JP4109665B2 - 携帯電話機 - Google Patents
携帯電話機 Download PDFInfo
- Publication number
- JP4109665B2 JP4109665B2 JP2004334102A JP2004334102A JP4109665B2 JP 4109665 B2 JP4109665 B2 JP 4109665B2 JP 2004334102 A JP2004334102 A JP 2004334102A JP 2004334102 A JP2004334102 A JP 2004334102A JP 4109665 B2 JP4109665 B2 JP 4109665B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- circuit board
- mobile phone
- crystal cell
- crystal display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 163
- 210000002858 crystal cell Anatomy 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 41
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 230000001413 cellular effect Effects 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 101100206196 Arabidopsis thaliana TCP3 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- NEAPKZHDYMQZCB-UHFFFAOYSA-N N-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]ethyl]-2-oxo-3H-1,3-benzoxazole-6-carboxamide Chemical compound C1CN(CCN1CCNC(=O)C2=CC3=C(C=C2)NC(=O)O3)C4=CN=C(N=C4)NC5CC6=CC=CC=C6C5 NEAPKZHDYMQZCB-UHFFFAOYSA-N 0.000 description 1
- 101100260060 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CCT3 gene Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Images
Landscapes
- Liquid Crystal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004334102A JP4109665B2 (ja) | 1994-09-16 | 2004-11-18 | 携帯電話機 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22205894 | 1994-09-16 | ||
| JP2004334102A JP4109665B2 (ja) | 1994-09-16 | 2004-11-18 | 携帯電話機 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51006796A Division JP3648741B2 (ja) | 1994-09-16 | 1995-09-14 | 液晶表示装置，その実装構造，及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005070811A JP2005070811A (ja) | 2005-03-17 |
| JP2005070811A5 JP2005070811A5 (enrdf_load_stackoverflow) | 2005-08-25 |
| JP4109665B2 true JP4109665B2 (ja) | 2008-07-02 |
Family
ID=34424954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004334102A Expired - Lifetime JP4109665B2 (ja) | 1994-09-16 | 2004-11-18 | 携帯電話機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4109665B2 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170120478A (ko) * | 2016-04-20 | 2017-10-31 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20210064083A (ko) * | 2019-11-22 | 2021-06-02 | 이글 테크놀로지, 엘엘씨 | 인터페이스 보드 및 신호 비아를 갖는 aom 시스템 및 관련 방법 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101827060B1 (ko) * | 2015-11-27 | 2018-03-22 | 주식회사 두산 | 플렉서블 플랫 케이블 모듈과, 이를 구비하는 전원공급장치 및 디스플레이 장치 |
| CN214708142U (zh) * | 2021-01-14 | 2021-11-12 | 株式会社和冠 | 控制电路基板 |
-
2004
- 2004-11-18 JP JP2004334102A patent/JP4109665B2/ja not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170120478A (ko) * | 2016-04-20 | 2017-10-31 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR102767329B1 (ko) * | 2016-04-20 | 2025-02-18 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20210064083A (ko) * | 2019-11-22 | 2021-06-02 | 이글 테크놀로지, 엘엘씨 | 인터페이스 보드 및 신호 비아를 갖는 aom 시스템 및 관련 방법 |
| KR102650563B1 (ko) * | 2019-11-22 | 2024-03-21 | 이글 테크놀로지, 엘엘씨 | 인터페이스 보드 및 신호 비아를 갖는 aom 시스템 및 관련 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005070811A (ja) | 2005-03-17 |
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