JP2006201214A - Electrooptical apparatus and manufacturing method of electrooptical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical apparatus capable of enhancing quality of reflection display by removing the cause of narrowness of a visual angle of reflection display easily and at a low cost, and to provide a manufacturing method of the electrooptical apparatus. <P>SOLUTION: The manufacturing method of the electrooptical apparatus includes: a forming process for forming an underlayer 15 having recessed and projecting parts 21 on a second substrate; a film-depositing process for film-depositing a reflection film 16 reflecting light on the underlayer formed in the forming process; and a removing process for removing the flat part 23 of the reflection film 16 film-deposited in the film-depositing process. Thereby, external light is not specularly reflected by the flat part 23 and a liquid crystal apparatus 1 capable of performing clear reflection display using scattering by pure external light can be manufactured. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electro-optical device used for a personal computer, a mobile phone, and the like, and a method for manufacturing the electro-optical device.

  Currently, electro-optical devices are widely used in various electronic devices such as mobile phones and portable information terminals, and these electro-optical devices are displays for visually displaying various information on the electronic devices. Used for parts. In electro-optical devices, devices using liquid crystals as electro-optical materials, that is, liquid crystal devices are now widely known. Furthermore, an EL (Electro Luminescence) display device is also known as a display device using other electro-optical materials.

  For example, a liquid crystal device using liquid crystal as an electro-optical material generally has a structure in which a liquid crystal layer is sandwiched between a pair of substrates each having an electrode. That is, a gap is formed between the pair of substrates by the spacer, and the liquid crystal is sealed in the gap by using a sealant. In this liquid crystal device, the alignment state of the liquid crystal molecules is modulated by controlling the voltage applied to the liquid crystal layer, and the external light that has passed through the polarizing plate passes through the modulated liquid crystal layer. Information such as letters, numbers, and figures can be displayed on the observation side.

  As a method for performing display by supplying external light to the liquid crystal as described above, a reflective type, a transmissive type, and a reflective transflective type in which both can be selected are well known. In the reflection type light supply method, a reflection film having a reflection function is provided inside, and external light such as room light and sunlight is reflected by the reflection film and supplied to the liquid crystal. In this case, the formation of concavities and convexities for obtaining a display that is easier to see is generally performed (see, for example, Patent Document 1).

  In addition, a technique for improving the quality of reflective display by using an efficient reflector is widely known. (For example, refer to Patent Document 2).

Further, in a transflective liquid crystal device in which a transflective layer having a concavo-convex structure having a reflective portion and a transmissive portion is formed, it is proposed that the transmissive portion is formed in a region including a substantially flat portion of the concavo-convex structure. (For example, refer to Patent Document 3).
Japanese Patent Application Laid-Open No. 2003-75987. Japanese Unexamined Patent Publication No. 2000-171794. JP 2001-75091 A.

  However, by randomly arranging the uneven reflecting surface shape by the method of Patent Document 1 described above, it is possible to improve the display characteristics, and the uneven surface becomes smoother by the method of Patent Document 2, Since it is difficult to completely eliminate the flat portion of the uneven surface while ensuring randomness, there is a problem in that the flat portion causes specular reflection, narrowing the viewing angle of reflection, and improving the quality of the reflective display. .

  On the other hand, according to the proposal of Patent Document 3 described above, since the transmission part is formed in a region including the substantially flat part of the uneven structure of the semi-transmission layer, it is considered that the specular reflection by the flat part can be prevented. It is not easy to accurately form a transmission part on a flat part, including the production of the exposure mask, and even if this is possible, there is a problem that high technology and large costs are required.

  The present invention has been made in view of the above-described problems, and eliminates the cause of narrowing the viewing angle of a reflective display easily at low cost, and an electro-optical device capable of improving the quality of the reflective display and the electro-optical device. An object is to provide a manufacturing method.

  In order to achieve the above object, an electro-optical device according to a main aspect of the present invention includes a substrate that supports an electro-optical material, a resin layer that is formed on the substrate and has a plurality of convex portions, and the resin layer. And a reflection film having a plurality of projections reflecting the plurality of projections, and a region between the projections of the resin layer is a flat portion, and the reflection film is provided. It is characterized by not.

  According to the present invention, a reflective film is provided on the flat portion of the underlayer as in the prior art, so that external light is not specularly reflected, and a clear reflective display is possible using scattering from pure external light without fail. Become.

  An electro-optical device manufacturing method according to another aspect of the present invention includes: a forming step of forming a resin layer having irregularities on a substrate; and a reflective film that reflects light on the resin layer formed by the forming step And a removal step of removing a flat portion of the reflective film formed by the film formation step.

  Here, the “flat portion” refers to a portion parallel to the substrate surface at the bottom of the concave and convex portions, for example.

  The present invention includes a forming step of forming a resin layer having unevenness on a substrate, a film forming step of forming a reflective film that reflects light on the resin layer formed by the forming step, and the film forming And removing the flat part of the reflective film formed by the process, so that external light is not specularly reflected by the flat part, and it is clear using scattering by pure external light. An electro-optical device that enables reflective display can be manufactured.

  According to one form of this invention, the unevenness | corrugation of the said resin layer has a some convex part, and the said flat part respond | corresponds to the area | region between the said convex parts. Thereby, it becomes easy to specify the region to be removed, and the manufacturing cost can be reduced.

  According to one aspect of the present invention, the forming step includes a first application step of applying a first photosensitive resin on the substrate, and the first photosensitive material applied by the first application step. A first exposure step of exposing the photosensitive resin using a first exposure mask having a light shielding portion formed in a predetermined pattern, and developing the first photosensitive resin exposed by the first exposure step. A first developing step, and the removing step includes a positive second type when the first photosensitive resin is a positive type on the reflective film formed by the film forming step. When the first photosensitive resin is a negative type, when the first photosensitive resin is a negative type, a second application step of applying a negative type second photosensitive resin, and the second coating step is applied. An exposure mask having a second light-sensitive resin and a light-shielding portion having the same pattern as the first exposure mask A second exposure step for exposing the second photosensitive resin, a second development step for developing the second photosensitive resin exposed in the second exposure step, and the reflective film exposed after the second development step. And a step of etching the flat portion of the substrate and a step of removing the second photosensitive resin. Here, the “exposure mask provided with the light shielding portion of the same pattern” includes not only the exposure mask provided with the light shielding portion of the same pattern as the first exposure mask but also the first exposure mask itself. Thereby, an uneven pattern can be easily formed on the surface of the resin layer, and a reflective film can be laminated on the resin layer to reflect the unevenness on the surface of the reflective film, and reflected light can be scattered.

  Conventionally, it is not easy to accurately form a transmissive part in a flat part, including the production of the exposure mask, and even if it is possible, there has been a problem that high technology and large cost are required. According to the present invention, the same positive type or the same negative type second photosensitive resin as that of the first photosensitive resin is used, and the first exposure mask used for forming the unevenness of the resin layer is used as it is or the same. Since the flat part of the reflective film can be removed by exposure using an exposure mask in which the pattern of the light shielding part is formed, the flat part can be easily aligned accurately, and there is no need to prepare a separate exposure mask. The conventional problems can be solved.

  According to one aspect of the present invention, the forming step includes a first application step of applying a first photosensitive resin on the substrate, and the first photosensitive material applied by the first application step. A first exposure step of exposing the photosensitive resin using a first exposure mask having a light shielding portion formed in a predetermined pattern, and developing the first photosensitive resin exposed by the first exposure step. A first developing step, wherein the removing step is a negative second when the first photosensitive resin is a positive type on the reflective film formed by the film forming step. When the first photosensitive resin is a negative type, when the first photosensitive resin is a negative type, a second application step of applying a positive type second photosensitive resin and the second application step are applied. The second photosensitive resin is a pattern in which the pattern of the light shielding portion of the first exposure mask is inverted. A second exposure step in which exposure is performed using a second exposure mask in which an optical part is formed; a second development step in which the second photosensitive resin exposed in the second exposure step is developed; The method includes a step of etching a flat portion of the reflective film exposed after the second development step, and a step of removing the second photosensitive resin. Accordingly, even if the second photosensitive resin is not the same negative type or positive type as the first photosensitive resin, the second exposure mask obtained by inverting the first exposure mask is used, so that the reflective film is flattened. Therefore, it is possible to make the exposure mask relatively inexpensive while increasing the degree of freedom in selecting the photosensitive resin.

  In addition, since the exposure is performed using the second exposure mask in which the light shielding portion is formed with a pattern obtained by inverting the pattern of the light shielding portion of the first exposure mask, the flat portion 23 can be easily aligned accurately, and the manufacturing cost can be reduced. Can be further reduced.

