JP4166598B2 - ポジ型レジスト組成物 - Google Patents
ポジ型レジスト組成物 Download PDFInfo
- Publication number
- JP4166598B2 JP4166598B2 JP2003067010A JP2003067010A JP4166598B2 JP 4166598 B2 JP4166598 B2 JP 4166598B2 JP 2003067010 A JP2003067010 A JP 2003067010A JP 2003067010 A JP2003067010 A JP 2003067010A JP 4166598 B2 JP4166598 B2 JP 4166598B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- hydrogen atom
- atom
- general formula
- alkyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/107—Polyamide or polyurethane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/108—Polyolefin or halogen containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003067010A JP4166598B2 (ja) | 2003-03-12 | 2003-03-12 | ポジ型レジスト組成物 |
EP04004961A EP1457819A3 (en) | 2003-03-12 | 2004-03-03 | Positive resist composition and method of forming a resist pattern using the same |
US10/796,083 US7118846B2 (en) | 2003-03-12 | 2004-03-10 | Positive resist composition and method of forming a resist pattern using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003067010A JP4166598B2 (ja) | 2003-03-12 | 2003-03-12 | ポジ型レジスト組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004279471A JP2004279471A (ja) | 2004-10-07 |
JP2004279471A5 JP2004279471A5 (US06780888-20040824-C00057.png) | 2005-09-29 |
JP4166598B2 true JP4166598B2 (ja) | 2008-10-15 |
Family
ID=32767944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003067010A Expired - Fee Related JP4166598B2 (ja) | 2003-03-12 | 2003-03-12 | ポジ型レジスト組成物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7118846B2 (US06780888-20040824-C00057.png) |
EP (1) | EP1457819A3 (US06780888-20040824-C00057.png) |
JP (1) | JP4166598B2 (US06780888-20040824-C00057.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005173549A (ja) * | 2003-11-21 | 2005-06-30 | Fuji Photo Film Co Ltd | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5675070B2 (ja) * | 2009-07-30 | 2015-02-25 | 富士フイルム株式会社 | 感活性光線性または感放射線性樹脂組成物、及び該組成物を用いたパターン形成方法 |
JP5331624B2 (ja) * | 2009-09-04 | 2013-10-30 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、及びそれを用いたパターン形成方法 |
KR101810520B1 (ko) * | 2009-07-30 | 2017-12-19 | 후지필름 가부시키가이샤 | 감활성 광선성 또는 감방사선성 수지 조성물 및 그것을 사용한 패턴 형성 방법 |
JP5621432B2 (ja) * | 2009-09-17 | 2014-11-12 | 住友化学株式会社 | レジスト組成物 |
JP5556522B2 (ja) * | 2009-09-17 | 2014-07-23 | 住友化学株式会社 | レジスト組成物 |
US9726976B2 (en) * | 2009-09-17 | 2017-08-08 | Sumitomo Chemical Company, Limited | Photoresist composition |
US9223208B2 (en) | 2011-12-29 | 2015-12-29 | Fujifilm Corporation | Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition |
KR20150101074A (ko) * | 2014-02-26 | 2015-09-03 | 삼성전자주식회사 | 포토레지스트 조성물, 이를 이용한 패턴 형성 방법 및 반도체 소자의 제조 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3591672B2 (ja) * | 1996-02-05 | 2004-11-24 | 富士写真フイルム株式会社 | ポジ型感光性組成物 |
WO2000017712A1 (en) | 1998-09-23 | 2000-03-30 | E.I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
AU4678100A (en) * | 1999-05-04 | 2000-11-17 | E.I. Du Pont De Nemours And Company | Fluorinated polymers, photoresists and processes for microlithography |
TWI224713B (en) * | 2000-01-27 | 2004-12-01 | Fuji Photo Film Co Ltd | Positive photoresist composition |
US20020155376A1 (en) * | 2000-09-11 | 2002-10-24 | Kazuhiko Hashimoto | Positive resist composition |
JP3876968B2 (ja) | 2001-04-26 | 2007-02-07 | 信越化学工業株式会社 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
US7108951B2 (en) * | 2002-02-26 | 2006-09-19 | Fuji Photo Film Co., Ltd. | Photosensitive resin composition |
KR100955454B1 (ko) * | 2002-05-31 | 2010-04-29 | 후지필름 가부시키가이샤 | 포지티브 레지스트 조성물 |
-
2003
- 2003-03-12 JP JP2003067010A patent/JP4166598B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-03 EP EP04004961A patent/EP1457819A3/en not_active Withdrawn
- 2004-03-10 US US10/796,083 patent/US7118846B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005173549A (ja) * | 2003-11-21 | 2005-06-30 | Fuji Photo Film Co Ltd | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
JP4639062B2 (ja) * | 2003-11-21 | 2011-02-23 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
US7118846B2 (en) | 2006-10-10 |
EP1457819A3 (en) | 2004-10-20 |
US20060035165A1 (en) | 2006-02-16 |
EP1457819A2 (en) | 2004-09-15 |
JP2004279471A (ja) | 2004-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3909829B2 (ja) | ポジ型レジスト組成物 | |
JP4007581B2 (ja) | ポジ型レジスト組成物 | |
JP4056345B2 (ja) | ポジ型レジスト組成物 | |
JP4092153B2 (ja) | ポジ型レジスト組成物 | |
JP4166598B2 (ja) | ポジ型レジスト組成物 | |
JP4007582B2 (ja) | ポジ型レジスト組成物 | |
JP4018454B2 (ja) | ポジ型レジスト組成物 | |
JP2005049695A (ja) | ポジ型レジスト組成物 | |
JP2004069981A (ja) | ポジ型レジスト組成物 | |
JP2004029542A (ja) | ポジ型レジスト組成物 | |
JP4073337B2 (ja) | 感光性樹脂組成物 | |
JP3841400B2 (ja) | ポジ型レジスト組成物 | |
JP4073253B2 (ja) | ポジ型レジスト組成物 | |
JP2004109834A (ja) | ポジ型レジスト組成物 | |
JP2004318045A (ja) | ポジ型レジスト組成物及びそれを用いたパターン形成方法 | |
JP2004101934A (ja) | ポジ型レジスト組成物 | |
JP2004170871A (ja) | ポジ型レジスト組成物 | |
JP2004271630A (ja) | ポジ型レジスト組成物 | |
JP2004302200A (ja) | ポジ型レジスト組成物 | |
JP2004271843A (ja) | ポジ型レジスト組成物 | |
JP4178007B2 (ja) | ポジ型レジスト組成物 | |
JP2003295442A (ja) | ポジ型レジスト組成物 | |
JP2004069921A (ja) | ポジ型レジスト組成物 | |
JP4084965B2 (ja) | ポジ型レジスト組成物 | |
JP2004102264A (ja) | 化学増幅型レジスト組成物及びそれを用いたパターン形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050421 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050421 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060325 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20061124 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070803 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070815 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071015 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071108 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071115 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071122 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080109 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080205 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080326 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080410 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080709 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080730 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110808 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110808 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120808 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120808 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130808 Year of fee payment: 5 |
|
LAPS | Cancellation because of no payment of annual fees |