。
【図面の簡単な説明】
【図１】（ａ）は本実施形態に係る電極基板の構成を示す平面図であり、（ｂ）は本実施形態に係る電極基板に含まれるマルチチャンネル部材の構成を示す平面図であり、（ｃ）は本実施形態に係る電極基板に含まれるマルチチャンネル部材に含まれるガラス部材の構成を示す斜視図である。
【図２】本実施形態に係る電極基板に含まれるマルチチャンネル部材の要部拡大平面図である。
【図３】本実施形態に係る電極基板の断面構成を説明するための図である。
【図４】本実施形態に係る電極基板の断面構成を説明するための図である。
【図５】本実施形態に係る電極基板の断面構成を説明するための図である。
【図６】本実施形態に係る電極基板の断面構成を説明するための図である。
【図７】本実施形態に係る電極基板の変形例の構成を示す平面図である。
【図８】本実施形態に係る電極基板の変形例の構成を示す平面図である。
【図９】（ａ）は本実施形態に係る電極基板の変形例の構成を示す平面図であり、（ｂ）は本実施形態に係る電極基板に含まれるマルチチャンネル部材の構成を示す平面図である。
【図１０】本実施形態に係る電極基板の変形例に含まれるマルチチャンネル部材の要部拡大平面図である。
【図１１】本実施形態に係る電極基板の変形例の構成を示す平面図である。
【図１２】本実施形態に係る電極基板の変形例の構成を示す平面図である。
【図１３】本実施形態に係る電極基板の変形例に含まれるマルチチャンネル部材の要部拡大平面図である。
【図１４】本実施形態に係る電極基板の変形例における断面構成を説明するための図である。
【図１５】本実施形態に係る電極基板の変形例における断面構成を説明するための図である。
【図１６】本実施形態に係る電極基板の変形例に含まれるマルチチャンネル部材の要部拡大平面図である。
【図１７】（ａ）〜（ｅ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図１８】（ａ）及び（ｂ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図１９】（ａ）及び（ｂ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図２０】（ａ）〜（ｃ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図２１】（ａ）〜（ｂ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図２２】（ａ）〜（ｃ）は、本実施形態に係る電極基板の製造方法を説明するための図である。
【図２３】（ａ）〜（ｃ）は、本実施形態に係る電極基板の製造方法の変形例を説明するための図である。
【符号の説明】
１…電極基板、３…キャピラリー基板、５…マルチチャンネル部材、７，７ａ，７ｂ…貫通孔、８…ガラス部材、１０…貫通用領域、１１ａ…第１のガラス部材、１１ｂ…第２のガラス部材、１３…導電性部材、１３ａ…第１の電極部分、１３ｂ…第２の電極部分、１７…ガラス部材、３１…母材、３３…コアガラス部分、３５…被覆ガラス部分、３７…シングルファイバ、３９…型、４１…マルチファイバ、４３…ガラス管、４７…束状のガラス部材、５３…板状のガラス部材、５５…マスク、５７…導電性金属層。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrode substrate and a manufacturing method thereof.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an electrode in which a substrate made of an inorganic insulating material (for example, a glass substrate) is provided with fine holes reaching from the upper surface to the lower surface in the thickness direction and a columnar conductive member (conductor layer) in the fine holes. Substrates are known. (For example, refer to Patent Document 1.)
[0003]
[Patent Document 1]
JP-A-3-203341
[0004]
[Problems to be solved by the invention]
However, it is difficult to form through-holes for penetrating the substrate in the thickness direction and to provide a conductive member with a finer hole diameter and pitch, and to increase the area and thickness of the substrate. Yes, it was not easy to realize.
[0005]
The present invention has been made in view of the above-described points, and has a through hole for providing a conductive member formed on a substrate with a finer hole diameter and pitch, and further, the substrate has a large area and is thinned. An object of the present invention is to provide an electrode substrate and a method for manufacturing the same.
[0006]
[Means for Solving the Problems]
An electrode substrate according to the present invention includes a plurality of multichannel members having through holes, a capillary substrate integrally formed by fusion with the multichannel members arranged in a two-dimensional manner, and provided in the through holes. The multi-channel member is integrally formed by fusing a plurality of glass members having the first composition to each other on the main surface. A first glass member that has a triangular shape, a quadrangular shape, or a hexagonal shape as viewed from the vertical direction, and in which a through hole is formed in the penetrating region. And a second glass member having a glass member having a second composition different from the first composition in its penetrating region.
[0007]
The electrode substrate according to the present invention includes a plurality of multi-channel members having through-holes, the multi-channel members being two-dimensionally arranged and fused together to form a capillary substrate, and the through-holes And a conductive member that electrically conducts between both principal surfaces of the capillary substrate, and the multi-channel member is formed by fusing together a plurality of glass members having a first composition and having through holes. It is formed and has a triangular shape, a quadrangular shape or a hexagonal shape as viewed from the direction perpendicular to the main surface, and the first composition is formed in the through holes of some glass members. The glass member which consists of a 2nd composition different from this is filled.
[0008]
According to each of these electrode substrates according to the present invention, a plurality of through holes are provided in the multichannel member by fusing together and integrally forming a plurality of glass members having through holes. In addition, since the multichannel member has a triangular shape, a quadrangular shape, or a hexagonal shape as viewed from a direction perpendicular to the main surface, the multichannel member has a two-dimensional shape. In this state, they can be fused and integrally formed, thereby forming a capillary substrate. As a result, it is possible to easily form through holes for providing the conductive member in the substrate with a finer hole diameter and pitch, and to increase the area and thickness of the substrate. Further, by including the second glass member having the glass member of the second composition in the penetrating region, a flat and constant space is provided on the main surface of the electrode substrate. Alternatively, the glass member having the second composition is filled in the through holes of some of the glass members, so that a flat and constant space is provided on the main surface of the electrode substrate. Therefore, a wiring pattern for electrically connecting the conductive members to each other can be easily provided. Further, since the second composition is different from the first composition, a through-hole can be additionally provided by removing the glass member made of the second composition from the capillary substrate.
[0009]
The second composition is preferably a composition that can be removed from the capillary substrate by etching. In such a configuration, the glass member having the second composition can be easily removed from the capillary substrate by etching, so that a through-hole can be easily added.
[0010]
Also, the second composition is more HCl solution or HNO than the first composition. _Three It is preferable that the composition has a high dissolution rate in the solution. In such a configuration, the electrode substrate is made of HCl solution or HNO. _Three Since the glass member made of the second composition can be easily removed by immersing in the solution, a through-hole can be easily added and provided.
[0011]
In addition, SiO in the second composition ₂ The composition ratio of SiO in the first composition ₂ It is preferable that the composition ratio is smaller. When configured in this manner, the second composition has a higher dissolution rate in an acidic solution such as an HCl solution than the first composition, so that the glass member made of the second composition can be easily removed. The through hole can be easily added and provided.
[0012]
In addition, the electrode substrate according to the present invention is a bundle-like glass member formed by bundling a fiber-like glass member including a core glass portion and a coated glass portion provided around the core glass portion. A capillary substrate having a plurality of through-holes formed by cutting a glass member to a desired thickness and removing a part of the core glass portion, and an electrical connection between both main surfaces of the capillary substrate provided in the through-holes A conductive member that conducts electricity.
[0013]
