JP2010225699A - Laminated mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simply connect other members to a laminated mounting structure with a high density. <P>SOLUTION: The laminated mounting structure 1 includes: first substrates 11 and a second substrate 13 oppositely arranged while main surfaces are disposed mutually in parallel; connecting members 15 among the substrates mechanically and electrically connecting the first substrates 11 and the second substrate 13; and the connecting members 17 among the members for connecting other members arranged on the sides of the laminated mounting structure 1. The connecting members 15 among the substrates connect electrodes 111 for connecting the substrates formed on the main surfaces of the first substrates 11 and the electrodes 131 for connecting the substrates formed to the underside of the second substrate 13. In the connecting members 17 among the members, one-end side faces are brought into contact with the electrodes 113 for connecting the members, and the longitudinal directions of the other ends are disposed in parallel with the first substrates 11 so as to be extended outside one ends of the top faces of the first substrates 11, and parallel parts are formed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a stacked mounting structure in which substrates whose main surfaces are arranged in parallel are connected to each other.

  2. Description of the Related Art Conventionally, endoscopes that are inserted into a body cavity of a subject to observe a region to be examined are known and widely used in the medical field and the like. This endoscope is configured by incorporating an electronic circuit module in which an electronic component such as an image sensor is mounted at the distal end of a flexible elongated insertion tool. In order to relieve the patient's pain, the distal end portion of the insertion tool is desired to be reduced in diameter and shortened.

  By the way, for a stacked mounting structure configured by stacking substrates on which electronic components are mounted, if other members such as another substrate, electronic components, and electronic circuit modules can be connected so that the principal surfaces are orthogonal to each other, The space can be effectively used to connect other members with high density, and the electronic circuit module can be miniaturized. Here, the component mounting parts are arranged on the flexible board so that they are alternately front and back, and the wiring parts that connect each component mounting part are bent so that they are perpendicular to the mounting board surface. Is known (see Patent Document 1).

JP-A-5-291724

  However, the technique of Patent Document 1 has a problem that it is difficult to increase the density because it is necessary to provide a certain amount of space between adjacent component mounting portions so as not to break the wiring portions that connect the component mounting portions.

  This invention is made | formed in view of the above, Comprising: It aims at providing the laminated mounting structure which can connect another member easily and with high density.

  In order to solve the above-described problems and achieve the object, a stacked mounting structure according to the present invention includes a plurality of substrates in which main surfaces are arranged in parallel to each other, an inter-substrate connecting member that connects the substrates, On the substrate main surface of at least one substrate, there is a columnar parallel portion whose longitudinal direction is arranged parallel to the substrate main surface, and the other end side of the parallel portion extends to an end portion of the member main surface. And an inter-member connecting member connected at one end to the electrode for connecting members formed on the main surface of the substrate, and the main surface of the substrate and the main surface are disposed at the other end of the parallel portion. The members arranged so as to be orthogonal to each other are connected.

  Further, in the stacked mounting structure according to the present invention, in the above invention, the inter-member connection member includes a support portion that is erected on the member connection electrode and supports the parallel portion. Features.

  In the stacked mounting structure according to the present invention, a reinforcing member is disposed at least around the inter-substrate connecting member and the inter-member connecting member.

  In the stacked mounting structure according to the present invention, in the above invention, a plurality of the member connecting electrodes are formed on a main surface of the substrate to which the inter-member connecting member is connected, and each of the member connecting electrodes In addition, an inter-member connecting member having a different length of the support portion is connected.

  Further, in the stacked mounting structure according to the present invention, in the above invention, a protective layer is formed by filling a reinforcing member on a substrate main surface to which the inter-member connecting member is connected, and the end surface of the protective layer The other end of the parallel part is exposed.

  Also, in the stacked mounting structure according to the present invention, in the above invention, a side surface connection electrode is formed on the end surface where the other end of the parallel portion of the protective layer is exposed, and the other end of the parallel portion is formed. A wiring pattern for connecting at least one of the electrodes to the side connection electrode is formed.

  In the stacked mounting structure according to the present invention, a plurality of substrates having principal surfaces arranged in parallel to each other are connected by an inter-substrate connecting member, and a member formed on the substrate principal surface of at least one of the substrates. The connecting electrode is configured by connecting one end side of a parallel portion arranged in such a manner that its longitudinal direction is parallel to the substrate main surface and the other end side is extended to the end portion of the member main surface. And the member arrange | positioned so that the said board | substrate main surface and main surface may orthogonally cross can be connected to the other end side of a parallel part. Therefore, other members can be easily and densely connected to the stacked mounting structure.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the present embodiment.

(Embodiment 1)
1 and 2 are perspective views showing a configuration example of the stacked mounting structure 1 according to the first embodiment. In FIG. 1, the first substrate 11 and the second substrate 13 constituting the stacked mounting structure 1 are shown separately, and in FIG. 2, the first substrate 11, the second substrate 13, Is shown in a connected state. A stacked mounting structure 1 shown in FIG. 1 includes a first substrate 11 and a second substrate 13 that are opposed to each other with their main surfaces parallel to each other, and between the first substrate 11 and the second substrate 13. The board-to-board connection member 15 is connected mechanically and electrically, and the member-to-member connection member 17 for connecting other members disposed on the side of the stacked mounting structure 1 is provided.

  On the first substrate 11 on the lower side, a mounted component C11 which is an electronic component such as an electronic circuit is mounted on the upper surface which is the main surface, and at a predetermined position on the upper surface avoiding these mounted components C11, A plurality (four in the illustrated example) of the substrate connecting electrodes 111 are formed, and a plurality (three in each of the short sides in the illustrated example) of the member connecting electrodes are arranged at predetermined positions on the short side end. 113 is formed. On the other hand, on the upper second substrate 13, a mounted component C13, which is an electronic component such as an electronic circuit, is mounted on the upper surface, and a substrate connection electrode 131 is formed on the lower surface. The substrate connecting electrode 131 is formed at a position facing the substrate connecting electrode 111 of the first substrate 11 when the first substrate 11 and the second substrate 13 are disposed facing each other.

  The inter-substrate connecting member 15 is a columnar member made of a conductive material, and one end surface is in contact with the substrate connecting electrode 111 of the first substrate 11, and the other end surface is the substrate connecting electrode 131 of the second substrate 13. To connect between the first substrate 11 and the second substrate 13. The length of the inter-substrate connecting member 15 is determined by the height from the main surface of the first substrate 11 to the lower surface of the second substrate 13.

