JP4174340B2 - Conductive sheet and electronic component transport container and package - Google Patents
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Description
【０００１】
【発明の属する技術分野】
本発明は、導電性シートの中でも、特にシートの片面又は両面に導電性塗料を塗布して０．１〜１０μｍ厚みの導電層を形成した導電性シート及びそれよりなる電子部品搬送用容器および包装体に関するものである。
【０００２】
【従来の技術】
プラスチックシートの帯電防止方法としては、シートの表面のみを導電化したシートとシートの厚み方向も導電化したシートの二つの方法がある。シート表面のみを導電化したシートとは、プラスチックシート表面に導電性塗料を塗布または導電性フィラーを練り込んだ樹脂組成物を共押出またはラミネート等にて表面のみに導電層を形成したものである。シートの厚み方向も導電化したシートとは、導電性フィラーを練り込んだ樹脂組成物を単層シートに押出したものであり、体積抵抗も低下させたものである。
【０００３】
従来、ＩＣやＩＣを用いた電子部品の包装材として、プラスチックシートの表面に導電性フィラーの１つであるカーボンブラックを含有した導電塗料を塗布して導電性を付与したシートやカーボンブラックを練り込んだ導電性樹脂組成物を共押出法により表面へ積層させたシートを用いる場合があった。しかし、カーボンブラックを含む導電層を最表面層にした構成シートではカーボンブラックの脱落によるＩＣの汚染等の問題が発生したり、蓋材であるカバーテープとのシール性がカーボンブラックによって阻害される問題が発生したりしていた。それ故、カーボンブラックの脱落及びカバーテープとのシール性の阻害を防ぐ為に導電層の片側表面にカーボンブラックを含まない樹脂の層を形成する方法が特許文献１に記載されている。しかし、その方法では生産工数がかかり生産性の低下及び高コストになっていた。
【０００４】
また、カバーテープとのシール性を良好にする為に、すなわち、シール飛びやシール強度のばらつきが少なくする為に、カーボンブラックを含有した導電塗料のバインダー樹脂としてガラス転移温度が低く、カーボンブラックとの相溶性の良いものだけを用い、両面に導電性を付与したシートが検討されたが、巻いた場合に表裏面がブロッキングする問題が発生していた。ここで記すシール性が良好とは、シール幅１ｍｍ、シール温度１４０〜２２０℃で、シール強度が０．２０〜０．６０Ｎになる温度領域幅が１０℃以上あるものであり、更に好ましくはシール温度１６０〜１８０℃で、シール強度が０.３〜０．５Ｎの範囲にあるものである。
【特許文献１】
特許1812780号公報
【０００５】
【発明が解決しようとする課題】
本発明は、かかる問題を解決したものであり、トップコートを施すこと無しに、片面一回塗布で、導電性フィラーの脱落やカバーテープとのシール性、ブロッキング性を低下させること無しに導電性塗料を塗布した導電性シート及びそれよりなる電子部品搬送用容器及び包装体を提供するものである。
【０００６】
【課題を解決するための手段】
本発明は、
（１）熱可塑性樹脂よりなる基材シートの片面又は両面に導電性塗料を塗布したシートで、導電層の厚みが０．１〜１０μｍ、表面抵抗値が１×１０3Ω／□以上１×１０10Ω／□未満である導電性シート、
（２）導電性塗料が導電性フィラー、導電性フィラーの分散性が良い熱可塑性樹脂Ａおよび熱可塑性樹脂Ａに比べ導電性フィラーの分散性が悪く、熱可塑性樹脂Ａと相溶性が悪い熱可塑性樹脂Ｂを、熱可塑性樹脂Ｂが１重量部に対して熱可塑性樹脂Ａを２〜７重量部混合してなる塗料である第（１）項記載の導電性シート、
（３） 熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を用いた第（１）項又は第（２）項記載の導電性シート、
（４） 導電性フィラーがカーボンブラックである第（１）〜（３）項のいずれか１項に記載の導電性シート、
（５） 熱可塑性樹脂Ａあるいは熱可塑性樹脂Ｂのどちらか一方が蓋材との熱シール性が良好である第（１）〜（４）項のいずれか１項に記載の導電性シート、
（６） 第（１）〜（５）項のいずれか１項に記載の導電性シートよりなる電子部品搬送用容器、
（７） 第（６）項記載の電子部品の入った電子部品搬送用容器が蓋材と熱シールされてなる電子部品搬送用包装体、
である。
【０００７】
【発明の実施の形態】
以下、本発明を更に詳細に説明する。本発明の導電性シートは、熱可塑性樹脂よりなる基材シートの片面又は両面に導電性塗料を塗布したシートで、導電層の厚みが０．１〜１０μｍ、表面抵抗値が１×１０3Ω／□以上１×１０10Ω／□未満である導電性シートである。導電層の厚みが０．１μｍ未満だと十分な導電性が得られず、１０μｍを越えるとカーボン脱落等の問題が起こりやすい。また、表面抵抗値は１×１０10Ω／□を超えると十分な帯電防止効果が得られず、１×１０3Ω／□未満では導電性が良すぎて外部で発生した静電気に対して通電し、内容物であるＩＣ等を破壊する恐れがある。
