JP4172927B2

JP4172927B2 - Partition wall structure

Info

Publication number: JP4172927B2
Application number: JP2001296100A
Authority: JP
Inventors: 延雄辻; 陽一細田
Original assignee: 岩谷テクノ株式会社
Priority date: 2000-11-17
Filing date: 2001-09-27
Publication date: 2008-10-29
Anticipated expiration: 2021-09-27
Also published as: JP2002213038A

Description

【０００１】
【発明の属する技術分野】
本発明は、乾式工法の間仕切壁構造に関するものであり、より詳細には、低周波数帯域の騒音に対する遮音性能を向上することができる間仕切壁構造に関するものである。
【０００２】
【従来の技術】
建築物又は工作物の間仕切壁として、石膏ボード又は珪酸カルシウム板等の建築用内装ボード材料を鋼製スタッドの間柱に取付けてなる所謂軸組構造の軽量鉄骨間仕切壁が広く実用に供されている。この形式の間仕切壁構造においては、鋼製スタッドは、壁芯に沿って所定間隔を隔てて整列配置され、鋼製スタッドの上端部及び下端部は、天井ランナ及び床ランナに夫々固定される。鋼製スタッドの間柱には、建築用内装ボード材料が固定され、内装ボード材料の壁面が形成される。
【０００３】
他の形式の間仕切壁構造として、間仕切壁の遮音性能及び施工性等を向上すべく、鋼製スタッドの間柱を省略したノンスタッド構造又はスタッドレス構造の間仕切壁が知られている。例えば、特公昭６２─９７０１号公報に開示された間仕切壁は、天井ランナ及び床ランナに固定される各壁面の内装ボード材料と、間仕切壁の中空部に配置された芯材とから略構成される。一種の間柱として機能する芯材は、無機質系接着剤を介してボード材料に接着され、ボード材料と芯材との間に空隙が形成される。また、他の形式のノンスタッド構造間仕切壁として、例えば、特開平７−３２４４１０号公報及び特開平９−４０９６号公報等に開示される如く、上下方向に延びる補強リブをボード片の積層体等によって予め内装ボード材料に一体的に形成し、ボード材料を天井ランナ及び床ランナに取付けるように構成したものが知られている。
【０００４】
本発明者等は、このような乾式工法且つスタッドレス構造の間仕切壁に関し、下張りボードと上張りボードとの間に補強板及び接着材塊を介挿した構造の間仕切壁を開発し、既に実用化している（実公平６−３３０５８号公報）。補強板の幅は、下張り及び上張りボードの幅の約１／２に設定され、各補強板は、下張り及び上張りボードの縦目地を跨ぐように配置される。間隔を隔てた補強板の間には、閉鎖空間が形成され、下張りボードと上張りボードとを接合する多数の接着材塊が閉鎖空間に分散配置される。このような構造の壁面を上下ランナの両側に備えた間仕切壁は、比較的高い壁面剛性を発揮するばかりでなく、図１２の線図に示す如く、比較的良好な遮音性能を発揮する。
【０００５】
【発明が解決しようとする課題】
図１２は、この形式の間仕切壁に関する音響透過損失の実測結果を示す線図である。図１２には、間仕切壁の実測値が実線で示されるとともに、現行の遮音基準（遮音性能指定番号：Ｄ３０〜Ｄ５５）が破線で示されている。実測値は、遮音指定Ｄ５５の基準線を超える高レベルの遮音性能を全体的に示しており、現行の遮音基準の下では、Ｄ５５の遮音性能を発揮する間仕切壁として認定される。
【０００６】
しかしながら、音響透過損失の実測値は、遮音性能の評価対象となる周波数帯域、即ち、１２５Ｈｚ以上の周波数帯域では、比較的良好な数値を示すものの、１２５Ｈｚ以下の周波数帯域においては、図１２に符号Ａで指示するように、比較的急激に低下する傾向があり、低周波数帯域の騒音に対する遮音性能の低下が懸念される。
【０００７】
このような低周波数帯域の騒音は、一般に、乾式工法の間仕切壁によっては非常に遮音し難い特性を有し、従来は、鉄筋コンクリート壁等の比較的重質構造の壁体により遮音していた性質のものであるが、高層集合住宅や、高層ホテル建築物等の如く、各住戸又は各客室を乾式工法の軽量間仕切壁で区画せざるを得ない性質の中高層建築物が近年において多数建設されるに至り、乾式工法の軽量間仕切壁にあっても、１２５Ｈｚ以下の低周波数帯域における間仕切壁の遮音性能を向上すべき必要が生じている。
【０００８】
本発明は、かかる事情に鑑みてなされたものであり、その目的とするところは、壁面を形成する建築用内装ボード材料を上下のランナーに取付けた構成を有する乾式工法の軽量間仕切壁構造において、１２５Ｈｚ以下の低周波数帯域における間仕切壁の遮音性能を向上することができる間仕切壁構造を提供することにある。
【０００９】
【課題を解決するための手段及び作用】
上記目的を達成すべく、本発明の間仕切壁構造(W) は、壁面を形成する建築用内装ボード材料(10,12) を上下のランナー(2,3) に取付けた構成を有する乾式工法のものであり、間仕切壁は、建築用内装ボード材料を構成する下張りボード(10)及び上張りボード(12)と、該ボード間に介挿された補強ボード(11)及び第１無機質系接着材(20)とを有する。補強ボードは、第１接着材の硬化塊を分散配置すべき閉鎖空間(7) を形成するように壁芯方向に互いに間隔を隔てて配置される。第１接着材と同質の第２無機質系接着材(30)が、閉鎖空間に相応する位置において間仕切壁の中空部(6) 側から前記下張りボードの裏面に塗着され、第２接着材の硬化塊が、下張りボードの高さ中心領域(S) に分散配置される。
【００１０】
本発明の上記構成によれば、比較的幅狭の補強ボード(11)が、下張りボード(10)及び上張りボード(12)の間に介挿され、閉鎖空間(7) が、下張りボード及び上張りボードの間の画成される。第１接着材(20)の硬化塊が、閉鎖空間に点在し、第２接着材(30)の硬化塊が、中空部(6) の側から下張りボードの裏面に付着し、所定の高さ領域(S) に分散配置される。補強ボード及び第１接着材硬化塊は、壁面の剛性及び質量を増大し、壁面の遮音性能を全体的に向上するばかりでなく、壁面の面密度又は質量分布を変化させ、壁面の共振作用を抑制して、１２５Ｈｚ以上の周波数帯域の騒音伝播に対する間仕切壁(W) の遮音性能を向上する。他方、第２接着材(30)の硬化塊は、閉鎖空間の裏側において下張りボードの中間高さ領域(S) に付着し、下張りボードの面密度又は質量分布を中間高さ領域において局所的に増大する。これにより、閉鎖空間部分における共振作用が抑制され、１２５Ｈｚ以下の周波数帯域の音響透過損失が向上し、低周波数帯域の騒音に対する遮音性能の低下が、効果的に防止される。
【００１１】
他の観点より、本発明に係る間仕切壁構造(W) の遮音機構は、壁芯方向に間隔を隔てて配置された狭小幅の第１ボード片(17)と、第１ボード片よりも小さい幅を有する第２ボード片(18)と、第２ボード片と一体化したボード(10)とを有する。ボード(10)は、建築用内装ボード材料を構成し、その裏面は、間仕切壁の中空部(6)に向けられる。第２ボード片は、第１ボード片の表面側半部に固定され、無機質系接着材(20)を分散配置可能な開放空間(8)が、第１ボード片の表面側残部と内装ボード材料との間に形成される。接着材の硬化塊は、第１ボード片及び内装ボード材料を相互接着する。第１ボード片は、内装ボード材料の半分以下の幅を有し、第２ボード片は、内装ボード材料の１／４以下の幅を有する。第１及び第２ボード片(17,18) 及び内装ボード材料(10) は、接着材(20)の硬化塊を介挿可能な開放空間(8)を形成し、内装ボード材料が形成する壁面の剛性及び質量を増大し、壁面の遮音性能を全体的に向上するとともに、壁面の面密度を変化させ、各材料のコインシデンス効果の相違により、壁面の共振現象を抑制し、１２５Ｈｚ以上の周波数帯域の騒音伝播に対する間仕切壁(W)の遮音性能を効果的に向上する。また、接着材硬化塊(20)を介挿した開放空間(8)は、片側が中空部(6)に開放しており、１２５Ｈｚ以下の低周波数帯域の共振効果による遮音性能の低下を効果的に防止する。
【００１２】
更に他の観点より、本発明の間仕切壁構造(W)の遮音機構では、無機質系接着材(30)が、間仕切壁の中空部(6)側からボード(10) の裏面に塗着され、接着材(30)の硬化塊が、間仕切壁の高さ中心領域に分散配置される。ボード(10)は、建築用内装ボード材料を構成し、その裏面は、間仕切壁の中空部(6)に向けられる。接着材の塗着領域は、間仕切壁の高さ中心(M)から上下方向に所定寸法(S)の範囲内に制限され、寸法(S)は、間仕切壁の全高(H)の１／４〜１／６に設定される。このような構成によれば、間仕切壁の中間高さ領域に付着した接着材硬化塊(30)は、内装ボード材料の質量分布を中間高さ領域において局所的に増大し、低周波数帯域における壁面の共振効果を有効に規制する。このため、１２５Ｈｚ以下の周波数帯域の音響透過損失が向上するので、低周波数帯域における間仕切壁の遮音性能低下は、効果的に防止される。
【００１３】
【発明の実施の形態】
本発明の好適な実施形態によれば、高さ中心領域の無機質系接着材(30)は、２乃至３列の列をなして上下方向に配列される。
【００１４】
本発明の更に好適な実施形態において、下張りボード(10)及び上張りボード(12)は、実質的に同一の幅を有し、上記補強ボード(11)の幅は、下張り及び上張りボードの幅の半分に設定され、下張り及び上張りボードの縦目地は、補強ボード上に位置決めされる。
【００１５】
本発明の他の好適な実施形態によれば、上記第１ボード片(17)は、内装ボード材料(10,12) を半分以下の幅に裁断した裁断片からなり、上記第２ボード片(18)は、内装ボード材料を１／４以下の幅に裁断した裁断片からなる。
【００１６】
好ましくは、上記内装ボード材料(10,12) 、補強ボード(11)、第１ボード片(17)及び第２ボード片(18)は、板厚１２．５〜１５mmの石膏ボード又はその裁断片からなり、無機質系接着材(20,30) は、石膏粉末、軽量骨材及び接着剤を含む接着材原料を水で混練した石膏系接着材からなる。なお、上記石膏系接着材として、商品名ＧＬボンド又はダイレクトボンド等を好適に使用し得る。所望により、上記間仕切壁の中空部(6) には、グラスウールマット、グラスウール成形板又はロックウール吸音材等の吸音材(5) が挿入又は充填される。
【００１７】
【実施例】
以下、添付図面を参照して、本発明の好適な実施例について詳細に説明する。図１は、本発明の第１実施例に係る間仕切壁の縦断面図であり、図２は、図１に示す間仕切壁のＡ−Ａ線断面図である。また、図３は、図１及び図２に示す間仕切壁の構造を概略的に示す分解斜視図である。
【００１８】
図１乃至図３に示す間仕切壁Ｗは、軽量鉄骨製の床ランナー２及び天井ランナー３を備える。床ランナー２は、コンクリートスラブ又は床モルタル下地等の床基盤Ｆ上に配置され、実質的に水平且つ壁芯方向に床基盤Ｆ上に延在する。床ランナー２は、９００mm程度の間隔を隔てて配置された打込みピン等の固定具（図示せず）によって床基盤Ｆに固定される。天井ランナー３は、溶接、タッピング螺子又はアンカー等の固定手段（図示せず）によって軽量鉄骨天井下地材又は上階コンクリートスラブ等の天井下地Ｃに固定される。天井ランナー３は、床ランナー２と対向して実質的に水平且つ壁芯方向に延在する。
【００１９】
下張りボード１０の上端部及び下端部が、タッピング螺子等の係止具１５によって床ランナー２及び天井ランナー３に固定され、隣り合う下張りボード１０の側縁部同士が、ステープル等の係止具（図示せず）によって相互接合され、連接する。中空部６が、間仕切壁Ｗの内部に画成され、断熱・吸音材料５が、中空部６内に配置される。下張りボード１０は、例えば、幅６００〜１２００mm及び板厚１２．５〜１５mmの石膏ボードからなり、断熱・吸音材料５は、例えば、厚さ２５〜５０mm程度のグラスウールマット又はグラスウール成形板からなる。
【００２０】
酢酸ビニール系接着剤を片面（裏面）に塗布した補強ボード１１が、ステープル等の係止具（図示せず）により下張りボード１０上に留付けられる。補強ボード１１は、下張りボード１０と同質の石膏ボードを半分の幅に裁断した石膏ボード裁断片からなり、例えば、幅３００〜６００mm及び板厚１２．５〜１５mmの寸法を有し、下張りボード１０と実質的に同一の高さ寸法を備える。補強ボード１１は、その幅方向中央部を下張りボード１０の継目（縦目地）と概ね整合するように位置決めされ、下張りボード１０の縦目地を跨ぐように下張りボード１０上に一体的に積層される。
【００２１】
石膏系接着材２０が、団子状に下張りボード１０上に点付けされる。石膏系接着材２０は、石膏粉末、軽量骨材及び接着剤を含む接着材原料を水で混練した粘性材料からなる。石膏系接着材２０の各団子状物は、正面視約５０mm×５０mm程度の寸法を有し、約２５〜３０mm程度の盛付け高さを有する。石膏系接着材２０は、上下方向に１５０〜３００mm程度の相互間隔を隔てて下張りボード１０上に２列乃至３列（本例では２列）に配列される。
【００２２】
酢酸ビニール系接着剤等の接着剤を裏面に塗布した上張りボード１２が、ステープル等の係止具により補強ボード１１上に留付けられ、補強ボード１１に積層される。上張りボード１２は、例えば、幅６００〜１２００mm及び板厚１２．５〜１５mmの石膏ボードからなり、上張りボード１２の表面には、クロス材料又は内装仕上げ塗料等の内装仕上材１３が仕上げ張りないし塗装される。所望により、内装仕上材１３を片面（表面）に予め施した化粧石膏ボード等を上張りボード１２として使用しても良い。
【００２３】
上張りボード１２の接合部（縦目地）は、概ね補強ボード１１の幅方向中央部に位置決めされ、上張りボード１２の中央部裏面は、石膏系接着材２０を偏平に押潰しながら石膏系接着材２０に接着する。下張りボード１０及び上張りボード１２は、石膏系接着材２０の乾燥硬化により一体化する。下張りボード１０及び上張りボード１２の間には、閉鎖空間７が画成され、偏平化し且つ硬化した石膏系接着材２０は、閉鎖空間７に点在する比較的高比重の接着材塊を形成する。
【００２４】
石膏系接着材２０と同質の石膏系接着材３０が、中空部６の側から団子状に下張りボード１０に点付けされる。石膏系接着材３０の各団子状物は、約２５〜５０mm程度の盛付け高さ及び約５０mm×５０mm程度の正面視寸法を有し、上下方向に１００〜３００mm程度の相互間隔を隔てて下張りボード１０上に２乃至３列（本例では３列）に配列される。石膏系接着材３０の塗着領域は、下張りボード１０の高さ中心Ｍから寸法Ｓの上下対称範囲内に限定され、寸法Ｓは、間仕切壁Ｗの全高Ｈの１／４〜１／６に設定される。
【００２５】
このように構成された間仕切壁Ｗによれば、比較的幅狭の補強ボード１１が、下張りボード１０及び上張りボード１２の間に介挿され、閉鎖空間７が、下張りボード１０及び上張りボード１２の間の形成される。接着材２０の硬化塊が、閉鎖空間７に点在し、接着材３０の硬化塊が、下張りボード１０の中空部６側に付着し、所定の高さ領域Ｓに点在する。補強ボード１１及び接着材２０の硬化塊は、ボード１０、１２が形成する壁面の剛性及び重量を増大し、壁面の遮音性能を全体的に向上するとともに、壁面の面密度を変化させ、一般的な周波数帯域における壁面の共振作用を抑制し、１２５Ｈｚ以上の周波数帯域の騒音を有効に遮音するように働く。他方、接着材３０の硬化塊は、閉鎖空間７の裏側において下張りボード１０の中間高さ領域Ｓに付着し、下張りボード１０の重量分布を中間高さ領域において増大する。
【００２６】
間仕切壁Ｗの音響透過損失を実測した結果、図１２に破線Ｂで示す如く、１２５Ｈｚ以下の周波数帯域の音響透過損失が向上し、低周波数帯域の騒音に対する遮音性能の低下が効果的に防止されると判明した。これは、従来構成のものでは、１２５Ｈｚ以下の周波数帯域において共振現象が生じていたのに対し、閉鎖空間７の裏側に位置する接着材３０の硬化塊が、閉鎖空間７部分に位置する下張りボード１０の領域において、低周波数帯域の共振効果を有効に規制したことによると考えられる。