  The inter-member connecting member 17 is composed of one columnar member formed of a conductive material. FIG. 3 is a diagram for explaining a configuration example of the inter-member connecting member 17. As shown in FIG. 3, the inter-member connecting member 17 has a longitudinal direction so that one end side surface is in contact with the member connecting electrode 113 and the other end extends outside the one end portion of the upper surface of the first substrate 11. Are arranged in parallel with the first substrate 11 to form a parallel portion. The inter-member connecting member 17 is formed to have a length determined by the distance from the member connecting electrode 113 to one end of the first substrate 11.

  When manufacturing the stacked mounting structure 1, the inter-substrate connecting member 15 is erected on the substrate connecting electrode 111 of the first substrate 11 on which the mounted component C11 is mounted, and connected by, for example, soldering or the like. . Further, the inter-member connecting member 17 is arranged so that the longitudinal direction thereof is parallel to the main surface of the first substrate 11 and the other end extends outside the corresponding short side end portion of the first substrate 11. Then, one end side surface of the inter-member connecting member 17 is brought into contact with the member connecting electrode 113 and connected by soldering or the like. Subsequently, the first substrate 11 and the second substrate 13 are arranged to face each other. Then, the substrate connection electrode 131 on the lower surface is opposed to the substrate connection electrode 111 of the first substrate 11, the other end surface of the inter-substrate connection member 15 is brought into contact with each substrate connection electrode 131, and connected by soldering or the like. As a result, as shown in FIG. 2, the stacked mounting structure 1 in which the first substrate 11 and the second substrate 13 are mechanically and electrically connected is obtained. The gap E between the first substrate 11 and the second substrate 13 is filled with resin as a reinforcing member to form a protective layer, and the internal members are fixed and protected. By doing so, the reliability of the stacked mounting structure 1 is improved, and handling as a component can be easily performed. Further, the second substrate 13 may be appropriately filled with a resin to form a protective layer, and an internal member such as a mounted component may be fixed and protected.

  FIG. 4 is a partial cross-sectional view of the periphery of the inter-member connection member 17 showing a state in which the substrate 19 which is another member is connected to the stacked mounting structure 1. The main surface of the substrate 19 on the outer side of the one end portion of the first substrate 11 is directed to the first substrate 11 side so that the right surface in FIG. Has been placed. The substrate 19 has a mounting structure connecting electrode 191 formed at a predetermined position on the right side surface, and the other end surface of the inter-member connecting member 17 extending outside one end of the first substrate 11. They are touched and connected with solder or the like. As a result, the member connecting electrode 113 and the mounting structure connecting electrode 191 are connected, and the stacked mounting structure 1 and the substrate 19 are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 191 and the inter-member connection member 17 is sealed with the resin 18 to fix and protect the vicinity of the connection portion.

  As described above, according to the stacked mounting structure 1 of the first embodiment, the inter-member connection member 17 configured by one columnar member is disposed in parallel with the main surface of the first substrate 11 and one end thereof. Can be connected to the member connection electrode 113 formed on the main surface of the first substrate 11, and the other end can be extended outside one end of the upper surface of the first substrate 11. A stacked mounting structure 1 in which the second substrate 13 is stacked on the first substrate 11 can be realized. Therefore, other members such as the second substrate 13 arranged so that their principal surfaces are orthogonal to the first substrate 11 can be connected to the other end of the inter-member connection member 17 (parallel portion). According to this, it is possible to easily and densely connect other members such as a substrate to the stacked mounting structure 1. Further, the member connecting electrode 113 and the mounting structure connecting electrode 191 can be connected by the columnar member connecting member 17. At this time, it is possible to appropriately increase the diameter of the inter-member connecting member 17 in consideration of the space on the first substrate 11. Therefore, compared with the case where a wiring pattern is formed on the first substrate and connected, a connection with low resistance and high reliability can be realized.

  In the first embodiment described above, the inter-member connecting member constituted by one columnar member has been described, but the configuration of the inter-member connecting member is not limited to this.

(Modification 1)
FIG. 5 is a diagram for explaining a configuration example of the inter-member connection member 27 in the first modification. The inter-member connecting member 27 according to the first modification includes a first columnar member 271 and a second columnar member 273 that is a support portion. Each of the columnar members 271 and 273 is formed of a conductive material, and is substantially L in which the other end surface of the second columnar member 273 supporting the first columnar member 271 forming the parallel portion is connected to the side surface of the first columnar member 271. It has a letter-shaped outer shape. One end surface of the second columnar member 273 of the inter-member connecting member 27 is connected to the member connecting electrode 213 of the first substrate 21. The first columnar member 271 is arranged so that the longitudinal direction is parallel to the main surface of the first substrate 21, and the other end is extended to the outside of one end of the first substrate 21. . Here, the length of the second columnar member 273 is the position of the mounting structure connecting electrode of the member connected to the member connecting electrode 213 by the inter-member connecting member 27 (relative to the main surface position of the first substrate 21). It is defined according to the height of the mounting structure connecting electrode of the other member.

  When connecting the inter-member connecting member 27 to the member connecting electrode 213, first, one end surface of the second columnar member 273 is erected on the member connecting electrode 213 and connected. Subsequently, the longitudinal direction of the first columnar member 271 is arranged in parallel with the main surface of the first substrate 21, and one end side surface thereof is brought into contact with the other end surface of the second columnar member 273 via the metal film. Connecting. In addition, it is good also as connecting the one end part side surface of the 1st columnar member 271, and the other end surface of the 2nd columnar member 273 with solder etc. previously.

  FIG. 6 is a partial cross-sectional view of the periphery of the inter-member connection member 27 showing a state in which the substrate 29 as another member is connected to the stacked mounting structure 2 including the inter-member connection member 27 of the present modification. . The substrate 29 is arranged on the outer side of one end portion of the first substrate 21 such that the right side surface in FIG. 6 as the main surface faces the first substrate 21 side, and the first substrate 21 and the main surfaces are orthogonal to each other. Has been placed. A mounting structure connecting electrode 291 is formed on the substrate 29 at a predetermined position on the right side surface, and the other end surface of the inter-member connecting member 27 extending outside one end of the first substrate 21. They are touched and connected with solder or the like. As a result, the member connecting electrode 213 and the mounting structure connecting electrode 291 are connected, and the stacked mounting structure 2 and the substrate 29 are mechanically and electrically connected. Further, the vicinity of the connecting portion between the mounting structure connecting electrode 291 and the inter-member connecting member 27 is sealed with the resin 28, and the vicinity of these connecting portions is fixed and protected.

  As described above, according to the first modification, the inter-member connecting member 27 having a predetermined height can be configured by adjusting the length of the second columnar member 273.