【０００８】
本発明において、導電性フィラー、導電性フィラーの分散性が良好な熱可塑性樹脂Ａ、および熱可塑性樹脂Ａに比べ導電性フィラーの分散性が悪く、熱可塑性樹脂Ａと相溶性の悪い熱可塑性樹脂Ｂを適当な比率で混合した導電性塗料を調整する。導電性フィラーの分散性の判断は、同一溶媒中で、熱可塑性樹脂Ａ及び熱可塑性樹脂Ｂに同量の導電性フィラーを分散させ、それを基材に塗布し、その表面抵抗値を測定する。表面抵抗値が低い方が導電性フィラーの分散性が良い。また、塗布塗料の光沢性、液の安定性でも判断でき、あまり光沢が良い物、液が分離するものは導電性フィラーの分散性が悪い。熱可塑性樹脂Ａと熱可塑性樹脂Ｂの相溶性は、二つの樹脂を混ぜたものをガラス板の上に一滴垂らし、その樹脂の透明性で判断する。透明にならず、液が濁るものが相溶性が悪い。熱可塑性樹脂Ａ及び熱可塑性樹脂Ｂを混ぜると、熱可塑性樹脂Ａの方が熱可塑性樹脂Ｂに比べ導電性フィラーの分散性が良いため、多量に導電性フィラーを取り込む。また、熱可塑性樹脂Ａと熱可塑性樹脂Ｂは相溶性が悪いため、導電性フィラーを多量に含んだ熱可塑性樹脂Ａの上に熱可塑性樹脂Ｂが染み出す形となり、トップコートを施した場合と同様な効果が得られる。
【０００９】
導電性フィラーの分散性の良好な熱可塑性樹脂Ａとは一般的なウレタン樹脂等、また、熱可塑性樹脂Ａに比べ導電性フィラーの分散性が悪く、熱可塑性樹脂Ａと相溶性の悪い熱可塑性樹脂Ｂとは、一部のアクリルウレタン樹脂等である。熱可塑性樹脂Ａおよび熱可塑性樹脂Ｂの配合比率は、好ましくは熱可塑性樹脂Ｂが１重量部に対し熱可塑性樹脂Ａが２〜７重量部である。熱可塑性樹脂Ａの配合比率が下限値未満になると、液の分離が起こり、外観不良、表面抵抗値の低下を引き起こす。また、熱可塑性樹脂Ａの配合比率が上限値より多くなると、導電性フィラーの脱落やシール性の低下を引き起こす。
【００１０】
表面導電層に使用される導電性フィラーとしては、カーボンブラックが用いられ、好ましくは、比表面積が大きく、π電子捕捉不純物が少ないアセチレンブラック、ファーネブラック、ケッチェンブラック等が用いられる。
本発明で用いられる熱可塑性樹脂よりなる基材シートとしては、導電性塗料が塗布できれば何でも良く、例えば、ポリスチレン系樹脂、ＡＢＳ系樹脂、ＡＳ系樹脂、ポリエステル系樹脂及びポリカーボネート系樹脂又はそれらのポリマーアロイ等がある。
本発明の導電性塗料には、必要に応じて流動性や力学的特性を改善するために、各種添加剤を添加することが可能である。
【００１１】
本発明により、導電性フィラー、導電性フィラーの分散性が良好な熱可塑性樹脂Ａ、および導電性フィラーの分散性が樹脂Ａに比べ悪く、熱可塑性樹脂Ａと相溶性の悪い熱可塑性樹脂Ｂを混合することにより、一回塗布で、トップコートを施した場合と同様に、導電性フィラーの脱落が少なく、カバーテープとのシール性も良好でブロッキングしない導電性シート及びそれよりなる電子部品搬送用容器及び包装体を安価に提供できるようになった。
【００１２】
【実施例】
以下、本発明を実施例により更に詳細に説明する。
＜実施例１＞
導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝２：１で混合したものを使用した。
＜実施例２＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝７：１で混合したものを使用した。
【００１３】
＜比較例１＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂（熱可塑性樹脂Ａ）を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）を使用した。
＜比較例２＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、導電性フィラーを含まないアクリルウレタン樹脂（熱可塑性樹脂Ｂ）ＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）を使用した。
【００１４】
＜比較例３＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝１：１で混合したものを使用した。
＜比較例４＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝１０：１で混合したものを使用した。
【００１５】
