JP2002213038A - Partitioning wall structure - Google Patents

Partitioning wall structure

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Publication number
JP2002213038A
JP2002213038A JP2001296100A JP2001296100A JP2002213038A JP 2002213038 A JP2002213038 A JP 2002213038A JP 2001296100 A JP2001296100 A JP 2001296100A JP 2001296100 A JP2001296100 A JP 2001296100A JP 2002213038 A JP2002213038 A JP 2002213038A
Authority
JP
Japan
Prior art keywords
board
adhesive
partition wall
piece
interior
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001296100A
Other languages
Japanese (ja)
Other versions
JP4172927B2 (en
Inventor
Nobuo Tsuji
延雄 辻
Yoichi Hosoda
陽一 細田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatani Techno Co Ltd
Original Assignee
Iwatani Techno Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatani Techno Co Ltd filed Critical Iwatani Techno Co Ltd
Priority to JP2001296100A priority Critical patent/JP4172927B2/en
Publication of JP2002213038A publication Critical patent/JP2002213038A/en
Application granted granted Critical
Publication of JP4172927B2 publication Critical patent/JP4172927B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To improve the sound isolating performance of a partitioning wall in a low-frequency band of 125 Hz or below in a lightweight partitioning wall structure by a dry method having a structure fitted with building interior board materials forming a wall face to upper and lower runners. SOLUTION: This partitioning wall structure W by a dry method has the structure fitted with building interior board materials 10 and 12 forming the wall face to upper and lower runners 2 and 3, and it is provided with the lower board 10 and the upper board 12 forming the building interior board materials, a reinforcing board 11 inserted between the boards 10 and 12, and a first inorganic adhesive 20. The reinforcing board 11 is arranged at an interval in the wall core direction so as to form a closed space 7 to diffusively arrange the hardened lumps of the first adhesive. A second inorganic adhesive 30 having the same quality as the first adhesive is applied to the back face of the lower board from the side of the hollow section 6 of a partitioning wall at the corresponding position to the closed space. Hardened lumps of the second adhesive are diffusively arranged in the height center region S of the lower board.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、乾式工法の間仕切
壁構造に関するものであり、より詳細には、低周波数帯
域の騒音に対する遮音性能を向上することができる間仕
切壁構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partition wall structure of a dry construction method, and more particularly to a partition wall structure capable of improving sound insulation performance against low frequency band noise.

【0002】[0002]

【従来の技術】建築物又は工作物の間仕切壁として、石
膏ボード又は珪酸カルシウム板等の建築用内装ボード材
料を鋼製スタッドの間柱に取付けてなる所謂軸組構造の
軽量鉄骨間仕切壁が広く実用に供されている。この形式
の間仕切壁構造においては、鋼製スタッドは、壁芯に沿
って所定間隔を隔てて整列配置され、鋼製スタッドの上
端部及び下端部は、天井ランナ及び床ランナに夫々固定
される。鋼製スタッドの間柱には、建築用内装ボード材
料が固定され、内装ボード材料の壁面が形成される。
2. Description of the Related Art As a partition wall of a building or a work, a so-called light-weight steel-frame partition wall having a so-called frame structure in which a building interior board material such as a gypsum board or a calcium silicate plate is attached to a stud of a steel stud is widely used. Has been offered to. In this type of partition wall structure, steel studs are arranged at predetermined intervals along a wall core, and upper and lower ends of the steel studs are fixed to a ceiling runner and a floor runner, respectively. On the studs of the steel studs, a building interior board material is fixed, and a wall surface of the interior board material is formed.

【0003】他の形式の間仕切壁構造として、間仕切壁
の遮音性能及び施工性等を向上すべく、鋼製スタッドの
間柱を省略したノンスタッド構造又はスタッドレス構造
の間仕切壁が知られている。例えば、特公昭62─97
01号公報に開示された間仕切壁は、天井ランナ及び床
ランナに固定される各壁面の内装ボード材料と、間仕切
壁の中空部に配置された芯材とから略構成される。一種
の間柱として機能する芯材は、無機質系接着剤を介して
ボード材料に接着され、ボード材料と芯材との間に空隙
が形成される。また、他の形式のノンスタッド構造間仕
切壁として、例えば、特開平7−324410号公報及
び特開平9−4096号公報等に開示される如く、上下
方向に延びる補強リブをボード片の積層体等によって予
め内装ボード材料に一体的に形成し、ボード材料を天井
ランナ及び床ランナに取付けるように構成したものが知
られている。
As another type of partition wall structure, a non-stud structure or a studless structure partition wall in which a stud of a steel stud is omitted is known in order to improve the sound insulation performance and workability of the partition wall. For example, Tokiko Sho 62─97
The partition disclosed in Japanese Patent Publication No. 01 is substantially composed of an interior board material of each wall fixed to the ceiling runner and the floor runner, and a core material disposed in a hollow portion of the partition. The core material that functions as a kind of stud is bonded to the board material via an inorganic adhesive, and a gap is formed between the board material and the core material. Further, as another type of non-stud structure partitioning wall, for example, as disclosed in Japanese Patent Application Laid-Open Nos. 7-324410 and 9-4096, reinforcing ribs extending in the vertical direction may be used as a laminate of board pieces or the like. Is formed integrally with an interior board material in advance, and the board material is attached to a ceiling runner and a floor runner.

【0004】本発明者等は、このような乾式工法且つス
タッドレス構造の間仕切壁に関し、下張りボードと上張
りボードとの間に補強板及び接着材塊を介挿した構造の
間仕切壁を開発し、既に実用化している(実公平6−3
3058号公報)。補強板の幅は、下張り及び上張りボ
ードの幅の約1/2に設定され、各補強板は、下張り及
び上張りボードの縦目地を跨ぐように配置される。間隔
を隔てた補強板の間には、閉鎖空間が形成され、下張り
ボードと上張りボードとを接合する多数の接着材塊が閉
鎖空間に分散配置される。このような構造の壁面を上下
ランナの両側に備えた間仕切壁は、比較的高い壁面剛性
を発揮するばかりでなく、図12の線図に示す如く、比
較的良好な遮音性能を発揮する。
The present inventors have developed a partition wall having a dry construction method and a studless structure, in which a reinforcing plate and an adhesive mass are interposed between a lower board and an upper board. Already put into practical use
No. 3058). The width of the reinforcing plate is set to about 1/2 of the width of the lower and upper boards, and each reinforcing plate is arranged so as to straddle the vertical joint of the lower and upper boards. A closed space is formed between the spaced reinforcing plates, and a large number of adhesive masses for joining the lower board and the upper board are dispersedly arranged in the closed space. A partition wall having such a structure on both sides of the upper and lower runners not only exhibits relatively high wall rigidity, but also exhibits relatively good sound insulation performance as shown in the diagram of FIG.

【0005】[0005]

【発明が解決しようとする課題】図12は、この形式の
間仕切壁に関する音響透過損失の実測結果を示す線図で
ある。図12には、間仕切壁の実測値が実線で示される
とともに、現行の遮音基準(遮音性能指定番号:D30
〜D55)が破線で示されている。実測値は、遮音指定
D55の基準線を超える高レベルの遮音性能を全体的に
示しており、現行の遮音基準の下では、D55の遮音性
能を発揮する間仕切壁として認定される。
FIG. 12 is a diagram showing actual measurement results of sound transmission loss for a partition wall of this type. In FIG. 12, the measured values of the partition wall are shown by solid lines, and the current sound insulation standard (sound insulation performance designation number: D30)
To D55) are indicated by broken lines. The actual measurement value indicates a high level of sound insulation performance exceeding the reference line of the sound insulation designation D55 as a whole, and is recognized as a partition wall exhibiting the sound insulation performance of D55 under the current sound insulation standard.

【0006】しかしながら、音響透過損失の実測値は、
遮音性能の評価対象となる周波数帯域、即ち、125H
z以上の周波数帯域では、比較的良好な数値を示すもの
の、125Hz以下の周波数帯域においては、図12に
符号Aで指示するように、比較的急激に低下する傾向が
あり、低周波数帯域の騒音に対する遮音性能の低下が懸
念される。
However, the measured value of the sound transmission loss is
Frequency band to be evaluated for sound insulation performance, that is, 125H
In a frequency band equal to or higher than z, a relatively good numerical value is shown, but in a frequency band equal to or lower than 125 Hz, as indicated by a symbol A in FIG. There is a concern that sound insulation performance may be reduced.

【0007】このような低周波数帯域の騒音は、一般
に、乾式工法の間仕切壁によっては非常に遮音し難い特
性を有し、従来は、鉄筋コンクリート壁等の比較的重質
構造の壁体により遮音していた性質のものであるが、高
層集合住宅や、高層ホテル建築物等の如く、各住戸又は
各客室を乾式工法の軽量間仕切壁で区画せざるを得ない
性質の中高層建築物が近年において多数建設されるに至
り、乾式工法の軽量間仕切壁にあっても、125Hz以
下の低周波数帯域における間仕切壁の遮音性能を向上す
べき必要が生じている。
[0007] Such noise in the low frequency band generally has a characteristic that it is very difficult to prevent sound insulation by a partition wall of a dry method, and conventionally, noise is prevented by a wall having a relatively heavy structure such as a reinforced concrete wall. In recent years, there have been many high-rise buildings, such as high-rise apartment buildings and high-rise hotel buildings, in which each dwelling unit or each guest room has to be divided by lightweight partition walls of dry construction method. As a result of the construction, there is a need to improve the sound insulation performance of the partition wall in a low frequency band of 125 Hz or less even with a lightweight partition wall of a dry method.