  According to one aspect of the present invention, when the second photosensitive resin is a positive type, the second photosensitive resin remaining after the second developing step is used in the second exposure step. When the second photosensitive resin is negative, the second photosensitive resin remaining after the second development step is formed so as to protrude from the light shielding region to the flat portion side. It is formed so as to protrude from the exposure region of the exposure step to the flat portion side. Thereby, the second photosensitive resin remaining after the second development step by adjusting the film thickness of the second photosensitive resin, the exposure amount, the material of the photosensitive resin, or the time of the melt baking is, for example, the second photosensitive resin. It can be formed so as to protrude from the light shielding region in the exposure process to the flat portion side.

  For example, the portion of the second photosensitive resin that covers the inclined surface of the uneven surface formed on the surface of the reflective film with respect to the substrate plane is also removed by the second development. Therefore, the entire surface of the reflective film is not removed by etching, and only unnecessary portions such as a substantially flat portion are removed.

  According to one form of this invention, the film thickness of the said 2nd photosensitive resin is 1.5 times or more and 2 times or less of the film thickness of the convex part of the said 1st photosensitive resin, It is characterized by the above-mentioned. And Here, the film thickness of the convex portion of the first photosensitive resin is, for example, a concavo-convex shape indicating a position where light is applied by the concavo-convex mask 27 from the surface of the first photosensitive resin 26 shown in FIG. The distance to the convex part of the broken line (unevenness 21 of the underlayer). As a result, the portion of the second photosensitive resin that covers the inclined surface with respect to the substrate plane of the irregularities formed on the surface of the reflective film is not completely removed even by the second development, and is therefore also reflected by etching. The entire surface of the film is not removed, and only unnecessary portions such as a substantially flat portion are removed.

  According to an aspect of the present invention, the removing step includes a step of baking the second photosensitive resin before the etching step. As a result, the second photosensitive resin remains more reliably in the portion covering the inclined surface with respect to the uneven surface of the substrate formed on the reflective film surface, so that only unnecessary portions such as flat portions are removed. Become.

  According to an aspect of the present invention, the flat portion is characterized in that the surface of the flat portion is at an angle of 0 degree to 3 degrees with respect to the substrate surface. As a result, a region that is specularly reflected from the surface of the reflective film can be surely removed, and a clear reflective display can be achieved using scattering by pure external light.

  A method for manufacturing a substrate for an electro-optical device according to the present invention is a method for manufacturing a substrate for an electro-optical device including a substrate having a plurality of pixels, the application step of applying a photosensitive material to the substrate, and the application An exposure process for forming irregularities in which exposure is performed so that light acts to a depth shallower than the film thickness of the photosensitive material in order to form irregularities on the surface of the photosensitive material applied in the process, and the substrate for the electro-optical device Substrate exposure that exposes light so that it acts beyond the depth of the film thickness of the photosensitive material applied in the coating process, outside the region to be the substrate for the electro-optical device in order to form a region to be A step of developing the photosensitive material that has been subjected to the exposure for forming irregularities and the substrate exposure, removing a region exposed during the exposure for forming irregularities and the substrate exposure, and baking the substrate Smooth A step of forming a convex surface, a step of forming a reflective film on the concave and convex portions with a substantially uniform film thickness after the step of forming the smooth concave and convex surface, and photolithography and etching on the substrate on which the reflective film is formed. And a step of removing the reflective film in a region overlapping with the flat portion.

  According to this method for manufacturing a substrate for an electro-optical device, the depth of the concave and convex portions formed in the photosensitive material is shallower than the thickness of the photosensitive material, and the concave and convex portions are formed into the film thickness of the photosensitive material. Therefore, the flatness of the reflective layer formed on the bottom of the concave portion is lowered, and good scattering characteristics can be obtained.

  In addition, the photosensitive material in a portion other than the region that becomes the electro-optical device substrate is removed, and the side end surface of the electro-optical device substrate becomes flat, so that the electrode provided across the side end surface is cut off. The problem is solved.

  In the electro-optical device substrate manufacturing method, in the substrate exposure step, the electro-optical device substrate region is formed so that a transmission region for transmitting light is formed in the electro-optical device substrate region. In addition to the outside, an area corresponding to the transmission area in the area to be the substrate for the electro-optical device may be exposed.

  In the method for manufacturing a substrate for an electro-optical device according to the present invention, a positive resist that makes the light irradiation portion soluble by development may be used, or a negative resist that cures the light irradiation portion may be used.

  Embodiments according to the present invention will be described below with reference to the drawings. In the following description of the embodiments, an electro-optical device and a method for manufacturing the electro-optical device will be described using a liquid crystal device as an example of the electro-optical device as an example. However, the present invention is not limited to the embodiment. Of course. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic exploded perspective view of a liquid crystal device according to the present embodiment, FIG. 2 is a partial plan view seen from above a color filter on the second substrate side, and FIG. 3 is a schematic partial sectional view taken along line AA in FIG. FIG. 4 is an explanatory diagram showing a state in which the reflective film is removed at the flat portion.

  (Configuration of liquid crystal device)

  First, the configuration of the liquid crystal device 1 according to the embodiment of the present invention will be described.

  As shown in FIGS. 1 and 3, for example, the liquid crystal device 1 includes a liquid crystal 2 (not shown in FIG. 1), which is a kind of electro-optical material, sandwiched between a first substrate 3 and a second substrate 4 as substrates. Liquid crystal panel 5 and a backlight unit 6 disposed on the second substrate side of the liquid crystal panel 5. In the following description, for the sake of convenience, as shown in FIG. 3, “observation side” means that the first substrate side with respect to the liquid crystal is the side on which the observer who views the display image by the liquid crystal device 1 is located. And the second substrate side from the liquid crystal 2 is referred to as “back side”. In addition to the backlight unit 6, other auxiliary mechanisms (not shown) are attached to the liquid crystal device 1 as necessary.

  The first substrate 3 of the liquid crystal panel 5 is a plate-like member made of a light transmissive material such as glass. On the surface of the first substrate 3 on the observation side, for example, as shown in FIGS. 1 and 3, a retardation plate 7 for improving contrast and a polarizing plate 8 for polarizing incident light are provided on the first substrate side. The pixel electrodes 9 such as an ITO (Indium Tin Oxide) film are arranged in a matrix on the liquid crystal side (back side) surface of the first substrate 3. A plurality of data electrodes 10 extending in one direction (Y direction shown in FIG. 1) are formed in the gaps between the pixel electrodes 9, and the data adjacent to each pixel electrode 9 and each pixel electrode 9 are formed. The electrode 10 is connected via a TFD (Thin Film Diode) 11 which is a two-terminal switching element having nonlinear current-voltage characteristics. As shown in FIG. 3, the surface of the first substrate 3 on which the pixel electrode 9, the data electrode 10, and the TFD 11 are formed is covered with an alignment film 12 (not shown in FIG. 1). The alignment film 12 is an organic thin film such as polyimide, and is subjected to a rubbing process for defining the alignment state of the liquid crystal 2 when no voltage is applied.

  The second substrate 4 as a substrate for a liquid crystal device is a plate-like member made of a light-transmitting material such as glass, for example, and the retardation plate 13 is formed on the back surface thereof in the same manner as the first substrate 3. The polarizing plate 14 is laminated in this order from the second substrate side. On the other hand, on the liquid crystal side (observation side) surface of the second substrate 4, for example, a base layer 15 as a resin layer, a reflective film 16, three color filters 17 (17R, 17G, 17B), and light A light shielding layer 18, a scanning electrode 19, and an alignment film 20 (not shown in FIG. 1) are laminated in this order from the second substrate side. Among these, the alignment film 20 is an organic thin film similar to the alignment film 12, and is subjected to a rubbing process.

  Here, the underlayer 15 is formed, for example, by exposing and developing a positive photosensitive resin, and has fine irregularities 21 on the surface. 2 and 3, for example, the inner circumference is formed in a substantially rectangular shape for each pixel described later, and the second substrate 4 is not covered with the underlying layer 15 (transmission region described later). C).

  The reflective film 16 is a metal film made of, for example, aluminum, silver, or an alloy thereof, and forms a reflective region B that reflects external light. Further, the reflection film 16 is also provided with irregularities 22 on the surface of the reflection film, reflecting the fine irregularities 21 on the surface of the underlayer 15. As a result, it is possible to solve problems such as scattering of external light such as sunlight and room light, narrowing the viewing angle, and making it difficult to see the reflective display of the liquid crystal display device.

  Further, as shown in FIGS. 2 and 3, for example, the reflective film 16 is formed only in the region where the base layer 15 is formed. Like the base layer 15, the reflective film 16 is formed in the center of each pixel. A transmissive region C that transmits substantially no rectangular light is formed.

