JP4186958B2 - Method for manufacturing circuit-formed substrate - Google Patents

Description

  The present invention relates to a method for manufacturing a circuit-formed substrate used in various electronic devices.

  As electronic devices have become smaller and higher in density in recent years, the adoption of double-sided and multi-layer boards for circuit-forming boards on which electronic components are mounted has increased from the conventional single-sided board, and more circuits can be integrated on the board. A density circuit forming substrate is being developed.

  For high-density circuit-formed boards, it is possible to connect the layers at a higher density and in place, instead of using the widely used drilling process (through-hole) to the board and connecting the layers by plating. A circuit board with an inner via structure that can be used has been developed.

  In such a new substrate having an inner via structure, a method of filling a conductive paste in a hole disposed between layers is employed in order to connect the layers. Even in a so-called build-up board that has been connected, in order to have a via-on-via structure in which inner vias are stacked in the thickness direction of the circuit-forming board, the holes are filled with a paste-like resin material after plating to smooth the board surface. A process is required.

As described above, in the manufacture of a high-density substrate in recent years, a technique of filling a paste-like material, that is, a paste composition into a through or non-through hole has become important.
JP-A-6-268345 Masa Tachibana et al., “Resin Multilayer Substrate ALIVH and Application Development”, Nikkan Kogyo Shimbun “Surface Mount Technology”, May 1996 issue

  However, in high-density substrates, the circuit line width and land size become smaller, and the size of through or non-through holes becomes finer. Optimum filling process conditions are required to fill the paste composition with high quality. At the same time, it is essential to control the viscosity of the paste composition.

  In addition, when high-density circuit-forming substrates are applied to consumer portable devices, etc., the demand for manufacturing costs is severe, and a construction method that can produce more circuit-forming substrates with the same amount of paste composition is desired. It had been.

  An example of the filling process of the paste composition to the substrate material in the production of the conventional circuit-formed substrate will be described with reference to FIG.

  The substrate material 1 shown in FIG. 5 (a) is a prepreg that is made into a B-stage after impregnating a thermosetting resin material such as an epoxy resin into a woven or nonwoven fabric made of inorganic or organic fiber material such as glass fiber or aramid fiber. A release film 2 is bonded to both surfaces of the substrate material 1 by a method such as lamination. Further, a through hole 3 is formed in the substrate material 1. Various methods for fine processing at high speed such as laser have been developed for forming the through hole 3.

  Next, as shown in FIG. 5B, the substrate material 1 is transferred onto the stage 10 by a substrate material transfer device (not shown). A paste composition 7 is prepared on the plate frame 9. The paste composition 7 is obtained by dispersing conductive particles mainly composed of copper in a binder component composed of an epoxy resin, a curing agent, a solvent, and the like.

  Next, as shown in FIG. 5C, the substrate material 1 is slightly pressed from above by the plate frame 9, and the paste composition 7 on the left plate frame 9 in the drawing is attached to the squeegee holder 6. The through hole 3 is filled while being moved to the right in the figure by the squeegee 4. A squeegee up / down mechanism (not shown) and a squeegee pressurizing mechanism (not shown) are connected to the squeegee holder 6.

  Next, as shown in FIG. 5D, switching to the return squeegee 5 is performed on the plate frame 9 on the right side in the drawing.

  Next, as shown in FIG. 5 (e), the paste composition 7 is subjected to a second filling operation while being moved to the left by the return squeegee 5.

  Next, as shown in FIG. 5 (f), the filling operation is completed when the paste composition reaches the left plate frame 9 in the drawing, and the plate frame 9 rises upward, and the substrate material transfer device (FIG. (Not shown), the substrate material 1 is discharged, and the substrate material 1 filled with the paste composition 7 is obtained. Also, as shown on the left side of the figure, a substrate material 1 to be used for the next filling operation is prepared, and a plurality of paste composition-filled substrate materials are obtained by repeating the cycle described above.