In the electrode substrate according to the present invention, a bundle-like glass member formed by bundling fiber-like glass members is cut to a desired thickness, and the core glass portion is removed, whereby a plurality of capillaries are formed on the capillary substrate. Through-holes are provided. As a result, the through holes for providing the conductive member can be formed in the substrate with an even finer hole diameter and pitch, and the substrate can be easily increased in area and thickness. Further, by removing only a part of the core glass member, the portion on the main surface of the electrode substrate where the core glass member is not removed becomes flat, and a wiring pattern for electrically connecting the conductive members to each other is formed. It can be easily provided.
[0014]
Further, the through hole is preferably formed so that the opening on the other main surface side cannot be seen through from the opening on one main surface side in a direction orthogonal to the main surface. When comprised in this way, it can prevent reliably that energy rays, such as an X-ray, will pass through a through-hole from the one main surface side to the other main surface side.
[0015]
Moreover, it is preferable that the through-hole is formed so that the opening on at least one main surface side is inclined with respect to the main surface. When formed in this way, the configuration of the through-hole that cannot be seen through the opening on the other main surface when viewed from the opening on one main surface in the direction orthogonal to the main surface is easily realized. can do.
[0016]
Moreover, it is preferable that the through holes are formed so that the interval between the openings of the through holes is different between the one main surface side and the other main surface side. When formed in this way, the pitch of the conductive member provided in the through hole can be enlarged or reduced between one main surface side and the other main surface side.
[0017]
Moreover, it is preferable that an electroconductive member contains the 1st electrode part formed in a through-hole, and the 2nd electrode part formed in the opening part outer periphery of the through-hole in a main surface. When comprised in this way, since the 2nd electrode part is formed in the opening part outer periphery of the through-hole in a main surface as a conductive member, it can prevent that a conductive member remove | deviates from a capillary substrate.
[0018]
The first electrode portion is preferably formed on the inner wall of the through hole. Alternatively, the first electrode portion is preferably formed by filling the inside of the through hole. When configured as described above, the first electrode portion can be easily formed in the through hole.
[0019]
The second electrode portion is preferably formed over the outer periphery of the opening of at least two through holes adjacent to each other. In such a configuration, the second electrode portion can be widely provided on the main surface of the capillary substrate, so that the relative positional accuracy between the electronic device electrically connected to the electrode substrate and the conductive member is eased. be able to.
[0020]
The conductive member is preferably provided only in a desired through hole.
[0021]
The capillary substrate is preferably tempered glass by being heated and cooled. When comprised in this way, the intensity | strength of the capillary substrate in which the several through-hole was formed can be raised, and the failure | damage etc. of the said capillary substrate can be prevented.
[0022]
Moreover, it is preferable that the through-hole has a quadrangular opening and is arranged in two directions orthogonal to each other when viewed from the direction orthogonal to the main surface. When comprised in this way, the electroconductive member provided in the through-hole and the circuit pattern of the electronic device electrically connected to a capillary substrate can be matched easily.
[0023]
Moreover, it is preferable that the through-hole has a circular opening and is arranged side by side in two directions orthogonal to each other when viewed from the direction orthogonal to the main surface. When comprised in this way, the electroconductive member provided in the through-hole and the circuit pattern of the electronic device electrically connected to a capillary substrate can be matched easily.
[0024]
In addition, it is preferable that any of the plurality of through holes has a hole diameter different from that of the other through holes. When comprised in this way, the resistance loss in the electroconductive member provided in the through-hole with a large hole diameter can be reduced. In addition, it is possible to insert an electric wiring or the like into the through hole having a large hole diameter.
[0025]
Further, a plurality of rows in which through holes are arranged in parallel at a predetermined pitch are provided adjacent to each other, and in the plurality of rows of through holes, one row is shifted by a half pitch of the other row adjacent to the other row. It is preferable that the through holes of the other row are arranged between the through holes of one row. When comprised in this way, when electrically connecting the electroconductive members provided in a through-hole across the adjacent row | line | column, the said electroconductive members can be easily connected by linear wiring.
[0026]
In addition, the multichannel member preferably has a quadrangular shape as viewed from a direction perpendicular to the main surface, and is preferably arranged in a straight line in each of two directions orthogonal to each other. The multichannel member has a quadrangular shape when viewed from a direction perpendicular to the main surface, and a plurality of rows in which the multichannel members are arranged in a predetermined direction are provided adjacent to each other. In a plurality of rows, it is preferable that one row is arranged shifted in a predetermined direction with respect to the other row adjacent thereto.
[0027]
On the other hand, in the method for manufacturing an electrode substrate according to the present invention, a fiber glass member including a core glass portion and a coated glass portion provided around the core glass portion is bundled to form a bundle glass member. Cutting the bundle-shaped glass member into a desired thickness to form a plate-shaped glass member; removing a part of the core glass portion from the plate-shaped glass member; A step of forming a plurality of through holes penetrating the member in the thickness direction, and a step of providing a conductive member in the through hole that electrically conducts between both main surfaces of the plate-like glass member. Yes.
[0028]
In the electrode substrate manufacturing method according to the present invention, a bundle-like glass member formed by bundling fiber-like glass members is cut to a desired thickness, and a part of the core glass portion is removed. Thus, a plurality of through holes are provided in the plate-like glass portion. As a result, the through holes for providing the conductive member can be formed in the substrate with an even finer hole diameter and pitch, and the substrate can be easily increased in area and thickness. Further, by removing only a part of the core glass member, the portion on the main surface of the electrode substrate where the core glass member is not removed becomes flat, and a wiring pattern for electrically connecting the conductive members to each other is formed. It can be easily provided.
[0029]
Further, in the step of forming a bundle-like glass member, a plurality of fiber-like glass members are bundled and aligned in a predetermined mold, and the fiber-like glass member is drawn in the aligned state, and the drawn fiber-like glass is drawn. It is preferable to place a plurality of members in a predetermined glass tube and heat-fuse the fiber-shaped glass members to form a bundle-shaped glass member. In this case, a bundle-shaped glass member can be easily configured with an extremely small-diameter and fiber-shaped glass member.
