JP4104072B2 - Electronic equipment housing structure - Google Patents

Description

  The present invention relates to a casing structure of an electronic device that has improved heat dissipation while improving durability of the electronic device and reducing manufacturing cost, and is particularly suitable for an electronic device such as a power supply device.

  As a housing of an electronic device such as a power supply device, for example, a box-shaped or L-shaped structure is conventionally known. However, a part of this housing is screwed to an external device such as an industrial device. In many cases, these electronic devices are structured to be attached to external devices by being stopped.

On the other hand, electronic devices such as these power supply devices tend to be reduced in size and thickness in recent years, and with this reduction in size and thickness, heat dissipating parts cannot be arranged inside the electronic device. As shown in FIGS. 7 and 8, a structure in which the housing 112 itself is used as a heat dissipation medium and heat is radiated from the electronic device 110 to the external device 130 via the mounting wall 112 </ b> B of the housing 112 is generally used. .
JP 2003-152139 A JP-A-5-251839

  However, as shown in FIGS. 7 and 8, the electronic component 124 is supported by the support piece 114 whose base end is fixed to the mounting wall 112 </ b> B for mounting the electronic device 110 itself to the external device 130 along with the reduction in size and thickness. The electronic component 124 may be supported by the mounting wall 112B.

  As described above, the mounting wall 112 </ b> B has a structure that also serves as a support portion for supporting the electronic component 124. Even in such a case, the mounting wall 112 </ b> B is installed on the base portion 112 </ b> A of the housing 112 and mounted in the electronic device 110. In general, vibration / impact modes between the circuit board 122 and the mounting wall 112B are different from each other.

  Therefore, when vibration or impact occurs in the external device 130 or the electronic device 110 itself, the lead 124A or the soldered portion 124B of the electronic component 124 for joining the electronic component 124 to the circuit board 122 is affected by vibration or impact. Due to the load, the durability of the electronic device 110 is reduced.

On the other hand, it is possible to change the design of the casing 112 of the electronic device 110 to a structure that is strong against vibration and shock, but in this case, there is a drawback that the manufacturing cost of the electronic device 110 increases. Will occur.
In view of the above facts, an object of the present invention is to provide a casing structure of an electronic device with improved heat dissipation while improving the durability of the electronic device and reducing the manufacturing cost.

The electronic device casing structure according to claim 1 is an electronic device having a structure in which a circuit board and electronic components connected to the circuit board are built in the casing, and the casing can be attached to an external device. The housing structure of
A base part which is a part of a housing in which a circuit board is installed;
A device connecting wall portion formed to be connected to the base portion in a bent form with respect to the base portion and connected to an external device;
A component supporting wall portion formed to be connected to the base portion in a bent form with respect to the base portion and supporting an electronic component;
A notch groove separating the device connecting wall portion and the component supporting wall portion and having a tip portion reaching the base portion;
Have
The surface formed by the device connection wall and the surface formed by the component support wall are parallel to each other, and the component support wall is closer to the inside of the housing than the device connection wall. It is characterized by having a structure that is arranged in the above.

According to the housing structure of an electronic device according to claim 1, for the base unit which is part of the housing the circuit board is installed, the device connecting wall may be connected to an external device and the electronic component parts supporting wall for supporting are formed connected respectively folded form. Further, the device connecting wall portion and the component supporting wall portion are separated by a notch groove having a tip portion reaching the base portion.
Along with this, a circuit board and electronic components connected to the circuit board are built in the casing, and the casing is attached to an external device. However, in this claim , the component support wall portion is made to be closer to the housing than the device connection wall portion while the surface formed by the device connection wall portion and the surface formed by the component support wall portion are parallel to each other . It has a structure that is arranged closer to the inside.

  Therefore, even when vibration or impact occurs in an external device or the electronic device itself, the component support wall portion that supports the electronic component is located on the inner side of the housing than the device connection wall portion that is connected to the external device. Since they are arranged close to each other, vibrations and shocks are not transmitted from the device connecting wall portion side to the component supporting wall portion side.

  As a result, vibration and impact are not transmitted not only to the base part but also to the part support wall part connected to the base part, and vibration or shock is not applied to the lead or soldering part of the electronic part for joining the electronic part to the circuit board. As the load due to the impact is not applied, the electronic component can be securely and securely fixed to the component supporting wall, and the durability of the electronic device is improved.