【0008】本発明は、かかる事情に鑑みてなされたも
のであり、その目的とするところは、壁面を形成する建
築用内装ボード材料を上下のランナーに取付けた構成を
有する乾式工法の軽量間仕切壁構造において、125H
z以下の低周波数帯域における間仕切壁の遮音性能を向
上することができる間仕切壁構造を提供することにあ
る。
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a dry-type light-weight partition wall having a structure in which a building interior board material forming a wall surface is attached to upper and lower runners. In construction, 125H
An object of the present invention is to provide a partition wall structure capable of improving the sound insulation performance of the partition wall in a low frequency band of z or less.

【0009】[0009]

【課題を解決するための手段及び作用】上記目的を達成
すべく、本発明の間仕切壁構造(W) は、壁面を形成する
建築用内装ボード材料(10,12) を上下のランナー(2,3)
に取付けた構成を有する乾式工法のものであり、間仕切
壁は、建築用内装ボード材料を構成する下張りボード(1
0)及び上張りボード(12)と、該ボード間に介挿された補
強ボード(11)及び第1無機質系接着材(20)とを有する。
補強ボードは、第1接着材の硬化塊を分散配置すべき閉
鎖空間(7) を形成するように壁芯方向に互いに間隔を隔
てて配置される。第1接着材と同質の第2無機質系接着
材(30)が、閉鎖空間に相応する位置において間仕切壁の
中空部(6) 側から前記下張りボードの裏面に塗着され、
第2接着材の硬化塊が、下張りボードの高さ中心領域
(S) に分散配置される。
In order to achieve the above-mentioned object, the partition wall structure (W) of the present invention comprises a building interior board material (10, 12) forming a wall and upper and lower runners (2, 2). 3)
The partition wall is a sub-board (1
0) and an overlay board (12), a reinforcing board (11) and a first inorganic adhesive (20) interposed between the boards.
The reinforcing boards are spaced apart from each other in the direction of the wall core so as to form a closed space (7) in which the cured mass of the first adhesive is to be dispersed. A second inorganic adhesive material (30) of the same quality as the first adhesive material is applied to the back surface of the underlining board from the hollow portion (6) side of the partition wall at a position corresponding to the closed space;
The cured mass of the second adhesive is located in the center area of the height of the underlay board.
(S) is distributed.

【0010】本発明の上記構成によれば、比較的幅狭の
補強ボード(11)が、下張りボード(10)及び上張りボード
(12)の間に介挿され、閉鎖空間(7) が、下張りボード及
び上張りボードの間の画成される。第1接着材(20)の硬
化塊が、閉鎖空間に点在し、第2接着材(30)の硬化塊
が、中空部(6) の側から下張りボードの裏面に付着し、
所定の高さ領域(S) に分散配置される。補強ボード及び
第1接着材硬化塊は、壁面の剛性及び質量を増大し、壁
面の遮音性能を全体的に向上するばかりでなく、壁面の
面密度又は質量分布を変化させ、壁面の共振作用を抑制
して、125Hz以上の周波数帯域の騒音伝播に対する
間仕切壁(W) の遮音性能を向上する。他方、第2接着材
(30)の硬化塊は、閉鎖空間の裏側において下張りボード
の中間高さ領域(S) に付着し、下張りボードの面密度又
は質量分布を中間高さ領域において局所的に増大する。
これにより、閉鎖空間部分における共振作用が抑制さ
れ、125Hz以下の周波数帯域の音響透過損失が向上
し、低周波数帯域の騒音に対する遮音性能の低下が、効
果的に防止される。
According to the above configuration of the present invention, the reinforcing board (11) having a relatively small width is provided with the lower board (10) and the upper board.
Interposed between (12), an enclosed space (7) is defined between the baseboard and the topboard. The cured mass of the first adhesive material (20) is scattered in the enclosed space, and the cured mass of the second adhesive material (30) adheres to the back surface of the underlining board from the side of the hollow portion (6),
They are distributed in a predetermined height area (S). The reinforcing board and the first adhesive cured mass increase the rigidity and mass of the wall surface, not only improve the sound insulation performance of the wall surface as a whole, but also change the surface density or the mass distribution of the wall surface and reduce the resonance effect of the wall surface. The noise insulation performance of the partition wall (W) against noise propagation in the frequency band of 125 Hz or more is suppressed. On the other hand, the second adhesive
The hardened mass of (30) adheres to the mid-height region (S) of the underlaying board on the back side of the closed space, and locally increases the areal density or mass distribution of the underlaying board in the mid-height region.
As a result, the resonance effect in the closed space portion is suppressed, the sound transmission loss in the frequency band of 125 Hz or less is improved, and a decrease in the sound insulation performance with respect to the noise in the low frequency band is effectively prevented.

【0011】他の観点より、本発明に係る間仕切壁構造
(W) は、壁芯方向に間隔を隔てて配置れさた狭小幅の第
1ボード片(17)と、第1ボード片よりも小さい幅を有す
る第2ボード片(18)と、第2ボード片と一体化した建築
用内装ボード材料(10,12) とを有する。第2ボード片
は、第1ボード片の表面側半部に固定され、無機質系接
着材(20)を分散配置可能な開放空間(8) が、第1ボード
片の表面側残部と内装ボード材料との間に形成される。
接着材の硬化塊は、第1ボード片及び内装ボード材料を
相互接着する。第1ボード片は、内装ボード材料の半分
以下の幅を有し、第2ボード片は、内装ボード材料の1
/4以下の幅を有する。第1及び第2ボード片(17,18)
及び内装ボード材料(10,12) は、接着材(20)の硬化塊を
介挿可能な開放空間(8) を形成し、内装ボード材料が形
成する壁面の剛性及び質量を増大し、壁面の遮音性能を
全体的に向上するとともに、壁面の面密度を変化させ、
各材料のコインシデンス効果の相違により、壁面の共振
現象を抑制し、125Hz以上の周波数帯域の騒音伝播
に対する間仕切壁(W) の遮音性能を効果的に向上する。
また、接着材硬化塊(20)を介挿した開放空間(8) は、片
側が中空部(6) に開放しており、125Hz以下の低周
波数帯域の共振効果による遮音性能の低下を効果的に防
止する。
[0011] From another viewpoint, the partition wall structure according to the present invention.
(W) is a first board piece (17) having a small width and spaced apart in the wall core direction, a second board piece (18) having a width smaller than the first board piece, and a second board piece (18). A building interior board material (10, 12) integrated with the board piece. The second board piece is fixed to the front surface half of the first board piece, and an open space (8) in which the inorganic adhesive (20) can be dispersedly arranged is provided with the remaining surface of the first board piece and the interior board material. Is formed between
The cured mass of adhesive bonds the first board piece and the interior board material together. The first board piece has a width equal to or less than half of the interior board material, and the second board piece has one width of the interior board material.
/ 4 or less. First and second board pieces (17, 18)
And the interior board material (10, 12) forms an open space (8) through which the cured mass of the adhesive (20) can be inserted, increasing the rigidity and mass of the wall surface formed by the interior board material, While improving the sound insulation performance as a whole, changing the surface density of the wall,
Due to the difference in the coincidence effect of each material, the resonance phenomenon of the wall surface is suppressed, and the sound insulation performance of the partition wall (W) against noise propagation in a frequency band of 125 Hz or more is effectively improved.
The open space (8) with the cured adhesive mass (20) interposed is open on one side to the hollow part (6), effectively reducing the sound insulation performance due to the resonance effect in the low frequency band of 125 Hz or less. To prevent.

【0012】更に他の観点より、本発明の間仕切壁構造
(W) では、無機質系接着材(30)が、第1ボード片(17)の
間の領域において間仕切壁の中空部(6) 側から内装ボー
ド材料(10,12) の裏面に塗着され、接着材(30)の硬化塊
が、内装ボード材料の高さ中心領域に分散配置される。
接着材の塗着領域は、間仕切壁の高さ中心(M) から上下
方向に所定寸法(S) の範囲内に制限され、寸法(S) は、
内装ボード材料の全高(H) の1/4〜1/6に設定され
る。このような構成によれば、内装ボード材料の中間高
さ領域に付着した接着材硬化塊(30)は、内装ボード材料
の質量分布を中間高さ領域において局所的に増大し、低
周波数帯域における壁面の共振効果を有効に規制する。
このため、125Hz以下の周波数帯域の音響透過損失
が向上するので、低周波数帯域における間仕切壁の遮音
性能低下は、効果的に防止される。
From still another viewpoint, the partition wall structure of the present invention
In (W), an inorganic adhesive (30) is applied to the back surface of the interior board material (10, 12) from the hollow portion (6) side of the partition wall in the area between the first board pieces (17). The hardened mass of the adhesive (30) is dispersed and arranged in the height center region of the interior board material.
The application area of the adhesive is limited within a predetermined dimension (S) in a vertical direction from the height center (M) of the partition wall, and the dimension (S) is
It is set to 1/4 to 1/6 of the total height (H) of the interior board material. According to such a configuration, the cured adhesive mass (30) attached to the intermediate height region of the interior board material locally increases the mass distribution of the interior board material in the intermediate height region, and in the low frequency band. Effectively regulate the wall resonance effect.
For this reason, the sound transmission loss in the frequency band of 125 Hz or less is improved, so that a decrease in the sound insulation performance of the partition wall in the low frequency band is effectively prevented.

