JP4206209B2 - Method for manufacturing substrate with metal pattern, substrate with metal pattern, method for manufacturing substrate with metal pattern for liquid crystal display device, substrate with metal pattern for liquid crystal display device, and liquid crystal display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a substrate with a metal pattern used for, for example, a semiconductor component, a substrate with a metal pattern obtained by this manufacturing method, a method for manufacturing a substrate with a metal pattern for a liquid crystal display device, and a liquid crystal obtained by this manufacturing method. The present invention relates to a substrate with a metal pattern for a display device and a liquid crystal display device using the substrate.
[Prior art]
[0002]
The structure of the liquid crystal display device is roughly classified into a transmission type liquid crystal display device (hereinafter referred to as a transmission type), a total reflection type liquid crystal display device (hereinafter referred to as a total reflection type), and a semi-transmission type liquid crystal display device (hereinafter referred to as a semi-transmission type). There are three types of forms). In the transmissive type, an image or the like is displayed when light from a backlight disposed inside the apparatus passes through a transparent colored layer composed of red, green, and blue.
[0003]
On the other hand, the total reflection type displays an image or the like using external light such as sunlight or illumination. The transflective type has a structure having both functions of a transmissive type and a total reflection type.
[0004]
FIGS. 9A and 9B are partially enlarged views showing a total reflection type structure and FIGS. 10A and 10B are semi-transmission type structures.
As shown in FIGS. 9A and 9B, in the total reflection type, the front substrate 41 and the substrate 45 with the metal pattern on which the metal pattern 42 is formed are arranged to face each other. The red, green and blue colored layers 43 (R), 43 (G) and 43 (B) formed on the substrate 45 with the metal pattern and the adjacent red, green and blue are prevented from being mixed and the color purity is lowered. A black matrix (not shown) provided for prevention, an overcoat layer 46 formed on the colored layers 43 (R), 43 (G) and 43 (B), and the liquid crystal 44 are sandwiched therebetween. Transparent conductive films 47 and 48 and a polarizing plate 49 are provided. In such a total reflection type, the external light L1 transmitted through the colored layers 43 (R), 43 (G), and 43 (B) is reflected by the metal pattern 42, and again the colored layers 43 (R), 43 (G ) And 43 (B) are transmitted to display an image or the like.
[0005]
Also, as shown in FIGS. 10A and 10B, the transflective type, like the total reflection type, is a front substrate 41, a substrate 45 with a metal pattern on which a metal pattern 42 is formed, a liquid crystal 44, a colored layer. In addition to 43 (R), 43 (G), 43 (B), and the like, a light transmitting portion 51 and a polarizing plate 50 for transmitting light are included. In such a semi-transmissive type, in addition to the display by the external light L1 similar to the total reflection type, the backlight L2 transmits the light transmissive part 51 and the colored layers 43 (R), 43 (G) and 43 (B). By doing so, an image or the like is displayed.
[0006]
FIG. 11 is a plan view showing a portion (substrate forming portion 53) where the substrate 45 with a metal pattern is formed on the transparent plate 52.
For example, in the case of a small-sized liquid crystal display device used for a mobile phone or the like, a plurality of substrates 45 with metal patterns are manufactured from one transparent plate 52 as shown in FIG. The metal pattern on the substrate 45 with a metal pattern is usually formed by the following procedure.
[0007]
<Procedure 1: Formation of metal film>
First, a metal film is formed on the entire surface of the transparent plate 52 by sputtering, vapor deposition, or the like. Usually, a metal film containing Al, Cr, Ag, Ni or the like or an alloy thereof is used. For the purpose of improving visibility, a scattering layer (not shown) having moderate irregularities may be formed before forming the metal film.
[0008]
<Procedure 2: Formation of photosensitive resin pattern>
After a photosensitive resin is applied on the metal film obtained by the procedure 1 by a spin coat method or the like, the photosensitive resin is covered with a photomask formed in a predetermined pattern, and then irradiated (exposed) with light. Development and curing are performed to obtain a predetermined photosensitive resin pattern. At this time, when the photosensitive resin is a negative type, the portion where the photosensitive resin pattern is to be formed is irradiated with light, and when the photosensitive resin is a positive type, the portion where the photosensitive resin pattern is to be formed is covered with the photomask. Irradiate other parts with light.