【００２７】
図４乃至図６は、本発明の第２実施例に係る間仕切壁の縦断面図、Ｂ−Ｂ線断面図及び分解斜視図である。図４乃至図６において、上記第１実施例の各構成要素と実質的に同一ないし均等な構成要素については、同一の参照符号が付されている。
【００２８】
本実施例の間仕切壁Ｗにおいては、狭小幅の第１ボード片１７が床ランナー２及び天井ランナー３に取付けられる。第１ボード片１７は、例えば、幅１２０〜４００mmの幅に裁断した帯板形態の石膏ボード裁断片からなり、１２．５〜１５mm程度の板厚を有する。第１ボード片１７の上端部及び下端部は、係止具１５によって床ランナー２及び天井ランナー３に固定され、上下のランナー２、３の間に垂直に延在する。
【００２９】
第２ボード片１８が、第１ボード片１７の外側に固定される。第２ボード片１８は、例えば、幅６０〜２００mmの幅に裁断した帯板形態の石膏ボード裁断片からなり、第１ボード片１７の概ね半分の幅を有する。酢酸ビニール系接着剤を片面（裏面）に塗布した第２ボード片１８が、ステープル等の係止具により第１ボード片１７に留付けられ、第２ボード片１８は、第１ボード片１７の半部に一体的に接着される。
【００３０】
第１ボード片１７の残部には、上記第１実施例と同様の石膏系接着材２０が上下方向に１５０〜３００mm程度の相互間隔を隔てて一列に点付けされる。石膏系接着材２０の各団子状物は、正面視約５０mm×５０mm程度の寸法を有し、２５〜３０mm程度の盛付け高さを有する。
【００３１】
下張りボード１０が、第２ボード片１８に固定される。下張りボード１０は、例えば、幅６００〜１２００mm及び板厚１２．５〜１５mmの石膏ボードからなる。酢酸ビニール系接着剤等の接着剤を裏面に塗布した下張りボード１０は、ステープル等の係止具により第２ボード片１８に留付けられる。下張りボード１０の接合部（縦継目）は、第２ボード片１８の幅方向中央部に位置決めされる。下張りボード１０の裏面は、石膏系接着材２０を偏平に押潰しながら石膏系接着材２０に接着する。下張りボード１０及び第１ボード片１７は、石膏系接着材２０の乾燥硬化により一体化する。第１ボード片１７及び下張りボード１０の間には、片側が開放した開放空間８が形成され、偏平化し且つ硬化した石膏系接着材２０は、開放空間８に点在する比較的高比重の接着材塊を形成する。
【００３２】
酢酸ビニール系接着剤等の接着剤を裏面に塗布した上張りボード１２が、ステープル等の係止具により下張りボード１0 上に留付けられ、下張りボード１０上に積層される。上張りボード１2 は、例えば、幅６００〜１２００mm及び板厚１２．５〜１５mmの石膏ボードからなる。上張りボード１２の表面には、クロス材料又は内装仕上げ塗料等の内装仕上材１３が施工される。所望により、内装仕上１３を片面（表面）に予め施した化粧石膏ボード等を上張りボード１２として使用しても良い。
【００３３】
石膏系接着材２０と同質の石膏系接着材３０が、中空部６の側から下張りボード１２の裏面に団子状に点付けされる。石膏系接着材３０の各団子状物は、約２５〜５０mm程度の盛付け高さ及び約５０mm×５０mm程度の正面視寸法を有し、上下方向に１００〜３００mm程度の相互間隔を隔てて下張りボード１０上に２乃至３列（本例では２列）に配列される。石膏系接着材３０の塗着領域は、下張りボード１０の高さ中心Ｍから寸法Ｓの上下対称範囲内に制限され、寸法Ｓは、間仕切壁Ｗの全高Ｈの１／４〜１／６に設定される。
【００３４】
このように構成された間仕切壁Ｗによれば、第１ボード片１７、第２ボード片１８及び下張りボード１０は、接着材２０の硬化塊を介挿可能な開放空間８を形成し、接着材３０の硬化塊が、第１ボード片１７に位置する下張りボード１０の中空部側面に付着し、所定の高さ範囲Ｓに分散配置される。第１ボード片１７、第２ボード片１８及び接着材２０の硬化塊は、ボード１０、１２が形成する壁面の剛性及び質量を増大し、壁面の遮音性能を全体的に向上するとともに、壁面の面密度を変化させ、一般的な周波数帯域における壁面の共振現象を抑制し、１２５Ｈｚ以上の周波数帯域の騒音を有効に遮音する。また、接着材２０の硬化塊を介挿した開放空間８は、片側が中空部６に開放しており、これにより、低周波数帯域の共振作用を防止する。更に、接着材３０の硬化塊は、開放空間８の裏側に位置する下張りボード１０の中間高さ領域Ｓに付着し、下張りボード１０の質量分布を中間高さ領域Ｓにおいて増大し、低周波数帯域の共振作用を有効に規制する。このため、本例の間仕切壁Ｗも又、図１２に破線Ｂで示す如く、１２５Ｈｚ以下の周波数帯域の音響透過損失を向上し、低周波数帯域の騒音に対する間仕切壁Ｗの遮音性能低下を効果的に防止する。
【００３５】
図７及び図８は、本発明の第３実施例に係る間仕切壁の縦断面図、Ｃ−Ｃ線断面図及び部分破断斜視図である。図７及び図８において、上記第１及び第２実施例の各構成要素と実質的に同一ないし均等な構成要素については、同一の参照符号が付されている。
【００３６】
本実施例の間仕切壁構造Ｗにおいては、下張りボード１０が、係止具１５によって床ランナー２及び天井ランナー３に取付けられ、上張りボード１２が、接着剤及び係止具によって下張りボード１0 の室内側に上張りされる。上張りボード１２の室内側面には、内装仕上材１３が更に施工される。内装仕上材１３は、石膏ボード又は化粧石膏ボード等のボード建材からなる。内装仕上材１３として、クロス材料又は内装仕上げ塗料等を使用しても良い。
【００３７】
石膏系接着材２０が、上下方向に１５０〜３００mm程度の相互間隔を隔てて下張りボード１０の裏面（間仕切壁Ｗの内側面）に一列に点付けされるとともに、帯状の第２ボード片１８が、下張りボード１０の内側面に固定される。第２ボード片１８の概ね２倍の幅を有する帯状の第１ボード片１７が、ステープル等の係止具及び接着剤により第１ボード片１８の内側面に留付けられる。第１ボード片１７の半部は、第２ボード片１８に一体的に接着し、第２ボード片１８の他の半部は、石膏系接着材２０を偏平に押潰しながら石膏系接着材２０に接着する。石膏系接着材２０の乾燥硬化により、下張りボード１０及び第１ボード片１７は一体化する。第１ボード片１７及び下張りボード１０の間には、片側が開放した開放空間８が形成され、偏平化し且つ硬化した石膏系接着材２０は、開放空間８に点在する比較的高比重の接着材塊を形成する。
【００３８】
第１及び第２ボード片１７、１８は、下張りボード１０の幅Ｌ１＝９１０mmであるとき、Ｌ２＝１５０〜７６０mm程度に設定された所定間隔を壁芯方向に隔てて配置される。第３ボード片９１が、ボード片１７、１８の中間位置において、下張りボード１０の内側面に固定され、補強金物９が、ビス等の係止具９２によって第３ボード片９１に固定される。
【００３９】
ボード片１７、１８、９１は、石膏ボード等のボード建材の裁断片からなり、１０〜１５mm程度の板厚を有する。補強金物９は、２０〜７５mm程度の幅及び奥行を有する軽量鉄骨部材等からなる。ボード片１７、１８、９１及び補強金物９の下端及び上端は、図８に示す如く、床Ｆ及び天井下地Ｃから所定距離Ｅを隔てた位置に位置決めされ、距離Ｅは、５０〜１５０mmの範囲、例えば、７５mmに設定される。
【００４０】
本実施例の間仕切壁構造Ｗによれば、ボード片１７、１８及び下張りボード１０は、接着材２０の硬化塊を介挿可能な開放空間８を形成し、補強金物９及びボード片９１が、壁芯方向に間隔を隔てた開放空間８の間に配置される。ボード片１７、１８及び接着材２０の硬化塊は、ボード１０、１２が形成する壁面の剛性及び質量を増大し、壁面の遮音性能を全体的に向上するとともに、壁面の面密度を変化させ、一般的な周波数帯域における壁面の共振現象を抑制し、１２５Ｈｚ以上の周波数帯域の騒音を有効に遮音する。また、接着材２０の硬化塊を介挿した開放空間８は、片側が中空部６に開放しており、これにより、低周波数帯域の共振作用を防止する。更に、補強金物９及びボード片９１は、開放空間８の間の領域において、下張りボード１０の質量を局所的に増大し、低周波数帯域の共振作用を有効に規制する。
【００４１】
本発明者は、図７及び図８に示す間仕切壁Ｗを製作し、財団法人小林理学研究所において音響透過損失の試験を実施した。比較例として、図９に示す間仕切壁Ｗを製作した。なお、図９に示す間仕切壁Ｗは、図１乃至図３に示す間仕切壁Ｗと概ね同一の基本構造を備えるが、上記第１実施例において説明した接着材３０の硬化塊を備えていない。
【００４２】
供試体各部の寸法は、以下のとおりである。
実施例
間仕切壁の壁厚Ｔ：１５０mm
下張りボード１０：石膏ボード厚さ１２．５mm、幅９１０mm
上張りボード１２：石膏ボード厚さ１５mm、幅９１０mm
内装仕上材１３：石膏ボード厚さ９．５mm、幅９１０mm
断熱・吸音材５：グラスウール厚さ２５mm、２４kg/m³
石膏系接着材２０：２kg/m²
第１ボード片１７：石膏ボード厚さ１２．５mm、幅２００mm
第２ボード片１８：石膏ボード厚さ１２．５mm、幅１００mm
第３ボード片９１：石膏ボード厚さ１２．５mm、幅１００mm
補強金物９：軽量溝型鋼材２５mm（幅）×２５mm（奥行）×０．５mm（板厚）
【００４３】
比較例
間仕切壁の壁厚Ｔ：１５０mm
下張りボード１０：石膏ボード厚さ１２．５mm、幅９１０mm
補強ボード１１：石膏ボード厚さ１５mm、幅６００mm
上張りボード１２：石膏ボード厚さ１２．５mm、幅９１０mm
内装仕上材１３：石膏ボード厚さ９．５mm、幅９１０mm
断熱・吸音材５：グラスウール厚さ２５mm、２４kg/m³
石膏系接着材２０：３kg/m²
【００４４】
音響透過損失試験の試験結果が、図１０及び図１１に示されている。なお，図１１に示す括弧内数値は、ＴＬＤ値である。
【００４５】
音響透過損失試験の試験結果によれば、比較例では、１２５Ｈｚ前後の周波数帯域において、音響透過損失が急激に低下するのに対し、本実施例の間仕切壁Ｗでは、１２５Ｈｚ前後の周波数帯域における音響透過損失の低下が観られず、この周波数帯域における音響損失効果が相対的に大きく向上する現象を確認することができた。
【００４６】
また、本実施例の間仕切壁は、ボードを３層に積層した壁面構造を有し、各壁面の厚さは、ボードを４層に積層した壁面構造を有する比較例と比べ、低減しているが、これにもかかわらず、本例の間仕切壁は、全周波数帯域に亘って比較例よりも高い遮音性能を発揮する。従って、本実施例の間仕切壁構造によれば、壁面を軽量化し得るにもかかわらず、遮音性能を向上することができるので、実用的に極めて有利である。
【００４７】
以上、本発明の好適な実施例について詳細に説明したが、本発明は上記実施例に限定されるものではなく、特許請求の範囲に記載された本発明の範囲内で種々の変形又は変更が可能である。
【００４８】
例えば、建築物又は工作物に使用可能な多種のボードを本発明の間仕切壁に用いることができる。例えば、上記建築内装ボード材料として、石膏ボードの他、珪酸カルシウム板、フレキシブルボード、石膏スラグ板、石膏繊維板、無機繊維強化石膏ボード、ガラス繊維強化石膏ボード、石綿セメント板、繊維強化石膏板（ＦＧボード）等の各種ボード材料を使用することが可能である。
【００４９】
【発明の効果】
以上説明した通り、本発明の上記構成によれば、壁面を形成する建築用内装ボード材料を上下のランナーに取付けた構成を有する乾式工法の軽量間仕切壁構造において、１２５Ｈｚ以下の低周波数帯域における間仕切壁の遮音性能を向上する間仕切壁構造を提供することができる。
【図面の簡単な説明】
【図１】本発明の第１実施例に係る間仕切壁の縦断面図である。
【図２】図１に示す間仕切壁のＡ−Ａ線断面図である。
【図３】図１及び図２に示す間仕切壁の構造を概略的に示す分解斜視図である。
【図４】本発明の第２実施例に係る間仕切壁の縦断面図である。
【図５】図４に示す間仕切壁のＢ−Ｂ線断面図である。
【図６】図４及び図５に示す間仕切壁の構造を概略的に示す分解斜視図である。
【図７】本発明の第３実施例に係る間仕切壁の縦断面図である。
【図８】図７に示す間仕切壁のＣ−Ｃ線断面図及び部分破断斜視図である。
【図９】比較例に係る間仕切壁構造を示す縦断面図及び横断面図である。
【図１０】音響透過損失試験の試験結果を示す線図である。
【図１１】音響透過損失試験の試験結果を示す図表である。
【図１２】従来の間仕切壁構造および本発明の間仕切壁構造に関する音響透過損失試験の実測結果を示す線図である。
【符号の説明】
２床ランナー
３天井ランナー
５断熱・吸音材料
６中空部
７閉鎖空間
８開放空間
１０下張りボード
１１補強ボード
１２上張りボード
１３内装仕上材
１５係止具
１７第１ボード片
１８第２ボード片
２０石膏系接着材
３０石膏系接着材
Ｍ高さ中心
Ｓ寸法( 高さ中心領域)
Ｔ壁厚
Ｗ間仕切壁
Ｃ天井下地
Ｆ床基盤[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a partition wall structure for a dry construction method, and more particularly to a partition wall structure capable of improving sound insulation performance against noise in a low frequency band.
[0002]
[Prior art]
As a partition wall of a building or a workpiece, a so-called frame structure lightweight steel partition wall in which a building interior board material such as gypsum board or calcium silicate board is attached to a stud stud made of steel is widely used practically. . In this type of partition wall structure, the steel studs are aligned and arranged at predetermined intervals along the wall core, and the upper end portion and the lower end portion of the steel stud are fixed to the ceiling runner and the floor runner, respectively. An interior board material for construction is fixed to the studs made of steel, and a wall surface of the interior board material is formed.
[0003]
