JP5526250B2 - Manufacturing method of mounting structure - Google Patents

Description

  The present invention relates to a method for manufacturing a mounting structure.

  2. Description of the Related Art Conventionally, endoscopes that are inserted into a body cavity of a subject to observe a region to be examined are known and widely used in the medical field and the like. This endoscope is configured by incorporating an electronic circuit module in which an electronic component such as an image sensor is mounted at the distal end of a flexible elongated insertion tool. The distal end portion of the insertion tool is required to be reduced in diameter and shortened in order to alleviate the patient's pain, and various techniques for reducing the size of the electronic circuit module built in the distal end portion are disclosed. .

  On the other hand, a technique for connecting printed boards to each other in the vertical direction is known (see Patent Document 1). In Patent Document 1, a printed circuit board is mechanically and electrically connected by inserting a protrusion provided on the other printed circuit board into a hole formed on one printed circuit board.

JP 2007-194160 A

  By the way, if a member such as another board, electronic component, or electronic circuit module can be connected so that the principal surfaces are orthogonal to the mounting structure configured by mounting the electronic component on a member such as a board, the space becomes effective. It can be used to connect other members with high density, and the electronic circuit module can be miniaturized. However, when the technique of Patent Document 1 is applied, it is necessary to process a member to be connected to provide holes and protrusions, which complicates the manufacturing process and is troublesome.

  This invention is made | formed in view of the above, Comprising: It aims at providing the manufacturing method of the mounting structure which can connect another member easily and with high density.

  In order to solve the above-described problems and achieve the object, a manufacturing method of a mounting structure according to the present invention includes a cutting position on a main surface of a member on which a component to be mounted is mounted for each region that is cut and divided. A parallel portion of the connecting member is parallel to the main surface of the member between the electrode forming step of forming the member connecting electrodes so as to face each other across the electrode and the opposing member connecting electrodes formed in the electrode forming step A connecting step of connecting both ends of the parallel portion to the opposing member connecting electrodes, and a singulation step of cutting the member together with the parallel portion at the cutting position to divide the member. The electrode forming step is characterized in that the member connecting electrodes are formed such that the positions of the member connecting electrodes formed in adjacent regions are line-symmetric with respect to the cutting position.

  In the method for manufacturing a mounting structure according to the present invention, in the above invention, the connection step includes a second columnar member that is a support portion on the member connection electrodes facing each other across the cutting position. Each of the first end surfaces of the second columnar member, and a step of filling the resin on the member to form a protective layer and then polishing and flattening the upper surface of the protective layer. A step of exposing each of the end surfaces, and a first columnar member disposed on the other end surface of the exposed second columnar member in parallel with the main surface of the member, and side surfaces of both ends of the second columnar member A step of connecting to the exposed other end surface of the columnar member, wherein the parallel portion cut in the singulation step is the first columnar member.

  In the method for manufacturing a mounting structure according to the present invention, in the above invention, the connection step has an outer shape in which support portions are integrally formed at both ends of the first columnar member that forms the parallel portion. The U-shaped members connect between the member connecting electrodes facing each other across the cutting position.

  The mounting structure according to the present invention is configured by connecting one end side of a parallel portion of a connection member arranged in parallel to the main surface of the member to a member connection electrode formed on the main surface of the member. And the other member arrange | positioned so that a main surface may intersect orthogonally with the other end side of a parallel part can be connected. Therefore, other members can be easily and densely connected to the mounting structure.

FIG. 1 is a partial cross-sectional view showing an example of the mounting structure according to the first embodiment. FIG. 2 is a partial cross-sectional view illustrating an example of the mounting structure according to the first embodiment. FIG. 3 is a partial cross-sectional view showing a state in which a substrate is connected to the mounting structure of the first embodiment. FIG. 4 is a schematic perspective view schematically showing the overall configuration of the electronic circuit module including the mounting structure according to the first embodiment. FIG. 5 is a partial cross-sectional view showing an example of the mounting structure according to the second embodiment. FIG. 6 is a partial cross-sectional view showing an example of the mounting structure according to the second embodiment. FIG. 7 is a partial cross-sectional view illustrating a state in which a substrate is connected to the mounting structure according to the second embodiment. FIG. 8 is a partial cross-sectional view showing an example of the mounting structure according to the third embodiment. FIG. 9 is a partial cross-sectional view illustrating an example of the mounting structure according to the third embodiment. FIG. 10 is a partial cross-sectional view illustrating a state in which a substrate is connected to the mounting structure according to the third embodiment. FIG. 11 is a partial cross-sectional view illustrating an example of the mounting structure according to the fourth embodiment. FIG. 12 is a partial cross-sectional view illustrating an example of the mounting structure according to the fourth embodiment. FIG. 13 is a partial cross-sectional view illustrating a state in which a substrate is connected to the mounting structure according to the fourth embodiment. FIG. 14 is a partial cross-sectional view illustrating an example of the mounting structure according to the fifth embodiment. FIG. 15 is a partial cross-sectional view illustrating a state in which a substrate is connected to the mounting structure according to the fifth embodiment. FIG. 16 is a schematic perspective view schematically showing the overall configuration of the electronic circuit module including the mounting structure according to the fifth embodiment. FIG. 17 is a partial cross-sectional view showing an example of the mounting structure according to the sixth embodiment. FIG. 18 is a diagram for explaining an arrangement position of member connection electrodes formed on a substrate constituting the mounting structure according to the sixth embodiment. FIG. 19 is a side view of the mounting structure according to the sixth embodiment as viewed from one end of the substrate. FIG. 20 is a schematic perspective view illustrating the entire configuration of the mounting structure according to the sixth embodiment. FIG. 21 is a schematic perspective view illustrating the overall configuration of the mounting structure according to the sixth embodiment. FIG. 22 is a diagram for explaining the principle of the manufacturing method of the mounting structure according to the seventh embodiment. FIG. 23 is a diagram for explaining the principle of the manufacturing method of the mounting structure according to the seventh embodiment. FIG. 24 is a schematic perspective view of the mounting structure manufactured by the manufacturing method of the mounting structure of the seventh embodiment. FIG. 25A is a diagram illustrating a specific example of a method for manufacturing a mounting structure. FIGS. 25-2 is a figure explaining the specific example of the manufacturing method of a mounting structure. FIGS. 25-3 is a figure explaining the specific example of the manufacturing method of a mounting structure. FIG. 26 is a partial cross-sectional view showing a state in which the substrate is connected to the mounting structure manufactured by the manufacturing method of FIGS. FIG. 27 is a diagram showing a modification of the arrangement position of the member connection electrodes formed on the substrate. FIG. 28 is a diagram for explaining the principle of a method for manufacturing a mounting structure in a modified example. FIG. 29 is a schematic perspective view showing the entire configuration of the mounting structure according to the eighth embodiment. FIG. 30 is a diagram illustrating a modified example of the mounting structure. FIG. 31 is a diagram illustrating a modification of the connection method between the other end side of the parallel portion formed on the connection member and the mounting structure connection electrode. FIG. 32 is a diagram illustrating another modification of the method for connecting the other end side of the parallel portion formed on the connection member and the mounting structure connection electrode.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the present embodiment.