[0009]
<Procedure 3: Formation of metal pattern>
A metal pattern having the same shape as the photosensitive resin pattern is obtained by subjecting the metal film having the photosensitive resin pattern obtained in step 2 to a corrosion treatment (etching) with an etching solution suitable for the metal film. Is obtained.
[0010]
<Procedure 4: Removal of photosensitive resin>
The photosensitive resin pattern on the metal pattern obtained by procedures 1 to 3 is peeled and removed with an alkaline stripping material.
[0011]
A predetermined metal pattern for light reflection can be formed on the transparent plate 52 by the procedures 1 to 4 described above. The substrate 45 with a metal pattern obtained by cutting the substrate forming portion 53 on which the metal pattern is formed is the liquid crystal display device shown in FIGS. 9A, 9B, 10A, and 10B. Used for.
[0012]
However, when the metal pattern 42 is formed on the substrate 45 with the metal pattern, many processes as described in the above 1 to 4 are required, which causes an increase in cost. Further, when the photosensitive resin pattern is peeled off as shown in step 4, the metal pattern 42 is deteriorated / corroded, scratched / stained, etc., or the photosensitive resin is not completely peeled off. In some cases, a resin residue is generated and the reflection performance is deteriorated. Further, when colored layers 43 (R), 43 (G) and 43 (B) and a black matrix (not shown) are formed on the metal pattern 42 as shown in FIGS. 9B and 10B. In this formation process, the metal pattern 42 may be flawed and the reflection performance may be deteriorated.
[0013]
The above problems are not limited to the time of manufacturing a substrate for a liquid crystal display device, but also occur when a metal pattern is formed on a substrate, for example, as in the manufacture of semiconductor components.
[0014]
[Problems to be solved by the invention]
The main object of the present invention is to reduce the number of processes when manufacturing a metal pattern used for semiconductor parts, for example, the metal pattern is deteriorated / corroded, scratched / stained, etc., and a photosensitive resin residue is generated. It is providing the manufacturing method of the board | substrate with a metal pattern which does not carry out, and the board | substrate with a metal pattern obtained by this manufacturing method.
[0015]
Another object of the present invention is to reduce the number of processes when forming a metal pattern on a transparent plate, and the metal pattern is deteriorated / corroded, scratched / stained, and a photosensitive resin residue is generated. Furthermore, when a colored layer or black matrix is formed on the metal pattern, the metal pattern is not deteriorated, corroded, scratched or soiled. A manufacturing method, a substrate with a metal pattern obtained by this manufacturing method, and a liquid crystal display device provided with this substrate.
[0016]
[Means for Solving the Problems]
As a result of intensive studies to solve the above problems, the present inventors have peeled off the photosensitive resin used for forming the metal pattern after forming the metal pattern when forming a metal pattern used for a semiconductor component or the like. By leaving this photosensitive resin as a protective film for the metal pattern without removing it, the number of processes can be reduced, and the metal pattern may be deteriorated / corroded, scratched / stained, or a photosensitive resin residue may be generated. Therefore, the present inventors have completed the present invention by finding a new finding that the cost can be reduced and a highly reliable substrate with a metal pattern can be manufactured.
[0017]
That is, the method of manufacturing the metal patterned substrate of the present invention, a sensitive optical resin film is formed on the metal film formed on a substrate, exposing the photosensitive resin film, developing the plurality of substrate forming portion Forming a photosensitive resin pattern that exposes the metal film in the gap between the photosensitive resin pattern, removing the metal film exposed from the photosensitive resin pattern by corrosion treatment , forming a metal pattern on each substrate formation site, in each substrate forming portion, and wherein the obtaining the photosensitive residue was left metal patterned substrate a plurality of sheets by cutting the substrate forming part of the resin pattern as a protective film on the metal pattern.
[0018]
The manufacturing method of the board | substrate with a metal pattern of this invention implements the said image development and the said corrosion process simultaneously, It is characterized by the above-mentioned. Since the metal pattern and the protective film are formed at the same time, not only can the cost be reduced by further reducing the number of processes, but also the metal pattern and the protective film (photosensitive resin pattern) are not displaced, resulting in higher reliability. A highly metal substrate with a metal pattern can be manufactured.