  Substrate material 1 filled with paste composition 7 becomes a circuit-formed substrate through a process in which release film 2 is peeled in a subsequent process, and is sandwiched between metal foils and hot pressed.

  FIG. 6 shows an enlarged cross section of the substrate material 1 filled with the paste composition 7 and discharged by the substrate material transfer device.

  The through-hole 3 is filled with the paste composition 7, but the binder component 17 in the paste composition 7 is attached to the entire surface of the releasable film 2, and the conductive particles 16 are not attached. Trace amount. This phenomenon is because the paste composition 7 is sufficiently scraped off by the outward squeegee 4 with respect to the conductive particles 16, but the binder component 17 in a thinly applied state on the release film 2 is difficult to be scraped off. The return squeegee 5 is left behind on the releasable film 2 while being left behind.

  As a result, when comparing the paste composition 7 shown in FIG. 5 (b) with the paste composition 7 shown in FIG. 5 (f) after the filling operation is completed, the latter is more conductive particles 16 and the binder component. In the ratio of 17, the binder component 17 changes in the direction of decreasing. Although the amount of change is very small, when the filling operation is continuously repeated on the plurality of substrate materials 1, the change is accumulated, and the viscosity of the paste composition increases due to the phenomenon of the binder component 17, and finally the through hole. Insufficient filling of 3 or a problem in quality occurs such as when the release film is peeled off in a later step, the paste composition is taken on the release film side.

  In order to avoid such a problem, the replacement | exchange operation | work with a new paste composition is implemented before the viscosity of the paste composition 7 rises to a limit. When a new paste composition is charged into the equipment and a filling operation is performed on a plurality of substrate materials, the number of substrate materials filled from the paste composition charging to the replacement operation is referred to as the printing durability.

  This replacement operation is an operation of removing the old paste composition from the equipment and cleaning it, and then introducing a new paste composition. Therefore, the work load is large, and the number of through holes 3 provided in the substrate material 1 and the initial number Due to the viscosity variation of the paste composition and the like, the proper timing for performing the replacement work on which substrate material is not constant, and the difficulty of the work is increased. I want to replace the paste composition after repeating the filling operation to the limit as much as possible from the viewpoint of manufacturing cost, but as described above, the appropriate timing of replacement is not constant, so to avoid quality problems In practice, the paste composition was replaced with a small number of filling operations.

  In addition, in the above-described conventional method for producing a circuit-formed substrate, the paste composition is intended to impart conductivity and be used for connection between layers, so the amount of conductive particles in the paste composition is a certain amount or less. It is difficult to ensure conductivity, and as a result, the viscosity of the paste composition becomes a certain value or more, and a method of increasing the number of plate life by lowering the initial paste composition viscosity is adopted. It's also difficult.

  Further, the filling conditions such as the moving speed and the angle of the outward squeegee 4 and the return squeegee 5 are optimized to correspond to the physical properties of the paste composition 7, but the viscosity of the paste composition 7 is continuous with respect to a plurality of substrate materials 1. Fluctuation during the filling operation is also a factor that makes optimization difficult.

  In the method for manufacturing a circuit-formed substrate according to the present invention, the hole forming step of performing through or non-through holes in a plate-like or sheet-like substrate material composed of a single material or a plurality of materials during the manufacturing process; A paste filling step provided with a filling means for filling the through-hole or non-through-hole formed in the hole forming step with the paste composition, wherein the paste composition comprises a single substance or a plurality of substances in the filling step; An additional paste composition having the same or different composition is added to the paste composition using paste adding means.

  According to the present invention, it is possible to stabilize the composition ratio and viscosity of the paste composition that is changed by a plurality of filling operations by the action of the additional paste composition.

