JP4216440B2 - Component mounting equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel or a plasma display panel, and in particular, a component mounting apparatus for mounting a component such as a tape carrier component (TCP) on a substrate such as a glass substrate. About.
[0002]
[Prior art]
Conventionally, as this type of component mounting apparatus, a component mounting apparatus for mounting a tape carrier component (TCP) on a glass substrate via an anisotropic conductive film (ACF) is known. In such a component mounting apparatus, the glass substrate stored in the cassette of the loader unit is sequentially taken out, and after the tape carrier component is mounted on the taken out glass substrate by the component mounting unit, the component is mounted. Subsequent glass substrates are sequentially accommodated in the cassette of the unloader section. In the unloader section, when the current cassette is full of glass substrates, the cassette is replaced and the next glass substrate is stored in a new cassette.
[0003]
[Problems to be solved by the invention]
However, in the above-described conventional component mounting apparatus, the storage state of the glass substrate in the cassette of the loader unit and the storage state of the glass substrate in the cassette of the unloader unit do not necessarily match, so there are a plurality of types in one cassette. However, there is a problem that it is difficult to appropriately manage lots of glass substrates.
[0004]
As a method for solving such a problem, a barcode or the like for identifying each glass substrate is pasted on the glass substrate on which the component is mounted, and the barcode or the like is attached to the loader unit side and A method of managing lots by reading on the unloader unit side has been proposed.
[0005]
However, with this method, it is necessary to affix a barcode or the like to all glass substrates on which components are mounted, and there is a problem that the cost for performing lot management is high.
[0006]
The present invention has been made in consideration of such points, and an object of the present invention is to provide a component mounting apparatus that can easily and inexpensively manage lots such as substrates on which components are mounted.
[0007]
[Means for Solving the Problems]
The present invention provides a loader unit for sequentially removing substrates from a cassette, a component mounting unit for mounting components on the substrate extracted from the loader unit, and a substrate on which components are mounted by the component mounting unit in a cassette. An unloader unit, and a controller for controlling the loader unit, the component mounting unit, and the unloader unit, and the controller assigns an identification number to the board every time the board is taken out from the loader unit. An assignment unit, an identification number management unit that manages the identification number of the board in a manner that reflects the current position of the board conveyed between the loader unit, the component mounting unit, and the unloader unit; and the unloader unit Referring to the identification number of the transported substrate, the lot unit of the substrate stored in the cassette of the loader unit is stored in the cassette of the unloader unit. Possess a storage control unit for accommodating the plate,
The controller further includes an abnormal board identification number assigning unit that assigns a different kind of identification number indicating that the board is inserted halfway into the component mounting unit, and the storage of the controller The control unit provides a component mounting apparatus characterized in that a discharge process different from that of a substrate assigned with a normal identification number is performed on a substrate assigned with a different type of identification number by the abnormal substrate identification number assigning unit. . According to the present invention, the storage control unit of the controller is configured such that the cassette of the unloader unit is in a lot unit of the substrate stored in the cassette of the loader unit and in the same situation as the storage state of the substrate in the cassette. It is preferable to accommodate the substrate inside.
[0009]
According to the present invention, every time a board is taken out from the cassette of the loader section, the identification number is given to the board by the identification number giving section of the controller, and the board is conveyed between the loader section, the component mounting section and the unloader section. The identification number of the board is managed in a manner that reflects the current position of the board, and finally, the identification number of the board transferred to the unloader section is referred to the board control unit for the board stored in the cassette of the loader section. The substrate is stored in the cassette of the unloader unit in a lot unit and in the same state as the storage state in the cassette. For this reason, even if a smaller number of substrates are stored in the cassette of the loader unit, or even if a problem occurs during the process and the substrate is removed in the middle of the process, Thus, the substrate storage state matches the substrate storage state in the cassette of the unloader unit, and the lot management of the substrate can be performed appropriately.
[0010]
Further, according to the present invention, when a board is inserted into the component mounting part in the middle, the abnormal board identification number assigning part of the controller assigns a different type of identification number indicating that the board is being placed in the middle. , Managing the different identification number of the board in a manner that reflects the current position of the board conveyed between the component mounting unit and the unloader unit, and finally, the controller's storage control unit controls the abnormal board identification number of the controller The substrate to which the different identification number is assigned by the assigning unit is subjected to a different discharge process from the substrate to which the normal identification number is assigned. For this reason, even when a board that has been processed up to a halfway process is thrown into the component mounting part from the middle, the board thrown in the middle can be handled separately from the normal board, and board lot management is appropriate. Can be done.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 are diagrams for explaining an embodiment of a component mounting apparatus according to the present invention. In the present embodiment, a component mounting apparatus for manufacturing a liquid crystal panel will be described as an example.