(Embodiment 1)
1 and 2 are partial cross-sectional views showing an example of the mounting structure 1 according to the first embodiment. As shown in FIG. 1, the mounting structure 1 according to the first embodiment includes a substrate 11 that is a member and a connection member 13. On the substrate 11, a mounted component that is an electronic component such as an electronic circuit (not shown) is mounted on the upper surface, which is the main surface. Is formed. On the other hand, the connecting member 13 is composed of one columnar member made of a conductive material, and forms a parallel portion. That is, the connecting member 13 is arranged with its side face parallel to the substrate 11 such that one end side surface thereof is in contact with the member connecting electrode 111 and the other end extends outside the one end portion of the upper surface of the substrate 11. Yes. The connecting member 13 is formed to have a length determined by the distance from the member connecting electrode 111 to one end of the substrate 11.

  When the mounting structure 1 is manufactured, the longitudinal direction of the connection member 13 is arranged in parallel with the main surface of the substrate 11, and one end side surface of the connection member 13 is brought into contact with the member connection electrode 111, for example, solder or the like. Connect with. Thereafter, as shown in FIG. 2, the vicinity of the connecting portion between the member connecting electrode 111 and the connecting member 13 is sealed with a resin 151 as a reinforcing member, and the vicinity of the connecting portion is fixed and protected. By doing so, the reliability of the mounting structure 1 is improved, and handling as a component can be facilitated.

  FIG. 3 is a partial cross-sectional view showing a state in which the substrate 17 which is another member is connected to the mounting structure 1. The substrate 17 is disposed outside one end portion of the substrate 11 so that the right side in FIG. 3 as the main surface faces the substrate 11 and the main surface is orthogonal to the substrate 11. A mounting structure connection electrode 171 is formed on the substrate 17 at a predetermined position on the right side surface, and is in contact with the other end surface of the connection member 13 extending to the outside of one end portion of the substrate 11 so as to be soldered. Connected with. Thus, the member connecting electrode 111 and the mounting structure connecting electrode 171 are connected, and the mounting structure 1 and the substrate 17 are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 171 and the connection member 13 is sealed with the resin 153 to fix and protect the vicinity of the connection portion.

  As described above, according to the mounting structure 1 of the first embodiment, the connection member 13 configured by one columnar member is arranged in parallel with the main surface of the substrate 11, and one end thereof is the main surface of the substrate 11. The other end can be extended to the outside of one end of the upper surface of the substrate 11. Then, another member such as the substrate 17 disposed so that the main surfaces thereof are orthogonal to the substrate 11 can be connected to the other end of the parallel portion. Therefore, it is not necessary to apply special processing to each member to be connected, and it is only necessary to connect the conductive connecting member 13 to the member connecting electrode 111 on the substrate 11, so that the other members can be easily and densely formed. Can be connected. Further, the member connecting electrode 111 and the mounting structure connecting electrode 171 can be connected by the columnar connecting member 13. At this time, it is possible to appropriately increase the diameter of the connection member 13 in consideration of the space on the substrate 11. Therefore, it is possible to realize a connection with low resistance and high reliability as compared with the case where the wiring pattern is formed on the substrate.

  FIG. 4 is a schematic perspective view schematically showing the entire configuration of the electronic circuit module 2 including the mounting structure according to the first embodiment. In the electronic circuit module 2 shown in FIG. 4, a plurality of mounted components 29 a to 29 e are mounted on the upper surface, which is the main surface, and a plurality of member connection electrodes 211 a to 211 d are formed at the end portion on the short side. The mounting structure described in the first embodiment is provided with the substrate 21 and the connection members 23a to 23d whose longitudinal direction is arranged in parallel with the main surface of the substrate 21 and whose one ends are connected to the member connection electrodes 211a to 211d. Including the body. Two substrates 27a and 27b are arranged outside the short side of the substrate 21 so that the main surface thereof faces the substrate 21 and is orthogonal to the main surface of the substrate 21, and the connection members 23a and 23b are arranged. Is connected to the substrate 27a, and the connection members 23c and 23d are connected to the substrate 27b. As described above, according to the electronic circuit module 2 including the mounting structure of the first embodiment, the electronic circuit module 2 in which the boards 27a and 27b, which are other members, are mounted on the mounting structure with high density can be configured. . In addition, not only the short side of the board | substrate 21, but a member connection electrode is formed in the edge part of a long side, and it is good also as connecting other members, such as a board | substrate, to the outer side.