  Further, as shown in FIG. 4, for example, as shown in FIG. 4, the reflective film 16 has the flat portion 23 of the unevenness 22 on the surface of the reflective film in which the reflective film 16 is completely removed in the same manner as the transmissive region C. It has become.

  For example, as shown in FIG. 4, the non-reflective region D that is a flat portion is just a concave portion of the concave and convex portions 22 of the reflective film 16, and the angle with the second substrate surface direction (Y-axis direction in the drawing) is 0 degree or more and 3 degrees or less It is formed to become. Thereby, the specular reflection by the reflective film 16 can be reduced, and the viewing angle of the reflected light can be widened. In addition, since it will scatter rather than specular reflection when it becomes larger than 3 degrees, it is limited to 3 degrees or less.

  Further, for example, the base layer 15 is colorless and transparent so that the light from the backlight unit 6 can be transmitted through the non-reflective region D, and the brightness in the reflective region B can be increased.

  The color filter 17 includes, for example, a transmissive region C and a reflective region B (including a non-reflective region D) by applying a coloring photosensitive resin such as a pigment or a dye on the reflective film, and exposing and developing. This is a primary color filter formed in the display area, and is composed of, for example, any one of 17R (red), 17G (green), and 17B (blue).

  In addition, the arrangement of the color filters 17 shows a stripe pattern in FIG. 2, but is not limited to this, and may be a mosaic arrangement or a pen tile arrangement.

  The light shielding layer 18 shields the boundary area between the pixels, and the longitudinal direction (X direction in FIG. 1) of the scanning electrode 19 of the second substrate 4 and the direction (FIG. 1 in FIG. 1) intersect the boundary area. For example, the colored layer 17B is disposed in the lowermost layer, and the colored layer 17R and the colored layer 17G are formed in that order, for example. Further, the light shielding layer 18 can be formed of a color filter 17 in which two or three layers are laminated, or a metal film such as chromium.

  Further, the scanning electrodes 19 are formed in a strip shape extending in a predetermined direction (X-axis direction in FIGS. 1 and 3), and a plurality of scanning electrodes 19 are formed in a stripe shape in parallel with each other. Further, the alignment film 20 is an organic thin film such as polyimide, and has been subjected to a rubbing process in order to define the alignment state of the liquid crystal 2.

  Each of the plurality of scanning electrodes 19 is a strip-like electrode formed of a light-transmitting conductive material such as ITO. As shown in FIG. 1, the scanning electrode 19 is formed on the surfaces of the color filters 17R, 17G, and 17B, extends in the direction intersecting the data electrode 10 described above (X-axis direction in FIG. 1), It is positioned on the first substrate 3 so as to face a plurality of pixel electrodes 9 forming a column.

  The first substrate 3 and the second substrate 4 having the above-described configuration are bonded together via, for example, a sealing material 24 (not shown), and in a region surrounded by the structure on both substrates and the sealing material 24, for example, A TN (Twisted Nematic) type liquid crystal 2 is sealed.

  Under such a configuration, the liquid crystal 2 sandwiched between the first substrate 3 and the second substrate 4 is applied with a voltage between the pixel electrode 9 and the scanning electrode 19 facing the liquid crystal 2, thereby aligning the alignment direction thereof. Changes. As shown in FIG. 2, the minimum unit of the region where the alignment direction of the liquid crystal 2 changes according to the applied voltage is arranged in a matrix, and each of them functions as a pixel 25 (dot).

  When external light is incident on the liquid crystal panel 5 from the observation side, the external light is scattered and reflected toward the observation side, for example, by the second substrate side, which is a substrate for an electro-optical device, thereby realizing a reflective display. On the other hand, when the light of the backlight unit 6 is incident from the back side of the liquid crystal panel 5, the incident light is emitted to the observation side through, for example, the transmission region C where the base layer 15 and the reflective film 16 are not provided. Thereby, a transmissive display is realized.

  For example, an overcoat layer (not shown) is provided between the color filter 17 and the alignment film 20 and the scanning electrode 19 to protect the color filter 17 and the optical path length in the reflection region B is substantially equal to the optical path length in the transmission region C. You may form so that it may become the same.

  (Manufacturing method of liquid crystal display device)

  Next, a manufacturing method of the liquid crystal device configured as described above will be described.

  FIG. 5 is a process diagram showing a manufacturing process on the second substrate side, which is a substrate for a liquid crystal device, FIG. 6 is an explanatory view of forming a base layer in the manufacturing process, and FIG. 7 is a plan view of an exposure mask for forming irregularities on the base layer. 8 is a plan view of an exposure mask for forming a transmission region of the underlayer, FIG. 9 is an explanatory view of forming a photosensitive resin on the reflective film, and FIG. 10 is an explanatory view of exposure of the second photosensitive resin. 11A and 11B are explanatory diagrams of the reflective film etching process.

  First, a manufacturing method on the second substrate side which is a substrate for a liquid crystal device will be described.

  For example, after the second substrate 4 is cleaned, the substrate is dried (ST101 in FIG. 5).

  Next, the first photosensitive resin 26 is applied to the surface to be the observation surface of the substrate as a first application step by, for example, spin coating as shown in FIG. 6A (ST102 in FIG. 5). .

  Thereafter, the first photosensitive resin 26 applied to the second substrate 4 is dried under reduced pressure (ST103 in FIG. 5), and pre-baked in the temperature range of 80 to 110 ° C. for 1 to 3 minutes (ST104 in FIG. 5). . In order to improve the adhesion of the photosensitive resin to the second substrate 4, a surface treatment with a silane coupling agent such as hexamethyldisilazane (HMDS) may be performed before applying the photosensitive resin. .

  Next, the pre-baked first photosensitive resin 26 is subjected to first exposure using an unevenness mask 27 that is a first exposure mask having a pattern shown in FIG. 7 as shown in FIG. 6B, for example. First exposure (1) is performed as the first exposure step (ST105 in FIG. 5).

  Here, the concavo-convex mask 27 is provided with a light-transmitting substrate such as glass provided with a concavo-convex light-shielding portion 28 (shown in black in FIG. 6B) as a light-shielding portion such as chrome. It is. As shown in the enlarged view of FIG. 7, the concavo-convex mask 27 is provided with a plurality of concavo-convex light-shielding portions 28, which are minute light-shielding regions for forming the concavo-convex 21 of the underlayer 15. Note that since the first photosensitive resin 26 is a positive type, when irradiated with light, the portion is dissolved and removed in a developer in a developing process described later.

  For example, when the exposure time is exposed in the range of 1,500 to 2,500 msec with such an uneven mask 27, the light transmitted through the uneven mask 27 is first as shown in FIG. The photosensitive resin 26 acts up to the surface indicated by the broken line in the figure. In the first photosensitive resin 26, the depth at which the light transmitted through the concave / convex mask 27 acts varies depending on the material of the first photosensitive resin 26 and the intensity of light at the time of exposure. It can be controlled by changing the time.

  Next, the concavo-convex mask 27 as described above is sequentially shifted by using an exposure machine, and the exposure process which is the first exposure (1) of the entire second substrate 4 is performed by repeating the exposure process. As shown in FIG. 6C, the mask 29 is used to perform the first exposure (2) as the first exposure process (ST106 in FIG. 5). FIG. 8 is a diagram showing a pattern of the transmission mask 29 used for the second exposure. As shown in this figure, the transmission mask 29 is provided with a light-transmitting region light-shielding portion 30 (indicated by hatching in FIG. 8) on a light-transmitting substrate such as glass.

  In this transmissive mask 29, the portion corresponding to the panel display area is shielded from light except for the transmissive area C, and the same pattern is provided in a matrix corresponding to each of the pixels 25 in the liquid crystal panel 5. Yes. As shown in the enlarged view of FIG. 8, a light transmitting portion 31 for forming a transmission region C is provided in a region corresponding to one pixel 25 in the transmission mask 29. With such a transmission mask 29, the first exposure time (1), which is the first exposure (1), is different from the exposure time. For example, the exposure time is 4,000 msec, and the first exposure (2) is the second time. When the above exposure is performed, the light transmitted through the non-shielded portion of the transmission mask 29, that is, the light transmitted through the light transmitting portion 31 and the portion corresponding to the outside of the panel display area is the first photosensitive resin 26. Acts to the bottom of the.

  After the transmission mask 29 is sequentially shifted by the exposure machine as described above, the exposure process is repeatedly performed for the entire second substrate 4, and then the first photosensitive resin 26 is used as a first development process. When the development process is performed (ST107 in FIG. 5), as shown in FIG. 6D, the depth of the light applied in the exposure process, the concave portion of the irregularities 21, the portion of the transmission region C, A portion of the photosensitive resin outside the panel display area is removed, and a first photosensitive resin 26 having irregularities 21 on the surface and flat side end surfaces 32 is formed. Note that the above-described exposure may use a small mask as shown in FIGS. 7 and 8, or a large mask for batch exposure.

