JP4165819B2 - WIRE WIRING SYSTEM AND VEHICLE LAMP - Google Patents

WIRE WIRING SYSTEM AND VEHICLE LAMP Download PDF

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JP4165819B2
JP4165819B2 JP2003287088A JP2003287088A JP4165819B2 JP 4165819 B2 JP4165819 B2 JP 4165819B2 JP 2003287088 A JP2003287088 A JP 2003287088A JP 2003287088 A JP2003287088 A JP 2003287088A JP 4165819 B2 JP4165819 B2 JP 4165819B2
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lamp
light source
wiring system
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conductive
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俊幸 近藤
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Stanley Electric Co Ltd
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Description

本発明は車両用灯具に関するものであり、詳細には、高出力化が図られて1個あたりの消費電力が増加され、これにより、個々のLEDランプにおける温度上昇が著しいものとなり、点灯時の温度管理が必要されている、LEDランプを光源とする車両用灯具の構成に係るものである。   The present invention relates to a vehicular lamp, and more specifically, high output is achieved and power consumption per unit is increased. As a result, the temperature rise in individual LED lamps becomes remarkable, and the lighting is turned on. The present invention relates to a configuration of a vehicular lamp that uses an LED lamp as a light source and requires temperature management.

従来のLEDランプを光源とするときの、車両用灯具に対するLEDランプの取付方法としては、LEDランプの脚部であるリード端子に樹脂製の灯体ベースと平行となるタブ状の部分を設けるとともに、この平行となるタブ状部分に取付穴を設けておき、加えて、前記灯体ベースには前記取付穴に挿入可能なボスを設けておき、このボスを前記取付穴に挿入した状態で熱カシメを行うことで、灯体にLEDランプを取付けるものがある。(例えば、特許文献1参照。)
特開2000−251504号公報(段落0008〜0022、図1〜図5)
When a conventional LED lamp is used as the light source, the LED lamp is attached to the vehicle lamp by providing a tab-shaped portion parallel to the resin lamp base on the lead terminal which is a leg portion of the LED lamp. In addition, a mounting hole is provided in the parallel tab-shaped portion, and in addition, a boss that can be inserted into the mounting hole is provided in the lamp base, and the boss is inserted into the mounting hole and heated. There are some which attach an LED lamp to a lamp body by performing caulking. (For example, refer to Patent Document 1.)
JP 2000-251504 A (paragraphs 0008 to 0022, FIGS. 1 to 5)

しかしながら、前記した従来の構成においては、LEDランプをそのリード端子で直接に熱カシメで取付けるものであるので、この取付時にリード端子に応力が加わる可能性が高く、この応力によりLEDランプの樹脂ケースとリード端子との間に剥離を生じるなどしてLEDチップに対する気密性が失われ、寿命の短縮など信頼性が低下する問題点を生じている。   However, in the above-described conventional configuration, since the LED lamp is directly attached by thermal caulking at the lead terminal, there is a high possibility that stress is applied to the lead terminal at the time of attachment, and this stress causes the resin case of the LED lamp. As a result, the airtightness of the LED chip is lost due to, for example, peeling between the lead terminal and the lead terminal.

また、近年では、LEDランプに対する光量増加の要望が強いので、LEDランプ1個あたりの消費電力が増やされる傾向にあり、このため、点灯時のLEDランプの温度上昇が著しいものとなり、上記した従来の構成では、例えば車両用灯具の中心近くに設置されたLEDランプでは放熱が困難となり、光量低下を生じたり、寿命の短命化を生じて、性能と信頼性とがともに低下して、これらの点も問題を生じるものとなっている。   Further, in recent years, there is a strong demand for an increase in the amount of light for the LED lamp, and thus there is a tendency for the power consumption per LED lamp to increase. For this reason, the temperature rise of the LED lamp at the time of lighting becomes remarkable. With this configuration, for example, an LED lamp installed near the center of a vehicle lamp makes it difficult to dissipate heat, resulting in a decrease in the amount of light or a shortened life, and both performance and reliability are reduced. The point also causes problems.