(Embodiment 2)
5 and 6 are partial cross-sectional views illustrating an example of the mounting structure 3 according to the second embodiment. As shown in FIG. 5, the mounting structure 3 according to the second embodiment includes a substrate 31 and two types of connection members 331 and 333. The substrate 31 is mounted with an unillustrated mounted component on the upper surface, which is the main surface, and member connection electrodes 311 and 313 are formed at predetermined positions on one end of the upper surface avoiding the mounted component. .

  The connection member 331 is configured in the same manner as the connection member 13 of the first embodiment, so that one side surface of the connection member 331 is in contact with the member connection electrode 311 and the other end extends outside the one end portion of the substrate 31. Are arranged with their longitudinal directions parallel to the substrate 31. On the other hand, the connection member 333 is composed of a first columnar member 334 and a second columnar member 335 each formed of a conductive material, and this is disposed on one side surface of the first columnar member 334 forming a parallel portion. It has a substantially L-shaped outer shape to which the other end surface of the second columnar member 335 to be supported is connected. One end surface of the second columnar member 335 of the connection member 333 is connected to the member connection electrode 313. The first columnar member 334 is arranged so that the longitudinal direction thereof is parallel to the main surface of the substrate 31, and the other end is extended to the outside of one end portion of the substrate 31. Here, the length of the second columnar member 335 is the position of the mounting structure connecting electrode of another member connected to the member connecting electrode 313 by the connecting member 333 (other member relative to the main surface position of the substrate 31). Depending on the height of the mounting structure connection electrode), the parallel portions of the connection members 331 and 333 arranged vertically (that is, the connection member 331 and the first columnar member 334 of the connection member) do not contact each other. It is specified in length.

  When the mounting structure 3 is manufactured, the longitudinal direction of the connection member 331 is arranged in parallel with the main surface of the substrate 31, and one end side surface of the connection member 331 is brought into contact with the member connection electrode 311, for example, solder or the like. Connect with. Further, one end surface of the second columnar member 335 is erected on the member connection electrode 313 to be connected. Subsequently, the longitudinal direction of the first columnar member 334 is arranged in parallel with the main surface of the substrate 31, and one side surface of the first columnar member 334 is brought into contact with the other end surface of the second columnar member 335 to be connected through the metal film. In addition, it is good also as connecting the one end part side surface of the 1st columnar member 334, and the other end surface of the 2nd columnar member 335 with solder etc. previously.

  Similarly to the first embodiment, the vicinity of the connection portion may be fixed and protected by resin sealing the connection portion between the substrate 31 and the connection members 331 and 333. For example, as shown in FIG. 6, the connection member 331 is connected to the member connection electrode 311, and one end surface of the second columnar member 335 is erected and connected to the member connection electrode 313. The protective layer 351 is formed by filling the resin. Then, after the other end surface of the second columnar member 335 is exposed and the one end side surface of the first columnar member 334 is connected, the vicinity of the connection portion between the first columnar member 334 and the second columnar member 335 is observed. Sealed with resin 352.

  FIG. 7 is a partial cross-sectional view showing a state in which a substrate 37, which is another member, is connected to the mounting structure 3. The substrate 37 is disposed outside the one end portion of the substrate 31 so that the right side in FIG. 7 as the main surface faces the substrate 31 and the main surface is orthogonal to the substrate 31. The substrate 37 has mounting structure connection electrodes 371 and 373 formed at predetermined positions on the right side surface, and is in contact with the other end surfaces of the connection members 331 and 333 extending outside one end portion of the substrate 31. And connected with solder or the like. As a result, the member connecting electrode 311 and the mounting structure connecting electrode 371 are connected, and the member connecting electrode 313 and the mounting structure connecting electrode 373 are connected, and the mounting structure 3 and the substrate 37 are connected. The space is mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 371 and the connection member 331 is sealed with the resin 353, and the vicinity of the connection portion between the mounting structure connection electrode 373 and the connection member 333 is sealed with the resin 354. It fixes and protects the vicinity of these connecting parts.

  As described above, according to the mounting structure 3 of the second embodiment, the same effects as those of the first embodiment can be obtained, and the length of the second columnar member 335 can be adjusted to a predetermined value. A connection member 333 having a height can be formed. And by using in combination with the columnar connection member 331, it can arrange | position and connect so that a parallel part may not contact mutually. Therefore, since the space on the substrate 31 can be used effectively, the degree of freedom in design increases.

  The connecting members 331 and 333 are not limited to the combination, and the second columnar members having different lengths are used to form connecting members having different parallel portions with respect to the main surface of the substrate 31, and these are used in combination. It is good as well.

(Embodiment 3)
8 and 9 are partial cross-sectional views showing an example of the mounting structure 4 of the third embodiment. As shown in FIG. 8, the mounting structure 4 of the third embodiment includes a substrate 41 and a connection member 433. In the substrate 41, a mounted component (not shown) is mounted on the upper surface, which is the main surface, and a member connection electrode 411 is formed at a predetermined position on one end of the upper surface avoiding the mounted component. On the other hand, the connection member 433 includes a first columnar member 434 and a second columnar member 435 each formed of a conductive material, and one end surface of the first columnar member 434 is a side surface of the second columnar member 435. It is connected to the. One end surface of the second columnar member 435 is in contact with the member connecting electrode 411, the longitudinal direction of the first columnar member 434 is arranged in parallel with the main surface of the substrate 41, and the other end is disposed on the substrate 41. It extends to the outside of one end of the. Here, the connection position of the first columnar member 434 to the second columnar member 435 is, for example, the position of the mounting structure connection electrode of another member connected to the member connection electrode 411 by the connection member 433 (substrate). The height of the mounting structure connecting electrode of the other member with respect to the position of the main surface 41 is defined.

