JP4193935B2 - LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF - Google Patents

Description

  The present invention relates to a lighting device used for product inspection or the like in a factory, for example, and a manufacturing method thereof.

  Conventionally, CCD has been used as a method for inspecting the quality of industrial products such as printed circuit boards and semiconductors, for example, defective soldering, defects, adhesion of foreign substances, etc., and printing errors such as the production date of drinking cans on the production line. A method using imaging by a camera or the like is used. This method is to inspect the presence / absence of an abnormality by imaging a specific part of the component and comparing it with the imaging result of a normal component. In such an inspection method, it is necessary to illuminate the imaging region of the CCD camera, and for example, a ring illumination device or the like is used as the illumination device.

In the ring-type lighting device as described above, an annular printed wiring board that can be bent and has a notch is held in a flat state, and a lead of a light emitting diode (hereinafter referred to as an LED) is inserted into the through hole. After soldering, both ends of the printed wiring board were joined to each other, and then the printed wiring board was bent to form a ring shape (a truncated cone shape).
JP 2002-117706 A

  However, in the illumination device described in the above-mentioned patent document, it is extremely difficult to provide a heat dissipation structure on the back surface of the LED mounting surface of the curved printed wiring board. Therefore, no heat dissipation member is provided on the back surface of the LED mounting surface. . As a result, the heat generated from the LED is not dissipated and the temperature of the LED rises and the light emission efficiency of the LED decreases, resulting in a problem that the light output of the illuminating device decreases and the desired illuminance cannot be obtained. . Moreover, even if a separate heat radiating member such as an aluminum heat radiating fin is provided on the back surface of the LED mounting surface, the housing case has to be enlarged by the size of the heat radiating member. There has also been a problem that it has become.

  For example, when manufacturing a ring-type lighting device, a flexible printed wiring board is first maintained in a flat state, and then a number of LEDs are mounted by soldering, and then placed on one end of the printed wiring board. Since the LED leads are superposed so that they are inserted into the through holes at the other end, the LED leads and the conductive lands of the through holes are soldered to form a printed circuit board in a ring shape, The manufacturing of the system is complicated, and it takes a lot of work because it is a manual work.

  The present invention is intended to solve such problems of the prior art, and the object of the present invention is to provide a large heat dissipation effect against the heat generated by the LED without using a conventional heat dissipation member. Is to provide a lighting device capable of obtaining stable illuminance.

  Another object of the present invention is to provide a method for manufacturing a lighting device that can be easily manufactured.

In order to achieve the above object, the present invention provides an illumination device comprising an insulating case provided with a window hole, a sheet-like substrate attached to the case, and an LED attached to the sheet-like substrate. The sheet-like substrate includes an irradiation region composed of a wiring pattern electrically connected to the LED, and a heat dissipation region provided with a conductive heat radiation pattern electrically and thermally conductively connected to the wiring pattern . The irradiation region is disposed on one side of the sheet-like substrate, the heat dissipation region is disposed on the other side of the sheet-like substrate, and the conductive heat radiation pattern is connected to the wiring pattern from an external power source. A terminal part for supplying power is provided,
Electric power supplied from the external power source through the terminal portion is supplied to the LED through the conductive heat radiation pattern and the wiring pattern, and heat generation of the LED is conducted through the wiring pattern. Heat is transferred to the heat dissipation pattern, and is radiated from the conductive heat dissipation pattern to the atmosphere .

Further, the second invention of the present invention is characterized in that the heat dissipation region is exposed to the outside from the case, and the third invention is a window hole of the case in the central portion of the irradiation region. And the LED is disposed at the periphery of the through-hole. According to a fourth aspect of the invention, the sheet-like substrate is formed of a flexible thin plate. According to a fifth aspect of the present invention, a protruding piece is provided at a peripheral edge portion of the through hole of the flexible thin plate, and the protruding piece is bent to one side on the inner peripheral surface of the window hole. is attached to, the surface of the protrusion and wherein the LED is disposed, the sixth invention, the irradiation region, the sheet having different arrangement positions of the LED that is mounted on the through-hole peripheral portion It is characterized in that a plurality of substrate-like substrates are superposed.

