JP2005228887A - Method for manufacturing electrode substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrode substrate, in which a through hole for providing a conductive member is formed in a substrate at a still finer hole diameter and pitch, and a large area and thinning are easily achieved. <P>SOLUTION: A fiber-like first glass member 37, containing the first core glass 33 of a first core diameter and a first coated glass 35 provided surrounding the first core glass 33, and a fiber-like second glass member 137 containing the second core glass 133 of a second core diameter different from the first core diameter and a second coated glass 135 provided around the second core glass 133, are bundled, heated and welded, so that a bundle-like glass member is formed; and this bundle-like glass member is cut to a desired thickness to form a plate-like glass member. The first core glass part 33 and the second core glass 133 are removed from the plate-like glass member, so that a plurality of through holes, penetrating the plate-like glass member to a thickness direction, are formed, and the conductive member is formed in the through hole. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electrode substrate.

2. Description of the Related Art Conventionally, an electrode in which a substrate made of an inorganic insulating material (for example, a glass substrate) is provided with fine holes reaching from the upper surface to the lower surface in the thickness direction and a columnar conductive member (conductor layer) in the fine holes. A substrate is known (for example, refer to Patent Document 1).
JP-A-3-203341

  However, it is difficult to form through-holes for penetrating the substrate in the thickness direction and to provide a conductive member with a finer hole diameter and pitch, and to increase the area and thickness of the substrate. Yes, it was not easy to realize.

  The present invention has been made in view of the above-described points, and has a through hole for providing a conductive member formed on a substrate with a finer hole diameter and pitch, and further, the substrate has a large area and is thinned. It is an object of the present invention to provide an electrode substrate and a method for manufacturing the same.

  The electrode substrate manufacturing method according to the present invention includes a first glass member having a fiber shape including a first core glass portion having a first core diameter and a first coated glass portion provided around the first core glass portion, A fiber-shaped second glass member including a second core glass portion having a second core diameter of a size different from the one core diameter is bundled using at least one by one, and then heat-welded to thereby form the first glass member and A bundled glass member forming step for forming a bundled glass member by integrating the second glass member, and a sheet glass for cutting the bundled glass member to a desired thickness to form a sheeted glass member Member forming step and through-hole forming step of removing a first core glass portion and a second core glass portion from a plate-like glass member and forming a plurality of through-holes penetrating the plate-like glass member in the thickness direction And the plate in the through hole Characterized in that it comprises a conductive member forming step of forming a conductive member electrically conduction between both main surfaces of the glass member.

  In the electrode substrate manufacturing method according to the present invention, a bundle-like glass member formed by bundling a fiber-like first glass member and a second glass member is cut to a desired thickness, and the first core glass portion and By removing the second core glass portion, a plurality of through holes are provided in the plate-like glass member. As a result, it is possible to easily form through holes for providing the conductive member in the substrate with a finer hole diameter and pitch, and to increase the area and thickness of the substrate.

  Further, since the first core diameter and the second core diameter are made different, through holes having different diameters are formed in the electrode substrate. For this reason, the freedom degree of board design improves. When a conductive member is provided in a through hole having a large hole diameter, resistance loss in the conductive member can be reduced, and electrical wiring or the like or a jig for fixing the substrate is placed in the through hole having a large hole diameter. Etc. can be easily inserted.

  Here, it is preferable that the second glass member further includes a second coated glass portion provided around the second core glass portion.

  According to this, the through-hole corresponding to the shape and magnitude | size of a 2nd core glass part can be formed suitably.

  Further, in the bundle glass member forming step, in addition to the first glass member and the second glass member, at least one fiber-like third glass member is further bundled and then heated and welded to form the first glass member. It is preferable that the second glass member and the third glass member are integrated to form a bundle-shaped glass member.

  According to this, since the third glass member remains without being removed in the through hole forming step, a portion where the through hole is not formed in the electrode substrate can be set at a desired position. For this reason, the electrode substrate in which the through holes are formed in a desired arrangement can be more suitably manufactured.

  In the bundled glass member forming step, the first glass member and the second glass member are bundled using at least one by one, aligned so as to have a predetermined arrangement, and drawn in the aligned state. It is preferable to form a bundle-like glass member by forming a fiber member and bundling a plurality of first multi-fiber members and heat-welding them.

  According to this, a bundle-shaped glass member can be easily formed with a very small diameter and a large number of the first glass member and the second glass member. Further, in the first multi-fiber forming step, the first glass member and the second glass member are arranged in a desired manner to form the first multi-fiber member, and the first multi-fiber member is bundled and heat-welded, so that the first multi-fiber member is formed in the desired arrangement. A bundle-like glass member in which the glass member and the second glass member are arranged can be easily configured. Thus, an electrode substrate in which a plurality of through holes having different diameters are formed in a desired arrangement can be suitably manufactured.

  In the bundled glass member forming step, the first glass member and the second glass member are bundled using at least one by one and aligned so as to have a different arrangement from the first multi-fiber member. To form a second multi-fiber member, to bundle at least one first multi-fiber member and second multi-fiber, and then to form a bundle-like glass member by heat welding Is preferred.

  According to this, the first multi-fiber member and the second multi-fiber member having different arrangements are formed, and these are bundled to form a bundled glass member, so that the electrode substrate having the desired arrangement of through holes Can be manufactured more suitably.

  In addition, in the bundled glass member forming step, by using a predetermined mold, the first glass member and the second glass member are bundled using at least one by one, and aligned in the above-described arrangement, Furthermore, it is preferable that the first glass member or the second glass member are aligned so as to have any one of a triangular shape, a quadrangular shape, and a hexagonal shape as viewed from the central axis direction.

  In this case, the multi-fiber members drawn in a state of being aligned in a predetermined shape can be tightly bundled, and it is possible to further increase the area.

  In the through-hole forming step, it is preferable to provide a mask having a desired pattern on the plate-shaped glass member and remove at least one of the first core glass portion and the second core glass portion through the mask.

  According to this, since it is not necessary to form a through-hole in the part etc. which do not need to provide an electroconductive member, the intensity | strength of an electrode substrate can be made higher.

  Another electrode substrate manufacturing method according to the present invention includes a first glass member having a fiber shape including a first core glass portion having a first core diameter and a first coated glass portion provided around the first core glass portion. The bundle of a plurality of fiber-like fourth glass members is bundled at least one by one, and then the first glass member and the fourth glass member aggregate are integrated by heating and welding. A bundle-shaped glass member forming step for forming a bundle-shaped glass member, a plate-shaped glass member forming step for cutting the bundle-shaped glass member into a desired thickness to form a plate-shaped glass member, and a plate-shaped glass member The first core glass part and the fourth glass member part are removed from the through-hole forming step of forming a plurality of through-holes penetrating the plate-like glass member in the thickness direction, Electricity between the two main surfaces of the glass member Characterized in that it comprises a conductive member forming step of forming a conductive member electrically connected to.

  According to the method for manufacturing an electrode substrate according to the present invention, a fiber-shaped first glass member and an assembly in which a fourth glass member are bundled are bundled into a bundle-shaped glass member, which has a desired thickness. By cutting and removing the first core glass portion and the fourth glass member portion, a plurality of through holes are provided in the plate-like glass member. As a result, it is possible to easily form through holes for providing the conductive member in the substrate with a finer hole diameter and pitch, and to increase the area and thickness of the substrate.

  Moreover, since the diameter of the through-hole formed by removing the part of the fourth glass member changes according to the number of the fourth glass members in the aggregate, etc., by removing the part of the fourth glass member The diameter of the through-hole formed can be easily made different from the diameter of the through-hole obtained by removing the first core glass portion. For this reason, through holes having different diameters can be easily formed, and the degree of freedom in substrate design is improved. When a conductive member is provided in a through hole having a large hole diameter, resistance loss in the conductive member can be reduced, and electrical wiring or the like or a jig for fixing the substrate is placed in the through hole having a large hole diameter. Etc. can be easily inserted.