【0013】[0013]

【発明の実施の形態】本発明の好適な実施形態によれ
ば、高さ中心領域の無機質系接着材(30)は、2乃至3列
の列をなして上下方向に配列される。
According to a preferred embodiment of the present invention, the inorganic adhesives (30) in the center region of the height are vertically arranged in two or three rows.

【0014】本発明の更に好適な実施形態において、下
張りボード(10)及び上張りボード(12)は、実質的に同一
の幅を有し、上記補強ボード(11)の幅は、下張り及び上
張りボードの幅の半分に設定され、下張り及び上張りボ
ードの縦目地は、補強ボード上に位置決めされる。
In a further preferred embodiment of the invention, the lower board (10) and the upper board (12) have substantially the same width, the width of said reinforcing board (11) being lower and upper. It is set to half the width of the upholstery board, and the vertical joints of the lower and upper boards are positioned on the reinforcement board.

【0015】本発明の他の好適な実施形態によれば、上
記第1ボード片(17)は、内装ボード材料(10,12) を半分
以下の幅に裁断した裁断片からなり、上記第2ボード片
(18)は、内装ボード材料を1/4以下の幅に裁断した裁
断片からなる。
According to another preferred embodiment of the present invention, the first board piece (17) is made of a cut piece obtained by cutting the interior board material (10, 12) into a half or less width. Board pieces
(18) consists of a cut piece obtained by cutting the interior board material to a width of 1/4 or less.

【0016】好ましくは、上記内装ボード材料(10,12)
、補強ボード(11)、第1ボード片(17)及び第2ボード
片(18)は、板厚12.5〜15mmの石膏ボード又はその
裁断片からなり、無機質系接着材(20,30) は、石膏粉
末、軽量骨材及び接着剤を含む接着材原料を水で混練し
た石膏系接着材からなる。なお、上記石膏系接着材とし
て、商品名GLボンド又はダイレクトボンド等を好適に
使用し得る。所望により、上記間仕切壁の中空部(6) に
は、グラスウールマット、グラスウール成形板又はロッ
クウール吸音材等の吸音材(5) が挿入又は充填される。
Preferably, the interior board material (10, 12)
The reinforcing board (11), the first board piece (17) and the second board piece (18) are made of a gypsum board having a thickness of 12.5 to 15 mm or a piece thereof, and are made of an inorganic adhesive (20, 30). Consists of a gypsum-based adhesive obtained by kneading an adhesive material including gypsum powder, lightweight aggregate and an adhesive with water. As the gypsum-based adhesive, GL bond or direct bond (trade name) can be suitably used. If desired, a sound absorbing material (5) such as a glass wool mat, a glass wool molded plate or a rock wool sound absorbing material is inserted or filled into the hollow portion (6) of the partition wall.

【0017】[0017]

【実施例】以下、添付図面を参照して、本発明の好適な
実施例について詳細に説明する。図1は、本発明の第1
実施例に係る間仕切壁の縦断面図であり、図2は、図1
に示す間仕切壁のA−A線断面図である。また、図3
は、図1及び図2に示す間仕切壁の構造を概略的に示す
分解斜視図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a longitudinal sectional view of a partition wall according to the embodiment, and FIG.
3 is a sectional view taken along line AA of the partition wall shown in FIG. FIG.
FIG. 3 is an exploded perspective view schematically showing a structure of a partition wall shown in FIGS. 1 and 2.

【0018】図1乃至図3に示す間仕切壁Wは、軽量鉄
骨製の床ランナー2及び天井ランナー3を備える。床ラ
ンナー2は、コンクリートスラブ又は床モルタル下地等
の床基盤F上に配置され、実質的に水平且つ壁芯方向に
床基盤F上に延在する。床ランナー2は、900mm程度
の間隔を隔てて配置された打込みピン等の固定具(図示
せず)によって床基盤Fに固定される。天井ランナー3
は、溶接、タッピング螺子又はアンカー等の固定手段
(図示せず)によって軽量鉄骨天井下地材又は上階コン
クリートスラブ等の天井下地Cに固定される。天井ラン
ナー3は、床ランナー2と対向して実質的に水平且つ壁
芯方向に延在する。
The partition wall W shown in FIGS. 1 to 3 includes a floor runner 2 and a ceiling runner 3 made of lightweight steel frames. The floor runner 2 is disposed on a floor base F such as a concrete slab or a floor mortar base, and extends on the floor base F in a substantially horizontal and wall-center direction. The floor runner 2 is fixed to the floor base F by a fixing tool (not shown) such as a driving pin arranged at an interval of about 900 mm. Ceiling runner 3
Is fixed to a ceiling substrate C such as a lightweight steel ceiling substrate or an upper concrete slab by fixing means (not shown) such as welding, tapping screws or anchors. The ceiling runner 3 extends substantially horizontally and in the direction of the center of the wall opposite to the floor runner 2.

【0019】下張りボード10の上端部及び下端部が、
タッピング螺子等の係止具15によって床ランナー2及
び天井ランナー3に固定され、隣り合う下張りボード1
0の側縁部同士が、ステープル等の係止具(図示せず)
によって相互接合され、連接する。中空部6が、間仕切
壁Wの内部に画成され、断熱・吸音材料5が、中空部6
内に配置される。下張りボード10は、例えば、幅60
0〜1200mm及び板厚12.5〜15mmの石膏ボード
からなり、断熱・吸音材料5は、例えば、厚さ25〜5
0mm程度のグラスウールマット又はグラスウール成形板
からなる。
The upper end and lower end of the underlay board 10
The underboard board 1 which is fixed to the floor runner 2 and the ceiling runner 3 by a locking tool 15 such as a tapping screw,
0 side edge parts are locking tools such as staples (not shown)
Are interconnected and connected by A hollow portion 6 is defined inside the partition wall W, and the heat insulating / sound absorbing material 5 is
Is placed within. The underlining board 10 has, for example, a width of 60.
It is made of a gypsum board having a thickness of 0 to 1200 mm and a thickness of 12.5 to 15 mm.
It consists of a glass wool mat or glass wool molded plate of about 0 mm.

【0020】酢酸ビニール系接着剤を片面(裏面)に塗
布した補強ボード11が、ステープル等の係止具(図示
せず)により下張りボード10上に留付けられる。補強
ボード11は、下張りボード10と同質の石膏ボードを
半分の幅に裁断した石膏ボード裁断片からなり、例え
ば、幅300〜600mm及び板厚12.5〜15mmの寸
法を有し、下張りボード10と実質的に同一の高さ寸法
を備える。補強ボード11は、その幅方向中央部を下張
りボード10の継目(縦目地)と概ね整合するように位
置決めされ、下張りボード10の縦目地を跨ぐように下
張りボード10上に一体的に積層される。
A reinforcing board 11 coated with a vinyl acetate-based adhesive on one side (back side) is fastened to the underlaying board 10 by a fastener (not shown) such as a staple. The reinforcement board 11 is a gypsum board cut piece obtained by cutting a gypsum board of the same quality as the underlay board 10 into a half width, and has dimensions of, for example, 300 to 600 mm in width and 12.5 to 15 mm in thickness. And substantially the same height dimension. The reinforcing board 11 is positioned so that its center in the width direction is substantially aligned with the seam (vertical joint) of the lower board 10, and is integrally laminated on the lower board 10 so as to straddle the vertical joint of the lower board 10. .

【0021】石膏系接着材20が、団子状に下張りボー
ド10上に点付けされる。石膏系接着材20は、石膏粉
末、軽量骨材及び接着剤を含む接着材原料を水で混練し
た粘性材料からなる。石膏系接着材20の各団子状物
は、正面視約50mm×50mm程度の寸法を有し、約25
〜30mm程度の盛付け高さを有する。石膏系接着材20
は、上下方向に150〜300mm程度の相互間隔を隔て
て下張りボード10上に2列乃至3列(本例では2列)
に配列される。
A gypsum-based adhesive 20 is spotted on the underlay board 10 in a dumpling shape. The gypsum-based adhesive 20 is made of a viscous material obtained by kneading an adhesive material including gypsum powder, lightweight aggregate and an adhesive with water. Each dumpling of the gypsum-based adhesive 20 has a size of about 50 mm × 50 mm in a front view, and has a size of about 25 mm.
It has a height of about 30 mm. Gypsum adhesive 20
Are two to three rows (two rows in this example) on the underlay board 10 with a mutual interval of about 150 to 300 mm in the vertical direction.
It is arranged in.