＜比較例５＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み０．０５μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝２：１で混合したものを使用した。
＜比較例６＞
実施例１と同様に、導電性フィラーとしてカーボンブラック、熱可塑性樹脂Ａとしてウレタン樹脂、熱可塑性樹脂Ｂとしてアクリルウレタン樹脂を使用し調整した導電性塗料を、基材シート（カネボウ合繊(株)製、ＡＳＴ７ＣＲ）にグラビア版を使用し導電層厚み１２μｍで塗布し導電性シートを作成した。導電性塗料は、カーボンブラックとウレタン樹脂を溶媒混合したＵＰＴ−１００（Ｖ）墨（大阪印刷インキ製造(株)製）とアクリルウレタン樹脂を溶媒に溶解させたＵＰＴ−１００（Ｖ）ＯＰ（大阪印刷インキ製造(株)製）をＵＰＴ−１００（Ｖ）墨：ＵＰＴ−１００（Ｖ）ＯＰ＝２：１で混合したものを使用した。
【００１６】
表面抵抗値は三菱油化(株)ハイレスタＵＰ（ＭＣＰ−ＨＴ４５０）を使用し、印加電圧１０Ｖ、プロ−タイプＵＡで１ｍ程度の印刷物で３ヶ所測定を行った。
シール性は、塗布後の導電性シートを８ｍｍ幅にスリットし、日東電工(株)製シール機（ＥＴ−２０００）を使用し、荷重９．８Ｎ、時間０．１秒、コテ幅０．５ｍｍ、コテ長１６ｍｍ、打点式シール（４度打）、シール温度１６０〜１８０℃でカバーテープＣＳＬ−Ｚ７３０２（住友ベークライト(株)製）とシール後、ピール機（ＧＰＤ８５６Ｖ）を用い３００ｍｍ／ｍｉｎで剥離し、カバーテープとのシール強度を評価した。
導電性フィラーの脱落評価は塗布後の導電性シート表面とコピー紙を５回擦り、コピー紙に導電性フィラーが付着しないものを◎、多少導電性フィラーが付着するが製品として問題ないものを○、多量に導電性フィラーが付着するものを×とした。
ブロッキング性は、６０℃のオーブンに５０ｇ/ｃｍ2の荷重をかけ２４時間放置後、表面が張り付いていないものを◎、多少張り付きはあるが使用に問題の無いものを○、張り付いて使用できないものを×とした。
外観評価は塗布後の外観を目視にて検査したもので、塗布むらが無いものを◎、塗布むらがあるものを×とした。
以上の実施例、比較例を表１にまとめて示す。
【００１７】
【表１】
【発明の効果】
本発明により、一回塗布で、トップコートを塗布した場合と同様に、導電性フィラーの脱落が少なく、カバーテープとのシール性が良好でブロッキングしない導電性シート及びそれよりなる電子部品搬送用容器が得られる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive sheet, in which a conductive layer having a thickness of 0.1 to 10 μm is formed by applying a conductive coating on one or both sides of the sheet, and a container for transporting electronic components and packaging comprising the same. It is about the body.
[0002]
[Prior art]
As an antistatic method for a plastic sheet, there are two methods: a sheet in which only the surface of the sheet is made conductive, and a sheet in which the thickness direction of the sheet is also made conductive. A sheet in which only the surface of the sheet is made conductive is a sheet in which a conductive layer is formed only on the surface by co-extrusion or lamination with a resin composition in which a conductive paint is applied to the surface of a plastic sheet or a conductive filler is kneaded. . A sheet that is also conductive in the thickness direction of the sheet is obtained by extruding a resin composition kneaded with a conductive filler into a single-layer sheet, and also has a reduced volume resistance.