(Modification 2)
FIG. 7 is a view for explaining a configuration example of the inter-member connection member 37 in the second modification. The inter-member connection member 37 of Modification 2 includes a first columnar member 371 and a second columnar member 373 that is a support portion. Each of the columnar members 371 and 373 is formed of a conductive material, and one end surface of the first columnar member 371 is connected to the side surface of the second columnar member 373. One end surface of the second columnar member 371 is in contact with the member connection electrode 313 of the first substrate 31, and the longitudinal direction of the first columnar member 371 is parallel to the main surface of the first substrate 31. The other end is extended to the outside of one end portion of the first substrate 31. Here, the connection position of the first columnar member 371 with respect to the second columnar member 373 is, for example, the position of the mounting structure connection electrode of another member connected to the member connection electrode 313 by the inter-member connection member 37. It is defined according to (the height of the mounting structure connecting electrode of another member with respect to the main surface position of the first substrate 31).

  When connecting the inter-member connecting member 37 to the member connecting electrode 313, for example, one end surface of the first columnar member 371 is connected to the side surface of the second columnar member 373 in advance via a metal film. The first columnar member 371 is disposed so that the longitudinal direction of the first columnar member 371 is parallel to the main surface of the first substrate 31 and the other end extends outside one end of the first substrate 31. Then, one end surface of the second columnar member 373 is erected on the member connection electrode 313 to be connected.

  FIG. 8 is a partial cross-sectional view of the periphery of the inter-member connection member 37 showing a state in which the substrate 39 as another member is connected to the stacked mounting structure 3 including the inter-member connection member 37 of the present modification. . The substrate 39 is arranged outside the one end portion of the first substrate 31 such that the right side in FIG. 8 as the main surface faces the substrate 39 side, and the first substrate 31 and the main surfaces are orthogonal to each other. Yes. The substrate 39 has a mounting structure connecting electrode 391 formed at a predetermined position on the right side surface, and the other end surface of the inter-member connecting member 37 extending to the outside of one end of the first substrate 31. They are touched and connected with solder or the like. As a result, the member connection electrode 313 and the mounting structure connection electrode 391 are connected, and the stacked mounting structure 3 and the substrate 39 are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 391 and the inter-member connection member 37 is sealed with the resin 38 to fix and protect the vicinity of the connection portion.

  As described above, according to the second modification, by adjusting the connection position of the first columnar member 371 with respect to the second columnar member 373, the parallel portion (the first columnar shape) with respect to the main surface of the first substrate 31 is adjusted. The height of the member 371) can be adjusted. Therefore, unlike the first modification, it is not necessary to form the second columnar members having different lengths for height adjustment, and the cost can be reduced.

(Modification 3)
FIG. 9 is a diagram for explaining a configuration example of the inter-member connection member 47 in the third modification. The member connection member 47 of Modification 2 is formed by integrally forming the first columnar member and the second columnar member constituting the member connection member 27 of Modification 1 and the connection member 37 of Modification 2. is there. For example, in the illustrated example, one columnar member formed of a conductive material has an outer shape L-shape in which a parallel portion 471 is formed by bending a middle portion. The base end portion is in contact with the member connection electrode 413 of the first substrate 41, the parallel portion 471 is disposed in parallel with the main surface of the first substrate 41, and the tip thereof is the first substrate 41. It arrange | positions so that it may extend to one end part outer side. Here, the length from the base end portion of the inter-member connecting member 47 to the midway portion is the position of the mounting structure connecting electrode of the other member connected to the member connecting electrode 413 by the inter-member connecting member 47 (first The height of the mounting structure connection electrode of another member with respect to the main surface position of one substrate 41).

  When the inter-member connecting member 47 is connected to the member connecting electrode 413, the parallel portion 471 of the inter-member connecting member 47 is made parallel to the first substrate 41. Then, the base end portion is erected on and connected to the member connection electrode 413 so that the front end of the parallel portion 471 extends outside one end portion of the first substrate 41.

  FIG. 10 is a partial cross-sectional view of the periphery of the inter-member connection member 47 showing a state in which the substrate 49 which is another member is connected to the stacked mounting structure 4 including the inter-member connection member 47 of the present modification. . The substrate 49 is arranged such that, on the outer side of one end portion of the first substrate 41, the right side surface in FIG. Has been placed. A mounting structure connecting electrode 491 is formed on the substrate 49 at a predetermined position on the right side surface, and the other end surface of the inter-member connecting member 47 extending outside one end portion of the first substrate 41. They are touched and connected with solder or the like. As a result, the member connection electrode 413 and the mounting structure connection electrode 491 are connected, and the stacked mounting structure 4 and the substrate 49 are mechanically and electrically connected. In addition, the vicinity of the connection portion between the mounting structure connection electrode 491 and the inter-member connection member 47 is sealed with the resin 48 to fix and protect the vicinity of the connection portion.

  As described above, according to the third modification, unlike the first and second modifications, it is not necessary to use the first columnar member and the second columnar member which are separate bodies and to connect them. Therefore, the number of parts can be reduced, and a step of connecting the first columnar member and the second columnar member is unnecessary. According to this, since the number of processes at the time of manufacture can be reduced, the manufacture of the stacked mounting structure 4 can be facilitated.

(Modification 4)
FIG. 11 is a diagram illustrating the configuration of the inter-member connecting members 571 and 573 in the fourth modification. In the fourth modification, member connection electrodes 513 and 513 are formed at predetermined positions on one end side of the upper surface, which is the main surface of the substrate 51, and two types of member connection members 571 are provided on the member connection electrodes 513 and 513. , 573 are connected.

  The inter-member connecting member 571 is configured in the same manner as the inter-member connecting member 17 of the first embodiment, is in contact with the outer member connecting electrode 513, and the other end is outside one end portion of the first substrate 51. The first substrate 51 is arranged so that its longitudinal direction extends in parallel with the first substrate 51. On the other hand, the inter-member connecting member 573 is configured in the same manner as the inter-member connecting member 27 of Modification 1, and includes a first columnar member 574 and a second columnar member 575. One end surface of the second columnar member 575 of the inter-member connecting member 573 is connected to the inner member connecting electrode 513. The first columnar member 574 is disposed so that the longitudinal direction thereof is parallel to the main surface of the first substrate 51, and the other end extends to the outside of one end of the first substrate 51. . Here, the length of the second columnar member 575 is the position of the mounting structure connecting electrode of the other member connected to the member connecting electrode 513 by the inter-member connecting member 573 (the main surface of the first substrate 51). Depending on the height of the mounting structure connecting electrode of another member with respect to the position, the parallel portions of the inter-member connecting members 571 and 573 (that is, the inter-member connecting member 571 and the inter-member connecting member 573) are arranged vertically. The first columnar members 574) are defined so as not to contact each other.