  When the mounting structure 4 is manufactured, for example, one end surface of the first columnar member 434 is connected in advance to the side surface of the second columnar member 435 via a metal film, and the first columnar member is thus formed. The longitudinal direction of 434 is arranged in parallel with the main surface of the substrate 41 so that the other end extends outside one end of the substrate 41. Then, one end surface of the second columnar member 435 is erected on the member connection electrode 411 and connected. Similarly to the first embodiment, the connection portion between the substrate 41 and the connection member 433 may be resin-sealed to fix and protect the vicinity of the connection portion. For example, as shown in FIG. 9, the second columnar member 435 is connected to the member connecting electrode 411, and then a resin is filled on the substrate 41 to form a protective layer 451.

  FIG. 10 is a partial cross-sectional view showing a state in which a substrate 47 which is another member is connected to the mounting structure 4. The substrate 47 is arranged outside the one end of the substrate 41 so that the main surface of the substrate 47 is directed to the substrate 41 side and the substrate 41 and the principal surfaces are orthogonal to each other. A mounting structure connection electrode 471 is formed at a predetermined position on the right side surface of the substrate 47, and is in contact with the other end surface of the connection member 433 extending to the outside of one end portion of the substrate 41. Connected with. As a result, the member connecting electrode 411 and the mounting structure connecting electrode 471 are connected, and the mounting structure 4 and the substrate 41 are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 471 and the connection member 433 is sealed with the resin 453, and the vicinity of the connection portion is fixed and protected.

  As described above, according to the mounting structure 4 of the third embodiment, the same effects as those of the first embodiment can be obtained, and the connection position of the first columnar member 434 with respect to the second columnar member is determined. By adjusting, the height of the parallel portion (first columnar member 434) with respect to the main surface of the substrate 41 can be adjusted. Therefore, unlike the second embodiment, there is no need to form second columnar members having different lengths for height adjustment, and the cost can be reduced.

  In addition, it is good also as using not only the case where 1 type of connection member 433 is used but combining with the connection member demonstrated in Embodiment 1,2. In this case, the connection position of the first columnar member with respect to the second columnar member is adjusted so that the parallel portions do not contact each other. Alternatively, the connecting members of the first columnar member may be connected to the second columnar member at different positions so that the height of the parallel portion with respect to the main surface of the substrate 41 is different, and these may be used in combination.

(Embodiment 4)
11 and 12 are partial cross-sectional views illustrating an example of the mounting structure 5 according to the fourth embodiment. As shown in FIG. 11, the mounting structure 5 of the fourth embodiment includes a substrate 51 and a connection member 53. A mounted component (not shown) is mounted on the upper surface, which is the main surface, of the substrate 51, and a member connection electrode 511 is formed at a predetermined position on one end of the upper surface avoiding the mounted component. On the other hand, the connection member 53 is formed by integrally forming the first columnar member and the second columnar member that constitute the connection member 333 of the second embodiment and the connection member 433 of the third embodiment. For example, in the illustrated example, one columnar member formed of a conductive material has an outer shape L-shape in which a parallel portion 531 is formed by bending at a midway portion. The base end portion is in contact with the member connecting electrode 511, the parallel portion 531 is disposed in parallel with the main surface of the substrate 51, and the distal end thereof is disposed so as to extend outside one end portion of the substrate 51. ing. Here, the length from the base end portion of the connecting member 53 to the midway portion is the position of the mounting structure connecting electrode of the other member connected to the member connecting electrode 511 by the connecting member 53 (the main surface of the substrate 51). The height is determined in accordance with the height of the mounting structure connection electrode of the other member with respect to the position.

  When the mounting structure 5 is manufactured, the parallel portion 531 of the connection member 53 is parallel to the substrate 51. Then, the base end portion is erected on the member connection electrode 511 so that the front end of the parallel portion 531 extends outside one end portion of the substrate 51. Similarly to the first embodiment, the connection portion between the substrate 51 and the connection member 53 may be resin-sealed to fix and protect the vicinity of the connection portion. For example, as shown in FIG. 12, after connecting the base end portion of the connection member 53 to the member connection electrode 511, the protective layer 551 is formed by filling the resin on the substrate 51.

  FIG. 13 is a partial cross-sectional view showing a state in which a substrate 57 which is another member is connected to the mounting structure 5. The substrate 57 is disposed outside one end portion of the substrate 51 such that the right surface in FIG. 13 which is the main surface faces the substrate 51 side and the substrate 51 and the main surfaces are orthogonal to each other. A mounting structure connection electrode 571 is formed on the substrate 57 at a predetermined position on the right side surface, and is in contact with the other end surface of the connection member 53 extending to the outside of one end portion of the substrate 51. Connected with. As a result, the member connecting electrode 511 and the mounting structure connecting electrode 571 are connected, and the mounting structure 5 and the substrate 57 are mechanically and electrically connected. Further, the vicinity of the connection portion between the mounting structure connection electrode 571 and the connection member 53 is sealed with the resin 553 to fix and protect the vicinity of the connection portion.

  As described above, according to the mounting structure 5 of the fourth embodiment, the same effects as those of the first embodiment can be obtained, and separately, as in the second and third embodiments. There is no need to connect a first columnar member and a second columnar member. According to this, the number of parts can be reduced, the process of connecting the first columnar member and the second columnar member is unnecessary, and the number of processes during manufacturing can be reduced. Therefore, the mounting structure 5 can be manufactured more easily.

  In addition, it is good also as using not only when using one type of connection member 53 but combining with the connection member demonstrated in Embodiment 1-3. In this case, the length from the base end portion to the midway portion is adjusted so that the parallel portions do not contact each other. Alternatively, connecting members having different lengths from the base end part to the midway part and having different parallel part heights with respect to the main surface of the substrate 51 may be used in combination.