  Here, the bundled glass member forming step includes a third multifiber member forming step in which a plurality of first glass members are bundled and aligned, and a third multifiber member is formed by drawing in the aligned state, and a fourth glass Bundling and aligning a plurality of members, forming a fourth multi-fiber member by drawing in the aligned state, and at least one third multi-fiber member and a fourth multi-fiber member; It is preferable to include a bundle forming step of forming a bundle-shaped glass member by using and bundling and then heat-sealing.

  According to this, a bundle-like glass member can be easily formed with a very small diameter and a large number of first glass members and fourth glass members. In addition, an electrode substrate in which a plurality of through holes having different diameters are formed in a desired arrangement can be preferably manufactured.

  Here, in the third multi-fiber member forming step, in addition to the first glass member, a fiber-shaped second glass member including a second core glass portion having a second core diameter different from the first core diameter is further provided. At least one is bundled and aligned so as to have a predetermined arrangement, and the third multi-fiber member is formed by drawing in the aligned state. In the through-hole forming step, the second core glass portion is further removed. It is preferable.

  According to this, the through-hole of the 2nd core diameter different from a 1st core diameter is suitably formed in an electrode substrate.

  Also, the fifth glass member is a fifth multi-fiber member that is bundled by using at least one first glass member and two second glass members, aligned so as to have a different arrangement from the third multi-fiber member, and drawn in the aligned state. Including a fifth multi-fiber member forming step, and in the bundled glass forming step, the third multi-fiber member, the fourth multi-fiber, and the fifth multi-fiber member are bundled using at least one each and heat-welded. Thus, it is preferable to form a bundle-shaped glass member.

  According to this, the first multi-fiber member and the second multi-fiber member having different arrangements are formed, and these are bundled to form a bundled glass member, so that the electrode substrate having the desired arrangement of through holes Can be manufactured more suitably.

  Moreover, it is preferable that a 2nd glass member further contains the 2nd coating glass part provided in the circumference | surroundings of the 2nd core glass part.

  According to this, the through-hole corresponding to the shape and magnitude | size of a 2nd core glass part can be formed suitably.

  In addition, in the third multi-fiber member forming step, in addition to the first glass member, at least one fiber-shaped third glass member is further bundled and aligned to form a predetermined arrangement, and in an aligned state. Preferably, the third multi-fiber member is formed by drawing.

  According to this, since the third glass member remains without being removed in the through hole forming step, a portion where the through hole is not formed in the electrode substrate can be set at a desired position. For this reason, the electrode substrate in which the through holes are formed in a desired arrangement can be more suitably manufactured.

  Further, in the third multi-fiber member forming step, alignment is performed by a predetermined mold so as to have any one of a triangular shape, a quadrangular shape, and a hexagonal shape as viewed from the central axis direction of the first glass member. Then, in the fourth multi-fiber member forming step, it is preferable to align with a predetermined mold so as to have the shape as seen from the central axis direction of the fourth glass member.

  In this case, the multi-fiber members drawn in an aligned state can be tightly bundled, and an increase in area can be further facilitated.

  In the through-hole forming step, it is preferable to provide a mask having a desired pattern on the plate-like glass member and remove at least one of the first core glass portion and the fourth glass member portion through the mask.

  According to this, since it is not necessary to form a through-hole in the part etc. which do not need to provide an electroconductive member, the intensity | strength of an electrode substrate can be made higher.

  In the plate-like glass member forming step, it is preferable that the bundle-like glass member is cut obliquely with respect to an axis orthogonal to the central axis.

  In this case, it is very easy to form the opening axis of the opening of the through hole so as to be inclined with respect to the main surface of the plate-like glass member.

  Further, in the step of forming the plate-shaped glass member, it is preferable to heat-stretch the bundle-shaped glass member and cut a portion where the outer shape is tapered.

  In this case, the through hole is formed so that the interval between the openings is different between the one main surface side and the other main surface side of the plate-like glass member, and the pitch of the conductive member provided in the through hole. Can be enlarged or reduced between one main surface side and the other main surface side.

Moreover, it is preferable to further have the process of heating and cooling the plate-shaped glass member in which the several through-hole was formed, and tempering the plate-shaped glass member before the process of providing a conductive member.
In this case, the strength of the plate-like glass member in which a plurality of through holes are formed can be increased, and damage to the plate-like glass member can be prevented.

  In the step of providing the conductive member, it is preferable that the conductive member is provided over the inner wall of the through hole and the outer periphery of the opening of the through hole.

  In this case, it is possible to prevent the conductive member from being detached from the plate-like glass member.

  Further, in the step of providing the conductive member, a mask having a desired pattern is provided on the plate-like glass member, a conductive metal layer is formed on the plate-like glass member via the mask, the mask is removed, and the conductive member is removed. Is preferably provided.

  In this case, the conductive member can be reliably and easily provided in a desired through hole.

  Moreover, it is preferable that the opening area of the part corresponding to the through-hole in a desired pattern is set larger than the opening area of a through-hole.

  In this case, in this case, the conductive member is also provided on the outer periphery of the opening of the through hole, so that the conductive member can be prevented from being detached from the plate-like glass member.

  According to the present invention, through holes for providing a conductive member can be formed in a substrate with a finer hole diameter and pitch, and the substrate can be easily increased in area and thickness. An electrode substrate and a manufacturing method thereof can be provided.

  Hereinafter, preferred embodiments of a method of manufacturing an electrode substrate according to the present invention will be described in detail with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

(First embodiment)
First, based on FIGS. 1-11, the structure of the electrode substrate manufactured by this embodiment is demonstrated. FIG. 1 is a plan view showing the configuration of the electrode substrate.

  The electrode substrate 100 has a capillary substrate 3 as shown in FIG. The capillary substrate 3 includes thin plate-like multichannel members 5a, 5b, 5c, and 5d. Each of the multichannel members 5a to 5d has a hexagonal plate shape (for example, the length of one piece is about 500 μm) having substantially the same size as viewed from the direction perpendicular to the main surface of the capillary substrate 3. The side surfaces are in close contact with each other and are arranged in a honeycomb shape as a whole.

  As shown in FIGS. 2 and 3, the multichannel member 5 a has a base member 6 made of glass or the like, and a plurality of through holes 7 perpendicular to the main surface of the capillary substrate 3 are formed in the base member 6. ing.

  As for the through-hole 7, the opening part of the both ends is exhibiting circular shape, respectively. The inner diameter of the through hole 7 is about 6 μm, for example. As shown in FIG. 2, the through-hole 7 is aligned in a position where the center is a triangular shape when viewed from the direction perpendicular to the main surface of the capillary substrate 3, and is linear in each of the three directions intersecting each other at 60 degrees. Are arranged in line. The boundary line of the multichannel member 5a is formed along these three directions.

  An interval (pitch) between adjacent through holes 7 is, for example, about 10 μm. As shown in FIG. 3, the through-hole 7 extends in the direction in which the central axis is orthogonal to the main surface of the capillary substrate 3.

  As shown in FIGS. 4 and 5, the multichannel member 5b has a base member 6 made of glass or the like, and a plurality of through holes 7 similar to the multichannel member 5a are formed.

  The multichannel member 5 b further has a conductive member 27. The conductive member 27 is selectively provided in a part of the through hole 7 and electrically conducts between both main surfaces of the capillary substrate 3. The conductive member 27 is made of nickel, aluminum, chromium, copper, silver, gold, or an alloy thereof. The conductive member 27 includes a first electrode portion 27a and a second electrode portion 27b. The first electrode portion 27 a is formed in a cylindrical shape on the inner surface of the through-hole 7, the second electrode portion 27 b is continuous with the first electrode portion 27 a, and each opening of the through-hole 7 in the main surface of the capillary substrate 3. It is formed on the outer periphery of the part.

