JP4142934B2 - Wiring board manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing a wiring board formed by forming a solder joint pad on the surface of an insulating substrate to which an electrode of an electronic component is connected via solder.
[0002]
[Prior art]
Conventionally, as a wiring board used for mounting electronic components such as semiconductor integrated circuit elements, a plurality of layers of, for example, an insulating layer made of an organic material such as glass-epoxy resin and a wiring conductor made of copper such as copper foil alternately. 2. Description of the Related Art A wiring board is known in which a solder joint pad made of a copper plating layer to which electrodes of electronic components are electrically connected via solder is formed on a laminated insulating board. In this wiring board, when connecting the electrode of the electronic component to the solder bonding pad via solder, the insulating substrate is protected from heat and heat resistance such as epoxy resin is used to prevent an electrical short circuit between the solder bonding pads. A solder-resistant resin layer made of resin is deposited on the insulating substrate so as to cover the outer periphery of the solder bonding pad. The solder bonding pad has a blackening film formed by blackening treatment on the outer peripheral surface covered with the solder-resistant resin layer in order to strengthen the adhesion with the solder-resistant resin layer. In order to prevent the oxidative corrosion and to make the electrical connection between the solder bonding pad and the electrode of the electronic component through the solder good and strong, the exposed surface of the solder bonding pad is usually electroless nickel plated. A layer and an electroless gold plating layer are sequentially deposited.
[0003]
In such a wiring board, first, a solder bonding pad made of a copper plating layer having a diameter of 250 to 600 μm is formed on an insulating board in which an organic material insulating layer and a wiring conductor made of copper are laminated, and then the insulating board. A blackening film is formed on the entire exposed surface of the solder bonding pad formed above to form a blackening film. Next, the outer periphery of the solder bonding pad is covered on the insulating substrate and the solder bonding pad, and the central portion is exposed. After forming the solder-resistant resin layer to be removed, the blackened film on the exposed central surface of the solder joint pad is removed by acid cleaning or chemical polishing by microetching, and finally the solder joint pad from which the blackened film has been removed is removed. It is manufactured by sequentially depositing an electroless nickel plating layer and an electroless gold plating layer on the exposed surface. The electroless gold plating layer deposited on the electroless nickel plating layer diffuses into the solder and disappears when the electrode of the electronic component and the solder joint pad are connected via solder.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-110939
[Problems to be solved by the invention]
However, in recent years, in consideration of the environment, lead-free solder containing no lead has been used as a solder for connecting an electrode of an electronic component and a solder joint pad of a wiring board. Such a lead-free solder generally has a melting point higher than that of conventional lead-containing solder by about 10 to 20 ° C. Therefore, the lead-free solder is used to connect the electrodes of electronic components and the solder joint pads of the wiring board. When connecting to the solder, it is necessary to melt the solder at a temperature about 10 to 20 ° C. higher than the conventional temperature. When such a high temperature is applied to the wiring board, the electroless nickel plating layer has a sparse crystal, so that a fragile metal is present at the interface between the electroless nickel plating layer deposited on the solder bonding pad and the solder. A large amount of intermetallic compound is formed, so when stress due to heat or external force is applied to the solder connecting the electrode of the electronic component to the solder joint pad, the solder is easily peeled from the plated metal layer, and as a result, There has been a problem that it becomes impossible to firmly connect the electrode of the electronic component and the solder bonding pad via the solder. Therefore, the plated metal layer to be deposited on the solder bonding pad is a dense electrolytic nickel plating layer and the electrolytic gold plating layer deposited thereon, so that the nickel plating layer and the solder deposited on the solder bonding pad It is conceivable that a fragile intermetallic compound is hardly formed during this period. However, in order to deposit the electrolytic nickel plating layer and the electrolytic gold plating layer on each electrically independent solder bonding pad, it is necessary to connect a wiring for plating conduction for supplying electric charge to each solder bonding pad. Such an unnecessary capacitance or inductance is formed on the solder bonding pad by the wiring for plating conduction, and particularly when an electronic component that operates at a high frequency is mounted. This causes the problem that the electronic component cannot be operated normally.