[0030]
Further, in the step of forming the bundle-shaped glass member, the fiber-shaped glass member is viewed from the central axis direction according to a predetermined mold, and has any one of a triangular shape, a quadrangular shape, and a hexagonal shape. It is preferable to arrange so that it becomes. In this case, the fiber-like glass members drawn in an aligned state can be closely packed in a predetermined glass tube, and the area can be further increased.
[0031]
In the step of forming the plate-like glass member, it is preferable that the bundle-like glass member is cut obliquely with respect to an axis orthogonal to the central axis. In this case, it is very easy to form the opening axis of the opening of the through hole so as to be inclined with respect to the main surface of the plate-like glass member.
[0032]
Further, in the step of forming the plate-shaped glass member, it is preferable to heat-stretch the bundle-shaped glass member and cut the portion whose outer shape is tapered. In this case, the through hole is formed so that the interval between the openings is different between the one main surface side and the other main surface side of the plate-like glass member, and the pitch of the conductive member provided in the through hole. Can be enlarged or reduced between one main surface side and the other main surface side.
[0033]
In the step of forming a plurality of through holes, it is preferable to form a plurality of through holes by providing a mask having a desired pattern on a plate-like glass member and removing a part of the core glass portion through the mask. In this case, since the core glass portion covered with the mask having the desired pattern is not removed, only the desired core glass portion can be reliably and easily removed.
[0034]
Moreover, it is preferable to further have the process of heating and cooling the plate-shaped glass member in which the several through-hole was formed, and tempering the plate-shaped glass member before the process of providing a conductive member. In this case, the strength of the plate-like glass member in which a plurality of through holes are formed can be increased, and damage to the plate-like glass member can be prevented.
[0035]
In the step of providing a conductive member, the conductive member is preferably provided in the through hole and the outer periphery of the opening of the through hole. In this case, it is possible to prevent the conductive member from being detached from the plate-like glass member.
[0036]
In the step of providing a conductive member, a mask having a desired pattern is provided on a plate-like glass member having a plurality of through holes, a conductive metal layer is formed on the plate-like glass member via the mask, and the mask is removed. Thus, it is preferable to provide a conductive member. In this case, the conductive member can be reliably and easily provided in a desired through hole.
[0037]
Moreover, it is preferable that the opening area of the part corresponding to the through-hole in a desired pattern is set larger than the opening area of a through-hole. In this case, the conductive member can be reliably and easily provided in the through hole and the outer periphery of the opening of the through hole.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of an electrode substrate and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.
[0039]
First, the configuration of the electrode substrate will be described with reference to FIGS. FIG. 1A is a plan view showing the configuration of the electrode substrate, and FIG. 1B is a plan view showing the configuration of the multi-channel member included in the electrode substrate. FIG. 1C and FIG. ) Is a perspective view showing a configuration of a glass member included in the multi-channel member. FIG. 2 is an enlarged plan view of a main part of the multichannel member, and FIG. 3 is a view for explaining a cross-sectional configuration of the electrode substrate. 1A to 1D, illustration of the conductive member is omitted for the sake of explanation.
[0040]
The electrode substrate 1 has a capillary substrate 3 as shown in FIG. The capillary substrate 3 includes a plurality of multichannel members 5 having a plurality of through holes 7. The multi-channel member 5 is integrally formed by being fused to each other in a two-dimensional arrangement inside an edge member 9 made of glass.
[0041]
As shown in FIGS. 1B to 1D, the multichannel member 5 is formed by fusing together a plurality of first glass members 11 a and second glass members 11 b, and the capillary substrate 3. A quadrangular shape (for example, about 1000 μm × 1000 μm) is viewed from a direction perpendicular to the main surface of the substrate. Further, the multi-channel member 5 is arranged linearly in each of two directions orthogonal to each other when viewed from a direction perpendicular to the main surface of the capillary substrate 3.
[0042]
The first glass member 11a and the second glass member 11b have a first composition. Examples of the glass member having the first composition include lead glass, soda lime glass, Kovar glass, and Pyrex. (Registered trademark) Glass or the like. The first glass member 11a and the second glass member 11b are arranged in a straight line in each of two directions orthogonal to each other when viewed from the direction perpendicular to the main surface of the capillary substrate 3 in the multichannel member 5. Has been. The outer shape of the first glass member 11a and the second glass member 11b has a quadrangular shape (for example, about 14 μm × 14 μm) when viewed from the direction perpendicular to the main surface of the capillary substrate 3. Each of the first glass member 11a and the second glass member 11b has a columnar penetrating region 10 therein as shown in FIGS. 1 (c) and (d).
[0043]
In the first glass member 11a, as shown in FIG. 1 (c), a through hole 7 is formed in the through region 10. Moreover, the 2nd glass member 11b has the glass member 8 in the area | region 10 for penetration, as FIG.1 (d) shows. In other words, in the second glass member 11b, the glass member 8 is filled in the through hole. The glass member 8 has a second composition different from the first composition. As the glass member having the second composition, for example, a glass member having a composition that can be removed from the capillary substrate 3 by a method such as etching is used. As a specific example, as a specific example of the second composition, an HCl solution or HNO rather than the first composition. _Three The composition may be such that the dissolution rate in the solution is increased. For example, such second composition includes SiO 2 ₂ The composition ratio of SiO in the glass member having the first composition is ₂ A composition smaller than the composition ratio is preferable.
[0044]
The opening of the through hole 7 has a circular shape. The inner diameter of the through hole 7 is, for example, about 6 μm, and the distance (pitch) between the adjacent through hole 7 or the glass member 8 is, for example, about 8 μm. As shown in FIG. 3, the through hole 7 has a central axis extending in a direction perpendicular to the main surface of the capillary substrate 3. Moreover, the both end surfaces of the glass member 8 are exhibiting circular shape. The dimension of the glass member 8 is substantially the same as the dimension of the through hole 7.
[0045]
As shown in FIG. 4, the through-hole 7 cannot be seen through the opening on the other main surface side when viewed from the opening on one main surface side of the capillary substrate 3 in the direction orthogonal to the main surface. You may form as follows. In FIG. 4, the through hole 7 is formed such that the opening on one main surface side is inclined with respect to the main surface, and the opening on one main surface side and the other main surface The opening on the side is provided with a larger offset than the pitch of the through holes 7.