  In addition, the manufacturing apparatus includes an additional operation control unit for adding a predetermined amount of additional paste composition to the paste composition using a paste adding unit for each predetermined number of substrate materials during a continuous filling operation. Can prevent changes in filling quality due to the number of holes in the substrate material or the viscosity of the paste composition, etc., and can provide a high-density and highly reliable circuit-formed substrate and can be manufactured by increasing the number of printed sheets Cost reduction can also be realized.

  As described above, the method for manufacturing a circuit-formed substrate according to the present invention includes a hole forming step of performing through or non-through holes in a plate-like or sheet-like substrate material composed of a single material or a plurality of materials, and the holes A filling step comprising a filling means for filling the through-hole or non-through-hole formed in the forming step with a paste composition, wherein the filling step is made of a single substance or a plurality of substances, and is the same as the paste composition or By adding an additional paste composition with a different composition to the paste composition using the paste addition means, the viscosity of the paste composition is stabilized, and the filling property of the paste composition into the through or non-through hole is improved. In addition, it has the effect of preventing the paste composition from falling off the substrate material in a step after the filling step, thereby enabling the production of a highly reliable circuit-formed substrate. Both enhance the utilization efficiency of the paste composition in the filling step by improving the continuous printing of the paste composition are those which can contribute to cost reduction of the circuit forming board.

According to a first aspect of the present invention, there is provided a hole forming step of performing through or non-through holes in a plate-like or sheet-like substrate material composed of a single material or a plurality of materials, and the substrate material as a stage. a step of transferring the upper, a filling step of filling the paste composition into the hole of the through or non-through while moving over the substrate material by the filling means forward path including a binder component, additional paste composition comprising a binder component A step of adding a product onto a plate frame using a paste adding means, a step of kneading the additional paste composition and the paste composition by a kneading means, the kneaded additional paste composition and the paste composition A filling step of filling a through or non-penetrating hole while moving the material on the substrate material by a filling means on the return path, and discharging the substrate material from the stage And the binder component of the additional paste composition has the same or different composition as the binder component in the paste composition. When the paste composition for addition and the paste composition are kneaded reliably, and the paste composition is reliably filled in the holes by the reciprocating operation, the viscosity, composition and physical properties of the paste composition change due to the addition. In addition to the effect that the influence on the plate is small, the addition is performed on the plate frame, so that the stability of the additional operation and the installation adjustment of the additional means are easy.

The invention according to claim 2 of the present invention includes a step of attaching a release film to a plate-like or sheet-like substrate material composed of a single material or a plurality of materials, and the release film and the substrate material. A hole forming step for performing through-hole or non-through-hole processing, and a filling step for filling the through-hole or non-through hole while moving the paste composition containing the binder component on the releasable film by a forward filling means, A step of adding an additional paste composition containing a binder component onto the plate frame using a paste adding means, a step of kneading the paste composition for addition and the paste composition by a kneading means, and the kneaded addition A filling step of filling a through or non-through hole while moving the paste composition and the paste composition on the releasable film by a filling means in a return path; And a step of peeling the releasable film, wherein the binder component of the additional paste composition has the same or different composition as the binder component in the paste composition. Since the paste composition for addition and the paste composition are surely kneaded and the paste composition is reliably filled in the hole by a reciprocating operation, the viscosity and composition of the paste composition can be additionally added. In addition to the effect that the influence when the physical properties change is small, the addition is performed on the plate frame, so that there is an effect that the stability of the additional operation and the installation adjustment of the additional means are easy.

  The present invention can also employ the following configurations.

  That is, in the filling step, one or more substrate materials are continuously filled with the paste composition into the through-holes or non-through-holes formed in the substrate material, and a predetermined number of substrate materials is determined for each predetermined number of substrate materials. By adding an additional amount of the paste composition to the paste composition using the paste adding means, the additional paste composition is added using the additional means when continuously filling a plurality of substrate materials. It has effects such as the frequency at which the effect to be added can be maximized and the addition amount can be selected.