本発明は上記した従来の課題を解決するための具体的手段として、灯体ベース上に点灯回路を構成するためのワイヤリングシステムであり、このワイヤリングシステムは金属部材により一部が略筒状に形成されて、その側面を電極として使用可能に形成された素子基板上にLEDチップがマウントされてLEDランプとされた光源部と、前記灯体ベース上に適宜な係着手段で点灯回路を構成し導電性と熱伝導性に対して適宜な板厚とされた金属板材のプレス加工により形成された導電部とからなり、前記光源部と前記導電部とは前記導電部側が内径で前記光源部の素子基板の外径に面接触して光源部の所定位置への保持と、給電と、放熱とを行う構成とされていることを特徴とする灯具のワイヤリングシステムを提供することで課題を解決するものである。 The present invention is a wiring system for constructing a lighting circuit on a lamp body base as a specific means for solving the above-described conventional problems, and this wiring system is formed in a substantially cylindrical shape by a metal member. A light source part in which an LED chip is mounted on an element substrate that can be used as an electrode on its side surface to form an LED lamp, and a lighting circuit is configured on the lamp base with appropriate attachment means. A conductive portion formed by pressing a metal plate material having an appropriate thickness for electrical conductivity and thermal conductivity. The light source portion and the conductive portion have an inner diameter on the conductive portion side and the light source portion. solve a holding in a predetermined position of the light source portion in surface contact with the outer diameter of the element substrate, and the power supply, the problem by providing a wiring system of the lamp, characterized by being configured to perform a heat radiation It is intended.

本発明により、灯体ベース上に点灯回路を構成するためのワイヤリングシステムであり、このワイヤリングシステムは金属部材により一部が略筒状に形成されて、その側面を電極として使用可能に形成された素子基板上にLEDチップがマウントされてLEDランプとされた光源部と、前記灯体ベース上に適宜な係着手段で点灯回路を構成し導電性と熱伝導性に対して適宜な板厚とされた金属板材のプレス加工により形成された導電部とからなり、前記光源部と前記導電部とは前記導電部側が内径で前記光源部の素子基板の外径に面接触して光源部の所定位置への保持と、給電と、放熱とを行う構成とされていることを特徴とする灯具のワイヤリングシステムとしたことで、光源部(LEDランプ)側では、素子基板の形状、寸法などの適正化を行い、灯具側でも導電部の形状、寸法での適正化を行い、光源部で発生した熱を導電部にに効率良く移行して導電部にて放熱させることを可能とし、近年の1個あたりの消費電力が増やされ、光源部(LEDランプ)自体で放熱が困難となっているLED光源の灯具の実現を光量低下、寿命の短縮などの問題を生じることなく可能とする極めて優れた効果を奏するものである。
According to the present invention, there is a wiring system for constructing a lighting circuit on a lamp base. This wiring system is formed in a substantially cylindrical shape by a metal member, and the side surface thereof is made usable as an electrode. A light source section in which an LED chip is mounted on an element substrate to form an LED lamp, and a lighting circuit is configured with appropriate engagement means on the lamp base, and an appropriate plate thickness for conductivity and thermal conductivity The light source part and the conductive part have an inner diameter on the conductive part side and are in surface contact with the outer diameter of the element substrate of the light source part. and holding to the position, and the feed, that was the lamp wiring system, characterized in that it is configured to perform a heat radiation in the light source unit (LED lamp) side, the shape of the element substrate, proper such dimensions It is possible to optimize the shape and size of the conductive part on the lamp side, and to efficiently transfer the heat generated in the light source part to the conductive part and dissipate the heat in the conductive part. Extremely excellent effect that enables the realization of LED light source lamps that have increased power consumption per unit and that make it difficult to dissipate heat in the light source unit (LED lamp) itself without causing problems such as a reduction in light intensity and shortening of service life. It plays.

つぎに、本発明を図に示す実施形態に基づいて詳細に説明する。図1に符号1で示すものは本発明に係る車両用灯具のワイヤリングシステムであり、この車両用灯具のワイヤリングシステム1(以下、ワイヤリングシステム1と略称)は、光源部2と導電部3と、必要に応じて設けられる給電部4(図4を参照)とから構成され、例えば、車両用灯具10のハウジングなどである灯体ベース11上に設置される。   Below, this invention is demonstrated in detail based on embodiment shown in a figure. 1 is a wiring system for a vehicular lamp according to the present invention, and the wiring system 1 for the vehicular lamp (hereinafter abbreviated as “wiring system 1”) includes a light source unit 2, a conductive unit 3, The power supply unit 4 is provided as necessary (see FIG. 4), and is installed on a lamp base 11 that is a housing of the vehicular lamp 10, for example.