As another type of partition wall structure, a partition wall having a non-stud structure or a studless structure in which the studs of steel studs are omitted is known in order to improve sound insulation performance and workability of the partition wall. For example, the partition wall disclosed in Japanese Patent Publication No. 62-9701 is substantially composed of an interior board material of each wall surface fixed to a ceiling runner and a floor runner, and a core material disposed in a hollow portion of the partition wall. The The core material that functions as a kind of stud is bonded to the board material via an inorganic adhesive, and a gap is formed between the board material and the core material. Further, as other types of non-stud structure partition walls, for example, as disclosed in JP-A-7-324410 and JP-A-9-4096, reinforcing ribs extending in the vertical direction are used as laminates of board pieces, etc. Is previously formed integrally with the interior board material and the board material is attached to the ceiling runner and floor runner.
[0004]
The inventors of the present invention have developed a partition wall having a structure in which a reinforcing plate and an adhesive lump are interposed between an underboard and an upper board, and have already been put into practical use. (Japanese Utility Model Publication No. 6-33058). The width of the reinforcing plate is set to about ½ of the width of the underlining and the upper board, and each reinforcing plate is disposed so as to straddle the vertical joint of the lower board and the upper board. A closed space is formed between the reinforcing plates spaced apart from each other, and a large number of adhesive masses that join the lower board and the upper board are distributed in the closed space. A partition wall provided with wall surfaces of such a structure on both sides of the upper and lower runners not only exhibits relatively high wall rigidity, but also exhibits relatively good sound insulation performance as shown in the diagram of FIG.
[0005]
[Problems to be solved by the invention]
FIG. 12 is a diagram showing an actual measurement result of sound transmission loss regarding the partition wall of this type. In FIG. 12, the actual measurement value of the partition wall is shown by a solid line, and the current sound insulation standard (sound insulation performance designation numbers: D30 to D55) is shown by a broken line. The actual measurement value generally indicates a high level of sound insulation performance exceeding the reference line of the sound insulation designation D55, and is certified as a partition wall that exhibits the sound insulation performance of D55 under the current sound insulation standard.
[0006]
However, the actual measurement value of sound transmission loss shows a relatively good value in the frequency band to be evaluated for the sound insulation performance, that is, in the frequency band of 125 Hz or higher, but in the frequency band of 125 Hz or lower, As indicated by A, there is a tendency to decrease relatively rapidly, and there is concern about a decrease in sound insulation performance against noise in a low frequency band.
[0007]
Such low frequency band noise generally has a characteristic that it is very difficult to be sound-insulated by the partition wall of the dry construction method, and has been conventionally sound-insulated by a relatively heavy structure wall such as a reinforced concrete wall. In recent years, many high-rise buildings, such as high-rise apartment buildings and high-rise hotel buildings, have been constructed in which each dwelling unit or guest room has to be partitioned with a lightweight partition wall using a dry construction method. Therefore, even in the light partition wall of the dry construction method, it is necessary to improve the sound insulation performance of the partition wall in a low frequency band of 125 Hz or less.
[0008]
The present invention has been made in view of such circumstances, and the object of the present invention is in a lightweight partition wall structure of a dry construction method having a configuration in which building interior board materials forming wall surfaces are attached to upper and lower runners. An object of the present invention is to provide a partition wall structure capable of improving the sound insulation performance of the partition wall in a low frequency band of 125 Hz or less.
[0009]
[Means and Actions for Solving the Problems]
In order to achieve the above object, the partition wall structure (W) of the present invention is a dry construction method having a construction in which the interior board material (10, 12) for forming the wall surface is attached to the upper and lower runners (2, 3). The partition wall is composed of an underboard board (10) and an upper board board (12) constituting an interior board material for construction, a reinforcing board (11) interposed between the boards, and a first inorganic adhesive material. (20) The reinforcing boards are spaced apart from each other in the direction of the wall core so as to form a closed space (7) in which the hardened mass of the first adhesive material is to be distributed. A second inorganic adhesive material (30) of the same quality as the first adhesive material is applied to the back surface of the underboard from the hollow portion (6) side of the partition wall at a position corresponding to the closed space. The cured mass is distributed in the center height area (S) of the underboard.
[0010]
According to the above configuration of the present invention, the relatively narrow reinforcing board (11) is inserted between the lower board (10) and the upper board (12), and the closed space (7) is provided with the lower board and the upper board (12). Defined between top board. The hardened lump of the first adhesive material (20) is scattered in the closed space, and the hardened lump of the second adhesive material (30) adheres to the back surface of the underboard from the side of the hollow portion (6). Distributed in the area (S). The reinforcing board and the first cured adhesive mass not only increase the rigidity and mass of the wall surface, improve the overall sound insulation performance of the wall surface, but also change the surface density or mass distribution of the wall surface, Suppressing and improving the sound insulation performance of the partition wall (W) against noise propagation in a frequency band of 125 Hz or higher. On the other hand, the cured mass of the second adhesive (30) adheres to the intermediate height region (S) of the underboard on the back side of the closed space, and the surface density or mass distribution of the underboard is locally increased in the intermediate height region. Increase. Thereby, the resonance action in the closed space portion is suppressed, the sound transmission loss in the frequency band of 125 Hz or less is improved, and the deterioration of the sound insulation performance against the noise in the low frequency band is effectively prevented.
[0011]