【0022】酢酸ビニール系接着剤等の接着剤を裏面に
塗布した上張りボード12が、ステープル等の係止具に
より補強ボード11上に留付けられ、補強ボード11に
積層される。上張りボード12は、例えば、幅600〜
1200mm及び板厚12.5〜15mmの石膏ボードから
なり、上張りボード12の表面には、クロス材料又は内
装仕上げ塗料等の内装仕上材13が仕上げ張りないし塗
装される。所望により、内装仕上材13を片面(表面)
に予め施した化粧石膏ボード等を上張りボード12とし
て使用しても良い。
An overlay board 12 having a back surface coated with an adhesive such as a vinyl acetate adhesive is fastened to the reinforcing board 11 by a fastener such as staples and laminated on the reinforcing board 11. The overlay board 12 has, for example, a width of 600 to
It is made of a gypsum board having a thickness of 1200 mm and a thickness of 12.5 to 15 mm, and an interior finishing material 13 such as a cloth material or an interior finishing paint is finish-finished or painted on the surface of the overlay board 12. If desired, finish the interior finish 13 on one side (front)
May be used as the overlay board 12.

【0023】上張りボード12の接合部(縦目地)は、
概ね補強ボード11の幅方向中央部に位置決めされ、上
張りボード12の中央部裏面は、石膏系接着材20を偏
平に押潰しながら石膏系接着材20に接着する。下張り
ボード10及び上張りボード12は、石膏系接着材20
の乾燥硬化により一体化する。下張りボード10及び上
張りボード12の間には、閉鎖空間7が画成され、偏平
化し且つ硬化した石膏系接着材20は、閉鎖空間7に点
在する比較的高比重の接着材塊を形成する。
The joints (vertical joints) of the upper board 12 are as follows:
It is positioned substantially at the center in the width direction of the reinforcing board 11, and the back surface of the central portion of the overlay board 12 is bonded to the gypsum-based adhesive 20 while crushing the gypsum-based adhesive 20 flat. The lower board 10 and the upper board 12 are made of a gypsum-based adhesive 20.
By drying and curing. A closed space 7 is defined between the lower board 10 and the upper board 12, and the flattened and hardened gypsum-based adhesive 20 forms a relatively high specific gravity adhesive mass scattered in the closed space 7. I do.

【0024】石膏系接着材20と同質の石膏系接着材3
0が、中空部16の側から団子状に下張りボード10に
点付けされる。石膏系接着材30の各団子状物は、約2
5〜50mm程度の盛付け高さ及び約50mm×50mm程度
の正面視寸法を有し、上下方向に100〜300mm程度
の相互間隔を隔てて下張りボード10上に2乃至3列
(本例では3列)に配列される。石膏系接着材30の塗
着領域は、下張りボード10の高さ中心Mから寸法Sの
上下対称範囲内に限定され、寸法Sは、間仕切壁Wの全
高Hの1/4〜1/6に設定される。
Gypsum adhesive 3 of the same quality as gypsum adhesive 20
0 is spotted on the underlay board 10 in a dumpling shape from the side of the hollow portion 16. Each dumpling of the gypsum-based adhesive 30 is about 2
It has a mounting height of about 5 to 50 mm and a front view dimension of about 50 mm × 50 mm, and has two to three rows (3 in this example) on the underlaying board 10 with an interval of about 100 to 300 mm in the vertical direction. Column). The application area of the gypsum-based adhesive 30 is limited to a vertically symmetric range of the dimension S from the height center M of the underlay board 10, and the dimension S is set to 1/4 to 1/6 of the total height H of the partition wall W. Is set.

【0025】このように構成された間仕切壁Wによれ
ば、比較的幅狭の補強ボード11が、下張りボード10
及び上張りボード12の間に介挿され、閉鎖空間7が、
下張りボード10及び上張りボード12の間の形成され
る。接着材20の硬化塊が、閉鎖空間7に点在し、接着
材30の硬化塊が、下張りボード10の中空部6側に付
着し、所定の高さ領域Sに点在する。補強ボード11及
び接着材20の硬化塊は、ボード10、12が形成する
壁面の剛性及び重量を増大し、壁面の遮音性能を全体的
に向上するとともに、壁面の面密度を変化させ、一般的
な周波数帯域における壁面の共振作用を抑制し、125
Hz以上の周波数帯域の騒音を有効に遮音するように働
く。他方、接着材30の硬化塊は、閉鎖空間7の裏側に
おいて下張りボード10の中間高さ領域Sに付着し、下
張りボード10の重量分布を中間高さ領域において増大
する。
According to the partition wall W configured as described above, the reinforcing board 11 having a relatively small width can be replaced with the underlining board 10.
And between the upper board 12 and the closed space 7
It is formed between the lower board 10 and the upper board 12. The hardened lumps of the adhesive 20 are scattered in the closed space 7, and the hardened lumps of the adhesive 30 are attached to the hollow portion 6 side of the underlay board 10 and are scattered in a predetermined height region S. The hardened mass of the reinforcing board 11 and the adhesive 20 increases the rigidity and weight of the wall surface formed by the boards 10 and 12, improves the sound insulation performance of the wall surface as a whole, and changes the surface density of the wall surface. The resonance effect of the wall surface in a wide frequency band,
It works to effectively shield noise in the frequency band of not less than Hz. On the other hand, the hardened mass of the adhesive 30 adheres to the intermediate height region S of the underlay board 10 on the back side of the closed space 7 and increases the weight distribution of the underboard 10 in the intermediate height region.

【0026】間仕切壁Wの音響透過損失を実測した結
果、図12に破線Bで示す如く、125Hz以下の周波
数帯域の音響透過損失が向上し、低周波数帯域の騒音に
対する遮音性能の低下が効果的に防止されると判明し
た。これは、従来構成のものでは、125Hz以下の周
波数帯域において共振現象が生じていたのに対し、閉鎖
空間7の裏側に位置する接着材30の硬化塊が、閉鎖空
間7部分に位置する下張りボード10の領域において、
低周波数帯域の共振効果を有効に規制したことによると
考えられる。
As a result of the actual measurement of the sound transmission loss of the partition wall W, as shown by the broken line B in FIG. 12, the sound transmission loss in the frequency band of 125 Hz or less is improved, and the sound insulation performance against the noise in the low frequency band is effectively reduced. Turned out to be prevented. This is because, in the conventional configuration, the resonance phenomenon occurs in a frequency band of 125 Hz or less, whereas the hardened mass of the adhesive 30 located on the back side of the closed space 7 has In the area of 10,
This is probably because the resonance effect in the low frequency band was effectively regulated.

【0027】図4乃至図6は、本発明の第2実施例に係
る間仕切壁の縦断面図、B−B線断面図及び分解斜視図
である。図4乃至図6において、上記第1実施例の各構
成要素と実質的に同一ないし均等な構成要素について
は、同一の参照符号が付されている。
FIGS. 4 to 6 are a vertical sectional view, a sectional view taken along line BB and an exploded perspective view of a partition wall according to a second embodiment of the present invention. 4 to 6, components that are substantially the same as or equivalent to the components of the first embodiment are denoted by the same reference numerals.

【0028】本実施例の間仕切壁Wにおいては、狭小幅
の第1ボード片17が床ランナー2及び天井ランナー3
に取付けられる。第1ボード片17は、例えば、幅12
0〜400mmの幅に裁断した帯板形態の石膏ボード裁断
片からなり、12.5〜15mm程度の板厚を有する。第
1ボード片17の上端部及び下端部は、係止具15によ
って床ランナー2及び天井ランナー3に固定され、上下
のランナー2、3の間に垂直に延在する。
In the partition wall W of this embodiment, the narrow first board pieces 17 are connected to the floor runner 2 and the ceiling runner 3.
Attached to The first board piece 17 has, for example, a width 12
It is a strip of gypsum board in the form of a strip cut to a width of 0 to 400 mm and has a thickness of about 12.5 to 15 mm. The upper end and the lower end of the first board piece 17 are fixed to the floor runner 2 and the ceiling runner 3 by the locking member 15 and extend vertically between the upper and lower runners 2, 3.

【0029】第2ボード片18が、第1ボード片17の
外側に固定される。第2ボード片18は、例えば、幅6
0〜200mmの幅に裁断した帯板形態の石膏ボード裁断
片からなり、第1ボード片17の概ね半分の幅を有す
る。酢酸ビニール系接着剤を片面(裏面)に塗布した第
2ボード片18が、ステープル等の係止具により第1ボ
ード片17に留付けられ、第2ボード片18は、第1ボ
ード片17の半部に一体的に接着される。
The second board piece 18 is fixed to the outside of the first board piece 17. The second board piece 18 has, for example, a width of 6
It is made of a strip of gypsum board in the form of a strip cut to a width of 0 to 200 mm, and has a width approximately half that of the first board piece 17. A second board piece 18 coated with a vinyl acetate-based adhesive on one side (back side) is fastened to the first board piece 17 by a fastener such as a staple, and the second board piece 18 is formed of the first board piece 17. Glued integrally to the half.

