JP4217719B2 - Electromagnetic wave shielding substrate, plasma display, and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electromagnetic wave shielding base material excellent in visibility, a plasma display, and a manufacturing method thereof.

  PDPs (plasma display panels) and CRTs (cathode-ray tubes) used for display screens of information processing apparatuses and the like have a problem that electromagnetic waves are generated outside.

  Thus, various techniques for preventing leakage of electromagnetic waves generated from these display screens to the outside have been proposed. A generally known leak prevention measure is a method of forming a metal pattern layer made of a highly conductive metal such as copper or nickel on a transparent substrate.

  However, when the electromagnetic shielding base material having the metal pattern layer formed as described above is provided on the front surface of the display screen, the light from the display screen and the external light are reflected on the surface of the metal pattern layer, and the metal pattern layer A cross-shaped reflection occurs along the pattern line. The reflection of the cross-shaped light causes a problem that the visibility of the display screen is lowered.

  This invention is made | formed in view of the said situation, and it aims at providing the electromagnetic wave shielding base material excellent in visibility, a plasma display, and its manufacturing method.

In order to achieve the above object, an electromagnetic wave shielding base material of the present invention has a transparent base material, an adhesive layer, and a metal pattern layer made of copper , and the shape of the metal pattern is parallel to the transparent base material. The area of the cut surface increases as it approaches the transparent substrate, and the surface roughness of the surface adjacent to the transparent substrate of the metal pattern layer is 0.10 to 1.00 μm, and is in contact with the transparent substrate. A film having at least one of an antireflection function, an antiglare function, or a near-infrared absorption function is attached to the upper surface side of the non-metal pattern layer via an adhesive layer.

The plasma display of the present invention is characterized in that a top Symbol electromagnetic wave shielding substrate to the screen front.

The method for producing an electromagnetic wave shielding base material of the present invention has a shape in which the area of a cut surface parallel to the transparent base material increases as it approaches the transparent base material on the transparent base material , and is adjacent to the transparent base material. After bonding a metal layer on which irregularities are formed in advance so that the surface roughness Ra is 0.10 to 1.00 μm using an adhesive layer, and patterning the metal layer to form a metal pattern layer A film having at least one of an antireflection function, an antiglare function, or a near-infrared absorption function is attached to the upper surface side of the metal pattern layer not in contact with the transparent substrate through an adhesive layer. And

The electromagnetic wave shielding substrate of the present invention as apparent from the above description, the light from the prevention and the display screen Newton rings generated between the prevention and the display screen and an electromagnetic wave shielding substrate leakage to the near infrared outside Further, it is possible to suppress the reflection of the external light and prevent the visibility of the screen from being lowered, and in particular, it is possible to suppress the reflection amount of the light incident from the lower side of the transparent substrate on the metal pattern layer side .

  Moreover, when the surface roughness Ra of the one surface or both surfaces of the metal pattern layer is 0.10 to 1.00 μm, the visibility of the screen due to haze or the like caused by the formation of the unevenness is not lowered.

Further, the method of manufacturing an electromagnetic wave shielding substrate of the present invention to prevent the Newton's rings generated between the prevention and the display screen and an electromagnetic wave shielding substrate leakage to the near infrared outside further light from the display screen Further, it is possible to suppress the reflection of the external light and prevent the visibility of the screen from being lowered, and in particular, it is possible to suppress the reflection amount of the light incident from the lower side of the transparent substrate on the metal pattern layer side .

  Moreover, when the surface roughness Ra of the one surface of the metal layer is 0.10 to 1.00 μm, the visibility of the screen due to haze or the like caused by the formation of unevenness is not lowered.

  Next, embodiments of the electromagnetic wave shielding base material and the manufacturing method thereof according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 13 show an embodiment of an electromagnetic wave shielding substrate of the present invention and a manufacturing method thereof.

  First, the configuration of an embodiment according to the electromagnetic wave shielding substrate of the present invention will be described with reference to FIG. As shown in FIG. 1, in the electromagnetic wave shielding base material according to the present invention, a metal pattern layer 2 made of a highly conductive metal is formed on a transparent base material 1.