  Furthermore, at this time, the component support wall is disposed closer to the inside of the housing than the device connection wall, so that the component support wall does not directly contact the external device, and the load due to vibration or impact is reduced. However, it does not more reliably join the component supporting wall.

  In other words, when the housing of an electronic device is made smaller or thinner, this housing is used as a heat dissipation medium, and heat is radiated from the electronic device to an external device through the device connection wall. However, the durability of electronic equipment has been improved. Along with this, it is no longer necessary to change the design of the electronic component housing itself to a structure that is strong against vibration and shock, and the manufacturing cost of the electronic equipment has also been reduced.

  As described above, according to the casing structure of the electronic device according to the present claim, even when the heat dissipation component is omitted in accordance with the downsizing and thinning of the casing of the electronic device, the durability of the electronic device is improved. It was possible to improve the heat dissipation of the electronic device while improving and reducing the manufacturing cost.

On the other hand, according to this claim, since the front end portion of the notch groove separating the device connecting wall portion and the component supporting wall portion reaches the base portion, the device connecting wall portion and the component supporting portion are supported. The wall is completely separated from the base part by this notch groove, and even if the wall for equipment connection is affected by vibration or shock, this effect is transmitted more reliably to the part support wall. Will not be.

  In addition, since the device connecting wall portion and the component supporting wall portion are completely separated from the base portion, the component supporting wall portion is closer to the inside of the housing than the device connecting wall portion. Even in the case of the arrangement, the device connecting wall portion and the component supporting wall portion can be easily bent with respect to the base portion, and the manufacturing cost of the housing can be further reduced.

On the other hand, according to this claim, by arranging the device connecting wall and the component supporting wall so that the surfaces constituting each of them are parallel to each other, the device connecting wall and the component supporting wall are arranged. Even when the wall portions are formed independently of each other, the housing is not unnecessarily enlarged .

  According to the present invention, a housing structure of an electronic device with improved heat dissipation can be obtained while improving the durability of the electronic device and reducing the manufacturing cost. Is preferred.

Hereinafter, an embodiment of a housing structure of an electronic device according to the present invention is shown in FIG. 1 to FIG. 6, and this embodiment will be described based on these drawings.
As shown in FIG. 1, a housing 12 of a power supply device 10 that is an electronic apparatus to which the present embodiment is applied has a cover 14 made of metal and having many holes, and an L shape having a substantially L-shaped cross section. It is comprised by the metal frame material 16 formed similarly, and has a structure which has space in the inside of the housing | casing 12 comprised with these covers 14 and the frame material 16. FIG.

  As shown in FIGS. 2 and 3, a circuit board 22 is screwed and installed on a base portion 16 </ b> A that forms a main portion of the frame material 16 in a planar shape, and is not shown on the circuit board 22. Parts such as transformers are mounted. Further, a device connecting wall portion 16B that can be connected to a bracket 30A that constitutes a part of the industrial device 30 shown in FIG. 3 and a component supporting wall portion 16C that supports an electronic component 24 such as a semiconductor are provided in the base portion 16A. Are formed so as to be connected to the base portion 16A while being made to be parallel to each other.

  That is, as shown in FIGS. 4 to 6, there are three device connecting wall portions 16 </ b> B that serve as side walls at one location, and screw holes 20 are respectively formed in these three device connecting wall portions 16 </ b> B. It has a structured. 3 is screwed into the screw hole 20 so that the device connecting wall 16B is screwed to the bracket 30A. . Further, the electronic component 24 is bonded to the two component supporting wall portions 16C with, for example, an adhesive, so that the electronic component 24 is supported on the component supporting wall portion 16C. An electronic component 24 is disposed in a space in the housing 12 together with the circuit board 22 described above.

  However, a notch groove 18 is formed between the device connecting wall portion 16B and the component supporting wall portion 16C of the present embodiment so that the tip portion reaches the base portion 16A. The connection wall portion 16B and the component support wall portion 16C are separated from each other, and the device connection wall portion 16B and the component support wall portion 16C are provided independently of each other. The component support wall portion 16C is formed so as to be shifted by one step with respect to the device connection wall portion 16B, and the component support wall portion 16C is closer to the inner side of the housing 12 than the device connection wall portion 16B (to the left side in FIG. 6). The wall portion 16C is arranged.