The present invention also provides a step of providing a polygonal through-hole in the irradiation region of a flexible sheet-like substrate having an irradiation region and a heat dissipation region, and the LED is electrically connected to the irradiation region. A step of providing a wiring pattern; a step of providing a conductive heat radiation pattern electrically and thermally conductively connected to the wiring pattern in the heat dissipation region; and mounting the LEDs on the wiring pattern at the periphery of the through-hole A step of attaching the sheet-like substrate to an insulating case provided with a window hole so that the through-hole faces the window hole; and heat generation of the LED from the wiring pattern to the conductive heat dissipation pattern A step of exposing the heat dissipating region from the insulating case to the outside in order to dissipate heat from the conductive heat dissipation pattern to the atmosphere, and bending the peripheral edge of the through hole of the sheet-like substrate in one side Characterized in that the serial LED and a step of mounting on the inner peripheral surface of the window opening.

  According to the illuminating device of the present invention, a large heat dissipation effect can be obtained with respect to the heat generated by the LED. Therefore, the luminous efficiency of the LED increases, the stable illuminance of the illuminating device can be obtained, and the illuminating device can be downsized. Furthermore, in order to dissipate heat directly from the sheet-like substrate to the atmosphere, the housing case of the lighting device is made of a metal having high heat conductivity as in the past, and the case case does not have a heat dissipation function. Since the heat generation can be dissipated, there is an effect that the selection range of the material of the casing case can be widened such that the casing case can be formed of an inexpensive resin or the like.

  Moreover, according to the manufacturing method of the illuminating device of the present invention, since the flexible sheet-like substrate is used, the processing such as bending the sheet-like substrate becomes easy, and as a result, the manufacturing method of the illuminating device that is easy to manufacture. Is obtained.

  Hereinafter, an embodiment of a lighting device according to the present invention will be described with reference to FIGS. 1 is a schematic perspective view showing a lighting device according to the present invention, FIG. 2 is a cross-sectional view taken along line MM ′ in FIG. 1, and FIG. 3 is a plan view showing a first sheet-like substrate used in the lighting device of the present invention. 4 is a plan view showing a second sheet-like substrate used in the lighting device of the present invention, and FIG. 5 is an exploded perspective view of the lighting device according to the present invention.

  As shown in FIG. 1, the lighting device L of the present invention includes an insulating case 1 made of a resin or the like, a first sheet-like substrate 10 made of a flexible thin plate attached to the case 1, and a second sheet made of a flexible thin plate. And a plurality of chip LEDs 3 electrically connected (that is, mounted) to each of the sheet-like substrates 10 and 20.

  The insulative case 1 made of resin or the like is formed of a rectangular plate body as viewed from above, and an octagonal window hole 11 is provided in an offset portion in the longitudinal direction. The inner peripheral surface of the window hole 11 is configured to be slightly inclined with respect to the vertical direction (see FIG. 2). Further, fixing holes 12 (to be described later) for fixing the first sheet-like substrate 10 and the second sheet-like substrate 20 (to be described later) on the case 1 are inserted into the four corners of the case 1. Are provided).

  The first sheet-like substrate 10 is provided with an irradiation region 102 composed of a wiring pattern 101 that is electrically connected to the chip LED 3, and the wiring pattern 101, and the heat generation of the chip LED 3 is generated from the wiring pattern 101. The heat dissipating region 104 is composed of a conductive heat dissipating pattern 103 that conducts heat and dissipates it to the atmosphere, and the whole is composed of a flexible sheet-like flexible thin plate. (See FIG. 3).

  The 1st sheet-like board | substrate 10 comprised from the flexible thin board is comprised from the base film which consists of polyimide resins, wiring patterns, such as copper foil, and the thin film resist material as a cover-coat material. Since the flexible thin plate has flexibility, it is characterized in that it can be easily bent and processed.

  A wiring pattern 101 is disposed in the irradiation region 102, and the chip LED 3 is mounted on the wiring pattern 101. A polygonal through-hole 105 is provided at the center of the irradiation region 102. As a specific shape of the through-hole 105, each of the protruding pieces 106 is extended from the four sides of the rectangular through-hole 105 toward the center. A total of twelve chip LEDs 3 are mounted on each of the protrusions 106, that is, the wiring pattern 101 in the peripheral edge portion 106 of the through hole (see FIG. 3).