【0030】第1ボード片17の残部には、上記第1実
施例と同様の石膏系接着材20が上下方向に150〜3
00mm程度の相互間隔を隔てて一列に点付けされる。石
膏系接着材20の各団子状物は、正面視約50mm×50
mm程度の寸法を有し、25〜30mm程度の盛付け高さを
有する。
On the remaining portion of the first board piece 17, a gypsum-based adhesive material 20 similar to that of the first embodiment is vertically arranged by 150 to 3 times.
They are dotted in a line with a mutual interval of about 00 mm. Each dumpling of the gypsum-based adhesive 20 is approximately 50 mm × 50 in front view.
It has a dimension of about mm and a laying height of about 25 to 30 mm.

【0031】下張りボード10が、第2ボード片18に
固定される。下張りボード10は、例えば、幅600〜
1200mm及び板厚12.5〜15mmの石膏ボードから
なる。酢酸ビニール系接着剤等の接着剤を裏面に塗布し
た下張りボード10は、ステープル等の係止具により第
2ボード片18に留付けられる。下張りボード10の接
合部(縦継目)は、第2ボード片18の幅方向中央部に
位置決めされる。下張りボード10の裏面は、石膏系接
着材20を偏平に押潰しながら石膏系接着材20に接着
する。下張りボード10及び第1ボード片17は、石膏
系接着材20の乾燥硬化により一体化する。第1ボード
片17及び下張りボード10の間には、片側が開放した
開放空間8が形成され、偏平化し且つ硬化した石膏系接
着材20は、開放空間8に点在する比較的高比重の接着
材塊を形成する。
The underlaying board 10 is fixed to the second board piece 18. The underlining board 10 has, for example, a width of 600 to
It consists of a gypsum board with a thickness of 1200 mm and a thickness of 12.5 to 15 mm. The underlining board 10 having an adhesive such as a vinyl acetate adhesive applied to the back surface is fastened to the second board piece 18 by a fastener such as staples. The joint (vertical joint) of the lower board 10 is positioned at the center in the width direction of the second board piece 18. The back surface of the underlining board 10 adheres to the gypsum-based adhesive 20 while crushing the gypsum-based adhesive 20 flat. The underlay board 10 and the first board piece 17 are integrated by drying and curing the gypsum-based adhesive 20. An open space 8 having an open side is formed between the first board piece 17 and the underlay board 10, and the flattened and hardened gypsum-based adhesive 20 is bonded to the relatively high specific gravity, which is scattered in the open space 8. Form a mass.

【0032】酢酸ビニール系接着剤等の接着剤を裏面に
塗布した上張りボード12が、ステープル等の係止具に
より下張りボード10 上に留付けられ、下張りボード1
0上に積層される。上張りボード12 は、例えば、幅6
00〜1200mm及び板厚12.5〜15mmの石膏ボー
ドからなる。上張りボード12の表面には、クロス材料
又は内装仕上げ塗料等の内装仕上材13が施工される。
所望により、内装仕上13を片面(表面)に予め施した
化粧石膏ボード等を上張りボード12として使用しても
良い。
An upper board 12 having an adhesive such as a vinyl acetate adhesive applied to the back surface is fastened to the lower board 10 by a fastener such as staples.
0. The overlay board 12 has, for example, a width of 6
It consists of a gypsum board with a thickness of 00 to 1200 mm and a thickness of 12.5 to 15 mm. An interior finishing material 13 such as a cloth material or interior finishing paint is applied to the surface of the overlay board 12.
If desired, a decorative gypsum board or the like in which the interior finish 13 has been previously applied to one surface (surface) may be used as the overlay board 12.

【0033】石膏系接着材20と同質の石膏系接着材3
0が、中空部6の側から下張りボード12の裏面に団子
状に点付けされる。石膏系接着材30の各団子状物は、
約25〜50mm程度の盛付け高さ及び約50mm×50mm
程度の正面視寸法を有し、上下方向に100〜300mm
程度の相互間隔を隔てて下張りボード10上に2乃至3
列(本例では2列)に配列される。石膏系接着材30の
塗着領域は、下張りボード10の高さ中心Mから寸法S
の上下対称範囲内に制限され、寸法Sは、間仕切壁Wの
全高Hの1/4〜1/6に設定される。
Gypsum adhesive 3 of the same quality as gypsum adhesive 20
0 is spotted in a dumpling shape on the back surface of the underlining board 12 from the side of the hollow portion 6. Each dumpling of the gypsum-based adhesive 30 is
About 25-50mm height and about 50mm x 50mm
With a frontal dimension of about 100 to 300 mm in the vertical direction
2 to 3 on the underlaying board 10 at a distance from each other
They are arranged in columns (two columns in this example). The area where the gypsum-based adhesive 30 is applied is a size S from the height center M of the underlay board 10.
And the dimension S is set to 1 / to 6 of the total height H of the partition wall W.

【0034】このように構成された間仕切壁Wによれ
ば、第1ボード片17、第2ボード片18及び下張りボ
ード10は、接着材20の硬化塊を介挿可能な開放空間
8を形成し、接着材30の硬化塊が、第1ボード片17
に位置する下張りボード10の中空部側面に付着し、所
定の高さ範囲Sに分散配置される。第1ボード片17、
第2ボード片18及び接着材20の硬化塊は、ボード1
0、12が形成する壁面の剛性及び質量を増大し、壁面
の遮音性能を全体的に向上するとともに、壁面の面密度
を変化させ、一般的な周波数帯域における壁面の共振現
象を抑制し、125Hz以上の周波数帯域の騒音を有効
に遮音する。また、接着材20の硬化塊を介挿した開放
空間8は、片側が中空部6に開放しており、これによ
り、低周波数帯域の共振作用を防止する。更に、接着材
30の硬化塊は、開放空間8の裏側に位置する下張りボ
ード10の中間高さ領域Sに付着し、下張りボード10
の質量分布を中間高さ領域Sにおいて増大し、低周波数
帯域の共振作用を有効に規制する。このため、本例の間
仕切壁Wも又、図12に破線Bで示す如く、125Hz
以下の周波数帯域の音響透過損失を向上し、低周波数帯
域の騒音に対する間仕切壁Wの遮音性能低下を効果的に
防止する。
According to the partition wall W configured as described above, the first board piece 17, the second board piece 18 and the underlay board 10 form the open space 8 through which the cured mass of the adhesive 20 can be inserted. , The cured mass of the adhesive 30 is
Is attached to the side surface of the hollow portion of the underlaying board 10 located at a predetermined height range S, and is dispersed in a predetermined height range S. First board piece 17,
The hardened mass of the second board piece 18 and the adhesive 20
In addition to increasing the rigidity and mass of the wall formed by 0 and 12 and improving the sound insulation performance of the wall as a whole, changing the surface density of the wall, suppressing the resonance phenomenon of the wall in a general frequency band, 125 Hz Noise in the above frequency bands is effectively shielded. In addition, the open space 8 in which the cured mass of the adhesive 20 is interposed has one side open to the hollow portion 6, thereby preventing a resonance operation in a low frequency band. Further, the hardened mass of the adhesive 30 adheres to the intermediate height region S of the underlay board 10 located on the back side of the open space 8, and
Is increased in the intermediate height region S, and the resonance action in the low frequency band is effectively regulated. For this reason, the partition wall W of the present example also has a frequency of 125 Hz as shown by the broken line B in FIG.
The sound transmission loss in the following frequency bands is improved, and the sound insulation performance of the partition wall W is effectively prevented from lowering against noise in the low frequency band.

【0035】図7及び図8は、本発明の第3実施例に係
る間仕切壁の縦断面図、C−C線断面図及び部分破断斜
視図である。図7及び図8において、上記第1及び第2
実施例の各構成要素と実質的に同一ないし均等な構成要
素については、同一の参照符号が付されている。
7 and 8 are a vertical sectional view, a sectional view taken along the line CC, and a partially cutaway perspective view of a partition wall according to a third embodiment of the present invention. 7 and FIG. 8, the first and second
Components that are substantially the same as or equivalent to the components of the embodiment are denoted by the same reference numerals.

【0036】本実施例の間仕切壁構造Wにおいては、下
張りボード10が、係止具15によって床ランナー2及
び天井ランナー3に取付けられ、上張りボード12が、
接着剤及び係止具によって下張りボード10 の室内側に
上張りされる。上張りボード12の室内側面には、内装
仕上材13が更に施工される。内装仕上材13は、石膏
ボード又は化粧石膏ボード等のボード建材からなる。内
装仕上材13として、クロス材料又は内装仕上げ塗料等
を使用しても良い。
In the partition wall structure W of the present embodiment, the lower board 10 is attached to the floor runner 2 and the ceiling runner 3 by the locking member 15, and the upper board 12 is
It is overlaid on the indoor side of the underlaying board 10 by an adhesive and a fastener. An interior finishing material 13 is further provided on the indoor side surface of the overlay board 12. The interior finishing material 13 is made of a board building material such as a gypsum board or a decorative gypsum board. As the interior finish 13, a cloth material, interior finish paint, or the like may be used.