  When connecting the inter-member connecting members 571, 573 to the member connecting electrodes 513, 513, the longitudinal direction of the inter-member connecting member 571 is arranged parallel to the main surface of the first substrate 51, and the inter-member connecting member One end side surface of 571 is connected to member connection electrode 513. Further, one end face of the second columnar member 575 constituting the inter-member connecting member 573 is erected on the member connecting electrode 513 to be connected. Subsequently, the longitudinal direction of the first columnar member 574 is arranged in parallel with the main surface of the first substrate 51, and one end side surface thereof is brought into contact with the other end surface of the second columnar member 575 via the metal film. Connecting.

  FIG. 12 shows a part of the periphery of the inter-member connection members 571 and 573 showing a state in which the substrate 59 as another member is connected to the stacked mounting structure 5 including the inter-member connection members 571 and 573 of this modification. It is sectional drawing. The substrate 59 is arranged such that, on the outer side of one end portion of the first substrate 51, the right side surface in FIG. Has been placed. The substrate 59 is provided with mounting structure connection electrodes 591 and 591 at predetermined positions on the right side surface. In addition to the inter-member connection member 571 extending to the outside of one end of the first substrate 51. The end face and the other end face of the second columnar member 575 of the inter-member connecting member 573 are respectively contacted and connected by solder or the like. As a result, the member connecting electrode 513 and the mounting structure connecting electrode 591 are connected, and the member connecting electrode 513 and the mounting structure connecting electrode 591 are connected, and the stacked mounting structure 5 and the substrate 59 are connected. Are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 591 and the inter-member connection member 571 is sealed with resin 581, and the vicinity of the connection portion between the mounting structure connection electrode 591 and the inter-member connection member 573 is resin. Sealed at 583, the vicinity of these connecting portions is fixed and protected.

  As described above, according to the fourth modification, by using the two types of inter-member connecting members 571 and 573 in combination, they can be arranged and connected so that the parallel portions do not contact each other. Therefore, since the space on the first substrate 51 can be used effectively, the degree of freedom in design increases.

  In addition, not only when combining the connection members 571 and 573 between members, the connection member from which the height of the parallel part with respect to the main surface of the 1st board | substrate 51 differs is comprised using the 2nd columnar member from which length differs. These may be used in combination. Moreover, it is good also as combining the connection member demonstrated in the modification 2,3. For example, in the case of combining the member connecting members described in Modification 2, the connection position of the first columnar member with respect to the second columnar member is adjusted so that the parallel portions do not contact each other. Alternatively, the connection position of the first columnar member with respect to the second columnar member is made different to constitute a member connection member having different heights of the parallel portions with respect to the main surface of the first substrate, and these are used in combination. Also good. If the inter-member connecting members described in Modification 3 are combined, the length from the base end portion to the midway portion is adjusted so that the parallel portions do not contact each other. Alternatively, it is also possible to configure member-to-member connecting members having different lengths from the base end portion to the midway portion and having different parallel portion heights with respect to the main surface of the first substrate 51, and use them in combination.

(Embodiment 2)
In the first embodiment, the case where the other end of the connection member forming the parallel portion extends to the outside of the one end portion of the first substrate has been described. However, the other end portion of the parallel portion is located on the first substrate. You may do it. FIG. 13 is a diagram illustrating the configuration of the inter-member connection member 67 according to the second embodiment. In the present embodiment, the member connection electrode 613 is formed at a predetermined position on one end of the upper surface, which is the main surface of the first substrate 61, and the member connection electrode 613 of Modification 3 is formed on the member connection electrode 613. An inter-member connecting member 67 configured similarly to 47 is connected. In the inter-member connecting member 67, the base end portion is in contact with the member connecting electrode 613 and the longitudinal direction of the parallel portion 671 is arranged in parallel with the first substrate 61 as in the third modification. In the second embodiment, the tip of the parallel portion 671 is positioned on the first substrate 61.

  FIG. 14 is a partial cross-sectional view showing a state in which a substrate 69 which is another member is connected to the stacked mounting structure 6. In FIG. 14, illustration of a protective layer formed by filling the resin on the first substrate 61 is omitted. The substrate 69 is arranged on the first substrate 61 so that the principal surfaces thereof are orthogonal to the first substrate 61. The substrate 69 has a mounting structure connecting electrode 691 formed at a predetermined position on the right side in FIG. 14, which is the main surface, and is positioned on the first substrate 61 of the inter-member connecting member 67. The other end surface of the parallel part 671 is connected with solder or the like. As a result, the member connecting electrode 613 and the mounting structure connecting electrode 691 are connected, and the stacked mounting structure 6 and the substrate 69 are mechanically and electrically connected.

  As described above, according to the second embodiment, the same effects as those of the first embodiment can be obtained, and the main surfaces are orthogonal to the first substrate 61 inside the stacked mounting structure 6. The board | substrate 69 arrange | positioned in this way can be connected. Therefore, the stacked mounting structure 6 in which other members such as the substrate 69 are connected with higher density can be realized. In addition, although the case where the connection member of the structure of the modification 3 was applied was demonstrated, the connection member of the other structure demonstrated in Embodiment 1 and the modifications 1 and 2 is applicable similarly.

  FIG. 15 is a schematic perspective view schematically illustrating the entire configuration of the electronic circuit module 7 including the stacked mounting structure according to the second embodiment. In FIG. 15, the second substrate disposed opposite to the first substrate 71, the inter-substrate connecting member for connecting the second substrate to the first substrate 71, and the resin on the first substrate 71 are filled. The protective layer formed in this manner is not shown. The electronic circuit module 7 shown in FIG. 15 has a plurality of member connection electrodes 713a, 713b, 713e, and 713f formed at the end portion on the short side of the upper surface, which is the main surface, and a member connection member at a predetermined position in the center. A stacked mounting structure according to the second embodiment, which includes a first substrate 71 on which electrodes 713c and 713d are formed, and inter-member connection members 77a to 77f whose base ends are connected to the respective member connection electrodes 713a to 713f. Including the body. And two board | substrates 79a and 79b are arrange | positioned so that the 1st board | substrate 71 and main surfaces may orthogonally cross on the outer side of the short side of the 1st board | substrate 71, and board | substrates are provided by the member connection members 77a and 77b. 79a is connected, and the board | substrate 79b is connected by the member connection members 77e and 77f. In addition, one substrate 79c is arranged on the first substrate 71 so that the main surfaces thereof are orthogonal to the first substrate 71, and the substrate 79c is connected by inter-member connection members 77c and 77d. Here, an unillustrated mounted component, an inter-substrate connection member for connecting to an unillustrated second substrate, and the like are mounted on the first substrate 71, and the substrate 79c includes these mounted components. Avoid being connected. As described above, according to the electronic circuit module 7 including the stacked mounting structure of the second embodiment, another member such as the substrate 79c is also connected to the inside of the stacked mounting structure (that is, on the first substrate 71). The space on the first substrate 71 can be used effectively. Therefore, it is possible to configure the electronic circuit module 7 in which the substrates 79a, 79b, and 79c, which are other members, are mounted on the stacked mounting structure with higher density. In addition, not only the short side of the 1st board | substrate 71 but a member connection electrode may be formed in the edge part of a long side, and it is good also as connecting other members, such as a board | substrate, to the outer side.