  As shown in FIG. 1, the surface of the metal pattern layer 2 is subjected to blackening treatment, and unevenness with a predetermined roughness is formed on the surface. The unevenness having a predetermined roughness formed on the surface may be provided on the surface of the metal pattern layer 2 that is not in contact with the transparent substrate 1 as shown in FIG. The metal pattern layer 2 may be provided on the contact surface with the transparent substrate 1 as shown in FIG. 1 (b), or the metal pattern as shown in FIG. 1 (c). It may be provided on both sides of the layer 2. When the electromagnetic wave shielding base material is provided on the front surface of the display screen, there arises a problem that the visibility of the screen is lowered due to light from the display screen and metal reflection by external light. In order to prevent such a problem, the surface of the metal pattern layer 2 is formed with blackening treatment and irregularities with a predetermined roughness. The unevenness on the surface of the metal pattern layer 2 can be formed by this blackening treatment.

  Further, the metal pattern layer 2 may have a general shape, but as shown in FIG. 1, the area of the cut surface of the metal pattern layer 2 parallel to the transparent substrate 1 is the same as that of the transparent substrate 1. It is even better if it is formed to be larger as it gets closer. By setting it as the metal pattern layer 2 of such a shape, the side surface of a metal pattern layer can hardly be seen from the transparent base lower side. Therefore, the amount of reflection of the light incident from the lower side of the transparent substrate on the side surface of the metal pattern layer can be kept low. Further, since the field of view when viewed obliquely is not obstructed, the visibility is not lowered even if the line film thickness is made thicker than before to enhance the shielding effect of electromagnetic waves.

  When the electromagnetic shielding base material having the above-described configuration forms irregularities on the surface of the metal pattern layer 2 on the transparent base material 1 side, as shown in FIG. A foil (copper foil) 3 is attached using an adhesive 4.

  Then, a resist 5 is applied to the upper surface of the metal foil 3 to form a pattern as shown in FIG. 2B, and the metal foil 3 is patterned by etching as shown in FIG. Layer 2 is formed.

  Since the electromagnetic wave shielding base material formed by the above process has irregularities formed by blackening treatment on the surface of the metal foil 3 to prevent metal reflection, the metal foil 3 as shown in FIG. Concavities and convexities are also formed on the surface of the adhesive 4 that adheres to the transparent substrate 1.

  The unevenness increases the haze (cloudiness due to the unevenness of the surface) where light is transmitted and where the metal foil is peeled off by etching, and causes a problem of reducing the visibility of the screen when it is provided on the front surface of the display screen. .

  Therefore, the roughness of the irregularities formed on the surface of the metal pattern layer was changed, and the state of metal reflection on the metal pattern layer and the haze value generated by the irregularities were examined. FIG. 3 shows the roughness of the surface of the metal pattern layer, whether or not cross-shaped unevenness occurred when light was irradiated to the metal pattern layer of the roughness, and haze at the roughness (cloudiness due to surface irregularities). Values are shown.

  As a result, as shown in FIG. 3, when unevenness with an Ra value of 0.10 to 1.00 μm is formed on the surface of the metal pattern layer, cross-shaped unevenness can be suppressed, and haze due to unevenness is not a problem. I understood.

  The above-mentioned surface roughness Ra means that the evaluation length Im (75 mm or more) is extracted in the direction of the center line from the roughness curve shown in FIG. The value obtained by the following equation is expressed in μm when the direction of is Y axis and the roughness curve is expressed by Y = f (X).

  By forming irregularities on the surface of the metal pattern layer 2 in the range of the surface roughness Ra of 0.10 to 1.00 μm, the cross-shaped reflection along the metal pattern lines caused by light irradiation is prevented, and the irregularities It is possible to prevent a decrease in visibility due to haze or the like caused by the formation of.

  Next, an embodiment in which the above-described electromagnetic shielding base material is applied to an optical filter will be described.