【0037】石膏系接着材20が、上下方向に150〜
300mm程度の相互間隔を隔てて下張りボード10の裏
面(間仕切壁Wの内側面)に一列に点付けされるととも
に、帯状の第2ボード片18が、下張りボード10の内
側面に固定される。第2ボード片18の概ね2倍の幅を
有する帯状の第1ボード片17が、ステープル等の係止
具及び接着剤により第1ボード片18の内側面に留付け
られる。第1ボード片17の半部は、第2ボード片18
に一体的に接着し、第2ボード片18の他の半部は、石
膏系接着材20を偏平に押潰しながら石膏系接着材20
に接着する。石膏系接着材20の乾燥硬化により、下張
りボード10及び第1ボード片17は一体化する。第1
ボード片17及び下張りボード10の間には、片側が開
放した開放空間8が形成され、偏平化し且つ硬化した石
膏系接着材20は、開放空間8に点在する比較的高比重
の接着材塊を形成する。
When the gypsum-based adhesive material 20 is vertically
On the back surface of the underboard board 10 (the inner surface of the partition wall W), the second board piece 18 is fixed to the inner surface of the underboard board 10 while being dotted in a line on the back surface (the inner surface of the partition wall W) with a mutual interval of about 300 mm. A strip-shaped first board piece 17 having a width approximately twice that of the second board piece 18 is fastened to the inner surface of the first board piece 18 by a fastener such as staples and an adhesive. The half of the first board piece 17 is
And the other half of the second board piece 18 crushes the gypsum-based adhesive 20 in a flat manner.
Glue to By drying and curing the gypsum-based adhesive 20, the underlaying board 10 and the first board piece 17 are integrated. First
An open space 8 having one side open is formed between the board piece 17 and the underlay board 10, and the flattened and hardened gypsum-based adhesive material 20 is formed of a relatively high specific gravity adhesive mass scattered in the open space 8. To form

【0038】第1及び第2ボード片17、18は、下張
りボード10の幅L1=910mmであるとき、L2=1
50〜760mm程度に設定された所定間隔を壁芯方向に
隔てて配置される。第3ボード片91が、ボード片1
7、18の中間位置において、下張りボード10の内側
面に固定され、補強金物9が、ビス等の係止具92によ
って第3ボード片91に固定される。
When the width L1 of the underlaying board 10 is 910 mm, the first and second board pieces 17 and 18 have L2 = 1.
They are arranged at predetermined intervals set to about 50 to 760 mm in the direction of the center of the wall. The third board piece 91 is the board piece 1
At an intermediate position between 7 and 18, the reinforcing metal 9 is fixed to the inner side surface of the underlaying board 10, and the reinforcing metal 9 is fixed to the third board piece 91 by a fastener 92 such as a screw.

【0039】ボード片17、18、91は、石膏ボード
等のボード建材の裁断片からなり、10〜15mm程度の
板厚を有する。補強金物9は、20〜75mm程度の幅及
び奥行を有する軽量鉄骨部材等からなる。ボード片1
7、18、91及び補強金物9の下端及び上端は、図8
に示す如く、床F及び天井下地Cから所定距離Eを隔て
た位置に位置決めされ、距離Eは、50〜150mmの範
囲、例えば、75mmに設定される。
The board pieces 17, 18, 91 are made of a piece of board building material such as gypsum board and have a thickness of about 10 to 15 mm. The reinforcing metal member 9 is made of a lightweight steel member having a width and a depth of about 20 to 75 mm. Board piece 1
7, 18, 91 and the lower and upper ends of the reinforcing hardware 9 are shown in FIG.
As shown in the figure, the position is set at a position separated by a predetermined distance E from the floor F and the ceiling base C, and the distance E is set in a range of 50 to 150 mm, for example, 75 mm.

【0040】本実施例の間仕切壁構造Wによれば、ボー
ド片17、18及び下張りボード10は、接着材20の
硬化塊を介挿可能な開放空間8を形成し、補強金物9及
びボード片91が、壁芯方向に間隔を隔てた開放空間8
の間に配置される。ボード片17、18及び接着材20
の硬化塊は、ボード10、12が形成する壁面の剛性及
び質量を増大し、壁面の遮音性能を全体的に向上すると
ともに、壁面の面密度を変化させ、一般的な周波数帯域
における壁面の共振現象を抑制し、125Hz以上の周
波数帯域の騒音を有効に遮音する。また、接着材20の
硬化塊を介挿した開放空間8は、片側が中空部6に開放
しており、これにより、低周波数帯域の共振作用を防止
する。更に、補強金物9及びボード片91は、開放空間
8の間の領域において、下張りボード10の質量を局所
的に増大し、低周波数帯域の共振作用を有効に規制す
る。
According to the partition wall structure W of this embodiment, the board pieces 17 and 18 and the underlay board 10 form an open space 8 through which a cured mass of the adhesive 20 can be inserted, and the reinforcing metal 9 and the board piece 91 is an open space 8 spaced apart in the direction of the wall center.
Placed between. Board pieces 17, 18 and adhesive 20
The hardened mass increases the rigidity and mass of the wall formed by the boards 10 and 12, improves the sound insulation performance of the wall as a whole, changes the surface density of the wall, and resonates the wall in a general frequency band. The phenomenon is suppressed, and noise in a frequency band of 125 Hz or more is effectively shielded. In addition, the open space 8 in which the cured mass of the adhesive 20 is interposed has one side open to the hollow portion 6, thereby preventing a resonance operation in a low frequency band. Furthermore, the reinforcing metal 9 and the board piece 91 locally increase the mass of the underlay board 10 in the region between the open spaces 8 and effectively restrict the resonance action in the low frequency band.

【0041】本発明者は、図7及び図8に示す間仕切壁
Wを製作し、財団法人小林理学研究所において音響透過
損失の試験を実施した。比較例として、図9に示す間仕
切壁Wを製作した。なお、図9に示す間仕切壁Wは、図
1乃至図3に示す間仕切壁Wと概ね同一の基本構造を備
えるが、上記第1実施例において説明した接着材30の
硬化塊を備えていない。
The inventor manufactured the partition wall W shown in FIGS. 7 and 8, and conducted a test of sound transmission loss at Kobayashi Institute of Physical Sciences. As a comparative example, a partition wall W shown in FIG. 9 was manufactured. The partition wall W shown in FIG. 9 has substantially the same basic structure as the partition wall W shown in FIGS. 1 to 3, but does not include the cured mass of the adhesive 30 described in the first embodiment.

【0042】供試体各部の寸法は、以下のとおりであ
る。実施例 間仕切壁の壁厚T:150mm 下張りボード10:石膏ボード 厚さ12.5mm、幅910mm 上張りボード12:石膏ボード 厚さ15mm、幅910mm 内装仕上材13 :石膏ボード 厚さ9.5mm、幅910mm 断熱・吸音材5 :グラスウール 厚さ25mm、24kg/m3 石膏系接着材20:2kg/m2 第1ボード片17:石膏ボード 厚さ12.5mm、幅200mm 第2ボード片18:石膏ボード 厚さ12.5mm、幅100mm 第3ボード片91:石膏ボード 厚さ12.5mm、幅100mm 補強金物9:軽量溝型鋼材25mm(幅)×25mm(奥行)×0.5mm(板厚)
The dimensions of each part of the specimen are as follows. Example partition wall thickness T: 150 mm Underlay board 10: gypsum board 12.5 mm thick, 910 mm wide Overlay board 12: gypsum board 15 mm thick, 910 mm width Interior finish 13: gypsum board 9.5 mm thick 910 mm width Insulation / sound absorbing material 5: glass wool 25 mm thick, 24 kg / m 3 gypsum adhesive 20: 2 kg / m 2 first board piece 17: gypsum board 12.5 mm thickness, 200 mm width 2nd board piece 18: gypsum Board Thickness 12.5mm, width 100mm Third board piece 91: gypsum board Thickness 12.5mm, width 100mm Reinforcement hardware 9: lightweight grooved steel material 25mm (width) x 25mm (depth) x 0.5mm (plate thickness)

【0043】比較例 間仕切壁の壁厚T:150mm 下張りボード10:石膏ボード 厚さ12.5mm、幅910mm 補強ボード11 :石膏ボード 厚さ15mm、幅600mm 上張りボード12:石膏ボード 厚さ12.5mm、幅910mm 内装仕上材13 :石膏ボード 厚さ9.5mm、幅910mm 断熱・吸音材5 :グラスウール 厚さ25mm、24kg/m3 石膏系接着材20:3kg/m2 Comparative Example Wall thickness of partition wall T: 150 mm Underlay board 10: Gypsum board thickness 12.5 mm, width 910 mm Reinforcement board 11: Gypsum board thickness 15 mm, width 600 mm Overlay board 12: Gypsum board thickness 12 5 mm, width 910 mm Interior finish 13: gypsum board thickness 9.5 mm, width 910 mm Insulation / sound absorbing material 5: glass wool thickness 25 mm, 24 kg / m 3 gypsum adhesive 20: 3 kg / m 2

【0044】音響透過損失試験の試験結果が、図10及
び図11に示されている。なお,図11に示す括弧内数
値は、TLD値である。
The test results of the sound transmission loss test are shown in FIG. 10 and FIG. The numerical values in parentheses shown in FIG. 11 are TLD values.