先ず、前記光源部2は、いわゆるLEDランプであるが、1個あたりの消費電力が増やされ、これにより点灯時の温度上昇も顕著となって、冷却手段の必要性が高まっていたり、同様に消費電力の増加により大型化し灯体ベース11上への取付けが困難化している近年のLEDランプに、前記導電部3とでシステム的に対応するべく、本発明により独自の形状とされている。   First, the light source unit 2 is a so-called LED lamp. However, the power consumption per unit is increased, so that the temperature rise at the time of lighting becomes remarkable, and the necessity of the cooling means is increased. The present invention has a unique shape in order to systematically cope with a recent LED lamp that has become larger due to an increase in power consumption and has become difficult to mount on the lamp base 11 with the conductive portion 3.

図2は前記光源部2の構成を示すものであり、この光源部2の基本構成は、金属部材により形成されている一対の素子基板21、22と、該素子基板21、22に取付けられるLEDチップ23と、前記LEDチップ23を外気から遮蔽するための透明樹脂による樹脂ケース24とから形成されている。尚、前記素子基板21、22は既製のLEDランプにおいてはリードフレームと称されているものである。   FIG. 2 shows the configuration of the light source unit 2. The basic configuration of the light source unit 2 is a pair of element substrates 21 and 22 formed of metal members and LEDs attached to the element substrates 21 and 22. A chip 23 and a resin case 24 made of a transparent resin for shielding the LED chip 23 from the outside air are formed. The element substrates 21 and 22 are called lead frames in the ready-made LED lamps.

前記素子基板21、22は前記LEDチップ23に電力を供給するために、従来のリードフレームと同様に、正極用素子基板21と、負極用素子基板22との一対で構成され、一方、例えば負極用素子基板22にはLEDチップ23がダイボンドされ、他方の正極用素子基板21は前記LEDチップ23とに金線(或いはアルミニウム線)25によりワイヤボンドが行われている。   In order to supply electric power to the LED chip 23, the element substrates 21 and 22 are composed of a pair of a positive electrode element substrate 21 and a negative electrode element substrate 22 as in the conventional lead frame. The LED chip 23 is die-bonded to the element substrate 22, and the other positive electrode element substrate 21 is wire-bonded to the LED chip 23 by a gold wire (or aluminum wire) 25.

そして、本発明においては、前記LEDチップ23がダイボンドされる側の素子基板、この実施形態においては負極用素子基板22の側が、前記LEDチップ23で発生した熱を伝導するのに充分な断面積を有するものとするために、例えば板厚を増す、形状を大型化するなど適宜な手段が施されている。   In the present invention, the element substrate to which the LED chip 23 is die-bonded, in this embodiment, the negative element substrate 22 side, has a sufficient cross-sectional area to conduct heat generated in the LED chip 23. For example, appropriate means such as increasing the plate thickness or increasing the shape are provided.

また、前記素子基板21、22の外部から給電を行うための端子部21a、22aは、双方を合わせて略円筒形状となるように加工され、後に説明する導電部3との接触面積の増加が図られている。尚、このときには、前記LEDチップ23がダイボンドされる側の負極用素子基板22の端子部22aを、例えば半円筒状とするなど、他方の端子部21aと比べて表面積を広く設定しておくことが好ましい。   Further, the terminal portions 21a and 22a for supplying power from the outside of the element substrates 21 and 22 are processed so as to have a substantially cylindrical shape by combining both, and the contact area with the conductive portion 3 described later increases. It is illustrated. At this time, the surface area of the terminal portion 22a of the negative electrode element substrate 22 to which the LED chip 23 is die-bonded is set to be larger than that of the other terminal portion 21a, for example, a semi-cylindrical shape. Is preferred.

以上のように組立が行われた素子基板21、22と、LEDチップ23、金線25に対しては透明なエポキシ樹脂によるモールディングが行われて樹脂ケース24が形成されて本発明の光源部2とされている。このときに、前記樹脂ケース24は、LEDチップ23の発光方向側においては、凸レンズ状など光を適宜に収束し放射するのに適する形状とされるものである点は従来例のLEDランプと同様である。   The element substrates 21 and 22 assembled as described above, the LED chip 23, and the gold wire 25 are molded with a transparent epoxy resin to form a resin case 24, and the light source unit 2 of the present invention. It is said that. At this time, the resin case 24 has a shape suitable for converging and emitting light appropriately, such as a convex lens, on the light emitting direction side of the LED chip 23, as in the conventional LED lamp. It is.