  In addition, by adding the paste composition for addition to each paste of the substrate material using the paste adding means for each piece of the substrate material, since the addition is performed for each piece of the board material, the additional amount can be made small. It has an effect such that the subsequent kneading or the uniformity of the composition of the paste composition is hardly disturbed.

  In addition, a predetermined amount is determined for each predetermined number of substrate materials calculated by one or both of the total number of holes and the total number of hole areas of through or non-through holes formed in one or more substrate materials in the filling process. Alternatively, by adding an additional paste composition in an amount calculated by either or both of the total number of holes and the total hole area of the through or non-through holes to the paste composition using paste addition means, The additional amount of the additional composition that changes depending on the total number of holes and the total area of the holes can be adjusted optimally.

  Further, the substrate material is a single-sided, double-sided, or multilayer circuit forming substrate, and a metal thin film that connects the layers is formed in a through or non-through hole formed in the substrate material. By filling the so-called inner via hole connected to the paste composition with the paste composition, the inner via hole portion can be smoothed, and the structure in which the inner via holes are stacked in the substrate thickness direction can be employed.

  In addition, the paste composition is made by dispersing conductive particles in the main component mainly composed of thermosetting resin, so that the paste composition is made conductive and used for electrical connection between the layers of the circuit forming substrate. In addition, the use of a thermosetting resin has effects such as high connection reliability.

  Moreover, the paste which accelerates | stimulates hardening of a thermosetting resin and obtains desired hardened | cured material by adding one or more additives among a hardening | curing agent, an organic solvent, a nonelectroconductive particle, and a dispersing agent to a paste composition. It has effects such as adjusting the viscosity of the composition and improving the dispersibility of solids in the paste composition.

  In addition, the paste composition is obtained by adding one or more additives among a curing agent, an organic solvent, non-conductive particles, and a dispersing agent to a main agent mainly composed of a thermosetting resin, thereby allowing penetration or non-permeability. A paste composition that can be utilized as a non-conductive paste filling paste composition that smoothes through-holes and that accelerates the curing of the thermosetting resin to obtain a desired cured product, which adjusts the viscosity of the paste composition. It has effects such as improving the dispersibility of solids in the product.

  Further, since the additional paste composition is the same thermosetting resin as the main agent used in the paste composition, it is possible to continuously fill a plurality of substrate materials without changing the properties of the original paste composition. It has the effect of becoming possible.

  In addition, the paste composition for addition is a thermosetting resin different from the main agent used in the paste composition or a composition in which a different thermosetting resin is mixed into the main agent used in the paste composition. In the case of continuous filling, there are effects such as correction of changes in the composition or physical properties of the paste composition.

  Further, by adding one or more additives among a curing agent, an organic solvent, conductive particles, non-conductive particles, and a dispersant to the paste composition for addition, a plurality of substrate materials are continuously filled. The composition of the paste composition or the change in the physical properties of the paste composition, the curing of the thermosetting resin is accelerated to obtain the desired cured product, the viscosity of the paste composition is adjusted, the solid in the paste composition It has the effect of improving the dispersibility of the product.

  Further, when the additional paste composition is made of the same or different organic solvent as the organic solvent used in the paste composition, the composition or physical properties of the paste composition can be improved when a plurality of substrate materials are continuously filled. Correction of the change can be performed using a relatively inexpensive organic solvent. In general, since the organic solvent has a low viscosity, it is relatively easy to add using an additional means.

  Further, by forming a predetermined marking on the substrate material, which is determined by one or both of the total number of holes and the total area of the holes of the through or non-through holes formed in the substrate material, adjustment of an additional amount, etc. Can be implemented without fail, and the system for determining the additional amount can be simplified as a configuration of equipment used for filling.

  In addition, after the paste composition is charged into the filling process, the paste composition is continuously filled into the through or non-through holes formed in the substrate material for one or more substrate materials, and the filling operation is performed. For each predetermined number of substrate materials changed stepwise according to the number of times, a predetermined amount or a predetermined amount of additional paste composition changed stepwise according to the number of filling operations is pasted using paste adding means By adding to the composition, the effect of adding an additional paste composition using an additional means when continuously filling a plurality of substrate materials, the composition of the paste composition according to the number of filling operations Corresponding to the case where the physical properties change, the frequency and the additional amount that can be maximized can be selected.