  From another viewpoint, the partition wall structure (W) according to the present inventionSound insulation mechanismThe first board piece (17) having a narrow width and spaced apart in the direction of the wall core, the second board piece (18) having a smaller width than the first board piece, and the second board piece are integrated with each other. Board (10). The board (10) constitutes an interior board material for construction, and the back surface thereof is directed to the hollow portion (6) of the partition wall. The second board piece is fixed to the surface side half of the first board piece, and the open space (8) in which the inorganic adhesive (20) can be distributed and distributed is the surface board remaining part and the interior board material of the first board piece. Formed between. The cured mass of adhesive bonds the first board piece and the interior board material together. The first board piece has a width less than half of the interior board material, and the second board piece has a width less than 1/4 of the interior board material. The first and second board pieces (17, 18) and the interior board material (10) form an open space (8) into which the cured mass of the adhesive (20) can be inserted, and the wall surface formed by the interior board material Increases the rigidity and mass of the wall, improves the overall sound insulation performance of the wall surface, changes the surface density of the wall surface, suppresses the resonance phenomenon of the wall surface due to the difference in the coincidence effect of each material, and the frequency band above 125 Hz Effectively improves the sound insulation performance of the partition wall (W) against noise propagation. In addition, the open space (8) inserted with the cured adhesive mass (20) is open to the hollow portion (6) on one side, effectively reducing the sound insulation performance due to the resonance effect in the low frequency band of 125 Hz or less. To prevent.
[0012]
  Furthermore, from another viewpoint, the partition wall structure (W) of the present inventionSound insulation mechanismThen, the inorganic adhesive (30) is applied from the hollow part (6) side of the partition wall to the back surface of the board (10), and the cured mass of the adhesive (30) is placed in the central area of the partition wall height. Distributed. The board (10) constitutes an interior board material for construction, and the back surface thereof is directed to the hollow portion (6) of the partition wall. The area where the adhesive is applied is limited to a predetermined dimension (S) in the vertical direction from the height center (M) of the partition wall, and the dimension (S) is ¼ of the total height (H) of the partition wall. Set to ~ 1/6. According to such a configuration, the adhesive cured mass (30) attached to the intermediate height region of the partition wall locally increases the mass distribution of the interior board material in the intermediate height region, and the wall surface in the low frequency band. This effectively regulates the resonance effect. For this reason, since sound transmission loss in a frequency band of 125 Hz or less is improved, a decrease in sound insulation performance of the partition wall in the low frequency band is effectively prevented.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
According to a preferred embodiment of the present invention, the inorganic adhesive (30) in the central region of the height is arranged in the vertical direction in two to three rows.
[0014]
In a further preferred embodiment of the present invention, the underboard (10) and the upper board (12) have substantially the same width, and the width of the reinforcing board (11) is the same as that of the underboard and the upper board. Set to half the width, the vertical joints of the underlay and overboard are positioned on the reinforcement board.
[0015]
According to another preferred embodiment of the present invention, the first board piece (17) is made of a cut piece obtained by cutting the interior board material (10, 12) into a half or less width, and the second board piece ( 18) consists of cut pieces obtained by cutting the interior board material to a width of 1/4 or less.
[0016]
Preferably, the interior board material (10, 12), the reinforcing board (11), the first board piece (17) and the second board piece (18) are a plaster board having a thickness of 12.5 to 15 mm or a cut piece thereof. The inorganic adhesive (20, 30) is made of a gypsum-based adhesive obtained by kneading an adhesive material containing gypsum powder, a lightweight aggregate and an adhesive with water. In addition, a brand name GL bond or a direct bond etc. can be used suitably as said gypsum-type adhesive material. If desired, the hollow portion (6) of the partition wall is inserted or filled with a sound absorbing material (5) such as glass wool mat, glass wool molded plate or rock wool sound absorbing material.
[0017]
【Example】
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a longitudinal sectional view of a partition wall according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of the partition wall shown in FIG. FIG. 3 is an exploded perspective view schematically showing the structure of the partition wall shown in FIGS. 1 and 2.
[0018]
The partition wall W shown in FIGS. 1 to 3 includes a floor runner 2 and a ceiling runner 3 made of lightweight steel. The floor runner 2 is disposed on a floor base F such as a concrete slab or a floor mortar base, and extends on the floor base F substantially horizontally and in a wall core direction. The floor runner 2 is fixed to the floor base F by a fixing tool (not shown) such as a driving pin disposed at an interval of about 900 mm. The ceiling runner 3 is fixed to a ceiling base C such as a lightweight steel ceiling base material or an upper floor concrete slab by fixing means (not shown) such as welding, a tapping screw or an anchor. The ceiling runner 3 faces the floor runner 2 and extends substantially horizontally and in the direction of the wall core.
[0019]
The upper end portion and the lower end portion of the underboard 10 are fixed to the floor runner 2 and the ceiling runner 3 by an engaging tool 15 such as a tapping screw, and the side edges of the adjacent underboard 10 are connected to an engaging tool such as a staple ( (Not shown) and are interconnected. The hollow portion 6 is defined inside the partition wall W, and the heat insulating and sound absorbing material 5 is disposed in the hollow portion 6. The underboard 10 is made of a gypsum board having a width of 600 to 1200 mm and a plate thickness of 12.5 to 15 mm, for example, and the heat insulating and sound absorbing material 5 is made of a glass wool mat or a glass wool molded plate having a thickness of about 25 to 50 mm, for example.
[0020]
The reinforcing board 11 coated with vinyl acetate adhesive on one side (back side) is fastened on the underlay board 10 by a locking tool (not shown) such as staples. The reinforcing board 11 is made of a gypsum board cutting piece obtained by cutting a gypsum board of the same quality as the underlay board 10 into a half width, and has a width of 300 to 600 mm and a thickness of 12.5 to 15 mm, for example. With substantially the same height dimension. The reinforcing board 11 is positioned so that the center portion in the width direction is substantially aligned with the joint (vertical joint) of the underboard 10, and is laminated integrally on the underboard 10 so as to straddle the vertical joint of the underboard 10. .