加えて、本発明においては、樹脂ケース24を前記素子基板21、22の端子部21a、22aの方向にも延設させ、2つの端子部21a、22aが形成する円筒状の中空部分を埋め内側から補強し、この部分をもって光源部2を抜き差しして着脱するなどソケットとして使用する場合にも充分な強度が得られるものとしている。   In addition, in the present invention, the resin case 24 is also extended in the direction of the terminal portions 21a and 22a of the element substrates 21 and 22 so as to fill the cylindrical hollow portion formed by the two terminal portions 21a and 22a. It is assumed that sufficient strength can be obtained even when used as a socket, such as by detaching the light source unit 2 and attaching / detaching the light source unit 2 with this part.

図3は、本発明に係るワイヤリングシステム1を構成する導電部3の構成を示すものであり、この導電部3は上記に説明した光源部2を所定位置に保持して給電を行い点灯させるとともに、点灯によって生じる光源部2の発熱を冷却する機能も有するものとされている。   FIG. 3 shows the configuration of the conductive portion 3 constituting the wiring system 1 according to the present invention. The conductive portion 3 keeps the light source portion 2 described above in place and supplies power to turn it on. In addition, it has a function of cooling the heat generation of the light source unit 2 caused by lighting.

従って、前記導電部3を形成するための部材としては導電性、熱伝導性、加工性に優れる銅、真鍮、鉄などの金属部材が採用され、正極用導電部31と、負極用導電部32とが用意され、前記正極用導電部31には、前記光源部2の正極用素子基板21に設けられている端子部21aに接触させるための接片部31aが設けられている。   Accordingly, a metal member such as copper, brass, or iron that is excellent in conductivity, thermal conductivity, and workability is adopted as a member for forming the conductive portion 3, and the positive electrode conductive portion 31 and the negative electrode conductive portion 32 are used. The positive electrode conductive portion 31 is provided with a contact piece portion 31a for contacting the terminal portion 21a provided on the positive electrode element substrate 21 of the light source unit 2.

同様に、負極用導電部32には、光源部2の負極用素子基板22に設けられている端子部22aに接触させるための接片部32aが設けられるものとなるが、このときには、それぞれの接片部31a、32aは接触する相手側である端子部21a、22aに対応する大きさ、形状とされている。   Similarly, the negative electrode conductive portion 32 is provided with a contact piece portion 32a for contacting the terminal portion 22a provided on the negative electrode element substrate 22 of the light source unit 2. The contact piece portions 31a and 32a have sizes and shapes corresponding to the terminal portions 21a and 22a on the other side to be contacted.

即ち、上記にも説明したように光源部2の端子部21a、22aにおいては、LEDチップ23のマウントが行われている側の素子基板に設けられる端子部は円筒状における円周角を大きく設定されているものであるので、それに接触する接片部も当然に円周角を大きく設定されるものであり、この実施形態では、円周角が31a<32aとされている。   That is, as described above, in the terminal portions 21a and 22a of the light source unit 2, the terminal portion provided on the element substrate on the side where the LED chip 23 is mounted has a large circumferential angle in the cylindrical shape. Therefore, the contact piece portion that contacts it is naturally set to have a large circumferential angle. In this embodiment, the circumferential angle is 31a <32a.

また、前記導電部3を形成するに際しては、前記光源部2が点灯時に発する熱量を考慮して板厚などが決定されるものであり、前記LEDチップ23がマウントされている側の素子基板(例えば、負極用素子基板22)に蓄積される熱量を、接触する接片部(例えば接片部32a)で導電部32の広い範囲に伝導するに必要充分な断面積が得られるようされている。   Further, when the conductive portion 3 is formed, the thickness of the light source portion 2 is determined in consideration of the amount of heat generated when the light source portion 2 is turned on, and the element substrate on the side where the LED chip 23 is mounted ( For example, the cross-sectional area necessary and sufficient to conduct the amount of heat stored in the negative electrode element substrate 22) to a wide range of the conductive portion 32 by the contacting piece portion (for example, the contacting piece portion 32a) is obtained. .