【0045】音響透過損失試験の試験結果によれば、比
較例では、125Hz前後の周波数帯域において、音響
透過損失が急激に低下するのに対し、本実施例の間仕切
壁Wでは、125Hz前後の周波数帯域における音響透
過損失の低下が観られず、この周波数帯域における音響
損失効果が相対的に大きく向上する現象を確認すること
ができた。
According to the test results of the sound transmission loss test, in the comparative example, the sound transmission loss sharply decreases in a frequency band of about 125 Hz, whereas the partition wall W of the present example has a frequency of about 125 Hz. No decrease in the sound transmission loss in the band was observed, and a phenomenon in which the sound loss effect in the frequency band was relatively greatly improved was confirmed.

【0046】また、本実施例の間仕切壁は、ボードを3
層に積層した壁面構造を有し、各壁面の厚さは、ボード
を4層に積層した壁面構造を有する比較例と比べ、低減
しているが、これにもかかわらず、本例の間仕切壁は、
全周波数帯域に亘って比較例よりも高い遮音性能を発揮
する。従って、本実施例の間仕切壁構造によれば、壁面
を軽量化し得るにもかかわらず、遮音性能を向上するこ
とができるので、実用的に極めて有利である。
Further, the partition wall of this embodiment has three boards.
It has a wall structure in which layers are stacked, and the thickness of each wall is reduced as compared with a comparative example having a wall structure in which boards are stacked in four layers. Is
It exhibits higher sound insulation performance than the comparative example over the entire frequency band. Therefore, according to the partition wall structure of the present embodiment, although the wall surface can be reduced in weight, the sound insulation performance can be improved, which is extremely advantageous in practice.

【0047】以上、本発明の好適な実施例について詳細
に説明したが、本発明は上記実施例に限定されるもので
はなく、特許請求の範囲に記載された本発明の範囲内で
種々の変形又は変更が可能である。
Although the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above-described embodiment, and various modifications may be made within the scope of the present invention described in the appended claims. Or it can be changed.

【0048】例えば、建築物又は工作物に使用可能な多
種のボードを本発明の間仕切壁に用いることができる。
例えば、上記建築内装ボード材料として、石膏ボードの
他、珪酸カルシウム板、フレキシブルボード、石膏スラ
グ板、石膏繊維板、無機繊維強化石膏ボード、ガラス繊
維強化石膏ボード、石綿セメント板、繊維強化石膏板
(FGボード)等の各種ボード材料を使用することが可
能である。
For example, various types of boards that can be used for buildings or works can be used for the partition wall of the present invention.
For example, as the building interior board material, in addition to gypsum board, calcium silicate board, flexible board, gypsum slag board, gypsum fiber board, inorganic fiber reinforced gypsum board, glass fiber reinforced gypsum board, asbestos cement board, fiber reinforced gypsum board ( Various board materials such as FG board can be used.

【0049】[0049]

【発明の効果】以上説明した通り、本発明の上記構成に
よれば、壁面を形成する建築用内装ボード材料を上下の
ランナーに取付けた構成を有する乾式工法の軽量間仕切
壁構造において、125Hz以下の低周波数帯域におけ
る間仕切壁の遮音性能を向上する間仕切壁構造を提供す
ることができる。
As described above, according to the above-mentioned structure of the present invention, in a dry-type light-weight partition wall structure having a structure in which a building interior board material for forming a wall surface is attached to upper and lower runners, a frequency of 125 Hz or less is obtained. A partition wall structure that improves the sound insulation performance of the partition wall in a low frequency band can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1実施例に係る間仕切壁の縦断面図
である。
FIG. 1 is a longitudinal sectional view of a partition wall according to a first embodiment of the present invention.

【図2】図1に示す間仕切壁のA−A線断面図である。FIG. 2 is a sectional view taken along line AA of the partition wall shown in FIG.

【図3】図1及び図2に示す間仕切壁の構造を概略的に
示す分解斜視図である。
FIG. 3 is an exploded perspective view schematically showing the structure of the partition wall shown in FIGS. 1 and 2.

【図4】本発明の第2実施例に係る間仕切壁の縦断面図
である。
FIG. 4 is a longitudinal sectional view of a partition wall according to a second embodiment of the present invention.

【図5】図4に示す間仕切壁のB−B線断面図である。FIG. 5 is a sectional view taken along line BB of the partition wall shown in FIG.

【図6】図4及び図5に示す間仕切壁の構造を概略的に
示す分解斜視図である。
FIG. 6 is an exploded perspective view schematically showing the structure of the partition wall shown in FIGS. 4 and 5.

【図7】本発明の第3実施例に係る間仕切壁の縦断面図
である。
FIG. 7 is a longitudinal sectional view of a partition wall according to a third embodiment of the present invention.

【図8】図7に示す間仕切壁のC−C線断面図及び部分
破断斜視図である。
8 is a sectional view taken along the line CC of the partition wall shown in FIG. 7 and a partially cutaway perspective view.

【図9】比較例に係る間仕切壁構造を示す縦断面図及び
横断面図である。
FIG. 9 is a longitudinal sectional view and a transverse sectional view showing a partition wall structure according to a comparative example.

【図10】音響透過損失試験の試験結果を示す線図であ
る。
FIG. 10 is a diagram showing test results of a sound transmission loss test.

【図11】音響透過損失試験の試験結果を示す図表であ
る。
FIG. 11 is a table showing test results of a sound transmission loss test.

【図12】従来の間仕切壁構造および本発明の間仕切壁
構造に関する音響透過損失試験の実測結果を示す線図で
ある。
FIG. 12 is a diagram showing actual measurement results of a sound transmission loss test for a conventional partition wall structure and a partition wall structure of the present invention.

【符号の説明】[Explanation of symbols]

2 床ランナー 3 天井ランナー 5 断熱・吸音材料 6 中空部 7 閉鎖空間 8 開放空間 10 下張りボード 11 補強ボード 12 上張りボード 13 内装仕上材 15 係止具 17 第1ボード片 18 第2ボード片 20 石膏系接着材 30 石膏系接着材 M 高さ中心 S 寸法( 高さ中心領域) T 壁厚 W 間仕切壁 C 天井下地 F 床基盤 2 Floor runner 3 Ceiling runner 5 Heat insulation / sound absorbing material 6 Hollow part 7 Closed space 8 Open space 10 Underlay board 11 Reinforcement board 12 Overlay board 13 Interior finishing material 15 Fastener 17 First board piece 18 Second board piece 20 Gypsum Adhesive 30 Gypsum adhesive M Height center S Dimension (height center area) T Wall thickness W Partition wall C Ceiling base F Floor base

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2E001 DD01 DF02 DF04 FA07 FA11 FA14 FA71 GA10 GA12 GA42 GA55 GA59 HA00 HA03 HA31 HE10 KA08 LA01 LA04 LA09 LA11 LA12  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2E001 DD01 DF02 DF04 FA07 FA11 FA14 FA71 GA10 GA12 GA42 GA55 GA59 HA00 HA03 HA31 HE10 KA08 LA01 LA04 LA09 LA11 LA12

Claims (12)