In the heat dissipating region 104, a large number of conductive heat dissipating patterns 103 provided electrically and heat-conductively with the wiring pattern 101 are arranged densely and meanderingly to increase the heat dissipating area. However, in FIGS. 1, 3, and 5, the heat dissipation region 104 is a region surrounded by a dotted line, and the conductive heat radiation pattern 103 is schematically illustrated by a solid line in the region surrounded by the dotted line. Show. Heat generated from the chip LED 3 is transferred to the conductive heat radiation pattern 103 via the wiring pattern 101, and this heat is radiated from the surface of the conductive heat radiation pattern 103 to the atmosphere. A terminal portion 107 to which a lead wire (not shown) from an external power source (not shown) for supplying power to the chip LED 3 is electrically connected is provided at each end of the conductive heat radiation pattern 103. A plurality are provided.

  The first sheet-like substrate 10 is provided with first connection terminals 108 for electrically connecting the wiring patterns 101 and 201 of the first sheet-like substrate 10 and the second sheet-like substrate 20. Yes. Furthermore, fixing holes 109 into which fixing pins 2 for fixing the first sheet-like substrate 10 to the case 1 are inserted are provided at the four corners of the irradiation region 102 of the first sheet-like substrate 10.

  The second sheet-like substrate 20 is composed of a flexible sheet-like flexible thin plate, and similarly to the first sheet-like substrate 10, an irradiation region 202 including a wiring pattern 201 to which the chip LED 3 is electrically connected, and A heat dissipating region 209 is provided which is provided electrically and thermally conductively with the wiring pattern 201, and includes a conductive heat radiation pattern 208 that transfers heat generated from the chip LED 3 from the wiring pattern 201 and dissipates it into the atmosphere. . In addition, a polygonal through-hole 203 is provided at the center of the irradiation area 202, but the chip LED 3 mounted on the through-hole peripheral edge 204 has an arrangement position different from that of the first sheet-like substrate 10. (See FIG. 4). That is, the specific shape of the through-hole 203 is configured such that the protruding pieces 204 (that is, the through-hole peripheral edge portion 204) extend from the respective vertex portions of the rectangular through-hole 203 toward the center. Yes. A total of twelve chip LEDs 3 are mounted on the wiring pattern 201 of each projecting piece 204.

  In the heat dissipation area 209, a large number of conductive heat radiation patterns 208 provided electrically and thermally conductively with the wiring pattern 201 are densely and meandered to increase the heat radiation area. However, in FIGS. 1, 3, and 5, the heat dissipation area 209 is an area surrounded by a dotted line, and the conductive heat dissipation pattern 208 is schematically illustrated by a solid line within the area surrounded by the dotted line. Show. Heat generated from the chip LED 3 is transferred to the conductive heat radiation pattern 208 through the wiring pattern 201, and this heat is radiated from the surface of the conductive heat radiation pattern 208 to the atmosphere. A plurality of terminal portions 207 to which lead wires from an external power source for supplying power to the chip LED 3 are electrically connected are provided at each end portion of the conductive wiring pattern 208.

  Further, the second sheet-like substrate 20 is provided with a second connection terminal 205 for electrically connecting the respective wiring patterns 101 and 201 of the first sheet-like substrate 10 and the second sheet-like substrate 20. Yes. In addition, fixing holes 206 into which fixing pins 2 for fixing the second sheet-like substrate 20 to the case 1 are inserted are provided at the four corners of the second sheet-like substrate 20, respectively. Furthermore, the length of the second sheet-like substrate 20 in the longitudinal direction is longer than the length of the first sheet-like substrate 10 in the longitudinal direction.

  Here, the manufacturing method of the illuminating device L of this invention is demonstrated based on FIG. 1 thru | or FIG. However, in FIGS. 1, 3 to 5, only a part of the wiring patterns 101 and 201 is shown. Further, electronic circuit components (such as resistors) other than the chip LED 3 are not shown.

  The first sheet-like substrate 10 having the irradiation region 102 and the heat dissipation region 104 and the second sheet-like substrate 20 having the irradiation region 202 and the heat dissipation region 209 are manufactured in advance. Specifically, first, polygonal through-holes 105 and 203 are respectively provided in the central portions of the irradiation regions 102 and 202 of the first sheet-like substrate 10 and the second sheet-like substrate 20, respectively. Wiring patterns 101 and 201 having a predetermined arrangement are provided in the regions 102 and 202, respectively. The conductive heat radiation patterns 103 and 208 are electrically and thermally conductively connected to the heat dissipation regions 104 and 209 of the first sheet substrate 10 and the second sheet substrate 20 respectively. The chip LED 3 is mounted on each of the predetermined portions of the wiring patterns 101 and 201 by soldering using an electronic component mounting apparatus or the like. At this time, it is preferable that the conductive heat radiation patterns 103 and 208 are densely arranged over the entire area of the heat dissipation regions 104 and 209 by meandering (bending). Further, fixing holes 109 and 206 are provided at the four corners of the irradiation regions 102 and 202, respectively. Furthermore, terminal portions 107 and 207 are provided at the end portions of the conductive heat radiation patterns 103 and 208, respectively.