(Embodiment 5)
FIG. 14 is a partial cross-sectional view showing an example of the mounting structure 6 according to the fifth embodiment. As illustrated in FIG. 14, the mounting structure 6 according to the fifth embodiment includes a substrate 61 and a connection member 63 configured similarly to the connection member 53 according to the fourth embodiment. On the substrate 61, a component to be mounted (not shown) is mounted on the upper surface which is the main surface, and a member connection electrode 611 is formed at a predetermined position on one end side of the upper surface avoiding the component to be mounted. On the other hand, as in the fourth embodiment, the connection member 63 has a base end portion in contact with the member connection electrode 611 and the longitudinal direction of the parallel portion 631 is arranged in parallel with the substrate 61. Then, the tip of the parallel portion 631 is located on the substrate 61.

  FIG. 15 is a partial cross-sectional view showing a state in which a substrate 67 which is another member is connected to the mounting structure 6. The substrate 67 is disposed on the substrate 61 so that the principal surfaces thereof are orthogonal to the substrate 61. The substrate 67 has a mounting structure connection electrode 671 formed at a predetermined position on the right side in FIG. 15 which is the main surface of the substrate 67, and a connection member 63 extending to the outside of one end of the substrate 61. Is contacted with the other end surface and connected with solder or the like. As a result, the member connecting electrode 611 and the mounting structure connecting electrode 671 are connected, and the mounting structure 6 and the substrate 67 are mechanically and electrically connected. Although not shown, resin may be sealed in the vicinity of the connection portion between the mounting structure connection electrode 671 and the connection member 63.

  As described above, according to the fifth embodiment, the same effects as those of the fourth embodiment can be obtained, and the main surfaces are arranged so as to be orthogonal to the substrate 61 inside the mounting structure 6. A substrate 67 can be connected. Therefore, the mounting structure 6 in which other members such as the substrate 67 are connected with higher density can be realized. In addition, although the case where the connection member having the configuration of the fourth embodiment is applied has been described, the connection members having other configurations described in the first to third embodiments can be similarly applied.

  FIG. 16 is a schematic perspective view schematically showing the entire configuration of the electronic circuit module 7 including the mounting structure according to the fifth embodiment. In the electronic circuit module 7 shown in FIG. 16, a plurality of member connection electrodes 711a to 711d are formed at the end on the short side of the upper surface which is the main surface, and member connection electrodes 711e and 711f are formed at predetermined positions in the center. And a mounting member according to the fifth embodiment, including a substrate 71 on which the substrate is formed and connecting members 73a to 73f whose base ends are connected to the respective member connecting electrodes 711a to 711f. And two board | substrates 77a and 77b are arrange | positioned so that the board | substrate 71 and main surfaces may orthogonally cross on the outer side of the short side of the board | substrate 71, the board | substrate 77a is connected by the connection members 73a and 73b, and the connection member 73c. , 73d are connected to the substrate 77b. In addition, one substrate 77c is arranged on the substrate 71 so that the main surface of the substrate 71 is orthogonal to the substrate 71, and the substrate 77c is connected by connection members 73e and 73f. Here, mounted components (not shown) are mounted on the substrate 71, and the substrate 77c is connected avoiding these mounted components. Thus, according to the electronic circuit module 7 including the mounting structure of the fifth embodiment, other members such as the substrate 77c can be connected to the inside of the mounting structure (above the substrate 71). The space on 71 can be used effectively. Therefore, it is possible to configure the electronic circuit module 7 in which the substrates 77a, 77b, and 77c, which are other members, are mounted on the mounting structure at a higher density. In addition, not only the short side of the board | substrate 71 but it is good also as forming the member connection electrode in the edge part of a long side, and connecting other members, such as a board | substrate, to the outer side.

(Embodiment 6)
FIG. 17 is a partial cross-sectional view illustrating an example of the mounting structure 8 according to the sixth embodiment. FIG. 18 is a diagram illustrating the arrangement positions of the member connection electrodes 811 and 813 formed on the substrate 81. FIG. 19 is a side view of the mounting structure as viewed from one end side of the substrate 81. As shown in FIG. 17, the mounting structure 8 of the sixth embodiment includes a substrate 81 and two types of connection members 831 and 833. The substrate 81 is mounted with an unillustrated mounted component on the upper surface, which is the main surface, and member connection electrodes 811 and 813 are formed at predetermined positions on one end of the upper surface avoiding the mounted component. . Specifically, as shown in FIG. 18, a plurality of (five in the illustrated example) member connection electrodes 811 arranged adjacent to two rows on one end side of the upper surface, which is the main surface of the substrate 81. (811a to 811c) and 813 (813a and 813b) are formed, and the connection members 831 (831a to 831c) are connected to the three outer member connection electrodes 811a to 811c, and the two inner member connection electrodes are used. Connection members 833 (833a, 833b) are connected to the electrodes 813a, 813b. At this time, the height of the connection member 833 is defined so that the vertical positions of the parallel portions of the connection members 831a to 831c and the connection members 833a and 833b do not overlap. As shown in FIG. 19, when the mounting structure 8 is viewed from one end side of the substrate 81, the connection members 831 a to 831 c, 833 a, and 833 b have high height positions of the parallel portions from the main surface of the substrate 81. A thing and a low thing are arranged next to each other so that they are alternately arranged. In addition, the combination of the connection member from which the height of the parallel part from the main surface of the board | substrate 81 differs not only in the combination of the connection member 831 and the connection member 833 shown in FIG. 17, but Embodiment 1-4 demonstrated. The connecting members can be used in appropriate combination.