  As shown in FIGS. 6 and 7, the multi-channel member 5c has a base member 6 made of glass or the like. The base member 6 has a plurality of through-holes 7 similar to the multi-channel member 5b and a capillary similarly. A through hole 15 that is orthogonal to the main surface of the substrate 3 and has a diameter larger than that of the through hole 7 is formed.

  Each opening of the through hole 15 has a circular shape. The inner diameter of the through hole 15 is, for example, about 100 μm. The through-hole 15 is formed near the center of the multichannel member 5c when viewed from the direction perpendicular to the main surface.

  Similarly to the multichannel member 5 b, the multichannel member 5 c has a conductive member 27 selectively provided in a part of the through hole 7 and a conductive member 25 provided in the through hole 15. doing. The conductive members 27 and 25 are electrically connected between both main surfaces of the capillary substrate 3, respectively. The material of the conductive member 25 is the same as that of the conductive member 27. The conductive member 25 includes a first electrode portion 25a and a second electrode portion 25b. The first electrode portion 25 a is formed in a cylindrical shape on the inner surface of the through-hole 15, the second electrode portion 25 b is continuous with the first electrode portion 25 a, and each opening of the through-hole 15 on the main surface of the capillary substrate 3. It is formed on the outer periphery of the part.

  As shown in FIGS. 8 and 9, the multichannel member 5d has a base member 6 made of glass or the like, and the base member 6 is formed with a through hole 15 similar to the multichannel member 5c. A through hole 7 is selectively formed in the base member 6. Each form of the through holes 7 and 15 is the same as that of the multichannel member 5c.

  Since the through holes 7 are selectively disposed in a part of the base member 6, the number of the through holes 7 is smaller than that in the case of the multichannel member 5c.

  A plurality of such multi-channel members 5a to 5d are two-dimensionally arranged in a honeycomb shape as shown in FIG. Here, the arrangement order and the number of the multi-channel members 5a to 5d are arbitrary, but in this embodiment, for example, the multi-channel members are arranged between the rows A and C where only the multi-channel members 5a are arranged in a row. 5a, a multichannel member 5c, a multichannel member 5a, a through-hole 4 to be described later, a multichannel member 5a, a multichannel member 5d, a multichannel member 5b, and a row B in which the multichannel member 5a are arranged in this order Has been.

  As shown in FIGS. 1 and 10, the electrode substrate 100 has through holes 4 formed in a portion surrounded by six multichannel members 5 a. The through hole 4 has the same size as the multichannel members 5 a to 5 d and penetrates through the front and back of the electrode substrate 100. When viewed from above, the inner peripheral surface of the through hole 4 has a wavy shape along the row of the outermost through holes 7 of the multichannel member 5a adjacent to the through hole 4.

  Further, as shown in FIGS. 10 and 11, a conductive member 26 is provided in the through hole 4. The conductive member 26 is electrically connected between both main surfaces of the capillary substrate 3. The conductive member 26 is made of the same material as the conductive member 27. The conductive member 26 includes a first electrode portion 26a and a second electrode portion 26b. The first electrode portion 26 a is formed in a cylindrical shape on the inner surface of the through hole 4. The second electrode portion 26 b is continuous with the first electrode portion 26 a and is formed on the outer periphery of the opening of the through hole 4 on the main surface of the capillary substrate 3. The size of the through hole 4 is approximately the same as that of the multichannel member.

  Next, a method for manufacturing the above-described electrode substrate 100 will be described with reference to FIGS.

  Here, first, a multi-fiber 41 (corresponding to a third multi-fiber), a multi-fiber 43 (first multi-fiber) as a fiber assembly corresponding to each of the multi-channel members 5a, 5b, 5c, 5d and the through hole 4 , Corresponding to the third multi-fiber), multi-fiber 44 (corresponding to the second multi-fiber, third multi-fiber) and multi-fiber 45 (corresponding to the fourth multi-fiber, aggregate).

  First, a method for creating the multi-fiber 41 (third multi-fiber member) will be described. As shown in FIG. 12A, a columnar base material 31 including a first core glass portion 33 and a first coated glass portion 35 provided around the first core glass portion 33 is prepared. The base material 31 has an outer diameter of about 40 to 45 mm, and the outer diameter of the first core glass portion 33 is 28 mm to 31 mm. The first core glass portion 33 is made of acid-soluble glass, and the first coated glass portion 35 is made of lead glass, soda-lime glass, Kovar glass, Pyrex (registered trademark) glass, or the like.

  Next, as shown in FIG. 12B, the base material 31 is drawn to produce a cylindrical fiber-shaped first single fiber (first glass member) 37. The outer diameter of the first coated glass portion 35 of the first single fiber 37 is, for example, about 0.4 mm. The core diameter (first core diameter) of the first core glass portion 33 of the first single fiber 37 is about 0.2 mm.

  Next, as shown in FIG. 12C, a plurality of the first single fibers 37 are bundled and aligned so as to be densely arranged in a predetermined mold 39. Here, as viewed from the central axis direction of the first single fiber 37, a mold 39 having a hexagonal shape is used, and about one hundred first single fibers 37 are stacked. Thereby, as shown in FIG. 12D, the first single fibers 37 are closely aligned so as to have a hexagonal shape when viewed from the central axis direction.

  Next, as shown in FIG. 12E, the bundle of the first single fibers 37 is drawn in the aligned state, and the multi-fiber 41 is manufactured. The outer diameter of the multifiber 41 is, for example, about 0.7 mm. This completes the creation of the multi-fiber 41. The multifiber 41 corresponds to the multichannel members 5 a and 5 b of the electrode substrate 100.

  Next, a method for creating the multi-fiber 43 (first multi-fiber member, third multi-fiber member) will be described. As illustrated in FIG. 13A, a columnar base material 131 including a second core glass portion 133 and a second coated glass portion 135 provided around the second core glass portion 133 is prepared. The second core glass portion 133 is the same glass as the first core glass portion 33, and the second coated glass portion 135 is the same glass as the first coated glass portion 35. The base material 131 has an outer diameter of about 20 to 50 mm, and the second core glass portion 133 has a diameter of 15 to 45 mm.

  Next, as shown in FIG. 13B, the base material 131 is drawn to produce a cylindrical fiber-shaped second single fiber 137 (second glass member). The outer diameter of the second coated glass portion 135 of the second single fiber 137 is, for example, about 1 mm. The core diameter (second core diameter) of the core glass portion 133 of the second single fiber 137 is about 0.7 mm, which is different from the core diameter of the first core glass portion 33 of the first single fiber 37. Further, as shown in FIG. 13C, the first single fiber 37 is prepared as described above.

  Next, as shown in FIG. 13 (d), the second single fiber 137 and the plurality of first single fibers 37 are bundled and aligned in a predetermined mold 39. Here, one second single fiber 137 is arranged in the vicinity of the center of the first single fiber 37 as viewed from the central axis direction in the mold 39, and about one hundred first fibers are arranged around the second single fiber 137. Align so that the single fibers 37 are closely arranged. As a result, the bundle of aggregates of the second single fibers 137 and 37 is aligned so as to have a hexagonal shape when viewed from the central axis direction, as shown in FIG. Here, the arrangement of the multi-fibers 43, that is, the relative positions and the numbers of the second single fibers 137 and the first single fibers 37 can be arbitrarily selected.

  Next, as shown in FIG. 13 (f), the bundle including the second single fiber 137 and the first single fiber 37 is drawn in an aligned state, and the multi-fiber 43 is manufactured. The outer diameter of the multi-fiber 43 is about the same as that of the multi-fiber 41. This completes the creation of the multi-fiber 43. The multifiber 43 corresponds to the multichannel member 5 c of the electrode substrate 100.