  When the development process of the first photosensitive resin 26 is completed as described above, the first photosensitive resin 26 is then irradiated with, for example, ultraviolet rays (hereinafter referred to as UV) such as i-line to perform bleach exposure. (ST108 in FIG. 5). The first photosensitive resin 26 used in this embodiment is yellowish immediately after development, and the yellowishness is removed and the light transmittance is improved by irradiating UV. If the ground layer 15 is colored by the first photosensitive resin 26, this is reflected in the light transmitted through the non-reflective region D from which the reflective film 16 has been removed. Yes. This step is a specific step for the positive photosensitive resin used in this embodiment, and is not an essential step in the manufacture of the second substrate that is a substrate for a liquid crystal device. Thereafter, the first photosensitive resin 26 is baked, for example, at “220 ° C.” for 30 minutes to 50 minutes (ST109 in FIG. 5). In this way, a ground layer 15 having irregularities is formed as shown in FIG. 6D (ST110 in FIG. 5).

  Next, for example, as shown in FIG. 9A, a metal film such as aluminum is formed into a thin film by a vapor deposition method or the like on the uneven base layer 15 (ST111 in FIG. 5) to form an aluminum film. Then, after cleaning the second substrate 4 with the aluminum film, the substrate is dried.

  Then, a second photosensitive resin 33 as a second application step is applied to the surface to be the observation surface of the second substrate as shown in FIG. 9B by, for example, a spin coating method (in FIG. 5). ST112).

  At this time, the second photosensitive resin 33 is the first photosensitive resin 33 left after the second development as a second development step, which will be described later, as the second exposure (1). It is assumed that it is formed so as to protrude from the light shielding region of the exposure to the flat portion side. For example, the second photosensitive resin 33 remaining after the second development by adjusting the film thickness of the second photosensitive resin 33, the exposure amount, the material of the photosensitive resin, or the time of melt baking is used as the second exposure. It can be formed so as to protrude from the light shielding region of (1) to the flat portion side.

  As a result, the portion of the second photosensitive resin 33 that covers the inclined surface of the irregularities 22 formed on the reflective film surface with respect to the second substrate surface also protrudes from the light shielding portion of the irregularity mask 27. Therefore, the entire surface of the reflective film 16 is not removed even by etching, and only unnecessary portions such as a substantially flat portion are removed.

  Specifically, for example, the film thickness of the second photosensitive resin 33 is set to be 1.5 to 2 times the film thickness of the convex portion of the first photosensitive resin 26. Here, the film thickness of the convex portion of the first photosensitive resin 26 is, for example, an unevenness indicating a position where light is applied by the unevenness mask 27 from the surface of the first photosensitive resin 26 shown in FIG. If the film thickness is smaller than 1.5 times, all the second photosensitive resin 33 on the reflective film other than the flat portion 23 is also exposed to light. Conversely, if it is larger than twice, the second photosensitive resin 33 on the reflective film of the flat portion 23 may not be removed. As a result, the second photosensitive resin 33 covers only a wider range of dripping of the second photosensitive resin 33 due to baking after exposure and development, which will be described later, for example, usually only a part of the inclined surface of the unevenness 22 other than the flat portion. The conductive resin 33 covers substantially the entire inclined surface, and as a result, only the flat portion 23 of the reflective film 16 can be exposed.

  Thereafter, the second photosensitive resin 33 applied to the second substrate is dried under reduced pressure (ST113 in FIG. 5), and pre-baked in the temperature range of 80 to 110 ° C. for 1 to 3 minutes (ST114 in FIG. 5).

  Then, for example, as shown in FIG. 9C, the second photosensitive resin 33 pre-baked as shown in FIG. 9 is used as it is to form the concave / convex mask 27 used for the first exposure (1) of the first photosensitive resin. Then, the second exposure (1), which is the second exposure step, is performed (ST115 in FIG. 5).

  Thus, for example, as shown in FIG. 10, the film thickness of the second photosensitive resin 33 on the flat portion 23 of the unevenness 22 of the reflective film 16 is substantially F when viewed in the Z-axis direction, and the second photosensitive resin When the exposure amount is adjusted so that the light can act to the depth of just F with the photosensitive resin 33, the light completely acts on the photosensitive resin at least in the flat portion 23 (non-reflective region D) in FIG.

  On the other hand, the thickness G in the Z-axis direction of the second photosensitive resin 33 corresponding to both ends of the uneven transmission portion 34 of the uneven mask 27, for example, the end portion 35 in FIG. Thus, the thickness is larger than the thickness F, which is the length of the normal line from the intersection 36 with the reflection film surface directly below the end portion 35 to the outer surface of the second photosensitive resin 33. That is, even if the distance is such that G> F and the light can act on the flat portion 23, the other second photosensitive resin 33 cannot act on the surface of the reflective film 16. Accordingly, assuming that the exposure amount is such that all the light can act on the flat portion 23, the maximum depth at which the light acts on the other second photosensitive resin 33 is, for example, the thick line (H in FIG. 10). As a result, the second photosensitive resin 33 remains on the reflective film surface other than the flat portion 23 after all.

  For example, as shown by a broken line in FIG. 9C, the second photosensitive resin 33 is completely reflected only in the flat portion 23 of the unevenness 22 of the reflective film 16 by the second exposure (1) (ST115 in FIG. 5). Light acts on the film surface.

  Next, in the transmission mask 29 which is the first exposure mask used for forming the reflective film 16, the first exposure time and the exposure time which are the second exposure (1) are made different, for example, exposure When the second exposure is performed as the second exposure (2) as the second exposure process at a time of 4,000 to 6,000 msec (ST116 in FIG. 5), the unshielded portion of the transmission mask 29 , That is, the light that has passed through the translucent portion 31 and the portion corresponding to the outside of the panel display area, acts on the lowermost portion of the second photosensitive resin 33 as shown in FIG. .

  Further, since the second photosensitive resin 33 is also of a positive type, the portion where the light has acted is dissolved in the developer in the second development as the second development step, for example, as shown in FIG. It is removed (ST117 in FIG. 5).

  Thereafter, the second photosensitive resin 33 is baked, for example, at 100 ° C. or higher and 120 ° C. or lower, preferably “110 ° C.” for 30 to 20 minutes (ST118 in FIG. 5). At this time, for example, the film thickness of the second photosensitive resin 33 is 1.5 times or more and twice or less than the film thickness of the convex portion of the first photosensitive resin 26, so that the liquid is used at the baking temperature. The drooping range is widened, and the inclined surface of the irregularities 22 other than the flat portion 23 of the reflective film 16 can be covered.

  Further, unnecessary portions such as the flat portion 23 of the reflective film 16 are removed by etching / resist stripping processing, for example, as shown in FIG. 11B (ST119 in FIG. 5), as shown in FIG. 11C. Then, the reflective film 16 in which the non-reflective region D and the transmissive region C are formed is completed (ST120 in FIG. 5).

  Subsequently, red, green, and blue color filters 17R, 17G, and 17B are formed in a matrix on the reflective film 16 on the second substrate side. As a method for forming these color filters 17R, 17G, and 17B, for example, the color filters 17R, 17G, and 17B can be formed using a photosensitive resin colored with a pigment.

  Next, a thin film made of ITO is formed so as to cover the color filters 17R, 17G, and 17B and the light shielding layer 18, and the scanning electrode 19 is formed by patterning the thin film.

  Then, after forming the scan electrodes 19, an alignment film 20 is formed so as to cover these scan electrodes 19, and a rubbing process is performed on the surface of the alignment film 20.

  The above is the manufacturing method of each structure provided on the second substrate 4. The second substrate side obtained by this manufacturing method and the first substrate side on which the pixel electrode 9, the data electrode 10, the TFD 11, and the alignment film 12 are formed are opposed to each other. In this state, they are bonded together via the sealing material 24.

  Next, the liquid crystal 2 is injected into a space surrounded by the first substrate side, the second substrate side, and the sealing material 24, and then the space where the liquid crystal 2 is injected is sealed with a sealing material (not shown).

  Then, the phase difference plates 7 and 13 and the polarizing plates 8 and 14 are attached to the outer surfaces of the integrated first substrate 3 and second substrate 4 to complete the liquid crystal panel 5.

  Finally, a necessary circuit board, a backlight unit 6 and a case are attached to the liquid crystal panel 5 to complete the liquid crystal device 1.

  (Operation of liquid crystal device)

  Next, the operation of the liquid crystal device 1 configured as described above will be briefly described.