  FIG. 5 shows a first embodiment in which the electromagnetic wave shielding base material of the present invention is applied to an optical filter. In the first embodiment shown in FIG. 5, a PET film layer 6 in which a PET (Polyethylene terephthalate) film is attached to one side of the transparent substrate 1 with an adhesive 7 is formed. A copper pattern layer 8 to which a copper foil patterned by an adhesive 4 is bonded is formed on the upper surface, and a transparent film having antiglare or antireflection and antiglare functions by an adhesive 7 on the upper surface of the copper pattern layer 8. Is formed on the transparent film layer 9. Also, a transparent film layer 10 is formed on the other surface of the transparent substrate 1 by attaching a transparent film having antireflection or antireflection and antiglare functions by an adhesive 4.

  A near-infrared absorber is kneaded into the transparent substrate 1 made of resin. It is known that PDP emits near infrared rays that cause a malfunction in a remote control device, a communication device, and the like. By kneading the near-infrared absorber that absorbs near-infrared light into the transparent base material, leakage of the near-infrared light to the outside can be prevented. In addition, black frame printing 11 for tightening the display screen is performed around the edge of the transparent substrate.

  As described above, the copper pattern layer 8 formed on the PET film layer 6 has an uneven surface with a surface roughness Ra of 0.10 to 1.00 μm on the adhesive surface with the adhesive 4 and the upper surface thereof by blackening treatment. Is formed. By providing such irregularities, it is possible to prevent cross-shaped reflections that have occurred along the pattern lines due to light irradiation on the copper pattern layer 8. Moreover, the fall of the visibility resulting from the haze etc. which arise by formation of an unevenness | corrugation can be prevented because the upper limit of surface roughness shall be 1.00 micrometer.

  The copper pattern layer 8 is preferably formed with a line width of 5 to 30 μm, a line pitch of 100 to 500 μm, and a line angle of 25 to 45 degrees.

  The transparent film layer 9 adhered to the upper surface of the copper pattern layer 8 with the pressure-sensitive adhesive 7 is an antiglare or a film layer having antiglare and antireflection functions. The anti-glare function is a function for preventing Newton's ring generated between the display screen and the electromagnetic shielding base material. Further, the antireflection function is a function for preventing a decrease in visibility of the screen by suppressing reflection of light from the display screen and external light when an electromagnetic wave shielding base material is provided on the front surface of the display screen.

  A transparent film layer 10 having an antireflection function, or an antiglare function and an antireflection function is formed on the opposite surface of the transparent substrate 1 by the adhesive 7.

  Next, the manufacturing procedure of the optical filter described above will be described with reference to the drawing showing the manufacturing process of the optical filter shown in FIG.

  For the copper pattern layer 8, an electrolytic copper foil 12 formed by electrolytic plating is used. One side or both sides of the copper foil 12 is subjected to blackening treatment to form irregularities having a surface roughness Ra of 0.10 to 1.00 μm. In addition, although formation of an unevenness | corrugation can also be formed by a blackening process, it can also form using the drum 13 shown by FIG. The drum 13 shown in FIG. 7 has irregularities formed on the surface with a predetermined roughness and is negatively charged. A part of this drum is dipped in a container containing a positively charged chemical abrasive, and the copper foil 12 wound around the drum 14 is wound around the drum 15 via the drum 13. At this time, one surface of the copper foil 12 is polished by unevenness provided on the drum 13 and the other surface is polished by a chemical abrasive to form unevenness on the surface.

  The copper foil 12 as described above is bonded to a PET film. The copper foil 12 is bonded to the PET film 6 to which the adhesive 4 has been applied so that the surface that has been blackened as shown in FIG. Then, as shown in FIG. 6 c, the PET film 6 to which the copper foil 12 is attached and the transparent substrate 1 are bonded together with the adhesive 7 so that the copper foil side does not become an adhesive surface.

  Next, as shown in FIG. 6d, a resist 5 is applied on the copper foil 12, and the resist 5 is patterned. Then, as shown in FIG. 6 e, the copper foil 12 is patterned by etching to form a copper pattern layer 8. After the patterning of the copper foil, the surface of the copper pattern layer 8 that has not been blackened is subjected to a blackening treatment to give unevenness to the surface of the copper pattern layer 8. These irregularities are also formed so that the surface roughness Ra is 0.10 to 1.00.