[0046]
In addition, the through-hole 7 should just be formed so that the opening part of the at least one main surface side may incline the opening axis with respect to the said main surface. For example, as shown in FIG. 5, the through-hole 7 may be formed to be curved, and the opening axis of the opening on the other main surface side is formed so as to be orthogonal to the main surface. Also good.
[0047]
The electrode substrate 1 has a conductive member 13 as shown in FIGS. 2 and 3. The conductive member 13 is provided only in a desired through hole 7 and electrically conducts between both main surfaces of the capillary substrate 3. The conductive member 13 is made of nickel, aluminum, chromium, copper, silver, gold, or an alloy thereof, and includes a first electrode portion 13a and a second electrode portion 13b.
[0048]
The first electrode portion 13 a is formed in the through hole 7. For example, as shown in FIG. 3, the first electrode portion 13 a is formed on the inner wall of the through hole 7. Alternatively, as shown in FIG. 6, the first electrode portion 13 a may be formed by filling the through hole 7. The second electrode portion 13 b is continuous with the first electrode portion 13 a and is formed on the outer periphery of the opening of the through hole 7 in the main surface of the capillary substrate 3. Alternatively, the second electrode portion is continuous with the first electrode portion, and is formed over the outer periphery of the opening of at least two through holes 7 adjacent to each other.
[0049]
Moreover, the electrode substrate 1 has a wiring pattern 21 as shown in FIGS. The wiring pattern 21 electrically connects the second electrode portions 13 b to each other on the main surface of the capillary substrate 3. The wiring pattern 21 is provided on the main surface of the capillary substrate 3.
[0050]
As shown in FIG. 2, the through holes 7 are arranged side by side in two directions orthogonal to each other when viewed from the direction orthogonal to the main surface. In this case, the conductive member 13 provided in the through hole 7 and the circuit pattern of an electronic device (not shown) electrically connected to the capillary substrate 3 can be easily aligned.
[0051]
As described above, in the electrode substrate 1 of the present embodiment, the through hole 7 is provided in the through region 10 of the first glass member 11a. A plurality of through holes 7 are provided in the multichannel member 5 by fusing together a plurality of first glass members 11a and second glass members 11b. Further, since the multi-channel member 5 has a quadrangular shape when viewed from the direction perpendicular to the main surface, the multi-channel member 5 is fused and integrally formed in a two-dimensional arrangement. As a result, the capillary substrate 3 is configured. As a result, the through holes 7 for providing the conductive member 13 can be easily formed in the substrate 1 with a finer hole diameter and pitch, and the substrate 1 can be easily increased in area and thickness. it can.
[0052]
Moreover, in the electrode substrate 1 of this embodiment, the 2nd glass member 11b has the glass member 8 in the area | region 10 for penetration. In other words, in the second glass member 11b, the glass member 8 is filled in the through hole. The second glass member 11 b is not provided with the conductive member 13 and is also filled with the through hole 7, so that a flat and constant space is provided on the main surface of the electrode substrate 1. By using this space for the wiring pattern 21, the wiring pattern 21 for electrically connecting the second electrode portions 13b of the conductive member 13 to each other can be easily provided.
[0053]
Moreover, in the electrode substrate 1 of this embodiment, the glass member 8 consists of a 2nd composition different from a 1st glass composition. With this configuration, by removing the desired glass member 8 from the capillary substrate 3, the through holes 7 can be additionally provided with a fine hole diameter and pitch.
[0054]
Further, in the electrode substrate 1 of the present embodiment, since the plurality of through holes 7 are formed, the electrode substrate 1 itself functions as a member having a heat insulating effect and can be reduced in weight. Further, since the multichannel member 5 having a quadrangular shape is two-dimensionally arranged, the directionality of the electrode substrate 1 can be easily identified based on the arrangement of the multichannel member 5. Further, a plurality of first glass members 11a and a second glass member 11b are fused together to form a multichannel member 5, and further, the multichannel members 5 are fused together to form a capillary substrate 3. As a result, the mechanical strength of the electrode substrate 1 is increased, and damage to the substrate 1 itself can be suppressed. Moreover, if the 2nd glass member 11b is used for the part which does not need to provide the electroconductive member 13 in the electrode substrate 1, energy rays, such as an X-ray, will be from the one main surface side of the electrode substrate 1 to the other main surface side. Can be prevented from passing through.
[0055]
In the electrode substrate 1 of the present embodiment, the second composition is a composition that can be removed from the capillary substrate 3 by etching. As a result, the desired glass member 8 having the second composition can be easily removed from the capillary substrate 3 by etching, so that the through holes 7 can be easily additionally provided with a fine hole diameter and pitch.
[0056]
Further, in the electrode substrate 1 of the present embodiment, the second composition is more HCl solution or HNO than the first glass composition. _Three The composition has a high dissolution rate in the solution. Thereby, HCl solution or HNO _Three Since the desired glass member 8 having the second composition can be easily removed by immersing the electrode substrate 1 in the solution, the through holes 7 can be easily additionally provided with a fine hole diameter and pitch. .
[0057]
Further, in the electrode substrate 1 of the present embodiment, SiO in the second composition ₂ The composition ratio of SiO in the first composition is ₂ It is good to make it smaller than the composition ratio. SiO contained in glass members ₂ When the composition ratio is small, the dissolution rate of the glass member in an acidic solution such as an HCl solution is increased. By configuring the electrode substrate 1 in this way, the glass member 8 dissolves faster in the acidic solution such as the HCl solution than the portion other than the glass member 8 of the second glass member 11b. Thereby, the desired glass member 8 can be easily removed, and the through holes 7 can be easily added with a fine hole diameter and pitch.
[0058]
Further, in the electrode substrate 1 of the present embodiment, the through hole 7 is formed so that the opening on the other main surface side cannot be seen through from the opening on one main surface side in a direction orthogonal to the main surface. Has been. Thereby, energy rays such as X-rays can be reliably prevented from passing through the through hole 7 from one main surface side to the other main surface side. In particular, when the capillary substrate 3 is made of a material that shields energy rays such as X-rays, the shielding effect can be ensured.
[0059]