[0006]
Also, in the conventional wiring board, when removing the blackening film in the central part exposed from the solder-resistant resin layer of the blackened solder joint pad, the blackening residue remains in the central part of the solder joint pad. Easily, if such a residue remains, the blackening treatment residue remaining in the center of the solder bonding pad between the central portion of the solder bonding pad from which the blackened film has been removed and the electroless nickel plating layer thereon is formed. Due to this, there was a problem that peeling was likely to occur.
[0007]
The present invention has been completed in view of such conventional problems, and its purpose is to generate a blackening residue at the center of the solder joint pad to which the electrolytic nickel plating layer and the electrolytic gold plating layer are applied. In addition, a fine plated metal layer by electrolytic plating is satisfactorily deposited on the surface of the solder bonding pad without leaving a wiring for plating conduction, and the electrode of the electronic component is firmly attached to the solder bonding pad via solder. Another object of the present invention is to provide a wiring board that can be connected to a circuit board and that can normally operate an electronic component.
[0008]
[Means for Solving the Problems]
The method for manufacturing a wiring board according to the present invention includes a step of preparing an insulating substrate having wiring conductors inside and / or on the surface and having solder bonding pads formed on the upper surface, and an electroless copper plating layer on the upper surface of the insulating substrate. And depositing a first plating resist layer having a first opening that exposes the electroless copper plating layer where the solder joint pad is to be formed on the electroless copper plating layer And a step of depositing an electrolytic copper plating layer on the electroless copper plating layer exposed in the first opening, and after removing the first plating resist layer, the electroless copper plating A second opening having a second opening that covers an outer peripheral portion of the electrolytic copper plating layer at a portion where the solder joint pad is formed on the layer and the electrolytic copper plating layer and exposes a central portion of the electrolytic copper plating layer Deposit plating resist layer A step of sequentially depositing an electrolytic nickel plating layer and an electrolytic gold plating layer on the electrolytic copper plating layer exposed in the second opening, and after peeling the second plating resist layer, Etching and removing the electroless copper plating layer exposed from the electrolytic copper plating layer and etching the surface of the electrolytic copper plating layer exposed from the electrolytic nickel plating layer and the gold plating layer on the insulating substrate An electroless copper plating layer and an electrolytic copper plating layer thereon, and an electrolytic nickel plating layer and an electrolytic gold plating layer are sequentially deposited on the central portion of the upper surface, and the central portion and the outer peripheral portion forming a solder joint pads step is formed between the electroless copper plating exposed from the electrolytic nickel plating and electrolytic gold plating of the solder bonding pad A step of blackening the surface of the layer and the electrolytic copper plating layer, and forming a solder-resistant resin layer on the upper surface of the insulating substrate so as to cover an outer peripheral portion of the solder bonding pad and expose a central portion of the solder bonding pad The processes are sequentially performed.
[0009]
According to the method for manufacturing a wiring board of the present invention, an insulating substrate having wiring conductors inside and / or on the surface and having solder bonding pads formed on the upper surface is prepared, and then an electroless copper is formed on the upper surface of the insulating substrate. A plating layer is deposited, and then a first plating resist layer having a first opening that exposes the electroless copper plating layer where solder joint pads are to be formed on the electroless copper plating layer is deposited Next, an electrolytic copper plating layer is deposited on the electroless copper plating layer exposed in the first opening of the first plating resist layer, and then the first plating resist layer is peeled off, The electrolytic copper plating layer and a second opening having a second opening that covers the outer peripheral portion of the electrolytic copper plating layer where the solder joint pad is formed on the electrolytic copper plating layer and exposes the central portion of the electrolytic copper plating layer Next, apply a plating resist layer. An electrolytic nickel plating layer and an electrolytic gold plating layer are sequentially deposited on the electrolytic copper plating layer exposed in the second opening of the plating resist layer, and then the second plating resist layer is peeled off, followed by electrolytic copper plating. The electroless copper plating layer exposed from the layer is etched away to form an electroless copper plating layer and an electrolytic copper plating layer on the insulating substrate, and an electrolytic nickel plating layer and electrolytic gold are formed in the center of the upper surface. Forming a solder joint pad on which the plating layer is sequentially deposited, and then blackening the surface of the electroless copper plating layer and the electrolytic copper plating layer exposed from the electrolytic nickel plating and the electrolytic gold plating of the solder joint pad; Next, a solder-resistant resin layer is formed on the upper surface of the insulating substrate so as to cover the outer periphery of the solder bonding pad and expose the central portion of the solder bonding pad. It does not generate a blackening residue at the center of the solder bonding pad to which the plating layer is applied, and is exposed from the solder-resistant resin layer without leaving the plating conduction wiring connected to the solder bonding pad. A dense electrolytic nickel plating layer and electrolytic gold plating layer can be deposited on the surface.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Next, a method for manufacturing a wiring board according to the present invention will be described in detail with reference to the accompanying drawings.