  20 and 21 are schematic perspective views for explaining the overall configuration of the mounting structure 8 according to the sixth embodiment. Here, FIG. 20 shows an example of the internal configuration of the mounting structure 8. As shown in FIG. 20, a plurality of mounted components 89 a to 89 f are mounted on the substrate 81 of the mounting structure 8. ing. As shown in FIGS. 17 to 19, two types of connection members 831 a to 831 c and connection members 833 a and 833 b are arranged on one end of the substrate 81. Each is connected to a member connecting electrode (not shown). Similarly, two types of connection members 831d to 831f and connection members 833c and 833d are arranged at the other end of the substrate 81, and are connected to member connection electrodes (not shown) on the substrate 81, respectively. ing. Further, on the substrate 81, connecting members 835 and 836 formed in U-shapes having different heights are arranged. Specifically, the connection members 835 and 836 are arranged such that portions arranged in parallel with the main surface of the substrate 81 intersect three-dimensionally above the mounted components 89d and 89f. The electrodes (not shown) to be connected formed above are connected. As shown in FIG. 21, the mounting structure 8 is sealed with a resin 85 in order to fix and protect internal members such as mounted components 89a to 89f and connection members 831a to 831f and 833a to 833d. The end face is polished and modularized. In addition, not only the short side of the board | substrate 81 but a member connection electrode is formed in the edge part of a long side, and it is good also as connecting other members, such as a board | substrate, to the outer side.

  As described above, according to the mounting structure 8 of the sixth embodiment, the same effects as those of the above-described embodiments can be obtained, and the parallel portions of the adjacent connection members 831 and 833 can be formed at a narrow pitch. The mounting structure 8 can be reduced in size. In addition, as illustrated in FIG. 17, the connection members 831 and 833 having different heights of the portions arranged in parallel with the main surface of the substrate 81 are used in appropriate combinations, so that the electrodes on the substrate 81 are three-dimensionally formed. Can be connected. According to this, the space on the substrate 81 can be used effectively, downsizing can be realized, and a low resistance and highly reliable connection can be realized as compared with the case where the wiring pattern is formed on the substrate and connected. it can.

  In the first to sixth embodiments described above, the other end of the parallel portion formed on the connection member extends to the outside of the upper end portion of the upper surface of the substrate constituting the mounting structure. It suffices if it extends to one end edge of the upper surface. In this case, for example, after a protective layer is formed by filling a resin on the substrate, the end surface of the protective layer on one end side of the substrate is polished. Thus, the other end surface of the parallel portion may be exposed from the side surface on one end side of the mounting structure.

(Embodiment 7)
By the way, in each of the above-described embodiments, the case where the mounting structure is manufactured (manufactured) alone has been described, but the method for manufacturing the mounting structure is not limited to this. The seventh embodiment relates to a method for manufacturing a mounting structure. 22 and 23 are diagrams illustrating the principle of the manufacturing method of the mounting structure according to the seventh embodiment. FIG. 24 is a schematic perspective view of the mounting structure 9 manufactured by the manufacturing method of the mounting structure according to the seventh embodiment.

  In this manufacturing method, a plurality of mounting structures 9 are simultaneously manufactured on a single substrate 91, and the main surface, which is the upper surface of the substrate 91, is partitioned at cutting positions indicated by broken lines in FIG. A component to be mounted (not shown) is mounted for each partition area A9 and is finally cut and divided (separated) at a cutting position. In the mounting structure manufacturing method, the member connection electrodes 911a and 911b are formed on the main surface of the substrate 91 so as to face each other across the cutting position. In the illustrated example, two sets of opposing member connection electrodes 911a and 911b are formed at each end of each partition region A9 across each side. Then, as shown in FIG. 22, a member 93 having a columnar portion 931 and serving as a connecting member when separated into the mounting structures 9a and 9b shown in FIG. 23 is opposed to a member connecting electrode 911a. , 911b. This columnar part 931 is a part which forms the parallel part of a connection member, and the member 93 is arrange | positioned so that the columnar part 931 may straddle a cutting position. Then, after a protective layer disposing step, etc., it is finally cut and cut into pieces at a cutting position, and as shown in FIG. 24, a modular mounting structure 9 (9a, 9b) is obtained.

  FIGS. 25-1 to 25-3 are diagrams illustrating a specific example of the method for manufacturing the mounting structure. FIG. 26 is a partial cross-sectional view showing a state in which substrates 97a and 97b, which are other members, are connected to the manufactured mounting structures 9a and 9b. Here, a case where a mounting structure to which the connection member 333 of Embodiment 2 is applied will be described as an example. Although not shown, the description will be made on the assumption that the mounted component has already been mounted on the main surface of the substrate 91. That is, as shown in FIG. 25-1, the member connection electrodes 911a and 911b are formed on the main surface of the substrate 91 at positions facing each other across the cutting position indicated by the broken line in FIG. Forming step). Next, the connection process is started. In other words, one end surfaces of the second columnar members 935a and 935b, which are support portions, are erected on the member connection electrodes 911a and 911b and connected by soldering or the like. Then, after the resin is filled on the substrate 91 to form the protective layer 951, the upper surface of the protective layer 951 is polished and flattened to expose the other end surfaces of the second columnar members 935a and 935b. Subsequently, as shown in FIG. 25B, metal films 96a and 96b are formed on the other end surfaces of the exposed second columnar members 935a and 935b. Then, one columnar member 934 corresponding to the columnar portion 931 is arranged in parallel with the main surface of the substrate 91, and both side surfaces thereof are disposed on the other end surfaces of the second columnar members 935a and 935b via metal films 96a and 96b. Connect. Next, the process moves to an arrangement step, where the vicinity of the connection portion between the columnar member 934 and the metal films 96a and 96b is sealed with resin 952, and the vicinity of the connection portion is fixed and protected. Then, the process proceeds to the individualization step, and as shown in FIG. 25-3, the mounting structures 9a and 9b are obtained by individualization by dicing.