[0012]
As shown in FIG. 1, the component mounting apparatus 1 includes a loader unit 2 that sequentially takes out a glass substrate 40 from a supply-side cassette 7, and a tape carrier component (not shown) on the glass substrate 40 that is taken out from the loader unit 2. The ACF adhering device 3 for mounting, the temporary crimping device 4 and the main crimping device 5 and the glass substrate 40 after the tape carrier component is mounted by the ACF adhering device 3, the temporary crimping device 4 and the main crimping device 5 are discharged. And an unloader section 6 that is sequentially stored in the side cassette 8. The ACF sticking device 3, the temporary crimping device 4, and the final crimping device 5 each constitute a component mounting portion.
[0013]
The component mounting apparatus 1 includes a loader unit controller 11, an ACF application device controller 12, an ACF application device 3, a temporary pressure bonding device 4, a main pressure bonding device 5, and an unloader unit 6. A provisional pressure bonding device controller 13, a main pressure bonding device controller 14, and an unloader controller 15 are provided.
[0014]
Here, each of the controllers 11, 12, 13, 14, and 15 has a device interface unit 22 and controls the loader unit 2, the ACF sticking device 3, the temporary crimping device 4, the main crimping device 5, and the unloader unit 6. Can be done.
[0015]
Specifically, the controller 11 includes a substrate supply control unit 26 and a cassette exchange control unit 27. In the loader unit 2, the controller 11 sequentially takes out the glass substrates 40 from the supply side cassette 7 and all the glass from the supply side cassette 7. When the substrate 40 is taken out, it can be controlled to eject the empty cassette 9 and replace the supply side cassette 7. The supply-side cassette 7 can store a predetermined number (for example, a maximum of 20) of glass substrates 40 and stores an arbitrary number of glass substrates 40 before the tape carrier component is mounted. In addition, although 20 glass substrates 40 are normally stored in the supply-side cassette 7, for example, in the case of lot breaks, a smaller number of glass substrates 40 are stored.
[0016]
Each of the controllers 12, 13, and 14 includes an ACF sticking control unit 29, a provisional crimping control unit 30, and a main crimping control unit 31, and the ACF sticking and glass on the glass substrate 40 supplied from the loader unit 2. Control can be performed so that the temporary pressure bonding and the main pressure bonding of the tape carrier component to the substrate 40 are performed.
[0017]
Furthermore, the controller 15 includes a substrate discharge control unit 32 and a cassette replacement control unit 33. In the unloader unit 6, the glass substrate 40 after the tape carrier component is mounted is sequentially stored in the discharge side cassette 8, and When the discharge side cassette 8 is filled with the glass substrate 40, it can be controlled to discharge the stored cassette 10 and replace the discharge side cassette 8. The substrate discharge control unit 32 and the cassette replacement control unit 33 constitute a storage control unit.
[0018]
The controllers 11, 12, 13, 14, and 15 each have a memory interface unit 21 and are connected to the memory device 17 via the bus 16.
[0019]
Here, the controller 11 has an identification number giving unit 23 that gives an identification number 41 to the glass substrate 40 every time the glass substrate 40 is taken out from the loader unit 2. The identification number 41 may be a four-digit number including a lot number indicating a lot to which the glass substrate belongs and a serial number indicating the order of the glass substrates in the lot. Specifically, for example, of the four-digit number, the upper two digits represent the lot number (for example, “00” to “09” for normal lots and “10” or more for abnormal lots), and the lower two digits in the lot It is preferable to represent the order of the glass substrates (given in order from 01). The lot number may be assigned for each cassette, or may be assigned for each order lot, production lot, or the like across a plurality of cassettes.
[0020]
Further, the controllers 12, 13, 14, and 15 are arranged so that the glass substrate 40 is conveyed between the loader unit 2, the ACF adhering device 3, the temporary crimping device 4, the final crimping device 5 and the unloader unit 6 in accordance with the glass. An identification number delivery unit 24 and an identification number receiving unit 25 that deliver the identification number 41 of the substrate 40 on the memory device 17 are provided. The identification number management unit is configured by the identification number delivery unit 24 and the identification number reception unit 25 of the controllers 12, 13, 14, and 15.