The through hole 7 is formed such that at least one main surface side opening is inclined with respect to the main surface. Thereby, the configuration of the through-hole 7 in which the opening on the other main surface side cannot be seen through when viewed from the opening on one main surface side in a direction orthogonal to the main surface can be easily realized.
[0060]
In the electrode substrate 1 of the present embodiment, the conductive member 13 includes a first electrode portion 13a formed on the inner wall of the through hole 7 and a second electrode formed on the outer periphery of the opening of the through hole 7 on the main surface. Electrode portion 13b. Thereby, since the 2nd electrode part 13b is formed in the opening part outer periphery of the through-hole 7 in the main surface as the electroconductive member 13, it can prevent that the electroconductive member 13 remove | deviates from the capillary substrate 3. FIG. .
[0061]
In the electrode substrate 1 of the present embodiment, the first electrode portion 13 a of the conductive member 13 is formed on the inner wall of the through hole 7. Alternatively, the first electrode portion 13 a is formed by filling the through hole 7. By configuring the first electrode portion 13a as any one of these, the first electrode portion 13a can be easily formed in the through hole 7.
[0062]
In the electrode substrate 1 of the present embodiment, the second electrode portion 13b of the conductive member 13 is formed over the outer periphery of the opening of at least two through holes 7 adjacent to each other. Accordingly, since the second electrode portion 13b can be widely provided on the main surface of the capillary substrate 3, the relative positional accuracy between the electronic device electrically connected to the electrode substrate 1 and the conductive member 13 is relaxed. be able to.
[0063]
Subsequently, a configuration of a modified example of the electrode substrate according to the present embodiment will be described with reference to FIGS.
[0064]
FIG. 7 is a plan view showing a configuration of a modified example of the electrode substrate. In the electrode substrate 1 shown in FIG. 7, there are a plurality of adjacent rows in which multichannel members 5 each having a quadrangular shape as viewed from a direction perpendicular to the main surface of the capillary substrate 3 are arranged in parallel in a predetermined direction. A plurality of rows of the multi-channel member 5 is provided, and one row is arranged so as to be shifted in the predetermined direction with respect to the other adjacent row.
[0065]
FIG. 8 is a plan view showing a configuration of a modified example of the electrode substrate. In the electrode substrate 1 shown in FIG. 7, the multi-channel members 5 having a quadrangular shape as viewed from the direction perpendicular to the main surface of the capillary substrate 3 are disposed inside the edge member 15 having a quadrangular outer shape. The two orthogonal directions (left and right direction and up and down direction in FIG. 8) are arranged in a straight line.
[0066]
FIG. 9A is a plan view showing a configuration of a modified example of the electrode substrate, and FIG. 9B is a plan view showing a configuration of a multichannel member included in the electrode substrate. FIG. 10 is an enlarged plan view of the main part of the electrode substrate. FIG. 11 is a plan view showing a configuration of a modified example of the electrode substrate. In the electrode substrate 1 shown in FIGS. 9 to 11, the multichannel member 5 has a triangular shape (the length of one side is about 1000 μm, for example) when viewed from the direction perpendicular to the main surface of the capillary substrate 3. Presents. As shown in FIG. 9B, the multi-channel member 5 has a glass member 17 whose outer shape is circular (diameter is, for example, about 6 μm) when viewed from the direction perpendicular to the main surface of the capillary substrate 3. However, they are closely arranged. For example, if there are 141 glass members 17 on one side, 10011 glass members 17 are arranged in one multichannel member 5. The glass member 17 includes a first glass member in which the through hole 7 is formed in the penetrating region and a second glass member having the glass member 8 in the penetrating region.
[0067]
As shown in FIG. 10, the electrode substrate 1 is provided with a plurality of rows in which the through holes 7 are arranged in parallel at a predetermined pitch, and one row of the plurality of rows of the through holes 7 is provided. Are arranged so as to be shifted by a half pitch of the through holes 7 with respect to the other adjacent row, and the through holes 7 of the other adjacent row are arranged between the through holes 7 of one row. In this case, when the conductive members 13 (13 b) are electrically connected across adjacent columns, the conductive members 13 can be easily connected by the linear wiring pattern 21.
[0068]
FIG. 12 is a plan view showing a configuration of a modified example of the electrode substrate. In the electrode substrate 1 shown in FIG. 12, the multi-channel members 5 having a hexagonal shape as viewed from the direction perpendicular to the main surface of the capillary substrate 3 are fused to each other in a two-dimensional arrangement. Are integrally formed.
[0069]
FIG. 13 is a plan view showing a configuration of a modified example of the electrode substrate, and FIG. 14 is a diagram showing a cross-sectional configuration of the modified example of the electrode substrate. In the electrode substrate 1 shown in FIGS. 13 and 14, the hole diameter of any one of the plurality of through holes is different from the diameter of the other through holes 7 b. In this case, the resistance loss in the conductive member 13 provided in the through hole 7a having a large hole diameter can be reduced. It is also possible to insert an electric wiring or the like into the through hole 7a having a large hole diameter.
[0070]
FIG. 15 is a diagram showing a cross-sectional configuration in a modified example of the electrode substrate. In the electrode substrate 1 shown in FIG. 15, the through hole 7 is formed such that the distance from the opening of the other through hole 7 is different between one main surface side and the other main surface side. In this case, the pitch of the conductive members (not shown) provided in the through holes 7 can be enlarged or reduced between one main surface side and the other main surface side. The through-hole 7 is formed in a taper shape in which the hole diameter of the opening on one main surface side is different from the hole diameter of the opening on the other main surface side.
[0071]
FIG. 16 is a plan view showing a configuration of a modified example of the electrode substrate. In the electrode substrate 1 shown in FIG. 16, the opening of the through hole 7 has a quadrangular shape and is aligned linearly in each of two directions orthogonal to each other when viewed from the direction orthogonal to the main surface. Are arranged. The outer shape of the second electrode portion 13b of the conductive member 13 is also a quadrangular shape. In this case, the conductive member 13 provided in the through hole 7 and the circuit pattern of an electronic device (not shown) electrically connected to the capillary substrate 3 can be easily aligned.
[0072]
Next, based on FIGS. 17-22, the manufacturing method of an electrode substrate is demonstrated.
[0073]
First, as shown in FIG. 17A, a base material 31 including a core glass portion 33 and a covering glass portion 35 provided around the core glass portion 33 is prepared. The base material 31 has an outer diameter of about 40 to 45 mm, and the outer diameter of the core glass portion 33 is 28 mm to 31 mm. The core glass portion 33 is made of acid-soluble glass, and the coated glass portion 35 is lead glass, soda lime glass, Kovar glass, Pyrex. (Registered trademark) Made of glass or the like.