  As shown in FIG. 26, the mounting 69CB structures 9a and 9b manufactured in this way are formed with mounting structure connection electrodes 971a and 971b on the main surface in the same manner as in the above embodiments. It is connected with the board | substrates 97a and 97b which are other members made. Specifically, the substrate 97a is arranged outside the one end of the substrate 91a so that the main surface of the substrate 97a faces the substrate 91a with the left side surface in FIG. 26 facing the substrate 91a. The mounting structure connection electrode 971a is connected to the other end surface of the connection member 93a extending to the outside of one end of the substrate 91a, so that the space between the mounting structure 9a and the substrate 97a is mechanically and electrically. Connected. Similarly, the substrate 97b is arranged outside the one end of the substrate 91b so that the right surface in FIG. 26, which is the main surface, faces the substrate 91b, and the main surface is orthogonal to the substrate 91b. The mounting structure connection electrode 971b is connected to the other end surface of the connection member 93b extending to the outside of one end of the substrate 91b, so that the space between the mounting structure 9b and the substrate 97b is mechanically and electrically. Connected.

  As described above, according to the method for manufacturing a mounting structure of the seventh embodiment, a plurality of mounting structures can be manufactured at a time, so that the manufacturing cost can be reduced and the productivity can be improved.

  In the seventh embodiment, the case where the connection member having the configuration described in the second embodiment is applied has been described. However, the same applies to the connection members having other configurations described in the first, third, and fourth embodiments. Applicable to. For example, when the connection member having the configuration described in the fourth embodiment is applied, a U-shaped member having an outer shape in which support portions are integrally formed at both ends of a columnar portion that forms a parallel portion is prepared. . In the connecting step, the columnar portions are arranged in parallel with the main surface of the substrate, and the base end portions of the respective supporting portions are erected and connected on the member connecting electrodes facing each other across the cutting position. According to this, since the process of connecting the second columnar members 935a and 935b and the columnar member 934 described in the seventh embodiment is not necessary, the number of processes during manufacturing can be reduced.

  In the seventh embodiment described above, the case where the same number (two) of member connection electrodes is formed at each end on the substrate constituting the mounting structure is described. The number of connection electrodes can be set as appropriate. FIG. 27 is a diagram showing a modification of the arrangement position of the member connection electrodes 1011 formed on the substrate 101. FIG. 28 is a diagram for explaining the principle of the manufacturing method of the mounting structure in the present modification.

  As shown in FIG. 27, three member connecting electrodes 1011 (1011a to 1011c) are provided on the left end portion of the substrate 101a shown in FIG. 27 on the main surface of the mounting structure manufactured by the manufacturing method of the present modification. One member connecting electrode 1011 (1011d) is formed at the right end, and two member connecting electrodes 1011 (1011e to 1011h) are formed at the upper end and the lower end, respectively. In the connecting step in this case, as shown in FIG. 28, the positions of the member connecting electrodes 1011 formed in the adjacent partition regions A10 are lined with respect to each other across the cutting position indicated by the broken line in FIG. As described above, each member connection electrode 1011 is formed on the substrate 101. According to this, even when the number (including 0) of the member connection electrodes formed on the end portion of the substrate is different for each end portion, it can be manufactured at the same time. More specifically, even if the number of member connection electrodes formed on one opposite end is different, if the number of member connection electrodes formed on the other opposite end is the same, It can be produced at the same time.

(Embodiment 8)
FIG. 29 is a schematic perspective view showing the overall configuration of the mounting structure 1100 according to the eighth embodiment. In the mounting structure 1100 shown in FIG. 29, the other end (specifically, the connection members 1130 a to 1130 i of the plurality of connection members 1130 a to 1130 i are attached to the end surface of the protective layer 1150 on the substrate 1110. The other end of the parallel part to be formed is exposed. A plurality (four in the illustrated example) of side connection electrodes 1151a to 1151d are formed on this end surface, and the side surface connection electrodes 1151a to 1151d and the mounting structure connection electrodes are formed on the main surface. The other member is connected. Specifically, the other end of the connection member 1130b and the side connection electrode 1151a are connected by the wiring patterns P1110, P1130, and P1150 formed on the end surface of the protective layer 1150, and the other end of the connection member 1130h is connected to the side surface. The electrode 1151b is connected, and the other end of the connection member 1130e and the side connection electrode 1151c are connected. Each of the wiring patterns P1110, P1130, and P1150 can be formed using, for example, a thin film method or an inkjet method as appropriate. At this time, an insulating protective film may be formed on the end surface of the protective layer 1150 other than the side connection electrodes 1151a to 1151d.

  According to the eighth embodiment, the side surface connection electrodes 1151a to 1151d connected to other members can be formed on the end surface of the protective layer 1150, so that the connection position with other members in the mounting structure 1100 is determined. It can be adjusted freely, increasing the degree of design freedom.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit of the invention.

  For example, in each of the above-described embodiments, when connecting the member connection electrode formed on the substrate constituting the mounting structure and the mounting structure connection electrode formed on the substrate which is another member. However, the present invention is not limited to this. FIG. 30 is a diagram illustrating an example of the mounting structure 1200 according to this modification, and illustrates a state in which a substrate 1270 that is another member is connected to the mounting structure 1200. As shown in FIG. 30, the mounting structure 1200 according to this modification includes a substrate 1210 and two types of connection members 1231 and 1233. On the substrate 1210, a mounted component 1290 is mounted on the upper surface, which is the main surface, and member connection electrodes 1211 are formed at predetermined positions on one end side of the upper surface avoiding the mounted component 1290.