[0011]
FIG. 1 is a cross-sectional view of an essential part showing an example of an embodiment of a wiring board manufactured by the manufacturing method of the present invention, in which 1 is an insulating substrate, 2 is a wiring conductor, 3 is a solder bonding pad, 4 Is a solder-resistant resin layer, which mainly constitutes the wiring board according to the present invention.
[0012]
The insulating substrate 1 is made of, for example, an epoxy resin or a modified polyphenylene ether resin on an insulating plate 1a in which a glass cloth formed by knitting glass fibers vertically and horizontally is impregnated with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. A plurality of wiring conductors 2 made of copper, such as a copper foil and a copper plating layer, are disposed inside and on the surface of the insulating layer 1b made of a thermosetting resin.
[0013]
A plurality of solder bonding pads 3 made of a copper plating layer electrically connected to the wiring conductor 2 are formed on the surface of the insulating substrate 1, and electrodes of electronic components (not shown) are formed on the solder bonding pads 3. Are electrically connected via solder.
[0014]
It should be noted that an electrolytic nickel plating layer 5 and an electrolytic gold plating layer 6 are provided on the exposed upper surface of the solder bonding pad 3 in order to prevent oxidative corrosion of the solder bonding pad 3 and to improve the bonding between the solder bonding pad 3 and the solder. Are sequentially deposited. When solder is welded to the solder bonding pad 3, the electrolytic gold plating layer 6 diffuses into the solder and disappears, and the electrolytic nickel plating layer 5 and the solder are bonded. At this time, since the electrolytic nickel plating layer 5 deposited on the upper surface of the solder bonding pad 3 has a dense crystal, a large amount of brittle intermetallic compound is formed between the electrolytic nickel plating layer 5 and the solder. Therefore, the electrode of the electronic component can be firmly connected to the solder bonding pad 3 via the solder.
[0015]
Further, a solder-resistant resin layer 4 made of a heat-resistant resin such as an epoxy resin that covers the outer peripheral portion of the solder-bonding pad 3 and exposes the central portion is deposited on the insulating substrate 1 and the solder-bonding pad 3. The solder-resistant resin layer 4 protects the insulating substrate 1 from the heat when the electrodes of the electronic component are connected to the solder bonding pads 3 via solder, and the solder bonding pads 3 are electrically short-circuited via the solder. It functions as a dam to prevent it.
[0016]
Further, a blackening film 7 is formed by a blackening process on the surface of the solder bonding pad 3 covered with the solder-resistant resin layer 4. The blackening film 7 allows the solder bonding pad 3, the solder-resistant resin layer 4, and The adhesion of is strong.
[0017]
Here, the blackening treatment means that the surface of the solder bonding pad 3 made of copper is oxidized with an alkaline oxidation treatment solution to generate needle crystals composed of cuprous oxide and copper oxide. It means a surface roughening treatment that produces fine irregularities based on the surface.
In addition, since the surface becomes black after the treatment, this surface roughening treatment is called a blackening treatment, and the surface-discolored layer is called a blackening film.
[0018]
Next, a method for manufacturing the above-described wiring board according to the present invention will be described in detail with reference to FIG. 2A to 2J are cross-sectional views of main parts for each step for explaining the method of manufacturing a wiring board according to the present invention.
[0019]
First, as shown in FIG. 2A, a thermosetting resin such as an epoxy resin or a modified polyphenylene ether resin is formed on an insulating plate 1a in which a glass cloth is impregnated with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin. An insulating substrate 1 having a wiring conductor 2 made of a copper foil or a copper plating layer is prepared inside and / or on the surface. The insulating plate 1a is formed by impregnating and curing a glass cloth in which glass fibers are woven vertically and horizontally with a thermosetting resin such as an epoxy resin or a bismaleimide triazine resin, and the insulating layer 1b includes an uncured epoxy resin, A resin sheet having a thickness of 10 to 70 μm made of a thermosetting resin such as a modified polyphenylene ether resin was attached to the upper surface of the insulating plate 1a, and an opening 1c for exposing the wiring conductor 2 was formed on the resin sheet by laser processing. Then, it is laminated | stacked on the insulating board 1a by heating and thermosetting, pressing from the upper and lower sides. Further, the wiring conductor 2 is formed by pasting a copper foil on the upper surface of the insulating plate 1a in advance and etching the copper foil into a predetermined pattern.