  Next, the second sheet-like substrate is placed on the case 1 so that the positions of the four fixing holes 12, 109, and 206 of the case 1, the first sheet-like substrate 10, and the second sheet-like substrate 20 are substantially matched. 20 and the first sheet-like substrate 10 are superposed and placed in this order (see FIG. 5). At this time, the through-holes 105 and 203 are respectively opposed to the window hole 11, and the surface on which the chip LED 3 is mounted is the upper surface. Then, the four fixing pins 2 are inserted into the four fixing holes 12 to fix the first sheet-like substrate 10 and the second sheet-like substrate 20 to the case 1. At this time, the first and second connection terminals 108 and 205 of the first sheet-like substrate 10 and the second sheet-like substrate 20 are electrically connected to each other, and as a result, the first sheet-like substrate 10 and the second sheet-like substrate 10 are connected to each other. The wiring patterns 101 and 201 of the sheet-like substrate 20 are electrically connected to each other. Furthermore, since the lengths in the longitudinal direction of the respective sheet-like substrates 10 and 20 are different from each other, when the respective sheet-like substrates 10 and 20 are polymerized, the heat dissipation region 209 is not covered with the first sheet-like substrate 10. Exposed to the atmosphere.

  Next, the through-hole peripheral portions 106 and 204 of the first sheet-like substrate 10 and the second sheet-like substrate 20, that is, the protruding pieces 106 and 204 are bent inside the window hole 11 of the case 1, 204 is fixed on the inner peripheral surface of the window hole 11 using a tape, an adhesive (not shown) or the like. At this time, each chip LED 3 is arranged over substantially the entire peripheral area on the inner peripheral surface of the window hole 11.

  Then, the terminal portions 107 and 207 provided on the conductive heat radiation patterns 103 and 208 of the first sheet-like substrate 10 and the second sheet-like substrate 20 are respectively drawn from an external power source (not shown), and the electric power is supplied to each chip. A lead wire (not shown) for supplying to the LED 3 is electrically connected by soldering or screwing.

  The operation of the illumination device L configured as described above will be described. When power is supplied from the external power source to the terminal portions 107 and 207 via the lead wires, the power is transmitted to the conductive heat radiation patterns 103 and 208 and the wiring pattern 101 of the first sheet-like substrate 10 and the second sheet-like substrate 20. Each chip LED 3 on the first sheet-like substrate 10 and the second sheet-like substrate 20 emits light. Thus, the light from each chip LED 3 is irradiated from the inner peripheral surface of the window hole 11 toward one point on the vertical line passing through the center of the window hole 11 (the side on which the sheet-like substrates 10 and 20 are provided). The As each chip LED 3 emits light, each chip LED 3 generates heat. This heat is transmitted to the conductive heat radiation patterns 103 and 208 via the wiring patterns 101 and 201 of the first sheet substrate 10 and the second sheet substrate 20. Heated and radiated from the surfaces of the conductive heat radiation patterns 103 and 208 to the atmosphere. Since the heat dissipation regions 104 and 209 of the first sheet-like substrate 10 and the second sheet-like substrate 20 are respectively exposed outside the case 1 (that is, exposed to the atmosphere), heat is generated on the case 1. It can effectively dissipate heat.

  An image processing inspection method using the illumination device L of the present invention will be briefly described with reference to FIG. The illumination device L is installed so that the workpiece 5 is positioned below the window hole 11 of the illumination device L and the illumination light from each chip LED 3 is directed to the surface of the workpiece 5, and the surface of the workpiece 5 is obliquely above the workpiece 5. Illuminate. A CCD camera 6 is installed on the work 5, and the illuminated work 5 is imaged using the CCD camera 6, and an image signal obtained by imaging is transmitted to a personal computer or the like (not shown). Perform processing inspection.