  In addition, after the paste composition is charged into the filling process, the filling operation of the paste composition into the through or non-through holes formed in the substrate material is continuously performed on one or more substrate materials. The viscosity of the paste composition is measured by the viscosity measuring means during or before the operation, and for each predetermined number of substrate materials calculated from the measured viscosity, a predetermined amount or a predetermined amount calculated from the measured viscosity is added. By adding the paste composition to the paste composition using a paste adding means, it is possible to easily detect a change in the composition or physical properties of the paste composition and to add an optimum amount of additional paste composition. Have.

  Further, in the filling step, a frame-shaped plate frame covering the entire circumference or a part of the outer periphery of the substrate material is provided, and by adding a paste composition for addition on the plate frame using a paste adding means, An additional operation can be performed outside the substrate material, and it is not necessary to provide a space for addition on the substrate material. Since the addition is performed on the plate frame, installation adjustment of the additional means is easy.

  Further, by providing the paste adding means with a dispenser unit capable of discharging a predetermined amount of additional paste composition, it is possible to ensure the stability of the discharge amount and to facilitate the configuration as the additional means.

  Further, by providing the paste adding means with moving means for moving the dispenser unit in a direction substantially perpendicular to the operation direction of the filling means, it is possible to add the additional paste composition uniformly to the paste composition. .

  Further, a small amount of the additional paste composition can be added uniformly to the paste composition by continuously discharging the additional paste composition while moving the dispenser unit by the moving means and adding it in a substantially linear shape. It has effects such as.

  Further, by intermittently discharging the paste composition for addition while moving the dispenser unit by the moving means, and adding a plurality of points in a substantially straight line, the dispenser unit can be used even when the amount of one addition is very small. By selecting the number of additional points suitable for the minimum dischargeable amount, there is an effect that the stability of the additional operation can be ensured.

  Further, by providing an additional paste composition film forming means for forming an additional paste composition on a substrate material or on the plate frame into a continuous or intermittent strip-shaped film, it is used for accurate addition when forming as a film. By adjusting the amount of the paste composition, there is an effect that the additional amount can be determined more accurately.

  Further, as the additional paste composition film forming means, a concave portion having a predetermined depth, an additional paste supplying means and a filling scraping means are provided on the plate frame, and the concave portion is continuously filled with the additional paste composition. Alternatively, by forming an intermittent strip-shaped film, the additional amount can be easily stabilized by making the depth of the recesses constant.

  In addition, since the concave portion has a chamfered corner portion, friction when the filling means passes through the concave portion is reduced, wear of the squeegee used for the filling means is prevented, or addition in the concave portion is performed. The paste composition can be scraped stably.

  In addition, by providing a cleaning means for cleaning the portion where the additional paste composition is added by the additional means, a plurality of substrate materials are continuously filled, and the composition of the paste composition when the addition is performed a plurality of times Alternatively, correction of changes in physical properties can be performed using a relatively inexpensive organic solvent, and since organic solvents are generally low in viscosity, it is relatively easy to add using additional means. .

  Further, in the filling step, the paste composition is filled into the through-holes or non-through-holes formed in the substrate material continuously for one or more substrate materials, and a predetermined number of substrate materials is determined for each predetermined number of substrate materials. When adding an additional amount of the paste composition to the paste composition using the paste adding means, the composition of the paste composition before the start of the filling operation is decreased from the composition of the paste composition before the addition operation by the composition ratio. For all of the above components or a predetermined component, an additional paste composition to be added due to a change in the number of holes in the substrate material or the like by adding the same or a smaller amount of the component to compensate for the reduced composition ratio. Even when the amount changes, it can be prevented that the additional amount becomes excessive, and the additional operation of the present invention can be performed without impairing the quality of the circuit forming substrate.