(Embodiment 3)
FIG. 16 is a partial cross-sectional view around the member connecting members 871 and 873 of the stacked mounting structure 8 according to the third embodiment. FIG. 17 shows a member connecting electrode 813a formed on the first substrate 81. , 813b and FIG. 18 is a side view of the stacked mounting structure 8 as viewed from one end side of the first substrate 81. As shown in FIG. 16, on the first substrate 81 of the stacked mounting structure 8 of the third embodiment, a mounted component (not shown) is mounted on the upper surface which is the main surface, and this mounted component is avoided. Member connection electrodes 813a and 813b are formed at predetermined positions on one end of the upper surface. Specifically, as shown in FIG. 17, on one end of the upper surface of the first substrate 81, a plurality (five in the illustrated example) of member connection electrodes 813a arranged adjacent to two rows, 813b is formed, the inter-member connection member 871 is connected to the three outer member connection electrodes 813a, and the inter-member connection member 873 is connected to the two inner member connection electrodes 813b. At this time, the height of the inter-member connection member 873 is defined so that the vertical positions of the parallel portions of the connection members 871, 873 and the inter-member connection members 871, 873 do not overlap. As shown in FIG. 18, when the stacked mounting structure 8 is viewed from one end side of the first substrate 81, the inter-member connection members 871 and 873 are high in the parallel portion from the main surface of the first substrate 81. The high positions and the low positions are arranged adjacent to each other so that they are alternately arranged. Note that the combination of connection members having different parallel part heights from the main surface of the first substrate 81 is not limited to the combination of the inter-member connection members 871 and 873 shown in FIG. The connecting members described in 1 to 3 can be used in appropriate combination.

  FIG. 19 is a schematic perspective view illustrating the overall configuration of the stacked mounting structure 8 according to the third embodiment. As shown in FIG. 19, a plurality of mounted components C 811 to C 816 and a connection between the first substrate 81 and the second substrate 83 are provided on the first substrate 81 of the stacked mounting structure 8. The inter-board connecting member 85 is mounted. As shown in FIGS. 16 to 18, two types of inter-member connection members 871, 873 are arranged at one end of the first substrate 81, and the first substrate 81 It is connected to the upper member connection electrode (not shown). Similarly, two types of inter-member connection members 871 and 873 are arranged on the other end of the first substrate 81, and each of the member connection electrodes (not shown) on the first substrate 81 is provided. It is connected. Further, on the first substrate 81, connecting members 875 and 876 formed in U-shapes having different heights are arranged. Specifically, the inter-member connecting members 875 and 876 are arranged such that portions arranged parallel to the main surface of the first substrate 81 intersect three-dimensionally above the mounted components C814 and C815. The electrodes to be connected (not shown) formed on the first substrate 81 are connected. The first substrate 81 is connected to the second substrate 83 disposed opposite to the first substrate 81 by the inter-substrate connection member 85. A resin is filled between the first substrate 81 and the second substrate, and the end surface is polished to be modularized. In addition, not only the short side of the first substrate 81 but also a member connection electrode may be formed at the end of the long side, and another member such as a substrate may be connected to the outside.

  As described above, according to the stacked mounting structure 8 of the third embodiment, the same effects as those of the first embodiment described above can be obtained, and a plurality of inter-member connection members 871 and 873 are connected. , The parallel portions of the adjacent inter-member connecting members 871, 873 can be arranged at a narrow pitch. Therefore, the stacked mounting structure 8 can be reduced in size. In addition, as shown in FIG. 16, the first connecting member 875, 876 having different heights of the portions arranged in parallel with the main surface of the first substrate 81 is used in an appropriate combination, so that the first The electrodes on the substrate 81 can be three-dimensionally connected. According to this, the space on the first substrate 81 can be used effectively, downsizing can be realized, and compared with the case where the wiring pattern is formed on the substrate and connected, the resistance is low and the reliability is high. Connection can be realized.

(Embodiment 4)
The fourth embodiment relates to a method for manufacturing a stacked mounting structure. FIG. 20 is a diagram illustrating a method for manufacturing the stacked mounting structure in the fourth embodiment. In the method for manufacturing the stacked mounting structure shown in FIG. 20, first, the mounted component C91 is mounted on the upper surface, which is the main surface of the first substrate 91, with solder or the like (FIG. 20A). At this time, the substrate connection electrode is formed at a predetermined position on the upper surface, and the member connection electrode is formed at a predetermined position on the upper surface side end. Subsequently, one end surface of the inter-substrate connection member 95 is erected and connected to the substrate connection electrode formed on the upper surface (FIG. 20B). Subsequently, at the side end portion of the first substrate 91, the longitudinal direction is parallel to the first substrate 91 and the other end extends to the outside of the corresponding side end portion of the first substrate 91. The connecting member 97 is disposed, and one end is connected to the member connecting electrode substrate formed on the upper surface (FIG. 20C). Then, the protective layer 98 is formed, and the mounted component C91, the inter-substrate connecting member 95, and the inter-member connecting member 97 are resin-sealed (FIG. 20D). Subsequently, the upper surface of the protective layer 98 is polished and flattened, and the other end surface of the inter-substrate connecting member 95 is exposed (FIG. 20E). Then, a metal film 951 is formed on the other end of the exposed inter-substrate connection member 95, and bumps 952 are formed on the metal film 951 (FIG. 20 (f)). Although not shown, thereafter, a second substrate (not shown) is disposed so as to face the first substrate 91 via the bumps 952 to obtain mechanical and electrical connection therebetween. According to this method for manufacturing a stacked mounting structure, even when the length of the inter-substrate connecting member 95 cannot be accurately defined, the opposing members can be reliably connected.