  First, light incident from the outside reaches the reflection film 16 via the liquid crystal 2. Incident light is reflected by the reflective film 16 and reaches the observer. At this time, since the reflective film 16 does not exist in the specular reflection region (non-reflective region D in FIG. 4), external light is transmitted and does not reach the observer. For this reason, specular reflection light that causes the viewing angle to be narrowed is removed, the viewing angle is widened, and the reflection quality is improved.

  This is the end of the description of the operation of the liquid crystal device 1.

  As described above, according to the present embodiment, the formation step of forming the base layer 15 having the unevenness 21 on the second substrate, and the reflective film 16 that reflects light on the base layer formed by the formation step are provided. Since the film forming step for forming a film and the removing step for removing the flat portion 23 of the reflective film 16 formed by the film forming step are provided, external light is specularly reflected by the flat portion 23. Therefore, it is possible to manufacture the liquid crystal device 1 that enables clear reflective display using scattering by pure external light.

  Moreover, since the unevenness 21 of the base layer 15 has a plurality of convex portions and the flat portion 23 corresponds to the region between the convex portions, it is easy to specify the region to be removed, and the manufacturing cost is reduced. Reduction can be achieved.

  Further, the same positive type second photosensitive resin 33 as the first photosensitive resin 26 is used, and the concavo-convex mask 27 which is the first exposure mask used for forming the concavo-convex of the underlayer 15 is used as it is or in the same light shielding portion. Since the flat portion 23 of the reflective film 16 is removed by exposure or the like using the exposure mask on which the pattern is formed, the flat portion 23 can be easily aligned accurately and it is also necessary to prepare a separate exposure mask. The manufacturing cost can also be reduced.

  Further, since the second photosensitive resin 33 remaining after the second development is formed so as to protrude from the light shielding region of the second exposure (1) to the flat portion side, for example, the second photosensitive resin 33 The part which covers the inclined surface with respect to the board | substrate plane of the unevenness | corrugation 22 currently formed in the reflective film surface among 2nd photosensitive resin 33 by adjusting the film thickness of 33, exposure amount, the material of a photosensitive resin, or the time of melt baking. Of these, the portion that protrudes from the light shielding portion of the exposure mask remains without being removed by the second development, and the entire surface of the reflective film 16 is not removed by etching, and only an unnecessary portion such as a substantially flat portion is left. It will be removed.

  Furthermore, since the film thickness of the second photosensitive resin 33 is 1.5 to 2 times the film thickness of the convex portion of the first photosensitive resin 26, Of these, the portion covering the inclined surface with respect to the substrate plane of the irregularities 22 formed on the surface of the reflective film is not completely removed even by the second development, and the entire surface of the reflective film 16 is not removed by the etching. Only unnecessary portions such as flat portions are removed. In addition, the photosensitive resin is widened by firing as much as the film thickness of the photosensitive resin, and a necessary portion other than an unnecessary portion such as the flat portion 23 can be more reliably covered.

  Moreover, since the removal process of the flat part 23 decided to bake the 2nd photosensitive resin 33 before an etching, the board | substrate surface of the unevenness | corrugation 22 in which the 2nd photosensitive resin 33 is formed in the reflective film surface Since it remains more reliably in the portion covering the inclined surface, only an unnecessary portion such as a flat portion is removed. As a result, it is possible to manufacture the liquid crystal device 1 with less specular reflection and high display quality.

  For example, the second photosensitive resin 33 is baked at a temperature of 100 ° C. or higher and 120 ° C. or lower, more preferably 110 ° C.

  Furthermore, since the surface of the flat part 23 is at an angle of 0 degree or more and 3 degrees or less with respect to the second substrate surface, the flat part 23 can surely remove the region that is specularly reflected with respect to the reflective film surface. A clear reflective display is possible by using the scattering caused by.

  In the above-described embodiment, the depth at which light acts on the photosensitive resin is controlled by the exposure time. However, the present invention is not limited to this. For example, the light is changed to the photosensitive resin by changing the light intensity. You may make it control the depth which acts.

  Further, in the above-described embodiment, the unevenness 21 is formed on the underlayer 15 using a positive photosensitive resin, the reflection film 16 is formed thereon, and the unevenness 21 of the underlayer 15 is reflected. 16 is formed, and the flat portion 23 of the concave portion of the concave and convex portion 22 is removed. For example, a plurality of convex portions are formed on the base layer, and the reflective film 16 is formed thereon, and the base layer When reflecting a convex part and forming a several convex part in this reflective film 16, you may make it not provide a reflective film in this flat part by making the area | region between the convex parts of a resin layer into a flat part. As a result, a reflective film is provided on the flat portion of the underlayer as in the prior art, so that external light is not specularly reflected, and a clear reflective display is possible using scattering from pure external light without fail. .

  Conversely, it is also possible to manufacture a reflective film having a plurality of recesses. In order to form the concave shape, it is possible to manufacture by the same process only by changing the mask pattern for forming the convex portion described above to the transmission portion.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to embodiment mentioned above, It can implement with another various form. For example, the present invention may be implemented by modifying the above-described embodiment as follows.

  (Modification 1)

  Modification 1 of the liquid crystal device 1 according to the present invention will be described. In the first modification, the pattern of the concavo-convex mask for forming the concavo-convex of the underlayer 15 as the first exposure mask is different from that of the first embodiment, and the negative second in the step of removing the reflective film 16. The second embodiment is different from the first embodiment in that a second exposure mask using the photosensitive resin is used and the first exposure mask is not used and the light-shielding portion pattern of the first exposure mask is inverted. So, I will focus on that point. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  (Configuration of liquid crystal device)

  Since the configuration of the liquid crystal device 101 according to the first modification of the present invention is the same as that of the first embodiment, the description thereof is omitted.

  (Manufacturing method of liquid crystal device)

  FIG. 12 is an explanatory diagram of the formation of the underlayer of the first modification, FIG. 13 is an explanatory diagram of the step of exposing using the mask of the reverse pattern, FIG. 14 is a plan view of the exposure mask for forming the irregularities of the underlayer, and FIG. FIG. 5 is a plan view of an exposure mask having a reverse pattern.

  The manufacturing method on the second substrate side which is the substrate for the liquid crystal device is the same as that in the first embodiment until the first photosensitive resin 26 is pre-baked through the steps up to ST104 shown in FIG. To do.

  Next, the pre-baked first photosensitive resin 26 is subjected to first exposure using an unevenness mask 127 that is a first exposure mask having the pattern shown in FIG. 14 as shown in FIG. First exposure (1) is performed as the first exposure step (ST105 in FIG. 5).

  Here, the concave / convex mask 127 is provided with a light-transmitting substrate such as glass provided with a concave / convex light-shielding portion 128 (shown in black in FIG. 12B) as a light-shielding portion such as chromium. It is.

  Further, as shown in the enlarged view of FIG. 14, the unevenness mask 127 is provided with a plurality of unevenness light-shielding portions 128, which are minute light-shielding regions for forming the unevenness 21 of the underlayer 15. Further, as shown in the enlarged view of FIG. 12B and FIG. 14, the uneven mask 127 has an uneven light-shielding portion 128 formed in a region that becomes a substantially rectangular transmission region C in the region corresponding to one pixel 25. However, it is an uneven transmission part 134 that transmits light including between the uneven light shielding parts.

  Note that since the first photosensitive resin 26 is a positive type, when irradiated with light, the portion is dissolved and removed in a developer in a developing process described later.

  When such an uneven mask 127 is exposed, for example, in an exposure time in the range of 1,500 to 2,500 msec, the light transmitted through the uneven mask 127 is first as shown in FIG. The photosensitive resin 26 acts up to the surface indicated by the broken line in the figure. In the first photosensitive resin 26, the depth at which the light transmitted through the concave / convex mask 127 acts depends on the material of the first photosensitive resin 26 and the intensity of light at the time of exposure. It can be controlled by changing the time.

  Next, the concave / convex mask 127 as described above is sequentially shifted by using an exposure machine, and the exposure process which is the first exposure (1) of the entire second substrate 4 is performed by repeating the exposure process. As shown in FIG. 12C, the mask 29 is used to perform the first exposure (2) as the first exposure process (ST106 in FIG. 5).

  That is, if the first exposure time (1) is different from the first exposure time, for example, the exposure time is set to 4,000 msec and the second exposure is performed as the first exposure (2), transmission is performed. The light transmitted through the unshielded portion of the mask 29, that is, the light transmitted through the portion corresponding to the outside of the panel display area and the light transmitting portion 31 acts to the bottom of the first photosensitive resin 26.

  After the transmission mask 29 is sequentially shifted by the exposure machine as described above, the exposure process is repeatedly performed for the entire second substrate 4, and then the first photosensitive resin 26 is used as a first development process. When the development process is performed (ST107 in FIG. 5), as shown in FIG. 12D, the depth of the light applied in the exposure process, the concave portion of the unevenness 21, the portion of the transmission region C, The photosensitive resin such as a portion outside the panel display area is removed, and the first photosensitive resin 26 having the unevenness 21 on the surface and the flat side end face 32 is formed. Note that the exposure described above may use a small mask as shown in FIGS. 14 and 8, or a large mask for batch exposure.