[0003]
Conventionally, as a packaging material for ICs and electronic parts using ICs, a conductive paint containing carbon black, which is one of the conductive fillers, is applied to the surface of a plastic sheet to knead the conductive sheet or carbon black. In some cases, a sheet obtained by laminating the conductive resin composition contained on the surface by a coextrusion method is used. However, in the configuration sheet having the conductive layer containing carbon black as the outermost surface layer, problems such as IC contamination due to dropping off of the carbon black occur, and the sealing performance with the cover tape as the cover material is hindered by the carbon black. There was a problem. Therefore, Patent Document 1 discloses a method of forming a resin layer not containing carbon black on one surface of a conductive layer in order to prevent the carbon black from falling off and hindering the sealing property with the cover tape. However, this method requires man-hours for production, resulting in a decrease in productivity and high cost.
[0004]
In addition, in order to improve the sealing property with the cover tape, that is, to reduce variations in seal jump and seal strength, the glass transition temperature is low as a binder resin of conductive paint containing carbon black, and carbon black and Although a sheet having conductivity on both sides was examined using only those having good compatibility, there was a problem that the front and back surfaces were blocked when rolled. “Sealability” described herein means that the seal width is 1 mm, the seal temperature is 140 to 220 ° C., and the temperature region width at which the seal strength is 0.20 to 0.60 N is 10 ° C. or more. At a temperature of 160 to 180 ° C., the seal strength is in the range of 0.3 to 0.5 N.
[Patent Document 1]
Japanese Patent No. 1812780 [0005]
[Problems to be solved by the invention]
The present invention solves such a problem, and without applying a top coat, it can be applied by one-sided application, without dropping the conductive filler, sealing with the cover tape, and reducing the blocking property. It is an object of the present invention to provide a conductive sheet coated with a paint, a container for transporting electronic parts, and a package.
[0006]
[Means for Solving the Problems]
The present invention
(1) A sheet in which a conductive coating is applied to one or both sides of a base material sheet made of a thermoplastic resin, the thickness of the conductive layer is 0.1 to 10 μm, and the surface resistance value is 1 × 10 3 Ω / □ or more 1 × A conductive sheet of less than 10 10 Ω / □,
(2) The conductive paint is a conductive filler, and the thermoplastic resin A and the thermoplastic resin A have good dispersibility. The conductive filler has a poor dispersibility and is not compatible with the thermoplastic resin A. The conductive sheet according to item (1), wherein the resin B is a paint obtained by mixing 2 to 7 parts by weight of the thermoplastic resin A with respect to 1 part by weight of the thermoplastic resin B.
(3) The conductive sheet according to (1) or (2), wherein a urethane resin is used as the thermoplastic resin A and an acrylic urethane resin is used as the thermoplastic resin B.
(4) The conductive sheet according to any one of (1) to (3), wherein the conductive filler is carbon black,
(5) The conductive sheet according to any one of (1) to (4), wherein either one of the thermoplastic resin A or the thermoplastic resin B has a good heat sealing property with the lid member,
(6) A container for conveying an electronic component comprising the conductive sheet according to any one of (1) to (5),
(7) Electronic component transport packaging body in which an electronic component transport container containing the electronic component according to item (6) is heat-sealed with a lid.
It is.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail. The conductive sheet of the present invention is a sheet in which a conductive coating is applied to one or both sides of a base material sheet made of a thermoplastic resin. The conductive layer has a thickness of 0.1 to 10 μm and a surface resistance value of 1 × 10 3 Ω. / □ or more and less than 1 × 10 10 Ω / □. If the thickness of the conductive layer is less than 0.1 μm, sufficient conductivity cannot be obtained, and if it exceeds 10 μm, problems such as carbon falling off easily occur. Also, if the surface resistance exceeds 1 × 10 10 Ω / □, sufficient antistatic effect cannot be obtained, and if it is less than 1 × 10 3 Ω / □, the electrical conductivity is too good and current is applied to static electricity generated externally. In addition, there is a risk of destroying the IC or the like as the contents.