  Next, a method for creating the multi-fiber 44 (second multi-fiber member, third multi-fiber member, fifth multi-fiber member) will be described. First, as shown in FIG. 14A, a columnar base material 132 including only the third glass portion 235 is prepared. The material of the third glass portion 235 is the same as that of the first coated glass portion 35. The base material 132 has an outer diameter of about 20 to 50 mm.

  Next, as shown in FIG. 14B, the base material 132 is drawn to produce a fiber-like third single fiber (third glass member) 139. The outer diameter of the third single fiber 139 is about the same as that of the first single fiber 37, for example, about 0.4 mm. Moreover, as shown in FIG.14 (c) and FIG.14 (d), the 1st single fiber 37 and the 2nd single fiber 137 are created with the above-mentioned method.

  Next, as shown in FIG. 14 (e), the third single fiber 139, the first single fiber 37, and the second single fiber 137 are bundled and aligned in a predetermined mold 39. Here, one second single fiber 137 is arranged near the center in the radial direction in the mold 39, and around the third single fiber 139 and about ten around the second single fiber 137. The first single fibers 37 are aligned so as to be closely arranged.

  Here, the arrangement of the multi-fibers 44, that is, the relative positions and the numbers of the second single fibers 137, the first single fibers 37, and the third single fibers 139 can be arbitrarily selected. In the present embodiment, the position of the first single fiber 37 is set to a position corresponding to the part where the through hole 7 is finally formed.

  With such a mold stack, the bundle including the second single fiber 137, the first single fiber 37, and the third single fiber 139 has a hexagonal shape as viewed from the center axis direction as shown in FIG. Aligned to be

  Next, as shown in FIG. 14G, a bundle of the second single fiber 137, the first single fiber 37, and the third single fiber 139 is drawn in an aligned state, and the multi-fiber 44 is manufactured. The outer diameter of the multifiber 44 is approximately the same as that of the multifiber 41. This completes the creation of the multi-fiber 44. The multifiber 44 corresponds to the multichannel member 5 d of the electrode substrate 100.

  Next, a method for creating the multi-fiber 45 (fourth multi-fiber member) will be described. As shown in FIG. 15A, a solid columnar base material 147 having only the fourth glass portion 233 is prepared. The material of the fourth glass portion 233 is the same as that of the first core glass portion 33. The base material 147 has an outer diameter of about 20 to 50 mm.

  Next, as shown in FIG. 15B, the base material 147 is drawn to produce a fiber-shaped fourth single fiber 138 (fourth glass member). The outer diameter of the fourth single fiber 138 is the same as that of the first single fiber 37, and is about 0.4 mm, for example.

  Next, as shown in FIG. 15C, the fourth single fibers 138 are bundled and aligned with a predetermined mold 39. Here, about 100 fourth single fibers 138 are aligned in the mold 39 so as to be densely arranged. As a result, the bundle of the fourth single fibers 138 is aligned so as to have a hexagonal shape as viewed from the central axis direction, as shown in FIG.

  Next, as shown in FIG. 15E, the bundle of the fourth single fibers 138 is drawn in an aligned state, and the multi-fiber 45 is manufactured. The outer diameter of the multifiber 45 is approximately the same as that of the multifiber 41. This completes the creation of the multifiber 45. The multifiber 45 corresponds to the through hole 4 of the electrode substrate 100.

  Next, as shown in FIG. 16A, a plurality of drawn multi-fibers 41 to 45 are arranged in a predetermined glass tube 143 and stored. The inner diameter of the glass tube 143 is about 100 mm. In the present embodiment, a portion of the electrode substrate 100 to be manufactured that corresponds to the multichannel members 5a and 5b is a multifiber 41, a portion that corresponds to the multichannel member 5c is a multifiber 43, and a portion that corresponds to the multichannel member 5d. The multi-fibers 44 are arranged in the portions corresponding to the through holes 4. It should be noted that the number and position of each of the multi-fibers 41 to 45 can be set arbitrarily according to the arrangement of the multi-channel members of the electrode substrate to be manufactured, and it is preferable that the multi-fiber members are filled without any gaps.

  Next, as shown in FIG.16 (b), the multifibers 41-45 stored in the glass tube 143 are heat-fused. Thereby, each single fiber in the glass tube 143 is fused. At this time, a glass tube 145 that is thinner than the glass tube is connected to one end of the glass tube 143, and exhausted by a rotary pump or the like to reduce the internal pressure. The heating temperature is, for example, about 600 ° C., and the internal pressure is about 0.5 Pa. The other end of the glass tube 143 is sealed.

  Through the above steps, a bundle-like glass member 47 in a state where the multi-fibers 41 to 45 are fused in the glass tube 143 is formed.

  Subsequently, after removing the glass tube 145 and the sealed portion, the outer periphery of the glass tube 143 is polished by a grindstone 49 or the like as shown in FIG. Shaping (outside diameter) is performed. An outer peripheral grinder can be used to obtain the outer diameter of the bundle-shaped glass member 47.

  Then, as shown in FIG. 17B, the bundle-shaped glass member 47 is cut into a desired thickness. At this time, the bundle-shaped glass member 47 is cut by the slicer 51 at a right angle to the axis 1 orthogonal to the central axis, and then the cut surface is polished. By these steps, as shown in FIGS. 18 and 19, a plate-like glass member 53 is formed. The glass member 53 includes a section 41a that is a thin piece of the multifiber 41, a section 43a that is a thin piece of the multifiber 43, a section 44a that is a thin piece of the multifiber 44, and a section 45a that is a thin piece of the multifiber 45. ing.

Subsequently, the first core glass portion 33, the second core glass portion 133, and the fourth glass portion 233 are removed (centered) from the respective sections 41 a to 45 a of the plate-like glass member 53. At this time, using HNO ₃ or HCl, the first core glass portion 33, the second core glass portion 133, and the fourth glass portion 233 are removed by an etching technique. Thereby, as shown in FIG. 20, the through-hole 7, the through-hole 15, and the through-hole 4 which penetrate the plate-shaped glass member 53 in the thickness direction are formed, and the capillary substrate 3 is formed.

  Next, as shown in FIG. 21, a mask 55 having a desired pattern is provided on the plate-like glass member 53 (capillary substrate 3) in which the through holes 4, 7, and 15 are formed. As the mask 55, a resist layer formed by a photolithography method may be used, or a vapor deposition mask made of nickel or the like may be used. Here, masks 55 are formed on both surfaces of the glass member 53 so as to exclude the through hole 7 in which the conductive member 27 is to be formed, the through hole 15 in which the conductive member 25 is to be formed, and the through hole 4. The Furthermore, the opening area of the portion of the mask 55 corresponding to the through holes 7, 15, 4 where the conductive member is to be formed is set larger than the opening area of the through holes 7, 15, 4.

  Next, as shown in FIG. 22, a conductive metal layer (for example, made of nickel, aluminum, chromium, copper, silver, gold, or an alloy thereof) 57 is formed on the plate-like glass member 53 through the mask 55. Form. The conductive metal layer 57 can be formed by vapor deposition (physical vapor deposition (PVD) method, chemical vapor deposition (CVD) method), plating, or the like. Then, as shown in FIG. 23, the mask 55 is removed. By these steps, the conductive members 27, 25, and 26 that are electrically connected between both main surfaces of the plate-like glass member 53 are provided. As shown in FIG. 23, the conductive members 27, 25, 26 are provided over the inner walls of the through holes 15, 4, 7 and the outer periphery of the openings of the through holes 15, 4, 7.

  Through these steps, the electrode substrate 100 having the above-described configuration is manufactured.