  When the development process of the first photosensitive resin 26 is completed as described above, the first photosensitive resin 26 is then irradiated with, for example, UV rays such as i-line to perform bleach exposure (ST108 in FIG. 5).

  Thereafter, the first photosensitive resin 26 is baked, for example, at “220 ° C.” for 30 minutes to 50 minutes (ST109 in FIG. 5). Thus, as shown in FIG. 12D, the ground layer 15 having irregularities is formed (ST110 in FIG. 5).

  Next, for example, as shown in FIG. 13A, a metal film such as aluminum is formed into a thin film by vapor deposition or the like on the underlayer 15 having the unevenness 21 (ST111 in FIG. 5) to form an aluminum film. . Then, after cleaning the second substrate 4 with the aluminum film, the substrate is dried.

  Then, a second photosensitive resin 133 as a second application step is applied to the surface to be an observation surface of the second substrate as shown in FIG. 13B by, for example, a spin coating method (in FIG. 5). ST112).

  At this time, the second photosensitive resin 133 is a negative type, and the second photosensitive resin 133 remaining after the second development as a second development step described later is the second exposure (1). It is assumed that it is formed so as to protrude from the exposure area of the flat part side. For example, the second photosensitive resin 133 remaining after the second development by adjusting the film thickness of the second photosensitive resin 133, the exposure amount, the material of the photosensitive resin, or the time of the melt baking is used as the second exposure. It can be formed so as to protrude from the exposure region of (1) to the flat portion side.

  As a result, among the portions of the second photosensitive resin 133 that cover the inclined surface of the unevenness 22 formed on the reflective film surface with respect to the second substrate surface, the reverse transmission portion 142 for unevenness of the reverse mask 140 for unevenness described later. Since the protruding portion remains without being removed by the second development, the entire surface of the reflective film 16 is not removed even by etching, and only an unnecessary portion such as a substantially flat portion is removed. .

  Specifically, for example, the film thickness of the second photosensitive resin 133 is set to be 1.5 to 2 times the film thickness of the convex portion of the first photosensitive resin 26. As a result, the second photosensitive resin 133 that covers only a part of the inclined surface of the irregularities 22 other than the flat portion in a wider range, for example, normally, the dripping of the second photosensitive resin 133 due to baking after exposure and development described later. The conductive resin 133 covers substantially the entire inclined surface, and as a result, only the flat portion of the reflective film 16 can be exposed.

  Here, the film thickness of the convex portion of the first photosensitive resin 26 is, for example, an unevenness indicating a position where light is applied by the unevenness mask 127 from the surface of the first photosensitive resin 26 shown in FIG. The distance to the convex portion of the broken line (unevenness 21 of the underlying layer).

  If the film thickness is smaller than 1.5 times, the second photosensitive resin 133 is not sufficiently dripped by baking after exposure and development, which will be described later, and the second photosensitive resin 133 has irregularities 22 other than the flat portion. There is a possibility that only a part of the inclined surface is covered, and conversely, if it is larger than twice, the second photosensitive resin 133 may remain on the flat portion.

  Next, the second photosensitive resin 133 applied to the second substrate is dried under reduced pressure (ST113 in FIG. 5), and pre-baked at a temperature range of 80 to 110 ° C. for 1 to 3 minutes (ST114 in FIG. 5). .

  Then, the pre-baked second photosensitive resin 133 is applied to the concavo-convex mask 127 used for the first exposure (1) of the first photosensitive resin 26 by, for example, an exposure machine as shown in FIG. The second exposure (1), which is the second exposure step, is performed using the concave / convex reversal mask 140 that is the second exposure mask obtained by inverting the pattern of the concave / convex light-shielding portion 128 that is the light-shielding portion (in FIG. ST115).

  FIG. 15 is a view showing a pattern of the concave / convex reversing mask 140 used for this exposure. In the negative type photosensitive resin, the exposed portion remains as a pattern, and therefore, as shown in the enlarged view of FIG. 15, the portions other than the flat portion of the reflective film 16 are left, that is, the flat portion and the transmission region are formed. The concave / convex reverse transmissive part 142 is provided so that light is applied to areas other than the area, and the concave / convex reverse light-shielding part 141 shields a portion (the flat part 23 and the transmissive area C) from which the reflective film is to be removed.

  Thereby, for example, as shown by a broken line in FIG. 13C, the second photosensitive resin 133 is formed by the second exposure (1) (ST115 in FIG. 5) and the flat portion 23 of the unevenness 22 of the reflective film 16 and Light acts completely on the reflective film surface only in a region other than the region to be a transmission region.

  In this case, since the second photosensitive resin 133 is a negative type, the portion where the light does not act is dissolved in the developer in the developing step as the second developing step, for example, as shown in FIG. And removed (ST117 in FIG. 5). In the case of negative photosensitive resin, the removal of unnecessary resin only needs to be shielded from light. Therefore, unlike the case of positive photosensitive resin, the exposure process is completed once in the second exposure (1). To do.

  Since the following manufacturing process is the same as that of the first embodiment, the description thereof is omitted.

  Finally, a necessary circuit board, backlight unit 6 and case are attached to the liquid crystal panel 5 to complete the liquid crystal device 101.

  (Operation of liquid crystal device)

  Next, since the operation of the liquid crystal device 101 configured as described above is the same as that of the first embodiment, the description thereof is omitted.

  As described above, according to the present modification, the step of removing the flat portion 23 of the reflective film 16 is performed by applying the second photosensitive resin 133 of the negative type on the reflective film formed by the film forming process. For the unevenness which is the second exposure mask in which the pattern of the light shielding portion of the unevenness mask 127 which is the first exposure mask is reversed with the second photosensitive resin 133 applied in the application step and the second application step. A second exposure step of exposing using the reversal mask 140, a second development step of developing the second photosensitive resin 133 exposed by the second exposure step, and exposure by the second development step The second photosensitive resin 133 is not of the same positive type as the first photosensitive resin 26 because the second reflective resin 133 has a step of etching the reflective film 16 and a step of peeling the second photosensitive resin 133. Even the first exposure mask is an uneven mask. By using the concavo-convex reversal mask 140 that is the second exposure mask obtained by reversing the pattern of the 27 light-shielding portions, the flat portion 23 of the reflective film 16 can be removed, and the exposure mask is increased while increasing the degree of freedom in selecting the photosensitive resin The manufacturing cost can be made relatively low.

  Further, the flat portion 23 of the reflective film 16 is removed by exposure or the like using the concave / convex reversal mask 140 which is the second exposure mask obtained by inverting the pattern of the light shielding portion of the concave / convex mask 127 which is the first exposure mask. Therefore, the flat portion 23 can be accurately aligned easily, and the manufacturing cost can be reduced.

  Further, since the negative type was used as the photosensitive resin in the removal process of the flat part 23, only the areas other than the flat part 23 of the unevenness 22 of the reflection film 16 and the area to be the transmission area in one exposure process were completely on the reflection film surface. Light can be applied, and the flat portion of the projections and depressions 22 of the reflective film 16 can be removed by a single exposure process. Thereby, the manufacturing process can be reduced and the manufacturing cost can be reduced.

  (Modification 2)

  Modification 2 of the liquid crystal device according to the present invention will be described. In the second modification, a so-called halftone mask having the same light-shielding pattern is used as the exposure mask used for the first and second exposures, and the negative type photosensitivity insolubilized by exposure to the first and second photosensitive resins. Since the point of using a resin is different from that of the first embodiment, this point will be mainly described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  (Configuration of liquid crystal device)

  The configuration of the liquid crystal device 201 according to the second modification of the present invention is the same as that of the first embodiment except that the material of the base layer 15 and the negative photosensitive resin are used as the second photosensitive resin. Description is omitted.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 201 will be described below.

  FIG. 16 is an explanatory diagram on the second substrate side in the manufacturing process of the substrate for a liquid crystal device when using a negative photosensitive resin, and FIG. 17 is an explanatory diagram of the negative mask used in the first and second exposure steps. FIG.

  First, as shown in FIG. 16A, a negative first photosensitive resin 226, which is a kind of photosensitive material, is applied onto the second substrate 4 as a first application step by spin coating or the like ( ST102 in FIG. 5).

  After that, the second substrate 4 coated with the negative first photosensitive resin 226 is dried under reduced pressure and pre-baked. For example, as shown in FIG. First exposure (1) is performed as a first exposure step using the mask 227.