[0074]
Next, as shown in FIG. 17B, the base material 31 is drawn to produce a fiber-shaped glass member (hereinafter referred to as a single fiber) 37. The outer diameter of the single fiber 37 is, for example, about 0.4 mm.
[0075]
Next, as shown in FIG. 17C, a plurality of the single fibers 37 are bundled and aligned with a predetermined mold 39. Here, a mold 39 having a hexagonal shape as viewed from the central axis direction of the single fiber 37 is used, and about 10,000 single fibers 37 are stacked. Thereby, as shown in FIG. 17D, the single fibers 37 are aligned so as to have a hexagonal shape when viewed from the central axis direction. A single fiber 37 having a triangular shape or a quadrangular shape as viewed from the central axis direction is used so that the single fiber 37 has a triangular shape or a rectangular shape as viewed from the central axis direction. You may align.
[0076]
Next, as shown in FIG. 17 (e), a bundle of single fibers 37 is drawn in an aligned state to produce a multi-fiber 41. The outer diameter of the multifiber 41 is, for example, about 0.7 mm.
[0077]
Next, as shown in FIG. 18A, a plurality of drawn multi-fibers 41 are arranged in a predetermined glass tube 43 and stored. The inner diameter of the glass tube 43 is about 100 mm.
[0078]
Next, as shown in FIG. 18B, the multi-fibers 41 housed in the glass tube 43 are heat-sealed. At this time, a glass tube 45 thinner than the glass tube is connected to one end portion of the glass tube 43, and exhausted by a rotary pump or the like to reduce the internal pressure. The heating temperature is, for example, about 600 ° C., and the internal pressure is about 0.5 Pa. The other end of the glass tube 43 is sealed.
[0079]
Through the above steps, a bundle-like glass member 47 in a state where a plurality of multi-fibers 41 are fused in the glass tube 43 is formed.
[0080]
Subsequently, after removing the glass tube 45 and the sealed portion, the outer periphery of the glass tube 43 is polished with a grindstone 49 or the like as shown in FIG. 47 is shaped (outside diameter out). An outer peripheral grinder can be used to obtain the outer diameter of the bundle-shaped glass member 47.
[0081]
Then, as shown in FIG. 19B, the bundle-shaped glass member 47 is cut to a desired thickness. At this time, the bundle-like glass member 47 is cut with the slicer 51 obliquely (in a state having a predetermined angle θ) with respect to the axis 1 orthogonal to the central axis, and then the cut surface is polished. By these steps, as shown in FIGS. 20A and 20B, a plate-like glass member 53 is formed.
[0082]
Subsequently, as shown in FIG. 20C, a mask 54 having a desired pattern is provided on the plate-like glass member 53. Here, the desired pattern of the mask 54 is provided with an opening in a portion corresponding to the core glass portion 53 to be removed. As the mask 54, a resist layer formed by a photolithography method may be used, or a vapor deposition mask made of nickel or the like may be used.
[0083]
Next, as shown in FIG. 21A, a part of the core glass portion 33 is removed (centered) from the plate-like glass member 53. At this time, HNO _Three Alternatively, the core glass portion 33 is removed through the mask 54 by etching technique using HCl. Then, as shown in FIG. 21B, the mask 54 is removed. Thereby, the said capillary substrate 3 in which the through-hole 7 which penetrates the plate-shaped glass member 53 in the thickness direction was formed in multiple numbers is formed.
[0084]
Next, as shown in FIG. 22A, a mask 55 having a desired pattern is provided on a plate-like glass member 53 (capillary substrate 3) in which a plurality of through holes 7 are formed. As the mask 55, a resist layer formed by a photolithography method may be used, or a vapor deposition mask made of nickel or the like may be used. Here, the opening area of the portion corresponding to the through hole 7 in the desired pattern of the mask 55 is set larger than the opening area of the through hole 7.
[0085]
Next, as shown in FIG. 22B, a conductive metal layer (for example, nickel, aluminum, chromium, copper, silver, gold, or an alloy thereof) is formed on the plate-like glass member 53 through the mask 55. 57) is formed. The conductive metal layer 57 can be formed by vapor deposition (physical vapor deposition (PVD) method, chemical vapor deposition (CVD) method), plating, or the like. Then, as shown in FIG. 22C, the mask 55 is removed. Through these steps, the conductive member 13 (conductive metal layer 57) that electrically connects between both main surfaces of the plate-like glass member 53 and the second electrode portions 13b of the conductive member 13 are electrically connected. A wiring pattern 21 to be connected to is provided. The conductive member 13 is provided across the inner wall of the through hole 7 and the outer periphery of the opening of the through hole 7 as shown in FIG.
[0086]
Through these steps, the electrode substrate 1 having the above-described configuration is manufactured.
[0087]
As described above, according to the manufacturing method described above, a bundle-like glass member 47 formed by bundling single fibers (fiber-like glass members) 37 is cut to a desired thickness, and a part of the above-mentioned By removing the core glass portion 33, the plurality of through holes 7 are provided in the plate-like glass member 53. As a result, the through holes 7 for providing the conductive member 13 can be easily formed in the substrate with a finer hole diameter and pitch, and the substrate can be easily increased in area and thickness. Further, the portion (glass member 8) where the core glass member 33 is not removed is flat on the main surface of the electrode substrate 1, and the wiring pattern 21 for electrically connecting the conductive members 13 to each other can be easily provided. Can do.
[0088]
Further, in the manufacturing method described above, in the step of forming the bundle-shaped glass member 47, a plurality of single fibers 37 are bundled and aligned with a predetermined mold 39, and the single fibers 37 are drawn in the aligned state to draw the multi-fiber 41. A plurality of multi-fibers 41 are accommodated in a predetermined glass tube 43, and the multi-fibers 41 are heated and fused together to form a bundle-shaped glass member 47. As a result, the bundle-shaped glass member 47 can be easily configured with a large number of single fibers 37 having a very small diameter.
[0089]
Further, in the manufacturing method described above, in the step of forming the bundle-shaped glass member 47, among the triangular shape, the quadrangular shape, and the hexagonal shape when the single fiber 37 is viewed from the central axis direction by the predetermined die 39. They are aligned so as to have either shape. As a result, the multi-fiber 41 produced by drawing the single fibers 37 in an aligned state can be closely packed in the predetermined glass tube 43, and the area can be further increased.
[0090]
In the manufacturing method described above, in the step of forming the plate-like glass member 53, the bundle-like glass member 47 is cut obliquely with respect to an axis orthogonal to the central axis. Thereby, it is very easy to form the opening axis of the opening of the through-hole 7 so as to be inclined with respect to the main surface of the plate-like glass member 53.
[0091]
In the manufacturing method described above, in the step of forming a plurality of through holes 7, a mask 54 having a desired pattern is provided on the plate-like glass member 53, and a part of the core glass member 33 is removed through the mask 54. A plurality of through holes are formed. Thereby, since the core glass part 33 covered with the mask 54 of the desired pattern is not removed, only the desired core glass part 33 can be removed reliably and easily.