  Further, in the filling step, the paste composition is filled into the through-holes or non-through-holes formed in the substrate material continuously for one or more substrate materials, and a predetermined number of substrate materials is determined for each predetermined number of substrate materials. When adding an additional amount of the paste composition to the paste composition using the paste addition means, the weight ratio of the paste composition for addition to the paste composition is 0.1 when performing the additional operation once by the addition means. % Or less and 0.001% or more by satisfying one or both of them, the amount of the paste composition for addition is within the above numerical value, and the paste composition and the paste for addition There is an effect that uniform kneading of the composition can be sufficiently performed within the interval of the additional operation.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

(Embodiment 1)
FIGS. 1A to 1F are process cross-sectional views illustrating a method and an apparatus for manufacturing a circuit-formed substrate in the first embodiment of the present invention.

  A substrate material 1 shown in FIG. 1 (a) is a prepreg that is made into a B-stage after impregnating a thermosetting resin material such as an epoxy resin into a woven or nonwoven fabric made of an inorganic or organic fiber material such as glass fiber or aramid fiber. A release film 2 is bonded to both surfaces of the substrate material 1 by a method such as lamination. Further, a through hole 3 is formed in the substrate material 1. Various methods for fine processing at high speed such as laser have been developed for forming the through hole 3.

  Next, as shown in FIG. 1B, the substrate material 1 is transferred onto the stage 10 by a substrate material transfer device (not shown). A paste composition 7 is prepared on the plate frame 9. The paste composition 7 is obtained by dispersing conductive particles mainly composed of copper in a binder component composed of an epoxy resin as a thermosetting resin, a curing agent, an organic solvent, a dispersant, and the like.

  Among the above compositions, the presence or absence of the curing agent, organic solvent, non-conductive particles, and dispersant can be selected as an additive.

  Moreover, as an example of a specific paste composition material, bisphenol A type epoxy resin as an epoxy resin, amine adduct curing agent as a curing agent, high boiling point solvent such as butyl carbitol acetate as a solvent, phosphate ester type as a dispersing agent Surfactant etc. are mention | raise | lifted.

  Next, as shown in FIG. 1 (c), the substrate material 1 is slightly pressed from above by the plate frame 9, and the paste composition 7 on the left plate frame 9 in the drawing is the forward path in which the squeegee holder 6 is mounted. The through hole 3 is filled while being moved to the right in the figure by the squeegee 4. A squeegee up / down mechanism (not shown) and a squeegee pressurizing mechanism (not shown) are connected to the squeegee holder 6.

  Next, as shown in FIG. 1D, switching to the return squeegee 5 is performed on the plate frame 9 on the right side in the drawing.

  At that time, an additional paste composition 11 is added onto the plate frame 9 by the dispenser 8. As the paste composition for addition, the paste composition can be used as it is, but as described in the conventional method for producing a circuit-forming substrate, the paste composition decreases in a continuous filling operation. More preferably, the binder component is added as an additional paste composition. That is, a composition such as a thermosetting resin, a curing agent, an organic solvent, conductive particles, non-conductive particles, and a dispersant, which may be used for the paste composition, but a different composition should be selected. It is possible to select one or more of the aforementioned compositions.

  In this Embodiment, what knead | mixed the bisphenol A type epoxy resin and the organic solvent by the same amount by weight ratio was used as an additional paste composition.

  Next, as shown in FIG. 1 (e), the paste composition 7 is subjected to a second filling operation while being moved to the left by the return squeegee 5. At that time, the additional paste composition 11 is kneaded with the paste composition 7.