  In the negative mask 227 used for this exposure, since the exposed portion remains as a pattern in the negative photosensitive resin, as shown in the enlarged view of FIG. The negative translucent part 231 is provided so as to remain, that is, so that light is applied to the part corresponding to the convex part, and the part where the underlayer 15 is to be removed is shielded.

  At this time, for example, as shown in the enlarged views of FIGS. 16B and 17, the portion corresponding to the concave portion of the unevenness 21 has a light shielding amount smaller than the region corresponding to the transmissive region C and the portion corresponding to the outside of the panel display region. The negative mask 227 is formed as a translucent portion 237, and is a so-called halftone mask having regions with different light shielding amounts.

  When the first exposure is performed using the negative mask 227, as shown in FIG. 16B, the light transmitted through the negative translucent portion 231 and the semi-transparent portion 237 is transmitted through the first photosensitive resin. It acts to the surface shown by the broken line in FIG. In the case of the negative type photosensitive resin, since unnecessary resin may be shielded from light, the exposure process is performed using a negative mask 227 which is a halftone mask unlike the case of the positive type photosensitive resin. End in times.

  After the exposure process as the first exposure process using the negative mask 227 as described above, the first photosensitive resin 226 is subjected to the development process as the first development (ST107 in FIG. 5). As shown in FIG. 16C, a region to be a transmission region C, and a base layer 15 having irregularities 21 on the surface and a flat side end surface 32 are formed.

  After the first development step of the first photosensitive resin 226 described above, the first photosensitive resin 226 is baked without performing the bleach exposure of the first embodiment (ST109 in FIG. 5). The film formation of the aluminum film below the baking, the application of the second photosensitive resin, the second exposure, the second development, the baking, the etching of the aluminum film, and the peeling process of the second photosensitive resin are the second photosensitive resin. The second embodiment is substantially the same as the first exposure, except that the photosensitive resin is negative and the second exposure is not a double exposure but can be completed by a single exposure. Since this is the same, the description thereof is omitted.

  Thus, even in an embodiment using a negative photosensitive resin, it is possible to manufacture a reflective film similar to the case of a positive photosensitive resin.

  Since the following manufacturing process is the same as that of the first embodiment, the description thereof is omitted.

  Finally, a necessary circuit board, backlight unit 6 and case are attached to the liquid crystal panel 5 to complete the liquid crystal device 201.

  (Operation of liquid crystal device)

  Next, since the operation of the liquid crystal device 201 configured as described above is the same as that of the first embodiment, the description thereof is omitted.

  As described above, according to the present modification, the negative photosensitive resin is used as the first and second photosensitive resins, and exposure is performed using a so-called halftone mask. The first and second exposures can be performed once using the same negative mask 227 when forming the region to be the region or when removing the flat portion 23 and the transmissive region C of the reflective film 16. By reducing the manufacturing process, the manufacturing cost can be reduced.

  Further, the flat portion 23 of the reflective film 16 is exposed, for example, by using the negative mask 227 which is the first exposure mask used for forming the unevenness of the base layer 15 as it is or using an exposure mask on which the same light shielding portion pattern is formed. Therefore, it is possible to accurately align the flat portion 23, and it is not necessary to prepare a separate exposure mask, and the manufacturing cost can be reduced.

  Further, even in the case of using a negative photosensitive resin, as in the case of the positive photosensitive resin, a forming process for forming the base layer 15 having the unevenness 21 on the second substrate, and a lower layer formed by the forming process. Since the film forming step for forming the reflective film 16 for reflecting light on the ground layer and the removing step for removing the flat portion 23 of the reflective film 16 formed by the film forming step are provided. External light is not specularly reflected by the flat portion 23, and clear reflection display can be easily performed at low cost by using scattering by pure external light.

  In addition, since the first photosensitive resin 226 outside the panel display area is removed and the side end face 32 of the liquid crystal device substrate becomes flat, the problem that the scanning electrode 19 is cut off does not occur.

  (Modification 3)

  A modification 3 of the liquid crystal device according to the invention will be described. In the third modification, the first photosensitive resin and the exposure mask used for the first exposure use a negative photosensitive resin and a halftone mask as in the second modification, but the second photosensitive resin and the first exposure resin are used. Since the exposure mask used for the exposure of 2 is different from that of the second modification, the description will focus on that point. In addition, about the component which is common in components, such as 1st Embodiment, the code | symbol same as the component of 1st Embodiment etc. is attached | subjected, and the description is abbreviate | omitted.

  (Configuration of liquid crystal device)

  The configuration of the liquid crystal device 401 according to the third modification of the present invention is the same as that of the first embodiment except that a negative photosensitive resin is used as the material of the base layer 15, and thus the description thereof is omitted.

  (Manufacturing method of liquid crystal device)

  Next, in the manufacturing method of the liquid crystal device 401, the positive second photosensitive resin 433 is used as the second photosensitive resin, and the light shielding pattern of the negative mask 227 is inverted as the exposure mask used for the second exposure. Since the point of using the concave / convex reversal mask 440 is different from that of the modification example 2, this point will be mainly described.

  First, a negative type first photosensitive resin 226, which is a kind of photosensitive material, is applied as a first application process on the second substrate 4 by spin coating or the like (ST102 in FIG. 5).

  Hereinafter, the process up to the aluminum film formation step (ST111 in FIG. 5) is the same as that of the second modification, and thus the description thereof is omitted.

  After the aluminum film is formed by the aluminum film formation process, the second photosensitive resin 433 as the second application process is applied to the surface to be the observation surface of the second substrate by, for example, a spin coating method. (ST112 in FIG. 5).

  At this time, the second photosensitive resin 433 is a positive type, and the second photosensitive resin 433 remaining after the second development as the second development step is used as the second exposure (1). It is formed so as to protrude from the exposure light-shielding region to the flat portion side. For example, the second photosensitive resin 433 remaining after the second development by adjusting the film thickness of the second photosensitive resin 433, the exposure amount, the material of the photosensitive resin, or the time of melt baking is used as the second exposure. It can be formed so as to protrude from the light shielding region of (1) to the flat portion side.

  Next, the second photosensitive resin 433 applied to the second substrate is dried under reduced pressure (ST113 in FIG. 5), and pre-baked in the temperature range of 80 to 110 ° C. for 1 to 3 minutes (ST114 in FIG. 5). .

  Then, the second photosensitive resin 433 that has been pre-baked is exposed by an exposure machine, and the pattern of the light shielding portion of the negative mask 227 used for the first exposure (1) of the first photosensitive resin 226 is reversed. Second exposure (1), which is the second exposure step, is performed using the concave / convex reversal mask 440, which is an exposure mask (ST115 in FIG. 5).

  Here, for example, the concave / convex inversion mask 440 is formed so that the translucent portion corresponds to the region to be the transmissive region C and the semi-transparent portion corresponds to the flat portion 23 of the reflective film 16. By the exposure (1), the second photosensitive resin 433 is removed between the flat portion 23 of the reflective film 16 and the region that becomes the transmission region C. Thereby, unlike the first embodiment, the second exposure process is completed by one exposure.

  From the second development (ST117 in FIG. 5) as the second development step below to the completion of the reflective film having the non-reflective region (ST120 in FIG. 5), the process is the same as in the first embodiment. Description is omitted.

  Finally, a necessary circuit board, backlight unit 6 and case are attached to the liquid crystal panel 5 to complete the liquid crystal device 401.

  (Operation of liquid crystal device)

  Next, since the operation of the liquid crystal device 401 configured as described above is the same as that of the first embodiment, the description thereof is omitted.

  As described above, according to the present modification, the step of removing the flat portion 23 of the reflective film 16 is performed by applying the second photosensitive resin 433 of the positive type onto the reflective film formed by the film forming process. The second photosensitive resin 433 applied by the coating process and the second coating process is used for the unevenness which is the second exposure mask in which the pattern of the light shielding portion of the negative mask 227 which is the first exposure mask is inverted. A second exposure step of exposing using the reversal mask 440, a second development step of developing the second photosensitive resin 433 exposed in the second exposure step, and exposure after the second development step The step of etching the flat portion 23 of the reflective film 16 and the step of peeling off the second photosensitive resin 433 are included, so that the second photosensitive resin 433 is the same as the first photosensitive resin 226. Even if it is not negative, it is the first exposure mask By using the concave / convex reversal mask 440, which is the second exposure mask obtained by reversing the pattern of the light shielding portion of the mask 227, the flat portion 23 of the reflective film 16 can be accurately aligned and removed, and a photosensitive resin can be selected. The manufacturing cost of the exposure mask can be reduced while increasing the degree of freedom.