[0019]
The above-described method of the present invention can also be applied to the production of a substrate with a metal pattern for a liquid crystal display device. Specifically, it is preferable to apply to a total reflection type and a transflective type.
[0020]
Method of manufacturing a liquid crystal display device for metal patterned substrate of the present invention includes the steps of forming a metal film on the surface of the transparent plate, forming a photosensitive resin film on the surface of the metal film, the photosensitive resin film exposing and forming a developing the photosensitive resin pattern to expose the metal film in the gap between the plurality of substrates forming portion, Shi divided the metal film exposed from the photosensitive resin pattern corroded treated and forming a metal pattern for light reflected onto the substrate forming part, wherein in each substrate forming part, and cut the remaining were left each substrate forming portion the photosensitive resin pattern as a protective film on the metal pattern And a step of obtaining a plurality of substrates with a metal pattern for a total reflection type liquid crystal display device .
[0021]
As a result, the number of processes can be reduced, the metal pattern does not deteriorate, corrode, scratches, dirt, etc., and no photosensitive resin residue is generated. In addition, a colored layer or black matrix is formed on the metal pattern. The metal pattern is not deteriorated, corroded, scratched, or soiled when forming the film, so that the cost can be reduced and a highly reflective substrate with a metal pattern for a liquid crystal display device with high reflection performance can be obtained. Can do.
[0022]
A method of manufacturing a liquid crystal display device for metal patterned substrate of the present invention includes the steps of forming a metal film on the surface of the transparent plate, forming a photosensitive resin film on the surface of the metal film, the photosensitive the resin film was exposed and developed, and the metal film in the gap of the plurality of substrate forming portion, forming a photosensitive resin pattern to expose the metal film in the light transmitting portion of the substrate forming part, this was removed dividing the metal film exposed from the photosensitive resin pattern by corrosion processes, forming a metal pattern for light reflection, including a light transmissive portion on each substrate forming portion, wherein each substrate forming portion, and characterized in that it comprises a step of obtaining the photosensitive resin pattern plurality of transflective liquid crystal display device for metal patterned substrate by cutting while remaining the substrate forming portion as a protective film on the metal pattern To do.
[0023]
As in the above, the number of processes can be reduced, the metal pattern is not deteriorated / corroded, scratched / stained, or photosensitive resin residue is generated, and the metal pattern is colored. When forming a layer or black matrix, the metal pattern is not deteriorated, corroded, scratched, or soiled, so the cost can be reduced, and the metal pattern for a transflective liquid crystal display device with high reflective performance is included. A substrate can be obtained.
[0024]
The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices of this invention implements the said image development and the said corrosion process simultaneously. Since the metal pattern and the protective film are formed at the same time, not only can the cost be reduced by further reducing the number of processes, but also the metal pattern and the protective film (photosensitive resin pattern) will not be displaced, resulting in more reflection. A substrate with a metal pattern for a liquid crystal display device with high performance can be manufactured.
In the present invention, it is preferable to use an alloy in which the metal contains aluminum.
Furthermore, the liquid crystal display device of the present invention is characterized by including the substrate with a metal pattern for the liquid crystal display device. As a result, a liquid crystal display device having high reflection performance at low cost can be obtained.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
<Method for Manufacturing Substrate with Metal Pattern for Total Reflection Type Liquid Crystal Display>
The manufacturing method of the board | substrate with a metal pattern for total reflection types which is one Embodiment of this invention is demonstrated. FIG. 1 is a plan view showing a portion (substrate forming portion 2) where the substrate with a metal pattern is formed on a transparent plate 1 by the manufacturing method of the present invention.
[0026]
For example, in the case of a small liquid crystal display device used for a cellular phone or the like, as described above, a plurality of substrates with metal patterns for a liquid crystal display device are formed from one transparent plate 1 as shown in FIG. . 2 is a cross-sectional view showing a cross section taken along line AA of FIG. As shown in FIG. 2, a metal pattern 3b made of a metal film is formed on the substrate forming portion 2 on the transparent plate 1, and a protective film 4b made of a photosensitive resin is formed on the metal pattern 3b.