  On the other hand, as shown in FIGS. 2 and 3, the electronic component 24 supported by the component support wall 16C has a lead 24A for connection to the circuit board 22, and the circuit board of the lead 24A. By soldering the joining portion to 22, this joining portion is made a soldering portion 24 </ b> B, and the circuit board 22 and the electronic component 24 are joined.

  On the other hand, when the power supply device 10 having the casing 12 constituted by the cover 14 and the frame material 16 is fixed to the industrial equipment 30, the equipment connection wall portion 16 </ b> B constituting a part of the frame material 16 is provided. A bolt 32 penetrating the bracket 30A of the industrial device 30 shown in FIG. 3 is screwed into the formed screw hole 20, and the device connecting wall portion 16B is screwed to the industrial device 30 so that the device connecting wall portion 16B is industrially used. It will be connected to the device 30. Accordingly, the power supply device 10 as shown in FIG. 1 is attached to the industrial device 30, and the power supply device 10 supplies power to the industrial device 30.

Next, the effect | action of the housing structure of the electronic device which concerns on this Embodiment is demonstrated.
According to the housing structure of the electronic device according to the present embodiment, the device connecting wall portion 16B that can be connected to the industrial device 30 and the base portion 16A that is the portion of the housing 12 where the circuit board 22 is installed, and A component supporting wall portion 16 </ b> C that supports the electronic component 24 is formed to be connected. Accordingly, in this embodiment, the circuit board 22 and the electronic component 24 connected to the circuit board 22 are built in the housing 12 and the housing 12 is attached to the industrial device 30. It has become.

  At this time, although the device connecting wall portion 16B and the component supporting wall portion 16C are formed by being bent with respect to the base portion 16A, respectively, the device connecting wall portion 16B and the component supporting wall portion 16C The notch groove 18 is separated by a notch groove 18, and the tip of the notch groove 18 reaches the base portion 16 </ b> A. For this reason, the device connecting wall portion 16B and the component supporting wall portion 16C are provided in a completely independent manner.

  In the present embodiment, although the plane formed by the device connecting wall portion 16B and the plane formed by the component supporting wall portion 16C are arranged in parallel to each other, FIG. 3 and FIG. As shown, the component supporting wall portion 16C is arranged closer to the inside of the housing 12 than the device connecting wall portion 16B.

  Therefore, even when vibration or impact occurs in the industrial device 30 or the power supply device 10 itself, the device connecting wall portion 16B connected to the industrial device 30 and the component support wall portion 16C supporting the electronic component 24 are mutually connected. Therefore, vibrations and impacts are not transmitted from the device connecting wall 16B side to the component supporting wall 16C side.

  As a result, vibration and impact are not transmitted not only to the base portion 16A but also to the component supporting wall portion 16C connected to the base portion 16A, and the lead 24A of the electronic component 24 for joining the electronic component 24 to the circuit board 22 A load due to vibration or impact is not applied to the soldering portion 24B. For this reason, the electronic component 24 can be securely and securely fixed to the component supporting wall portion 16C, and the durability of the power supply device 10 is improved.

  Further, at this time, the component supporting wall portion 16C is arranged closer to the inside of the housing 12 than the device connecting wall portion 16B, so that the component supporting wall portion 16C does not directly contact the industrial device 30 which is an external device. Thus, a load due to vibration or impact is more reliably prevented from being applied to the component supporting wall portion 16C.

  That is, as the casing 12 of the power supply apparatus 10 is reduced in size and thickness, the casing 12 is used as a heat dissipation medium, and heat is radiated from the power supply apparatus 10 to the industrial equipment 30 via the apparatus connecting wall portion 16B. Even in this case, not only can heat be dissipated reliably, but also the durability of the power supply device 10 can be improved. Accordingly, it is not necessary to design the housing 12 itself of the electronic component 24 to have a structure that is strong against vibration and shock, and the manufacturing cost of the power supply device 10 is also reduced.

  As described above, according to the casing structure of the electronic device according to the present embodiment, even when the heat dissipation component is omitted in accordance with the miniaturization or thinning of the casing 12 of the power supply apparatus 10, the power supply apparatus 10. It is possible to improve the heat dissipation of the power supply device 10 while improving the durability and reducing the manufacturing cost.