(Embodiment 5)
By the way, in Embodiment 4, although the case where the multilayer mounting structure was produced (manufactured) alone was described, the manufacturing method of the multilayer mounting structure is not limited thereto. FIG. 21 is a diagram for explaining the principle of the manufacturing method of the stacked mounting structure according to the fifth embodiment.

  In this manufacturing method, a plurality of stacked mounting structures are manufactured simultaneously. Here, on the main surface of one substrate 101 serving as the first substrate, mounted components (not shown) are mounted for each of the partition areas A101 defined by the cutting positions indicated by broken lines in FIG. A board-to-board connecting member 105 is mounted. Similarly, on the main surface of one substrate 103 serving as the second substrate, a component to be mounted (not shown) is mounted for each partition region A103 defined by a cutting position indicated by a broken line in FIG. Then, after the substrates 101 and 103 are connected by the inter-substrate connecting member 105, they are finally cut at the cutting position and divided (divided into individual pieces). In this method for manufacturing a stacked mounting structure, member connection electrodes 1013a and 1013b to which one end of an inter-member connection member is connected are formed on the main surface of the substrate 101 so as to face each other across the cutting position. In the example shown in the drawing, two sets of opposing member connection electrodes 1013a and 1013b are formed at each end of each partition region A101 across each side. And the member 107 which has the columnar part 1071 and becomes an inter-member connection member when separated into the respective stacked mounting structures 10a and 10b is disposed between the opposing member connection electrodes 1013a and 1013b. This columnar part 1071 is a part which forms the parallel part of the connection member between members, and the member 107 is arrange | positioned so that the columnar part 1071 may straddle a cutting position. Then, through a protective layer arranging step and the like, a stacked mounting structure that is finally cut and cut into pieces at a cutting position and modularized is obtained.

  22-1 to 22-3 are diagrams illustrating a specific example of the manufacturing method of the present stacked mounting structure. FIG. 23 is a partial cross-sectional view showing a state in which a substrate as another member is connected to the manufactured stacked mounting structure. Here, a case where a stacked mounting structure to which the inter-member connecting member 47 of Modification 3 is applied will be described as an example. Although not shown in the drawings, it will be described that the component to be mounted and the inter-board connecting member are already mounted on the main surface of the substrate 101. That is, as shown in FIG. 22-1, member connection electrodes 1013a and 1013b are formed on the main surface of the substrate 101 at positions facing each other across the cutting position indicated by the broken line in FIG. Forming step). Next, the connection process is started. In this manufacturing method, an outer U-shaped member 107 in which support portions 1072a and 1072b are integrally formed at both ends of a columnar portion 1071 forming a parallel portion is prepared. In the connecting step, the columnar portion 1071 is arranged in parallel with the main surface of the substrate 101, and the base end portions of the support portions 1072a and 1072b are erected on the electrode for connecting members facing each other across the cutting position. To do. Next, the process moves to an arrangement step, and as shown in FIG. 22-2, the protective layer 108 is formed by filling the substrate 101 with resin. Then, after the connecting process of the second substrate 103, the process proceeds to the singulation process, and as shown in FIG. 22-3, singulation is performed to obtain the stacked mounting structures 10a and 10b.

  As shown in FIG. 23, the stacked mounting structures 10a and 10b manufactured in this way are formed with mounting structure connection electrodes 1091a and 1091b on the main surface in the same manner as in the above embodiments. It is connected to the substrates 109a and 109b which are other members. Specifically, the substrate 109a has a main surface on the outer side of one end of the first substrate 101a, the left side surface in FIG. 23 facing the first substrate 101a side, and the first substrate 101a and the main surface. Are arranged so as to be orthogonal to each other. The mounting structure connecting electrode 1091a is connected to the other end surface of the inter-member connecting member 107a extending to the outside of one end of the first substrate 101a, and the space between the stacked mounting structure 10a and the substrate 109a is connected. Connected mechanically and electrically. Similarly, the substrate 109b has the main surface of the first substrate 101b on the outer side of the one end portion of the first substrate 101b with the right side in FIG. It arrange | positions so that it may orthogonally cross. The mounting structure connecting electrode 1091b is connected to the other end surface of the inter-member connecting member 107b extending to the outside of one end of the first substrate 101b, and the space between the stacked mounting structure 10b and the substrate 109b is connected. Connected mechanically and electrically.

  As described above, according to the method for manufacturing a stacked mounting structure according to the fifth embodiment, a plurality of stacked mounting structures can be manufactured at one time, so that manufacturing costs can be reduced and productivity can be improved. it can.

  In addition, although the member connection member of the structure demonstrated in the above-mentioned modification 3 was applied, it can apply similarly to the member connection member of the other structure demonstrated in Embodiment 1 and the modification 1,2. For example, if the connection member having the configuration described in Modification 1 is applied, in the connection step, one end surface of each second columnar member is erected on each of the member connection electrodes facing each other across the cutting position. Connect. Then, one columnar member corresponding to the columnar portion is arranged in parallel with the main surface of the substrate serving as the first substrate, and the side surfaces of both end portions are connected to the other end surface of the second columnar member. In the case of the manufacturing method according to the fifth embodiment, since the step of connecting the second columnar member and the columnar member is not required unlike the present modification, the number of steps during manufacturing can be reduced.

  In the above-described fifth embodiment, the case where the same number (two) of member connection electrodes is formed at each end on the substrate constituting the stacked mounting structure is described. The number of member connection electrodes can be set as appropriate. FIG. 24 is a diagram showing a modification of the arrangement position of the member connection electrodes formed on the substrate. FIG. 25 is a diagram for explaining the principle of the manufacturing method of the stacked mounting structure according to this modification.

  As shown in FIG. 24, three member connection electrodes 1113 (1113a to 1113c) are provided on the left end portion of the substrate 1110a shown in FIG. 24 on the main surface of the stacked mounting structure manufactured by the manufacturing method of this modification. , One member connecting electrode 1113 (1113d) is formed at the right end, and two member connecting electrodes 1113 (1113e to 1113h) are formed at the upper end and the lower end, respectively. In the connection step in this case, as shown in FIG. 25, the positions of the member connection electrodes 1113 formed in the adjacent partition regions A1110 are lined with respect to each other across the cutting position indicated by the broken line in FIG. As described above, each member connection electrode 1130 is formed on the substrate 1110. Then, after the substrates 1110 and 1130 are connected, they are finally cut at the cutting position and divided (separated). According to this, even when the number (including 0) of the member connection electrodes formed on the end portion of the substrate is different for each end portion, it can be manufactured at the same time. More specifically, even if the number of member connection electrodes formed on one opposite end is different, if the number of member connection electrodes formed on the other opposite end is the same, It can be produced at the same time.