  The reason why the additional paste composition 11 is added at the time of switching to the return squeegee 5 in the present embodiment is that the addition of the paste composition 7 and the additional paste composition 7 is performed when the addition is performed in the forward path of the recharging operation. There is a possibility that the through-hole 3 will be filled before the paste composition 11 is sufficiently kneaded, and in this case, the conductive particles 16 are in comparison with the original composition of the paste composition 7. This is because there is a problem that filling is performed in an insufficient state and the amount of conductive particles 16 filling the through hole 3 is insufficient, resulting in insufficient interlayer connection as a circuit forming substrate. This problem can be prevented by optimizing conditions such as the physical properties of the paste composition 7 and the additional paste composition 11 and the speed of the filling operation, but as described above, it is added before the start of the filling operation on the return path. A more preferable result is obtained by adding the paste composition for kneading and kneading in the filling operation of the return path. That is, in the case of the return path, a considerable amount of the conductive particles 16 are filled in the through hole 3 in advance in the forward path filling operation, and the degree of influence in the backward path filling operation is small.

  Further, as an auxiliary function, a kneading means of the paste composition 7 and the additional paste composition 11 can be used. For example, a method may be adopted in which a refilling squeegee is reciprocated with a short stroke on the plate frame 9 to perform the kneading and then a filling operation is started, or a kneading squeegee independent from the forward or return squeegee is installed. This also has the effect of ensuring kneading.

  Next, as shown in FIG. 1 (f), the filling operation is completed when the paste composition reaches the left plate frame 9 in the drawing, and the plate frame 9 rises upward, and the substrate material transfer device (FIG. (Not shown), the substrate material 1 is discharged, and the substrate material 1 filled with the paste composition 7 is obtained. Also, as shown on the left side of the figure, a substrate material 1 to be used for the next filling operation is prepared, and a plurality of paste composition-filled substrate materials are obtained by repeating the cycle described above.

  With the configuration of the filling process as described above, when the filling operation is repeated for a plurality of substrate materials, the ratio of the conductive particles to the binder component changes as a result of which the binder component decreases. Phenomenon, that is, the addition of an additional paste composition can suppress the change from the initial composition ratio of the paste composition, resulting in an increase in the paste composition viscosity and finally insufficient filling of the through holes. When the release film is peeled off in a later step, conventional problems such as taking a paste composition on the release film side can be solved.

  Further, the additional amount of the additional paste composition is preferably controlled to an amount that can be kneaded by the filling operation as described above. In the inventor's experiment, the additional paste composition 11 is added to the paste composition 7. The weight ratio is preferably 0.1% or less. Further, in order to obtain the effect of stabilizing the viscosity of the paste composition 7 by the addition, an additional amount of 0.001% or more gave preferable results.

  In the above description, an additional paste composition was added for each filling operation, but the total number of through holes or the hole area processed into the substrate material and the paste put into the equipment at the beginning of the filling operation Depending on the viscosity of the composition, the filling operation measured by the viscosity measuring means, or the conditions such as the viscosity of the paste composition before and after, the additional frequency is performed every predetermined number or the amount of the paste composition to be added is increased or decreased. Thus, the viscosity of the paste composition can be made more stable even in a continuous filling operation.

  FIG. 2 is a top view showing the circuit-forming board manufacturing apparatus in the first embodiment of the present invention. When the plate frame 9 is viewed from above, the plate frame opening 13 is disposed so as to press the outer periphery of the setting position of the substrate material 1, and the dispenser 8 is attached to the dispenser movement guide 12. The additional paste composition 11 is added substantially linearly on the plate frame 9 while being moved from the position A1 shown in FIG. 2 to the position A2 by a driving means (not shown). As an additional method, it may be added linearly by continuously discharging, or depending on the additional amount, the discharge may be intermittently added to a plurality of dots.

(Embodiment 2)
FIG. 3 is a perspective view showing a method and an apparatus for manufacturing a circuit forming substrate according to the second embodiment of the present invention.