  On the other hand, in the present embodiment, the device connecting wall portion 16B and the component supporting wall portion 16C are formed by being bent with respect to the base portion 16A, and the device connecting wall portion 16B and the component supporting wall portion 16C. Are separated by a notch groove 18. And it has the structure where the front-end | tip part of this notch groove 18 reached this base part 16A.

  Therefore, according to the present embodiment, the tip portion of the notch groove 18 separating the device connecting wall portion 16B and the component supporting wall portion 16C reaches the base portion 16A. The wall portion 16B and the component support wall portion 16C are completely separated from the root portion by the notch groove 18, and even if the device connection wall portion 16B is affected by vibration or impact, it is used for component support. This effect is more reliably prevented from being transmitted to the wall portion 16C.

  Further, as the space between the device connecting wall portion 16B and the component supporting wall portion 16C is completely separated from the root portion, the component supporting wall portion 16C is more enclosed than the device connecting wall portion 16B. Even when it is arranged closer to the inside of the body 12, the device connecting wall 16B and the component supporting wall 16C can be easily bent with respect to the base 16A, respectively, and the manufacturing cost of the housing 12 is further reduced. Will come to be.

  Further, in the present embodiment, the device connecting wall 16B and the component supporting wall 16C are arranged so that the planes constituting each of them are parallel to each other. Even when the component supporting wall 16C is formed independently of each other, the housing 12 is not unnecessarily enlarged.

  In addition, in the said embodiment, although it was set as the structure which provided the wall part 16B for apparatus connection, and the wall part 16C for component support alternately two or three places, you may provide each one place or each three or more places, Further, the number of device connecting wall portions 16B and the number of component supporting wall portions 16C may be the same. Further, instead of adhering the electronic component 24 to the component support wall portion 16C with an adhesive or the like as in the above embodiment, a support piece whose base end side is attached to the component support wall portion 16C is similar to the conventional example. The electronic component 24 may be configured to be pressed against the component supporting wall portion 16C.

  On the other hand, in the above embodiment, the electronic device is the power supply device 10, but the present invention may be applied to other electronic devices, and the external device is the industrial device 30, but the external device is another device. It may be a household device.

It is a perspective view which shows the power supply device with which one embodiment of this invention was applied. It is a principal part expansion perspective view of the state which decomposed | disassembled the power supply device with which one embodiment of this invention was applied. It is a principal part expanded sectional view of the state which decomposed | disassembled the power supply device with which one embodiment of this invention is applied, Comprising: It is a figure which shows the state connected with industrial equipment. It is a perspective view which shows the frame material of the power supply device with which one embodiment of this invention was applied. It is the perspective view seen from another direction which shows the frame material of the power supply device with which one embodiment of this invention was applied. It is a top view which shows the frame material of the power supply device with which one embodiment of this invention was applied. It is a principal part expansion perspective view of the electronic device which concerns on a prior art example. It is a principal part expanded sectional view of the electronic device which concerns on a prior art example, Comprising: It is a figure which shows the state connected with industrial equipment.

Explanation of symbols

10 Power supply (electronic equipment)
DESCRIPTION OF SYMBOLS 12 Housing | casing 16 Frame material 16A Base part 16B Wall part for apparatus connection 16C Wall part for component support 18 Notch groove 24 Electronic component 30 Industrial equipment

Claims (1)

A circuit board and an electronic component connected to the circuit board are housed in a housing, and the housing is a housing structure of an electronic device having a structure that can be attached to an external device,
A base part which is a part of a housing in which a circuit board is installed;
A device connecting wall portion formed to be connected to the base portion in a bent form with respect to the base portion and connected to an external device;
A component supporting wall portion formed to be connected to the base portion in a bent form with respect to the base portion and supporting an electronic component;
A notch groove separating the device connecting wall portion and the component supporting wall portion and having a tip portion reaching the base portion;
Have
The surface formed by the device connection wall and the surface formed by the component support wall are parallel to each other, and the component support wall is closer to the inside of the housing than the device connection wall. A housing structure for an electronic device, characterized in that the housing structure is disposed on the housing.

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