  As described above, according to the manufacturing method described above, the single fiber (first glass member) 37 having the first core glass portion 33 having the first core diameter and the first coated glass portion 35, the first core diameter, The first single fiber 37 and the second single fiber (second glass member) 137 including second core glass portions 133 having different second core diameters are bundled by using at least one second fiber and then heat-sealed. The two single fibers 137 are integrated to form a bundle-like glass member 47, which is cut to a desired thickness, and the first core glass portion 33 and the second core glass portion 133 are removed. For this reason, the plurality of through holes 7 and 15 can be provided in the plate-like glass member 53.

  As a result, the through holes 7 and 15 for providing the conductive members 27 and 25 are formed in the substrate with a finer hole diameter and pitch, and the substrate can be easily increased in area and thickness. Can do.

  Further, since the first core diameter and the second core diameter are made different, the through holes 7 and 15 having different diameters are formed in the electrode substrate 100, and the degree of freedom in designing the substrate is improved. Moreover, the resistance loss in the conductive member 25 can be reduced by providing the conductive member 25 in the through-hole 15 having a large hole diameter. In addition, it becomes easy to insert a substrate fixing jig such as an electric wiring or a bolt into the through hole 15 having a large hole diameter.

  Further, since the second single fiber 137 includes the second coated glass portion 135 around the second core glass portion 133, the through hole 15 corresponding to the shape and size of the second core glass portion 133 is preferably used. Is formed.

  Further, in addition to the first single fiber 37 and the second single fiber 137, at least one fiber-like third single fiber 139 is further bundled, and then heated and welded to thereby form the first single fiber 37 and the second single fiber 139. A bundle-like glass member 47 is formed by integrating the fiber 137 and the third single fiber 139.

  For this reason, since the third glass portion 235 of the third single fiber 139 remains without being removed after the through hole is formed, the portion of the electrode substrate 200 where the through holes 7 and 15 are not formed can be set to a desired position. For this reason, the electrode substrate 200 in which the through holes 7, 15 and the like are formed in a desired arrangement can be more suitably manufactured.

  Further, in the manufacturing method described above, the first single fiber 37 and the second single fiber 137 are bundled using at least one each, aligned so as to have a predetermined arrangement, and drawn in the aligned state to draw the multi-fiber 43. , 44 are formed, and a plurality of these are bundled and heat-welded to form a bundle-shaped glass member 47.

  Thereby, the bundle-shaped glass member 47 having a desired arrangement can be easily configured by the extremely small diameter and a large number of the first single fibers 37 and the second single fibers 137. Further, the first single fiber 37 and the second single fiber 137 are arranged in a desired manner to form multi-fibers 43 and 44, and these are bundled to form the first single fiber 37 and the second single fiber 137 in a desired arrangement. It is possible to easily configure the bundle-shaped glass member 47 in which are arranged. Thus, the electrode substrate 100 in which a plurality of through holes 7 and 15 having different diameters are formed in a desired arrangement can be suitably manufactured.

  In the manufacturing method described above, the first single fiber 37 and the second single fiber 137 are bundled using at least one by one, aligned so as to have a different arrangement from the multi-fiber 43, and drawn in the aligned state. The multi-fiber 44 is formed, the multi-fiber 43 and the multi-fiber 44 are bundled using at least one by one, and then heated and welded to form a bundle-shaped glass member 47.

  For this reason, the electrode substrate 100 having the desired arrangement of the through holes 7 and 15 can be more suitably manufactured by the multi-fiber 43 and the multi-fiber 44 having different arrangements.

  Here, as the multi-fiber 44, in addition to the present embodiment, for example, the same number of first single fibers 37 and second single fibers 137 as the multi-fiber 43 are provided, and their arrangement (arrangement) is different from that of the multi-fiber 43. It is conceivable that the number of the first single fibers 37 and the second single fibers 137 is different from that of the multi-fibers 43 (for example, the second single fibers 137 are located off the center when viewed from above).

  Further, in addition to bundling at least one first single fiber 37 and second single fiber 137 using a predetermined mold 39 and aligning them in a predetermined arrangement, the single fiber 37 and the like are further arranged. Are aligned so as to have a hexagonal shape when viewed from the center axis direction.

  For this reason, the multi-fibers 43, 44 and the like drawn in a state of being aligned in a predetermined shape can be tightly bundled, and the enlargement of the area can be further facilitated.

In the manufacturing method described above, in the step of forming the bundle-shaped glass member 47, the first single fiber 37 and the multi-fiber 45 as an assembly of the fourth single fibers 138 are bundled to form a bundle-shaped glass member. 47 is formed, and after the heat welding, the first core glass portion 33 and the fourth glass portion 233 are removed. For this reason, the through holes 7 and 4 for providing the conductive members 27 and 26 can be formed in the electrode substrate 100 with an even finer hole diameter and pitch, and the electrode substrate 100 can be increased in area and thickness. Further, the diameter of the through-hole 4 formed by removing the fourth glass portion 233 of the fourth single fiber 138 depends on the number of the fourth single fibers 138 bundled in the multi-fiber 45 and the like. Therefore, it is easy to make the diameter of the through hole 4 formed by removing the fourth glass portion 233 different from the diameter of the through hole 7 obtained by removing the first core glass portion 33. it can. For this reason, the through holes 7 and 4 having different diameters can be easily formed and the degree of freedom in designing the substrate is improved. When the conductive member 26 is provided in the through hole 4 having a large hole diameter, resistance loss in the conductive member 26 can be reduced, and electrical wiring or the like is fixed in the through hole 4 having a large hole diameter. It is also easy to insert a jig or the like.

  Here, a plurality of first single fibers 37 are bundled and aligned, and drawn in the aligned state to form multi-fibers 41, 43, and 44, and a plurality of fourth single fibers 138 are bundled and aligned. A multi-fiber 45 is formed by drawing in a state, and the multi-fibers 41, 43, 44 and the multi-fiber 45 are bundled using at least one by one, and then heated and fused to form a bundle-shaped glass member 47. doing.

  According to this, the bundle-shaped glass member 47 can be easily formed by the aggregate of the first single fiber 37 and the fourth single fiber 138 having a very small diameter. Moreover, the electrode substrate 100 in which a plurality of through holes 4 and 7 having different diameters are formed in a desired arrangement can be suitably manufactured.

  Further, in addition to the first single fiber 37, at least one second single fiber 137 is used and bundled so as to form a predetermined arrangement, and the aligned fibers are drawn to form multi-fibers 43 and 44. When forming the through hole, the second core glass portion 133 is further removed.

  For this reason, the through hole 7 and the through hole 15 having a diameter different from that of the through hole 7 are suitably formed in the electrode substrate 100.

  The second single fiber 137 further includes a second coated glass portion 135 provided around the second core glass portion 133.

  For this reason, the through-hole 15 corresponding to the shape and size of the second core glass portion 133 is suitably formed.

  In addition, the first single fiber 37 and the second single fiber 137 are used at least one by one and aligned so as to be arranged differently from the bundled multi-fiber 43, and the multi-fiber 44 is formed by drawing in the aligned state. The multi-fiber 43, the multi-fiber 44, and the multi-fiber 45 are bundled and heat-welded to form a bundle-shaped glass member 47.

  According to this, since the multi-fibers 43 and the multi-fibers 44 having different arrangements are formed and bundled to form the bundled glass member 47, the desired arrangement of the through-holes 7 and 15 and the through-holes 4 is achieved. The electrode substrate 100 having the above can be more suitably manufactured.

  Further, in addition to the first single fiber 37, at least one third single fiber 139 is further bundled and aligned in a hexagonal column shape so as to form a predetermined arrangement, and a multi-fiber 44 is formed by drawing in the aligned state. doing.