【特許請求の範囲】[Claims] 【請求項1】 壁面を形成する建築用内装ボード材料を
上下のランナー(2,3) に取付けた構成を有する乾式工法
の間仕切壁構造において、 建築用内装ボード材料を構成する下張りボード(10)及び
上張りボード(12)と、該ボード間に介挿された補強ボー
ド(11)及び第1無機質系接着材(20)とを有し、前記補強
ボードは、前記第1接着材の硬化塊を分散配置すべき閉
鎖空間(7) を形成するように壁芯方向に互いに間隔を隔
てて配置され、 前記第1接着材と同質の第2無機質系接着材(30)が、前
記閉鎖空間に相応する位置において間仕切壁の中空部
(6) 側から前記下張りボードの裏面に塗着され、前記第
2接着材の硬化塊が、前記下張りボードの高さ中心領域
(S) に分散配置されることを特徴とする間仕切壁構造。
An underlay board (10) constituting a building interior board material in a dry-type partition wall structure having a construction in which a building interior board material forming a wall surface is attached to upper and lower runners (2, 3). And an overlay board (12), a reinforcing board (11) and a first inorganic adhesive (20) interposed between the boards, and the reinforcing board comprises a cured mass of the first adhesive. Are arranged at a distance from each other in the direction of the center of the wall so as to form a closed space (7) in which the closed space (7) to be dispersed is to be arranged. A second inorganic adhesive (30) of the same quality as the first adhesive is provided in the closed space. Hollow part of the partition wall at the corresponding position
(6) The hardened mass of the second adhesive applied to the back surface of the underboard board from the side, and the height center area of the underboard board
(S) A partition wall structure characterized by being distributed.
【請求項2】 前記建築用内装ボード材料及び補強ボー
ドは、石膏ボード又はその裁断片からなり、前記無機質
系接着材は、石膏粉末、軽量骨材及び接着剤を含む接着
材原料を水で混練した石膏系接着材からなることを特徴
とする請求項1に記載の間仕切壁構造。
2. The building interior board material and the reinforcing board are each made of a gypsum board or a cut piece thereof, and the inorganic adhesive is a material in which an adhesive material containing a gypsum powder, a lightweight aggregate and an adhesive is kneaded with water. The partition wall structure according to claim 1, wherein the partition wall structure is made of a gypsum-based adhesive material.
【請求項3】 前記下張りボード及び上張りボードは、
実質的に同一の幅を有し、前記上張り及び下張りボード
の各縦目地位置は、前記補強ボード上に位置し、該補強
ボードの幅は、前記下張り及び上張りボードの幅の半分
に設定されることを特徴とする請求項1又は2に記載の
間仕切壁構造。
3. The lower board and the upper board,
Having substantially the same width, each vertical joint position of the upper and lower boards is located on the reinforcing board, and the width of the reinforcing board is set to half of the width of the lower and upper boards; The partition wall structure according to claim 1, wherein the partition wall structure is formed.
【請求項4】 壁面を形成する建築用内装ボード材料を
上下のランナー(2,3) に取付けた構成を有する乾式工法
の間仕切壁構造において、 壁芯方向に相互間隔を隔てて配置された狭小幅の第1ボ
ード片(17)と、該ボード片よりも小さい幅を有する第2
ボード片(18)と、該第2ボード片と一体化した建築用内
装ボード材料(10,12) とを有し、 前記第2ボード片は、前記第1ボード片の表面側半部に
固定され、無機質系接着材(20)を分散配置可能な開放空
間(8) が、前記第1ボード片の表面側残部と前記内装ボ
ード材料との間に形成され、前記接着材の硬化塊は、前
記第1ボード片及び前記内装ボード材料を相互接着し、 前記第1ボード片は、前記内装ボード材料の半分以下の
幅を有し、前記第2ボード片は、前記内装ボード材料の
1/4以下の幅を有することを特徴とする間仕切壁構
造。
4. A partition wall structure of a dry construction method having a structure in which a building interior board material for forming a wall surface is attached to upper and lower runners (2, 3), wherein narrow walls arranged at intervals from each other in a wall core direction. A first board piece (17) having a width and a second board piece having a smaller width than the board piece.
It has a board piece (18) and an architectural interior board material (10, 12) integrated with the second board piece, wherein the second board piece is fixed to the front surface half of the first board piece. An open space (8) in which the inorganic adhesive (20) can be dispersedly formed is formed between the surface-side remaining portion of the first board piece and the interior board material, and the cured mass of the adhesive is The first board piece and the interior board material are adhered to each other, the first board piece has a width of less than half the width of the interior board material, and the second board piece is 1 / of the interior board material. A partition wall structure having the following width.
【請求項5】 前記接着材と同質の第2無機質系接着材
(30)が、前記第1ボード片の間の領域において間仕切壁
の中空部(6) 側から前記内装ボード材料の裏面に塗着さ
れ、前記第2接着材の硬化塊が、前記内装ボード材料の
高さ中心領域(S) に分散配置されることを特徴とする請
求項4に記載の間仕切壁構造。
5. A second inorganic adhesive having the same quality as the adhesive.
(30) is applied to the back surface of the interior board material from the hollow portion (6) side of the partition wall in a region between the first board pieces, and the hardened mass of the second adhesive is applied to the interior board material. The partition wall structure according to claim 4, wherein the partition wall structure is distributed in the height center region (S).
【請求項6】 前記内装ボード材料及び前記ボード片
は、石膏ボード又はその裁断片からなり、前記無機質系
接着材は、石膏粉末、軽量骨材及び接着剤を含む接着材
原料を水で混練した石膏系接着材からなることを特徴と
する請求項4又は5に記載の間仕切壁構造。
6. The interior board material and the board piece are made of a gypsum board or a cut piece thereof, and the inorganic adhesive is obtained by kneading an adhesive material containing gypsum powder, a lightweight aggregate and an adhesive with water. The partition wall structure according to claim 4, comprising a gypsum-based adhesive.
【請求項7】 壁面を形成する建築用内装ボード材料を
上下のランナー(2,3)に取付けた構成を有する乾式工法
の間仕切壁構造において、 無機質系接着材(30)が、間仕切壁の中空部(6) 側から前
記内装ボード材料(10,12) の裏面に塗着され、前記接着
材の硬化塊が、前記内装ボード材料の高さ中心領域に分
散配置され、 前記接着材の塗着領域は、間仕切壁の高さ中心(M) から
上下方向に所定寸法(S) の範囲内に制限され、該所定寸
法は、前記内装ボード材料の全高(H) の1/4〜1/6
に設定されることを特徴とする間仕切壁構造。
7. A partition wall structure of a dry construction method having a structure in which an interior board material for a building forming a wall surface is attached to upper and lower runners (2, 3), wherein an inorganic adhesive (30) is provided in the partition wall. A portion (6) is applied to the back surface of the interior board material (10, 12), and a cured mass of the adhesive is dispersed and arranged in a height center region of the interior board material, and the application of the adhesive is performed. The area is limited within a range of a predetermined dimension (S) in the vertical direction from the height center (M) of the partition wall, and the predetermined dimension is 4 to 6 of the total height (H) of the interior board material.
A partition wall structure characterized by being set to:
【請求項8】 前記塗着領域は、間仕切壁の高さ中心か
ら上下対称の前記寸法範囲内に限定されることを特徴と
する請求項7に記載の間仕切壁構造。
8. The partition wall structure according to claim 7, wherein the coating region is limited within the dimension range vertically symmetric from the height center of the partition wall.
【請求項9】 前記接着材は、2乃至3列の列をなして
上下方向に配列されることを特徴とする請求項7又は8
に記載の間仕切壁構造。
9. The adhesive according to claim 7, wherein the adhesive is vertically arranged in two or three rows.
The partition wall structure described in.
【請求項10】 壁面を形成する建築用内装ボード材料
を上下のランナー(2,3) に取付けた構成を有する乾式工
法の間仕切壁構造において、 壁芯方向に相互間隔を隔てて配置された狭小幅の第1ボ
ード片(17)と、該ボード片よりも小さい幅を有する第2
ボード片(18)と、該第2ボード片と一体化した建築用内
装ボード材料(10,12) とを有し、 前記第2ボード片は、前記第1ボード片の表面側半部に
固定され、第1無機質系接着材(20)を分散配置可能な開
放空間(8) が、前記第1ボード片の表面側残部と前記内
装ボード材料との間に形成され、前記第1接着材の硬化
塊は、前記第1ボード片及び前記内装ボード材料を相互
接着し、前記第1接着材と同質の第2無機質系接着材(3
0)が、前記第1ボード片の間の領域において間仕切壁の
中空部(6) 側から前記内装ボード材料の裏面に塗着さ
れ、前記第2接着材の硬化塊が、前記内装ボード材料の
高さ中心領域(S) に分散配置されることを特徴とする間
仕切壁構造。
10. A partitioning wall structure of a dry construction method having a structure in which a building interior board material forming a wall surface is attached to upper and lower runners (2, 3), wherein narrow walls arranged at a distance from each other in a wall core direction. A first board piece (17) having a width and a second board piece having a smaller width than the board piece.
It has a board piece (18) and an architectural interior board material (10, 12) integrated with the second board piece, wherein the second board piece is fixed to the front surface half of the first board piece. An open space (8) in which the first inorganic adhesive (20) can be dispersedly formed is formed between the surface-side remaining portion of the first board piece and the interior board material, and the first adhesive is The hardened mass adheres the first board piece and the interior board material to each other and forms a second inorganic adhesive (3) of the same quality as the first adhesive.
0) is applied to the back surface of the interior board material from the hollow portion (6) side of the partition wall in a region between the first board pieces, and the hardened mass of the second adhesive material is applied to the interior board material. A partition wall structure which is arranged in a distributed manner in the height center area (S).
【請求項11】 前記第2接着材の塗着領域は、間仕切
壁の高さ中心(M) から上下方向に所定寸法(S) の範囲内
に制限され、該所定寸法は、前記内装ボード材料の全高
(H) の1/4〜1/6に設定されることを特徴とする請
求項10に記載の間仕切壁構造。
11. The coating area of the second adhesive is limited within a range of a predetermined dimension (S) in a vertical direction from a height center (M) of the partition wall, and the predetermined dimension is determined by the interior board material. Height of
The partition wall structure according to claim 10, wherein (H) is set to 1/4 to 1/6.
【請求項12】 前記第1ボード片(17)は、前記内装ボ
ード材料を半分以下の幅に裁断した裁断片からなり、前
記第2ボード片(18)は、前記内装ボード材料を1/4以
下の幅に裁断した裁断片からなることを特徴とする請求
項10又は11に記載の間仕切壁構造。
12. The first board piece (17) is made of a cut piece obtained by cutting the interior board material to a width of not more than half, and the second board piece (18) is a quarter of the interior board material. The partition wall structure according to claim 10, comprising a cut piece cut to the following width.
JP2001296100A 2000-11-17 2001-09-27 Partition wall structure Expired - Fee Related JP4172927B2 (en)

Priority Applications (1)

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Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-351882 2000-11-17
JP2000351882 2000-11-17
JP2001296100A JP4172927B2 (en) 2000-11-17 2001-09-27 Partition wall structure

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JP4172927B2 JP4172927B2 (en) 2008-10-29

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