尚、実際の実施に当たっては、光源部2(LEDランプ)は車両の電源に対して複数個、例えば3個が直列接続されることもあるので、正極用導電部31と負極用導電部32とは、光源部2同士が接続される部分においては、負極用導電部32と正極用導電部31とを組合わせた形状のものを形成し使用(図1参照)しても良いものである。   In actual implementation, a plurality of, for example, three light source units 2 (LED lamps) may be connected in series to the power source of the vehicle, so that the positive electrode conductive unit 31 and the negative electrode conductive unit 32 In the portion where the light source portions 2 are connected to each other, a shape in which the negative electrode conductive portion 32 and the positive electrode conductive portion 31 are combined may be formed and used (see FIG. 1).

また、前記導電部3を灯体ベース11に取付けるに当たっては、ビス止めなどとしての良いものであるが、前記導電部3の側には取付穴32bを設けておき、熱可塑性樹脂で形成された灯体ベース11の側には取付穴32bに対応する位置にボス11aを設けておき、ボス11aに取付穴32bを嵌着した状態で熱カシメを行い固着させても良いものである。   Further, when the conductive portion 3 is attached to the lamp base 11, it is good as a screw stopper or the like. However, a mounting hole 32b is provided on the conductive portion 3 side, and is formed of a thermoplastic resin. A boss 11a may be provided on the lamp body base 11 at a position corresponding to the mounting hole 32b, and the boss 11a may be fixed with heat caulking in a state where the mounting hole 32b is fitted.

ここで、車両用灯具10がストップ/テール兼用灯具である場合、明・暗の二種類の点灯状態を実現しなければならないが、光源がLEDランプ(光源部2)である場合、印可する電源電流値をチョッパー手段などにより変化させ、点灯輝度に明・暗を設けるのが一般的である。   Here, when the vehicular lamp 10 is a stop / tail combined lamp, two types of lighting states of light and dark must be realized. However, when the light source is an LED lamp (light source unit 2), the power supply to be applied In general, the current value is changed by a chopper means or the like, so that the lighting luminance is bright or dark.

従って、本発明においても同様な手段で対応するものであり、図4にも示すように、例えばチョッパー回路を含む給電部4を前記導電部3の前段に接続しておき、この給電部4のT(テール)端子に入力がある時には光源部2を低輝度側の所定輝度で点灯させ、S(ストップ)端子に入力がある時には光源部2を高輝度側の所定輝度で点灯させ、双方に入力のないときには消灯させるように制御するものとする。   Therefore, in the present invention, the same means is used, and as shown in FIG. 4, for example, a power feeding unit 4 including a chopper circuit is connected to the previous stage of the conductive unit 3. When there is an input at the T (tail) terminal, the light source unit 2 is lit at a predetermined luminance on the low luminance side, and when there is an input at the S (stop) terminal, the light source unit 2 is lit at a predetermined luminance on the high luminance side. It is assumed that control is made to turn off when there is no input.

また、図4は本発明の別な実施形態を示すものであり、図1に示した前の実施形態では本発明の構成を明確に示すために、光源部2、導電部3がともに灯体ベース11の同じ側に設けられているものとして説明した。しかしながら、本発明はこれを限定するものではなく、この実施形態においては、前記導電部3は背面側から灯体ベース11に取付けられ、光源部2は前面側から灯体ベース11に取付けられている。   FIG. 4 shows another embodiment of the present invention. In the previous embodiment shown in FIG. 1, the light source unit 2 and the conductive unit 3 are both lamps in order to clearly show the configuration of the present invention. The description has been made assuming that the base 11 is provided on the same side. However, the present invention is not limited to this. In this embodiment, the conductive portion 3 is attached to the lamp base 11 from the back side, and the light source portion 2 is attached to the lamp base 11 from the front side. Yes.

このようにすることで、配線のための構成物である導電部3、および、給電部4がレンズ(図示は省略する)などを透過して使用者の目に触れないものとなり、美観に向上などが図れるものとなる。また同時に灯体ベース11の前面側には反射面12を形成しておき、配光特性を整えるなどすれば、性能向上も図れるものとなる。   By doing in this way, the conductive part 3 and the power feeding part 4 that are components for wiring do not pass through a lens (not shown) and the like and do not touch the user's eyes. And so on. At the same time, if the reflecting surface 12 is formed on the front side of the lamp base 11 and the light distribution characteristics are adjusted, the performance can be improved.