[0021]
The gypsum adhesive 20 is spotted on the underboard 10 in a dumpling shape. The gypsum adhesive 20 is made of a viscous material obtained by kneading an adhesive material containing gypsum powder, a lightweight aggregate, and an adhesive with water. Each dumpling of the gypsum-based adhesive 20 has a dimension of about 50 mm × 50 mm when viewed from the front, and a height of about 25 to 30 mm. The gypsum-based adhesives 20 are arranged in two to three rows (two rows in this example) on the underboard 10 with an interval of about 150 to 300 mm in the vertical direction.
[0022]
An upper board 12 having an adhesive such as a vinyl acetate adhesive applied on the back surface is fastened on the reinforcing board 11 by a fastener such as a staple and is laminated on the reinforcing board 11. The upper board 12 is made of, for example, a gypsum board having a width of 600 to 1200 mm and a plate thickness of 12.5 to 15 mm, and an interior finishing material 13 such as a cloth material or an interior finishing paint is finished on the surface of the upper board 12. Or painted. If desired, a decorative plaster board or the like in which the interior finishing material 13 is preliminarily applied to one surface (surface) may be used as the upper board 12.
[0023]
The joint portion (vertical joint) of the upper board 12 is positioned substantially in the center of the reinforcing board 11 in the width direction, and the back surface of the central part of the upper board 12 is gypsum-based bonded while flatly crushing the gypsum-based adhesive 20. Adhere to the material 20. The lower board 10 and the upper board 12 are integrated by drying and hardening the gypsum adhesive 20. A closed space 7 is defined between the lower board 10 and the upper board 12, and the flattened and hardened gypsum adhesive 20 forms an adhesive mass having a relatively high specific gravity scattered in the closed space 7. To do.
[0024]
  A gypsum adhesive 30 that is the same quality as the gypsum adhesive 206The underboard 10 is scored in a dumpling form from the side of the plate. Each dumpling of the gypsum-based adhesive 30 has a height of about 25 to 50 mm and a front view size of about 50 mm × 50 mm, and is laid down with an interval of about 100 to 300 mm in the vertical direction. Arranged on the board 10 in 2 to 3 rows (3 rows in this example). The application region of the gypsum-based adhesive 30 is limited to a vertically symmetric range of the dimension S from the height center M of the underboard 10, and the dimension S is ¼ to ６ of the total height H of the partition wall W. Is set.
[0025]
According to the partition wall W configured in this way, the relatively narrow reinforcing board 11 is inserted between the underboard 10 and the upper board 12, and the closed space 7 becomes the underboard 10 and the upper board. Formed between twelve. The cured mass of the adhesive material 20 is scattered in the closed space 7, and the cured mass of the adhesive material 30 adheres to the hollow portion 6 side of the underboard 10 and is scattered in the predetermined height region S. The hardened lump of the reinforcing board 11 and the adhesive material 20 increases the rigidity and weight of the wall surface formed by the boards 10 and 12, improves the sound insulation performance of the wall surface as a whole, and changes the surface density of the wall surface. It suppresses the resonance effect of the wall surface in a special frequency band, and works to effectively insulate noise in the frequency band of 125 Hz or higher. On the other hand, the cured mass of the adhesive material 30 adheres to the intermediate height region S of the underboard 10 on the back side of the closed space 7 and increases the weight distribution of the underboard 10 in the intermediate height region.
[0026]
As a result of the actual measurement of the sound transmission loss of the partition wall W, as shown by the broken line B in FIG. 12, the sound transmission loss in the frequency band of 125 Hz or less is improved, and the deterioration of the sound insulation performance against the noise in the low frequency band is effectively prevented. It turned out. This is because the resonance phenomenon occurs in the frequency band of 125 Hz or less in the conventional configuration, whereas the hardened lump of the adhesive 30 located on the back side of the closed space 7 is the underboard placed on the closed space 7 portion. This is considered to be due to the fact that the resonance effect in the low frequency band was effectively regulated in the 10 region.
[0027]
4 to 6 are a longitudinal sectional view, a sectional view taken along line BB, and an exploded perspective view of a partition wall according to a second embodiment of the present invention. 4 to 6, components that are substantially the same as or equivalent to the components of the first embodiment are denoted by the same reference numerals.
[0028]
In the partition wall W of the present embodiment, the narrow first board piece 17 is attached to the floor runner 2 and the ceiling runner 3. The 1st board piece 17 consists of a gypsum board cutting piece of the strip | belt board shape cut | judged to the width | variety of 120-400 mm width, for example, and has board thickness of about 12.5-15 mm. The upper end portion and the lower end portion of the first board piece 17 are fixed to the floor runner 2 and the ceiling runner 3 by the locking tool 15, and extend vertically between the upper and lower runners 2 and 3.
[0029]
The second board piece 18 is fixed to the outside of the first board piece 17. The second board piece 18 is made of, for example, a gypsum board cutting piece in the form of a strip cut into a width of 60 to 200 mm, and has a width approximately half that of the first board piece 17. A second board piece 18 coated with vinyl acetate adhesive on one side (back side) is fastened to the first board piece 17 by a fastener such as a staple, and the second board piece 18 is attached to the first board piece 17. The half is bonded together.
[0030]
On the remaining portion of the first board piece 17, the gypsum adhesive 20 similar to that of the first embodiment is dotted in a row at an interval of about 150 to 300 mm in the vertical direction. Each dumpling-like material of the gypsum adhesive 20 has a dimension of about 50 mm × 50 mm when viewed from the front, and has a height of about 25 to 30 mm.
[0031]