  A recess 14 is formed on the plate frame 9. The additional paste composition is dropped into the concave portion 14 by a dropping means (not shown), and squeezing while the film forming squeegee 15 is in close contact with the plate frame in the direction of the arrow in the figure, thereby adding the additional paste composition into the concave portion 14. Can be satisfied. It is desirable that the dripping amount be substantially equal to or larger than the volume of the recess 14. The amount of the desired additional paste composition can be accurately controlled by the volume of the recess 14.

  Moreover, the shape of the recess is more preferably a chamfered cross-sectional shape without a corner portion from the viewpoint of squeegee wear or the like.

  Moreover, it is also possible to control the amount of the paste composition for addition by the amount of dripping using the same method, In that case, the amount of dripping smaller than the volume of the recessed part 14 is employ | adopted.

  FIG. 4 is a cross-sectional view showing a circuit forming substrate manufacturing method and manufacturing apparatus according to the second embodiment of the present invention. After filling the concave portion with the additional paste composition 11 with the above-described configuration, the additional paste composition 11 is moved to the direction of the arrow in the figure while the return squeegee 5 is squeezing the paste composition 7. And kneaded by the subsequent squeezing operation.

  In the first embodiment and the second embodiment described above, the example for the through hole has been described. However, the paste composition filling for the non-through hole as used in the build-up substrate is also described here. The invention is effective, and the paste composition is not conductive, and a non-conductive paste composition is filled in a through-hole or a non-through-hole in which a connection between layers is previously formed by plating a metal thin film or the like. It can also be employed in the process of filling for the purpose.

Process sectional drawing of the manufacturing method and manufacturing apparatus of the circuit formation board | substrate in the 1st Embodiment of this invention The top view which shows the manufacturing apparatus of the circuit formation board | substrate in the 1st Embodiment of this invention The perspective view which shows the manufacturing method and manufacturing apparatus of the circuit formation board | substrate in the 2nd Embodiment of this invention. Sectional drawing which shows the manufacturing method and manufacturing apparatus of the circuit formation board in the 2nd Embodiment of this invention Process sectional view of a conventional circuit forming substrate manufacturing method and manufacturing apparatus Expanded cross-sectional view of the substrate material of a conventional circuit forming substrate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate material 2 Release film 3 Through hole 4 Outward squeegee 5 Return squeegee 6 Squeegee holder 7 Paste composition 8 Dispenser 9 Plate frame 10 Stage 11 Additional paste composition 12 Dispenser movement guide 13 Plate frame opening 14 Recess 15 Film Forming squeegee

Claims (2)

A hole forming step of performing through or non-through holes in a plate-like or sheet-like substrate material composed of a single material or a plurality of materials, and a step of transferring the substrate material onto a stage;
A filling step of filling a through or non-penetrating hole while moving the paste composition containing the binder component on the substrate material by a forward filling means;
Adding a paste composition for addition containing a binder component onto a plate frame using a paste adding means;
A step of kneading the paste composition for addition and the paste composition by a kneading means;
A filling step of filling the penetrating or non-penetrating hole while moving the kneaded paste composition for addition and the paste composition on the substrate material by a filling means in a return path;
And a step of discharging the substrate material from the stage,
The method for producing a circuit-forming substrate, wherein the binder component of the additional paste composition has the same or different composition as the binder component in the paste composition. A step of attaching a releasable film to a plate-like or sheet-like substrate material composed of a single material or a plurality of materials, and a hole forming step of drilling through or not through the releasable film and the substrate material And a filling step of filling the through-hole or non-through-hole while moving the paste composition containing the binder component on the release film by an outward filling means, and adding an additional paste composition containing the binder component to the paste Adding on the plate frame using means, kneading the additional paste composition and the paste composition by kneading means, and kneading the additional paste composition and the paste composition kneaded in the return path A filling step of filling a through or non-penetrating hole while moving on the releasable film by a filling means, and a process for peeling the releasable film. It equipped with a door,
The method for producing a circuit-forming substrate, wherein the binder component of the additional paste composition has the same or different composition as the binder component in the paste composition.

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