[0027]
The transparent plate 1 is not particularly limited as long as it has high transparency. For example, a plate-like member such as transparent glass, polycarbonate, polyether sulfone resin, epoxy resin or the like can be used. Examples of the metal used for forming the metal pattern 3b include Al, Cr, Ag, Ni, and alloys containing these. The photosensitive resin used for forming the protective film 4b has a high light transmittance (light transmittance is 80% or more, more preferably 90% or more, and still more preferably 95% or more. Is not particularly limited, for example, those having an acrylic resin, an epoxy resin, a polyimide resin, a novolac resin, or the like as a main component can be used. Further, in order to improve visibility, light scattering function may be imparted by kneading these photosensitive resins with light scattering fine particles.
[0028]
3A to 3F show a procedure for manufacturing the substrate 11 with a metal pattern used for the total reflection type.
[0029]
A metal film 3a is formed on the entire surface of the transparent plate 1 shown in FIG. 3A by sputtering, vapor deposition, or the like (FIG. 3B). For the purpose of improving visibility, a scattering layer (not shown) having moderate irregularities may be formed on the transparent plate 1 before the formation of the metal film 3a.
[0030]
Next, as shown in FIG. 3C, the photosensitive resin film 4a is formed on the metal film 3a by applying the photosensitive resin by spin coating or the like. The film thickness of the photosensitive resin is 0.5 μm or more and 10 μm or less, preferably 5 μm or less, and more preferably 3 μm or less. Next, the photosensitive resin film 4a is covered with a photomask formed in a predetermined pattern, and is irradiated (exposed) with light and developed. As shown in FIG. A protective film 4b is formed.
[0031]
Next, in the metal film 3a, an exposed portion where the protective film 4b is not formed is subjected to corrosion treatment (etching), thereby forming the same shape as the protective film 4b as shown in FIG. A metal pattern 3b is obtained. Depending on the chemicals for development and corrosion treatment, the development of the photosensitive resin film 4a and the corrosion treatment of the metal film 3a can be performed simultaneously. For example, when the metal is aluminum, the simultaneous treatment can be performed by using an alkaline aqueous solution such as an aqueous potassium hydroxide solution or an aqueous sodium carbonate solution.
[0032]
Further, the transparent plate 1 having the metal pattern 3b and the protective film 4b is heated to a predetermined temperature to cure the photosensitive resin forming the protective film 4b. The curing temperature may be set according to the physical properties of the photosensitive resin used, and is not particularly limited.
[0033]
Finally, the substrate forming part 2 having the metal pattern 3b and the protective film 4b manufactured as described above is cut into a shape equipped in the liquid crystal display device as shown in FIG. It is used as a substrate 11 with a metal pattern for reflection type.
[0034]
FIG. 4A shows a partially enlarged view of a liquid crystal display device 12 using the substrate 11 with a metal pattern having the metal pattern 3b and the protective film 4b. In the liquid crystal display device 12, a front substrate 5 on which a black matrix (not shown) and colored layers 6 (R), 6 (G) and 6 (B) are formed and the substrate 11 with a metal pattern are opposed to each other. Are arranged. On the colored layers 6 (R), 6 (G) and 6 (B), an overcoat layer 19 made of acrylic resin, epoxy resin, polyimide resin or the like is formed. The overcoat layer 19 can be omitted as necessary.
[0035]
Further, transparent conductive films 33 and 34 are formed so as to sandwich the liquid crystal 7. These transparent conductive films 33 and 34 are functional thin films having high transmittance with respect to visible light and high electrical conductivity. Usually, an ITO film that is an indium oxide-tin oxide solid solution is used. The transparent conductive films 33 and 34 are usually formed by a film forming method such as vapor deposition or sputtering.
[0036]
Further, a polarizing plate 17 is attached to the front side of the front substrate 5 (that is, the upper surface side of the front substrate 5 in FIG. 4A).
[0037]
By applying an electric field to the liquid crystal 7 by the transparent conductive films 33 and 34 disposed with the liquid crystal 7 interposed therebetween, the alignment state of the liquid crystal 7 is changed, the optical properties are also changed, and the relationship with the polarizing plate 17 is changed. The amount of transmitted light is controlled. By performing such control for each pixel corresponding to RGB of the colored layer, color expression is realized.