The underboard 10 is fixed to the second board piece 18. The underboard 10 is made of, for example, a gypsum board having a width of 600 to 1200 mm and a thickness of 12.5 to 15 mm. The underboard 10 having an adhesive such as vinyl acetate adhesive applied to the back surface is fastened to the second board piece 18 by a locking tool such as a staple. The joint portion (longitudinal joint) of the underboard 10 is positioned at the center in the width direction of the second board piece 18. The back surface of the underboard 10 is bonded to the gypsum adhesive 20 while crushing the gypsum adhesive 20 flat. The underboard 10 and the first board piece 17 are integrated by drying and curing the gypsum adhesive 20. An open space 8 that is open on one side is formed between the first board piece 17 and the underboard 10, and the flattened and hardened gypsum adhesive 20 is bonded to a relatively high specific gravity that is scattered in the open space 8. Form a lump.
[0032]
An upper board 12 having an adhesive such as a vinyl acetate adhesive applied to the back surface is fastened on the lower board 10 by a fastener such as a staple and laminated on the lower board 10. The upper board 12 is made of, for example, a gypsum board having a width of 600 to 1200 mm and a thickness of 12.5 to 15 mm. An interior finishing material 13 such as a cloth material or interior finish paint is applied to the surface of the upper board 12. If desired, a decorative plaster board or the like in which the interior finish 13 is preliminarily provided on one side (surface) may be used as the upper board 12.
[0033]
A gypsum-based adhesive 30 that is the same quality as the gypsum-based adhesive 20 is spotted in a dumpling shape from the hollow portion 6 side to the back surface of the underboard 12. Each dumpling of the gypsum-based adhesive 30 has a height of about 25 to 50 mm and a front view size of about 50 mm × 50 mm, and is laid down with an interval of about 100 to 300 mm in the vertical direction. Arranged on the board 10 in 2 to 3 rows (2 rows in this example). The application region of the gypsum-based adhesive 30 is limited within a vertically symmetrical range of the dimension S from the height center M of the underboard 10, and the dimension S is ¼ to ６ of the total height H of the partition wall W. Is set.
[0034]
According to the partition wall W configured in this way, the first board piece 17, the second board piece 18, and the underboard 10 form an open space 8 into which a cured mass of the adhesive 20 can be inserted, and the adhesive 30 cured masses adhere to the side of the hollow portion of the underboard 10 located on the first board piece 17 and are distributed in a predetermined height range S. The hardened lump of the first board piece 17, the second board piece 18 and the adhesive material 20 increases the rigidity and mass of the wall surface formed by the boards 10 and 12, and improves the sound insulation performance of the wall surface as a whole. The surface density is changed, the resonance phenomenon of the wall surface in the general frequency band is suppressed, and the noise in the frequency band of 125 Hz or more is effectively sound-insulated. Moreover, the open space 8 in which the hardened lump of the adhesive material 20 is inserted is open to the hollow portion 6 on one side, thereby preventing the resonance action in the low frequency band. Further, the cured mass of the adhesive 30 adheres to the intermediate height region S of the underboard 10 located on the back side of the open space 8, and the mass distribution of the underboard 10 is increased in the intermediate height region S, so that the low frequency band It effectively regulates the resonance action of the. For this reason, the partition wall W of this example also improves the sound transmission loss in the frequency band of 125 Hz or less, and effectively reduces the sound insulation performance of the partition wall W against noise in the low frequency band, as shown by the broken line B in FIG. To prevent.
[0035]
7 and 8 are a longitudinal sectional view, a CC sectional view and a partially broken perspective view of a partition wall according to a third embodiment of the present invention. 7 and 8, the same reference numerals are assigned to components that are substantially the same or equivalent to the components of the first and second embodiments.
[0036]
In the partition wall structure W of the present embodiment, the lower board 10 is attached to the floor runner 2 and the ceiling runner 3 by the locking tool 15, and the upper board 12 is placed in the chamber of the lower board 10 by the adhesive and the locking tool. It is upholstered inside. An interior finishing material 13 is further applied to the indoor side surface of the upper board 12. The interior finishing material 13 is made of a board building material such as a gypsum board or a decorative gypsum board. As the interior finish material 13, a cloth material or interior finish paint may be used.
[0037]
The gypsum-based adhesive 20 is dotted in a row on the back surface (inner side surface of the partition wall W) of the underboard 10 with a space of about 150 to 300 mm in the vertical direction. , And fixed to the inner surface of the underboard 10. A belt-like first board piece 17 having a width approximately twice that of the second board piece 18 is fastened to the inner surface of the first board piece 18 by a locking tool such as staples and an adhesive. One half of the first board piece 17 is integrally bonded to the second board piece 18, and the other half of the second board piece 18 is gypsum-based adhesive 20 while crushing the gypsum-based adhesive 20 flatly. Adhere to. By drying and curing the gypsum adhesive 20, the underboard 10 and the first board piece 17 are integrated. An open space 8 that is open on one side is formed between the first board piece 17 and the underboard 10, and the flattened and hardened gypsum adhesive 20 is bonded to a relatively high specific gravity scattered in the open space 8. A lump is formed.
[0038]
When the width L1 of the underlay board 10 is 910 mm, the first and second board pieces 17 and 18 are arranged with a predetermined interval set to L2 = 150 to 760 mm separated in the wall core direction. The third board piece 91 is fixed to the inner surface of the underboard 10 at an intermediate position between the board pieces 17 and 18, and the reinforcing hardware 9 is fixed to the third board piece 91 by a locking tool 92 such as a screw.
[0039]
The board pieces 17, 18, and 91 are made of a piece of board building material such as gypsum board and have a thickness of about 10 to 15 mm. The reinforcing hardware 9 is made of a lightweight steel member having a width and depth of about 20 to 75 mm. As shown in FIG. 8, the lower ends and upper ends of the board pieces 17, 18, 91 and the reinforcing hardware 9 are positioned at a predetermined distance E from the floor F and the ceiling base C, and the distance E is in the range of 50 to 150 mm. For example, it is set to 75 mm.
[0040]