[0092]
In the above-described manufacturing method, in the step of providing the conductive member 13, the conductive member 13 is provided across the inner wall of the through hole 7 and the outer periphery of the opening of the through hole 7. Thereby, it can prevent that the said electroconductive member 13 remove | deviates from the capillary substrate 3 (plate-shaped glass member 53 in which the through-hole 7 was formed).
[0093]
In the manufacturing method described above, in the step of providing the conductive member 13, a mask 55 having a desired pattern is provided on the plate-like glass member 53 in which a plurality of through holes 7 are formed, and the plate-like glass member 53 is interposed via the mask 55. Then, the conductive metal layer 57 is formed, the mask 55 is removed, and the conductive member 13 is provided. Thereby, the conductive member 13 can be reliably and easily provided in the desired through hole 7.
[0094]
In the manufacturing method described above, the opening area of the portion corresponding to the through hole 7 in the desired pattern of the mask 55 is set larger than the opening area of the through hole 7. Thereby, the conductive member 13 is also provided on the outer periphery of the opening of the through hole 7, and the conductive member 13 can be prevented from being detached from the plate-like glass member 53.
[0095]
In the step of forming the plate-like glass member 53, as shown in FIGS. 23 (a) to 23 (b), the bundle-like glass member 47 is heated and stretched, and the portion whose outer shape is tapered is cut. You may make it do. In this case, the through-hole 7 (core glass portion 33) is formed so that the interval between the openings is different between one main surface side and the other main surface side of the plate-like glass member 53. The pitch of the conductive member (not shown) provided in 7 can be enlarged or reduced between one main surface side and the other main surface side.
[0096]
In addition, before the step of providing the conductive member 13, the method further includes a step of heating and cooling the plate-like glass member 53 in which a plurality of through holes 7 are formed, and tempering the plate-like glass member 53. It may be. In this case, the strength of the plate-like glass member 53 in which the plurality of through holes 7 are formed can be increased, and damage to the plate-like glass member 53 can be prevented.
[0097]
Next, a method for manufacturing the electrode substrate 1 having the curved through hole 7 shown in FIG. 5 will be described.
[0098]
After the bundle-like glass member 47 is cut obliquely with respect to the axis orthogonal to the central axis, the plate-like glass member 53 is sandwiched and fixed by hot plates from both main surface sides. Then, after the hot plate is heated (for example, about 500 ° C.) and the entire plate-like glass member 53 is heated at substantially the same temperature, the hot plate on one side is set in a predetermined uniaxial direction or the hot plates on both sides are set in predetermined. Shift in the opposite direction to one axis direction. Through these steps, a plate-like glass member 53 having a curved through hole 7 is formed. Thereafter, the electrode substrate 1 is configured by providing the conductive member 13 as described above.
[0099]
【The invention's effect】
As described above in detail, according to the present invention, through holes for providing a conductive member are formed in a substrate with an even finer hole diameter and pitch, and the substrate is increased in area and thickness. Thus, it is possible to provide an electrode substrate and a method for manufacturing the same.
[Brief description of the drawings]
FIG. 1A is a plan view showing a configuration of an electrode substrate according to the present embodiment, and FIG. 1B is a plan view showing a configuration of a multichannel member included in the electrode substrate according to the embodiment; (C) is a perspective view which shows the structure of the glass member contained in the multichannel member contained in the electrode substrate which concerns on this embodiment.
FIG. 2 is an enlarged plan view of a main part of a multichannel member included in the electrode substrate according to the embodiment.
FIG. 3 is a view for explaining a cross-sectional configuration of an electrode substrate according to the present embodiment.
FIG. 4 is a view for explaining a cross-sectional configuration of an electrode substrate according to the present embodiment.
FIG. 5 is a view for explaining a cross-sectional configuration of the electrode substrate according to the embodiment.
FIG. 6 is a view for explaining a cross-sectional configuration of an electrode substrate according to the present embodiment.
FIG. 7 is a plan view showing a configuration of a modification of the electrode substrate according to the present embodiment.
FIG. 8 is a plan view showing a configuration of a modification of the electrode substrate according to the present embodiment.
9A is a plan view showing a configuration of a modified example of the electrode substrate according to the present embodiment, and FIG. 9B is a plan view showing a configuration of a multichannel member included in the electrode substrate according to the embodiment. It is.
FIG. 10 is an enlarged plan view of a main part of a multichannel member included in a modification of the electrode substrate according to the embodiment.
FIG. 11 is a plan view showing a configuration of a modification of the electrode substrate according to the present embodiment.
FIG. 12 is a plan view showing a configuration of a modified example of the electrode substrate according to the embodiment.
FIG. 13 is an enlarged plan view of a main part of a multichannel member included in a modification of the electrode substrate according to the embodiment.
FIG. 14 is a view for explaining a cross-sectional configuration in a modification of the electrode substrate according to the present embodiment.
FIG. 15 is a view for explaining a cross-sectional configuration in a modified example of the electrode substrate according to the embodiment;
FIG. 16 is an enlarged plan view of a main part of a multichannel member included in a modification of the electrode substrate according to the embodiment.
FIGS. 17A to 17E are views for explaining a method of manufacturing an electrode substrate according to the present embodiment.
FIGS. 18A and 18B are views for explaining a method of manufacturing an electrode substrate according to the present embodiment.
FIGS. 19A and 19B are views for explaining a method of manufacturing an electrode substrate according to the present embodiment. FIGS.
FIGS. 20A to 20C are views for explaining a method of manufacturing an electrode substrate according to the present embodiment.
FIGS. 21A to 21B are views for explaining a method of manufacturing an electrode substrate according to the present embodiment.
FIGS. 22A to 22C are views for explaining a method of manufacturing an electrode substrate according to the present embodiment.
FIGS. 23A to 23C are views for explaining a modification of the electrode substrate manufacturing method according to the present embodiment. FIGS.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electrode substrate, 3 ... Capillary substrate, 5 ... Multichannel member, 7, 7a, 7b ... Through-hole, 8 ... Glass member, 10 ... Area for penetration, 11a ... 1st glass member, 11b ... 2nd glass Member 13: Conductive member 13a: First electrode portion 13b: Second electrode portion 17: Glass member 31: Base material 33: Core glass portion 35: Covered glass portion 37: Single fiber , 39 ... mold, 41 ... multi-fiber, 43 ... glass tube, 47 ... bundle glass member, 53 ... plate glass member, 55 ... mask, 57 ... conductive metal layer.