[0038]
Further, like the liquid crystal display device 13 shown in FIG. 4B, the black matrix and the colored layers 6 (R), 6 (G), and 6 (B) are formed on the protective film 4b formed on the substrate 11 with the metal pattern. It can also be formed on top.
[0039]
<Method for Manufacturing Substrate with Metal Pattern for Transflective Liquid Crystal Display>
When manufacturing a substrate with a metal pattern used for a transflective type, the same manufacturing method as that for the total reflection type is used. The formation of the metal film 3a and the photosensitive resin film 4a shown in FIGS. 5A to 5C is performed in the same manner as the total reflection type in the case of the semi-transmissive type.
[0040]
Transflective type, the substrate forming portion within 2 shown in FIG. 1, a metal pattern for light reflection, including a light transmitting portion for transmitting light are formed. To form the metal pattern as a photomask described above, may be used in an as formed to correspond to the shape of the metal pattern including a light transmissive portion. Other manufacturing procedures are the same as those of the total reflection type.
[0041]
FIG. 6 shows a partially enlarged view of a translucent metal pattern-equipped substrate 14 obtained by using the photomask as described above. The metal pattern 3b, the protective film 4b, and the light transmission portion 8 are formed on the substrate 14 with the metal pattern.
[0042]
FIG. 7A shows a partially enlarged view of a liquid crystal display device 15 using the substrate 14 with a metal pattern. In the liquid crystal display device 15, a front substrate 5 on which a black matrix (not shown) and colored layers 6 (R), 6 (G), and 6 (B) are formed and the substrate 14 with a metal pattern are opposed to each other. Has been placed. In the case of the transflective type, the polarizing plate 18 is also disposed on the back side of the substrate 14 (that is, the lower side of the substrate 14 in FIG. 7A).
[0043]
Further, like the liquid crystal display device 16 shown in FIG. 7B, the black matrix and the colored layers 6 (R), 6 (G), and 6 (B) are formed on the protective layer 4 b formed on the substrate 14 with the metal pattern. It can also be formed on top.
[0044]
The liquid crystal 7, the overcoat layer 19, the transparent conductive films 33 and 34, and the polarizing plates 17 and 18 shown in FIGS. 4A and 4B are the same as in FIGS. 7A and 7B. The reference numerals are attached and the description is omitted.
[0045]
The black matrix formed in the total reflection type and the semi-transmission type prevents color mixing of adjacent red, green and blue colors in the colored layers 6 (R), 6 (G) and 6 (B), and has a color purity. Although it is provided to prevent the decrease, it may be provided as necessary. As the black matrix, a black photosensitive resin containing carbon black, a film having a multilayer structure of chromium metal and chromium oxide, or the like can be used.
[0046]
The colored layers 6 (R), 6 (G) and 6 (B) are coated with a photosensitive resin containing a pigment or dye by spin coating or the like, and then exposed through a photomask for development. It is obtained by doing. This process is repeated at least three times for each transparent coloring pattern of red, green, and blue.
[0047]
As described above, the metal-patterned substrates 11 and 14 for the liquid crystal display devices 12, 13, 15, and 16 manufactured by the manufacturing method according to the present invention are the conventional photosensitive resin peeling step (the above-described process). Procedure 4) has been reduced. Thereby, the cost reduction by process reduction can be achieved. Further, since the photosensitive resin pattern is not peeled off, the metal pattern 3b is not deteriorated / corroded, scratched / stained, or a photosensitive resin residue is not generated. Thereby, the board | substrates 11 and 14 with a metal pattern which have high reflective performance can be manufactured.
[0048]
Furthermore, in the liquid crystal display device shown in FIGS. 4B and 7B, the metal pattern 3b is also formed when the black matrix and the colored layers 6 (R), 6 (G), and 6 (B) are formed. There will be no deterioration, corrosion, scratches or dirt. Thereby, the board | substrates 11 and 14 with a metal pattern which have high reflective performance can be manufactured.