According to the partition wall structure W of the present embodiment, the board pieces 17 and 18 and the underboard 10 form an open space 8 in which a cured mass of the adhesive 20 can be inserted, and the reinforcing hardware 9 and the board piece 91 are It arrange | positions between the open spaces 8 spaced apart in the wall core direction. The hardened lump of the board pieces 17 and 18 and the adhesive material 20 increases the rigidity and mass of the wall surface formed by the boards 10 and 12, improves the overall sound insulation performance of the wall surface, changes the surface density of the wall surface, The resonance phenomenon of the wall surface in a general frequency band is suppressed, and noise in a frequency band of 125 Hz or higher is effectively insulated. Moreover, the open space 8 in which the hardened lump of the adhesive material 20 is inserted is open to the hollow portion 6 on one side, thereby preventing the resonance action in the low frequency band. Further, the reinforcing hardware 9 and the board piece 91 locally increase the mass of the underboard 10 in the region between the open spaces 8 and effectively regulate the resonance action in the low frequency band.
[0041]
The inventor manufactured the partition wall W shown in FIGS. 7 and 8, and conducted a sound transmission loss test at the Kobayashi Institute of Physical Science. As a comparative example, a partition wall W shown in FIG. 9 was manufactured. The partition wall W shown in FIG. 9 has substantially the same basic structure as the partition wall W shown in FIGS. 1 to 3, but does not include the cured mass of the adhesive material 30 described in the first embodiment.
[0042]
The dimensions of each part of the specimen are as follows.
Example
Wall thickness T of partition wall: 150mm
Underboard 10: Gypsum board Thickness 12.5mm, Width 910mm
Top board 12: Gypsum board 15mm thick, 910mm wide
Interior finish 13: Gypsum board Thickness 9.5mm, Width 910mm
Heat insulation / sound absorbing material 5: Glass wool 25mm thickness, 24kg / m^Three
Gypsum adhesive 20: 2kg / m²
1st board piece 17: Gypsum board thickness 12.5mm, width 200mm
Second board piece 18: gypsum board thickness 12.5mm, width 100mm
Third board piece 91: gypsum board thickness 12.5mm, width 100mm
Reinforcement hardware 9: Lightweight grooved steel 25mm (width) x 25mm (depth) x 0.5mm (plate thickness)
[0043]
Comparative example
Wall thickness T of partition wall: 150mm
Underboard 10: Gypsum board Thickness 12.5mm, Width 910mm
Reinforcement board 11: Gypsum board thickness 15mm, width 600mm
Top board 12: Gypsum board Thickness 12.5mm, Width 910mm
Interior finish 13: Gypsum board Thickness 9.5mm, Width 910mm
Heat insulation / sound absorbing material 5: Glass wool 25mm thickness, 24kg / m^Three
Gypsum adhesive 20: 3kg / m²
[0044]
The test results of the sound transmission loss test are shown in FIGS. The numbers in parentheses shown in FIG. 11 are TLD values.
[0045]
According to the test results of the sound transmission loss test, in the comparative example, the sound transmission loss sharply decreases in the frequency band around 125 Hz, whereas in the partition wall W of this embodiment, the sound in the frequency band around 125 Hz is obtained. A decrease in transmission loss was not observed, and it was confirmed that the acoustic loss effect in this frequency band was relatively greatly improved.
[0046]
In addition, the partition wall of this example has a wall surface structure in which boards are laminated in three layers, and the thickness of each wall surface is reduced as compared with the comparative example having a wall surface structure in which boards are laminated in four layers. However, in spite of this, the partition wall of this example exhibits higher sound insulation performance than the comparative example over the entire frequency band. Therefore, according to the partition wall structure of the present embodiment, the sound insulation performance can be improved despite the fact that the wall surface can be reduced in weight, which is extremely advantageous in practice.
[0047]
The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiments, and various modifications or changes can be made within the scope of the present invention described in the claims. Is possible.
[0048]
For example, various boards that can be used for buildings or work pieces can be used for the partition wall of the present invention. For example, as the building interior board material, in addition to gypsum board, calcium silicate board, flexible board, gypsum slag board, gypsum fiber board, inorganic fiber reinforced gypsum board, glass fiber reinforced gypsum board, asbestos cement board, fiber reinforced gypsum board ( Various board materials such as FG board) can be used.
[0049]
【The invention's effect】
As described above, according to the above configuration of the present invention, in the lightweight partition wall structure of the dry construction method having the configuration in which the interior board material for building forming the wall surface is attached to the upper and lower runners, the partition in the low frequency band of 125 Hz or less. A partition wall structure that improves the sound insulation performance of the wall can be provided.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view of a partition wall according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line AA of the partition wall shown in FIG.
3 is an exploded perspective view schematically showing the structure of the partition wall shown in FIGS. 1 and 2. FIG.
FIG. 4 is a longitudinal sectional view of a partition wall according to a second embodiment of the present invention.
5 is a cross-sectional view of the partition wall shown in FIG. 4 taken along the line BB.
6 is an exploded perspective view schematically showing the structure of the partition wall shown in FIGS. 4 and 5. FIG.
FIG. 7 is a longitudinal sectional view of a partition wall according to a third embodiment of the present invention.
8 is a cross-sectional view taken along line CC and a partially broken perspective view of the partition wall shown in FIG. 7. FIG.
FIG. 9 is a longitudinal sectional view and a transverse sectional view showing a partition wall structure according to a comparative example.
FIG. 10 is a diagram showing a test result of a sound transmission loss test.
FIG. 11 is a chart showing test results of a sound transmission loss test.
FIG. 12 is a diagram showing an actual measurement result of a sound transmission loss test related to the conventional partition wall structure and the partition wall structure of the present invention.
[Explanation of symbols]
2 floor runners
3 Ceiling runners
5 Insulation and sound absorbing materials
6 Hollow part
7 closed space
8 Open space
10 Underlay board
11 Reinforcement board
12 Top board
13 Interior finishing materials
15 Locking tool
17 First board piece
18 Second board piece
20 Gypsum adhesive
30 Gypsum adhesive
M height center
S dimension (height center area)
T wall thickness
W partition wall
C Ceiling base
F Floor base