  In the step of removing the flat portion 23, a positive type is used as the second photosensitive resin, and an exposure mask obtained by inverting the pattern of the light shielding portion of the first exposure mask that is a halftone mask is used as the second exposure mask. Since it is used, light can act on the flat surface 23 of the unevenness 22 of the reflective film 16 and the region to be the transmission region C completely on the reflective film surface in a single exposure process. Thus, it is possible to remove the flat portion of the unevenness 22 of the reflective film 16 and reduce the manufacturing cost.

  Second Embodiment Electronic Device

  Next, an electronic apparatus according to the second embodiment of the present invention on which the liquid crystal devices 1, 101, 201, 401 described above are mounted will be described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 18 is an external view of a mobile phone 300 having the liquid crystal device 1 as a display unit. In this figure, a mobile phone 300 includes the liquid crystal device 1 as a display unit for displaying various information such as a telephone number, in addition to a plurality of operation buttons 310, as well as an earpiece 320 and a mouthpiece 330. In addition to the mobile phone 300, the liquid crystal devices 1, 101, 201, and 401 (electro-optical devices) include various electronic devices such as computers, projectors, digital cameras, movie cameras, in-vehicle devices, copying machines, and audio devices. It can be used as a display unit.

  As described above, according to the present embodiment, the liquid crystal device 1 that eliminates the cause of easily reducing the viewing angle of the reflective display at low cost and improves the quality of the reflective display is provided. It is possible to provide the mobile phone 300 with high display quality in which brightness and the like are not insufficient.

  Note that the electro-optical device and the electronic apparatus of the present invention are not limited to the above-described examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Moreover, in the range which does not deviate from the summary of this invention, you may combine each embodiment and modification which were mentioned above.

  Although the present invention has been described above with the preferred embodiment, the present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention.

  For example, although the thin film diode element active matrix type liquid crystal device has been described in the above-described embodiments and modifications, the present invention is not limited to this, and for example, a thin film transistor element active matrix type or passive matrix type liquid crystal device may be used. Furthermore, it is not limited to the reflective transflective type, and may be a reflective type, for example. As a result, even for a wide variety of liquid crystal devices, the cause of narrowing the viewing angle of the reflective display can be easily removed at low cost, and the quality of the reflective display can be improved.

  Further, in the above-described embodiment or modification, the flat portion having a relatively large influence may be selectively removed while the viewing angle of the reflective display by specular reflection is narrowed at the flat portion of the reflective film. Thereby, it is possible to improve the deterioration of the quality of the reflective display due to the specular reflection while suppressing the influence on the reflective display by removing the reflective film as much as possible.

1 is a schematic exploded perspective view of a liquid crystal device according to a first embodiment. It is the fragmentary top view seen from the color filter by the side of the 2nd board | substrate. FIG. 3 is a schematic partial sectional view taken along line AA in FIG. 2. It is explanatory drawing of the state from which the reflecting film was removed by the flat part. It is process drawing which shows the manufacturing process by the side of the 2nd board | substrate which is a board | substrate for liquid crystal devices. It is explanatory drawing of base layer formation in the manufacturing process by the side of the 2nd board | substrate. It is a top view of the exposure mask for uneven | corrugated formation of a base layer. It is a top view of the exposure mask for formation, such as a transmissive area | region of a base layer. It is explanatory drawing of formation of the 2nd photosensitive resin on a reflecting film. It is explanatory drawing of exposure of the 2nd photosensitive resin which concerns on 1st Embodiment. It is explanatory drawing of the etching process of the reflective film which concerns on 1st Embodiment. It is explanatory drawing of base layer formation concerning the modification 1. FIG. It is explanatory drawing of the process exposed using the mask of a reverse pattern. 6 is a plan view of an exposure mask for forming irregularities of an underlayer according to Modification 1. FIG. 10 is a plan view of an exposure mask having a reverse pattern according to Modification 1. FIG. 11 is an explanatory diagram on the second substrate side in a manufacturing process according to Modification 2. FIG. It is explanatory drawing of the mask for negatives used at the 1st and 2nd exposure process. FIG. 11 is an external view of a mobile phone 300 having the liquid crystal device 1 as a display unit.

Explanation of symbols

  1, 101, 201, 401 Liquid crystal device, 2 Liquid crystal, 3 First substrate, 4 Second substrate, 5 Liquid crystal panel, 6 Backlight unit, 7, 13 Retardation plate, 8, 14 Polarizing plate, 9 Pixel electrode, 10 Data electrode, 11 TFD, 12,20 Alignment film, 15 Underlayer, 16 Reflective film, 17R, 17G, 17B Color filter, 18 Light-shielding layer, 19 Scan line, 21, 22 Concavity and convexity, 23 Flat part, 24 Sealing material, 25 Pixel, 26,226 First photosensitive resin, 27,127 Concavity and convexity mask, 28,128 Concavity and convexity shading portion, 29 Transmission mask, 30 Transmission region shading portion, 31 Translucent portion, 32 Side end surface, 33,133 , 233, 433 Second photosensitive resin, 34, 134 Transmitting portion for unevenness, 35 end portion, 36 intersection point, 140, 40 Inverted mask for unevenness, 141 Inverted light shielding part for unevenness, 142 Inverted transmission part for unevenness, 227 Negative mask, 231 Negative light transmitting part, 237 Semi-transparent part, 300 Mobile phone, 310 Operation button, 320 Earpiece, 330 Mouthpiece, B reflection area, C transmission area, D non-reflection area

Claims (9)

A substrate supporting an electro-optic material;
A resin layer formed on the substrate and having a plurality of protrusions;
A reflective film having a plurality of protrusions formed on the resin layer and reflecting the plurality of protrusions;
An area between the convex portions of the resin layer is a flat portion and the reflective film is not provided. Forming a resin layer having irregularities on the substrate;
A film forming step of forming a reflective film that reflects light on the resin layer formed by the forming step;
And a removal step of removing a flat portion of the reflective film formed by the film formation step. The unevenness of the resin layer has a plurality of convex portions,
The method of manufacturing an electro-optical device according to claim 2, wherein the flat portion corresponds to a region between the convex portions. The forming step includes a first application step of applying a first photosensitive resin on the substrate,
A first exposure process in which the first photosensitive resin applied in the first application process is exposed using a first exposure mask in which a light shielding portion is formed in a predetermined pattern;
A first development step of developing the first photosensitive resin exposed in the first exposure step,
In the removing step, when the first photosensitive resin is a positive type on the reflective film formed in the film forming step, a positive type second photosensitive resin is applied to the first photosensitive resin. A second application step of applying a negative second photosensitive resin when the conductive resin is negative;
A second exposure step of exposing the second photosensitive resin applied in the second application step using an exposure mask having a light-shielding portion having the same pattern as the first exposure mask;
A second development step of developing the second photosensitive resin exposed in the second exposure step;
Etching the flat portion of the reflective film exposed after the second development step;
The method of manufacturing an electro-optical device according to claim 2, further comprising a step of peeling the second photosensitive resin. The forming step includes a first application step of applying a first photosensitive resin on the substrate,
A first exposure process in which the first photosensitive resin applied in the first application process is exposed using a first exposure mask in which a light shielding portion is formed in a predetermined pattern;
A first development step of developing the first photosensitive resin exposed in the first exposure step,
In the removing step, when the first photosensitive resin is a positive type on the reflective film formed in the film forming step, a negative second photosensitive resin is applied to the first photosensitive resin. A second application step of applying a positive second photosensitive resin when the photosensitive resin is negative;
Using the second photosensitive resin applied in the second application step, a second exposure mask in which a light shielding part is formed with a pattern obtained by inverting the light shielding part pattern of the first exposure mask. A second exposure step for exposing;
A second development step of developing the second photosensitive resin exposed in the second exposure step;
Etching the flat portion of the reflective film exposed after the second development step;
4. The method of manufacturing an electro-optical device according to claim 2, further comprising a step of peeling the second photosensitive resin. 5. When the second photosensitive resin is a positive type, the second photosensitive resin remaining after the second development step protrudes from the light-shielding region of the second exposure step to the flat portion side. Formed into
When the second photosensitive resin is a negative type, the second photosensitive resin remaining after the second development process protrudes from the exposure area of the second exposure process to the flat portion side. The method of manufacturing an electro-optical device according to claim 4, wherein the electro-optical device is formed.   The film thickness of said 2nd photosensitive resin is 1.5 times or more of the film thickness of the convex part of said 1st photosensitive resin, and is 2 times or less of Claim 4-6 characterized by the above-mentioned. The manufacturing method of the electro-optical apparatus as described in any one of them.   The electro-optical device according to any one of claims 4 to 7, wherein the removing step includes a step of baking the second photosensitive resin before the etching step. Manufacturing method.   9. The electro-optic according to claim 2, wherein the flat portion has an angle of 0 to 3 degrees with respect to the substrate surface. Device manufacturing method.

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