[0020]
Next, as shown in FIG. 2B, an electroless copper plating layer 3a having a thickness of about 1 to 2 [mu] m is deposited on the entire upper surface of the insulating substrate 1 including the wiring conductor 2 in the opening 1c. In order to deposit the electroless copper plating layer 3a on the entire upper surface of the insulating substrate 1, first, the surface of the insulating layer 1b is roughened by being immersed in a roughening solution such as a permanganate aqueous solution at about 50 ° C. Next, the upper surface of the insulating substrate 1 whose surface of the insulating layer 1b is roughened is immersed in an aqueous solution of palladium catalyst for electroless plating at about 30 ° C. to immerse the surface of the insulating layer 1b and the wiring conductor in the opening 1c. The surface of the insulating layer 1b is immersed in an electroless copper plating solution containing copper sulfate, Rossell salt, formalin, EDTA sodium salt, stabilizer, etc. And the method of depositing the electroless copper plating layer 3a about 1-2 m thick on the wiring conductor 2 in the opening part 1c is employ | adopted.
[0021]
Next, as shown in FIG. 2C, a first opening 11a that exposes a portion where the solder bonding pad 3 is formed on the electroless copper plating layer 3a deposited on the upper surface of the insulating substrate 1. The 1st plating resist layer 11 which has is attached. The first plating resist layer 11 is, for example, an insulating substrate on which an electroless copper plating layer 3a is applied to a photosensitive resin film containing an uncured ultraviolet curable resin and a thermosetting resin having a thickness of about 10 to 50 μm. It is formed by sticking on 1 and exposing and developing this by employing a photolithographic technique.
[0022]
Next, as shown in FIG. 2 (d), an electrolytic copper plating layer 3 b is deposited on the electroless copper plating layer 3 a exposed from the first opening 11 a of the first plating resist layer 11. In order to deposit the electrolytic copper plating layer 3b, an electrolytic copper plating solution containing sulfuric acid, copper sulfate pentahydrate, chlorine, brightener, etc. is used, and a current of several A / dm ² from the electroless copper plating layer 3a. A method of depositing an electrolytic copper plating layer 3b having a thickness of about 5 to 30 μm by applying electrolytic copper plating while applying is adopted.
[0023]
Next, as shown in FIG. 2 (e), after the first plating resist layer 11 is peeled off using a stripping solution such as an aqueous sodium hydroxide solution, on the electroless copper plating layer 3a and the electrolytic copper plating layer 3b. The second plating resist layer 12 that has the second opening 12a that exposes the central portion of the electrolytic copper plating layer 3b that is applied to the portion where the solder bonding pad 3 is formed and that covers the outer peripheral portion is applied. . The second plating resist layer 12 is made of, for example, an electroless copper plating layer 3a and an electrolytic copper plating layer 3b made of a photosensitive resin film containing an uncured ultraviolet curable resin and a thermosetting resin having a thickness of about 10 to 50 μm. It is formed by adhering onto the deposited insulating substrate 1 and exposing and developing it using a photolithography technique.
[0024]
Next, as shown in FIG. 2 (f), the electrolytic nickel plating layer 5 and the electrolytic gold plating layer 6 are sequentially deposited on the electrolytic copper plating layer 3 b exposed from the opening 12 a of the second plating resist layer 12. Let In order to deposit the electrolytic nickel plating layer 5, a sulfamine bath or a watt bath is used, and by applying an electrolytic nickel plating while applying a current of several A / dm ² from the electroless copper plating layer 3a, about 1 to 5 μm is applied. A method of depositing a thick electrolytic nickel plating layer 5 is employed. At this time, since the electrolytic plating can form a dense crystal plating layer, the crystal of the electrolytic nickel plating layer 5 becomes dense. Further, in order to deposit the electrolytic gold plating layer 6, a neutral gold cyanide plating bath is used, and electrolytic gold plating is performed from the electroless copper plating layer 3a at a current density of 0.1 to 1 A / dm ^2. A method of applying the electrolytic gold plating layer 6 having a thickness of about 0.1 to 1 μm is employed.