[0049]
The method for manufacturing a substrate for a liquid crystal display device according to the present invention is not only applied to the above-described embodiments, but also can be used for forming a metal pattern using a photosensitive resin, for example, in manufacturing semiconductor components. Thus, a highly reliable substrate with a metal pattern can be obtained at low cost.
[0050]
【Example】
Hereinafter, an example is given and the reflective characteristic of the board | substrate with a metal pattern obtained by the manufacturing method of this invention is demonstrated.
[0051]
Example In order to confirm the reflection performance of the substrate with a metal pattern for a liquid crystal display device obtained by the production method of the present invention, the following experiment was conducted.
[0052]
A substrate 11 with a metal pattern having a metal pattern 3b and a protective film 4b was produced by the procedure shown in FIGS. Transparent glass was used for the transparent plate 1. Further, aluminum was used as the metal for forming the metal pattern 3b, and the film was formed by sputtering. A photosensitive resin mainly composed of an acrylic resin was used as the photosensitive resin for forming the protective film 4b. The development and the corrosion treatment were simultaneously performed using an alkaline aqueous solution.
[0053]
Since the substrate 11 with a metal pattern manufactured as described above has reduced the process of peeling off the protective film 4b, the surface of the metal pattern 3b does not show deterioration, corrosion, scratches, dirt, or photosensitive resin residue. I couldn't. It was also confirmed that the mirror surface was maintained by visual inspection using a high-intensity lamp.
Further, it was confirmed that there was no deviation between the metal pattern and the photosensitive resin pattern.
[0054]
In FIG. 8, the result of having measured the reflective performance of the said board | substrate 11 with a metal pattern is shown. The horizontal axis of the graph represents the wavelength of light, and the vertical axis represents the reflection performance of the substrate 11 with the metal pattern produced in this example when the reflectance of the aluminum film formed by sputtering is 100. . As shown in FIG. 8, the substrate 11 with the metal pattern of this example has a performance equivalent to the reflective performance of the aluminum film in the visible light region, and the protective film 4b exists on the metal pattern 3b. Even in this case, it was confirmed that good reflection performance was obtained.
[0055]
【The invention's effect】
According to the present invention, the number of processes can be reduced, the metal pattern is not deteriorated / corroded, scratched / stained, or a photosensitive resin residue is not generated. There exists an effect that a board | substrate with a high metal pattern can be manufactured.
[0056]
Further, according to the present invention, the number of processes can be reduced, the metal pattern is not deteriorated / corroded, scratched / stained, or a photosensitive resin residue is not generated, and the metal pattern is colored. When forming a layer or black matrix, the metal pattern is not deteriorated, corroded, scratched, or soiled, so that the cost can be reduced and the substrate with a metal pattern for a liquid crystal display device with high reflection performance is provided. The liquid crystal display device provided can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view showing a portion (substrate forming portion) where a substrate with a metal pattern is formed on a transparent plate by the manufacturing method of the present invention.
FIG. 2 is a cross-sectional view showing a cross section taken along line AA in FIG.
FIG. 3 is a schematic view showing a procedure for manufacturing a substrate with a metal pattern for a total reflection type liquid crystal display device by the manufacturing method of the present invention.
4A and 4B are partially enlarged views showing an example of a total reflection type liquid crystal display device using a substrate with a metal pattern manufactured by the manufacturing method of the present invention. FIG.
FIG. 5 is a schematic view showing a procedure for manufacturing a substrate with a metal pattern for a transflective liquid crystal display device by the manufacturing method of the present invention.
FIG. 6 is a partially enlarged view showing a substrate with a metal pattern manufactured by the manufacturing method of the present invention.
FIGS. 7A and 7B are partially enlarged views showing an example of a transflective liquid crystal display device using a substrate with a metal pattern manufactured by the manufacturing method of the present invention.
FIG. 8 is a graph showing reflection characteristics of a substrate with a metal pattern measured in an example of the present invention.
FIGS. 9A and 9B are partially enlarged views showing an example of a total reflection type liquid crystal display device using a substrate with a metal pattern manufactured by a conventional manufacturing method.
FIGS. 10A and 10B are partially enlarged views showing an example of a transflective liquid crystal display device using a substrate with a metal pattern manufactured by a conventional manufacturing method.