  According to this, since the third glass portion 235 of the third single fiber 139 remains without being removed after the through hole is formed, the portion where the through holes 7, 15 and the like are not formed in the electrode substrate 100 is set to a desired position. Can do. For this reason, the electrode substrate 100 in which the through holes 7 and 15 are formed in a desired arrangement can be more suitably manufactured.

  Further, in the multi-fibers 41 to 45, the outer shapes of the single fibers 37 to 45 are aligned by a predetermined die 39 so as to have a hexagonal shape when viewed from the central axis direction. As a result, the multi-fibers 41 to 45 can be fused and integrally formed in a two-dimensional arrangement, thereby forming the capillary substrate 3. As a result, the multi-fibers 41 and the like produced by drawing the first single fibers 37 and the like in an aligned state can be closely packed in the predetermined glass tube 143, and the area can be further increased. be able to.

  In the manufacturing method described above, in the step of providing the conductive members 25, 26, 27, the conductive members 25, 26, 27 are connected to the inner walls of the through holes 15, 4, 7 and the through holes 15, 4, 7. It is provided over the outer periphery of the opening. Thereby, it can prevent that the said electroconductive member 25,26,27 remove | deviates from the capillary substrate 3 (The plate-shaped glass member 53 in which the through-hole 7 grade | etc., Was formed).

  In the manufacturing method described above, in the step of providing the conductive member 27, a mask 55 having a desired pattern is provided on the plate-like glass member 53 in which a plurality of through holes 7 are formed, and the plate-like glass member 53 is interposed via the mask 55. Then, the conductive metal layer 57 is formed, and the mask 55 is removed to provide the conductive member 27. Thereby, the conductive member 27 can be reliably and easily provided in the desired through hole 7.

  Further, in the manufacturing method described above, the opening area of the portion corresponding to the through hole 7 or the like in the desired pattern of the mask 55 is set larger than the opening area of the through hole 7 or the like. Thereby, the conductive member 27 and the like are also provided on the outer periphery of the opening of the through hole 7 and the like, and the conductive member 27 and the like can be prevented from being detached from the plate-like glass member 53.

  Here, before the step of providing the conductive member 27 and the like, a step of heating and cooling the plate-like glass member 53 in which a plurality of through-holes 7 are formed and further tempering the plate-like glass member 53 is further performed. You may have. In this case, the strength of the plate-like glass member 53 in which the plurality of through holes 7 are formed can be increased, and damage to the plate-like glass member 53 can be prevented.

(Second embodiment)
Next, a method for manufacturing the electrode substrate 200 according to the second embodiment will be described. The electrode substrate 200 created in the present embodiment is different from the electrode substrate 100 of the first embodiment in that the first core glass derived from the multi-fibers 41, 43, and 44 in the base member 6, as shown in FIG. That is, the portion 33 remains.

  In the same manner as in the first embodiment, such an electrode substrate 200 is prepared by forming a glass member 53 as shown in FIG. 19, and then, as shown in FIG. 25, one of the plurality of first core glass portions 33. The resist layer 155 may be formed on both surfaces of the glass member 53 so that the first core glass portion 33 and the periphery thereof are exposed on the surface while the remaining first core glass portion 33 is covered. Then, by performing the centering process in the same manner as in the first embodiment, as shown in FIG. 26, a part of the first core glass portion 33 derived from the multi-fibers 41, 43, 44 is formed on the base member 6. On the other hand, the remaining first core glass portion 33 is removed to form the corresponding through hole 7, and thereafter, the conductive member 27 is attached to the through hole 7 in the same manner as in the first embodiment. The electrode substrate 200 as shown in FIG. 23 can be manufactured by forming.

  In the present embodiment, by covering a part of the plurality of first core glass portions 33 with the resist layer (mask) 155, the first core glass portion 33 is not formed without the through hole 7 being formed. In the base member 6 having a plurality of second core glass portions 133 and fourth glass portions 233, for example, the inside of the plurality of second core glass portions 133 and fourth glass portions 233 A portion of the second core glass portion 133 and the fourth glass portion 233 may be left without forming the through-holes 15 and 4 by covering a part thereof with the resist layer 155.

  In the present embodiment, in the through-hole forming step, a resist layer 155 having a desired pattern is provided on the plate-like glass member 47, and the first core glass portion 33, the second core glass portion 133, etc. are provided via the resist layer 155. At least one of the above is removed. In the through hole forming step, a resist layer 155 having a desired pattern is provided on the plate-like glass member 47, and at least one of the first core glass portion 33 and the fourth glass portion 233 is removed through the resist layer 155. ing.

  For this reason, since it is not necessary to form the through-hole 7 etc. in the part etc. which do not need to provide the electroconductive member 27 grade | etc., The intensity | strength of the electrode substrate 200 can be made higher. Other functions and effects are the same as those of the first embodiment.

(Third embodiment)
Next, the manufacturing method of the electrode substrate which concerns on 3rd embodiment is demonstrated. In the electrode substrate 300 manufactured in this embodiment, as shown in FIG. 27, the central axes of the through-hole 7, the through-hole 15, and the through-hole 4 are inclined with respect to the axis orthogonal to the main surface of the electrode substrate 300. ing.

  Such an electrode substrate 300 is a step of forming the plate-like glass member 53 in the first embodiment, and the bundle-like glass member 47 is orthogonal to the central axis thereof as shown by an imaginary line in FIG. It is obtained by cutting obliquely (angle θ) with respect to the axis 1 to be performed. Thereby, it is very easy to form the opening axis of the opening portion of the through-hole 7 so as to be inclined with respect to the main surface of the plate-like glass member 53. Other functions and effects are the same as in the first embodiment.

  The through holes 4, 7, and 15 are formed on the other main surface side when viewed in a direction orthogonal to the main surface from the opening on one main surface side of the capillary substrate 3, for example, as shown in FIG. 4. You may form diagonally so that an opening part cannot be seen through. Thereby, when viewed in a direction orthogonal to the main surface from the opening on one main surface side, it is possible to easily realize the configuration of the through hole 7 or the like in which the opening on the other main surface side cannot be seen. . Thereby, energy rays such as X-rays can be reliably prevented from passing through the through hole 7 from one main surface side to the other main surface side. In particular, when the capillary substrate 3 is made of a material that shields energy rays such as X-rays, the shielding effect can be ensured.

(Fourth embodiment)
Next, a method for manufacturing the electrode substrate according to the fourth embodiment will be described. In the electrode substrate 400 manufactured in the present embodiment, as shown in FIG. 28, the central axes of the through hole 7, the through hole 15, and the through hole 4 are curved with respect to the axis orthogonal to the main surface of the electrode substrate 300. Yes.

  Such an electrode substrate 400 can be manufactured as follows. That is, like the third embodiment, the bundle-like glass member 47 is cut obliquely with respect to the axis orthogonal to the central axis, and then the plate-like glass member 53 is sandwiched between both main surfaces by hot plates. Fix it. Then, after the hot plate is heated (for example, about 500 ° C.) and the entire plate-like glass member 53 is heated at substantially the same temperature, the hot plate on one side is set in a predetermined uniaxial direction, or the hot plates on both sides are set in predetermined. Shift in the opposite direction to one axis direction. Through these steps, a plate-like glass member 53 having a curved through hole 7 is formed. After that, the electrode substrate 400 is configured by providing the conductive members 25, 26, and 27 as described above. The effect of this embodiment is the same as that of the third embodiment.

(Fifth embodiment)
Next, a method for manufacturing the electrode substrate according to the fifth embodiment will be described. In the electrode substrate 500 manufactured in this embodiment, as shown in FIG. 29, the distance between the through hole 7 and the opening of the adjacent through hole 7 and the like is between one main surface side and the other main surface side. Are formed differently. In this case, the pitch of the conductive members 27, 25, and 26 provided in the through holes 7 and the like can be enlarged or reduced between one main surface side and the other main surface side. Further, the through-hole 7 and the like are formed in a taper shape in which the hole diameter of the opening on one main surface side is different from the hole diameter of the opening on the other main surface side.