  Then, as shown in FIG. 6 f, transparent film layers 9 and 10 are attached to the upper surface of the copper pattern layer 8 and the other surface of the transparent substrate 1 with an adhesive 7. The transparent film layer 9 formed on the copper pattern layer 8 is an antiglare or a film layer having antiglare and antireflection functions, and the transparent film layer 10 formed on the other surface of the transparent substrate 1 is It is a film layer having an antireflection function, or an antiglare function and an antireflection function.

  Note that the black frame printing 11 formed on the transparent substrate 1 may be printed on the same side of the transparent substrate 1 as the surface on which the copper pattern layer 8 is provided, as shown in FIG. Alternatively, as shown in FIG. 8, the transparent substrate 1 may be printed on the surface opposite to the surface on which the copper pattern layer 8 is provided.

  Next, second and third embodiments in which the electromagnetic wave shielding base material of the present invention is applied to an optical filter will be described with reference to FIGS. FIG. 9 shows the second embodiment, and FIG. 10 shows the third embodiment.

  Unlike the above-described first embodiment, these embodiments use glass as the transparent substrate 1. When the transparent substrate 1 is glass, a near infrared absorber cannot be kneaded into the transparent substrate. Therefore, in the second embodiment shown in FIG. 9, the near-infrared absorbing film layer 16 in which the near-infrared absorbing film 16 is bonded to the copper pattern layer 8 with the adhesive 7 is provided. In the third embodiment shown in FIG. 10, a near-infrared absorbing film layer 16 is formed by sticking a strong near-infrared absorbing film on the transparent substrate 1 with the adhesive 7.

  In the above-described first embodiment, the transparent film layer 9 provided on the copper pattern layer 8 is a film layer having an antiglare function, or an antireflection function and an antiglare function. The film layer 17 has only an antireflection function. In addition, the transparent film layer 18 attached to the transparent substrate 1 with the adhesive 7 has an antireflection function, or an antiglare function and an antireflection function.

  Also in the second and third embodiments, unevenness is formed on the adhesive surface of the copper pattern layer 8 with the adhesive and the upper surface thereof with surface roughness Ra 0.10 to 1.00.

  As a modification of the second embodiment, instead of performing black frame printing 11 on the transparent substrate 1 on the copper pattern layer 8 side, the side opposite to the side on which the copper pattern layer 8 is provided as shown in FIG. Black frame printing 11 may be performed on the transparent substrate on the side.

  Further, as a modification of the third embodiment, as in the modification of the second embodiment, a black frame is formed on the transparent substrate 1 on the side opposite to the side on which the copper pattern layer 8 is provided as shown in FIG. Print 11 may be performed.

  Next, the manufacturing process of the manufacturing example will be described with reference to the flowchart shown in FIG.

  First, a copper foil part is peeled from a copper foil with a PET film (step S1). In this example, the copper foil portion of Toyo Metal Landing Co., Ltd., trade name Metaroyal, which is attached to the PET film by vapor deposition, is peeled from the PET film (step S1).

  Next, the copper foil from which the PET film has been peeled is chemically polished (step S2). In this treatment, trade name NPE-300 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as an abrasive. The copper foil is immersed in NPE-300 having a concentration of 20% and 20 ° C. for 200 seconds.

  Next, the chemically polished copper foil is bonded to a PET film using an adhesive (step S3). In this example, the product name TB1549 manufactured by Three Bond Co., Ltd. was used as the adhesive. This adhesive is applied to a PET film with a bar coater # 20 and bonded to a copper foil. Then, it is dried at 55 ° C. for 15 minutes, and after being dried, it is pressure-bonded with a 5 kg roller.

  Next, the copper foil film obtained by bonding the copper foil and the PET film is bonded to the transparent substrate (step S4). The PET film on which the copper foil is pasted and the transparent substrate are bonded together with an adhesive. In addition, a near-infrared absorber can also be added to the transparent substrate.

  Next, a resist is applied on the copper foil (step S5). In this example, a trade name, TLCR-P8008, manufactured by Tokyo Ohka Co., Ltd. was used as a resist agent. A transparent substrate on which a copper foil film is attached is fixed on a spinner, a resist is applied on the copper foil, and rotated at 1500 rpm for 1 minute.