[0021]
FIG. 2 is a diagram for explaining an example of a management method of the identification number 41 in the memory device 17 shown in FIG. As shown in FIG. 2, the memory device 17 corresponds to each of the loader unit 2, the ACF adhering device 3, the provisional crimping device 4, the main crimping device 5, and the unloader unit 6. "0" for medium, "1" for processed), and an identification number of a glass substrate that has been supplied to each device and that has not been processed or is being processed. It has input side identification number information 17b and output side identification number information 17c indicating the identification number of the glass substrate that has been processed in each apparatus and is ready for transport to the next process.
[0022]
Here, the controllers 11, 12, 13, 14, and 15 perform the following processing using such a memory device 17. That is, the identification number assigning unit 23 of the controller 11 generates the identification number 41 of the glass substrate 40 when it is ready to take out the glass substrate 40 from the supply side cassette 7 and transport it to the ACF attaching device 3 in the next process. Then, the identification number 41 is stored as output side identification number information 17 c for the loader unit of the memory device 17. Further, the identification number delivery unit 24 and the identification number reception unit 25 of the controllers 12, 13, 14, and 15 finish the processing for the glass substrate 40 from the ACF sticking control unit 29, the temporary crimping control unit 30, and the main crimping control unit 31. At the time when the notification of the effect is received, the status information 17a of the device in the previous process is referred to. When the status information 17a in the previous process is “1”, the output side identification number information 17c of the previous process is Stored as the input side identification number information 17b of the process.
[0023]
In addition, the glass substrate 40 delivered in accordance with the transfer of the glass substrate 40 between the loader unit 2, the ACF sticking device 3, the temporary crimping device 4, the main crimping device 5 and the unloader unit 6 in this way. The identification number 41 is finally referred to by the substrate discharge control unit 32 and the cassette replacement control unit 33 of the controller 15, and is the lot unit of the glass substrate 40 stored in the supply side cassette 7 of the loader unit 2 and the cassette. The glass substrate 40 is accommodated in the discharge-side cassette 8 of the unloader unit 6 in the same situation as that in the interior.
[0024]
Further, the controllers 12, 13, and 14 are provided with different types of identification numbers indicating that the glass substrate 40 is inserted in the middle of the ACF adhering device 3, the temporary crimping device 4 or the main crimping device 5. An abnormal board identification number assigning section 28 for assigning is further provided, and the substrate discharge control section 32 and the cassette replacement control section 33 of the controller 15 are provided with different kinds of identification numbers by the abnormal board identification number assignment section 28 of the controllers 12, 13, and 14. The glass substrate 40 to which is attached is subjected to a discharge process different from that of the glass substrate 40 to which a normal identification number is assigned.
[0025]
Next, the operation of the present embodiment having such a configuration will be described.
[0026]
In the component mounting apparatus 1 shown in FIG. 1, the glass substrate 40 is sequentially taken out from the supply-side cassette 7 by the loader unit 2. The glass substrate 40 thus taken out is sequentially transported between the ACF sticking device 3, the provisional pressure bonding device 4 and the main pressure bonding device 5, and in the process, a tape is placed on the glass substrate 40 taken out from the loader unit 2. A carrier component (not shown) is mounted. The glass substrate 40 on which the tape carrier component has been mounted in this manner is sequentially stored in the discharge cassette 8 by the unloader unit 6.
[0027]
At this time, as shown in FIG. 3, the controller 11 assigns an identification number 41 to the glass substrate 40 by the identification number assigning unit 23 every time the glass substrate 40 is taken out from the supply side cassette 7 of the loader unit 2. In FIG. 3, the cassette number (“01”, “02”,...) Is assigned as the lot number of the identification number 41, and the order of the glass substrates in the cassette (“01” to “20”) is assigned as the serial number. Is granted.
[0028]
Further, the controllers 12, 13, 14, and 15 are arranged so that the glass substrate 40 is conveyed between the loader unit 2, the ACF adhering device 3, the temporary crimping device 4, the final crimping device 5 and the unloader unit 6 in accordance with the glass. The identification number 41 of the substrate 40 is transferred on the memory device 17 by each identification number transfer unit 24 and the identification number receiving unit 25.