  The above-described embodiment is merely an example of the present invention, and it is obvious that modifications and modifications as appropriate within the spirit of the present invention are included in the claims of the present application. For example, in the present embodiment, two sheet-like substrates are superposed and used, but only one or three or more may be superposed.

  Moreover, you may provide the case with the angle variable means which can change the irradiation direction of chip | tip LED by adjusting the angle which bends a periphery of a through-hole. Specifically, as shown in FIG. 7, one hinge piece of the hinge 4 is attached to the inner peripheral portion of the window hole 11, and the first sheet-like substrate 10 and the second sheet-like shape are attached to the other hinge piece of the hinge 4. The protruding pieces 106 and 204 of the substrate 20 are fixed. And the opening degree of hinge 4 is adjusted so that a desired irradiation angle may be obtained.

The schematic perspective view which shows the illuminating device by one Example of this invention. FIG. 2 is a sectional view taken along line M-M ′ in FIG. 1. The top view which shows the 1st sheet-like board | substrate by one Example of this invention. The top view which shows the 2nd sheet-like board | substrate by one Example of this invention. The disassembled perspective view which shows the illuminating device by one Example of this invention. Schematic which shows the image processing test | inspection method using the illuminating device by one Example of this invention. The M-M 'sectional view showing the illuminating device by the other Example of this invention.

Explanation of symbols

L Illuminating device 1 Case 11 Window hole 12, 109, 206 Fixed hole 2 Fixed pin 3 Chip LED
4 Hinges 5 Work 6 CCD camera 10 First sheet substrate 101, 201 Wiring pattern 102, 202 Irradiation area 103, 208 Conductive heat dissipation pattern 104, 209 Heat dissipation area 105, 203 Through hole 106, 204 Periphery of peripheral part, protrusion Pieces 107 and 207 Terminal portion 108 First connection terminal 20 Second sheet-like substrate 205 Second connection terminal

Claims (7)

In an illuminating device including an insulating case provided with a window hole, a sheet-like substrate attached to the case, and an LED attached to the sheet-like substrate, the sheet-like substrate is electrically connected to the LED. And a heat dissipation region provided with a conductive heat radiation pattern electrically and thermally conductively connected to the wiring pattern , the irradiation region on one side of the sheet-like substrate The heat dissipation area is disposed on the other side of the sheet-like substrate, and the conductive heat dissipation pattern is provided with a terminal portion for supplying power from an external power source to the wiring pattern,
Electric power supplied from the external power source through the terminal portion is supplied to the LED through the conductive heat radiation pattern and the wiring pattern, and heat generation of the LED is conducted through the wiring pattern. A lighting device characterized in that heat is transferred to a heat dissipation pattern and is radiated from the conductive heat dissipation pattern to the atmosphere . The lighting device according to claim 1 , wherein the heat dissipation region is exposed to the outside from the case. 3. The illumination according to claim 1, wherein a polygonal through hole facing the window hole is provided at a central portion of the irradiation area, and the LED is disposed at a peripheral edge of the through hole. apparatus. The lighting device according to any one of claims 1 to 3 , wherein the sheet-like substrate is formed of a flexible thin plate. The flexibility in the through hole periphery of the thin plate having a projecting piece is provided, wherein the protrusion is mounted on the inner peripheral surface of the window opening are bent on one, on the surface of said protrusion is The lighting device according to claim 4 , wherein the LEDs are arranged. The irradiation area, an illumination device according to any one of claims 3 to 5, characterized in that to constitute a different said sheet substrate of the arrangement position of the LED that is mounted on the through-hole peripheral portion with a plurality polymerization . A step of providing a polygonal through hole in the irradiation region of a flexible sheet-like substrate having an irradiation region and a heat dissipation region, and a step of providing a wiring pattern in which the LED is electrically connected to the irradiation region. A step of providing a conductive heat radiation pattern electrically and thermally conductively connected to the wiring pattern in the heat dissipation region, a step of mounting the LED on the wiring pattern at the periphery of the through-hole, and the sheet-like shape Mounting a substrate on an insulating case provided with a window hole so that the through-hole faces the window hole; and heat generated from the LED is transferred from the wiring pattern to the conductive heat radiation pattern to conduct the conduction. Exposing the heat dissipation area to the outside from the insulating case to dissipate heat from the heat dissipation pattern to the atmosphere, and bending the peripheral edge of the through hole of the sheet-like substrate in one direction Method for manufacturing a lighting device which comprises a step of mounting on the inner circumferential surface of the hole.

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