  The connection member 1231 is configured similarly to the connection member 13 of the first embodiment. On the other hand, the connection member 1233 is configured similarly to the connection member 333 of the second embodiment. In this modification, one end surface of the second columnar member 1235 of the connection member 1233 is connected to a member connection electrode 1291 formed on the main surface of the mounted component 1290. The first columnar member 1234 is arranged so that its longitudinal direction is parallel to the main surface of the substrate 1210 (parallel to the main surface of the mounted component 1290) and the other end extends outside one end of the substrate 1210. Has been. The mounting structure 1200 is connected to a substrate 1270 which is another member in which mounting structure connection electrodes 1271 and 1273 are formed on the main surface as in the above-described embodiments. Here, the length of the second columnar member 1235 of the connection member 1233 is the position of the mounting structure connection electrode 1273 of the substrate 1270 connected to the member connection electrode 1291 by the connection member 1233 (the member of the mounted component 1290). The height of the mounting structure connection electrode 1273 of the substrate 1270 with respect to the principal surface position where the connection electrode 1291 is formed is defined.

  In the first to sixth embodiments described above, the case where the other end surface of the parallel portion formed on the connection member is connected to the mounting structure connection electrode formed on another member such as a substrate has been described. It is not limited to. In the modification described below, a connection member having the same configuration as that of the connection member of the fourth embodiment will be described as an example, but the same applies to connection members of other configurations described in the first to third embodiments. Applicable.

  FIG. 31 is a view for explaining a modification of the connection method between the other end side of the parallel portion 1331 formed on the connection member 1330 and the mounting structure connection electrode of the substrate 1370 which is another member. In the example of FIG. 31, the base end portion of the connection member 1330 is connected to the member connection electrode 1311, and the protective layer 1350 is formed by filling the resin on the substrate 1310, and then the distal end side of the parallel portion 1331 of the connection member 1330. For example, the protruding portion is bent upward along the end surface of the protective layer 1350. The mounting structure 1300 is connected to a substrate 1370 which is another member on which the mounting structure connection electrode 1371 is formed. Specifically, the side surface of the other end of the bent parallel portion 1331 is connected to the mounting structure connecting electrode 1371. According to this, compared with the case where the other end surface of the parallel part 1331 is connected to the mounting structure connecting electrode 1371, the connection area of the parallel part 1331 with respect to the mounting structure connecting electrode 1371 can be secured widely. The connection strength between them can be increased.

  FIG. 32 is a view for explaining another modification of the method for connecting the other end side of the parallel portion 1431 formed on the connection member 1430 and the mounting structure connection electrode of the substrate 1470 which is another member. . In the example of FIG. 32, after connecting the base end portion of the connecting member 1430 to the member connecting electrode 1411, the other end side of the parallel portion 1431 is bent upward, for example. Thereafter, the substrate 1410 is filled with a resin to form a protective layer 1450, and the end surface of the protective layer 1450 on one end side of the substrate 1410 is polished to expose the other end side surface of the parallel portion 1431. The mounting structure 1400 is connected to a substrate 1470 which is another member on which the mounting structure connection electrode 1471 is formed. Specifically, the exposed side surface of the other end of the parallel portion 1431 is connected to the mounting structure connecting electrode 1471. In this case as well, a wide connection area of the parallel portion 1431 with respect to the mounting structure connection electrode 1471 can be secured, and the connection strength between them can be increased.

  In addition, the substrate shown as an example of a member constituting the mounting structure or other member may be a wiring substrate on which a wiring pattern is formed, or may be one in which an electronic circuit or the like is mounted. Good.

  Moreover, although each above-described embodiment demonstrated the case where a board | substrate was connected with respect to a mounting structure, the other member of connection object is not limited to a board | substrate. For example, the present invention can be similarly applied to a case where members such as an electronic component and an electronic circuit module are arranged with respect to the substrate so that the principal surfaces are orthogonal to each other, and these are connected.

DESCRIPTION OF SYMBOLS 1 Mounting structure 11 Board | substrate 111 Member connection electrode 13 Connection member 17 Board | substrate 171 Mounting structure connection electrode 151,153 Resin

Claims (2)

Forming an electrode for connecting a member on a main surface of a member on which a component to be mounted is mounted for each region that is cut and divided so as to face each other across the cutting position;
A first connection step in which one end surface of a second columnar member as a support portion is erected and connected to the opposing member connection electrodes formed in the electrode formation step ;
After the resin is filled on the member to form a protective layer, the upper surface of the protective layer is polished and flattened to expose the other end surfaces of the second columnar members,
One first columnar member is arranged in parallel with the main surface of the member on the other end surface of the exposed second columnar member, and both side surfaces of the first columnar member are exposed on the other end surface of the second columnar member. A second connection step of connecting;
An individualization step of cutting and dividing the member together with a first columnar member parallel to the main surface of the member at the cutting position;
And the electrode forming step forms the member connecting electrodes so that the positions of the member connecting electrodes formed in adjacent regions are symmetrical with respect to each other across the cutting position. Manufacturing method of mounting structure. Forming an electrode for connecting a member on a main surface of a member on which a component to be mounted is mounted for each region that is cut and divided so as to face each other across the cutting position;
A connecting member having a U-shaped outer shape in which support portions are integrally formed at both ends of a columnar portion forming a parallel portion is disposed so that the parallel portion is parallel to the main surface of the member, and A connection step in which the base end portion of the support portion is erected and connected on the opposing member connection electrodes formed in the electrode formation step ;
An individualization step of cutting and dividing the member together with the parallel portion at the cutting position;
And the electrode forming step forms the member connecting electrodes so that the positions of the member connecting electrodes formed in adjacent regions are symmetrical with respect to each other across the cutting position. Manufacturing method of mounting structure.

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