[0025]
Next, as shown in FIG. 2 (g), the second plating resist layer is peeled off using a peeling solution such as an aqueous sodium hydroxide solution, and then, as shown in FIG. 2 (h), the electrolytic copper plating layer 3b. The electroless copper plating layer 3a exposed from the surface is etched away with sulfuric acid and aqueous solution of sulfuric acid such as hydrogen peroxide or copper sulfate, so that the electroless copper plating layer 3a and the electrolysis thereon are formed on the upper surface of the insulating substrate 1. A solder joint pad 3 is formed which is composed of a copper plating layer 3b, and in which an electrolytic nickel plating layer 5 and an electrolytic gold plating layer 6 are sequentially deposited at the center of the upper surface thereof. At this time, since the electroless copper plating layer 3a exposed from the electrolytic copper plating layer 3b is removed, wiring for plating conduction does not remain, and therefore an unnecessary capacitance and inductance are not applied to the solder bonding pad 3. Never formed. Moreover, since the exposed part of the electrolytic copper plating layer 3b is also slightly etched, a step is formed on the upper surface of the electrolytic copper plating layer 3b.
[0026]
Next, as shown in FIG. 2 (i), the insulating substrate 1 on which the solder bonding pads 3 are formed is dipped in a blackening treatment solution made of sodium hydroxide, sodium chlorite, a stabilizer, etc. for several minutes for solder bonding. Blackening film 7 is formed on the surfaces of electroless copper plating layer 3a and electrolytic copper plating layer 3b exposed from electrolytic nickel plating layer 5 and electrolytic gold plating layer 6 of pad 3. At this time, the blackening film 7 is selectively formed on the surfaces of the electroless copper plating layer 3 a and the electrolytic copper plating layer 3 b exposed from the electrolytic nickel plating layer 5 and the electrolytic gold plating layer 6. In addition, a blackening residue does not occur in the central portion of the solder joint pad 3 to which the electrolytic gold plating layer 6 is applied.
[0027]
Finally, as shown in FIG. 2 (j), a solder-resistant resin layer 4 that covers the outer peripheral portion of the solder bonding pad 3 and exposes the central portion is deposited on the insulating substrate 1 according to the present invention. The wiring board is completed. In order to deposit and form the solder-resistant resin layer 4, a mixture of a photosensitive resin such as an acrylic-modified epoxy resin and a photoinitiator is formed on the upper surface of the insulating substrate 1 on which the solder bonding pads 3 are formed. An uncured solder-resistant resin containing an inorganic powder filler such as silica or talc of ~ 70% by mass is applied to a thickness of about 10 to 80 μm by screen printing or a roll coating method. A method of exposing and developing so as to have an opening that exposes the central portion and then curing it with ultraviolet rays and heat curing is adopted. At this time, since the blackening film 7 is formed on the outer peripheral portion of the solder bonding pad 3, the solder-resistant resin layer 4 and the solder bonding pad 3 are firmly adhered to each other. Further, the step formed on the upper surface of the electrolytic copper plating layer 3 b constituting the solder bonding pad 3 effectively prevents the resin of the solder-resistant resin layer 4 from flowing out to the central portion of the solder bonding pad 3.
[0028]
Thus, according to the method for manufacturing a wiring board of the present invention, a blackening residue can be generated at the center of the solder joint pad 3 to which the electrolytic nickel plating layer 5 and the electrolytic gold plating layer 6 are applied. In addition, the electrolytic nickel plating layer 5 and the electrolytic gold plating layer 6 of fine crystals are satisfactorily deposited on the surface of the solder bonding pad 3 without leaving the wiring for plating conduction, and the electrodes of the electronic component are interposed via the solder. Thus, it is possible to provide a wiring board that can be firmly connected to the solder bonding pad 3 and can normally operate the electronic component.
[0029]
Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the scope of the present invention.