[0008]
In the present invention, the conductive filler, the thermoplastic resin A having a good dispersibility of the conductive filler, and the thermoplastic resin having a poor dispersibility of the conductive filler as compared with the thermoplastic resin A and a poor compatibility with the thermoplastic resin A A conductive paint in which B is mixed at an appropriate ratio is prepared. The determination of the dispersibility of the conductive filler is carried out by dispersing the same amount of the conductive filler in the thermoplastic resin A and the thermoplastic resin B in the same solvent, applying it to the substrate, and measuring the surface resistance value. . The lower the surface resistance value, the better the dispersibility of the conductive filler. Also, the gloss of the coating material and the stability of the liquid can be judged, and those having a very high gloss and those in which the liquid is separated have a poor dispersibility of the conductive filler. The compatibility of the thermoplastic resin A and the thermoplastic resin B is determined by dropping one drop of a mixture of two resins on a glass plate and the transparency of the resin. It is not transparent, and liquids that are cloudy have poor compatibility. When the thermoplastic resin A and the thermoplastic resin B are mixed, since the thermoplastic resin A has a better dispersibility of the conductive filler than the thermoplastic resin B, a large amount of the conductive filler is taken in. In addition, since the thermoplastic resin A and the thermoplastic resin B are poorly compatible, the thermoplastic resin B oozes out on the thermoplastic resin A containing a large amount of conductive filler, and the top coat is applied. Similar effects can be obtained.
[0009]
The thermoplastic resin A having good dispersibility of the conductive filler is a general urethane resin or the like, and the thermoplastic filler A has poor dispersibility of the conductive filler as compared with the thermoplastic resin A, and is poorly compatible with the thermoplastic resin A. The resin B is a part of acrylic urethane resin or the like. The blending ratio of the thermoplastic resin A and the thermoplastic resin B is preferably 2 to 7 parts by weight of the thermoplastic resin A with respect to 1 part by weight of the thermoplastic resin B. When the blending ratio of the thermoplastic resin A is less than the lower limit value, liquid separation occurs, resulting in poor appearance and a decrease in surface resistance value. Moreover, when the compounding ratio of the thermoplastic resin A is greater than the upper limit value, the conductive filler is dropped and the sealing performance is lowered.
[0010]
As the conductive filler used in the surface conductive layer, carbon black is used. Preferably, acetylene black, furnace black, ketjen black or the like having a large specific surface area and few π electron trapping impurities is used.
The base sheet made of the thermoplastic resin used in the present invention may be anything as long as a conductive paint can be applied. For example, polystyrene resin, ABS resin, AS resin, polyester resin and polycarbonate resin, or polymers thereof. There are alloys.
Various additives can be added to the conductive paint of the present invention as needed in order to improve fluidity and mechanical properties.
[0011]
According to the present invention, the conductive filler, the thermoplastic resin A having a good dispersibility of the conductive filler, and the thermoplastic resin B having a poor dispersibility of the conductive filler in comparison with the resin A and poor compatibility with the thermoplastic resin A are obtained. By mixing, as with the case where the top coat is applied by a single application, the conductive filler is less likely to come off, the sealing property with the cover tape is good, and it does not block, and it is used for transporting electronic components. Containers and packages can be provided at low cost.
[0012]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples.
<Example 1>
A gravure plate is used for the base material sheet (AST7CR, manufactured by Kanebo Gosei Co., Ltd.) using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B. Then, a conductive sheet was prepared by coating with a conductive layer thickness of 1 μm. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacture Co., Ltd.) UPT-100 (V) Black: UPT-100 (V) OP = 2: 1 was used.
<Example 2>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 1 μm to produce a conductive sheet. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacture Co., Ltd.) mixed with UPT-100 (V) black: UPT-100 (V) OP = 7: 1 was used.
[0013]
<Comparative Example 1>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 1 μm to produce a conductive sheet. As the conductive paint, UPT-100 (V) black (manufactured by Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin (thermoplastic resin A) were mixed with a solvent was used.
<Comparative example 2>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 1 μm to produce a conductive sheet. As the conductive paint, acrylic urethane resin (thermoplastic resin B) UPT-100 (V) OP (manufactured by Osaka Printing Ink Manufacturing Co., Ltd.) containing no conductive filler was used.
[0014]
<Comparative Example 3>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 1 μm to produce a conductive sheet. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacturing Co., Ltd.) mixed with UPT-100 (V) black: UPT-100 (V) OP = 1: 1 was used.
<Comparative example 4>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 1 μm to produce a conductive sheet. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacturing Co., Ltd.) mixed with UPT-100 (V) black: UPT-100 (V) OP = 10: 1 was used.