[0029]
Then, the identification number 41 of the glass substrate 40 delivered in this way is finally referred to by the substrate discharge control unit 32 and the cassette replacement control unit 33 of the controller 15, and in the supply side cassette 7 of the loader unit 2. The glass substrates 40 are stored in the discharge-side cassette 8 of the unloader unit 6 in the same situation as the storage state in the cassette for each lot of the glass substrates 40 stored in the unloader.
[0030]
Specifically, when the glass substrate 40 is stored in the discharge cassette 8 by the unloader section 6, if the upper two digits (lot number) in the identification number 41 are switched, the discharge cassette 8 is replaced. The glass substrate 40 is accommodated in a new discharge cassette 8. Further, if the lower two digits (serial numbers) in the identification number 41 are missing, the missing portion is skipped and the glass substrate 40 is stored in the discharge side cassette 8 (see FIG. 4).
[0031]
On the other hand, when the glass substrate 40 that has been processed up to the middle step is inserted into the ACF adhering device 3, the temporary pressure bonding device 4 or the main pressure bonding device 5 from the middle, the abnormal substrate identification numbers of the controllers 12, 13, and 14 are used. The assigning unit 28 assigns a different type of identification number (for example, an identification number including “10” indicating an abnormal lot to the upper two-digit lot number) indicating that the glass substrate 40 is being inserted halfway (see FIG. 5). The different types of identification numbers assigned in this way are also used for the controller 12, as the glass substrate 40 is transported between the ACF sticking device 3, the temporary pressure bonding device 4, the main pressure bonding device 5 and the unloader unit 6. 13, 14, and 15 are transferred on the memory device 17 by the identification number transfer unit 24 and the identification number reception unit 25, and finally, the controller 12 controls the controller 12 by the substrate discharge control unit 32 and the cassette replacement control unit 33. , 13, and 14 are subjected to a different discharge process from the glass substrate 40 to which the normal identification number is assigned to the glass substrate 40 to which the different identification number is assigned by the abnormal substrate identification number assigning unit 28.
[0032]
Specifically, when the glass substrate 40 is stored in the discharge cassette 8 by the unloader unit 6, if the upper two digits (lot number) in the identification number 41 is “10”, the glass substrate 40 is sent to another system different from the discharge side cassette 8 in which the glass substrate 40 to which the normal identification number is assigned is stored, or the discharge side cassette 8 is replaced and temporarily stored in the new discharge side cassette 8. You can do it.
[0033]
Thus, according to the present embodiment, each time the glass substrate 40 is taken out from the supply side cassette 7 of the loader unit 2, the identification number giving unit 23 of the controller 11 gives the identification number 41 to the glass substrate 40, As the glass substrate 40 is transported between the loader unit 2, the ACF adhering device 3, the provisional crimping device 4, the main crimping device 5, and the unloader unit 6, the identification number delivery units of the controllers 12, 13, 14, and 15. 24 and the identification number receiving unit 25 transfer the identification number 41 of the glass substrate 40 on the memory device 17, and are finally conveyed to the unloader unit 6 by the substrate discharge control unit 32 and the cassette replacement control unit 33 of the controller 15. By referring to the identification number 41 of the glass substrate 40, the lot unit of the glass substrate 40 stored in the supply side cassette 7 of the loader unit 2 One housing the glass substrate 40 on the discharge side cassette 8 of the unloader section 6 in the same situation and housing conditions in the cassette. For this reason, even when fewer than 20 glass substrates 40 are stored in the supply-side cassette 7 or when a trouble occurs during the process and the glass substrate 40 is removed during the process, the loader unit The storage status of the glass substrate 40 in the second supply-side cassette 7 and the storage status of the glass substrate 40 in the discharge-side cassette 8 of the unloader unit 6 coincide with each other, and lot management of the glass substrate 40 is appropriately performed. be able to.