本発明に係る車両用灯具のワイヤリングシステムの実施形態を示す説明図である。It is explanatory drawing which shows embodiment of the wiring system of the vehicle lamp which concerns on this invention. 同じく本発明に係る車両用灯具のワイヤリングシステムの光源部における実施形態を示す説明図である。It is explanatory drawing which similarly shows embodiment in the light source part of the wiring system of the vehicle lamp which concerns on this invention. 同じく本発明に係る車両用灯具のワイヤリングシステムの導電部および給電部における実施形態を示す説明図である。It is explanatory drawing which shows embodiment in the electroconductive part and electric power feeding part of the wiring system of the vehicular lamp which concerns on this invention similarly. 同じく本発明に係る車両用灯具のワイヤリングシステムの別の実施形態を示す説明図である。It is explanatory drawing which similarly shows another embodiment of the wiring system of the vehicle lamp which concerns on this invention.

符号の説明Explanation of symbols

1……車両用灯具のワイヤリングシステム
2……光源部
21……正極用素子基板
22……負極用素子基板
21a、22a……端子部
23……LEDチップ
24……樹脂ケース
25……金線
3……導電部
31……正極用導電部
32……負極用導電部
31a、32a……接片部
31b、32b……取付穴
4……給電部
10……車両用灯具
11……灯体ベース
11a……ボス
12……反射面
DESCRIPTION OF SYMBOLS 1 ... Vehicle lamp wiring system 2 ... Light source part 21 ... Positive electrode element board 22 ... Negative electrode element board 21a, 22a ... Terminal part 23 ... LED chip 24 ... Resin case 25 ... Gold wire 3 …… Conducting part 31 …… Conducting part for positive electrode 32 …… Conducting part for negative electrode 31a, 32a …… Contact piece part 31b, 32b …… Mounting hole 4 …… Power feeding part 10 …… Vehicle lamp 11 …… Lamp Base 11a …… Boss 12 …… Reflective surface

Claims (3)

灯体ベース上に点灯回路を構成するためのワイヤリングシステムであり、このワイヤリングシステムは金属部材により一部が略筒状に形成されて、その側面を電極として使用可能に形成された素子基板上にLEDチップがマウントされてLEDランプとされた光源部と、前記灯体ベース上に適宜な係着手段で点灯回路を構成し導電性と熱伝導性に対して適宜な板厚とされた金属板材のプレス加工により形成された導電部とからなり、前記光源部と前記導電部とは前記導電部側が内径で前記光源部の素子基板の外径に面接触して光源部の所定位置への保持と、給電と、放熱とを行う構成とされていることを特徴とする灯具のワイヤリングシステム。 A wiring system for constructing a lighting circuit on a lamp body base. This wiring system is formed on a device substrate, a part of which is formed of a metal member in a substantially cylindrical shape, and a side surface of which can be used as an electrode. A light source part in which an LED chip is mounted to form an LED lamp, and a metal plate material in which a lighting circuit is configured with appropriate fastening means on the lamp base and has an appropriate plate thickness for electrical conductivity and thermal conductivity The light source part and the conductive part are held in contact with the outer diameter of the element substrate of the light source part by holding the light source part in a predetermined position. And a lamp wiring system characterized by being configured to perform power feeding and heat dissipation. 前記導電部の前記灯体ベースの外部に導出される部分には給電部が設けられ、この給電部には前記光源部に対応する制御回路を搭載した回路基板が設けられていることを特徴とする請求項1記載の灯具のワイヤリングシステム。 A portion of the conductive portion led out of the lamp base is provided with a power supply portion, and the power supply portion is provided with a circuit board on which a control circuit corresponding to the light source portion is mounted. The lamp wiring system according to claim 1. 請求項1または請求項2に記載のワイヤリングシステムを具備することを特徴とする車両用灯具。 A vehicular lamp comprising the wiring system according to claim 1.
JP2003287088A 2003-08-05 2003-08-05 WIRE WIRING SYSTEM AND VEHICLE LAMP Expired - Fee Related JP4165819B2 (en)

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JP2005056716A5 JP2005056716A5 (en) 2006-07-20
JP4165819B2 true JP4165819B2 (en) 2008-10-15

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