Claims

A capillary substrate including a plurality of multi-channel members having through-holes, the multi-channel members being fused together and integrally formed in a two-dimensional arrangement;
A conductive member provided in the through hole and electrically conducting between both principal surfaces of the capillary substrate;
The multi-channel member is integrally formed by fusing together a plurality of glass members having a first composition, and any of a triangular shape, a quadrangular shape, and a hexagonal shape as viewed from a direction perpendicular to the main surface. It has the shape of
The glass member includes a first glass member having a through-hole formed in the penetrating region, and a second glass having a glass member having a second composition different from the first composition in the penetrating region. An electrode substrate comprising: a member.

A capillary substrate including a plurality of multi-channel members having through-holes, the multi-channel members being fused together and integrally formed in a two-dimensional arrangement;
A conductive member provided in the through hole and electrically conducting between both principal surfaces of the capillary substrate;
The multi-channel member is formed of a plurality of glass members having the first composition and having the through-holes fused together to form a triangular shape, a quadrangular shape, and a hexagonal shape as viewed from a direction perpendicular to the main surface. Presents one of the shapes,
An electrode substrate, wherein the through hole of a part of the glass member is filled with a glass member having a second composition different from the first composition.

The electrode substrate according to claim 1, wherein the second composition is a composition that can be removed from the capillary substrate by etching.

_3. The electrode substrate according to claim 1, wherein the second composition has a higher dissolution rate in an HCl solution or an HNO ₃ solution than the first composition. 4.

The composition ratio of SiO ₂ in the second composition, the electrode substrate according to claim 1 or claim 2, characterized in that less than the composition ratio of SiO ₂ in said first composition.

A fiber glass member including a core glass portion and a coated glass portion provided around the core glass portion is bundled to form a bundle glass member, and the bundle glass member is cut to a desired thickness. A capillary substrate having a plurality of through holes formed by removing a part of the core glass portion;
An electrode substrate comprising: a conductive member provided in the through hole and electrically conducting between both principal surfaces of the capillary substrate.

The said through-hole is formed so that the opening part of the other main surface side cannot be seen through in the direction orthogonal to the said main surface from the opening part of one main surface side. The electrode substrate according to claim 2 or 6.

The electrode substrate according to claim 7, wherein the through-hole is formed such that an opening portion on at least one main surface side is inclined with respect to the main surface.

The said through-hole is formed so that the space | interval of the opening part of the said through-hole may differ in one main surface side and the other main surface side, The claim 1, 2 or 6 characterized by the above-mentioned. The electrode substrate according to 1.

The conductive member includes a first electrode portion formed in the through hole and a second electrode portion formed on the outer periphery of the opening of the through hole in the main surface. The electrode substrate according to claim 1, claim 2 or claim 6.

The electrode substrate according to claim 10, wherein the first electrode portion is formed on an inner wall of the through hole.

The electrode substrate according to claim 10, wherein the first electrode portion is formed by filling the through hole.

The electrode substrate according to claim 10, wherein the second electrode portion is formed over the outer periphery of the opening of at least two of the through holes adjacent to each other.

The electrode substrate according to claim 1, wherein the conductive member is provided only in a desired through hole.

The electrode substrate according to claim 1, wherein the capillary substrate is tempered glass by being heated and cooled.

The opening of the through hole has a quadrangular shape, and is arranged side by side in two directions orthogonal to each other when viewed from a direction orthogonal to the main surface. The electrode substrate according to Item 2 or Claim 6.

The opening of the through hole has a circular shape, and is arranged side by side in two directions orthogonal to each other when viewed from a direction orthogonal to the main surface. The electrode substrate according to claim 2 or 6.

7. The electrode substrate according to claim 1, wherein any of the plurality of through holes has a hole diameter different from that of the other through holes.

A plurality of rows in which the through holes are arranged in parallel at a predetermined pitch are provided adjacent to each other,
In the plurality of rows of the through-holes, one row is arranged with a half-pitch shift of the through-holes with respect to the other neighboring row, and the other row of the neighboring rows is arranged between the through-holes of the one row. The electrode substrate according to claim 1, wherein the through-hole is disposed.

The multi-channel member, as viewed from a direction perpendicular to the main surface, the co if and has a quadrangular shape, characterized in that it is aligned in a straight line for two directions orthogonal to each other The electrode substrate according to claim 1 or 2 .

The multi-channel member has a quadrangular shape when viewed from a direction perpendicular to the main surface,
A plurality of rows in which the multi-channel members are arranged in parallel in a predetermined direction are provided adjacent to each other,
3. The electrode substrate according to claim 1 , wherein, in the plurality of rows of the multi-channel member, one row is arranged so as to be shifted in the predetermined direction with respect to the other row adjacent thereto.

Bundling a fiber-shaped glass member including a core glass part and a coated glass part provided around the core glass part to form a bundle-shaped glass member;
Cutting the bundled glass member to a desired thickness to form a plate-like glass member;
Removing a part of the core glass portion from the plate-like glass member, and forming a plurality of through holes penetrating the plate-like glass member in the thickness direction;
And a step of providing, in the through hole, a conductive member that electrically conducts between both principal surfaces of the plate-like glass member.

In the step of forming the bundle-shaped glass member, a plurality of the fiber-shaped glass members are bundled, aligned in a predetermined mold, the fiber-shaped glass member is drawn in the aligned state, and the drawn fiber-shaped glass member 23. The electrode substrate according to claim 22, wherein a plurality of the glass members are placed in a predetermined glass tube, and the fiber-shaped glass members are heat-fused to form the bundle-shaped glass member. Production method.

In the step of forming the bundle-shaped glass member, the fiber-shaped glass member is viewed from the central axis direction by the predetermined mold, and is any one of a triangular shape, a quadrangular shape, and a hexagonal shape. 24. The method of manufacturing an electrode substrate according to claim 23, wherein alignment is performed so that

23. The method of manufacturing an electrode substrate according to claim 22, wherein in the step of forming the plate-shaped glass member, the bundle-shaped glass member is cut obliquely with respect to an axis orthogonal to the central axis.

23. The method of manufacturing an electrode substrate according to claim 22, wherein in the step of forming the plate-shaped glass member, the bundle-shaped glass member is heated and stretched to cut a portion having a tapered outer shape. .

In the step of forming a plurality of the through holes, a mask having a desired pattern is provided on the plate-like glass member, a part of the core glass portion is removed through the mask, and a plurality of the through holes are formed. The method for manufacturing an electrode substrate according to claim 22, wherein:

Before the step of providing the conductive member, the method further comprises a step of heating and cooling the plate-like glass member in which a plurality of the through holes are formed to temper the plate-like glass member. The method for manufacturing an electrode substrate according to claim 22.

23. The method of manufacturing an electrode substrate according to claim 22, wherein in the step of providing the conductive member, the conductive member is provided in the through hole and the outer periphery of the opening of the through hole.

In the step of providing the conductive member, a mask having a desired pattern is provided on the plate-like glass member formed with a plurality of the through holes, a conductive metal layer is formed on the plate-like glass member via the mask, 23. The method of manufacturing an electrode substrate according to claim 22, wherein the conductive member is provided by removing a mask.

31. The method of manufacturing an electrode substrate according to claim 30, wherein an opening area of a portion corresponding to the through hole in the desired pattern is set larger than an opening area of the through hole.