[0034]
Further, according to the present embodiment, when the glass substrate 40 is inserted into the ACF adhering device 3, the temporary pressure bonding device 4 or the main pressure bonding device 5 from the middle, the abnormal substrate identification numbers of the controllers 12, 13, and 14 are assigned. The part 28 assigns a different type of identification number indicating that the glass substrate 40 is being put in the middle of the glass substrate 40, and the glass substrate 40 is placed between the ACF sticking device 3, the temporary pressure bonding device 4, the main pressure bonding device 5, and the unloader unit 6. The different identification numbers of the glass substrate 40 are transferred on the memory device 17 by the identification number transfer section 24 and the identification number reception section 25 of the controllers 12, 13, 14, 15 in accordance with the conveyance, and finally, The abnormal substrate identification number assigning unit 28 of each of the controllers 12, 13, 14 is changed by the substrate discharge control unit 32 and the cassette replacement control unit 33 of the controller 15. Identification number normal identification number subjected to different discharge process a glass substrate 40 which is applied to the glass substrate 40 that has been granted. For this reason, even when the glass substrate 40 that has been processed up to the middle step is put into the ACF adhering device 3, the temporary pressure bonding device 4 or the main pressure bonding device 5 from the middle, It can be handled separately from the glass substrate 40, and lot management of the glass substrate 40 can be performed appropriately.
[0035]
In the above-described embodiment, the identification number 41 of the glass substrate 40 is transferred on the memory device 17 connected to the controllers 11, 12, 13, 14, 15, but without providing the memory device 17, The identification number 41 may be directly exchanged between the controllers 11, 12, 13, 14, and 15.
[0036]
In the above-described embodiment, a controller for controlling the loader unit 2, the ACF sticking device 3, the temporary crimping device 4, the main crimping device 5 and the unloader unit 6 is provided for each device. These controllers may be integrated into one controller, and the identification number 41 of the glass substrate 40 may be transferred on the memory of the controller.
[0037]
Furthermore, in the above-described embodiment, the present invention has been described with reference to an example in which the present invention is applied to a component mounting apparatus that mounts a tape carrier component on a glass substrate 40. However, other component mounting apparatuses such as a plasma display panel (PDP) The present invention can also be applied to a component mounting apparatus for mounting electronic components such as a flexible printed circuit board (FPC).
[0038]
【The invention's effect】
As described above, according to the present invention, it is possible to easily and inexpensively manage lots such as substrates on which components are mounted.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining an embodiment of a component mounting apparatus according to the present invention.
FIG. 2 is a diagram for explaining an example of an identification number management method in the memory device of the component mounting apparatus shown in FIG. 1;
FIG. 3 is a view for explaining an example of the operation of the component mounting apparatus shown in FIG. 1;
FIG. 4 is a view for explaining another example of the operation of the component mounting apparatus shown in FIG. 1;
FIG. 5 is a view for explaining still another example of the operation of the component mounting apparatus shown in FIG. 1;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Loader part 3 ACF sticking apparatus 4 Temporary crimping apparatus 5 Final crimping apparatus 6 Unloader part 7 Supply side cassette 8 Discharge side cassette 9 Empty cassette 10 Stored cassette 11 Loader part controller 12 ACF sticking apparatus controller 13 Temporary Crimping device controller 14 Crimping device controller 15 Unloader controller 16 Bus 17 Memory device 21 Memory interface unit 22 Device interface unit 23 Identification number assigning unit 24 Identification number delivery unit 25 Identification number receiving unit 26 Substrate supply control unit 27 Cassette Replacement control unit 28 Abnormal substrate identification number assigning unit 29 ACF sticking control unit 30 Temporary pressure bonding control unit 31 Main pressure bonding control unit 32 Substrate discharge control unit 33 Cassette replacement control unit 40 Glass substrate 41 Identification number

Claims (2)

A loader unit for sequentially taking out the substrates from the cassette; a component mounting unit for mounting components on the substrate taken out from the loader unit; and an unloader unit for sequentially storing the substrates on which the components are mounted by the component mounting unit in the cassette. A controller for controlling the loader unit, the component mounting unit, and the unloader unit, and the controller assigns an identification number to the board every time the board is taken out of the loader unit; An identification number management unit that manages an identification number of the board in a manner that reflects a current position of the board conveyed between the loader unit, the component mounting unit, and the unloader unit; and a substrate conveyed to the unloader unit The substrate is stored in the cassette of the unloader unit in units of lots of the substrates stored in the cassette of the loader unit with reference to the identification number of the loader unit. And a that the storage control unit,
The controller further includes an abnormal board identification number assigning unit that assigns a different kind of identification number indicating that the board is inserted halfway into the component mounting unit, and the storage of the controller The control unit performs a discharging process different from that of a substrate assigned with a normal identification number on a substrate assigned with a different type of identification number by the abnormal substrate identification number assigning unit. The component mounting apparatus according to claim 1, wherein the identification number includes a lot number representing a lot to which the board belongs and a serial number representing the order of the boards in the lot.

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