(Embodiment 6)
FIG. 26 is a schematic perspective view showing the overall configuration of the stacked mounting structure 1200 of the sixth embodiment. In the stacked mounting structure 1200 shown in FIG. 26, a plurality of (nine in the illustrated example) inter-member connection members 1270a to 1270i are provided on the end surface of the protective layer 1280 between the first substrate 1210 and the second substrate 1230. The other end (specifically, the other end of the parallel portion formed in the inter-member connecting members 1270a to 1270i) is exposed. A plurality (four in the illustrated example) of side connection electrodes 1281a to 1281d are formed on the end face, and the side connection electrodes 1281a to 1281d and the mounting structure connection electrodes are formed on the main surface. The other member is connected. Specifically, the other end of the inter-member connection member 1270b and the side surface connection electrode 1281a are connected by the wiring patterns P1210, P1230, and P1250 formed on the end surface of the protective layer 1280, and the inter-member connection member 1270h. The end and the side connection electrode 1281b are connected, and the other end of the inter-member connection member 1270e and the side connection electrode 1281c are connected. Each of the wiring patterns P1210, P1230, and P1250 can be formed by appropriately using, for example, a thin film method or an ink jet method. At this time, an insulating protective film may be formed on the end surface of the protective layer 1280 other than the side surface connection electrodes 1281a to 1281d.

  According to the sixth embodiment, the side surface connection electrodes 1281a to 1281d connected to other members can be formed on the end surface of the protective layer 1280. Therefore, the connection positions with other members in the stacked mounting structure 1200 Can be freely adjusted, and the degree of freedom in design increases.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit of the invention.

  For example, in each of the above-described embodiments and modifications, a member connection electrode formed on a substrate constituting a stacked mounting structure, and a mounting structure connection electrode formed on a substrate which is another member; However, the present invention is not limited to this. FIG. 27 is a part of the periphery of the inter-member connection members 1371 and 1373 showing a state in which the substrate 1390 which is another member is connected to the stacked mounting structure 1300 including the inter-member connection members 1371 and 1373 of the present modification. It is sectional drawing. The substrate 1390 is arranged such that, on the outer side of one end of the first substrate 1310, the right surface in FIG. 27, which is the main surface, faces the first substrate 1310, and the first substrate 1310 and the main surfaces are orthogonal to each other. Has been placed.

  The inter-member connecting member 1371 is configured in the same manner as the inter-member connecting member 17 of the first embodiment, and one end is connected to the member connecting electrode 1313 on the first substrate 1310. On the other hand, the inter-member connecting member 1373 is configured similarly to the inter-member connecting member 27 of the first modification. In this modification, one end surface of the second columnar member 1375 of the inter-member connection member 1373 is connected to a member connection electrode 1314 formed on the main surface of the mounted component C1310. The first columnar member 1374 has the longitudinal direction parallel to the main surface of the first substrate 1310 (parallel to the main surface of the mounted component C1310), and the other end outside the one end portion of the first substrate 1310. It is arranged to extend. The stacked mounting structure 1300 is connected to a substrate 1390 which is another member in which mounting structure connection electrodes 1391a and 1391b are formed on the main surface as in the above-described embodiments. Here, the length of the second columnar member 1375 of the inter-member connecting member 1373 is the position of the mounting structure connecting electrode 1391b of the first substrate 1310 connected to the member connecting electrode 1314 by the inter-member connecting member 1373. (The height of the mounting structure connecting electrode 1391b of the first substrate 1310 with respect to the main surface position where the member connecting electrode 1314 of the mounted component C1310 is formed).

  Further, in each of the above-described embodiments and modifications, the case where the other end surface of the parallel portion formed on the connection member is connected to the mounting structure connection electrode formed on another member such as a substrate has been described. It is not limited to this. In the modification described below, a connection member having the same configuration as the connection member of Modification 3 will be described as an example. However, connection members having other configurations described in Embodiment 1 and Modifications 1 and 2 will be described. Can be applied similarly.

  FIG. 28 is a diagram for explaining a modification of the connection method between the other end side of the parallel portion 1471 formed on the inter-member connecting member 1470 and the mounting structure connecting electrode 1491 of the substrate which is another member. In the example of FIG. 28, the base end portion of the inter-member connecting member 1470 is connected to the member connecting electrode 1413, and the protective layer 1480 is formed by filling the resin on the first substrate 1410, and then the inter-member connecting member 1470. The protruding portion on the front end side of the parallel portion 1471 is bent upward, for example, along the end surface of the protective layer 1480. This stacked mounting structure 1400 is connected to a substrate 1490 which is another member on which mounting structure connection electrodes 1491 are formed. Specifically, the side surface of the other end of the bent parallel portion 1471 is connected to the mounting structure connecting electrode 1491. According to this, compared with the case where the other end surface of the parallel part 1471 is connected to the mounting structure connecting electrode 1491, a connection area of the parallel part 1471 with respect to the mounting structure connecting electrode 1491 can be secured widely. The connection strength between them can be increased.

  FIG. 29 is a diagram for explaining another modification of the method for connecting the other end side of the parallel portion 1571 formed in the inter-member connecting member 1570 and the mounting structure connecting electrode 1591 of the substrate which is another member. It is. In the example of FIG. 29, after the base end portion of the inter-member connecting member 1570 is connected to the member connecting electrode 1513, the other end side of the parallel portion 1571 is bent upward, for example. After that, a resin is filled on the first substrate 1510 to form a protective layer 1580, and the end surface of one end side of the first substrate 1510 of the protective layer 1580 is polished, whereby the side surface of the other end portion of the parallel portion 1571 is obtained. To expose. This stacked mounting structure 1500 is connected to a substrate 1590 which is another member on which mounting structure connection electrodes 1591 are formed. Specifically, the exposed side surface of the other end of the parallel portion 1571 is connected to the mounting structure connecting electrode 1591. In this case as well, a wide connection area of the parallel portion 1571 with respect to the mounting structure connection electrode 1591 can be secured, and the connection strength between them can be increased.