FIG. 11 is a plan view showing a portion (substrate forming portion) where a substrate with a metal pattern is formed on a transparent plate by a conventional manufacturing method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Transparent plate 2 Substrate formation site 3a Metal film 3b Metal pattern 4a Photosensitive resin film 4b Protective film 5 Front substrate 6 (R) Colored layer (red)
6 (G) Colored layer (green)
6 (B) Colored layer (blue)
7 Liquid crystal 8 Light transmission part 11 Substrate with metal pattern 12 Total reflection type liquid crystal display device 13 Total reflection type liquid crystal display device 14 Substrate with metal pattern 15 Transflective liquid crystal display device 16 Transflective liquid crystal display devices 17 and 18 Polarizing plate 19 Overcoat layer 33, 34 Transparent conductive film

Claims (12)

Form a photosensitive resin film on the metal film formed on the substrate,
This photosensitive resin film is exposed and developed to form a photosensitive resin pattern that exposes the metal film in the gaps between the plurality of substrate formation sites,
The metal film exposed from the photosensitive resin pattern is removed by corrosion treatment, and after forming a metal pattern on each substrate formation site,
A substrate with a metal pattern, wherein, in each of the substrate formation portions, each substrate formation portion is cut while leaving the photosensitive resin pattern as a protective film on the metal pattern to obtain a plurality of substrates with metal patterns. Manufacturing method.   The manufacturing method of the board | substrate with a metal pattern of Claim 1 which implements the said image development and the said corrosion process simultaneously. The manufacturing method of the board | substrate with a metal pattern of Claim 1 or 2 in which the said photosensitive resin has the light transmittance of 80% or more . The manufacturing method of the board | substrate with a metal pattern as described in any one of Claims 1-3 in which the said metal consists of an alloy containing aluminum. It is a board | substrate with a metal pattern manufactured by the manufacturing method as described in any one of Claims 1-4, Comprising: It has a protective film which consists of a photosensitive resin pattern on a metal pattern, The board | substrate with a metal pattern characterized by the above-mentioned. . Forming a metal film on the surface of the transparent plate;
Forming a photosensitive resin film on the surface of the metal film;
Forming a photosensitive resin pattern that exposes and develops the photosensitive resin film to expose a metal film in a gap between a plurality of substrate formation sites;
Removing the metal film exposed from the photosensitive resin pattern by corrosion treatment, and forming a metal pattern for light reflection on each substrate forming site;
A step of cutting each substrate forming portion while leaving the photosensitive resin pattern as a protective film on the metal pattern in each substrate forming portion to obtain a plurality of total reflection type substrates with metal patterns for liquid crystal display devices The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices characterized by the above-mentioned. Forming a metal film on the surface of the transparent plate;
Forming a photosensitive resin film on the surface of the metal film;
A step of exposing and developing the photosensitive resin film to form a photosensitive resin pattern that exposes a metal film in a gap between a plurality of substrate forming portions and a metal film in a light transmitting portion of each substrate forming portion. When,
Removing the metal film exposed from the photosensitive resin pattern by corrosion treatment, and forming a light reflecting metal pattern including a light transmitting portion on each substrate forming portion;
A step of cutting each substrate forming portion while leaving the photosensitive resin pattern as a protective film on the metal pattern in each substrate forming portion to obtain a plurality of transflective liquid crystal display substrate with a metal pattern The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices characterized by the above-mentioned.   The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices of Claim 6 or 7 which implements the said image development and the said corrosion process simultaneously. The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices as described in any one of Claims 6-8 in which the said photosensitive resin has the light transmittance of 80% or more . The manufacturing method of the board | substrate with a metal pattern for liquid crystal display devices as described in any one of Claims 6-9 which the said metal consists of an alloy containing aluminum. It is a board | substrate with a metal pattern for liquid crystal display devices manufactured by the manufacturing method as described in any one of Claims 6-10, Comprising: It has a protective film which consists of a photosensitive resin pattern on a metal pattern, It is characterized by the above-mentioned. A substrate with a metal pattern for liquid crystal display devices.   The liquid crystal display device provided with the board | substrate with a metal pattern for liquid crystal display devices of Claim 11.

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