[0030]
【The invention's effect】
According to the method for manufacturing a wiring board of the present invention, an insulating substrate having wiring conductors inside and / or on the surface and having solder bonding pads formed on the upper surface is prepared, and then an electroless copper is formed on the upper surface of the insulating substrate. A plating layer is deposited, and then a first plating resist layer having a first opening is exposed to expose the electroless copper plating layer where solder joint pads are to be formed on the electroless copper plating layer. Next, an electrolytic copper plating layer is deposited on the electroless copper plating layer exposed in the first opening of the first plating resist layer, and then the first plating resist layer is peeled off, The electrolytic copper plating layer and a second opening having a second opening that covers the outer peripheral portion of the electrolytic copper plating layer where the solder joint pad is formed on the electrolytic copper plating layer and exposes the central portion of the electrolytic copper plating layer Next, apply a plating resist layer. An electrolytic nickel plating layer and an electrolytic gold plating layer are sequentially deposited on the electrolytic copper plating layer exposed in the second opening of the plating resist layer, and then the second plating resist layer is peeled off, followed by electrolytic copper plating. The electroless copper plating layer exposed from the layer is etched away to form an electroless copper plating layer and an electrolytic copper plating layer on the insulating substrate, and an electrolytic nickel plating layer and electrolytic gold are formed in the center of the upper surface. Forming a solder joint pad on which the plating layer is sequentially deposited, and then blackening the surface of the electroless copper plating layer and the electrolytic copper plating layer exposed from the electrolytic nickel plating and the electrolytic gold plating of the solder joint pad; Next, a solder-resistant resin layer is formed on the upper surface of the insulating substrate so as to cover the outer periphery of the solder bonding pad and expose the central portion of the solder bonding pad. Solder-resistant resin that does not generate blackening residue in the center of the solder bonding pad with the plating layer applied, and does not leave plating conductive wiring connected to the solder bonding pad. A dense electrolytic nickel plating layer and an electrolytic gold plating layer can be deposited on the surface exposed from the layer. Therefore, it is possible to provide a wiring board that can firmly connect the electrode of the electronic component to the solder bonding pad via the solder and can operate the electronic component normally.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an essential part showing an example of an embodiment of a wiring board manufactured according to the present invention.
FIGS. 2A to 2J are cross-sectional views of relevant parts for respective steps for explaining a method of manufacturing a wiring board according to the present invention. FIGS.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Wiring conductor 3 ... Solder joint pad 3a ... Electroless copper plating layer 3b ... Electrolytic copper plating layer 4 ... Solder resistant resin layer 5 ... Electrolytic nickel plating layer 6 ... Electrolytic gold plating layer 7 ... Blackening film 11 ... First plating resist layer 11a ... First opening 12 ... Second plating Resist layer 12a ... second opening

Claims (1)

A step of preparing an insulating substrate having a wiring conductor inside and / or on the surface and having a solder bonding pad formed on the upper surface; a step of depositing an electroless copper plating layer on the upper surface of the insulating substrate; Depositing a first plating resist layer having a first opening for exposing the electroless copper plating layer at a portion where the solder bonding pad is formed on the copper plating layer; and in the first opening A step of depositing an electrolytic copper plating layer on the electroless copper plating layer exposed to the surface, and after peeling off the first plating resist layer, the solder on the electroless copper plating layer and the electrolytic copper plating layer Depositing a second plating resist layer having a second opening that covers an outer periphery of the electrolytic copper plating layer at a portion where a bonding pad is formed and exposes a central portion of the electrolytic copper plating layer; Said second opening A step of sequentially depositing an electrolytic nickel plating layer and an electrolytic gold plating layer on the electrolytic copper plating layer exposed to the surface, and after removing the second plating resist layer, the portion exposed from the electrolytic copper plating layer Etching away the electroless copper plating layer and etching the surface of the electrolytic copper plating layer exposed from the electrolytic nickel plating layer and the gold plating layer . A solder bonding pad comprising an electrolytic copper plating layer, wherein an electrolytic nickel plating layer and an electrolytic gold plating layer are sequentially deposited on the central portion of the upper surface, and a step is formed between the central portion and the outer peripheral portion And surfaces of the electroless copper plating layer and the electrolytic copper plating layer exposed from the electrolytic nickel plating and electrolytic gold plating of the solder joint pad A step of performing a blackening process and a step of forming a solder-resistant resin layer on the upper surface of the insulating substrate so as to cover an outer peripheral portion of the solder bonding pad and expose a central portion of the solder bonding pad are sequentially performed. A method of manufacturing a wiring board.

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