  In such a process of forming the plate-like glass member 53, such an electrode substrate 500 is formed by heating and stretching the bundle-like glass member 47 as shown in FIGS. It can be formed by cutting the formed portion 47D. In this case, the through-hole 7 (first core glass portion 33) is formed so that the interval between the openings is different between one main surface side of the plate-like glass member 53 and the other main surface side, The pitch of conductive members (not shown) provided in the through holes 7 can be enlarged or reduced between one main surface side and the other main surface side. The other Sayo Koka is the same as that of the fourth embodiment.

(Sixth embodiment)
Next, a method for manufacturing the electrode substrate according to the sixth embodiment will be described. In the electrode substrates 600 and 700 manufactured in this embodiment, the multichannel members 5a to 5d and the through holes 4 are perpendicular to the main surface of the capillary substrate 3, as shown in FIGS. 31 (a) and 31 (b). As viewed from the right direction, it has a triangular shape (the length of one side is about 1000 μm, for example).

  Such electrode substrates 600 and 700 can be manufactured as follows. That is, as shown in FIG. 32A, after drawing the second single fiber 137 and the like in a die 39 having a triangular shape when viewed from the central axis direction of the first single fiber 37 and the like, As shown in FIG. 32 (b), the multi-fibers 41, 43, 44, and 45 whose outer shape is a triangular shape (diameter is about 6 μm, for example) when viewed from the direction perpendicular to the main surface of the capillary substrate 3 are formed. To do.

  Then, these multi-fibers 41 to 45 are arranged in the glass tube 143 so as to correspond to the multi-channel members 5a to 5d so as to be in close contact with each other, and thereafter, the same processing as in the first embodiment is performed. Electrode substrates 600 and 700 can be manufactured. FIG. 32 (c) shows a glass member 47 that is created when the electrode substrate 600 is created. The effects are the same as in the first embodiment.

(Seventh embodiment)
Next, a method for manufacturing the electrode substrate according to the seventh embodiment will be described. In the electrode substrate 800 manufactured in the present embodiment, the multichannel members 5a to 5d and the through holes 4 are perpendicular to the main surface of the capillary substrate 3, as shown in FIGS. 33 (a) and 33 (b). When viewed from the side, it has a quadrangular shape (the length of one side is, for example, about 1000 μm). Further, the multichannel members 5 a to 5 d and the through hole 4 are arranged in a straight line in each of two directions orthogonal to each other when viewed from a direction perpendicular to the main surface of the capillary substrate 3.

  Such an electrode substrate 800 can be manufactured as follows. That is, as shown in FIG. 33A, after drawing the second single fiber 137 and the like in a die 39 having a quadrangular shape when viewed from the central axis direction of the first single fiber 37 and the like, As shown in FIG. 33 (c), multi-fibers 41, 43, 44, and 45 having a quadrangular shape (diameter is, for example, about 6 μm) when viewed from the direction perpendicular to the main surface of the capillary substrate 3 are formed. To do.

  Then, these multi-fibers 41 to 45 correspond to the multi-channel members 5a to 5d, are arranged so as to be in close contact with each other, and are arranged in the glass tube, and thereafter the same processing as in the first embodiment is performed, thereby The substrate 800 can be manufactured.

  In addition, when the multi-fibers 41 to 45 having a quadrangular shape are juxtaposed in a predetermined direction in the glass tube, one row is displaced in a predetermined direction with respect to the other adjacent row. As shown in FIG. 34, in a plurality of rows of the multichannel members 5a to 5d, it is possible to form the electrode substrate 900 in which one row is arranged so as to be shifted in the predetermined direction with respect to the other row adjacent thereto.

  Furthermore, by arranging the quadrangular multi-fibers 41 to 45 in the glass tube having a rectangular cross section, the capillary substrate is placed inside the edge member 515 having a quadrangular outer shape as shown in FIG. When viewed from the direction perpendicular to the main surface of FIG. 3, the multi-channel members 5a to 5d having a quadrangular shape are linearly aligned in two directions orthogonal to each other (left and right direction and up and down direction in FIG. 34B). Thus, the electrode substrate 1000 can be formed. In addition, the other effect in this embodiment is the same as that of 1st Embodiment.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above-described embodiment, the single fibers 37 and 137 having a circular cross section perpendicular to the axial direction of the core glass portions 33 and 133 and the covering glass portions 35 and 135 are used, but the cross section is triangular (for example, 35 (a)) or square single fibers 37, 137 may be used. According to this, it is possible to suitably form an electrode substrate including the capillary substrate 3 having through holes 7 and 15 having a triangular cross section (for example, see FIG. 35) or a square.

  Moreover, in the said embodiment, the 1st single fiber 37 which has the 1st core glass part 33 and the 1st coating glass part 35, and the 2nd single fiber 137 which has the 2nd core glass part 133 and the 2nd coating glass part 135, , A bundle-shaped glass member 47 is formed using, for example, a solid single fiber having only the second core glass portion 133 without the second coated glass portion 135 as the second single fiber 137. It may be used. In this case, if the first single fiber 37 is arranged so as to surround the solid single fiber to form a bundle-like glass member 47, a through hole corresponding to the solid single fiber can be obtained.

  In the above-described embodiment, the multi-fiber 44 and the like are prepared and further bundled and heat-welded. Alternatively, the multi-fiber 44 and the like bundled with the single fibers 37 and 137 may be heat-welded and used as an electrode substrate as it is. good. Further, the shape in which the multi-fibers 44 are aligned may be a house-shaped pentagon.

It is a top view which shows the structure of the electrode substrate 100 which concerns on 1st Embodiment. It is an enlarged plan view of the multichannel member 5a in FIG. It is the III-III arrow line view of FIG. FIG. 2 is an enlarged plan view of a multichannel member 5b in FIG. It is a VV arrow line view of FIG. It is an enlarged plan view of the multichannel member 5c in FIG. It is a VII-VII arrow line view of FIG. It is an enlarged plan view of the multichannel member 5d in FIG. It is the IX-IX arrow directional view of FIG. FIG. 2 is an enlarged plan view of a through hole 4 in FIG. 1 and the vicinity thereof. It is a XI-XI arrow line view of FIG. It is a figure explaining the manufacturing process of the electrode substrate which concerns on this embodiment. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. FIG. 19 is a view taken along arrow IXX-IXX in FIG. 18. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is a figure explaining the manufacturing process following FIG. It is sectional drawing which shows the electrode substrate 200 which concerns on 2nd embodiment. It is sectional drawing explaining the manufacturing process of the electrode substrate 200 of FIG. FIG. 26 is a cross-sectional view illustrating a manufacturing process following FIG. 25. It is sectional drawing which shows the electrode substrate 300 which concerns on 3rd embodiment. It is sectional drawing which shows the electrode substrate 400 which concerns on 4th embodiment. It is sectional drawing which shows the electrode substrate 500 which concerns on 5th embodiment. It is a figure explaining the manufacturing process of the electrode substrate of FIG. It is a top view which shows the electrode substrates 600 and 700 which concern on 6th embodiment. It is a figure explaining the manufacturing process of the electrode substrate of FIG. It is a figure explaining the electrode substrate 800 which concerns on 7th embodiment, and its manufacturing process. It is a top view showing electrode substrates 900 and 1000 concerning an eighth embodiment. It is a top view which shows the single fiber and capillary substrate which concern on other embodiment.