  In the first to third embodiments and the first to fourth modifications described above, the other end of the parallel portion formed on the connection member extends outside the one end portion of the upper surface of the substrate constituting the stacked mounting structure. However, it only has to extend to at least one edge of the upper surface of the substrate. In this case, for example, after a protective layer is formed by filling a resin on the substrate, the end surface of the protective layer on one end side of the substrate is polished. Thus, the other end surface of the parallel portion may be exposed from the side surface on one end side of the stacked mounting structure.

  Further, in each of the above-described embodiments and modifications, member connection electrodes are formed on the first substrate disposed on the lower side among the substrates that are arranged to face each other and constitute the stacked mounting structure, and between the members Although the connection member has been described as being connected, the member connection electrode may be formed on the upper second substrate to connect the inter-member connection member.

  Further, in each of the above-described embodiments and modifications, the protective layer is formed by filling the resin between the first substrate and the second substrate that are opposed to each other. Near the connection position between the substrate connection electrode of the first substrate, near the connection position between the inter-substrate connection member and the substrate connection electrode of the second substrate, and near the connection position between the inter-member connection member and the member connection electrode. It is good also as sealing resin, respectively.

  In addition, the first substrate, the second substrate, and the substrate shown as examples of other members may be a wiring substrate on which a wiring pattern is formed, or an electronic circuit or the like mounted inside. May be.

  Moreover, although each above-mentioned embodiment and modification demonstrated the case where a board | substrate was connected with respect to a lamination | stacking mounting structure, the other member of connection object is not limited to a board | substrate. For example, the present invention can be similarly applied to a case where members such as an electronic component and an electronic circuit module are arranged with respect to the substrate so that the principal surfaces are orthogonal to each other, and these are connected.

3 is a perspective view showing a configuration example of a stacked mounting structure in Embodiment 1. FIG. 3 is a perspective view showing a configuration example of a stacked mounting structure in Embodiment 1. FIG. FIG. 3 is a diagram for explaining a configuration example of an inter-member connecting member in the first embodiment. It is a partial cross section figure of the periphery of the connection member between members which shows the state which connected the board | substrate which is another member with respect to the laminated mounting structure. It is a figure for demonstrating the structural example of the member connection member in the modification 1. FIG. 10 is a partial cross-sectional view of a stacked mounting structure including an inter-member connecting member in Modification 1. FIG. It is a figure for demonstrating the structural example of the member connection member in the modification 2. FIG. 10 is a partial cross-sectional view of a stacked mounting structure including an inter-member connecting member in Modification 2. FIG. It is a figure for demonstrating the structural example of the member connection member in the modification 3. FIG. 10 is a partial cross-sectional view of a stacked mounting structure including an inter-member connecting member in Modification 3. FIG. It is a figure explaining the composition of the member connection member in modification 4. 10 is a partial cross-sectional view of a stacked mounting structure including an inter-member connecting member in Modification 4. FIG. It is a figure explaining the structure of the connection member between members in Embodiment 2. FIG. FIG. 6 is a partial cross-sectional view showing a state in which a substrate is connected to the stacked mounting structure in the second embodiment. FIG. 5 is a schematic perspective view schematically showing an overall configuration of an electronic circuit module 7 including a stacked mounting structure in a second embodiment. FIG. 10 is a partial cross-sectional view of the stacked mounting structure in the third embodiment. FIG. 10 is a diagram for explaining an arrangement position of a member connection electrode formed on a first substrate in the third embodiment. It is a side view of the stacked mounting structure viewed from one end side of the first substrate. FIG. 10 is a schematic perspective view illustrating an overall configuration of a stacked mounting structure in a third embodiment. It is a figure explaining the manufacturing method of the laminated mounting structure in Embodiment 4. FIG. It is a figure explaining the principle of the manufacturing method of the laminated mounting structure in Embodiment 5. FIG. It is a figure explaining the specific example of the manufacturing method of the laminated mounting structure in Embodiment 5. FIG. It is a figure explaining the specific example of the manufacturing method of the laminated mounting structure in Embodiment 5. FIG. It is a figure explaining the specific example of the manufacturing method of the laminated mounting structure in Embodiment 5. FIG. It is a partial cross section figure which shows the state which connected the board | substrate with respect to the laminated mounting structure manufactured with the manufacturing method of FIGS. It is a figure which shows the modification of the arrangement position of the electrode for member connection formed on a board | substrate. It is a figure explaining the principle of the manufacturing method of the laminated mounting structure in a modification. FIG. 10 is a schematic perspective view showing an overall configuration of a stacked mounting structure in a sixth embodiment. It is a partial cross section figure of the lamination mounting structure provided with the member connection member in a modification. It is a figure explaining the modification of the connection method of the other end side of the parallel part formed in the connection member between members, and the mounting structure connection electrode. It is a figure explaining the other modification of the connection method of the other end side of the parallel part formed in the connection member between members, and the mounting structure connection electrode.

DESCRIPTION OF SYMBOLS 1 Stack mounting structure 11 1st board | substrate 111 board | substrate connection electrode 113 member connection electrode 15 board | substrate connection member 17 member connection member 13 2nd board | substrate 131 board | substrate connection electrode C11, C13 to-be-mounted component

Claims (6)

A plurality of substrates whose main surfaces are arranged in parallel to each other;
An inter-board connecting member for connecting the substrates;
On the substrate main surface of at least one substrate, there is a columnar parallel portion whose longitudinal direction is arranged parallel to the substrate main surface, and the other end side of the parallel portion extends to an end portion of the member main surface. The inter-member connecting member connected to the member connecting electrode formed on the substrate main surface at one end side,
With
A member that is disposed so that the substrate main surface and the main surfaces are orthogonal to each other is connected to the other end side of the parallel portion.   2. The stacked mounting structure according to claim 1, wherein the inter-member connection member includes a support portion having one end standing on the member connection electrode and supporting the parallel portion.   The stacked mounting structure according to claim 1, wherein a reinforcing member is disposed at least around the inter-substrate connecting member and the inter-member connecting member.   A plurality of the member connection electrodes are formed on the main surface of the substrate to which the inter-member connection member is connected, and the inter-member connection members having different lengths of the support portions are connected to the respective member connection electrodes. The stacked mounting structure according to claim 2, wherein the stacked mounting structure is provided.   The substrate main surface to which the inter-member connecting member is connected is filled with a reinforcing member to form a protective layer, and the other end of the parallel portion is exposed from the end surface of the protective layer. The stacked mounting structure according to claim 4.   A side surface connection electrode is formed on the end surface of the protective layer where the other end of the parallel portion is exposed, and a wiring pattern for connecting at least one of the other ends of the parallel portion to the side surface connection electrode is provided. The stacked mounting structure according to claim 5, wherein the stacked mounting structure is formed.

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