Claims

In the partition wall structure of the dry construction method having a construction in which the interior board material for building forming the wall surface is attached to the upper and lower runners (2, 3),
A lower board (10) and an upper board (12) constituting an interior board material for building; a reinforcing board (11) interposed between the boards; and a first inorganic adhesive (20); The reinforcing boards are arranged spaced apart from each other in the direction of the wall core so as to form a closed space (7) in which the hardened mass of the first adhesive material is to be distributed.
A second inorganic adhesive (30) of the same quality as the first adhesive is applied to the back surface of the underboard from the hollow portion (6) side of the partition wall at a position corresponding to the closed space, A partition wall structure characterized in that a hardened lump of adhesive material is dispersedly arranged in the height center region (S) of the underboard.

The building interior board material and the reinforcing board are made of gypsum board or a cut piece thereof, and the inorganic adhesive material is a gypsum adhesive material obtained by kneading an adhesive material containing gypsum powder, a lightweight aggregate and an adhesive with water. The partition wall structure according to claim 1, comprising:

The underboard and the upper board have substantially the same width, and each vertical joint position of the upper board and the underboard is located on the reinforcing board, and the width of the reinforcing board is equal to the underboard and the upper board. The partition wall structure according to claim 1, wherein the partition wall structure is set to a half of the width of the upper board.

In partition walls of sound insulation mechanism dry method having a configuration the building interior board material forming the wall is attached to the upper and lower runners (2, 3),
A first board piece (17) having a narrow width and spaced apart from each other in the direction of the wall core, a second board piece (18) having a smaller width than the board piece, and the second board piece. And a board (10) that constitutes the building interior board material and whose rear surface faces the hollow part (6) of the partition wall,
The second board piece is fixed to the half on the surface side of the first board piece, and an open space (8) in which the inorganic adhesive (20) can be dispersedly disposed is formed on the surface side remaining part of the first board piece. Formed between the board (10) and the back surface of the board (10), the cured mass of the adhesive material, the first board piece and the board are mutually bonded,
The sound insulation mechanism for a partition wall , wherein the first board piece has a width of half or less of the board, and the second board piece has a width of 1/4 or less of the board.

A second inorganic adhesive (30) of the same quality as the adhesive is applied to the back surface of the board (10) from the hollow portion (6) side of the partition wall in the region between the first board pieces, The sound insulation mechanism for a partition wall according to claim 4, wherein the hardened mass of the second adhesive material is dispersedly arranged in the height center region (S) of the partition wall.

The board (10) and the board pieces (17, 18) are made of gypsum board or a cut piece thereof, and the inorganic adhesive (20) is made of an adhesive material containing gypsum powder, lightweight aggregate and adhesive. partition wall of the sound insulation mechanism according to claim 4 or 5, characterized in that it consists of gypsum-based adhesive obtained by kneading with water.

In partition walls of sound insulation mechanism dry method having a configuration the building interior board material forming the wall is attached to the upper and lower runners (2, 3),
The inorganic adhesive (30) is applied from the hollow part (6) side of the partition wall to the board (10) constituting the interior board material for building and having the back surface facing the hollow part (6) of the partition wall. Attached, the cured mass of the adhesive material is distributed and arranged in the central region of the height of the partition wall,
The area where the adhesive is applied is limited to a predetermined dimension (S) in the vertical direction from the height center (M) of the partition wall, and the predetermined dimension is 1/4 of the total height (H) of the partition wall. A sound insulation mechanism for partition walls , which is set to １／.

The sound insulation mechanism for a partition wall according to claim 7, wherein the coating region is limited within the dimension range that is vertically symmetrical from the height center of the partition wall.

The sound insulation mechanism for a partition wall according to claim 7 or 8, wherein the adhesive is arranged in a vertical direction in two to three rows.

In the partition wall structure of the dry construction method having a construction in which the interior board material for building forming the wall surface is attached to the upper and lower runners (2, 3),
A first board piece (17) having a narrow width and spaced apart from each other in the direction of the wall core, a second board piece (18) having a smaller width than the board piece, and the second board piece. And the board (10) that constitutes the building interior board material and has the back surface facing the hollow portion (6) of the partition wall,
The second board piece is fixed to the front half of the first board piece, and an open space (8) in which the first inorganic adhesive (20) can be dispersedly arranged is provided on the surface side of the first board piece. Formed between the remaining portion and the back surface of the board (10), and the cured mass of the first adhesive material bonds the first board piece and the board to each other;
A second inorganic adhesive material (30) of the same quality as the first adhesive material is applied to the back surface of the board from the hollow portion (6) side of the partition wall in the region between the first board pieces. (2) A partition wall structure characterized in that hardened lumps of adhesive are dispersedly arranged in the central height region (S) of the partition wall.

The application region of the second adhesive (30) is limited to a predetermined dimension (S) in the vertical direction from the height center (M) of the partition wall, and the predetermined dimension is the total height (H The partition wall structure according to claim 10, wherein the partition wall structure is set to 1/4 to 1/6.

The first board piece (17) is made of a cut piece obtained by cutting the board (10) to a half width or less, and the second board piece (18) is a width of the board (10) less than 1/4. The partition wall structure according to claim 10 or 11, wherein the partition wall structure is formed by cutting into pieces.