Explanation of symbols

  3 ... Capillary substrate, 4, 7, 15 ... Through hole, 5a, 5b, 5c, 5d ... Multichannel member, 25, 26, 27 ... Conductive member, 33 ... First core glass portion, 35 ... Second coated glass Part 37 ... first single fiber (first glass member) 39 ... mold 41 ... multi fiber (third multi fiber member) 43 ... multi fiber (first multi fiber member, third multi fiber member) 44 ... multi-fiber (second multi-fiber member, third multi-fiber member, fifth multi-fiber member), 45 ... multi-fiber (fourth multi-fiber member, aggregate), 47 ... bundled glass member, 53 ... plate shape Glass member, 55 ... mask, 57 ... conductive metal layer, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000 ... electric Substrate, 133 ... second core glass part, 135 ... second coated glass part, 137 ... second single fiber (second glass member), 138 ... fourth single fiber (fourth glass member), 139 ... third single fiber (Third glass member), 143... Glass tube, 155... Resist layer (mask), 233.

Claims (21)

A fiber-shaped first glass member including a first core glass portion having a first core diameter and a first coated glass portion provided around the first core glass portion; and a first glass member having a size different from the first core diameter. The first glass member and the second glass member are integrated by bundling at least one fiber-like second glass member including a second core glass portion having a two-core diameter, and then heat-welding. A bundled glass member forming step of forming a bundled glass member;
A plate-like glass member forming step of cutting the bundle-like glass member to a desired thickness to form a plate-like glass member;
Removing the first core glass portion and the second core glass portion from the plate-like glass member, and forming a plurality of through-holes penetrating the plate-like glass member in the thickness direction; and
In the through hole, a conductive member forming step of forming a conductive member that electrically conducts between both main surfaces of the plate-like glass member;
The manufacturing method of the electrode substrate characterized by including. The method for manufacturing an electrode substrate according to claim 1, wherein the second glass member further includes a second coated glass portion provided around the second core glass portion. In the bundle glass member forming step,
In addition to the first glass member and the second glass member, at least one fiber-like third glass member is used for bundling, and then heat-welded, thereby the first glass member and the second glass member, and The method for manufacturing an electrode substrate according to claim 1, wherein the third glass member is integrated to form the bundle-shaped glass member. In the bundle glass member forming step,
The first glass member and the second glass member are bundled using at least one by one and aligned to form a predetermined arrangement, and the first multi-fiber member is formed by drawing in the aligned state, The method for manufacturing an electrode substrate according to any one of claims 1 to 3, wherein the bundle-shaped glass member is formed by bundling a plurality of multi-fiber members and heat-welding them. In the bundled glass member forming step, the first glass member and the second glass member are bundled using at least one by one and aligned so as to have a different arrangement from the first multi-fiber member. Forming a second multi-fiber member by drawing in a state;
The bundled glass member is formed by bundling at least one of the first multifiber member and the second multifiber, and then heat-welding. Of manufacturing the electrode substrate. In the bundle glass member forming step, in addition to using a predetermined mold and bundling the first glass member and the second glass member one by one and aligning them in the arrangement, Further, the first glass member or the second glass member is aligned so as to have any one of a triangular shape, a quadrangular shape, and a hexagonal shape as viewed from the central axis direction. A method for producing the electrode substrate according to 4 or 5. In the through-hole forming step, a mask having a desired pattern is provided on the plate-like glass member, and at least one of the first core glass portion and the second core glass portion is removed through the mask. The manufacturing method of the electrode substrate as described in any one of Claims 1-6. A plurality of fiber-like first glass members including a first core glass portion having a first core diameter and a first coated glass portion provided around the first core glass portion, and a plurality of fiber-like fourth glass members are bundled. Bundles that are bundled using at least one by one, and then heat-welded to integrate the first glass member and the fourth glass member to form a bundled glass member. A glass member forming step;
A plate-like glass member forming step of cutting the bundle-like glass member to a desired thickness to form a plate-like glass member;
A through-hole forming step of removing the first core glass portion and the fourth glass member from the plate-like glass member, and forming a plurality of through-holes penetrating the plate-like glass member in the thickness direction; ,
In the through hole, a conductive member forming step of forming a conductive member that electrically conducts between both main surfaces of the plate-like glass member;
The manufacturing method of the electrode substrate characterized by including. The bundled glass member forming step includes
A third multi-fiber member forming step of bundling and aligning a plurality of the first glass members, forming a third multi-fiber member by drawing in the aligned state;
A fourth multi-fiber member forming step of bundling and aligning a plurality of the fourth glass members, and forming a fourth multi-fiber member by drawing in the aligned state;
A bundle forming step of forming the bundled glass member by bundling the third multifiber member and the fourth multifiber member using at least one by one, and then heat-sealing;
The manufacturing method of the electrode substrate of Claim 8 characterized by the above-mentioned. In the third multi-fiber member forming step, in addition to the first glass member, a fiber-shaped second glass member including a second core glass portion having a second core diameter different from the first core diameter is further provided. Using at least one bundle and aligning them in a predetermined arrangement, drawing in the aligned state to form the third multi-fiber member,
The method for manufacturing an electrode substrate according to claim 9, wherein the second core glass portion is further removed in the through hole forming step. The first glass member and the second glass member are bundled using at least one by one, aligned so as to have a different arrangement from the third multi-fiber member, and drawn in the aligned state to obtain a fifth multi-fiber. Including a fifth multi-fiber member forming step of forming a member;
In the bundle forming step, at least one of the third multi-fiber member, the fourth multi-fiber, and the fifth multi-fiber member are used and bundled and heat-welded to form the bundle-shaped glass member. The method for manufacturing an electrode substrate according to claim 10. The method for manufacturing an electrode substrate according to claim 10, wherein the second glass member further includes a second coated glass portion provided around the second core glass portion. In the third multi-fiber member forming step, in addition to the first glass member, at least one fiber-shaped third glass member is used and bundled to be aligned in a predetermined arrangement, and in an aligned state The method of manufacturing an electrode substrate according to claim 9, wherein the third multi-fiber member is formed by drawing. In the third multi-fiber member forming step, alignment is performed by a predetermined die so as to be any one of a triangular shape, a quadrangular shape, and a hexagonal shape when viewed from the central axis direction of the first glass member. And
10. The electrode substrate according to claim 9, wherein in the fourth multi-fiber member forming step, the electrode substrate is aligned so as to have the shape as viewed from the central axis direction of the fourth glass member by a predetermined mold. Production method. In the through-hole forming step, a mask having a desired pattern is provided on the plate-like glass member, and at least one of the first core glass portion and the fourth glass member portion is removed through the mask. The method for manufacturing an electrode substrate according to any one of claims 8 to 14, characterized in that: In the said plate-shaped glass member formation process, the said bundle-shaped glass member is cut | disconnected diagonally with respect to the axis | shaft orthogonal to the center axis | shaft, The any one of Claims 1-15 characterized by the above-mentioned. A method for manufacturing an electrode substrate. In the step of forming the plate-like glass member, the bundle-like glass member is heated and stretched to cut a portion whose outer shape is tapered. The manufacturing method of the electrode substrate as described in claim | item. Before the step of providing the conductive member, the method further comprises a step of heating and cooling the plate-like glass member in which a plurality of the through holes are formed to temper the plate-like glass member. The manufacturing method of the electrode substrate as described in any one of Claims 1-17. 19. The step of providing the conductive member, the conductive member is provided across the inner wall of the through hole and the outer periphery of the opening of the through hole. A method for manufacturing an electrode substrate. In the step of providing the conductive member, a mask having a desired pattern is provided on the plate-like glass member, a conductive metal layer is formed on the plate-like glass member through the mask, the mask is removed, The method for manufacturing an electrode substrate according to claim 1, wherein the conductive member is provided. 21. The electrode substrate according to claim 20, wherein an opening area of a portion corresponding to a through hole provided with the conductive member in the desired pattern is set larger than an opening area of the through hole. Method.

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