[0015]
<Comparative Example 5>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and coating with a conductive layer thickness of 0.05 μm to produce a conductive sheet. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacture Co., Ltd.) UPT-100 (V) Black: UPT-100 (V) OP = 2: 1 was used.
<Comparative Example 6>
In the same manner as in Example 1, a conductive coating prepared by using carbon black as the conductive filler, urethane resin as the thermoplastic resin A, and acrylic urethane resin as the thermoplastic resin B was prepared as a base sheet (manufactured by Kanebo Gosei Co., Ltd.). , AST7CR) using a gravure plate and applying with a conductive layer thickness of 12 μm, a conductive sheet was prepared. The conductive paints are UPT-100 (V) black (Osaka Printing Ink Manufacturing Co., Ltd.) in which carbon black and urethane resin are mixed, and UPT-100 (V) OP (in Osaka, Japan) in which acrylic urethane resin is dissolved in the solvent. Printing Ink Manufacture Co., Ltd.) UPT-100 (V) Black: UPT-100 (V) OP = 2: 1 was used.
[0016]
The surface resistance value was measured at three locations on a printed matter of about 1 m with an applied voltage of 10 V and a pro-type UA using Mitsubishi Oil Corporation Hiresta UP (MCP-HT450).
The sealing property was obtained by slitting the coated conductive sheet into a width of 8 mm, using a Nitto Denko Co., Ltd. sealing machine (ET-2000), load 9.8 N, time 0.1 seconds, iron width 0.5 mm. , Iron length 16mm, Dot-point seal (4 degrees strike), seal with cover tape CSL-Z7302 (manufactured by Sumitomo Bakelite Co., Ltd.) at a seal temperature of 160-180 ° C, peel off at 300mm / min using peel machine (GPD856V) The seal strength with the cover tape was evaluated.
Conductive filler drop-off evaluation is made by rubbing the surface of the coated conductive sheet and the copy paper 5 times, with no conductive filler adhering to the copy paper. A case where a large amount of the conductive filler adhered was evaluated as x.
For blocking performance, apply a load of 50 g / cm 2 to an oven at 60 ° C. and leave it for 24 hours, then use ◎ if the surface is not sticky, ○ if there is a little sticky but there is no problem in use. The thing which cannot be made was set as x.
Appearance evaluation was a visual inspection of the appearance after coating. A sample having no coating irregularities was marked with ◎, and a sample having coating irregularities was marked with ×.
The above Examples and Comparative Examples are summarized in Table 1.
[0017]
[Table 1]
【The invention's effect】
According to the present invention, as in the case where the top coat is applied by a single application, the conductive filler is less dropped, the sealing property with the cover tape is good and does not block, and the electronic component transport container comprising the same Is obtained.
Claims (6)
前記導電性塗料が、
導電性フィラーと、
導電性フィラーの分散性が良い熱可塑性樹脂Ａを２〜７重量部と、
熱可塑性樹脂Ａに比べて導電性フィラーの分散性が悪くかつ熱可塑性樹脂Ａとの相溶性が悪い熱可塑性樹脂Ｂを１重量部とを混合してなるものである導電性シート。 A conductive layer is formed by applying a conductive paint on one or both sides of a base material sheet made of a thermoplastic resin. The thickness of the conductive layer is 0.1 to 10 μm, and the surface resistance value is 1 × 10 3 Ω / □. A conductive sheet having a resistance of less than 1 × 10 10 Ω / □ ,
The conductive paint is
A conductive filler;
2-7 parts by weight of thermoplastic resin A with good dispersibility of the conductive filler,
A conductive sheet obtained by mixing 1 part by weight of a thermoplastic resin B having a poor dispersibility of the conductive filler and a poor compatibility with the thermoplastic resin A compared to the thermoplastic resin A.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003033954A JP4174340B2 (en) | 2003-02-12 | 2003-02-12 | Conductive sheet and electronic component transport container and package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003033954A JP4174340B2 (en) | 2003-02-12 | 2003-02-12 | Conductive sheet and electronic component transport container and package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004244038A JP2004244038A (en) | 2004-09-02 |
| JP4174340B2 true JP4174340B2 (en) | 2008-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003033954A Expired - Fee Related JP4174340B2 (en) | 2003-02-12 | 2003-02-12 | Conductive sheet and electronic component transport container and package |
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| Country | Link |
|---|---|
| JP (1) | JP4174340B2 (en) |
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| JP2004244038A (en) | 2004-09-02 |
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