  Next, the applied resist is pre-baked (step S6). This treatment is baked in a clean oven at 90 ° C. for 20 minutes.

Next, in order to pattern the resist, a mask is attached on the resist and exposure (step S7) and development (step S8) are performed. The exposure is performed with a light amount of 120 mj / cm ² and the development is performed by immersing in KOH at a concentration of 0.8% and 25 ° C. for 1 minute.

  Next, the exposed and developed substrate is washed with water (step S9) and etched. In this example, a product name Melstrip MN-957 manufactured by Meltex Co., Ltd. was used as an etching solution. An etching solution at 40 ° C. is sprayed on the substrate for 50 seconds.

  Next, the resist attached on the copper pattern layer is peeled off (step S11). This treatment is immersed in 3% strength KOH at 30 ° C. for 2 minutes.

Then, the electromagnetic wave shield substrate from which the resist has been peeled is washed with water (step S12) and dried (step S13), and an antireflection film is laminated on both surfaces of the substrate (step S14). In this embodiment, as a reflection preventing agent, product name Realak 2201 manufactured by Nippon Oil & Fats Co., Ltd. is used, and this reflection preventing agent is laminated at 5 kg / cm ² .

  Through the above steps, the optical filter having the configuration shown in FIG. 5 can be generated.

  The above-described embodiment is a preferred embodiment of the present invention. However, the present invention is not limited to this, and various modifications can be made without departing from the scope of the present invention.

It is sectional drawing showing the structure of embodiment which concerns on the electromagnetic wave shielding base material of this invention. It is a figure for demonstrating the formation method to the transparent base material of a metal pattern layer. It is a figure showing the relationship between the roughness of the unevenness | corrugation of the surface of a metal pattern layer, and cross unevenness. It is a figure for demonstrating surface roughness. It is sectional drawing showing the structure of 1st Embodiment which applied the electromagnetic wave shielding base material of this invention to the optical filter. It is a figure showing the state of the manufacture process of 1st Embodiment of an optical filter. It is a figure for demonstrating the formation method of the unevenness | corrugation formed in the surface of metal foil. It is sectional drawing showing the structure of the modification of 1st Embodiment of an optical filter. It is sectional drawing showing the structure of 2nd Embodiment which applied the electromagnetic wave shielding base material of this invention to the optical filter. It is sectional drawing showing the structure of 3rd Embodiment which applied the electromagnetic wave shielding base material of this invention to the optical filter. It is sectional drawing showing the structure of the modification of 2nd Embodiment of an optical filter. It is sectional drawing showing the structure of the modification of 3rd Embodiment of an optical filter. It is a flowchart showing the manufacturing process of a manufacture Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transparent base material 2 Metal pattern layer 3 Metal foil 4 Adhesive 5 Resist 6 PET film layer 7 Adhesive 8 Copper pattern layer 9, 10, 17, 18 Transparent film layer 12 Copper foil 13, 14, 15 Drum 16 Near-infrared absorption Film layer

Claims (3)

It has a transparent substrate, an adhesive layer, and a metal pattern layer made of copper , and the shape of the metal pattern is a shape that increases as the area of the cut surface parallel to the transparent substrate approaches the transparent substrate. There, the surface roughness of the surface adjacent to the transparent substrate of the metal pattern layer is 0.10～1.00Myuemu, on the upper surface side of the metal pattern layer not in contact with the transparent substrate, through an adhesive layer A film having at least one of an antireflection function, an antiglare function, or a near-infrared absorption function is attached. Plasma display, characterized in that an electromagnetic wave shielding substrate of claim 1 Symbol placement provided to the screen front. On the transparent base material, the area of the cut surface parallel to the transparent base material is increased as it approaches the transparent base material, and the surface roughness Ra of the surface adjacent to the transparent base material is 0.10 to 1 The metal pattern layer that is not in contact with the transparent substrate is formed by adhering a metal layer having irregularities formed beforehand to 0.000 μm using an adhesive and patterning the metal layer to form a metal pattern layer. A method for producing an electromagnetic wave shielding base material comprising attaching a film having at least one of an antireflection function, an antiglare function, or a near-infrared absorption function via an adhesive layer to the upper surface side of the substrate.

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